DAC7621EBG4 [TI]

12 位、并行输入数模转换器 | DB | 20 | -40 to 85;
DAC7621EBG4
型号: DAC7621EBG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

12 位、并行输入数模转换器 | DB | 20 | -40 to 85

光电二极管 转换器 数模转换器
文件: 总17页 (文件大小:625K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
DAC7621  
®
DAC7621  
For most current data sheet and other product  
information, visit www.burr-brown.com  
12-Bit, Parallel Input  
DIGITAL-TO-ANALOG CONVERTER  
DESCRIPTION  
FEATURES  
The DAC7621 is a 12-bit digital-to-analog converter  
(DAC) with guaranteed 12-bit monotonicity perfor-  
mance over the industrial temperature range. It re-  
quires a single +5V supply and contains an input  
register, latch, 2.435V reference, DAC, and high speed  
rail-to-rail output amplifier. For a full-scale step, the  
output will settle to 1 LSB within 7µs. The device  
consumes 2.5mW (0.5mA at 5V).  
LOW POWER: 2.5mW  
FAST SETTLING: 7µs to 1 LSB  
1mV LSB WITH 4.095V FULL-SCALE  
RANGE  
COMPLETE WITH REFERENCE  
12-BIT LINEARITY AND MONOTONICITY  
OVER INDUSTRIAL TEMP RANGE  
The parallel interface is compatible with a wide variety  
of microcontrollers. The DAC7621 accepts a 12-bit  
parallel word, has a double-buffered input logic struc-  
ture and provides data readback. In addition, two  
control pins provide a chip select (CS) function and  
asynchronous clear (CLR) input. The CLR input can  
be used to ensure that the DAC7621 output is 0V on  
power-up or as required by the application.  
ASYNCHRONOUS RESET TO 0V  
APPLICATIONS  
PROCESS CONTROL  
DATA ACQUISITION SYSTEMS  
CLOSED-LOOP SERVO-CONTROL  
PC PERIPHERALS  
The DAC7621 is available in a 20-lead SSOP package  
and is fully specified over the industrial temperature  
range of –40°C to +85°C.  
PORTABLE INSTRUMENTATION  
VDD  
Ref  
12-Bit DAC  
12  
VOUT  
CLR  
DAC Register  
12  
LOADDAC  
Input Register  
12  
CS  
I/O Buffer  
R/W  
DAC7621  
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11  
DGND  
International Airport Industrial Park  
Mailing Address: PO Box 11400, Tucson, AZ 85734  
Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706  
• Tel: (520) 746-1111  
Twx: 910-952-1111 Internet: http://www.burr-brown.com/  
Cable: BBRCORP Telex: 066-6491  
FAX: (520) 889-1510 Immediate Product Info: (800) 548-6132  
© 1998 Burr-Brown Corporation  
PDS-1502B  
Printed in U.S.A. March, 1999  
SBAS107  
SPECIFICATIONS  
ELECTRICAL  
At TA = –40°C to +85°C, and VDD = +5V, unless otherwise noted.  
DAC7621E  
TYP  
DAC7621EB  
TYP  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
MAX  
MIN  
MAX  
UNITS  
12  
Bits  
ACCURACY  
Relative Accuracy(1)  
Differential Nonlinearity  
Zero-Scale Error  
Full Scale Voltage  
–2  
–1  
–1  
±1/2  
±1/2  
+1  
+2  
+1  
+3  
–1  
–1  
±1/4  
±1/4  
+1  
+1  
LSB  
LSB  
LSB  
V
Guaranteed Monotonic  
Code 000H  
Code FFFH  
4.079  
4.095  
4.111  
4.087  
4.095  
4.103  
ANALOG OUTPUT  
Output Current  
Load Regulation  
Capacitive Load  
Short-Circuit Current  
Short-Circuit Duration  
Code 800H  
RLOAD 402, Code 800H  
No Oscillation  
±5  
±7  
1
500  
±20  
Indefinite  
mA  
LSB  
pF  
3
mA  
GND or VDD  
DIGITAL INPUT  
Data Format  
Data Coding  
Logic Family  
Logic Levels  
VIH  
VIL  
IIH  
IIL  
Parallel  
Straight Binary  
CMOS  
0.7 • VDD  
V
V
µA  
µA  
0.3 • VDD  
±10  
±10  
DYNAMIC PERFORMANCE  
Settling Time(2) (tS)  
DAC Glitch  
To ±1 LSB of Final Value  
7
5
2
µs  
nV-s  
nV-s  
Digital Feedthrough  
POWER SUPPLY  
VDD  
IDD  
Power Dissipation  
Power Supply Sensitivity  
+4.75  
–40  
+5.0  
0.5  
2.5  
+5.25  
1
5
V
mA  
mW  
%/%  
VIH = 5V, VIL = 0V, No Load, at Code 000H  
VIH = 5V, VIL = 0V, No Load  
VDD = ±5%  
0.001  
0.004  
TEMPERATURE RANGE  
Specified Performance  
+85  
°C  
Same specification as for DAC7621E.  
