DLP5532AFYSQ1 [TI]
Automotive 0.55-inch DLP® digital micromirror device for interior and transparent window displays | FYS | 149 | -40 to 105;型号: | DLP5532AFYSQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | Automotive 0.55-inch DLP® digital micromirror device for interior and transparent window displays | FYS | 149 | -40 to 105 |
文件: | 总38页 (文件大小:1881K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DLP5530S-Q1
ZHCSMN0 –JUNE 2021
DLP5532-Q1 适用于汽车显示的0.55 英寸130 万像素DMD
1 特性
3 说明
• 符合汽车应用要求
DLP5532-Q1 汽车 DMD 与 DLPC230-Q1 DMD 控制
器和TPS99000-Q1 系统管理和照明控制器结合使用,
能够在照射到特殊窗口薄膜表面时实现高性能汽车窗口
显示。2:1 宽高比支持非常宽的宽高比设计,130 万个
原生像素支持高分辨率内容。DLP5532-Q1 的光通量
是前代 DLP3030-Q1 汽车 DMD 的 3 倍以上,能够实
现更亮、更大的显示效果,从而实现更佳的观看体验。
该芯片组与 LED 和投影仪配合使用,可实现 125%
NTSC 的深度饱和色彩、超过 1,000 流明的超高亮度
以及大于100:1 的调光比。DLP5532-Q1 汽车DMD 微
镜阵列针对底部照明而配置,可实现更高效率和更紧凑
的光学引擎设计。S450 封装针对 DMD 阵列而言具有
低热阻的特点,可实现更高效的热解决方案。
– DMD 阵列工作温度范围-40°C 至105°C
• DLP5532-Q1 汽车芯片组包括:
– DLP5532-Q1 DMD
– DLPC230-Q1 DMD 控制器
– TPS99000-Q1 系统管理和照明控制器
• 0.55 英寸对角线微镜阵列
– 7.6 μm 微镜间距
– ±12° 微镜倾斜角(相对于平面)
– 底部照明,实现最优的效率和光学引擎尺寸
– 支持1152 × 576 输入分辨率
– 高达2304 x 1152 分辨率,外部基于GPU 的菱
形预处理
– 与LED 或激光照明兼容
• 600 MHz sub-LVDS DMD 接口,可实现低功耗和低
排放
为了帮助设计和制造基于 DLP 技术的符合汽车标准的
投影仪,可利用许多老牌光学模块制造商和设计公司来
支持您的设计。
• 温度极值下DMD 刷新率为10 kHz
• DMD 存储器单元的内置自检
• 图像性能针对窗口显示和其他内部显示进行了优化
器件信息
封装(1)
封装尺寸(标称值)
器件型号
DLP5532-Q1
FYS (149)
22.30mm × 32.20mm
2 应用
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
• 适用于车辆前窗、侧窗、后窗的窗口显示
• 室内天花板投影仪
Voltage
Monitor and
Enables
TPS99000-Q1
Power
Regulation
1.8V
1.1V
3.3V
6.5V
LED dimming
System
diagnostics
VOFFSET
SPI
DLPC230-Q1
SPI
VBIAS
DMD power
management
DLP5532-Q1
VRESET
Video
ARM®
Cortex®-R4F
SubLVDS
DMD video
processing &
control
TMP411
Temperature
Sensor
0.55" DMD
2:1 aspect ratio
1.3M pixels
I2C
LED
ENABLE
Video
memory
Flash
SPI
DLP5532-Q1 TI DLP® 芯片组系统方框图
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: DLPS208
DLP5530S-Q1
ZHCSMN0 –JUNE 2021
www.ti.com.cn
Table of Contents
7.4 System Optical Considerations.................................20
7.5 Micromirror Array Temperature Calculation.............. 21
7.6 Micromirror Landed-On/Landed-Off Duty Cycle....... 23
8 Application and Implementation..................................24
8.1 Application Information............................................. 24
8.2 Typical Application.................................................... 24
9 Power Supply Recommendations................................27
9.1 Power Supply Power-Up Procedure......................... 27
9.2 Power Supply Power-Down Procedure.....................27
9.3 Power Supply Sequencing Requirements................ 28
10 Layout...........................................................................29
10.1 Layout Guidelines................................................... 29
11 Device and Documentation Support..........................30
11.1 Device Support........................................................30
11.2 接收文档更新通知................................................... 30
11.3 支持资源..................................................................30
11.4 Trademarks............................................................. 30
11.5 静电放电警告...........................................................31
11.6 DMD Handling.........................................................31
11.7 术语表..................................................................... 31
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 8
6.1 Absolute Maximum Ratings ....................................... 8
6.2 Storage Conditions .................................................... 8
6.3 ESD Ratings .............................................................. 8
6.4 Recommended Operating Conditions ........................9
6.5 Thermal Information .................................................10
6.6 Electrical Characteristics ..........................................10
6.7 Timing Requirements ............................................... 11
6.8 Switching Characteristics .........................................14
6.9 System Mounting Interface Loads ........................... 15
6.10 Physical Characteristics of the Micromirror Array ..15
6.11 Micromirror Array Optical Characteristics .............. 17
6.12 Window Characteristics ......................................... 17
6.13 Chipset Component Usage Specification............... 17
7 Detailed Description......................................................18
7.1 Overview...................................................................18
7.2 Functional Block Diagram.........................................18
7.3 Feature Description...................................................19
Information.................................................................... 31
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
June 2021
*
Initial Release
Copyright © 2023 Texas Instruments Incorporated
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English Data Sheet: DLPS208
DLP5530S-Q1
ZHCSMN0 –JUNE 2021
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5 Pin Configuration and Functions
图5-1. FYS Package
149-Pin CPGA
Bottom View
Pin Functions - Connector Pins
PIN
TYPE
SIGNAL
DATA RATE
DESCRIPTION
NAME
NO.
DATA INPUTS
D_AN(0)
D_AN(1)
D_AN(2)
D_AN(3)
D_AN(4)
D_AN(5)
D_AN(6)
D_AN(7)
D_AP(0)
D_AP(1)
D_AP(2)
D_AP(3)
D_AP(4)
D_AP(5)
D_AP(6)
D_AP(7)
D_BN(0)
D_BN(1)
D_BN(2)
D_BN(3)
D_BN(4)
D_BN(5)
D_BN(6)
D_BN(7)
L2
K2
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
Data, Negative
J2
H2
F2
E2
D2
C2
L1
K1
J1
H1
F1
E1
D1
C1
K19
J19
H19
G19
E19
D19
C19
B19
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DLP5530S-Q1
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Pin Functions - Connector Pins (continued)
PIN
NAME
TYPE
SIGNAL
DATA RATE
DESCRIPTION
NO.
