DRV5011ADDBZT [TI]
小尺寸（采用 WCSP 和 X2SON 封装）、低电压（最高 5.5V）霍尔效应锁存器 | DBZ | 3 | -40 to 135;
| 型号： | DRV5011ADDBZT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 小尺寸（采用 WCSP 和 X2SON 封装）、低电压（最高 5.5V）霍尔效应锁存器 | DBZ | 3 | -40 to 135 锁存器 |
| 文件： | 总34页 (文件大小：2283K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
DRV5011 低电压数字锁存器霍尔效应传感器
1 特性
3 说明
1
•
•
•
•
•
•
超小型 X2SON、SOT-23、DSBGA 或 TO-92 封装
DRV5011 器件是一款数字锁存器霍尔效应传感器，专
为电机和其他旋转系统而设计。
高磁性灵敏度：±2mT（典型值）
可靠磁滞：4mT（典型值）
快速感应带宽：30kHz
此器件具有工作电压范围为 2.5V 至 5.5V 的高效低电
压架构，采用标准 SOT-23 封装以及薄型 X2SON、
DSBGA 和 TO-92 封装。输出端采用推挽驱动器，无
需使用上拉电阻器，使系统更加紧凑小巧。
V
CC 工作范围：2.5V 至 5.5V
推挽式 CMOS 输出
支持 5mA 拉电流和 20mA 灌电流
工作温度：-40°C 至 +135°C
–
当南磁极靠近封装顶部并且超出 BOP 阈值时，该器件
会驱动低电压。输出会保持低电平，直到应用北极并且
超出 BRP 阈值，这将使输出驱动高电压。必须交换北
极和南极才能切换输出，且集成的磁滞会分开 BOP 和
•
2 应用
•
•
无刷直流电机传感器
增量旋转编码：
BRP 以提供可靠切换。
–
–
–
–
–
–
刷式直流电机反馈
电机速度（转速计）
机械行程
器件在 –40°C 至 +135°C 的宽环境温度范围内能够保
持稳定一致的优异性能。
器件信息(1)
流体测量
器件型号
封装
DSBGA (4)
封装尺寸（标称值）
0.80mm × 0.80mm
2.92mm × 1.30mm
1.10mm × 1.40mm
4.00mm × 3.15mm
旋钮转动
轮速
SOT-23 (3)
X2SON (4)
TO-92 (3)
DRV5011
•
•
电动自行车
流量计
(1) 如需了解所有可用封装，请参阅数据表末尾的封装选项附录。
典型原理图
磁响应
VCC
OUT
S
N
N
S
DRV5011
VCC
Controller
GPIO
VCC
N
S
S
N
OUT
GND
BHYS
0V
Copyright © 2017, Texas Instruments Incorporated
B
BRP
BOP
north
0 mT
south
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSCY6
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Magnetic Characteristics........................................... 5
6.7 Typical Characteristics.............................................. 6
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 7
7.4 Device Functional Modes........................................ 10
8
9
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Applications ................................................ 11
8.3 Dos and Don'ts........................................................ 14
Power Supply Recommendations...................... 15
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Examples................................................... 15
11 器件和文档支持 ..................................................... 16
11.1 器件支持................................................................ 16
11.2 文档支持................................................................ 16
11.3 接收文档更新通知 ................................................. 16
11.4 社区资源................................................................ 16
11.5 商标....................................................................... 16
11.6 静电放电警告......................................................... 16
11.7 Glossary................................................................ 16
12 机械、封装和可订购信息....................................... 16
7
4 修订历史记录
Changes from Revision A (April 2019) to Revision B
Page
•
向数据表添加了 LPG (TO-92) 封装 ........................................................................................................................................ 1
Changes from Original (December 2017) to Revision A
Page
•
•
已添加 向数据表添加了 YBH (DSBGA) 封装.......................................................................................................................... 1
已添加 recommendation to limit power supply voltage variation to less than 50 mVPP to Power Supply
Recommendations section ................................................................................................................................................... 15
2
Copyright © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
5 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
DMR Package
4-Pin X2SON With Exposed Thermal Pad
Top View
VCC
1
2
GND
3
Thermal
Pad
OUT
Not to scale
Not to scale
YBH Package
4-Pin DSBGA
Top View
LPG Package
3-Pin TO-92
Top View
1
2
3
2
1
OUT
GND
VCC
A
GND
NC
B
VCC
OUT
Not to scale
Pin Functions
PIN
DSBGA SOT-23 X2SON
I/O
DESCRIPTION
NAME
TO-92
GND
A1
A2
B2
B1
3
—
2
2
3
4
1
2
—
—
O
Ground reference
No-connect. This pin is not connected to the silicon. Leave this pin floating or
tied to ground, and soldered to the board for mechanical support.
