DAC8822QBDBT [TI]
16 位双并行接口高精度乘法 DAC | DBT | 38 | -40 to 125;
| 型号： | DAC8822QBDBT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16 位双并行接口高精度乘法 DAC | DBT | 38 | -40 to 125 光电二极管 转换器 |
| 文件： | 总27页 (文件大小：1087K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DAC8822
SBAS390A–DECEMBER 2006–REVISED MARCH 2007
16-Bit, Dual, Parallel Input, Multiplying
Digital-to-Analog Converter
FEATURES
DESCRIPTION
•
•
•
•
±0.5LSB DNL
The DAC8822 dual, multiplying digital-to-analog
converter (DAC) is designed to operate from a single
2.7V to 5.5V supply.
±1LSB INL
Low Noise: 12nV/√Hz
Low Power Operation:
IDD = 1µA per Channel at 2.7V
2mA Full-Scale Current, with VREF = 10V
Settling Time: 0.5µs
The applied external reference input voltage VREF
determines the full-scale output current. An internal
feedback resistor (RFB
)
provides temperature
•
•
•
•
•
•
•
•
•
•
•
•
•
tracking for the full-scale output when combined with
an external, current-to-voltage (I/V) precision
amplifier.
16-Bit Monotonic
4-Quadrant Multiplying Reference Inputs
Reference Bandwidth: 10MHz
Reference Input: ±18V
A RSTSEL pin allows system reset assertion (RS) to
force all registers to zero code when RSTSEL = '0',
or to midscale code when RSTSEL = '1'. Additionally,
an internal power-on reset forces all registers to zero
or midscale code at power-up, depending on the
state of the RSTSEL pin.
Reference Dynamics: –105 THD
Midscale or Zero Scale Reset
Analog Power Supply: +2.7V to +5.5V
TSSOP-38 Package
A
parallel
interface
offers
high-speed
communications. The DAC8822 is packaged in a
space-saving TSSOP-38 package and has an
industry-standard pinout. The device is specified
from –40°C to +125°C.
Industry-Standard Pin Configuration
Pin-Compatible with the 14-Bit DAC8805
Temperature Range: –40°C to +125°C
For
a 14-bit, pin-compatible version, see the
DAC8805.
APPLICATIONS
•
•
•
•
Automatic Test Equipment
Instrumentation
Digitally Controlled Calibration
Industrial Control PLCs
DGND
VDD
R1A RCOM
A
VREFA ROFS
A
RFBA
R1A
R2A
ROFSA
RFBA
D0
Input A
DAC A
Parallel
Bus
D15
DAC A
DAC B
IOUT
A
Register
Register
WR
A0
Interface
AGNDA
A1
Input B
DAC B
Register
Register
IOUTB
RS
LDAC
Control
Logic
AGNDB
R1B
R2B
ROFSB
RFBB
Power-On
Reset
RSTSEL
R1B
RCOMB
VREFB ROFS
B
RFBB
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
DAC8822
www.ti.com
SBAS390A–DECEMBER 2006–REVISED MARCH 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE-LEAD
(DESIGNATOR)
PACKAGE
MARKING
PRODUCT
TSSOP-38
(DBT)
DAC8822QB
±2
±1
±1
±1
–40°C to +125°C
–40°C to +125°C
DAC8822
DAC8822
TSSOP-38
(DBT)
DAC8822QC
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
DAC8822
–0.3 to +7
–0.3 to +VDD + 0.3
–0.3 to +VDD + 0.3
±25
UNIT
V
VDD to GND
Digital input voltage to GND
V (IOUT) to GND
V
V
REF, ROFS, RFB, R1, RCOM to AGND, DGND
Operating temperature range
Storage temperature range
Junction temperature range (TJ max)
Power dissipation
V
–40 to +125
–65 to +150
+150
°C
°C
°C
W
(TJ max – TA) / RθJA
53
Thermal impedance, RθJA
°C/W
V
Human Body Model (HBM)
ESD rating
4000
Charged Device Model (CDM)
500
V
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
ELECTRICAL CHARACTERISTICS
All specifications at TA = –40°C to +125°C, VDD = +2.7V to +5.5V, IOUT = virtual GND, GND = 0V, and VREF = 10V, unless otherwise noted.