K20
J20
H20
G20
E20
D20
C20
B20
G2
D_BP(0)
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
SubLVDS
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Double
Single
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Data, Positive
Clock, Negative
Clock, Positive
Clock, Negative
Clock, Positive
D_BP(1)
D_BP(2)
D_BP(3)
D_BP(4)
D_BP(5)
D_BP(6)
D_BP(7)
DCLK_AN
DCLK_AP
DCLK_BN
DCLK_BP
LS_CLKN
LS_CLKP
LS_WDATAN
LS_WDATAP
CONTROL INPUTS
G1
F19
F20
R3
Clock for Low Speed Interface, Negative
Clock for Low Speed Interface, Positive
Write Data for Low Speed Interface, Negative
Write Data for Low Speed Interface, Positive
T3
Single
R2
Single
T2
Single
Asynchronous Reset Active Low. Logic High
Enables DMD.
DMD_DEN_ARSTZ
T10
I
LPSDR
LS_RDATA_A
LS_RDATA_B
T5
T6
O
O
LPSDR
LPSDR
Single
Single
Read Data for Low Speed Interface
Read Data for Low Speed Interface
TEMPERATURE SENSE DIODE
TEMP_N
TEMP_P
RESERVED PINS
VCCH
P1
N1
O
I
Calibrated temperature diode used to assist
accurate temperature measurements of DMD die.
A8
A9
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
VCCH
VCCH
A10
B8
Reserved Pin. Connect to Ground.
VCCH
VCCH
B9
VCCH
B10
A11
A12
A13
B11
B12
B13
VSSH
VSSH
VSSH
Reserved Pin. Connect to Ground.
VSSH
VSSH
VSSH
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English Data Sheet: DLPS208
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Pin Functions - Connector Pins (continued)
PIN
TYPE
SIGNAL
DATA RATE
DESCRIPTION
NAME
POWER
VBIAS
VBIAS
VOFFSET
VOFFSET
VOFFSET
VOFFSET
VOFFSET
VOFFSET
VRESET
VRESET
VDD
NO.
T7
T15
T9
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Power
Supply voltage for positive bias level at
micromirrors.
T13
A5
Supply voltage for High Voltage CMOS core
logic. Supply voltage for offset level at
micromirrors.
B5
A16
B16
T8
Supply voltage for negative reset level at
micromirrors.
T14
R4
VDD
R10
R11
R20
N2
VDD
VDD
VDD
VDD
M20
L3
VDD
Supply voltage for Low Voltage CMOS core logic;
for LPSDR inputs; for normal high level at
micromirror address electrodes.
VDD
K18
H3
VDD
VDD
G18
E3
VDD
VDD
D18
C3
VDD
VDD
A6
VDD
A18
T4
VDDI
VDDI
R1
VDDI
M3
L18
J3
VDDI
VDDI
Supply voltage for SubLVDS receivers.
VDDI
H18
F3
VDDI
VDDI
E18
B3
VDDI
VDDI
B18
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English Data Sheet: DLPS208
DLP5530S-Q1
ZHCSMN0 –JUNE 2021
www.ti.com.cn
Pin Functions - Connector Pins (continued)
PIN
NAME
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
TYPE
SIGNAL
DATA RATE
DESCRIPTION
NO.
T1
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
T16
T19
T20
R5
R6
R7
R8
R9
R13
R14
R15
P2
P3
P20
N19
N20
M1
M2
Common return. Ground for all power.
L19
L20
K3
J18
G3
F18
D3
C18
B2
B4
B15
B17
A3
A4
A7
A15
A17
A19
A20
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: DLPS208
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Pin Functions - Test Pads
NUMBER
T11
SYSTEM BOARD
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
T12
T17
T18
R12
R16
R17
R18
R19
P18
P19
N3
N18
M18
M19
B6
B7
B14
A14
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Product Folder Links: DLP5530S-Q1
English Data Sheet: DLPS208
DLP5530S-Q1
ZHCSMN0 –JUNE 2021
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
see (1)
MIN
NOM
MAX
UNIT
SUPPLY VOLTAGE
Supply voltage for LVCMOS core logic
VDD
2.3
V
–0.5
Supply voltage for LPSDR low speed interface
Supply voltage for SubLVDS receivers
Supply voltage for HVCMOS and micromirror electrode
Supply voltage for micromirror electrode
Supply voltage for micromirror electrode
Supply voltage delta (absolute value)
VDDI
2.3
8.75
17
V
V
V
V
V
V
V
–0.5
–0.5
–0.5
–11
VOFFSET
VBIAS
VRESET
0.5
0.3
| VDDI–VDD |
Supply voltage delta (absolute value)
8.75
28
| VBIAS–VOFFSET |
| VBIAS–VRESET |
INPUT VOLTAGE
Supply voltage delta (absolute value)
Input voltage for other inputs LPSDR
Input voltage for other inputs SubLVDS
INPUT PINS
VDD + 0.5
VDDI + 0.5
V
V
–0.5
–0.5
| VID
IID
|
SubLVDS input differential voltage (absolute value)
SubLVDS input differential current
810
10
mV
mA
TEMPERATURE DIODE
ITEMP_DIODE
Max current source into temperature diode
120
μA
ENVIRONMENTAL
ILLOVERFILL
37 mW/mm2
105 °C
Illumination overfill maximum heat load in area shown in 图6-1
TARRAY
Operating DMD array temperature
–40
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device is not implied at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure above or below the Recommended Operating Conditions for extended periods may
affect device reliability.
6.2 Storage Conditions
Applicable for the DMD as a component or non-operating in a system.
MIN
MAX
UNIT
Tstg
DMD storage temperature
125
°C
–40
6.3 ESD Ratings
VALUE
UNIT
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC Q100-011
±2000
±750
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: DLPS208
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6.4 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
NOM
MAX
UNIT
SUPPLY VOLTAGE RANGE
Supply voltage for LVCMOS core logic
Supply voltage for LPSDR low-speed interface
VDD
1.7
1.8
1.95
V
VDDI
Supply voltage for SubLVDS receivers
Supply voltage for HVCMOS and micromirror electrode
Supply voltage for mirror electrode
1.7
8.25
1.8
8.5
1.95
8.75
V
V
V
V
V
V
VOFFSET
VBIAS
15.5
16
16.5
VRESET
Supply voltage for micromirror electrode
Supply voltage delta (absolute value)
Supply voltage delta (absolute value)
–9.5
–10
–10.5
0.3
| VDDI–VDD |
| VBIAS–VOFFSET |
CLOCK FREQUENCY
ƒmax
8.75
Clock frequency for low speed interface LS_CLK
Clock frequency for high speed interface DCLK
Duty cycle distortion DCLK
120
600
MHz
MHz
ƒmax
44%
56%
SUBLVDS INTERFACE
| VID
VCM
|
SubLVDS input differential voltage (absolute value)(2)
Common mode voltage (2)
150
700
90
250
900
100
100
350
1100
110
mV
mV
Ω
ZLINE
Line differential impedance (PWB/trace)
Internal differential termination resistance(3)
ZIN
80
120
Ω
ENVIRONMENTAL
TARRAY
Operating DMD array temperature(5)
105
2
°C
–40
ILLUV
Illumination, wavelength < 395 nm (4)
mW/cm 2
ILLOVERFILL
28 mW/mm 2
Illumination overfill maximum heat load in area shown in 图6-1
(1) Recommended Operating Conditions are applicable after the DMD is installed in the final product.
