DRV3255-Q1 [TI]
具有 4.5A 栅极驱动峰值灌电流的集成式三相 48V 汽车栅极驱动器单元 (GDU);
| 型号： | DRV3255-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 4.5A 栅极驱动峰值灌电流的集成式三相 48V 汽车栅极驱动器单元 (GDU) 栅极驱动 驱动器 |
| 文件： | 总17页 (文件大小：1955K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DRV3255-Q1
ZHCSN55A –JULY 2022 –REVISED AUGUST 2022
DRV3255-Q1 具有高级保护和诊断功能的集成式三相48V 汽车栅极驱动器单元
(GDU)
1 特性
3 说明
• 符合面向汽车应用的AEC-Q100 标准：
DRV3255-Q1 器件为适用于 48V 汽车电机驱动应用的
高度集成三相栅极驱动器。该器件专门设计用于通过提
供 3.5A 峰值拉电流和 4.5A 峰值灌电流（栅极驱动）
以及 90V MOSFET 瞬态过压支持来为大功率电机驱动
应用提供支持。使用高效的自举架构可充分降低栅极驱
动器的功率损耗和自发热。电荷泵使栅极驱动器能够支
持100% PWM 占空比控制。
– 器件环境温度等级0：–40°C 至+150°C
– 器件HBM ESD 分类等级2
– 器件CDM ESD 分类等级C4B
• 以符合功能安全标准为目标
– 专为功能安全应用开发
– 在发布量产版本时将会提供有助于进行ISO
26262 系统设计的文档
– 系统可满足ASIL D 等级要求
• 3 个N 沟道半桥栅极驱动器
广泛的诊断、监测和保护功能可支持稳健的电机驱动系
统设计。该器件集成了高度可配置的主动短路 (ASC)
功能，支持实施所选的外部 MOSFET，从而快速响应
系统故障并免除对外部元件的需求。
– 3.5A/4.5A 最大峰值栅极驱动电流
– 针对48V 应用进行优化的电源架构
– 12V/48V 双电源架构
– 直流链路电源(DHCP) 的瞬态绝对最大额定值为
95V
封装信息
器件型号(1)
封装尺寸（标称值）
封装
10.00mm ×
10.00mm
DRV3255-Q1
HTQFP (64)
– 可支持90V MOSFET 工作电压范围的105V 自
举电压
(1) 请参阅数据表末尾的可订购产品附录。
– 自举电荷泵可支持100% 占空比
• 集成可配置主动短路(ASC) 功能
48 V
( 20 to 90 V)
12 V
– 低侧和高侧ASC 支持
– 提供器件引脚控制
– 故障处理能力
DRVOFF
DRV3255-Q1
nASCIN
Three-Phase
Gate Driver
Gate Drive
nSLEEP
PWM
M
• 具有CRC 功能的串行外设接口(SPI)
• 支持3.3V 和5V 逻辑输入
• 高级保护功能
3.5A/4.5A
SPI
HS/LS ASC
Protection
Phase Comp
– 电池电压监测器
nFAULT
– MOSFET VDS 过流监测器
– MOSFET VGS 栅极故障监测器
– 模拟内置自检
图3-1. 简化原理图
– 内部稳压器和时钟监测器
– 器件热警告和热关断
– 故障状态指示器引脚
2 应用
• 汽车类48V 轻混合动力电机驱动
– 带式和集成式起动发电机和电动发电机
– 电动助力转向
– eTurbo 和eBooster
– HVAC 压缩机和风扇
– 变速器控制和驱动
– 油泵、变速器和水泵
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSG27
DRV3255-Q1
ZHCSN55A –JULY 2022 –REVISED AUGUST 2022
www.ti.com.cn
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (February 2021) to Revision A (August 2022)
Page
• 更新了DRV3255-Q1 的器件状态........................................................................................................................1
Copyright © 2022 Texas Instruments Incorporated
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5 Device and Documentation Support
5.1 Device Support
5.1.1 Device Nomenclature
Device Nomenclature shows a legend for reading the complete orderable device name for the DRV3256-Q1
device
5.2 Documentation Support
For related documentation see the following:
• Texas Instruments, How to Build a Small, Functionally Safe 48-V, 30-kW MHEV Motor-Drive System White
paper
• Texas Instruments, How to optimize a motor-driver design for 48-V starter generators Technical article
• Texas Instruments, System Design Considerations for High-Power Motor Driver Applications Application note
• Texas Instruments, Driving parallel MOSFETs using the DRV3255-Q1 Application brief
• Texas Instruments, A basic brushless gate driver design –part 3: integrated vs. discrete half bridges
Technical article
• Texas Instruments,PowerPAD™ Thermally Enhanced Package application report
• Texas Instruments,PowerPAD™ Made Easy application report
• Texas Instruments,Sensored 3-Phase BLDC Motor Control Using MSP430 application report
5.2.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
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ZHCSN55A –JULY 2022 –REVISED AUGUST 2022
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6.1 Package Option Addendum
Packaging Information
Orderable
Device
Package
Drawing
Lead/Ball
Finish
MSL Peak
Temp
Device
Marking
Status
Package Type
Pins
Package Qty
Eco Plan
Op Temp (°C)
DRV3255EPAP ACTIVE
RQ1
HTQFP
PAP
64
1000
RoHS & Green NIPDAU
Level 3-260C-1 -40 to 150
68 HR
DRV3255
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI
has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2022 Texas Instruments Incorporated
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6.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
P1
K0
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
DRV3255EPAPRQ1
HTQFP
PAP
64
1000
330.0
24.4
13.0
13.0
1.5
16.0
24.0
DRV3255
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
PAP 64
SPQ
Length (mm) Width (mm)
10.0 10.0
Height (mm)
DRV3255EPAPRQ1
HTQFP
1000
1.0
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PACKAGE OUTLINE
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PAP0064N
10.2
9.8
B
PIN 1 ID
A
64
49
48
1
10.2
9.8
12.2
11.8
33
16
17
32
0.27
0.17
64X
60X 0.5
0.08
C
A
B
4X 7.5
1.2
1
SEE DETAIL A
C
SEATING PLANE
0.09- 0.20
TYP
0.08
C
(0.11) TYP
NOTE 5
0° MIN
0.25
(1)
GAGE PLANE
5.30
4.06
0.15
0.05
0°- 7°
0.75
0.45
(0.11) TYP
NOTE 5
EXPOSED
THERMAL PAD
4225982/B 07/2021
PowerPAD is a trademark of Texas Instruments
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15
per side.