NOTES: (1) This term is sometimes referred to as Linearity Error or Integral Nonlinearity (INL). (2) Specification does not apply to negative-going transitions where  
the final output voltage will be within 3 LSBs of ground. In this region, settling time may be double the value indicated.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
®
2
DAC7621  
PIN CONFIGURATION  
PIN DESCRIPTIONS  
PIN  
LABEL  
DESCRIPTION  
Top View  
SSOP  
1
CLR  
Reset. Resets the DAC register to zero. Active  
LOW. Asynchronous input.  
2
VDD  
VOUT  
AGND  
DGND  
DB11  
DB10  
DB9  
DB8  
DB7  
DB6  
DB5  
DB4  
DB3  
DB2  
DB1  
DB0  
R/W  
CS  
Postive Power Supply  
DAC Output Voltage  
Analog Ground  
Digital Ground  
Data Bit 11, MSB  
Data Bit 10  
3
4
1
20 LOADDAC  
19 CS  
CLR  
5
2
VDD  
6
3
18 R/W  
7
VOUT  
8
Data Bit 9  
4
17 DB0 (LSB)  
16 DB1  
AGND  
9
Data Bit 8  
5
DGND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Data Bit 7  
DAC7621E  
6
15 DB2  
Data Bit 6  
DB11 (MSB)  
Data Bit 5  
7
14 DB3  
DB10  
Data Bit 4  
8
13 DB4  
DB9  
Data Bit 3  
9
12 DB5  
Data Bit 2  
DB8  
Data Bit 1  
10  
11 DB6  
DB7  
Data Bit 0, LSB  
Read and Write Control  
Chip Select. Active LOW.  
LOADDAC Loads the internal DAC register. The DAC register  
is a transparent latch and is transparent when  
LOADDAC is LOW (regardless of the state of CS or  
CLK).  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Burr-Brown  
recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
VDD to GND .......................................................................... –0.3V to 6V  
Digital Inputs to GND ..............................................0.3V to VDD + 0.3V  
VOUT to GND ...........................................................0.3V to VDD + 0.3V  
Power Dissipation ........................................................................ 325mW  
Thermal Resistance, θJA ........................................................... 150°C/W  
Maximum Junction Temperature .................................................. +150°C  
Operating Temperature Range ...................................... –40°C to +85°C  
Storage Temperature Range ....................................... –65°C to +150°C  
Lead Temperature (soldering, 10s).............................................. +300°C  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”  
may cause permanent damage to the device. Exposure to absolute maximum  
conditions for extended periods may affect device reliability.  
PACKAGE/ORDERING INFORMATION  
MINIMUM  
RELATIVE  
ACCURACY  
(LSB)  
DIFFERENTIAL  
NONLINEARITY  
(LSB)  
SPECIFICATION  
TEMPERATURE  
RANGE  
PACKAGE  
DRAWING  
NUMBER(1)  
ORDERING  
NUMBER(2)  
TRANSPORT  
MEDIA  
PRODUCT  
PACKAGE  
DAC7621E  
±2  
"
±1  
"
±1  
"
±1  
"
–40°C to +85°C  
20-Lead SSOP  
334  
"
334  
"
DAC7621E  
DAC7621E/1K  
DAC7621EB  
Rails  
Tape and Reel  
Rails  
"
"
"
DAC7621EB  
–40°C to +85°C  
20-Lead SSOP  
"
"
"
DAC7621EB/1K  
Tape and Reel  
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are  
available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7621E/1K” will get a single  
1000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book.  
