DRV5032AJDMRR [TI]
低功耗(5Hz、<1µA)、低电压(最高 5.5V)开关 | DMR | 4 | -40 to 85;型号: | DRV5032AJDMRR |
厂家: | TEXAS INSTRUMENTS |
描述: | 低功耗(5Hz、<1µA)、低电压(最高 5.5V)开关 | DMR | 4 | -40 to 85 开关 传感器 换能器 |
文件: | 总40页 (文件大小:1727K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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DRV5032
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020
DRV5032 Ultra-Low-Power Digital-Switch Hall Effect Sensor
1 Features
3 Description
The DRV5032 device is an ultra-low-power digital-
switch Hall effect sensor, designed for the most
compact and battery-sensitive systems. The device is
offered in multiple magnetic thresholds, sampling
rates, output drivers, and packages to accommodate
various applications.
1
•
Industry-leading ultra-low power consumption
–
–
5-Hz version: 0.54 µA with 1.8 V
20-Hz versions: 1.6 µA with 3 V
•
•
1.65-V to 5.5-V operating VCC range
Magnetic threshold options (maximum BOP):
When the applied magnetic flux density exceeds the
BOP threshold, the device outputs a low voltage. The
output stays low until the flux density decreases to
less than BRP, and then the output either drives a
high voltage or becomes high impedance, depending
on the device version. By incorporating an internal
oscillator, the device samples the magnetic field and
updates the output at a rate of 20 Hz, or 5 Hz for the
lowest current consumption. Omnipolar and unipolar
magnetic responses are available.
–
–
–
–
3.9 mT, highest sensitivity
4.8 mT, high sensitivity
9.5 mT, medium sensitivity
63 mT, lowest sensitivity
•
•
•
•
•
Omnipolar and unipolar options
20-Hz and 5-Hz sampling rate options
Open-drain and push-pull output options
SOT-23, X2SON and TO-92 package options
–40°C to +85°C operating temperature range
The device operates from a VCC range of 1.65 V to
5.5 V, and is packaged in a standard SOT-23, TO-92
and small X2SON.
2 Applications
Device Information(1)
•
•
•
•
•
•
•
Battery-critical position sensing
Electricity meter tamper detection
Cell Phone, laptop, or tablet case sensing
E-locks, smoke detectors, appliances
Medical devices, IoT systems
PART NUMBER
PACKAGE
BODY SIZE (NOM)
2.92 mm × 1.30 mm
1.10 mm × 1.40 mm
4.00 mm × 3.15 mm
SOT-23 (3)
DRV5032
X2SON (4)
TO-92 (3)
Valve or solenoid position detection
Contactless diagnostics or activation
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Current Consumption of 5-Hz Version
Typical Schematic
1.4
distance
VCC
1.2
1
DRV5032
VCC
Controller
N
S
OUT
GND
GPIO
0.8
0.6
0.4
Copyright © 2017, Texas Instruments Incorporated
1.65 V
3 V
5.5 V
0.2
0
-40
-10
20
Temperature (èC)
50
80
D011
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5032
SLVSDC7E –APRIL 2017–REVISED JANUARY 2020
www.ti.com
Table of Contents
8.4 Device Functional Modes........................................ 16
Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Applications ............................................... 17
9.3 Do's and Don'ts....................................................... 21
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 4
Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings ............................................................ 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information.................................................. 6
7.5 Electrical Characteristics........................................... 7
7.6 Magnetic Characteristics........................................... 8
7.7 Typical Characteristics.............................................. 9
Detailed Description ............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12
8.3 Feature Description................................................. 13
9
10 Power Supply Recommendations ..................... 22
11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
11.2 Layout Examples................................................... 22
12 Device and Documentation Support ................. 23
12.1 Documentation Support ........................................ 23
