DAC81404 [TI]
DACx1404 Quad, 16-Bit and 12-Bit, High-Voltage-Output DACs With Internal Reference;
| 型号： | DAC81404 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DACx1404 Quad, 16-Bit and 12-Bit, High-Voltage-Output DACs With Internal Reference |
| 文件： | 总53页 (文件大小：5757K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DAC81404, DAC61404
SLASEH2A – NOVEMBER 2020 – REVISED MAY 2021
DACx1404 Quad, 16-Bit and 12-Bit, High-Voltage-Output DACs
With Internal Reference
1 Features
3 Description
•
Performance:
The 16-bit DAC81404 and 12-bit DAC61404
(DACx1404) are pin-compatible, quad-channel,
buffered, high-voltage-output, digital-to-analog
converters (DACs). These devices include a low-drift,
2.5-V internal reference that eliminates the need for
an external precision reference in most applications.
The devices are specified monotonic and provide
high linearity of ±1 LSB INL. Additionally, the devices
implement per channel sense pins to eliminate IR
drops and sense up to ±12 V of ground bounce.
– Specified monotonic at 16-bit resolution
– INL: ±1 LSB maximum at 16-bit resolution
– TUE: ±0.05% FSR, maximum
Integrated output buffer
– Full-scale output voltage: ±5 V, ±10 V, ±20 V,
5 V, 10 V, 20 V, 40 V
– High drive capability: ±15 mA
– Per channel sense pins
Integrated 2.5-V precision reference
– Initial accuracy: ±2.5 mV, maximum
– Low drift: 10 ppm/°C, maximum
Reliability features:
– CRC error check
– Short circuit limit
– Fault pin
50-MHz, SPI-compatible serial interface
– 4-wire mode, 1.7-V to 5.5-V operation
– Readback and daisy-chain operations
Temperature range: –40°C to +125°C
Package: 5-mm × 5-mm, 32-pin QFN
•
•
•
A user-selectable output configuration enables full-
scale bipolar output voltages of ±20 V, ±10 V, and
±5 V; and full-scale unipolar output voltages of 40 V,
20 V, 10 V and 5 V. The full-scale output range for
each DAC channel is independently programmable.
The integrated DAC output buffers can sink or source
up to 15 mA, thus limiting the need for additional
operational amplifiers.
•
The DACx1404 incorporate a power-on-reset circuit
that connects the DAC outputs to ground at power
up. The outputs remain in this mode until the device
is properly configured for operation. These devices
include additional reliability features, such as a CRC
error check, short-circuit protection, and a thermal
alarm.
•
•
2 Applications
•
•
•
•
•
•
Semiconductor test
Lab and field Instrumentation
Analog output module
Data acquisition (DAQ)
LCD test
Communication to the devices is performed through
a 4-wire serial interface that supports operation from
1.7 V to 5.5 V.
Servo drive control module
IOVDD DVDD
FAULT
REFIO
AVDD
Device Information
PART NUMBER
DAC81404
PACKAGE(1)
BODY SIZE (NOM)
Internal Reference
Power On
Reset
REF
BUF
VQFN (32)
5.00 mm × 5.00 mm
SCLK
SDIN
SYNC
SDO
DAC61404
REF
DAC
Ladder
Buffer
Register
Active
Register
CCOMP[A:D]
OUT[A:D]
(1) For all available packages, see the package option
addendum at the end of the data sheet.
+
LDAC
–
RST
CLR
40 k
AVDD
SENSEP[A:D]
SENSEN[A:D]
40 k
Channel
A
40 k
–
+
40 k
Resistor Gain
Network
CCOMPX
REF
REF
DAC
Ladder
+
-
R
Current Limit
OUTX
40 k
40 k
40 k
40 k
GND
AGND
REFGND
AVSS
-
+
AVSS
GND
SENSEPX
Resistor Gain
Network
Functional Block Diagram
SENSENX
REF
REFGND
High Current Drive (1 A) Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC81404, DAC61404
SLASEH2A – NOVEMBER 2020 – REVISED MAY 2021
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings ....................................... 5
7.2 ESD Ratings .............................................................. 5
7.3 Recommended Operating Conditions ........................6
7.4 Thermal Information ...................................................6
7.5 Electrical Characteristics ............................................7
7.6 Timing Requirements: Write, IOVDD: 1.7 V to 2.7
V .................................................................................13
7.7 Timing Requirements: Write, IOVDD: 2.7 V to 5.5
V .................................................................................13
7.8 Timing Requirements: Read and Daisy Chain,
7.13 Typical Characteristics............................................17
8 Detailed Description......................................................25
8.1 Overview...................................................................25
8.2 Functional Block Diagram.........................................25
8.3 Feature Description...................................................26
8.4 Device Functional Modes..........................................30
8.5 Programming............................................................ 31
8.6 Register Map.............................................................34
9 Application and Implementation..................................41
9.1 Application Information............................................. 41
9.2 Typical Application.................................................... 41
10 Power Supply Recommendations..............................43
11 Layout...........................................................................43
11.1 Layout Guidelines................................................... 43
11.2 Layout Example...................................................... 43
12 Device and Documentation Support..........................44
12.1 Documentation Support.......................................... 44
12.2 Receiving Notification of Documentation Updates..44
12.3 Support Resources................................................. 44
12.4 Trademarks.............................................................44
12.5 Electrostatic Discharge Caution..............................44
12.6 Glossary..................................................................44
13 Mechanical, Packaging, and Orderable
FSDO = 0, IOVDD: 1.7 V to 2.7 V ............................... 14
7.9 Timing Requirements: Read and Daisy Chain,
FSDO = 1, IOVDD: 1.7 V to 2.7 V ............................... 14
7.10 Timing Requirements: Read and Daisy Chain,
FSDO = 0, IOVDD: 2.7 V to 5.5 V ............................... 15
7.11 Timing Requirements: Read and Daisy Chain,
FSDO = 1, IOVDD: 2.7 V to 5.5 V ............................... 15
7.12 Timing Diagrams.....................................................16
Information.................................................................... 44
4 Revision History
Changes from Revision * (November 2020) to Revision A (May 2021)
Page
•
Added DAC61404 and associated content.........................................................................................................1
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5 Device Comparison Table
DEVICE
RESOLUTION
16-bit
DAC81404
DAC61404
12-bit
6 Pin Configuration and Functions
OUTA
CCOMPA
SENSEPA
SENSENA
SENSENB
SENSEPB
CCOMPB
OUTB
1
2
3
4
5
6
7
8
24
OUTD
23
22
21
20
19
18
17
CCOMPD
SENSEPD
SENSEND
SENSENC
SENSEPC
CCOMPC
OUTC
Thermal pad
Not to scale
Figure 6-1. RHB (32-pin VQFN) Package, Top View
Table 6-1. Pin Functions
PIN
TYPE
DESCRIPTION
NO.
NAME
1
OUTA
Output
Input
Channel-A analog output voltage.
Channel-A external compensation capacitor connection.
The addition of an external capacitor improves the output buffer stability with high capacitive
loads at the OUTA pin by reducing the bandwidth of the output amplifier at the expense of
increased settling time.
2
CCOMPA
3
4
5
6
SENSEPA
SENSENA
SENSENB
SENSEPB
Input
Input
Input
Input
Channel-A sense pin for the positive voltage output load connection.
Channel-A sense pin for the negative voltage output load connection.
Channel-B sense pin for the negative voltage output load connection.
Channel-B sense pin for the positive voltage output load connection.
Channel-B external compensation capacitor connection pin.
The addition of an external capacitor improves the output buffer stability with high capacitive
loads at the OUTB pin by reducing the bandwidth of the output amplifier at the expense of
increased settling time.
7
8
9
CCOMPB
OUTB
Input
Output
Output
Channel-B analog output voltage.
Serial interface data output.
The SDO pin must be enabled before operation by setting the SDO-EN bit. Data are clocked out
of the input shift register on either rising or falling edges of the SCLK pin as specified by the
FSDO bit (rising edge by default).
SDO
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Table 6-1. Pin Functions (continued)
PIN
TYPE
DESCRIPTION
NO.
NAME
10
SCLK
Input
Input
Serial interface clock.
Serial interface data input. Data are clocked into the input shift register on each falling edge of the
SCLK pin.
11
12
13
SDIN
SYNC
LDAC
Active low serial data enable. This input is the frame synchronization signal for the serial data.
The serial interface input shift register is enabled when SYNC is low.
Input
Input
Active low synchronization signal. The DAC outputs of those channels configured in synchronous
mode are updated simultaneously when the LDAC pin is low. Connect to IOVDD if unused.
14
15
GND
Ground
Power
Digital ground reference point.
IOVDD
IO supply voltage. This pin sets the digital I/O operating voltage for the device.
Active-low clear input. Logic low on this pin clears all outputs to their clear code. Connect to
IOVDD if unused.
16
17
CLR
Input
OUTC
Output
Channel-C analog output voltage.
Channel-C external compensation capacitor connection pin.
The addition of an external capacitor improves the output buffer stability with high capacitive
loads at the OUTC pin by reducing the bandwidth of the output amplifier at the expense of
increased settling time.
18
CCOMPC
Input
19
20
21
22
SENSEPC
SENSENC
SENSEND
SENSEPD
Input
Input
Input
Input
Channel-C sense pin for the positive voltage output load connection.