NC
—
3
OUT
VCC
Push-pull CMOS output. Drives a VCC or ground level.
2.5-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic
capacitor to ground with a value of at least 0.01 µF.
1
1
—
Thermal
Pad
Thermal
Pad
Leave thermal pad floating or tied to ground, and soldered to the board for
mechanical support.
—
—
—
—
Copyright © 2017–2020, Texas Instruments Incorporated
3
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
VCC
Power-supply voltage
Power-supply voltage slew rate
Output voltage
VCC
–0.3
5.5
VCC
Unlimited
–0.3
V/µs
V
VO
IO
B
OUT
OUT
VCC + 0.3
30
Output current
–5
mA
T
Magnetic flux density
Operating junction temperature
Unlimited
TJ
140
135
°C
For SOT-23 (DBZ), X2SON (DMR) and TO-
92 (LPG)
–40
TA
Operating ambient temperature
Storage temperature
°C
°C
For DSBGA (YBH)
–40
–65
125
150
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±6000
±750
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
UNIT
V
VCC
VO
IO
Power supply voltage
Output voltage
Output current(1)
VCC
2.5
0
OUT
OUT
VCC
20
V
–5
mA
°C
TJ
Operating junction temperature
140
For SOT-23 (DBZ), X2SON (DMR) and
TO-92 (LPG)
–40
-40
135
125
TA
Operating ambient temperature
°C
For DSBGA (YBH)
(1) Device-sourced current is negative. Device-sunk current is positive.
4
Copyright © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
6.4 Thermal Information
DRV5011
DBZ
(SOT-23)
DMR
(X2SON)
YBH
(DSBGA)
LPG
(TO-92)
THERMAL METRIC(1)
UNIT
3 PINS
356
128
94
4 PINS
159
77
4 PINS
194.1
1.6
3 PINS
183.1
74.2
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
RθJB
ψJT
Junction-to-board thermal resistance
102
0.9
68
158.8
15.2
Junction-to-top characterization parameter
Junction-to-board characterization parameter
11.4
92
0.8
ψJB
100
67.9
158.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
2.3
40
MAX
3
UNIT
mA
µs
ICC
tON
td
Operating supply current
Power-on time (see 图 10)
Propagation delay time
High-level output voltage
Low-level output voltage
70
From change in B to change in OUT
IO = –1 mA
13
25
µs
VOH
VOL
VCC – 0.35 VCC – 0.1
0.15
V
IO = 20 mA
0.4
V
6.6 Magnetic Characteristics
for VCC = 2.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fBW
Sensing bandwidth
30
kHz
Magnetic threshold operate point
(see 图 8)
BOP
0.6
2
3.8
mT
Magnetic threshold release point
(see 图 8)
BRP
–3.8
2
–2
4
–0.6
6
mT
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
版权 © 2017–2020, Texas Instruments Incorporated
5
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
6.7 Typical Characteristics
5
0
-1
-2
-3
-4
-5
4
3
2
1
0
-40
-10
20
50
80
110
135
-40
-10
20
50
80
110
135
Temperature (èC)
Temperature (èC)
D002
D004
图 1. BOP vs Temperature
图 2. BRP vs Temperature
5
0
-1
-2
-3
-4
-5
4
3
2
1
0
1.5
2.5
3.5
Supply Voltage (V)
4.5
5.5
1.5
2.5
3.5
Supply Voltage (V)
4.5
5.5
D001
D003
图 3. BOP vs VCC
图 4. BRP vs VCC
2.6
1.65 V
3 V
5.5 V
2.5
2.4
2.3
2.2
2.1
2
-40
-10
20
50
80
110
135
Temperature (èC)
D005
图 5. ICC vs Temperature
6
版权 © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
7 Detailed Description
7.1 Overview
The DRV5011 is a magnetic sensor with a digital output that latches the most recent pole measured. Applying a
south magnetic pole near the top of the package causes the output to drive low, whereas a north magnetic pole
causes the output to drive high, and the absence of a magnetic field causes the output to continue to drive the
previous state, whether low or high.