(2) See 图6-6 and 图6-7
(3) See 图6-8
(4) The maximum operation conditions for operating temperature and UV illumination shall not be implemented simultaneously.
(5) Operating profile information for device micromirror landed duty-cycle and temperature may be provided if requested.
图6-1. Illumination Overfill Diagram
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6.5 Thermal Information
DLP5532-Q1
FYS (CPGA)
149 PINS
1.1
THERMAL METRIC
UNIT
Thermal resistance
Active area-to-test point 1 (TP1) (1)
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of
maintaining the package within the temperature range specified in 节6.4. The total heat load on the DMD is largely driven by the
incident light absorbed by the active area, although other contributions include light energy absorbed by the window aperture and
electrical power dissipation of the array. Optical systems should be designed to minimize the light energy falling outside the window
clear aperture since any additional thermal load in this area can significantly degrade the reliability of the device.
6.6 Electrical Characteristics
Over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CURRENT
IDD
Supply current: VDD(2)
Supply current: VDDI(2)
Supply current: VOFFSET
Supply current: VBIAS
Supply current: VRESET
VDD = 1.95 V
310
55
6
mA
mA
mA
mA
mA
IDDI
VDDI = 1.95 V
IOFFSET
IBIAS
VOFFSET = 8.75 V
VBIAS = 16.5 V
VRESET = -10.5 V
1
IRESET
-4.5
POWER
PDD
Supply power dissipation: VDD(2)
Supply power dissipation: VDDI(2)
Supply power dissipation: VOFFSET
Supply power dissipation: VBIAS
Supply power dissipation: VRESET
Supply power dissipation: Total
VDD = 1.95 V
604.5
107.25
52.5
mW
mW
mW
mW
mW
mW
PDDI
VDDI = 1.95 V
POFFSET
PBIAS
VOFFSET = 8.75 V
VBIAS = 16.5 V
VRESET = -10.5 V
16.5
PRESET
PTOTAL
LPSDR INPUT (3)
VIH(DC)
VIL(DC)
VIH(AC)
VIL(AC)
47.25
828
DC input high voltage
DC input low voltage
AC input high voltage
AC input low voltage
0.7 × VDD
–0.3
VDD + 0.3
0.3 × VDD
VDD + 0.3
0.2 × VDD
0.4 × VDD
V
V
0.8 × VDD
–0.3
V
V
0.1 × VDD
V
∆VT
IIL
Hysteresis (VT+ –VT–
)
See 图6-9
VDD = 1.95 V; VI = 0 V
VDD = 1.95 V; VI = 1.95 V
nA
nA
Low–level input current
–100
IIH
300
High–level input current
LPSDR OUTPUT (4)
VOH
DC output high voltage
IOH = -2mA
IOL = 2mA
0.8 × VDD
V
V
VOL
DC output low voltage
0.2 × VDD
CAPACITANCE
Input capacitance LPSDR
Input capacitance SubLVDS
Output capacitance
10
20
10
ƒ= 1 MHz
ƒ= 1 MHz
ƒ= 1 MHz
CIN
pF
COUT
pF
pF
pF
ƒ= 1 MHz (1152 X 144
micromirrors)
CRESET
CTEMP
Reset group capacitance
350
400
450
20
Temperature sense diode capacitance
ƒ= 1 MHz
(1) Device electrical characteristics are over Recommended Operating Conditions unless otherwise noted.
(2) Supply power dissipation based on non–compressed commands and data.
(3) LPSDR input specifications are for pin DMD_DEN_ARSTZ.
(4) LPSDR output specification is for pins LS_RDATA_A and LS_RDATA_B.
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6.7 Timing Requirements
Device electrical characteristics are over Recommended Operating Conditions unless otherwise noted
MIN
NOM
MAX
UNIT
LPSDR
tr
Rise slew rate (1)
(20% to 80%) × VDD
0.25
0.25
0.75
0.75
1.5
V/ns
V/ns
ns
tf
Fall slew rate (1)
(80% to 20%) × VDD
tW(H)
Pulse duration LS_CLK high(3)
Pulse duration LS_CLK low(3)
Setup time(3)
50% to 50% reference points
tW(L)
50% to 50% reference points
ns
tsu
ns
LS_WDATA valid before LS_CLK ↑or LS_CLK ↓
LS_WDATA valid after LS_CLK ↑or LS_CLK ↓
th
Hold time(3)
1.5
ns
SubLVDS
tr
Rise slew rate(2)
20% to 80% reference points
80% to 20% reference points
0.7
0.7
1
1
V/ns
V/ns
ns
tf
Fall slew rate(2)
tc
Cycle time DCLK(3)
Pulse duration DCLK high(3)
Pulse duration DCLK low(3)
Window time(3) (4)
1.61
0.75
0.75
0.3
1.67
tW(H)
tW(L)
tWINDOW
50% to 50% reference points
50% to 50% reference points
Setup time + Hold time
ns
ns
ns
tLVDS-ENABLE+REFGEN Power-up receiver(5)
2000
ns
(1) Specification is for DMD_DEN_ARSTZ pin. Refer to LPSDR input rise and fall slew rate in 图6-2
(2) See 图6-3
(3) See 图6-4
(4) See 图6-5
(5) Specification is for SubLVDS receiver time only and does not take into account commanding and latency after commanding.
图6-2. LPSDR Input Rise and Fall Slew Rate
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图6-3. SubLVDS Input Rise and Fall Slew Rate
图6-4. SubLVDS Switching Parameters
图6-5. High-Speed Training Scan Window
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图6-6. SubLVDS Voltage Parameters
图6-7. SubLVDS Waveform Parameters
DCLK_AP
DCLK_BP
D_AP(7:0)
D_BP(7:0)
ESD
Internal
Termination
DCLK_AN
DCLK_BN
D_AN(7:0)
D_BN(7:0)
SubLVDS
Receiver
ESD
图6-8. SubLVDS Equivalent Input Circuit
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图6-9. LPSDR Input Hysteresis
6.8 Switching Characteristics
Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ns
Output propagation, clock to Q, rising edge of LS_CLK
(differential clock signal) input to LS_RDATA output.(2)
tPD
CL = 45 pF
15
Slew rate, LS_RDATA
0.5
V/ns
Output duty cycle distortion, LS_RDATA_A and LS_RDATA_B
40%
60%
(1) Device electrical characteristics are over Recommended Operating Conditions unless otherwise noted.