Channel-C sense pin for the negative voltage output load connection.
Channel-D sense pin for the negative voltage output load connection.
Channel-D sense pin for the positive voltage output load connection.
Channel-D external compensation capacitor connection pin.
The addition of an external capacitor improves the output buffer stability with high capacitive
loads at the OUTD pin by reducing the bandwidth of the output amplifier at the expense of
increased settling time.
23
CCOMPD
Input
24
25
OUTD
Output
Channel-D analog output voltage.
REFGND
Ground
Ground reference point for the internal reference.
Reference input to the device when operating with an external reference. Reference output
voltage pin when using the internal reference. Connect a 150-nF capacitor to ground.
26
REFIO
Input/Output
27
28
29
30
AVSS
AVDD
AGND
DVDD
Power
Power
Ground
Power
Output buffers negative supply voltage.
Output buffers positive supply voltage.
Analog ground reference point.
Digital and analog supply voltage.
FAULT is an open-drain, fault-condition output. An external 10-kΩ pullup resistor to a voltage no
higher than IOVDD is required.
31
32
FAULT
RST
Output
Input
—
Active-low reset input. Logic low on this pin causes the device to issue a power-on-reset event.
Thermal
Pad
The thermal pad is located on the package underside. The thermal pad should be connected to
any internal PCB ground plane through multiple vias for good thermal performance.
Thermal pad
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
MAX
UNIT
DVDD to GND
IOVDD to GND
6
–0.3
6
44
Supply voltage
AVDD to GND
–0.3
V
AVSS to GND
–22
0.3
AVDD to AVSS
–0.3
44
VOUTX to GND
AVSS – 0.3
AVSS – 0.3
AVSS – 0.3
–0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
DVDD + 0.3
+0.3
VSENSEPX to GND
VSENSENX to GND
VREFIO to GND
Pin voltage
V
VREFGND to GND
Digital inputs to GND
SDO to GND
–0.3
–0.3
IOVDD + 0.3
IOVDD + 0.3
6
–0.3
FAULT to GND
Current into any digital pin
–0.3
Input current
–10
10
mA
°C
TJ
Junction temperature
Storage temperature
–40
150
Tstg
–60
150
°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/
ESDA/JEDEC JS-001(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per
JEDEC specification JESD22-C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
4.5
NOM
MAX
5.5
5.5
41.5
0
UNIT
DVDD to GND
IOVDD to GND
1.7
Supply voltage
AVDD to GND
AVSS to GND
AVDD to AVSS
VSENSENX to GND
4.5
V
–21.5
4.5
43
Pin voltage
–12
–40
12
V
TA
Ambient temperature
125
°C
7.4 Thermal Information
DACx1404
THERMAL METRIC(1)
RHB (VQFN)
32 PINS
29.3
UNIT
RΘJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
℃/W
℃/W
℃/W
℃/W
℃/W
℃/W
RΘJC(top)
RΘJB
17.0
9.5
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ΨJB
9.5
RΘJC(bot)
1.1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
all minimum/maximum specifications at TA = –40°C to +125°C and all typical specifications at TA = 25°C, AVDD = 4.5 V to
41.5 V, AVSS = –21.5 V to 0 V, DVDD = 5.0 V, internal reference enabled, IOVDD = 1.7 V, VSENSENX = 0 V, CCOMPX floating,
DAC outputs unloaded, and digital inputs at IOVDD or GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STATIC PERFORMANCE
DAC81404
16
12
Resolution
Bits
DAC61404
DAC81404. All ranges, except 0-V to
40-V and overranges
–1
1
INL
Relative accuracy(1)
LSB
LSB
DAC81404. 0-V to 40-V range
DAC61404
–2
–1
2
1
DNL
TUE
Differential nonlinearity(1)
Total unadjusted error(1)
–1
1
Unipolar ranges, AVSS = 0 V
–0.07
0.07
Unipolar ranges, AVSS = 0 V,
0°C ≤ TA ≤ 50°
–0.05
–0.05
–0.05
0.05
0.05
0.05
%FSR
Bipolar ranges, –21.5 V ≤ AVSS < 0 V
Unipolar ranges, AVSS = 0 V
Bipolar ranges, –21.5 V ≤ AVSS < 0 V
Offset error(1)
%FSR
Unipolar ranges, AVSS = 0 V
Bipolar ranges, –21.5 V ≤ AVSS < 0 V
Offset error temperature coefficient
±2
±2
ppmFSR/°C
All unipolar ranges, AVSS = 0 V
0.15
0.05
Zero-code (negative full scale) error
%FSR
All bipolar ranges,
–21.5 V ≤ AVSS < 0 V
All unipolar ranges, AVSS = 0 V
All bipolar ranges,
–21.5 V ≤ AVSS < 0 V
Zero-code (negative full scale) error
temperature coefficient
ppm of
FSR/°C
Full-scale error(2)
–0.06
–0.06
0.06
0.06
%FSR
Full-scale error temperature
coefficient(2)
ppm of
FSR/°C
±3
±2
Gain error(1)
%FSR
ppm of
FSR/°C
Gain error temperature coefficient
All bipolar ranges,
–21.5 V ≤ AVSS < 0 V
Bipolar-zero (midscale) error
–0.03
0.03
%FSR
Bipolar-zero (midscale) error
temperature coefficient
All bipolar ranges,
–21.5 V ≤ AVSS < 0 V
ppm of
FSR/°C
±2
±6
TA = 40°C, DAC code = full scale,
1000 hours
Output voltage drift over time
ppm FSR
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7.5 Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and all typical specifications at TA = 25°C, AVDD = 4.5 V to
41.5 V, AVSS = –21.5 V to 0 V, DVDD = 5.0 V, internal reference enabled, IOVDD = 1.7 V, VSENSENX = 0 V, CCOMPX floating,
DAC outputs unloaded, and digital inputs at IOVDD or GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT CHARACTERISTICS
0
0
5
6
20% overrange
0
10
12
20
24
40
5
20% overrange
20% overrange
0
0
0
VOUT
Output voltage
V
0
-5
20% overrange
20% overrange
-6
6
–10
–12
–20
10
12
20
to AVSS and AVDD
−10 mA ≤ load current ≤ 10 mA
1.25
1.5
Output voltage headroom and
footroom
V
to AVSS and AVDD
,
5.5 V < AVDD ≤ 41.5 V,
−15 mA ≤ load current ≤ 15 mA
Full-scale output shorted to AVSS
40
40
Zero-scale output shorted to AVDD
5.5 V < AVDD ≤ 41.5 V,
,
,
Short circuit current(3)
mA
Zero-scale output shorted to AVDD
4.5 V ≤ AVDD ≤ 5.5 V
25
50
DAC at midscale,
−15 mA ≤ load current ≤ 15 mA
Load regulation
µV/mA
nF
RLOAD = open, CCOMPX pin left floating
0
2
1
CL
Capacitive load(4)
RLOAD = open,
CCOMPX = 500 pF ± 10% to VOUTX
µF
5.5 V < AVDD ≤ 41.5 V
15
10
Load current(4)
mA
Ω
4.5 V ≤ AVDD ≤ 5.5 V
DAC code at midscale, DAC unloaded
DAC code at full scale, DAC unloaded
0.05
0.05
VOUT dc output impedance
DAC code at negative full scale,
DAC unloaded
25
DAC code at midscale, 10-V span
DAC disabled
55
45
45
45
VSENSEP dc output impedance
VSENSEN dc output impedance
kΩ
kΩ
DAC code at midscale, 10-V span
DAC disabled
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7.5 Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and all typical specifications at TA = 25°C, AVDD = 4.5 V to
41.5 V, AVSS = –21.5 V to 0 V, DVDD = 5.0 V, internal reference enabled, IOVDD = 1.7 V, VSENSENX = 0 V, CCOMPX floating,
DAC outputs unloaded, and digital inputs at IOVDD or GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC PERFORMANCE
5-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB
7
8
10-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB
µs
20-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB
12
22
40-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB
5-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB,
CL = 1 µF, CCOMPX = 500 pF to VOUTX
0.6
0.6
0.6
1.2
Output voltage settling time
10-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB,
CL = 1 µF, CCOMPX = 500 pF to VOUTX
ms
20-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB,
CL = 1 µF, CCOMPX = 500 pF to VOUTX
40-V span, 1/4 to 3/4 scale and 3/4 to
1/4 scale, settling time to ±2 LSB,
CL = 1 µF, CCOMPX = 500 pF to VOUTX
0-V to 5-V range (10% to 90% of full-
scale range)
0.8
4
All other output ranges except 40-V
span (10% to 90% of full-scale range)
Slew rate
V/µs
0-V to 5-V range, CL = 1 µF,
CCOMPX = 500 pF to VOUTX
0.04
0.04
All other ranges, CL = 1 µF,
CCOMPX = 500 pF to VOUTX
AVSS and AVDD ramped symmetrically,
ramp rate = 18 V/ms, output unloaded,
internal reference
Power-on glitch magnitude
0.1
0.35
25
V
V
AVSS and AVDD ramped, output
unloaded, internal reference, gain = 1x