DAC8822
PARAMETER
STATIC PERFORMANCE
CONDITIONS
MIN
TYP
MAX
UNITS
Resolution
16
Bits
LSB
LSB
LSB
nA
DAC8822QB
DAC8822QC
±2
±1
Relative accuracy
INL
Differential nonlinearity
Output leakage current
Output leakage current
DNL
±0.5
±1
Data = 0000h, TA = +25°C
Data = 0000h, Full temperature range
Unipolar, data = FFFFh
10
20
±4
nA
±1
±1
mV
Full-scale gain error
Bipolar, data = FFFFh
±4
mV
Full-scale temperature coefficient
Bipolar zero error
±1
±2
ppm/°C
mV
TA = +25°C
±1
±3
Full temperature range
±1
±3
mV
Power-supply rejection ratio
OUTPUT CHARACTERISTICS(1)
Output current
PSRR VDD = 5V ±10%
±0.2
±1.0
LSB/V
2
mA
pF
Output capacitance
Code dependent
50
REFERENCE INPUT
Reference voltage range
Input resistance (unipolar)
Input capacitance
VREF
RREF
–18
4
18
6
V
5
5
kΩ
pF
kΩ
kΩ
R1, R2
4
8
5
6
Feedback and offset resistance
LOGIC INPUTS AND OUTPUT(1)
ROFS, RFB
10
12
VIL VDD = +2.7V
VIL VDD = +5V
VIH VDD = +2.7V
VIH VDD = +5V
IIL
0.6
0.8
V
V
Input low voltage
Input high voltage
2.1
2.4
V
V
Input leakage current
Input capacitance
0.001
1
8
µA
pF
CIL
POWER REQUIREMENTS
Supply voltage
VDD
2.7
5.5
6
V
Normal operation, logic inputs = 0V
3
3
1
µA
µA
µA
Supply current
IDD VDD = +4.5V to +5.5V, VIH = VDD and VIL = GND
VDD = +2.7V to +3.6V, VIH = VDD and VIL = GND
6
3
AC CHARACTERISTICS(1)(2)
Output current settling time
Reference multiplying BW
DAC glitch impulse
To 0.0015% of full-scale,
data = 0000h to FFFFh to 0000h
tS
0.5
10
5
µs
BW – 3dB VREF = 5VPP, data = FFFFh, 2-quadrant mode
MHz
nV–s
VREF = 0V to 10V,
data = 7FFFh to 8000h to 7FFFh
Data = 0000h, VREF = 100kHz, ±10VPP
2-quadrant mode
,
Feedthrough error
Crosstalk error
VOUT/VREF
–70
–100
1
dB
dB
VOUTA/VREF
B
Data = 0000h, VREFB = 100mVRMS, f = 100kHz
LDAC = logic low, VREF = –10V to + 10V
Any code change
Digital feedthrough
nV–s
Total harmonic distortion
Output noise density
THD VREF = 6VRMS, data = FFFFh, f = 1kHz
eN f = 1kHz, BW = 1Hz, 2-quadrant mode
–105
12
dB
nV/√Hz
(1) Specified by design and characterization; not production tested.
(2) All ac characteristic tests are performed in a closed-loop system using a THS4011 I-to-V converter amplifier.
3
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
PIN ASSIGNMENTS
DBT PACKAGE
TSSOP-38
(TOP VIEW)
1
2
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
D1
D0
D2
D3
3
R
OFSA
RFB
R1A
D4
4
A
D5
5
D6
6
RCOM
VREF
IOUT
A
A
A
D7
7
D8
8
D9
9
AGNDA
DGND
D10
VDD
D11
D12
D13
D14
D15
RS
DAC8822
10
11
12
13
14
15
16
17
18
19
AGNDB
IOUT
VREF
RCOM
B
B
B
R1B
RFB
B
B
ROFS
RSTSEL
LDAC
A1
WR
A0
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
PIN ASSIGNMENTS (continued)
Table 1. TERMINAL FUNCTIONS
PIN #
NAME
DESCRIPTION
1, 2, 24-28,
30-38
D0-D15
Digital Input Data Bits D0 to D15. Signal level must be ≤ VDD +0.3V. D15 is MSB.