(2) See 图6-10 and 图6-11
图6-10. LPSDR Read Out
图6-11. Test Load Circuit for Output Propagation Measurement
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6.9 System Mounting Interface Loads
PARAMETER
MIN
NOM
MAX
UNIT
Condition 1: Maximum load evenly distributed within each area (1)
Thermal Interface Area
110.8
111.3
N
Electrical Interface Area
Condition 2: Maximum load evenly distributed within each area (1)
Thermal Interface Area
0
N
Electrical Interface Area
222.1
(1) See 图6-12
图6-12. System Interface Loads
6.10 Physical Characteristics of the Micromirror Array
PARAMETER
VALUE
1152
1152
7.6
UNIT
M
N
Number of active columns(1)
micromirrors
Number of active rows(1)
micromirrors
Micromirror (pixel) pitch - diagonal(1)
Micromirror (pixel) pitch - horizontal and vertical(1)
Micromirror active array width
Micromirror active array height
Micromirror active border
µm
ε
P
10.8
µm
mm
(P × M) + (P / 2)
12.447
6.226
10
(P x N) / 2 + (P / 2)
mm
Pond of micromirrors (POM) (2)
micromirrors/side
(1) See 图6-13
(2) The structure and qualities of the border around the active array includes a band of partially functional micromirrors called the POM.
These micromirrors are structurally and/or electrically prevented from tilting toward the bright or ON state, but still require an electrical
bias to tilt toward OFF.
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图6-13. Micromirror Array Physical Characteristics
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6.11 Micromirror Array Optical Characteristics
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
degree
degree
Micromirror tilt angle
DMD landed state(1)
12
Micromirror tilt angle tolerance(2)
DMD efficiency(3)
1
–1
420 nm - 700 nm(4)
66%
Adjacent micromirrors
Non-adjacent micromirrors
0
micromirrors
micromirrors
Number of non-operational micromirrors(4)
10
(1) Measured relative to the plane formed by the overall micromirror array at 25°C.
(2) For some applications, it is critical to account for the micromirror tilt angle variation in the overall optical system design. With some
optical system designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field
reflected from the micromirror array. With some optical system designs, the micromirror tilt angle variation between devices may result
in colorimetry variations, system efficiency variations, or system contrast variations.
(3) DMD efficiency is measured photopically under the following conditions: 24° illumination angle, F/2.4 illumination and collection
apertures, uniform source spectrum (halogen), uniform pupil illumination, the optical system is telecentric at the DMD, and the
efficiency numbers are measured with 100% electronic micromirror landed duty-cycle and do not include system optical efficiency or
overfill loss. This number is measured under conditions described above and deviations from these specified conditions could result in
a different efficiency value in a different optical system. The factors that can influence the DMD efficiency related to system application
include: light source spectral distribution and diffraction efficiency at those wavelengths (especially with discrete light sources such as
LEDs or lasers), and illumination and collection apertures (F/#) and diffraction efficiency. The interaction of these system factors as well
as the DMD efficiency factors that are not system dependent are described in detail in DLPA083A
(4) A non-operational micromirror is defined as a micromirror that is unable to transition between the on-state and off-state positions.
6.12 Window Characteristics
PARAMETER
MIN
NOM
Corning Eagle XG
1.5119
MAX
UNIT
Window material designation
Window refractive index
Window aperture (1)
at wavelength 546.1 nm
See (1)
(1) See the mechanical package ICD for details regarding the size and location of the window aperture.
6.13 Chipset Component Usage Specification
The DLP5532-Q1 is a component of a chipset. Reliable function and operation of the DLP5532-Q1 requires that
it be used in conjunction with the TPS99000-Q1 and DLPC230-Q1, and includes components that contain or
implement TI DMD control technology. TI DMD control technology consists of the TI technology and devices
used for operating or controlling a DLP DMD.
备注
TI assumes no responsibility for image quality artifacts or DMD failures caused by optical system
operating conditions exceeding limits described previously.
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7 Detailed Description
7.1 Overview
The DLP5532-Q1 Automotive DMD consists of 1,327,104 highly reflective, digitally switchable, micrometer-sized
mirrors organized in a two-dimensional array. As shown in Figure 6-13, the micromirror array consists of 1152
micromirror columns × 1152 micromirror rows in a diamond pixel configuration with a 2:1 aspect ratio.
Around the perimeter of the 1152 × 1152 array of micromirrors is a uniform band of border micromirrors called
the Pond of Micromirrors (POM). The border micromirrors are not user-addressable. The border micromirrors
land in the –12° position once power has been applied to the device. There are 10 border micromirrors on each
side of the 1152 × 1152 active array.
Due to the diamond pixel configuration, the columns of each odd row are offset by half a pixel from the columns
of the even row. Each mirror is switchable between two discrete angular positions: –12° and +12°. The mirrors
are illuminated from the bottom which allows for compact and efficient system optical design.
Although the native resolution of the DLP5532-Q1 is 1152 × 1152, when paired with the DLPC230-Q1 controller,
the DLP5532-Q1 can be driven with different resolutions to utilize the 2:1 aspect ratio. Please see the DLPC230-
Q1 automotive DMD controller data sheet (DLPS054) for a list of supported resolutions. Diamond pixel arrays
also have the capability to increase display resolution beyond native resolution. Future controllers or video
formatters may take advantage of this enhanced resolution.
7.2 Functional Block Diagram
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7.3 Feature Description
The DLP5532-Q1 consists of a two-dimensional array of 1-bit CMOS memory cells driven by a sub-LVDS bus
from the DLPC230-Q1 and powered by the TPS99000-Q1. The temperature sensing diode is used to
continuously monitor the DMD array temperature.
To ensure reliable operation the DLP5532-Q1 must be used with the DLPC230-Q1 DMD display controller and
the TPS99000-Q1 system management and illumination controller.
7.3.1 Sub-LVDS Data Interface
The Sub-LVDS signaling protocol was designed to enable very fast DMD data refresh rates while simultaneously
maintaining low power and low emission.
Data is loaded into the SRAM under each micromirror using the sub-LVDS interface from the DLPC230-Q1. This
interface consists of 16 pairs of differential data signals plus two clock pairs into two separate buses A and B
loading the left and right half of the SRAM array. The data is latched on both transitions creating a double data
rate (DDR) interface. The sub-LVDS interface also implements a continuous training algorithm to optimize the
data and clock timing to allow for a more robust interface.
The entire DMD array of 1.3 million pixels can be updated at a rate of less than 100 µs as a result of the high
speed sub-LVDS interface.
7.3.2 Low Speed Interface for Control
The purpose of the low speed interface is to configure the DMD at power up and power down and to control the
micromirror reset voltage levels that are synchronized with the data loading. The micromirror reset voltage
controls the time when the mirrors are mechanically switched. The low speed differential interface includes 2
pairs of signals for write data and clock, and 2 single-ended signals for output (A and B).
7.3.3 DMD Voltage Supplies
The micromirrors require unique voltage levels to control the mechanical switching from –12° to +12°. These
voltage levels are nominally 16 V, 8.5 V, and –10 V (VBIAS, VOFFSET, and VRESET), and are generated by
the TPS99000-Q1.
7.3.4 Asynchronous Reset
Reset of the DMD is required and controlled by the DLPC230-Q1 via the signal DMD_DEN_ARSTZ.