Output enable glitch magnitude
0.1 Hz to 10 Hz, DAC code at
midscale, 5-V span, external reference
= 2.5 V, output unloaded
Output noise
µVPP
0.1 Hz to 10 Hz, DAC code at
midscale, 5-V span, internal reference
= 2.5 V, output unloaded
30
1 kHz, DAC code at midscale, 5-
V span, output unloaded, external
reference
115
Output noise density
nV/√Hz
10 kHz, DAC code at midscale, 5-
V span, output unloaded, external
reference
105
88
1-kHz sine wave on VOUTX, output
unloaded, DAC update rate = 400 kHz
THD
Total harmonic distortion
dB
dB
VOUTX = 0 V (midscale), output
unloaded, ±10-V output,
frequency = 60 Hz,
PSRR-AC
Power supply ac rejection ratio
75
amplitude 200 mVPP
,
superimposed on AVDD, DVDD or AVSS
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7.5 Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and all typical specifications at TA = 25°C, AVDD = 4.5 V to
41.5 V, AVSS = –21.5 V to 0 V, DVDD = 5.0 V, internal reference enabled, IOVDD = 1.7 V, VSENSENX = 0 V, CCOMPX floating,
DAC outputs unloaded, and digital inputs at IOVDD or GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VOUTX = 0 V (midscale), ±10-V output,
DVDD = 5 V, AVDD = 15 V ± 20%,
AVSS = –15 V, output unloaded
5
µV/V
VOUTX = 0 V (midscale), ±10-V output,
DVDD = 5 V, AVDD = 15 V,
PSRR-DC
Power supply dc rejection ratio
10
AVSS = –15 V ± 20%, output unloaded
VOUTX = 0 V (midscale), ±10-V output,
DVDD = 5 V ± 5%, AVDD = 15 V,
AVSS = –15 V, output unloaded
0.2
mV/V
nV-s
1-LSB change around midscale,
0-V to 5-V range, output unloaded
1
2
2
1-LSB change around midscale,
0-V to 10-V range, output unloaded
Code change glitch impulse
1-LSB change around midscale,
–5-V to +5-V range, output unloaded
1-LSB change around midscale,
–10-V to +10-V range, output
unloaded
4
1-LSB change around midscale,
0-V to 5-V, 0-V to 10-V, –5-V to +5-
V and –10-V to +10-V ranges, output
unloaded
Code change glitch amplitude
±10
mV
10-V span, full-scale swing on all
other channel, measured channel at
midscale, output unloaded
Channel-to-channel ac crosstalk
Channel-to-channel dc crosstalk
1
1
nV-s
LSB
10-V span, full-scale swing on all
other channel, measured channel at
midscale, output unloaded
10-V span, full-scale swing on all
other input buffer, measured channel
at midscale, output unloaded
Digital crosstalk
1
1
nV-s
nV-s
DAC code at midscale, fSCLK = 1 MHz,
output unloaded
Digital feedthrough
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7.5 Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and all typical specifications at TA = 25°C, AVDD = 4.5 V to
41.5 V, AVSS = –21.5 V to 0 V, DVDD = 5.0 V, internal reference enabled, IOVDD = 1.7 V, VSENSENX = 0 V, CCOMPX floating,
DAC outputs unloaded, and digital inputs at IOVDD or GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EXTERNAL REFERENCE INPUT
VREFIO
Reference input voltage
Reference input current
Reference input impedance
Reference input capacitance
2.49
2.5
50
50
90
2.51
V
µA
kΩ
pF
INTERNAL REFERENCE
Reference output voltage
TA = 25°C
2.4975
2.5025
10
V
ppm/°C
Ω
Reference output drift
5
0.15
12
Reference output impedance
Reference output noise
0.1 Hz to 10 Hz
µVPP
nV/√Hz
mA
Reference output noise density
Reference load current
10 kHz, VREFIO = 10 nF
240
5
Reference load regulation
Reference line regulation
Reference output drift over time
Source
120
100
±300
±125
±25
µV/mA
µV/V
µV
TA = 40°C, 1000 hours
First cycle
Reference thermal hysteresis
µV
Additional cycle
DIGITAL INPUTS AND OUTPUTS
0.7 × IO
VDD
VIH
VIL
Input high voltage
Input low voltage
V
V
0.3
× IOVDD
Input current
±2
2
µA
pF
Input pin capacitance
IOVDD
–
VOH
VOL
SDO, high-level output voltage
SDO load current = 0.2 mA
V
0.2
SDO, low-level output voltage
FAULT, low-level output voltage
Output pin capacitance
SDO load current = 0.2 mA
FAULT load current = 10 mA
0.4
0.4
V
V
5
pF
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7.5 Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and all typical specifications at TA = 25°C, AVDD = 4.5 V to
41.5 V, AVSS = –21.5 V to 0 V, DVDD = 5.0 V, internal reference enabled, IOVDD = 1.7 V, VSENSENX = 0 V, CCOMPX floating,
DAC outputs unloaded, and digital inputs at IOVDD or GND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER REQUIREMENTS
Normal mode, internal reference
Normal mode, external reference
Power-down mode
8
7
mA
AIDD
DIDD
AISS
AVDD supply current(5)
DVDD supply current(5)
AVSS supply current(5)
IOVDD supply current(5)
10
8
µA
Digital interface static
mA
Normal mode, internal reference
Normal mode, external reference
Power-down mode
–8
–7
mA
–10
µA
µA
IIOVDD
SCLK toggling at 1 MHz
100
(1) End point fit between codes. 16-bit: 512 to 65024 for AVDD ≥ 5.5 V, 512 to 63488 for AVDD ≤ 5.5 V, 0.2-V headroom between VREFIO
and AVDD; 12-bit: 32 to 4064 for AVDD ≥ 5.5 V, 32 to 3968 for AVDD ≤ 5.5 V, 0.2-V headroom between VREFIO and AVDD
.
(2) Full-scale code written to the DAC for AVDD ≥ 5.5 V. 16-bit: code 63488 written to the DAC for AVDD ≤ 5.5 V; 12-bit: code 3968 written
to the DAC for AVDD ≤ 5.5 V.
(3) Temporary overload condition protection. junction temperature can be exceeded during current limit. operation above the specified
maximum junction temperature may impair device reliability.
(4) Specified by design and characterization, not production tested.
(5) AVDD = +15 V, AVSS = –15 V, DVDD = 5 V, SPI static, 10-V output span, all DAC at full scale, VOUTX unloaded.
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7.6 Timing Requirements: Write, IOVDD: 1.7 V to 2.7 V
all specifications at TA = –40°C to +125°C, input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed
from a voltage level of (VIL + VIH) / 2, SDO loaded with 20 pF, 1.7 V ≤ IOVDD < 2.7 V
PARAMETER
MIN
NOM
MAX
UNIT
MHz
ns
fSCLK
SCLK frequency
SCLK high time
SCLK low time
SDIN setup
25
tSCLKHIGH
tSCLKLOW
tSDIS
20
20
10
10
30
10
50
2.4
4
ns
ns
tSDIH
SDIN hold
ns
tCSS
SYNC to SCLK falling edge setup
SCLK falling edge to SYNC rising edge
SYNC high time
ns
tCSH
ns
tCSHIGH
tDACWAIT
tBCASTWAIT
tLDACAL
tLDACW
tCLRW
ns
Sequential DAC update wait time
Broadcast DAC update wait time
SYNC rising edge to LDAC falling edge
LDAC low time
µs
µs
80
20
20
20
ns
ns
CLR low time
ns
tRSTW
RST low time
ns
7.7 Timing Requirements: Write, IOVDD: 2.7 V to 5.5 V
all specifications at TA = –40°C to +125°C, input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed
from a voltage level of (VIL + VIH) / 2, SDO loaded with 20 pF, 2.7 V ≤ IOVDD ≤ 5.5 V
PARAMETER
MIN
NOM
MAX
UNIT
MHz
ns
fSCLK
SCLK frequency
SCLK high time
SCLK low time
SDIN setup
50
tSCLKHIGH
tSCLKLOW
tSDIS
10
10
5
ns
ns
tSDIH
SDIN hold
5
ns
tCSS
SYNC to SCLK falling edge setup
SCLK falling edge to SYNC rising edge
SYNC high time
15
5
ns
tCSH
ns
tCSHIGH
tDACWAIT
tBCASTWAIT
tLDACAL
tLDACW
tCLRW
25
2.4
4
ns
Sequential DAC update wait time
Broadcast DAC update wait time
SYNC rising edge to LDAC falling edge
LDAC low time
µs
µs
40
20
20
20
ns
ns
CLR low time
ns
tRSTW
RST low time
ns
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7.8 Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 1.7 V to 2.7 V
all specifications at TA = –40°C to +125°C, input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed
from a voltage level of (VIL + VIH) / 2, SDO loaded with 20 pF, 1.7 V ≤ IOVDD < 2.7 V
PARAMETER
MIN
NOM
MAX
UNIT
MHz
ns
fSCLK
SCLK frequency
SCLK high time
SCLK low time
SDIN setup
12.5
tSCLKHIGH
tSCLKLOW
tSDIS
33
33
10
10
30
10
50
0
ns
ns
tSDIH
SDIN hold
ns
tCSS
SYNC to SCLK falling edge setup
SCLK falling edge to SYNC rising edge
SYNC high time
ns
tCSH
ns
tCSHIGH
tSDOZ
ns
SDO driven to tri-state mode