The device integrates a Hall effect element, analog signal conditioning, offset cancellation circuits, amplifiers, and
comparators. This provides stable performance across a wide temperature range and resistance to mechanical
stress.
7.2 Functional Block Diagram
VCC
Voltage
Regulator
0.01 ꢀF
(minimum)
GND
REF
VCC
Element Bias
Output
Control
Offset
Cancellation
Amp
OUT
Temperature
Compensation
Copyright © 2017, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Magnetic Flux Direction
The DRV5011 is sensitive to the magnetic field component that is perpendicular to the top of the package, as
shown in 图 6.
TO-92
B
B
B
B
SOT-23
X2SON
DSBGA
PCB
图 6. Direction of Sensitivity
版权 © 2017–2020, Texas Instruments Incorporated
7
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
Feature Description (接下页)
The magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet.
This condition exists when a south magnetic pole is near the top of the package. The magnetic flux that travels
from the top to the bottom of the package results in negative millitesla values. 图 7 shows the flux direction
polarity.
positive B
negative B
N
S
S
N
PCB
PCB
图 7. Flux Direction Polarity
7.3.2 Magnetic Response
图 8 shows the device functionality and hysteresis.
OUT
VCC
BHYS
0V
B
BRP
BOP
north
0 mT
south
图 8. Device Functionality
8
版权 © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
Feature Description (接下页)
7.3.3 Output Driver
图 9 shows the device push-pull CMOS output that can drive a VCC or ground level.
VCC
Output
Output
Control
图 9. Push-Pull Output (Simplified)
7.3.4 Power-On Time
图 10 shows that after the VCC voltage is applied, the DRV5011 measures the magnetic field and sets the output
within the tON time.
VCC
2.5 V
tON
time
Output
Invalid
Valid
time
图 10. tON Definition
版权 © 2017–2020, Texas Instruments Incorporated
9
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
Feature Description (接下页)
7.3.5 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. 图 11 shows
the tolerances and side-view dimensions.
SOT-23
Top View
SOT-23
Side View
centered
650 µm
70 µm
80 µm
X2SON
Top View
X2SON
Side View
centered
60 µm
250 µm
50 µm
DSBGA
Top View
DSBGA
Side View
centered
20 µm
150 µm
20 µm
TO-92
Top View
2 mm
2 mm
TO-92
Side View
1.54 mm
1.61 mm
±50 µm
1030 µm
115 µm
图 11. Hall Element Location
7.4 Device Functional Modes
The DRV5011 has one mode of operation that applies when the Recommended Operating Conditions are met.
10
版权 © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV5011 is typically used in rotary applications for brushless DC (BLDC) motor sensors or incremental
rotary encoding.
For reliable functionality, the magnet must apply a flux density at the sensor greater than the maximum BOP and
less than the minimum BRP thresholds. Add additional margin to account for mechanical tolerance, temperature
effects, and magnet variation. Magnets generally produce weaker fields as temperature increases.