7.3.5 Temperature Sensing Diode
The DMD includes a temperature sensing diode designed to be used with the TMP411 temperature monitoring
device. The DLPC230-Q1 monitors the temperature sense diode via the TMP411. The DLPC230-Q1 operation
of the DMD timing can be adjusted based on the DMD array temperature, therefore this connection is essential
to ensure reliable operation of the DMD.
图7-1 shows the typical connection between the DLPC230-Q1, TMP411, and the DMD.
56 ꢀ
TEMP_P
SCL
SCL
SCA
D+
SCA
100 pF
THERM1
THERM2
56 ꢀ
D-
TEMP_N
DLPC230-Q1
TMP411-Q1
GND
图7-1. Temperature Sense Diode Typical Circuit Configuration
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7.3.5.1 Temperature Sense Diode Theory
A temperature sensing diode is based on the fundamental current and temperature characteristics of a transistor.
The diode is formed by connecting the transistor base to the collector. Three different known currents flow
through the diode and the resulting diode voltage is measured in each case. The difference in their base–
emitter voltages is proportional to the absolute temperature of the transistor.
Refer to the TMP411-Q1 data sheet for detailed information about temperature diode theory and measurement.
图7-2 and 图7-3 illustrate the relationships between the current and voltage through the diode.
IE1
IE2
TEMP_N
+
VBE 1,2
-
TEMP_P
图7-2. Temperature Measurement Theory
100uA
10uA
1uA
Temperature (°C)
Temperature (°C)
图7-3. Example of Delta VBE Versus Temperature
7.4 System Optical Considerations
Optimizing system optical performance and image performance strongly relates to optical system design
parameter trades. Although it is not possible to anticipate every conceivable application, projector image and
optical performance is contingent on compliance to the optical system operating conditions described in the
following sections.
7.4.1 Numerical Aperture and Stray Light Control
The numerical aperture of the illumination and projection optics at the DMD optical area should be the same.
This cone angle defined by the numerical aperture should not exceed the nominal device mirror tilt angle unless
appropriate apertures are added in the illumination and/or projection pupils to block out flat-state and stray light
from the projection lens. The mirror tilt angle defines the DMD's capability to separate the "On" optical path from
any other light path, including undesirable flat-state specular reflections from the DMD window, DMD border
structures, or other system surfaces near the DMD such as prism or lens surfaces.
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7.4.2 Pupil Match
TI’s optical and image performance specifications assume that the exit pupil of the illumination optics is
nominally centered and located at the entrance pupil position of the projection optics. Misalignment of pupils
between the illumination and projection optics can degrade screen image uniformity and cause objectionable
artifacts in the display’s border and/or active area. These artifacts may require additional system apertures to
control, especially if the numerical aperture of the system exceeds the pixel tilt angle.
7.4.3 Illumination Overfill
Overfill light illuminating the area outside the active array can create artifacts from the mechanical features and
other surfaces that surround the active array. These artifacts may be visible in the projected image. The
illumination optical system should be designed to minimize light flux incident outside the active array and on the
window aperture. Depending on the particular system’s optical architecture and assembly tolerances, this
amount of overfill light on the area outside of the active array may still cause artifacts to be visible.
Illumination light and overfill can also induce undesirable thermal conditions on the DMD, especially if
illumination light impinges directly on the DMD window aperture or near the edge of the DMD window. Heat load
on the aperture in the areas shown in 图 6-1 should not exceed the values listed in Recommended Operating
Conditions. This area is a 0.5-mm wide area the length of the aperture opening. The values listed in
Recommended Operating Conditions assume a uniform distribution. For a non-uniform distribution please
contact TI for additional information.
备注
TI ASSUMES NO RESPONSIBILITY FOR IMAGE QUALITY ARTIFACTS OR DMD FAILURES
CAUSED BY OPTICAL SYSTEM OPERATING CONDITIONS EXCEEDING LIMITS DESCRIBED
PREVIOUSLY.
7.5 Micromirror Array Temperature Calculation
图7-4. DMD Thermal Test Points
The active array temperature can be computed analytically from measurement points on the outside of the
package, the package thermal resistance, the electrical power, and the illumination heat load.
Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in
图7-4) is provided by the following equations:
TARRAY = TCERAMIC + (QARRAY × RARRAY–TO–CERAMIC
QARRAY = QELECTRICAL + QILLUMINATION
)
(1)
(2)
where
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• TARRAY = computed DMD array temperature (°C)
• TCERAMIC = measured ceramic temperature, TP1 location in 图7-4 (°C)
• RARRAY–TO–CERAMIC = DMD package thermal resistance from array to thermal test point TP1 (°C/W), see
Thermal Information
• QARRAY = total power, electrical plus absorbed, on the DMD array (W)
• QELECTRICAL = nominal electrical power dissipation by the DMD (W)
• QILLUMINATION = (CL2W × SL)
• CL2W = conversion constant for screen lumens to power on the DMD (W/lm)
• SL = measured screen lumens (lm)
Electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating
frequencies.
Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and
the intensity of the light source.
Equations shown above are valid for a 1–chip DMD system with a total projection efficiency from DMD to the
screen of 87%.
The constant CL2W is based on the DMD array characteristics. It assumes a spectral efficiency of 300 lm/W for
the projected light and illumination distribution of 83.7% on the active array, and 16.3% on the array border.
The following is a sample calculation for a typical projection application:
1. SL = 50 lm
2. CL2W = 0.00293 W/lm
3. QELECTRICAL = 0.4 W (This number does not represent an actual DMD electrical power; for illustration
purposes only)
4. RARRAY–TO–CERAMIC = 1.1°C/W
5. TCERAMIC = 55°C
6. QARRAY = 0.4 W + (0.00293 W/lm × 50 lm) = 0.5465 W
7. TARRAY = 55°C + (0.5465 W × 1.1°C/W) = 55.6°C
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7.6 Micromirror Landed-On/Landed-Off Duty Cycle
7.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
The micromirror landed-on/landed-off duty cycle (landed duty cycle) denotes the amount of time (as a
percentage) that an individual micromirror is landed in the ON state versus the amount of time the same
micromirror is landed in the OFF state.
As an example, a landed duty cycle of 90/10 indicates that the referenced pixel is in the ON state 90% of the
time (and in the OFF state 10% of the time), whereas 10/90 would indicate that the pixel is in the OFF state 90%
of the time. Likewise, 50/50 indicates that the pixel is ON 50% of the time and OFF 50% of the time.
Note that when assessing landed duty cycle, the time spent switching from one state (ON or OFF) to the other
state (OFF or ON) is considered negligible and is thus ignored.
Since a micromirror can only be landed in one state or the other (ON or OFF), the two numbers (percentages)
always add to 100.
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8 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围,TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计,以确保系统功能。
8.1 Application Information
The DLP5532-Q1 chipset is designed to support projection-based automotive applications such as window
display systems.