30
30
ns
tSDODLY
SDO output delay from SCLK rising edge
0
ns
7.9 Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 1.7 V to 2.7 V
all specifications at TA = –40°C to +125°C, input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed
from a voltage level of (VIL + VIH) / 2, SDO loaded with 20 pF, 1.7 V ≤ IOVDD < 2.7 V
PARAMETER
MIN
NOM
MAX
UNIT
MHz
ns
fSCLK
SCLK frequency
SCLK high time
SCLK low time
SDIN setup
25
tSCLKHIGH
tSCLKLOW
tSDIS
20
20
10
10
30
10
50
0
ns
ns
tSDIH
SDIN hold
ns
tCSS
SYNC to SCLK falling edge setup
SCLK falling edge to SYNC rising edge
SYNC high time
ns
tCSH
ns
tCSHIGH
tSDOZ
ns
SDO driven to tri-state mode
30
30
ns
tSDODLY
SDO output delay from SCLK rising edge
0
ns
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7.10 Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 2.7 V to 5.5 V
all specifications at TA = –40°C to +125°C, input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed
from a voltage level of (VIL + VIH) / 2, SDO loaded with 20 pF, 2.7 V ≤ IOVDD ≤ 5.5 V
PARAMETER
MIN
NOM
MAX
UNIT
MHz
ns
fSCLK
SCLK frequency
SCLK high time
SCLK low time
SDIN setup
20
tSCLKHIGH
tSCLKLOW
tSDIS
25
25
5
ns
ns
tSDIH
SDIN hold
5
ns
tCSS
SYNC to SCLK falling edge setup
SCLK falling edge to SYNC rising edge
SYNC high time
20
5
ns
tCSH
ns
tCSHIGH
tSDOZ
25
0
ns
SDO driven to tri-state mode
20
20
ns
tSDODLY
SDO output delay from SCLK rising edge
0
ns
7.11 Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 2.7 V to 5.5 V
all specifications at TA = –40°C to +125°C, input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed
from a voltage level of (VIL + VIH) / 2, SDO loaded with 20 pF, 2.7 V ≤ IOVDD ≤ 5.5 V
PARAMETER
MIN
NOM
MAX
UNIT
MHz
ns
fSCLK
SCLK frequency
SCLK high time
SCLK low time
SDIN setup
35
tSCLKHIGH
tSCLKLOW
tSDIS
14
14
5
ns
ns
tSDIH
SDIN hold
5
ns
tCSS
SYNC to SCLK falling edge setup
SCLK falling edge to SYNC rising edge
SYNC high time
20
5
ns
tCSH
ns
tCSHIGH
tSDOZ
25
0
ns
SDO driven to tri-state mode
20
20
ns
tSDODLY
SDO output delay from SCLK rising edge
0
ns
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7.12 Timing Diagrams
tCSS
tCSH
tCSHIGH
SYNC
SCLK
SDIN
tSCLKLOW
tSCLKHIGH
tSDIH
tSDIS
Bit 23
Bit 1
Bit 0
LDAC(A)
LDAC(B)
CLR
tCLRW
tLDACAL tLDACW
tRSTW
RST
A. Asynchronous update.
B. Synchronous update.
Figure 7-1. Serial Interface Write Timing Diagram
tCSHIGH
tCSS
tCSH
SYNC
SCLK
tSCLKLOW
tSCLKHIGH
FIRST READ COMMAND
Bit 22
ANY COMMAND
Bit 22
SDIN
SDO
Bit 23
Bit 0
Bit 23
Bit 23
Bit 0
tSDIH
tSDIS
DATA FROM FIRST
READ COMMAND
Bit 22
Bit 0
tSDOZ
tSDODLY
Figure 7-2. Serial Interface Read Timing Diagram
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7.13 Typical Characteristics
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
Figure 7-3. DAC81404 INL vs Digital Input Code
(Bipolar Outputs)
Figure 7-4. DAC81404 INL vs Digital Input Code
(Unipolar Outputs)
Figure 7-5. DAC81404 DNL vs Digital Input Code
(Bipolar Outputs)
Figure 7-6. DAC81404 DNL vs Digital Input Code
(Unipolar Outputs)
Figure 7-7. DAC81404 TUE vs Digital Input Code
(Bipolar Outputs)
Figure 7-8. DAC81404 TUE vs Digital Input Code
(Unipolar Outputs)
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
Figure 7-9. DAC61404 INL vs Digital Input Code
(Bipolar Outputs)
Figure 7-10. DAC61404 INL vs Digital Input Code
(Unipolar Outputs)
Figure 7-11. DAC61404 DNL vs Digital Input Code
(Bipolar Outputs)
Figure 7-12. DAC61404 DNL vs Digital Input Code
(Unipolar Outputs)
Figure 7-13. DAC61404 TUE vs Digital Input Code
(Bipolar Outputs)
Figure 7-14. DAC61404 TUE vs Digital Input Code
(Unipolar Outputs)
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
Figure 7-15. DAC81404 INL vs Temperature
Figure 7-17. DAC61404 INL vs Temperature
Figure 7-19. TUE vs Temperature
Figure 7-16. DAC81404 DNL vs Temperature
Figure 7-18. DAC61404 DNL vs Temperature
Figure 7-20. Unipolar Offset Error vs Temperature
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
Figure 7-22. Bipolar Zero Code Error vs Temperature
Figure 7-21. Unipolar Zero Code Error vs Temperature
Figure 7-23. Bipolar Zero Error vs Temperature
Figure 7-24. Gain Error vs Temperature
Figure 7-26. Supply Current (DIDD
)
Figure 7-25. Full-Scale Error vs Temperature
vs Digital Input Code
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
Figure 7-27. Supply Current (AIDD, AISS
vs Digital Input Code
)
Figure 7-28. Supply Current (IIOVDD
)
vs Supply Voltage
DAC range: ±20 V
DAC range: ±20 V
Figure 7-29. Supply Current vs Temperature
Figure 7-30. Power-Down Current vs Temperature
Figure 7-32. Source and Sink Capability
Figure 7-31. Headroom and Footroom from Supply
vs Output Current
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
DAC range: ±10 V
DAC range: ±10 V
Figure 7-33. Full-Scale Settling Time, Rising Edge
Figure 7-34. Full-Scale Settling Time, Falling Edge
DAC range: ±20 V
DAC range: ±10 V
Figure 7-35. DAC Output Enable Glitch
Figure 7-36. Glitch Impulse, 1 LSB Step,
Rising Edge
DAC range: ±10 V
Figure 7-37. Glitch Impulse, 1 LSB Step,
Figure 7-38. Power-Up Response
Falling Edge
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
DAC range: ±20 V
Figure 7-39. Power-Down Response
Figure 7-40. Clear Command Response
DAC range: 0 V to 5 V
Midscale code
DAC range: 0 V to 5 V
Midscale code
Figure 7-41. DAC Output Noise Density vs Frequency
Figure 7-42. DAC Output Noise
Figure 7-44. Internal Reference Voltage
vs Supply Voltage
Figure 7-43. Internal Reference Voltage vs Temperature
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7.13 Typical Characteristics (continued)
at TA = 25°C, DVDD = 5.0 V, IOVDD = 1.8 V, internal reference enabled, unipolar ranges: AVSS = 0 V and AVDD ≥ VMAX + 1.5
V for the DAC range, bipolar ranges: AVSS ≤ VMIN − 1.5 V and AVDD ≥ VMAX + 1.5 V for the DAC range, and DAC outputs
unloaded (unless otherwise noted)
Figure 7-46. Internal Reference Noise Density vs Frequency
Figure 7-45. Internal Reference Voltage vs Time
Figure 7-48. Internal Reference Temperature Drift Histogram
Figure 7-47. Internal Reference Noise
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8 Detailed Description
8.1 Overview
The 16-bit DAC81404 and 12-bit DAC61404 (DACx1404) are pin-compatible, quad-channel, high-voltage output,
digital-to-analog converters (DACs). The DACx1404 consist of an R-2R-based ladder followed by an output
buffer. The devices also include a precision reference and a reference buffer. The R-2R-based ladder is
production trimmed to provide monotonicity and a linearity of ±1 LSB. The devices are also optimized to reduce
the code-to-code change glitch to less than 2 nV-s.
The DACx1404 output amplifier provides bipolar voltage outputs up to ±20 V, and unipolar voltage outputs up to
40 V. Each output channel includes sense pins to eliminate the IR drop across load connections, and sense a
difference of up to ±12 V between the load and DAC grounds. Alternatively, the sense pins can also be used for
output offset adjustment. An external capacitor compensation pin is also provided to stabilize the output amplifier
for high capacitive loads.
Communication to the DACx1404 is performed through a 4-wire serial interface that supports stand-alone and
daisy-chain operation. An optional frame-error check provides added robustness to the device serial interface.
The DACx1404 incorporate a power-on-reset circuit that connects the DAC outputs to ground at power up. The
outputs remain in this mode until the device is properly configured for operation. The devices include additional
reliability features such as short-circuit protection and a thermal alarm.