8.2 Typical Applications
8.2.1 BLDC Motor Sensors Application
VCC
3
Outputs
GPIOs
VCC
DRV5011
DRV5011
DRV5011
Microcontroller
6 Gate Drivers
& MOSFETs
PWM
M
GPIOs
Copyright © 2017, Texas Instruments Incorporated
图 12. BLDC Motor System
8.2.1.1 Design Requirements
For this design example, use the parameters listed in 表 1.
表 1. Design Parameters
DESIGN PARAMETER
Number of motor phases
Motor RPM
EXAMPLE VALUE
3
15 k
Number of magnet poles on the rotor
Magnetic material
12
Bonded Neodymium
125°C
Maximum temperature inside the motor
Magnetic flux density peaks at the Hall
sensors at maximum temperature
±11 mT
Hall sensor VCC
5 V ±10%
版权 © 2017–2020, Texas Instruments Incorporated
11
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
8.2.1.2 Detailed Design Procedure
Three-phase brushless DC motors often use three Hall effect latch devices to measure the electrical angle of the
rotor and tell the controller how to drive the three wires. These wires connect to electromagnet windings, which
generate magnetic fields that apply forces to the permanent magnets on the rotor.
Space the three Hall sensors across the printed-circuit board (PCB) so that they are 120 electrical degrees apart.
This configuration creates six 3-bit states with equal time duration for each electrical cycle, which consists of one
north and one south magnetic pole. From the center of the motor axis, the number of degrees to space each
sensor equals 2 / [number of poles] × 120°. In this design example, the first sensor is placed at 0°, the second
sensor is placed 20° rotated, and the third sensor is placed 40° rotated. Alternatively, a 3× degree offset can be
added or subtracted to any sensor, meaning the third sensor could alternatively be placed at
40° – (3 × 20°) = –20°.
8.2.1.3 Application Curve
U
Phase
V
Voltages
W
Hall 1
DRV5011
Hall 2
Outputs
Hall 3
Electrical Angle
0°
0°
120°
240°
360°
60°
Mechanical Angle
30°
.
图 13. Phase Voltages and Hall Signals for 3-Phase BLDC Motor
12
版权 © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
8.2.2 Incremental Rotary Encoding Application
VCC
VCC
DRV5011
Controller
VCC
OUT
GPIO
GPIO
GND
S
N
VCC
N
S
DRV5011
VCC
OUT
GND
Copyright © 2017, Texas Instruments Incorporated
图 14. Incremental Rotary Encoding System
8.2.2.1 Design Requirements
For this design example, use the parameters listed in 表 2.
表 2. Design Parameters
DESIGN PARAMETER
RPM range
EXAMPLE VALUE
0 to 45 k
8
Number of magnet poles
Magnetic material
Ferrite
2.5 mm
Air gap above the Hall sensors
Magnetic flux density peaks at the Hall
sensors at maximum temperature
±7 mT
8.2.2.2 Detailed Design Procedure
Incremental encoders are used on knobs, wheels, motors, and flow meters to measure relative rotary movement.
By attaching a ring magnet to the rotating component and placing a DRV5011 nearby, the sensor generates
voltage pulses as the magnet turns. If directional information is also needed (clockwise versus counterclockwise),
a second DRV5011 can be added with a phase offset, and then the order of transitions between the two signals
describes the direction.
Creating this phase offset requires spacing the two sensors apart on the PCB, and an ideal 90° quadrature offset
is attained when the sensors are separated by half the length of each magnet pole, plus any integer number of
pole lengths. 图 14 shows this configuration, as the sensors are 1.5 pole lengths apart. One of the sensors
changes its output every 360° / 8 poles / 2 sensors = 22.5° of rotation. For reference, TI Design TIDA-00480,
Automotive Hall Sensor Rotary Encoder, uses a 66-pole magnet with changes every 2.7°.