®
3
DAC7621  
TIMING DIAGRAMS  
tWCS  
CS  
tWS  
tWH  
R/W  
tRCS  
CS  
tRDS  
R/W  
tLWD  
tRDH  
LOADDAC  
Data In  
tDH  
tDS  
tDZ  
Data Out  
Data Valid  
tCSD  
Data Output Timing  
Digital Input Timing  
TIMING SPECIFICATIONS  
LOGIC TRUTH TABLE  
TA = –40°C to +85°C  
INPUT  
DAC  
R/W  
CS  
LOADDAC  
REGISTER  
REGISTER  
MODE  
SYMBOL  
tRCS  
DESCRIPTION  
CS LOW for Read  
MIN TYP MAX UNITS  
L
L
L
L
L
H
H
L
Write  
Write  
Read  
Hold  
Hold  
Write  
Hold  
Write  
Write Input  
Read Input  
Update  
200  
10  
0
ns  
ns  
ns  
ns  
tRDS  
R/W HIGH to CS LOW  
R/W HIGH after CS HIGH  
H
X
X
L
Hold  
tRDH  
H
H
Update  
Hold  
tDZ  
CS HIGH to Data Bus  
in High Impedance  
100  
H
Hold  
X = Don’t Care.  
tCSD  
tWCS  
tWS  
CS LOW to Data Bus Valid  
CS LOW for Write  
100 160  
ns  
50  
0
R/W LOW to CS LOW  
R/W LOW after CS HIGH  
Data Valid to CS LOW  
Data Valid after CS HIGH  
LOADDAC LOW  
ns  
ns  
ns  
ns  
ns  
tWH  
tDS  
5
0
tDH  
5
tLWD  
50  
®
4
DAC7621  
TYPICAL PERFORMANCE CURVES  
At TA = +25°, and VDD = 5V, unless otherwise specified.  
PULL-DOWN VOLTAGE vs OUTPUT SINK CURRENT  
OUTPUT SWING vs LOAD  
4.5  
1k  
100  
10  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
85°C (mV)  
25°C  
1
–40°C  
0.1  
Data = 000H  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
10  
100  
1k  
10k  
100k  
Current (mA)  
Load Resistance ()  
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE  
BROADBAND NOISE  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
5
4.5  
4.0  
3.5  
3.0  
2.5 2.0  
1.5  
1.0  
0.5  
Time (2µs/div)  
Logic Voltage (V)  
POWER SUPPLY REJECTION vs FREQUENCY  
Data = FFFH  
MINIMUM SUPPLY VOLTAGE vs LOAD  
70  
60  
50  
40  
30  
20  
10  
0
5.0  
4.8  
4.6  
4.4  
4.2  
4.0  
VFS = 1 LSB  
Data = FFFH  
VDD = 5V  
±200mV AC  
10  
100  
1k  
10k  
100k  
1M  
0.010  
0.100  
1.000  
10.000  
Frequency (Hz)  
Output Load Current (mA)  
®
5
DAC7621  
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25°, and VDD = 5V, unless otherwise specified.  
SUPPLY CURRENT vs TEMPERATURE  
VLOGIC = 3.5V  
Data = FFFH  
No Load  
SHORT-CIRCUIT CURRENT vs OUTPUT VOLTAGE  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
80  
60  
Positive  
Current  
Limit  
40  
Data = 800H  
Output tied to ISOURCE  
20  
0
VDD = 5.0V  
VDD = 5.25V  
–20  
–40  
–60  
–80  
Negative  
Current  
Limit  
VDD = 4.75V  
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90  
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
Output Voltage (V)  
Temperature (°C)  
MID-SCALE GLITCH PERFORMANCE  
LOADDAC  
MID-SCALE GLITCH PERFORMANCE  
LOADDAC  
VOUT  
7FFH to 800H  
800H to 7FFH  
Time (500ns/div)  
Time (500ns/div)  
RISE TIME DETAIL  
LARGE-SIGNAL SETTLING TIME  
CL = 110pF  
LD  
RL = No Load  
VOUT  
VOUT  
LD  
Time (10µs/div)  
Time (20µs/div)  
®
6
DAC7621  
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25°, and VDD = 5V, unless otherwise specified.  