8.2 Functional Block Diagram
IOVDD DVDD
FAULT
REFIO
AVDD
Internal Reference
Power On
Reset
REF
BUF
SCLK
SDIN
SYNC
SDO
REF
DAC
Ladder
Buffer
Register
Active
Register
CCOMP[A:D]
OUT[A:D]
+
LDAC
–
RST
CLR
40 k
SENSEP[A:D]
SENSEN[A:D]
40 k
Channel
A
40 k
–
+
40 k
Resistor Gain
Network
REF
GND
AGND
REFGND
AVSS
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8.3 Feature Description
Each output channel in the device consists of an R-2R ladder digital-to-analog converter (DAC) with dedicated
reference and ground buffers, and an output buffer amplifier capable of rail-to-rail operation. The device also
includes an internal 2.5-V reference. Figure 8-1 shows a simplified diagram of the device architecture.
DVDD
IOVDD
REFIO
Internal
Reference
REF
BUF
REF
DAC
Ladder
Buffer
Register
Active
Register
AVDD
(async mode)
CCOMPX
OUTX
+
-
Clear Signal
LDAC Trigger
(synchronous mode)
AVSS
40 k
40 k
SENSEPX
SENSENX
40 k
40 k
-
+
Resistor Gain
Network
REF
GND
AGND
REFGND
Figure 8-1. Device Architecture
8.3.1 R-2R Ladder DAC
The DAC architecture consists of a voltage-output, segmented, R-2R ladder as shown in Figure 8-2. The device
incorporates a dedicated reference buffer per output channel that provides constant input impedance with code
at the REFIO pin. The output of the reference buffers drives the R-2R ladders. A production trim process
provides excellent linearity and low glitch.
Output
Amplifier
R
R
R
R
OUTX
Internal
Reference
REFIO
Reference
Buffer
REFGND
Figure 8-2. R-2R Ladder
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8.3.2 Programmable-Gain Output Buffer
The voltage output stage as conceptualized in Figure 8-3 provides the voltage output according to the DAC code
and the output range setting.
REFIO
AVDD
DAC
CCOMPX
OUTX
+
Ladder
-
AVSS
40 k
40 k
SENSEPX
SENSENX
40 k
-
+
40 k
R
REFIO
Resistor Gain
Network
REFGND
Figure 8-3. Voltage Output Buffer
For unipolar output mode, the output range can be programmed as:
•
•
•
•
0 V to 5 V
0 V to 10 V
0 V to 20 V
0 V to 40 V
For bipolar output mode, the output reange can be programmed as:
•
•
•
±5 V
±10 V
±20 V
In addition, 20% overrange is available on all ranges except for 0 V to 40 V and ±20 V.
The input data are written to the individual DAC data registers in straight-binary format for all output ranges. The
output voltage (VOUTX) can be expressed as Equation 1 and Equation 2.
For unipolar output mode
CODE
VOUTX = VREFIO ìGAINì
2N
(1)
For bipolar output mode
VREFIO
CODE
2N
VOUTX = VREFIO ìGAINì
where:
- GAINì
2
(2)
•
•
•
•
CODE is the decimal equivalent of the binary code loaded to the DAC data register.
N is the DAC resolution in bits.
VREFIO is the reference voltage (internal or external).
GAIN is the gain factor assigned to each output voltage output range as shown in Table 8-1.
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Table 8-1. Voltage Output Range vs Gain Setting
MODE
VOLTAGE OUTPUT RANGE
GAIN
2.0
5 V
6 V (20% overrange)
10 V
2.4
4.0
Unipolar
12 V (20% overrange)
20 V
4.8
8.0
24 V (20% overrange)
40 V
9.6
16.0
4.0
±5 V
±6 V (20% overrange)
±10 V
4.8
Bipolar
8.0
±12 V (20% overrange)
±20 V
9.6
16.0
The output amplifiers can drive up to ±15 mA with 1.5-V supply headroom while maintaining the specified TUE
specification for the device. The output stage has short-circuit current protection that limits the output current
to 40 mA. The device is able to drive capacitive loads up to 1 µF. For loads greater than 2 nF, an external
compensation capacitor must be connected between the CCOMPx and OUTx pins to keep the output voltage
stable, but at the expense of reduced bandwidth and increased settling time.
8.3.2.1 Sense Pins
The SENSEPx pins are provided to enable sensing of the load by connecting to points electrically closer to
the load. This configuration allows the internal output amplifier to make sure that the correct voltage is applied
across the load, as long as headroom is available on the power supply. The SENSEPx pins are used to correct
for resistive drops on the system board, and are connected to VOUTX at the pins. In some cases, both VOUTX and
VSENSEPX are brought out through separate lines and connected remotely together at the load. In such cases, if
the VSENSEPX line is cut, then the amplifier loop is broken; use a 5-kΩ resistor between the OUTx and SENSEPx
pins to maintain proper amplifier operation.
The SENSENx pins are provided as remote ground sense reference outputs from the internal VOUTX amplifier.
The output swing of the VOUTX amplifier is relative to the voltage seen at these pins. The voltage difference
between VSENSENX and the device ground must be lower than ±12 V.
At device start up, the power-on-reset circuit makes sure that all registers are at default values. The voltage
output buffer is in a Hi-Z state; however, the SENSEPx pins connect to the amplifier inputs through an internal
40-kΩ feedback resistor (Figure 8-3). If the OUTx and SENSEPx pins are connected together, the OUTx pins are
also connected to the same node through the feedback resistor. This node is protected by internal circuitry and
settles to a value between GND and the reference input.
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8.3.3 DAC Register Structure
Data written to the DAC data registers is initially stored in the DAC buffer registers. The transfer of data from the
DAC buffer registers to the active registers can be configured to occur immediately (asynchronous mode) or be
initiated by a DAC trigger signal (synchronous mode). After the active registers are updated, the DAC outputs
change to the new values.
After a power-on or reset event, all DAC registers set to zero code, the DAC output amplifiers power down, and
the DAC outputs connect to ground.
8.3.3.1 DAC Output Update
The DAC double-buffered architecture enables data updates without disturbing the analog outputs. Data updates
can be performed either in synchronous or asynchronous mode. The device offers both software and hardware
data update control.
The update mode for each DAC channel is determined by the status of the corresponding SYNC-EN bit. In both
update modes, a minimum wait time of 2.4 μs is required between DAC output updates.
8.3.3.1.1 Synchronous Update
In synchronous mode, writing to the DAC data register does not automatically update the DAC output. Instead
the update occurs only after a trigger event. A DAC trigger signal is generated eigher through the SOFT-LDAC
bit or by the LDAC pin. The synchronous update mode enables simultaneous update of multiple DAC outputs.
8.3.3.1.2 Asynchronous Update
In asynchronous mode, a DAC data register write results in an immediate update of the DAC active register and
DAC output on a SYNC rising edge.
8.3.3.2 Broadcast DAC Register
The DAC broadcast register enables a simultaneous update of multiple DAC outputs with the same value with a
single register write.
Each DAC channel can be configured to update or remain unaffected by a broadcast command by setting
the corresponding DAC-BRDCAST-EN bit. A register write to the BRDCAST-DATA register forces those DAC
channels that have been configured for broadcast operation to update their DAC buffer registers to this value.
The DAC outputs update to the broadcast value according to their synchronous mode configuration.
8.3.3.3 Clear DAC Operation
The DAC outputs are set in clear mode either through the CLR pin or the SOFT-CLR bit. In clear mode, each
DAC data register is set to either zero code (if configured for unipolar range operation) or midscale code (if set
for bipolar range operation). A clear command forces all DAC channels to clear the contents of their buffer and
active registers to the clear code regardless of their synchronization setting.
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8.3.4 Internal Reference
The device includes a precision 2.5-V band-gap reference with a maximum temperature drift of 10 ppm/°C. The
internal reference is in power-down mode by default.
The internal reference voltage is available at the REFIO pin and can source up to 5 mA. To filter noise, place a
minimum 150-nF capacitor between the reference output and ground.
External reference operation is also supported. The external reference is applied to the REFIO pin. If using an
external reference, power down the internal reference.
8.3.5 Power-On Reset (POR)
The device incorporates a power-on-reset function. After the supplies reach their minimum specified values, a
POR event is issued. Additionally, a POR event can be initiated by the RST pin or a SOFT-RESET command.
A POR event causes all registers to initialize to default values, and communication with the device is valid only
after a 1 ms POR delay. After a POR event, the device is set to power-down mode, where all DAC channels and
internal reference are powered down and the DAC outputs are connected to ground through a 10-kΩ internal
resistor.
8.3.5.1 Hardware Reset
A device hardware reset event is initiated by a minimum 20-ns logic low on the RST pin.
8.3.5.2 Software Reset
The device implements a software reset feature. A device software reset is initiated by writing reserved code
0x1010 to SOFT-RESET in the TRIGGER register. The software reset command is triggered on the SYNC rising
edge of the instruction.
8.3.6 Thermal Alarm
The device incorporates a thermal shutdown that is triggered when the die temperature exceeds 140°C. A
thermal shutdown sets the TEMP-ALM bit, and causes all DAC outputs to power-down; however, the internal
reference remains powered on. The FAULT pin can be configured to monitor a thermal shutdown condition by
setting the TEMPALM-EN bit. After a thermal shutdown is triggered, the device stays in shutdown even after the
device temperature lowers.
The die temperature must fall to less than 140°C before the device can be returned to normal operation.
To resume normal operation, the thermal alarm must be cleared through the ALM-RESET bit while the DAC
channels are in power-down mode.