8.2 Typical Application
The chipset consists of three components—the DLP5532-Q1 automotive DMD, the DLPC230-Q1, and the
TPS99000-Q1. The DMD is a light modulator consisting of tiny mirrors that are used to form and project images.
The DLPC230-Q1 is a controller for the DMD; it formats incoming video and controls the timing of the DMD
illumination sources and the DMD in order to display the incoming video. The TPS99000-Q1 is a controller for
the illumination sources (e.g. LEDs or lasers) and a management IC for the entire chipset. In conjunction, the
DLPC230-Q1 and the TPS99000-Q1 can also be used for system-level monitoring, diagnostics, and failure
detection features. Window Display System Block Diagram is a system level block diagram with these devices in
the window display configuration and shows the primary features and functions of each device.
VLED
6.5 V
Pre-
Regulator
6.5 V
1.1 V
1.8 V
3.3 V
Supplies for
DLPC230 and DMD
VBATT
Reg
3.3 V
LDO
(optional)
Power sequencing
and monitoring
High-side current
limiting
PROJ_ON
Optional SPI Monitor
12 bit
ADC
External ADC inputs for
general usage
LM3409
LED drive
AC3
ADC_CTRL(2)
SPI(4)
F
SPI_2
shunt(2)
E
T
s
RED
MPU
WD(2)
LED_SEL(4)
SEQ_START
S_EN
Ultra wide dimming
LED controller
GREEN
SPI_1
ECC
Low-side current
measurement
HOST_IRQ
OpenLDI
CTRL
TPS99000-Q1
D_EN
DLPC230-Q1
Illumination
Optics
Host
photo diode
External watchdogs /
over brightness / and
other monitors
COMPOUT
SEQ_CLK
Parallel
4
DATA
24
28
eSRAM
frame buffer
General
Purpose
PARKZ
RESETZ
INTZ
Photo diode
PD neg
meas. system
LDO
I2C(2)
SPI(4)
I2C_0
SPI_0
BIAS, RST, OFS
(3)
Spare
GPIO
GPIOx
GPIOx
I2C_1
Sys clock
monitor
DMD bias
regulator
VCC_FLASH
VCC_INTF
3.3 V
1.8 V
1.1 V
EEPROM
VIO
TMP411
(2)
DMD die temperature
VCORE
DLP5532-Q1
DMD
Sub-LVDS
Interface
sub-LVDS DATA
Control
图8-1. Window Display System Block Diagram
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8.2.1 Application Overview
图 8-1 shows the system block diagram for a DLP window display system. The system uses the DLPC230-Q1,
TPS99000-Q1, and the DLP5532-Q1 automotive DMD to enable a window display with high brightness, high
efficiency, and a high resolution. The combination of the DLPC230-Q1 and TPS99000-Q1 removes the need for
external SDRAM and a dedicated microprocessor. The chipset manages the illumination control of LED sources,
power sequencing functions, and system management functions. Additionally, the chipset supports numerous
system diagnostic and built-in self test (BIST) features. The following paragraphs describe the functionality of the
chipset used for a window system in more detail.
The DLPC230-Q1 is a controller for the DMD and the light sources in the DLP window display module. It
receives input video from the host and synchronizes DMD and light source timing in order to achieve the desired
video. The DLPC230-Q1 formats input video data that is displayed on the DMD. It synchronizes these video
segments with light source timing in order to create a video with grayscale shading and multiple colors, if
applicable.
The DLPC230-Q1 receives inputs from a host processor in the vehicle. The host provides commands and input
video data. Host commands can be sent using either the I2C bus or SPI bus. The bus that is not being used for
host commands can be used as a read-only bus for diagnostic purposes. Input video can be sent over an
OpenLDI bus or a parallel 24-bit bus. The 24-bit bus can be limited to only 8-bits or 16-bits of data for single light
source or dual light source systems depending on the system design. The SPI flash memory provides the
embedded software for the DLPC230-Q1’s ARM core and default settings. The TPS99000-Q1 provides
diagnostic and monitoring information to the DLPC230-Q1 using an SPI bus and several other control signals
such as PARKZ, INTZ, and RESETZ to manage power-up and power-down sequencing. The TMP411 uses an
I2C interface to provide the DMD array temperature to the DLPC230-Q1.
The outputs of the DLPC230-Q1 are configuration and monitoring commands to the TPS99000-Q1, timing
controls to the LED or laser driver, control and data signals to the DMD, and monitoring and diagnostics
information to the host processor. The DLPC230-Q1 communicates with the TPS99000-Q1 over an SPI bus. It
uses this to configure the TPS99000-Q1 and to read monitoring and diagnostics information from the TPS99000-
Q1. The DLPC230-Q1 sends drive enable signals to the LED or laser driver, and synchronizes this with the DMD
mirror timing. The control signals to the DMD are sent using a sub-LVDS interface.
The TPS99000-Q1 is a highly integrated mixed-signal IC that controls DMD power and provides monitoring and
diagnostics information for the DLP window display module. The power sequencing and monitoring blocks of the
TPS99000-Q1 properly power up the DMD and provide accurate DMD voltage rails (–16 V, 8.5 V, and 10 V),
and then monitor the system’s power rails during operation. The integration of these functions into one IC
significantly reduces design time and complexity. The TPS99000-Q1 also has several output signals that can be
used to control a variety of LED or laser driver topologies. The TPS99000-Q1 has several general-purpose
ADCs that designers can use for system level monitoring, such as over-brightness detection.
The TPS99000-Q1 receives inputs from the DLPC230-Q1, the power rails it monitors, the host processor, and
potentially several other ADC ports. The DLPC230-Q1 sends configuration and control commands to the
TPS99000-Q1 over an SPI bus and several other control signals. The DLPC230-Q1’s clocks are also
monitored by the watchdogs in the TPS99000-Q1 to detect any errors. The power rails are monitored by the
TPS99000-Q1 in order to detect power failures or glitches and request a proper power down of the DMD in case
of an error. The host processor can read diagnostics information from the TPS99000-Q1 using a dedicated SPI
bus, which enables independent monitoring. Additionally the host can request the image to be turned on or off
using a PROJ_ON signal. Lastly, the TPS99000-Q1 has several general-purpose ADCs that can be used to
implement system level monitoring functions.
The outputs of the TPS99000-Q1 are diagnostic information and error alerts to the DLPC230-Q1, and control
signals to the LED or laser driver. The TPS99000-Q1 can output diagnostic information to the host and the
DLPC230-Q1 over two SPI buses. In case of critical system errors, such as power loss, it outputs signals to the
DLPC230-Q1 that trigger power down or reset sequences. It also has output signals that can be used to
implement various LED or laser driver topologies.
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The DMD is a micro-electro-mechanical system (MEMS) device that receives electrical signals as an input (video
data), and produces a mechanical output (mirror position). The electrical interface to the DMD is a sub-LVDS
interface with the DLPC230-Q1. The mechanical output is the state of more than 1.3 million mirrors in the DMD
array that can be tilted ±12°. In a projection system the mirrors are used as pixels in order to display an image.