OUTPUT VOLTAGE NOISE vs FREQUENCY  
Data = FFFH  
FALL TIME DETAIL  
10.000  
1.000  
0.100  
LD  
0.010  
Time (10µs/div)  
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
LONG-TERM DRIFT ACCELERATED BY BURN-IN  
144 Units  
TOTAL UNADJUSTED ERROR HISTOGRAM  
60  
50  
40  
30  
20  
10  
0
8
6
T.U.E = ΣINL = ZS + FS  
Sample Size = 300 Units  
T
A = +25°C  
4
2
0
min  
–2  
–4  
–6  
–8  
avg  
max  
0
200  
400  
600  
800  
1000  
1200  
–12  
–8  
–4  
0
4
8
12  
Hours of Operation at +150°C  
FULL-SCALE VOLTAGE vs TEMPERATURE  
ZERO-SCALE VOLTAGE vs TEMPERATURE  
4.115  
4.110  
4.105  
4.100  
4.095  
4.090  
4.085  
4.080  
4.075  
3
2
No Load  
Avg + 3σ  
Sample Size = 300  
1
Avg  
0
Avg – 3σ  
–1  
–50  
–25  
0
25  
50  
75  
100  
125  
–50  
–25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
®
7
DAC7621  
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25°, and VDD = 5V, unless otherwise specified.  
DIFFERENTIAL LINEARITY ERROR vs DIGITAL CODE  
LINEARITY ERROR vs DIGITAL CODE  
(at +25°C)  
(at +25°C)  
2.0  
1.5  
2.0  
1.5  
1.0  
1.0  
0.5  
0.5  
0
0
–0.5  
–1.0  
–1.5  
–2.0  
–0.5  
–1.0  
–1.5  
–2.0  
0
512 1024 1536 2048 2560 3072 3584 4096  
Code  
0
0
0
512 1024 1536 2048 2560 3072 3584 4096  
Code  
DIFFERENTIAL LINEARITY ERROR vs DIGITAL CODE  
LINEARITY ERROR vs DIGITAL CODE  
(at +85°C)  
(at +85°C)  
1
0.5  
1
0.5  
0
0
–0.5  
–1.0  
–0.5  
–1.0  
0
512 1024 1536 2048 2560 3072 3584 4096  
Code  
512 1024 1536 2048 2560 3072 3584 4096  
Code  
LINEARITY ERROR vs DIGITAL CODE  
DIFFERENTIAL LINEARITY ERROR vs DIGITAL CODE  
(at –40°C)  
(at –40°C)  
1
0.5  
1
0.5  
0
0
–0.5  
–1.0  
–0.5  
–1.0  
512 1024 1536 2048 2560 3072 3584 4096  
Code  
0
512 1024 1536 2048 2560 3072 3584 4096  
Code  
®
8
DAC7621  
The digital data into the DAC7621 is double-buffered. This  
means that new data can be entered into the DAC without  
disturbing the old data and the analog output of the con-  
verter. At some point after the data has been entered into the  
serial shift register, this data can be transferred into the DAC  
register. This transfer is accomplished with a HIGH to LOW  
transition of the LOADDAC pin. However, the LOADDAC  
pin makes the DAC register transparent. If new data be-  
comes available on the bus register while LOADDAC is  
LOW, the DAC output voltage will change as the data  
changes. To prevent this, CS must be returned HIGH prior  
to changing data on the bus.  
OPERATION  
The DAC7621 is a 12-bit digital-to-analog converter (DAC)  
complete with an input shift register, DAC register, laser-  
trimmed 12-bit DAC, on-board reference, and a rail-to-rail  
output amplifier. Figure 1 shows the basic operation of the  
DAC7621.  
INTERFACE  
Figure 1 shows the basic connection between a  
microcontroller and the DAC7621. The interface consists of  
a Read/Write (R/W), data, and a load DAC signal  
(LOADDAC). In addition, a chip select (CS) input is avail-  
able to enable the DAC7621 when there are multiple de-  
vices. The data format is Straight Binary. An asynchronous  
clear input (CLR) is provided to simplify start-up or periodic  
resets. Table I shows the relationship between input code  
and output voltage.  
At any time, the contents of the DAC register can be set to  
000H (analog output equals 0V) by taking the CLR input  
LOW. The DAC register will remain at this value until CLR  
is returned HIGH and LOADDAC is taken LOW to allow  
the contents of the input register to be transferred to the  
DAC register. If LOADDAC is LOW when CLR is taken  
LOW, the DAC register will be set to 000H and the analog  
output driven to 0V. When CLR is returned HIGH, the DAC  
register and the analog output will respond accordingly.  