8.4 Device Functional Modes
8.4.1 Power-Down Mode
The device output amplifiers and internal reference power-down status can be individually configured and
monitored though the PWDWN registers. Setting a DAC channel in power-down mode disables the output
amplifier and clamps the output pin to ground through an internal 10-kΩ resistor.
The DAC data registers are not cleared when the DAC goes into power-down mode. Therefore, upon return to
normal operation, the DAC output voltages return to the same respective voltages prior to the device entering
power-down mode. The DAC data registers can be updated while in power-down mode, which allows for
changing the power-on voltage, if required.
After a power-on or reset event, all the DAC channels and the internal reference are in power-down mode. The
entire device can be configured into power-down or active modes through the DEV-PWDWN bit.
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8.5 Programming
The device is controlled through an SPI-compatible, flexible, four-wire, serial interface. The interface provides
access to the device registers, and can be configured to daisy-chain multiple devices for write operations.
The device incorporates an optional error-checking mode to validate SPI data communication integrity in noisy
environments.
8.5.1 Stand-Alone Operation
A serial interface access cycle is initiated by asserting the SYNC pin low. The serial clock, SCLK, can be a
continuous or gated clock. SDIN data are clocked on SCLK falling edges. A regular serial interface access cycle
is 24 bits long with error checking disabled and 32 bits long with error checking enabled. Therefore, the SYNC
pin must stay low for at least 24 or 32 SCLK falling edges. The access cycle ends when the SYNC pin is
deasserted high. If the access cycle contains less than the minimum clock edges, the communication is ignored.
If the access cycle contains more than the minimum clock edges, only the first 24 or 32 bits are used by the
device. When SYNC is high, the SCLK and SDIN signals are blocked, and SDO is in a Hi-Z state.
Table 8-2 describes the format for an error-checking-disabled access cycle (24-bits long). The first byte input to
SDIN is the instruction cycle. The instruction cycle identifies the request as a read or write command and the
6-bit address that is to be accessed. The last 16 bits in the cycle form the data cycle.
Table 8-2. Serial Interface Access Cycle
BIT
FIELD
DESCRIPTION
Identifies the communication as a read or write command to the address
register:
R/W = 0 sets a write operation.
R/W = 1 sets a read operation
23
RW
22
x
Don't care bit
Register address — specifies the register to be accessed during the read or
write operation
21-16
A[5:0]
Data cycle bits:
If a write command, the data cycle bits are the values to be written to the
register with address A[5:0]
15-0
DI[15:0]
If a read command, the data cycle bits are don't care values
Read operations require that the SDO pin is first enabled by setting the SDO-EN bit. A read operation is initiated
by issuing a read command access cycle. After the read command, a second access cycle must be issued to get
the requested data. The output data format is shown in Table 8-3. Data are clocked out on the SDO pin either on
the falling edge or rising edge of SCLK according to the FSDO bit.
Table 8-3. SDO Output Access Cycle
BIT
23
FIELD
DESCRIPTION
RW
Echo RW from previous access cycle
22
x
Echo bit 22 from previous access cycle
21-16
15-0
A[5:0]
DO[15:0]
Echo address from previous access cycle
Readback data requested on previous access cycle
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8.5.2 Daisy-Chain Operation
For systems that contain several devices, the SDO pin can be used to daisy-chain the devices together.
Daisy-chain operation is useful in reducing the number of serial interface lines.The SDO pin must be enabled by
setting the SDO-EN bit before initiating daisy-chain operation.
The first falling edge on the SYNC pin starts the operation cycle (see Figure 8-4). If more than 24 clock pulses
are applied while the SYNC pin is kept low, the data ripple out of the shift register and are clocked out on
the SDO pin, either on the falling edge or rising edge of SCLK according to the FSDO bit. By connecting the
SDO output of the first device to the SDIN input of the next device in the chain, a multiple-device interface is
constructed.
Each device in the daisy-chain system requires 24 clock pulses. As a result the total number of clock cycles
must be equal to 24 × N, where N is the total number of devices in the daisy chain. When the serial transfer to all
devices is complete, the SYNC signal is taken high. This action transfers the data from the SPI shift registers to
the internal register of each device in the daisy chain, and prevents any further data from being clocked into the
input shift register.
SYNC
1
8
9
24
25
48
49
72
SCLK
Device A command
Device B command
NOP
D23
D16
D15
D0
SDIN
D23 œ D1
D0
D23 œ D1
D0
SDO
Device A command
Device B command
Figure 8-4. Serial Interface Daisy-Chain Write Cycle
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8.5.3 Frame Error Checking
If the device is used in a noisy environment, error checking can be used to check the integrity of SPI data
communication between the device and the host processor. This feature is enabled by setting the CRC-EN bit.
The error checking scheme is based on the CRC-8-ATM (HEC) polynomial: x8 + x2 + x + 1 (that is, 100000111).
When error checking is enabled, the serial interface access cycle width is 32 bits. The normal 24-bit SPI data are
appended with an 8-bit CRC polynomial by the host processor before feeding the data to the device. In all serial
interface readback operations, the CRC polynomial is output on the SDO pin as part of the 32-bit cycle.
Table 8-4. Error Checking Serial Interface Access Cycle
BIT
FIELD
DESCRIPTION
Identifies the communication as a read or write command to the address
register.
R/W = 0 sets a write operation.
R/W = 1 sets a read operation.
31
RW
30
CRC-ERROR
A[5:0]
Reserved bit. Set to zero.
Register address. Specifies the register to be accessed during the read or
write operation.
29-24
Data cycle bits.
If a write command, the data cycle bits are the values to be written to the
register with address A[5:0].
If a read command, the data cycle bits are don't care values.
23-8
7-0
DI[15:0]
CRC
8-bit CRC polynomial.
The device decodes the 32-bit access cycle to compute the CRC remainder on SYNC rising edges. If no error
exists, the CRC remainder is zero and data are accepted by the device.
A write operation failing the CRC check causes the data to be ignored by the device. After the write command, a
second access cycle can be issued to determine the error checking results (CRC-ERROR bit) on the SDO pin.
If there is a CRC error, the CRC-ALM bit of the status register is set to 1. The FAULT pin can be configured to
monitor a CRC error by setting the CRCALM-EN bit.
Table 8-5. Write Operation Error Checking Cycle
BIT
31
FIELD
DESCRIPTION
Echo RW from previous access cycle (RW = 0).
Returns a 1 when a CRC error is detected; otherwise, returns a 0.
Echo address from previous access cycle.
Echo data from previous access cycle.
RW
30
CRC-ERROR
A[5:0]
29-24
23-8
7-0
DO[15:0]
CRC
Calculated CRC value of bits 31:8.
A read operation must be followed by a second access cycle to get the requested data on the SDO pin. The
error check result (CRC-ERROR bit) from the read command is output on the SDO pin.
As in the case of a write operation failing the CRC check, the CRC-ALM bit of the status register is set to 1, and
the ALMOUT pin, if configured for CRC alerts, is set low.
Table 8-6. Read Operation Error Checking Cycle
BIT
31
FIELD
DESCRIPTION
Echo RW from previous access cycle (RW = 1).
Returns a 1 when a CRC error is detected; otherwise, returns a 0.
Echo address from previous access cycle.
RW
30
CRC-ERROR
A[5:0]
29-24
23-8
7-0
DO[15:0]
CRC
Readback data requested on previous access cycle.
Calculated CRC value of bits 31:8.
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8.6 Register Map
Table 8-7 lists the memory-mapped registers for the device. All register addresses not listed should be considered as reserved locations and the register
contents should not be modified.
Table 8-7. Register Map
BIT DESCRIPTION
ADDR
(HEX)
RESET
(HEX)
REGISTER
TYPE
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
00
01
NOP
W
0000
NOP[15:0]
0A60(1)
or
DEVICEID
R
DEVICEID[13:0]
VERSIONID[1:0]
0920(2)
DAC-
BUSY
TEMP-
ALM
02
03
04
STATUS
R
0000
0AA4
4000
RESERVED
CRC-ALM
SDO-EN
TEMPALM- DACBUSY- CRCALM-
EN EN EN
DEV-
PWDWN
SPICONFIG
GENCONFIG
R/W
R/W
RESERVED
RESERVED
CRC-EN
RSVD
FSDO
RSVD
REF-
PWDWN
RSVD
RESERVED
DACD-
DACC-
DACB-
DACA-
05
06
BRDCONFIG
R/W
R/W
000F
0000
RESERVED
BRDCAST BRDCAST BRDCAST BRDCAST
-EN
-EN
-EN
-EN
DACD-
DACC-
DACB-
DACA-
SYNCCONFIG
RESERVED
SYNC-EN SYNC-EN SYNC-EN SYNC-EN
DACD-
PWDWN
DACC-
PWDWN
DACB-
PWDWN
DACA-
PWDWN
09
0A
0E
DACPWDWN
DACRANGE
TRIGGER
R/W
W
FFFF
0000
0000
RESERVED
DACD-RANGE[3:0]
RESERVED
DACC-RANGE[3:0]
DACB-RANGE[3:0]
RESERVED
DACA-RANGE[3:0]
SOFT-RESET[3:0]
ALM-
RESET
SOFT-
LDAC
R/W
SOFT-CLR
0F
10
11
12
13
BRDCAST
DACA
W
W
W
W
W
0000
0000
0000
0000
0000
BRDCAST-DATA[15:0]
DACA-DATA[15:0]
DACB-DATA[15:0]
DACC-DATA[15:0]
DACD-DATA[15:0]
DACB
DACC
DACD
(1) Reset code for DAC81404.