The maximum rotational speed that can be measured is limited by the sensor bandwidth. Generally, the
bandwidth must be faster than two times the number of poles per second. In this design example, the maximum
speed is 45000 RPM, which involves 6000 poles per second. The DRV5011 sensing bandwidth is 30 kHz, which
is five times the pole frequency. In systems where the sensor sampling rate is close to two times the number of
poles per second, most of the samples measure a magnetic field that is significantly lower than the peak value,
because the peaks only occur when the sensor and pole are perfectly aligned. In this case, add margin by
applying a stronger magnetic field that has peaks significantly higher than the maximum BOP
.
版权 © 2017–2020, Texas Instruments Incorporated
13
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
8.2.2.3 Application Curve
Two signals in quadrature provide movement and direction information. 图 15 shows how each 2-bit state has
unique adjacent 2-bit states for clockwise and counterclockwise.
Voltage
Sensor 1
Sensor 2
time
图 15. Quadrature Output (2-Bit)
8.3 Dos and Don'ts
The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package; therefore, the
correct magnet orientation must be used for the sensor to detect the field. 图 16 shows correct and incorrect
orientations when using a ring magnet.
CORRECT
N
S
N
N
S
S
N
S
S
N
N
S
INCORRECT
S
N
N
S
图 16. Correct and Incorrect Magnet Orientations
14
版权 © 2017–2020, Texas Instruments Incorporated
DRV5011
www.ti.com.cn
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
9 Power Supply Recommendations
The DRV5011 is powered from 2.5-V to 5.5-V dc power supplies. A 0.01-μF (minimum) ceramic capacitor rated
for VCC must be placed as close to the DRV5011 device as possible. Larger values of the bypass capacitor may
be needed to attenuate any significant high-frequency ripple and noise components generated by the power
source. TI recommends limiting the supply voltage variation to less than 50 mVPP
.
10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most PCBs, which makes placing the magnet on the opposite side
possible.
10.2 Layout Examples
VCC
VCC
OUT
GND
Thermal
Pad
GND
NC
VCC
GND
OUT
OUT
VCC
OUT
GND
NC
DSBGA
SOT-23
X2SON
TO-92
图 17. Layout Examples
版权 © 2017–2020, Texas Instruments Incorporated
15
DRV5011
ZHCSH78B –DECEMBER 2017–REVISED JANUARY 2020
www.ti.com.cn
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
有关其他设计参考，请参阅汽车霍尔传感器旋转编码器 TI 设计 (TIDA-00480)。
TI 还为 DRV5011 提供了以下评估模块 (EVM)：
•
•
德州仪器 (TI)，DRV5011 超低功耗、数字锁存器霍尔效应传感器评估模块
德州仪器 (TI)，用于评估 SOT-23 和 TO-92 霍尔传感器的分线适配器
11.2 文档支持
11.2.1 相关文档
请参阅如下相关文档：
•
•
DRV5011-5012EVM 用户指南
HALL-ADAPTER-EVM 用户指南
11.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产品
信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.4 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
16
版权 © 2017–2020, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV5011ADDBZR
DRV5011ADDBZT
DRV5011ADDMRR
DRV5011ADDMRT
DRV5011ADLPG
DRV5011ADLPGM
DRV5011ADYBHR
DRV5011ADYBHT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
X2SON
X2SON
TO-92
DBZ
DBZ
DMR
DMR
LPG
LPG
YBH
YBH
3
3
4
4
3
3
4
4
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 135
-40 to 135
-40 to 135
-40 to 135
-40 to 135
-40 to 135
-40 to 125
-40 to 125
1AD
1AD
1AD
1AD
11AD
11AD
A
SN
SN
SN
1000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
SN
TO-92
SN
N / A for Pkg Type
DSBGA
DSBGA
SAC396
SAC396
Level-1-260C-UNLIM
Level-1-260C-UNLIM
250
RoHS & Green
A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5011ADDBZR
DRV5011ADDBZT
DRV5011ADDMRR
DRV5011ADDMRT
DRV5011ADYBHR
DRV5011ADYBHT
SOT-23
SOT-23
X2SON
X2SON
DSBGA
DSBGA
DBZ
DBZ
DMR
DMR
YBH
YBH
3
3
4
4
4
4
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
3.15
3.15
1.27
1.27
0.85
0.85
2.77
2.77
1.57
1.57
0.89
0.89
1.22
1.22
0.5
4.0
4.0
4.0
4.0
2.0
2.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q1
Q1
Q2
Q2
3000
250
0.5
3000
250
0.51
0.51
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV5011ADDBZR
DRV5011ADDBZT
DRV5011ADDMRR
DRV5011ADDMRT
DRV5011ADYBHR
DRV5011ADYBHT
SOT-23
SOT-23
X2SON
X2SON
DSBGA
DSBGA
DBZ
DBZ
DMR
DMR
YBH
YBH
3
3
4
4
4
4
3000
250
183.0
183.0
200.0
200.0
182.0
182.0
183.0
183.0
183.0
183.0
182.0
182.0
20.0
20.0
25.0
25.0
20.0
20.0
3000
250
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
S
C
A
L
E
1
.