8.2.2 Reference Design
For information about connecting together the DLP5532-Q1 DMD, DLPC230-Q1 controller, and TPS99000-Q1 ,
please contact the TI Application Team for additional information about the DLP5532-Q1 evaluation module
(EVM). TI has optical-mechanical reference designs available, see the TI Application team for more information.
8.2.3 Application Mission Profile Consideration
Each application is anticipated to have different mission profiles, or number of operating hours at different
temperatures. To assist in evaluation the Application Report Reliability Lifetime Estimates for DLP3030-Q1 and
DLP553x-Q1 DMDs in Automotive Applications may be provided. See the TI Application team for more
information.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: DLPS208
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9 Power Supply Recommendations
The following power supplies are all required to operate the DMD: VDD, VDDI, VOFFSET, VBIAS, and VRESET.
All VSS connections are also required. DMD power-up and power-down sequencing is strictly controlled by the
TPS99000-Q1 device.
CAUTION
For reliable operation of the DMD, the following power supply sequencing requirements must be
followed. Failure to adhere to the prescribed power-up and power-down procedures may affect
device reliability.
VDD, VDDI, VOFFSET, VBIAS, and VRESET power supplies have to be coordinated during power-
up and power-down operations. Failure to meet any of the below requirements will result in a
significant reduction in the DMD’s reliability and lifetime. VSS must also be connected.
9.1 Power Supply Power-Up Procedure
• During power-up, VDD and VDDI must always start and settle before VOFFSET, VBIAS, and VRESET
voltages are applied to the DMD.
• During power-up, it is a strict requirement that the delta between VBIAS and VOFFSET must be within the
specified limit shown in the 节6.4.
• During power-up, the DMD’s LPSDR input pins shall not be driven high until after VDD and VDDI have
settled at operating voltage.
• During power-up, there is no requirement for the relative timing of VRESET with respect to VOFFSET and
VBIAS. Power supply slew rates during power-up are flexible, provided that the transient voltage levels follow
the requirements listed previously and in 图9-1.
9.2 Power Supply Power-Down Procedure
• The power-down sequence is the reverse order of the previous power-up sequence. VDD and VDDI must be
supplied until after VBIAS, VRESET, and VOFFSET are discharged to within 4 V of ground.
• During power-down, it is not mandatory to stop driving VBIAS prior to VOFFSET, but it is a strict requirement
that the delta between VBIAS and VOFFSET must be within the specified limit shown in the Recommended
Operating Conditions (Refer to Note 2 in 节9.3).
• During power-down, the DMD’s LPSDR input pins must be less than VDDI, the specified limit shown in the
Recommended Operating Conditions.
• During power-down, there is no requirement for the relative timing of VRESET with respect to VOFFSET and
VBIAS.
• Power supply slew rates during power-down are flexible, provided that the transient voltage levels follow the
requirements listed previously and in 节9.3.
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DLP5530S-Q1
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9.3 Power Supply Sequencing Requirements
A. To prevent excess current, the supply voltage delta |VBIAS –VOFFSET| must be less than specified in the Recommended Operating
Conditions. OEMs may find that the most reliable way to ensure this is to power VOFFSET prior to VBIAS during power-up and to
remove VBIAS prior to VOFFSET during power-down. Also, the TPS99000-Q1 is capable of managing the timing between VBIAS and
VOFFSET.
B. To prevent excess current, the supply voltage delta |VBIAS –VRESET| must be less than specified than the limit shown in the
Recommended Operating Conditions.
C. When system power is interrupted, the TPS99000-Q1 initiates hardware power-down that disables VBIAS, VRESET and VOFFSET
after the Micromirror Park Sequence.
D. Drawing is not to scale and details are omitted for clarity.
图9-1. Power Supply Sequencing Requirements (Power Up and Power Down)
Copyright © 2023 Texas Instruments Incorporated
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10 Layout
10.1 Layout Guidelines
Please refer to the DLPC230-Q1 and TPS99000-Q1 data sheets for specific PCB layout and routing guidelines.
For specific DMD PCB guidelines, use the following:
• Match lengths for the LS_WDATA and LS_CLK signals.
• Minimize vias, layer changes, and turns for the HS bus signals.
• Minimum of two 220-nF decoupling capacitors close to VBIAS.
• Minimum of two 220-nF decoupling capacitors close to VRESET.
• Minimum of two 220-nF decoupling capacitors close to VOFFSET.
• Minimum of four 100-nF decoupling capacitors close to VDDI and VDD.
• Temperature diode pins
The DMD has an internal diode (PN junction) that is intended to be used with an external TI TMP411
temperature sensing IC. PCB traces from the DMD’s temperature diode pins to the TMP411 are sensitive to
noise. Please see the TMP411 data sheet for specific routing recommendations.
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DLP5530S-Q1
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
DLP5532 A FYS Q1
Automotive
Package Type
Temperature Rating (-40°C to 105°C)
Device Descriptor
图11-1. Part Number Description
11.1.2 Device Markings
The device marking includes the legible character string GHJJJJK DLP5532AFYSQ1. GHJJJJK is the lot trace
code. DLP5532AFYSQ1 is the part number.
TI Internal Numbering
Part 2 of Serial Number
(7 Characters)
Part 1 of Serial Number
(7 Characters)
2-Dimension Matrix Code
DMD Part Number
(Part Number and Serial Number)
图11-2. DMD Marking
11.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
TI DLP® is a registered trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
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11.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.6 DMD Handling
The DMD is an optical device so precautions should be taken to avoid damaging the glass window. Please see
the application note DLPA019 DMD Handling for instructions on how to properly handle the DMD.
11.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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重要声明和免责声明
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没
有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务,TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DLP5532AFYSQ1
ACTIVE
CPGA
FYS
149
33
RoHS & Green
Call TI
N / A for Pkg Type
-40 to 105
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
DWG NO.
SH
8
5
3
6
1
7
4
1
2516726
REVISIONS
C
COPYRIGHT 2019 TEXAS INSTRUMENTS
UN-PUBLISHED, ALL RIGHTS RESERVED.
NOTES UNLESS OTHERWISE SPECIFIED:
REV
A
DESCRIPTION
ECO 2182382: INITIAL RELEASE
ECO 2182408: CHANGE APERTURE TOP EDGE SHAPE
ECO 2187769: CHG APER TOP EDGE SHAPE & LOCATION
DATE
BY
7/17/2019
7/26/2019
5/14/2020
BMH
BMH
BMH
1
2
3
SUBSTRATE EDGE PERPENDICULARITY TOLERANCE APPLIES TO ENTIRE SURFACE.
B
C
DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.
ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION
TOLERANCE AND HAS A MAXIMUM VALUE OF 0.8 DEGREES.
4
SUBSTRATE SYMBOLIZATION PAD AND PLATING AT BOTTOM OF DATUMS B AND C
HOLES TO BE ELECTRICALLY CONNECTED TO VSS PLANE WITHIN THE SUBSTRATE.