(2) Reset code for DAC61404.
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8.6.1 NOP Register (address = 00h) [reset = 0000h]
Return to Register Map.
Figure 8-5. NOP Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
NOP[15:0]
W-0000h
Table 8-8. NOP Register Field Descriptions
Bit
15-0
Field
NOP[15:0]
Type
Reset
Description
W
0000h
No operation. Write 0000h for proper no-operation command.
8.6.2 DEVICEID Register (address = 01h) [reset = 0A60h or 0920h]
Return to Register Map.
Figure 8-6. DEVICEID Register
15
7
14
6
13
5
12
11
10
2
9
1
8
0
DEVICEID[13:6]
R
4
3
DEVICEID[5:0]
R
VERSIONID[1:0]
R-0h
Table 8-9. DEVICEID Register Field Descriptions
Bit
Field
Type
Reset
0298h
0248h
0h
Description
15-2
DEVICEID[13:0]
R
DAC81404 device ID.
DAC61404 device ID.
Version ID. Subject to change.
1-0
VERSIONID[1:0]
R
8.6.3 STATUS Register (address = 02h) [reset = 0000h]
Return to Register Map.
Figure 8-7. STATUS Register
15
7
14
6
13
12
11
10
9
8
0
RESERVED
R-00h
5
4
3
2
1
RESERVED
R-00h
CRC-ALM
R-0h
DAC-BUSY
R-0h
TEMP-ALM
R-0h
Table 8-10. STATUS Register Field Descriptions
Bit
Field
Type
Reset
0000h
0h
Description
15-3
RESERVED
CRC-ALM
R
Reserved for factory use
CRC-ALM = 1 indicates a CRC error.
2
1
0
R
DAC-BUSY
TEMP-ALM
R
0h
DAC-BUSY = 1 indicates DAC registers are not ready for updates.
R
0h
TEMP-ALM = 1 indicates die temperature is over 140°C. A thermal
alarm event forces the DAC outputs to go into power-down mode.
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8.6.4 SPICONFIG Register (address = 03h) [reset = 0AA4h]
Return to Register Map.
Figure 8-8. SPICONFIG Register
15
14
13
5
12
11
10
9
CRCALM-EN
R/W-1h
1
8
RESERVED
R-0h
TEMPALM-EN DACBUSY-EN
RESERVED
R/W-1h
3
R/W-0h
2
R-0h
0
7
6
4
RESERVED
DEV-PWDWN
R/W-1h
CRC-EN
R/W-0h
RESERVED
R-0h
SDO-EN
R/W-1h
FSDO
RESERVED
R-0h
R-1h
R-0h
R/W-0h
Table 8-11. SPICONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
11
RESERVED
R
0h
Reserved for factory use
TEMPALM-EN
DACBUSY-EN
R/W
R/W
1h
When set to 1, a thermal alarm triggers the FAULT pin.
10
0h
When set to 1, the FAULT pin is set between DAC output updates.
Contrary to other alarm events, this alarm resets automatically.
9
CRCALM-EN
RESERVED
R/W
R
1h
2h
When set to 1, a CRC error triggers the FAULT pin..
Reserved for factory use
8-6
DEV-PWDWN = 1 sets the device in power-down mode.
DEV-PWDWN = 0 sets the device in active mode.
5
DEV-PWDWN
R/W
1h
4
3
2
1
CRC-EN
RESERVED
SDO-EN
FSDO
R/W
R
0h
0h
1h
0h
When set to 1, frame error checking is enabled.
Reserved for factory use
R/W
R/W
When set to 1, the SDO pin is operational.
Fast SDO bit (half-cycle speedup).
When 0, SDO updates on SCLK rising edges.
When 1, SDO updates on SCLK falling edges.
0
RESERVED
R
0h
Reserved for factory use
8.6.5 GENCONFIG Register (address = 04h) [reset = 4000h]
Return to Register Map.
Figure 8-9. GENCONFIG Register
15
RESERVED
R-0h
14
REF-PWDWN
R/W-1h
6
13
5
12
11
10
2
9
1
8
0
RESERVED
R-00h
7
4
3
RESERVED
R-00h
Table 8-12. GENCONFIG Register Field Descriptions
Bit
15
14
Field
RESERVED
Type
Reset
Description
R
0h
Reserved for factory use
REF-PWDWN
R/W
1h
REF-PWDWN = 1 powers down the internal reference.
REF-PWDWN = 0 activates the internal reference.
13-0
RESERVED
R
0000h
Reserved for factory use
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8.6.6 BRDCONFIG Register (address = 05h) [reset = 000Fh]
Return to Register Map.
Figure 8-10. BRDCONFIG Register
15
7
14
6
13
5
12
11
10
9
8
RESERVED
R-00h
4
3
2
1
0
RESERVED
R-0h
DACD-
DACC-
DACB-
DACA-
BRDCAST_EN BRDCAST-EN BRDCAST-EN BRDCAST-EN
R/W-1h R/W-1h R/W-1h R/W-1h
Table 8-13. BRDCONFIG Register Field Descriptions
Bit
Field
Type
Reset
000h
1h
Description
15-4
RESERVED
R
Reserved for factory use
3
2
1
0
DACD-BRDCAST-EN
DACC-BRDCAST-EN
DACB-BRDCAST-EN
DACA_BRDCAST-EN
R/W
R/W
R/W
R/W
When set to 1, the corresponding DAC is set to update the output to
the value set in the BDCAST register.
When cleared to 0, the corresponding DAC output remains
unaffected by a BRDCAST command.
1h
1h
1h
8.6.7 SYNCCONFIG Register (address = 06h) [reset = 0000h]
Return to Register Map.
Figure 8-11. SYNCCONFIG Register
15
7
14
6
13
5
12
11
10
2
9
1
8
0
RESERVED
R-00h
4
3
RESERVED
R-0h
DACD-SYNC-
EN
DACC-SYNC-
EN
DACB-SYNC-
EN
DACA-SYNC-
EN
R/W-0h
R/W-0h
R/W-0h
R/W-0h
Table 8-14. SYNCCONFIG Register Field Descriptions
Bit
Field
Type
Reset
000h
0h
Description
15-4
RESERVED
R
Reserved for factory use
3
2
1
0
DACD_SYNC_EN
DACC_SYNC_EN
DACB_SYNC_EN
DACA_SYNC_EN
R/W
R/W
R/W
R/W
When set to 1, the corresponding DAC is set to update in response
to an LDAC trigger (synchronous mode).
When cleared to 0, the corresponding DAC output is set to update
immediately on SYNC rising edge (asynchronous mode).
0h
0h
0h
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8.6.8 DACPWDWN Register (address = 09h) [reset = FFFFh]
Return to Register Map.
Figure 8-12. DACPWDWN Register
15
7
14
6
13
5
12
11
10
2
9
1
8
0
RESERVED
R-FFh
4
3
RESERVED
R-Fh
DACD-PWDWN DACC-PWDWN DACB-PWDWN DACA-PWDWN
R/W-1h R/W-1h R/W-1h R/W-1h
Table 8-15. DACPWDWN Register Field Descriptions
Bit
Field
Type
Reset
FFFh
1h
Description
15-4
RESERVED
R
Reserved for factory use
3
2
1
0
DACD-PWDWN
DACC-PWDWN
DACB-PWDWN
DACA-PWDWN
R/W
R/W
R/W
R/W
When set to 1, the corresponding DAC is in power-down mode, and
the output is connected to ground through a 10-kΩ internal resistor.
1h
1h
1h
8.6.9 DACRANGE Register (address = 0Ah) [reset = 0000h]
Return to Register Map.
Figure 8-13. DACRANGE Register
15
7
14
13
12
11
10
9
8
0
DACD-RANGE[3:0]
W-0h
DACC-RANGE[3:0]
W-0h
6
5
4
3
2
1
DACB-RANGE[3:0]
W-0h
DACA-RANGE[3:0]
W-0h
Table 8-16. DACRANGE Register Field Descriptions
Bit
Field
Type
Reset
Description
15-12
11-8
7-4
DACD-RANGE[3:0]
DACC-RANGE[3:0]
DACB-RANGE[3:0]
DACA-RANGE[3:0]
W
0h
Sets the output range for the corresponding DAC.
0000: 0 V to 5 V
1000: 0 V to 6 V
0001: 0 V to 10 V
1001: 0 V to 12 V
W
0h
W
0h
3-0
W
0h
0010: 0 V to 20 V
1010: 0 V to 24 V
0011: 0 V to 40 V
0101: –5 V to +5 V
1101: –6 V to +6 V
0110: –10 V to +10 V
1110: –12 V to +12 V
0111: –20 V to +20 V
All others: invalid
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8.6.10 TRIGGER Register (address = 0Eh) [reset = 0000h]
Return to Register Map.
Figure 8-14. TRIGGER Register
15
7
14
13
5
12
11
10
2
9
SOFT-CLR
W-0h
8
ALM-RESET
W-0h
RESERVED
W-00h
6
4
3
1
0
RESERVED
W-0h
SOFT-LDAC
W-0h
SOFT-RESET[3:0]
W-0h
Table 8-17. TRIGGER Register Field Descriptions
Bit
Field
Type
Reset
00h
0h
Description
15-10
RESERVED
SOFT-CLR
ALM-RESET
W
Reserved for factory use
9
8
W
Set this bit to 1 to clear all DAC outputs.