3
0
0
TRANSISTOR OUTLINE
4.1
3.9
3.25
3.05
0.55
0.40
3X
5.05
MAX
3
1
3X (0.8)
3X
15.5
15.1
0.48
0.35
0.51
0.36
3X
3X
2X 1.27 0.05
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
1
3
2
0.86
0.66
(0.5425)
4221343/C 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
FULL R
TYP
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X ( 0.75) VIA
2X
METAL
(1.7)
2X (1.7)
2X
SOLDER MASK
OPENING
2
3
1
2X (1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221343/C 01/2018
www.ti.com
TAPE SPECIFICATIONS
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0
1
13.0
12.4
0
1
1 MAX
21
18
2.5 MIN
6.5
5.5
9.5
8.5
0.25
0.15
19.0
17.5
3.8-4.2 TYP
0.45
0.35
6.55
6.15
12.9
12.5
4221343/C 01/2018
www.ti.com
GENERIC PACKAGE VIEW
DMR 4
1.1 x 1.4, 0.5 mm pitch
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4229480/A
www.ti.com
PACKAGE OUTLINE
DMR0004A
X2SON - 0.4 mm max height
SCALE 9.000
PLASTIC SMALL OUTLINE - NO LEAD
1.15
1.05
A
B
PIN 1 INDEX AREA
1.45
1.35
(0.13) TYP
C
0.4 MAX
SEATING PLANE
0.08 C
NOTE 4
0.05
0.00
2X 0.5
SYMM
2
3
NOTE 4
EXPOSED
THERMAL PAD
5
SYMM
0.6 0.1
0.25
0.15
4X
PIN 1 ID
(OPTIONAL)
4
1
0.27
0.17
4X
0.8 0.1
0.1
C B
C
A
0.05
4222825/B 05/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Quantity and shape of side wall metal may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.6)
(
0.2) VIA
2
3
SYMM
(0.8)
LAND PATTERN EXAMPLE
SCALE:35X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222825/B 05/2022
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.57)
METAL
TYP
2
3
SYMM
(0.76)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4222825/B 05/2022
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
YBH0004
DSBGA - 0.4 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
A
D
B
E
BALL A1
CORNER
C
0.4 MAX
SEATING PLANE
0.05 C
0.16
0.10
BALL TYP
0.4
TYP
B
SYMM
D: Max = 0.82 mm, Min = 0.76 mm
E: Max = 0.784 mm, Min =0.724 mm
0.4
TYP
A
1
2
0.225
0.185
4X
0.015
SYMM
C A B
4224051/A 11/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YBH0004
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
4X ( 0.2)
2
1
A
B
SYMM
(0.4) TYP
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 50X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.2)
METAL
(
0.2)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
(PREFERRED)
NON-SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4224051/A 11/2017
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBH0004
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
4X ( 0.21)
1
2
A
B
SYMM
(0.4) TYP
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm THICK STENCIL
SCALE: 50X
4224051/A 11/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023，德州仪器 (TI) 公司
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明