Bipolar Offset Resistor A. Accepts up to ±18V.
3
4
5
ROFS
RFB
A
In 2-quadrant mode, ROFSA ties to RFBA.
In 4-quadrant mode, ROFSA ties to R1A and the external reference.
A
Internal Matching Feedback Resistor A. Connects to the external op amp for I-V conversion.
4-Quadrant Resistor.
In 2-quadrant mode, R1A shorts to the VREFA pin.
In 4-quadrant mode, R1A ties to ROFSA and the reference input.
R1A
Center Tap Point of the Two 4-Quadrant Resistors, R1A and R2A.
In 2-quadrant mode, RCOMA shorts to the VREF pin.
6
RCOMA
In 4-quadrant mode, RCOMA ties to the inverting node of the reference amplifier.
DAC A Reference Input in 2-Quadrant Mode, R2 Terminal in 4-Quadrant Mode.
In 2-quadrant mode, VREFA is the reference input with constant input resistance versus code.
In 4-quadrant mode, VREFA is driven by the external reference amplifier.
7
8
VREFA
DAC A Current Output. Connects to the inverting terminal of external precision I-V op amp for voltage
output.
IOUT
A
9
AGNDA
DGND
DAC A Analog Ground.
Digital Ground.
10
11
AGNDB
DAC B Analog Ground.
DAC B Current Output. Connects to the inverting terminal of external precision I-V op amp for voltage
output.
12
IOUTB
DAC B Reference Input in 2-Quadrant Mode, R2 Terminal in 4-Quadrant Mode.
In 2-quadrant mode, VREFB is the reference input with constant input resistance versus code.
In 4-quadrant mode, VREFB is driven by the external reference amplifier.
13
VREF
B
Center Tap Point of the Two 4-Quadrant Resistors, R1B and R2B.
In 2-quadrant mode, RCOMB shorts to the VREF pin.
14
RCOMB
In 4-quadrant mode, RCOMB ties to the inverting node of the reference amplifier.
4-Quadrant Resistor.
15
16
17
R1B
In 2-quadrant mode, R1B shorts to the VREFB pin.
In 4-quadrant mode, R1B ties to ROFSB and the reference input.
RFB
B
Internal Matching Feedback Resistor B. Connects to external op amp for I-V conversion.
Bipolar Offset Resistor B. Accepts up to ±18V.
In 2-quadrant mode, ROFSB ties to RFBB.
ROFS
B
In 4-quadrant mode, ROFSB ties to R1B and the external reference.
Write Control Digital Input In, Active Low. WR enables input registers.
Signal level must be ≤ VDD + 0.3V.
18
WR
19
20
A0
A1
Address 0. Signal level must be ≤ VDD + 0.3V.
Address 1. Signal level must be ≤ VDD + 0.3V.
Digital Input Load DAC Control. Signal level must be ≤ VDD + 0.3V. See the Function of Control Inputs
table for details.
21
LDAC
Power-On Reset State.
RSTSEL = 0 corresponds to zero-scale reset.
RSTSEL = 1 corresponds to midscale reset.
The signal level must be ≤ VDD + 0.3V.
22
RSTSEL
Reset. Active low resets both input and DAC registers.
Resets to zero-scale if RSTSEL= 0, and to midscale if RSTSEL = 1.
Signal level must be equal to or less than VDD + 0.3 V.
23
29
RS
VDD
Positive Power Supply Input. The specified range of operation is 2.7V to 5.5V.