D
C
B
A
D
C
B
A
5
6
7
BOUNDARY MIRRORS SURROUNDING THE ACTIVE ARRAY.
MAXIMUM ENCAPSULANT PROFILE SHOWN.
ENCAPSULANT ALLOWED ON THE SURFACE OF THE CERAMIC IN THE AREA SHOWN
IN VIEW B (SHEET 2). ENCAPSULATION SHALL NOT EXCEED 0.2 THICKNESS MAXIMUM.
A
8
INDICATED CERAMIC SUBSTRATE FEATURES TO BE PLATED WITH 0.3 MICROMETERS
MINIMUM ELECTROLYTIC GOLD OVER 0.1 MICROMETER MINIMUM PALLADIUM OVER
1.27-8.89 MICROMETERS ELECTROLYTIC NICKEL PER ASTM B488-01, ASTM
B679-95(2009), AND AMS-QQ-N-290, RESPECTIVELY.
1
0.2E
SEE VIEW E (SHEET 3)
FOR WINDOW AND ACTIVE
ARRAY DIMENSIONS
9
NOTE THAT THE LOCATION OF THE ACTIVE ARRAY CENTER FOR THIS DMD IS THE SAME
AS THE AUTOMOTIVE DLP5530-Q1 AND DLP5531-Q1 DMD'S, BUT IS NOT CONSISTENT
WITH ALL OTHER SERIES 450 DMD'S.
E
3 0.5
(Ø2)
B
A
0.0750.15
3 0.5
A
A
22.30.22
13.0340.15
C
(1.5)
3.780.15
20.440.15
32.20.32
SUBSTRATE
6
INCIDENT
LIGHT
ENCAPSULANT
(0.36)
WINDOW
WINDOW APERTURE
3 PLACES
G
0.8 MAX
A
INDICATED
(SHEET 2)
1.1 0.05
1.41 0.077
0.0254A
2
2.925 0.24
1.050.1
0.02G
(0.31)
(0.75)
ACTIVE ARRAY
149X 1.4 0.1
DATE
DRAWN
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TEXAS
7/17/2019
B. HASKETT
ENGINEER
B. HASKETT
QA/CE
INSTRUMENTS
TOLERANCES:
Dallas Texas
7/17/2019
7/18/2019
7/18/2019
7/18/2019
7/17/2019
ANGLES 1
TITLE
(Ø0.305)
ICD, MECHANICAL, DMD
.55 2:1 1.3MP SERIES 450 -A1
(FYS PACKAGE)
2 PLACE DECIMALS 0.25
1 PLACE DECIMALS 0.50
DIMENSIONAL LIMITS APPLY BEFORE PROCESSES
INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME
Y14.5M-1994
SECTION A-A
P. KONRAD
CM
SCALE 20 : 1
M. LOPEZ
THIRD ANGLE
PROJECTION
DWG NO
REV
SIZE
D
NONE
NEXT ASSY
0314DA
USED ON
REMOVE ALL BURRS AND SHARP EDGES
PARENTHETICAL INFORMATION FOR REFERENCE ONLY
J. McKINLEY
APPROVED
B. RAY
2516726
C
SCALE
SHEET
OF
APPLICATION
4:1
1
4
INV2013-DLPa
5
3
6
1
2
7
8
4
DWG NO.
SH
8
5
3
6
1
7
4
2516726
2
D
D
C
B
A
D
C
B
A
0.5 MIN
(Ø2)
B
A
F
1.840.13
280.28
(DATUM B TO CENTER OF DATUM C SLOT)
25.7 MAX
2.1 0.15
2.3 MIN
A2
ENCAPSULANT ALLOWED
ON CERAMIC AREA
A
7
E
2±0.05
B
SECTION C-C
DATUM B
SCALE 16 : 1
5.150.15
2.9
C
C
6
23.2° 1°
120.12
14.9
0.5 MIN
A1
(1.5)
C
3X 4
D
1.840.13
C
D
1.5 0.05
0.750.025
1 0.1
WINDOW
SECTION D-D
DATUM C
0.5 0.05
A3
(VIEW ROTATED FOR CLARITY)
SCALE 16 : 1
2X 28
(DATUM B TO A2 AND A3)
VIEW B
DATUMS AND ENCAPSULANT ALLOWABLE AREA
SCALE 10 : 1
DWG NO
REV
SIZE
DRAWN
DATE
7/17/2019
TEXAS
2516726
B. HASKETT
C
4
D
INSTRUMENTS
Dallas Texas
SCALE
SHEET
OF
2
INV2013-DLPa
5
3
6
1
2
7
8
4
DWG NO.
SH
8
5
3
6
1
7
4
2516726
3
D
C
B
A
D
C
B
A
3
9
(2.1)
(12.447)
ACTIVE ARRAY
7.7760.076
4X (0.108)
5
(Ø2)
B
(5.15)
3
9
1.0870.05
0.3160.0885
2.8870.076
(7.022)
2
(9.359)
WINDOW
(6.2262)
ACTIVE ARRAY
WINDOW
APERTURE
6.7060.0885
8.2720.05
C
(1.5)
0.604 0.0885
1.2390.05
13.0510.0885
(13.655)
WINDOW APERTURE
13.6860.05
(14.925)
WINDOW
VIEW E
ACTIVE ARRAY AND WINDOW
SCALE 12 : 1
DWG NO
REV
SIZE
DRAWN
DATE
7/17/2019
TEXAS
2516726
B. HASKETT
C
4
D
INSTRUMENTS
Dallas Texas
SCALE
SHEET
OF
3
INV2013-DLPa
5
3
6
1
2
7
8
4
DWG NO.
SH
8
5
3
6
1
7
4
4
2516726
D
C
B
A
D
C
B
A
F
19.145
9 X 1.27 = 11.43
9 X 1.27 = 11.43
1.625
(A1, A2, & B1 OMITTED)
1.625
E
A
D
A
3.8950.25
B
C
D
E
F
G
H
J
14.510.25
15 X 1.27 = 19.05
K
L
M
N
P
R
T
G
8
SYMBOLIZATION
PAD
+
-
0.05
8.5 0.25
11.85 0.25
149X 0.305
0.5DEF
PINS
0.025
8
4
8
0.25D
VIEW F
PINS AND SYMBOLIZATION PAD
SCALE 8 : 1
0.28 MAX
(BRAZE AREA)
Ø0.85 MAX
(BRAZE AREA)
(R0.05)
(Ø0.305)
(1.4)
DETAIL G
PIN AND BRAZE DIMENSIONS
149 PLACES
SCALE 40 : 1
DWG NO
REV
SIZE
DRAWN
DATE
7/17/2019
TEXAS
2516726
B. HASKETT
C
4
D
INSTRUMENTS
Dallas Texas
SCALE
SHEET
OF
4
INV2013-DLPa
5
3
6
1
2
7
8
4
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
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