DAC7621 Full-Scale Range = 4.095V  
Least Significant Bit = 1mV  
DIGITAL INPUT CODE  
STRAIGHT OFFSET BINARY  
ANALOG OUTPUT  
(V)  
DESCRIPTION  
DIGITAL-TO-ANALOG CONVERTER  
FFFH  
801H  
800H  
7FFH  
000H  
+4.095  
+2.049  
+2.048  
+2.047  
0
Full Scale  
Midscale + 1 LSB  
Midscale  
Midscale – 1 LSB  
Zero Scale  
The internal DAC section is a 12-bit voltage output  
device that swings between ground and the internal ref-  
erence voltage. The DAC is realized by a laser-trimmed  
R-2R ladder network which is switched by N-channel  
MOSFETs. The DAC output is internally connected to  
the rail-to-rail output operational amplifier.  
TABLE I. Digital Input Code and Corresponding Ideal  
Analog Output.  
DAC7621E  
Clear  
1
2
LOADDAC 20  
CS 19  
Load DAC  
Chip Select  
Read/Write  
CLR  
+5V  
VDD  
+
10µF  
0.1µF  
0V to  
+4.095V  
3
R/W 18  
DB0 17  
DB1 16  
DB2 15  
DB3 14  
DB4 13  
DB5 12  
DB6 11  
VOUT  
AGND  
DGND  
DB11  
DB10  
DB9  
4
5
6
Data Bus  
7
8
Data Bus  
9
DB8  
10  
DB7  
FIGURE 1. Basic Operation of the DAC7621.  
®
9
DAC7621  
R-2R DAC  
2R  
Output Amplifier  
R
Buffer  
2R  
2R  
R2  
2.435V  
Bandgap  
Reference  
R
R
R1  
2R  
2R  
FIGURE 2. Simplified Schematic of Analog Portion.  
OUTPUT AMPLIFIER  
POWER SUPPLY  
A precision, low-power amplifier buffers the output of the  
DAC section and provides additional gain to achieve a 0V  
to 4.095V range. The amplifier has low offset voltage, low  
noise, and a set gain of 1.682V/V (4.095/2.435). See Figure  
2 for an equivalent circuit schematic of the analog portion  
of the DAC7621.  
A BiCMOS process and careful design of the bipolar and  
CMOS sections of the DAC7621 result in a very low power  
device. Bipolar transistors are used where tight matching  
and low noise are needed to achieve analog accuracy, and  
CMOS transistors are used for logic, switching functions  
and for other low power stages.  
The output amplifier has a 7µs typical settling time to ±1  
LSB of the final value. Note that there are differences in the  
settling time for negative-going signals versus positive-  
going signals.  
If power consumption is critical, it is important to keep the  
logic levels on the digital inputs (R/W, CLK, CS, LOADDAC,  
CLR) as close as possible to either VDD or ground. This will  
keep the CMOS inputs (see “Supply Current vs Logic Input  
Voltages” in the Typical Performance Curves) from shunt-  
ing current between VDD and ground.  
The rail-to-rail output stage of the amplifier provides the  
full-scale range of 0V to 4.095V while operating on a  
supply voltage as low as 4.75V. In addition to its ability to  
drive resistive loads, the amplifier will remain stable while  
driving capacitive loads of up to 500pF. See Figure 3 for an  
equivalent circuit schematic of the amplifier’s output driver  
and the Typical Performance Curves section for more infor-  
mation regarding settling time, load driving capability, and  
output noise.  
The DAC7621 power supply should be bypassed as shown  
in Figure 1. The bypass capacitors should be placed as close  
to the device as possible, with the 0.1µF capacitor taking  
priority in this regard. The “Power Supply Rejection vs  
Frequency” graph in the Typical Performance Curves sec-  
tion shows the PSRR performance of the DAC7621. This  
should be taken into account when using switching power  
supplies or DC/DC converters.  
In addition to offering guaranteed performance with VDD in  
the 4.75V to 5.25V range, the DAC7621 will operate with  
reduced performance down to 4.5V. Operation between  
4.5V and 4.75V will result in longer settling time, reduced  
performance, and current sourcing capability. Consult the  
“VDD vs Load Current” graph in the Typical Performance  
Curves section for more information.  
VDD  
P-Channel  
VOUT  
N-Channel  
AGND  
FIGURE 3. Simplified Driver Section of Output Amplifier.  
®
10  
DAC7621  
signals and should cross them at right angles. A solid analog  
ground plane around the D/A package, as well as under it in  
the vicinity of the analog and power supply pins, will isolate  
the D/A from switching currents. It is recommended that  
DGND and AGND be connected directly to the ground  
planes under the package.  