5
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
TIMING AND FUNCTIONAL INFORMATION
tWR
WR
A0/1
tAS
tAH
DATA
tDS
tDH
tLWD
LDAC
RS
tLDAC
tRST
Figure 1. Timing Diagram
TIMING CHARACTERISTICS
All specifications at TA = –40°C to +125°C, IOUT = virtual GND, GND = 0V, and VREF = 10V, unless otherwise noted
DAC8822
PARAMETER
Data to WR setup time
CONDITIONS
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
VDD = +5.0V
VDD = +2.7V
MIN
10
10
10
10
0
TYP
MAX
UNITS
ns
tDS
ns
ns
A0/1 to WR setup time
Data to WR hold time
A0/1 to WR hold time
WR pulse width
tAS
ns
ns
tDH
0
ns
0
ns
tAH
0
ns
10
10
10
10
10
10
0
ns
tWR
ns
ns
LDAC pulse width
RS pulse width
tLDAC
tRST
tLWD
ns
ns
ns
ns
WR to LDAC delay time
0
ns
6
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
Table 2. Address Decoder Pins
A1
0
A0
0
OUTPUT UPDATE
DAC A
0
1
None
1
0
DAC A and DAC B
DAC B
1
1
Table 3. Function of Control Inputs
CONTROL INPUTS
RS
WR
LDAC
REGISTER OPERATION
Asynchronous operation. Reset the input and DAC register to '0' when the RSTSEL pin is tied to DGND, and to
0
X
X
midscale when RSTSEL is tied to VDD
.
1
1
1
0
1
0
0
1
1
Load the input register with all 16 data bits.
Load the DAC register with the contents of the input register.
The input and DAC register are transparent.
LDAC and WR are tied together and programmed as a pulse. The 16 data bits are loaded into the input register on
the falling edge of the pulse and then loaded into the DAC register on the rising edge of the pulse.
1
1
1
0
No register operation.
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
TYPICAL CHARACTERISTICS: VDD = +5V
Channel A
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
0.8
TA = +25°C
TA = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 2.
Figure 3.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = -40°C
TA = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 4.
Figure 5.
LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = +125°C
TA = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 6.
Figure 7.
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Channel B
1.0
SBAS390A–DECEMBER 2006–REVISED MARCH 2007
TYPICAL CHARACTERISTICS: VDD = +5V (continued)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
TA = +25°C
TA = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 8.
Figure 9.
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = -40°C
TA = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 10.
Figure 11.
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = +125°C
TA = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 12.
Figure 13.
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
TYPICAL CHARACTERISTICS: VDD = +5V (continued)
MIDSCALE DAC GLITCH
MIDSCALE DAC GLITCH
VREF = +10V
VREF = +10V
Code: 7FFFh to 8000h
Code: 8000h to 7FFFh
LDAC Pulse
LDAC Pulse
Time (0.2ms/div)
Time (0.2ms/div)
Figure 14.
Figure 15.
FULL-SCALE ERROR
vs TEMPERATURE
BIPOLAR-ZERO ERROR
vs TEMPERATURE
3
2
4
3
DAC A
2
1
1
DAC A
0
0
-1
-2
-3
-4
-1
-2
-3
DAC B
DAC B
-50 -30 -10
10
30
50
70
90
110 130
-50 -30 -10
10
30
50
70
90
110 130
Temperature (°C)
Temperature (°C)
Figure 16.
Figure 17.
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
TYPICAL CHARACTERISTICS: VDD = +2.7V
Channel A
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
0.8
TA = +25°C
TA = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 18.
Figure 19.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = -40°C
TA = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 20.
Figure 21.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = +125°C
TA = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 22.
Figure 23.
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TYPICAL CHARACTERISTICS: VDD = +2.7V (continued)
Channel B
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
1.0
0.8
TA = +25°C
TA = +25°C
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
0
0
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 24.
Figure 25.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = -40°C
TA = -40°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 26.
Figure 27.
LINEARITY ERROR
vs DIGITAL INPUT CODE
LINEARITY ERROR
vs DIGITAL INPUT CODE
1.0
0.8
1.0
0.8
TA = +125°C
TA = +125°C
0.6
0.6
0.4
0.4
0.2
0.2
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
-0.2
-0.4
-0.6
-0.8
-1.0
8192 16384 24576 32768 40960 49152 57344 65535
Code
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 28.
Figure 29.
12
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TYPICAL CHARACTERISTICS: VDD = +2.7V (continued)
MIDSCALE DAC GLITCH
MIDSCALE DAC GLITCH
VREF = +10V
VREF = +10V
Code: 7FFFh to 8000h
Code: 8000h to 7FFFh
LDAC Pulse
LDAC Pulse
Time (0.2ms/div)
Time (0.2ms/div)
Figure 30.