4. Body width does not include interlead flash. Interlead flash shall not exceed 0.50 per side.
5. Strap features may not be present.
6. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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ZHCSN55A –JULY 2022 –REVISED AUGUST 2022
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EXAMPLE BOARD LAYOUT
HTQFP - 1.2 mm max height
PAP0064N
PLASTIC QUAD FLATPACK
(
8) NOTE 9
SYMM
(
5.3)
SOLDER MASK
OPENING
64
49
SOLDER MASK
DEFINED PAD
64X (1.5)
1
48
64X (0.3)
(0.65)
TYP
SYMM
(11.4)
60X (0.5)
(1.3)
TYP
33
16
(Ø 0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
17
32
(1.3) TYP
SEE DETAIL
(0.65) TYP
(11.4)
LAND PATTERN EXAMPLE
SCALE: 8X
0.05 MAX
ALL AROUND
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
4225982/B 07/2021
NOTES: (continued)
7. Publication IPC-7351 may have alternate designs.
8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
9. This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, PowerPAD Thermally Enhanced
Package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
www.ti.com
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EXAMPLE STENCIL DESIGN
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PAP0064N
(
5.3)
BASED ON
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
0.1 THICK STENCIL
THICKNESSES
49
64
64X (1.5)
1
48
64X (0.3)
SYMM
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
SYMM
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED COVERAGE BY AREA
SCALE: 8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
5.3X5.3 (SHOWN)
4.44 X 4.44
0.1
0.127
0.152
0.178
4.06 X 4.06
3.75 X 3.75
4225982/B 07/2021
NOTES: (continued)
9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
10. Board assembly site may have different recommendations for stencil design.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Feb-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV3255EPAPRQ1
ACTIVE
HTQFP
PAP
64
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 150
DRV3255
Q1
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Sep-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV3255EPAPRQ1
HTQFP
PAP
64
1000
330.0
24.4
13.0
13.0
1.5
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Sep-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTQFP PAP 64
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 55.0
DRV3255EPAPRQ1
1000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PAP 64
10 x 10, 0.5 mm pitch
HTQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
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PACKAGE OUTLINE
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PAP0064N
10.2
9.8
B
PIN 1 ID
A
64
49
48
1
10.2
9.8
12.2
11.8
33
16
17
32
0.27
0.17
64X
60X 0.5
0.08
C A
B
4X 7.5
1.2
1
SEE DETAIL A
C
SEATING PLANE
0.08 C
0.09- 0.20
TYP
(0.11) TYP
NOTE 5
0° MIN
0.25
(1)
GAGE PLANE
5.30
4.06
0.15
0.05
0°- 7°
0.75
0.45
(0.11) TYP
NOTE 5
EXPOSED
THERMAL PAD
4225982/B 07/2021
NOTES:
PowerPAD is a trademark of Texas Instruments
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15
per side.
4. Body width does not include interlead flash. Interlead flash shall not exceed 0.50 per side.
5. Strap features may not be present.
6. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PAP0064N
(
8) NOTE 9
SYMM
(
5.3)
SOLDER MASK
OPENING
64
49
SOLDER MASK
DEFINED PAD
64X (1.5)
1
48
64X (0.3)
(0.65)
TYP
SYMM
(11.4)
60X (0.5)
(1.3)
TYP
33
16
(Ø 0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
17
32
SEE DETAIL
(0.65) TYP
(1.3) TYP
(11.4)
LAND PATTERN EXAMPLE
0.05 MAX
ALL AROUND
SCALE: 8X
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
4225982/B 07/2021
NOTES: (continued)
7. Publication IPC-7351 may have alternate designs.
8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
9. This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, PowerPAD Thermally Enhanced
Package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
www.ti.com
EXAMPLE STENCIL DESIGN
HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
PAP0064N
(
5.3)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
BASED ON
0.1 THICK STENCIL
THICKNESSES
64
49
64X (1.5)
1
48
64X (0.3)
SYMM
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
SYMM
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED COVERAGE BY AREA
SCALE: 8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
5.3X5.3 (SHOWN)
4.44 X 4.44
0.1
0.127
0.152
0.178
4.06 X 4.06
3.75 X 3.75
4225982/B 07/2021
NOTES: (continued)
9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
10. Board assembly site may have different recommendations for stencil design.
www.ti.com
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