APPLICATIONS  
POWER AND GROUNDING  
The DAC7621 can be used in a wide variety of situations—  
from low power, battery operated systems to large-scale  
industrial process control systems. In addition, some appli-  
cations require better performance than others, or are par-  
ticularly sensitive to one or two specific parameters. This  
diversity makes it difficult to define definite rules to follow  
concerning the power supply, bypassing, and grounding.  
The following discussion must be considered in relation to  
the desired performance and needs of the particular system.  
If several DAC7621s are used, or if sharing supplies with  
other components, connecting the AGND and DGND lines  
together at the power supplies once, rather than at each chip,  
may produce better results.  
The power applied to VDD should be well regulated and low-  
noise. Switching power supplies and DC/DC converters will  
often have high-frequency glitches or spikes riding on the  
output voltage. In addition, digital components can create  
similar high frequency spikes as their internal logic switches  
states. This noise can easily couple into the DAC output  
A precision analog component requires careful layout, ad-  
equate bypassing, and a clean, well-regulated power supply.  
As the DAC7621 is a single-supply, +5V component, it will  
often be used in conjunction with digital logic,  
microcontrollers, microprocessors, and digital signal proces-  
sors. The more digital logic present in the design and the  
higher the switching speed, the more difficult it will be to  
achieve good performance.  
voltage through various paths between VDD and VOUT  
.
As with the GND connection, VDD should be connected to  
a +5V power supply plane or trace that is separate from the  
connection for digital logic until they are connected at the  
power entry point. In addition, the 10µF and 0.1µF capaci-  
tors shown in Figure 4 are strongly recommended and  
should be installed as close to VDD and ground as possible.  
In some situations, additional bypassing may be required  
such as a 100µF electrolytic capacitor or even a “Pi” filter  
made up of inductors and capacitors—all designed to essen-  
tially lowpass filter the +5V supply, removing the high  
frequency noise (see Figure 4).  
The DAC7621 has separate analog ground and digital ground  
pins. The current through DGND is mostly switching tran-  
sients and are up to 4mA peak in amplitude. The current  
through AGND is typically 0.5mA.  
For best performance, separate analog and digital ground  
planes with a single interconnection point to minimize  
ground loops. The analog pins are located adjacent to each  
other to help isolate analog from digital signals. Analog  
signals should be routed as far as possible from digital  
Digital Circuits  
+5V  
Power  
Supply  
+5V  
+5V  
GND  
DAC7621  
VDD  
GND  
+
+
100µF  
10µF  
0.1µF  
AGND  
DGND  
Optional  
Other  
Analog  
Components  
FIGURE 4. Suggested Power and Ground Connections for a DAC7621 Sharing a +5V Supply with a Digital System with a  
Single Ground Plane.  
®
11  
DAC7621  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Oct-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DAC7621E  
DAC7621E/1K  
DAC7621EB  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SSOP  
DB  
DB  
DB  
20  
20  
20  
70  
RoHS & Green  
Call TI  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 85  
-40 to 85  
-40 to 85  
DAC7621E  
Samples  
Samples  
Samples  
1000 RoHS & Green  
Call TI  
Call TI  
DAC7621E  
70  
70  
RoHS & Green  
RoHS & Green  
DAC7621E  
B
DAC7621EBG4  
ACTIVE  
SSOP  
DB  
20  
Call TI  
Level-3-260C-168 HR  
-40 to 85  
DAC7621E  
B
Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Oct-2022  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DAC7621E/1K  
SSOP  
DB  
20  
1000  
330.0  
16.4  
8.2  
7.5  
2.5  
12.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SSOP DB 20  
SPQ  
Length (mm) Width (mm) Height (mm)  
346.0 346.0 33.0  
DAC7621E/1K  
1000  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TUBE  
T - Tube  
height  
L - Tube length  
W - Tube  
width  
B - Alignment groove width  
*All dimensions are nominal  
Device  
Package Name Package Type  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
DAC7621E  
DAC7621EB  
DAC7621EBG4  
DB  
DB  
DB  
SSOP  
SSOP  
SSOP  
20  
20  
20  
70  
70  
70  
530  
530  
530  
10.2  
10.2  
10.2  
4000  
4000  
4000  
NA  
NA  
NA  
Pack Materials-Page 3  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
TI products.  
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022, Texas Instruments Incorporated  

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