Figure 31.
FULL-SCALE ERROR
vs TEMPERATURE
BIPOLAR-ZERO ERROR
vs TEMPERATURE
3
2
4
3
2
DAC A
1
1
DAC A
0
0
-1
-2
-3
-4
-1
-2
-3
DAC B
DAC B
-50 -30 -10
10
30
50
70
90
110 130
-50 -30 -10
10
30
50
70
90
110 130
Temperature (°C)
Temperature (°C)
Figure 32.
Figure 33.
13
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TYPICAL CHARACTERISTICS: VDD = +2.7V and +5V
SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
REFERENCE MULTIPLYING BANDWIDTH
UNIPOLAR MODE
180
160
140
120
100
80
6
0
0xFFFF
0x8000
0x4000
0x2000
0x1000
0x0800
0x0400
0x0200
0x0100
0x0080
0x0040
0x0020
0x0010
0x0008
0x0004
0x0002
0x0001
-6
-12
-18
-24
-30
-36
-42
-48
-54
-60
-66
-72
-78
-84
-90
-96
-102
-108
-114
VDD = +5.0V
60
40
VDD = +2.7V
20
0x0000
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Logic Input Voltage (V)
10
100
1k
10k
100k
1M
10M
100M
Bandwidth (Hz)
Figure 34.
Figure 35.
REFERENCE MULTIPLYING BANDWIDTH
BIPOLAR MODE
REFERENCE MULTIPLYING BANDWIDTH
BIPOLAR MODE
6
0
6
0
0xFFFF
0x0000
0x4000
0x6000
0x7000
0x7800
0x7C00
0x7E00
0x7F00
0x7F80
0x7FC0
0x7FE0
0x7FF0
0x7FF8
0x7FFC
0x7FFE
0x7FFF
0x8000
-6
0xC000
0xA000
0x9000
0x8800
0x8400
0x8200
0x8100
0x8080
0x8040
0x8020
0x8010
0x8008
0x8004
0x8002
0x8001
0x8000
-6
-12
-18
-24
-30
-36
-42
-48
-54
-60
-66
-72
-78
-84
-90
-96
-102
-108
-114
-12
-18
-24
-30
-36
-42
-48
-54
-60
-66
-72
-78
-84
-90
-96
-102
-108
-114
DAC 0V output
limited by bipolar
zero error to
DAC 0V output
limited by bipolar
zero error to
–96dB typical
(–76dB max).
–96dB typical
(–76dB max).
Codes from Midscale
to Positive Full-Scale
Codes from Negative
Full-Scale to Midscale
10
100
1k
10k
100k
1M
10M
100M
10
100
1k
10k
100k
1M
10M
100M
Bandwidth (Hz)
Bandwidth (Hz)
Figure 36.
Figure 37.
SUPPLY CURRENT vs TEMPERATURE
DAC SETTLING TIME
6
5
4
3
2
1
0
VDD = 5.0V
Unipolar Mode
Voltage Output Settling
VDD = 2.7V
Trigger Pulse
Time (0.5ms/div)
-50 -30 -10
10
30
50
70
90
110 130
Temperature (°C)
Figure 38.
Figure 39.
14
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
THEORY OF OPERATION
The DAC8822 is a multiplying, dual-channel, current output, 16-bit DAC. The architecture, illustrated in
Figure 40, is an R-2R ladder configuration with the three MSBs segmented. Each 2R leg of the ladder is either
switched to GND or to the IOUT terminal. The IOUT terminal of the DAC is held at a virtual GND potential by the
use of an external I/V converter op amp. The R-2R ladder is connected to an external reference input (VREF) that
determines the DAC full-scale output current. The R-2R ladder presents a code-independent load impedance to
the external reference of 5kΩ ± 25%. The external reference voltage can vary in a range of –18V to +18V, thus
providing bipolar IOUT current operation. By using an external I/V converter op amp and the RFB resistor in the
DAC8822, an output voltage range of –VREF to +VREF can be generated.