W
0h
Set this bit to 1 to clear an alarm event. Not applicable for a DAC-
BUSY alarm event.
7-5
4
RESERVED
SOFT-LDAC
W
W
0h
0h
Reserved for factory use
Set this bit to 1 to synchronously load the DACs that have been set
in synchronous mode in the SYNCCONFIG register.
3-0
SOFT_RESET[3:0]
W
0h
Set these bits to reserved code 1010 to reset the device to the
default state.
8.6.11 BRDCAST Register (address = 0Fh) [reset = 0000h]
Return to Register Map.
Figure 8-15. BRDCAST Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
BRDCAST-DATA[15:0]
W-0000h
Table 8-18. BRDCAST Register Field Descriptions
Bit
15-0
Field
Type
Reset
Description
BRDCAST_DATA[15:0]
W
0000h
Writing to the BRDCAST register forces the DAC channels that have
been set to broadcast in the BRDCONFIG register to update the data
register data to BRDCAST-DATA.
Data are MSB aligned in straight-binary format:
DAC81404: { DATA[15:0] }
DAC61404: { DATA[11:0], x, x, x, x }
x − Don't care bits
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8.6.12 DACn Register (address = 10h to 13h) [reset = 0000h]
Return to Register Map.
Figure 8-16. DACn Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
DACn-DATA[15:0]
W-0000h
Table 8-19. DACn Register Field Descriptions
Bit
15-0
Field
DACn-DATA[15:0]
Type
Reset
Description
W
0000h
Stores the data to be loaded to DACn in MSB-aligned, straight-binary
format:
DAC81404: { DATA[15:0] }
DAC61404: { DATA[11:0], x, x, x, x }
x − Don't care bits
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
A primary application of this device is programmable power supplies commonly used in automated test and
laboratory equipment, where high precision and programmable voltage ranges are important considerations.
This device, with an excellent linearity of ±1 LSB INL and inherently monotonic design, meets the criteria for
these applications. Apart from class-leading noise and drift performance, the per-channel programmable output
ranges make this device an excellent choice for a wide range of programmable power-supply designs.
9.2 Typical Application
Programmable power supplies are important building blocks in automated test equipments, semiconductor test
and bench top instrumentation units. The DAC is used to set the programmable voltage and a power stage is
designed to handle the output current requirements in these systems. Figure 9-1 shows a simplified diagram to
design such a programmable power supply unit.
VCC
R1
T1
AVDD
D1
VSENSE
OUTSENSE
SENSEP
DAC81404
RSENSE
Digital Control
OUTFORCE
FPGA
SPI
ISENSE
SENSEN
GNDFORCE
GNDSENSE
D2
T2
AVSS
ISENSE
GND
ADC
VSENSE
R2
VEE
Figure 9-1. Programmable Power Supply
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9.2.1 Design Requirements
•
•
Voltage range : ±10 V, ±20 V, 0 V to 40 V
Current range : 200 mA
9.2.2 Detailed Design Procedure
The DAC81404 is an excellent choice for this application because of the device exceptional linearity and noise
performance. The maximum bipolar output voltage requirement is ±20 V; therefore, set the AVDD and AVSS
supplies to 21 V and −21 V, respectively. For a unipolar output range, set the AVDD supply to 41 V for a full-scale
output voltage of 40 V. In unipolar designs, the AVSS supply can be tied to ground. In all cases, the supply
voltages must be selected so that the AVDD − AVSS voltage does not exceed 41.5 V.
The output stage is designed as a standard class AB output because of the design simplicity. A current limit
stage can be designed to limit the current in the output stage during a short-circuit event.
A simple diode-and-resistor-based biasing is chosen for the class AB output stage. A small constant current
flows through the series circuit of R1, D1, D2 and R2, producing symmetrical voltage drops on either side of the
input. With no input voltage applied, the point between the two diodes is 0 V. As current flows through the chain,
there is a forward-bias voltage drop of approximately 0.7 V across the diodes that are applied to the base-emitter
junctions of the switching transistors. Therefore, the voltage drop across the diodes biases the base of transistor
T1 to approximately 0.7 V, and the base of transistor T2 to approximately −0.7 V. Therefore, the two silicon
diodes provide a constant voltage drop of approximately 1.4 V between the two bases biasing them above cutoff.
Current and voltage is sensed and fed to an ADC to close the loop for the completion of the circuit. The device
has sense connections for sensing the output and load ground voltages. One of the key features of this device
is load-ground voltage compensation, which can be used in this design. The load ground and device ground
difference must be within ±12 V.
The R1 and R2 values are decided by how much quiescent current is required by the design biasing scheme.
Figure 9-2 and Figure 9-3 show simulation results of the output voltage programmed from −10 V to +10 V, while
providing a constant 100 mA current to the load.
9.2.3 Application Curves
Figure 9-2. DAC Code Sweep From −10 V to +10 V
Figure 9-3. Output Error vs DAC Code
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10 Power Supply Recommendations
The device requires four power-supply inputs: IOVDD, DVDD, AVDD, and AVSS. A 0.1-µF ceramic capacitor
must be connected close to each power-supply pin. In addition, a 4.7-µF or 10-µF bulk capacitor is
recommended for each power supply. Tantalum or aluminum types can be chosen for the bulk capacitors.
There is no sequencing requirement for the power supplies. The DAC output range is configurable; therefore,
sufficient power-supply headroom is required to achieve linearity at codes close to the power-supply rails. When
sourcing or sinking current from or to the DAC output, make sure to account for the effects of power dissipation
on the temperature of the device, and ensure the device does not exceed the maximum junction temperature.
11 Layout
11.1 Layout Guidelines
Printed circuit board (PCB) layout plays a significant role in achieving desired ac and dc performance from the
device. The device has a pinout that supports easy splitting of the noisy and quiet grounds. The digital and
analog signals are available on separate sides of the package for easy layout. Figure 11-1 shows an example
layout where the different ground planes have been clearly demarcated, as well as the best position for the
single-point shorts between the planes.
For best power-supply bypassing, place the bypass capacitors close to the respective power-supply pins.
Provide unbroken ground reference planes for the digital signal traces, especially for the SPI and LDAC signals.
The RST and FAULT signals are static lines; therefore these lines can lie on the analog side of the ground plane.
11.2 Layout Example
Figure 11-1. Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
•
Texas Instruments, BP-DAC81404EVM, BP-DAC61402EVM user's guide
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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29-May-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DAC61404RHBR
DAC61404RHBT
DAC81404RHBR
DAC81404RHBT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN
VQFN
VQFN
VQFN
RHB
RHB
RHB
RHB
32
32
32
32
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
D61404
NIPDAUAG
NIPDAUAG
NIPDAUAG
D61404
D81404
D81404
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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29-May-2021
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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30-May-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DAC61404RHBR
DAC61404RHBT
DAC81404RHBR
DAC81404RHBT
VQFN
VQFN
VQFN
VQFN
RHB
RHB
RHB
RHB
32
32
32
32
3000
250
330.0
180.0
330.0
180.0
12.4
12.5
12.4
12.5
5.25
5.25
5.25
5.25
5.25
5.25
5.25
5.25
1.1
1.1
1.1
1.1
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q2
Q2
Q2
Q2
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-May-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DAC61404RHBR
DAC61404RHBT
DAC81404RHBR
DAC81404RHBT
VQFN
VQFN
VQFN
VQFN
RHB
RHB
RHB
RHB
32
32
32
32
3000
250
338.0
205.0
338.0
205.0
355.0
200.0
355.0
200.0
50.0
33.0
50.0
33.0
3000
250
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHB 32
5 x 5, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224745/A
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PACKAGE OUTLINE
RHB0032E
VQFN - 1 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
5.1
4.9
B
A
PIN 1 INDEX AREA
(0.1)
5.1
4.9
SIDE WALL DETAIL
20.000
OPTIONAL METAL THICKNESS
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
2X 3.5
(0.2) TYP
3.45 0.1
9
EXPOSED
THERMAL PAD
16
28X 0.5
8
17
SEE SIDE WALL
DETAIL
2X
SYMM
33
3.5
0.3
0.2
32X
24
0.1
C A B
C
1
0.05
32
25
PIN 1 ID
(OPTIONAL)
SYMM
0.5
0.3
32X
4223442/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
RHB0032E
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
3.45)
SYMM
32
25
32X (0.6)
1
24
32X (0.25)
(1.475)
28X (0.5)
33
SYMM
(4.8)
(
0.2) TYP
VIA
8
17
(R0.05)
TYP
9
16
(1.475)
(4.8)
LAND PATTERN EXAMPLE
SCALE:18X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4223442/B 08/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RHB0032E
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X ( 1.49)
(0.845)
(R0.05) TYP
32
25
32X (0.6)
1
24
32X (0.25)
28X (0.5)
(0.845)
SYMM
33
(4.8)
17
8
METAL
TYP
16
9
SYMM
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 33:
75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4223442/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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相关型号：
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IC SERIAL INPUT LOADING, 0.38 us SETTLING TIME, 12-BIT DAC, CDIP16, CERDIP-16, Digital to Analog Converter
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