R
R
R
VREF
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
2R
RFB
IOUT
GND
Figure 40. Equivalent R-2R DAC Circuit
The DAC output voltage is determined by VREF and the digital data (D) according to Equation 1:
D
65536
VOUT AńB + *VREF
(1)
Each DAC code determines the 2R-leg switch position to either GND or IOUT. The external I/V converter op amp
noise gain will also change because the DAC output impedance (as seen looking into the IOUT terminal) changes
versus code. Because of this change in noise gain, the external I/V converter op amp must have a sufficiently
low offset voltage such that the amplifier offset is not modulated by the DAC IOUT terminal impedance change.
External op amps with large offset voltages can produce INL errors in the transfer function of the DAC8822
because of offset modulation versus DAC code. For best linearity performance of the DAC8822, an op amp
(such as the OPA277) is recommended, as shown in Figure 41. This circuit allows VREF to swing from –10V to
+10V.
VDD
U1
VDD ROFS RFB
+15V
U2
V+
OPA277
VREF
IOUTA/B
DAC8822
VOUT
V-
GND
-15V
Figure 41. Voltage Output Configuration
15
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
APPLICATION INFORMATION
DIGITAL INTERFACE
The parallel bus interface of the DAC8822 is comprised of a 16-bit data bus D0—D15, address lines A0 and A1,
and a WR control signal. Timing and control functionality are shown in Figure 1, and described in Table 2 and
Table 3. The address lines must be set up and stable before the WR signal goes low, to prevent loading
improper data to an undesired input register.
Both channels of the DAC8822 can be simultaneously updated by control of the LDAC signal, as shown in
Figure 1. Reset control (RS) and reset select control (RSTSEL) signals are provided to allow user reset ability to
either zero scale or midscale codes of both the input and DAC registers.
STABILITY CIRCUIT
For a current-to-voltage (I/V) design, as shown in Figure 42, the DAC8822 current output (IOUT) and the
connection with the inverting node of the op amp should be as short as possible and laid out according to
correct printed circuit board (PCB) layout design. For each code change, there is an output step function. If the
gain bandwidth product (GBP) of the op amp is limited and parasitic capacitance is excessive at the inverting
node, then gain peaking is possible. Therefore, a compensation capacitor C1 (4pF to 20pF, typ) can be added to
the design for circuit stability, as shown in Figure 42.
VDD
U1
VDD ROFS RFB
C1
U2
VREF
VREF
DAC8822
IOUTA/B
VOUT
OPA277
GND
Figure 42. Gain Peaking Prevention Circuit with Compensation Capacitor
16
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
APPLICATION INFORMATION (continued)
BIPOLAR OUTPUT CIRCUIT
The DAC8822, as a 4-quadrant multiplying DAC, can be used to generate a bipolar output. The polarity of the
full-scale output (IOUT) is the inverse of the input reference voltage at VREF
.
Using a dual op amp, such as the OPA2277, full 4-quadrant operation can be achieved with minimal
components. Figure 43 demonstrates a ±10VOUT circuit with a fixed +10V reference. The output voltage is
shown in Equation 2:
D
32768
+ ǒ
Ǔ
VOUT
*1 VREF
(2)
VREF
U1
OPA2277
VDD
DGND
R1A
RCOMA
ROFSA
R
FBA
VREFA
R1A
R2A
ROFSA
RFB
A
DAC8822
C1
D0
IOUT
A
U2
OPA2277
DAC A
Parallel
Bus
Interface
D15
Input A
Register
DAC A
Register
VOUT
WR
A0
AGNDA
A1
RS
LDAC
Control
Logic
RSTSEL
Figure 43. Bipolar Output Circuit for Channel A
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SBAS390A–DECEMBER 2006–REVISED MARCH 2007
APPLICATION INFORMATION (continued)
PROGRAMMABLE CURRENT SOURCE CIRCUIT
The DAC8822 can be integrated into the circuit in Figure 44 to implement an improved Howland current pump
for precise V/I conversions. Bidirectional current flow and high-voltage compliance are two features of the circuit.
With a matched resistor network, the load current of the circuit is shown by Equation 3:
(
)
R2)R3 ń R1
D
65536
ILAńB +
VREF
R3
(3)
The value of R3 in the previous equation can be reduced to increase the output current drive of U3. U3 can drive
±20mA in both directions with voltage compliance limited up to 15V by the U3 voltage supply. Elimination of the
circuit compensation capacitor (C1) in the circuit is not suggested as a result of the change in the output
impedance (ZO), according to Equation 4:
(
)
R1ȀR3 R1)R2
ZO +
(
)
(
)
R1 R2Ȁ)R3Ȁ * R1Ȁ R2)R3
(4)
As shown in Equation 4, ZO with matched resistors is infinite and the circuit is optimum for use as a current
source. However, if unmatched resistors are used, ZO is positive or negative with negative output impedance
being a potential cause of oscillation. Therefore, by incorporating C1 into the circuit, possible oscillation problems
are eliminated. The value of C1 can be determined for critical applications; for most applications, however, a
value of several pF is suggested.
R2´
15kW
C1
10pF
VDD
R1´
U3
R3´
150kW
50W
U1
VOUT
OPA2277
C2
VDD ROFS RFB
10pF
R3
U2
R1
R2
50W
150kW
15kW
VREF
VREF
DAC8822
IOUTA/B
IL
OPA2277
LOAD
GND
Figure 44. Programmable Bidirectional Current Source Circuit
CROSS-REFERENCE
The DAC8822 has an industry-standard pinout. Table 4 provides the cross-reference information.
Table 4. Cross-Reference
SPECIFIED
TEMPERATURE
RANGE
CROSS-
REFERENCE
PART
INL
DNL
PACKAGE
DESCRIPTION
PACKAGE
OPTION
PRODUCT
DAC8822QB
DAC8822QC
BIT
16
(LSB)
(LSB)
2
1
1
1
–40°C to +125°C
–40°C to +125°C
TSSOP-38
TSSOP-38
DBT
DBT
AD5547B
N/A
16
18
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DAC8822QBDBT
DAC8822QBDBTR
DAC8822QCDBT
DAC8822QCDBTG4
DAC8822QCDBTR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
DBT
DBT
DBT
DBT
DBT
38
38
38
38
38
50
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
DAC8822
2000 RoHS & Green
NIPDAU
NIPDAU
NIPDAU
NIPDAU
DAC8822
DAC8822
DAC8822
DAC8822
50
50
RoHS & Green
RoHS & Green
2000 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DAC8822QBDBTR
DAC8822QCDBTR
TSSOP
TSSOP
DBT
DBT
38
38
2000
2000
330.0
330.0
16.4
16.4
6.9
6.9
10.2
10.2
1.8
1.8
12.0
12.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DAC8822QBDBTR
DAC8822QCDBTR
TSSOP
TSSOP
DBT
DBT
38
38
2000
2000
350.0
350.0
350.0
350.0
43.0
43.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
DAC8822QBDBT
DAC8822QCDBT
DAC8822QCDBTG4
DBT
DBT
DBT
TSSOP
TSSOP
TSSOP
38
38
38
50
50
50
530
530
530
10.2
10.2
10.2
3600
3600
3600
3.5
3.5
3.5
Pack Materials-Page 3
PACKAGE OUTLINE
DBT0038A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SEATING
PLANE
6.55
6.25
TYP
C
A
0.1 C
PIN 1 INDEX AREA
38 X 0.5
38
1
2X
9
9.75
9.65
NOTE 3
19
B
20
0.23
38 X
0.17
4.45
1.2 MAX
0.1
C A B
4.35
NOTE 4
0.25
GAGE PLANE
0.15
0.05
(0.15) TYP
SEE DETAIL A
0.75
0.50
0 -8
A
20
DETAIL A
TYPICAL
4220221/A 05/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
DBT0038A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
38 X (1.5)
SYMM
(R0.05) TYP
38
1
38 X (0.3)
38 X (0.5)
SYMM
19
20
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220221/A 05/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBT0038A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
38 X (1.5)
SYMM
(R0.05) TYP
38
1
38 X (0.3)
38 X (0.5)
SYMM
19
20
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220221/A 05/2020
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
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500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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