12.2 Receiving Notification of Documentation Updates 23
12.3 Support Resources ............................................... 23
12.4 Trademarks........................................................... 23
12.5 Electrostatic Discharge Caution............................ 23
12.6 Glossary................................................................ 23
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (November 2017) to Revision E
Page
•
•
•
Added LPG (TO-92) package ................................................................................................................................................ 1
Added notes for the DU and FD package magnetic threshold operate points in the Magnetic Characteristics table .......... 8
Added probability density function plots for BOP, BRP, and BHYS to the Typical Characteristics section............................... 10
Changes from Revision C (September 2017) to Revision D
Page
•
Added the DU device version to the data sheet .................................................................................................................... 3
Changes from Revision B (August 2017) to Revision C
Page
•
Changed the status of the AJ device version from Preview to Active ................................................................................... 3
Changes from Revision A (May 2017) to Revision B
Page
•
Added the ZE device version and the preview AJ device version ......................................................................................... 3
Changes from Original (April 2017) to Revision A
Page
•
Added the FA and FD device versions................................................................................................................................... 1
2
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SLVSDC7E –APRIL 2017–REVISED JANUARY 2020
5 Device Comparison Table
MAXIMUM
VERSION
MAGNETIC
RESPONSE
OUTPUT
TYPE
SAMPLING
RATE
PACKAGES
AVAILABLE
THRESHOLD
DRV5032DU
DRV5032FA
DRV5032FB
DRV5032FC
DRV5032FD
DRV5032AJ
DRV5032ZE
3.9 mT
Unipolar
Omnipolar
Omnipolar
Omnipolar
Unipolar
Push-pull
Push-pull
Push-pull
Open-drain
Push-pull
Open-drain
Open-drain
20 Hz
20 Hz
5 Hz
SOT-23, X2SON, TO-92
SOT-23, X2SON, TO-92
SOT-23, TO-92
4.8 mT
20 Hz
20 Hz
20 Hz
20 Hz
SOT-23, TO-92
X2SON, TO-92
9.5 mT
63 mT
Omnipolar
Omnipolar
SOT-23, X2SON, TO-92
SOT-23, TO-92
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6 Pin Configuration and Functions
FA, FB, FC, AJ, ZE Versions DBZ Package
DU Version DBZ Package
3-Pin SOT-23
3-Pin SOT-23
Top View
Top View
VCC
1
VCC
1
3
2
3
GND
GND
OUT
2
OUT2
FA, AJ Versions DMR Package
4-Pin X2SON
DU, FD Versions DMR Package
4-Pin X2SON
Top View
Top View
VCC
1
OUT
4
VCC OUT1
1
4
Thermal
Pad
Thermal
Pad
2
3
2
3
GND
NC
GND OUT2
FA, FB, FC, AJ, ZE Versions LPG Package
DU, FD Versions LPG Package
3-Pin TO-92
3-Pin TO-92
Top View
Top View
3
2
1
OUT
GND
VCC
3
2
1
OUT2
GND
VCC
4
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Pin Functions
PIN
TO-92
(FA, FB,
FC, AJ,
ZE)
SOT-23
(FA, FB,
FC, AJ, ZE)
I/O
DESCRIPTION
SOT-23
(DU)
TO-92
(DU, FD)
X2SON
(FA, AJ) (DU, FD)
X2SON
NAME
GND
OUT
3
2
3
2
3
2
2
4
2
—
O
Ground reference
—
—
—
Omnipolar output that responds to north and south magnetic poles
Unipolar output that responds to north magnetic poles near the top
of the package
OUT1
OUT2
—
—
—
2
—
—
—
3
—
—
4
3
O
O
Unipolar output that responds to south magnetic poles near the
top of the package
No-connect. This pin is not connected to the silicon. It should be
left floating or tied to ground. It should be soldered to the board for
mechanical support.
NC
—
—
—
—
3
—
—
1.65-V to 5.5-V power supply. TI recommends connecting this pin
to a ceramic capacitor to ground with a value of at least 0.1 µF.
VCC
1
1
1
1
1
1
—
—
Therma
l Pad
No-connect. This pin should be left floating or tied to ground. It
should be soldered to the board for mechanical support.
—
—
—
—
PAD
PAD
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
Power supply voltage
Power supply voltage slew rate
Output voltage
VCC
–0.3
5.5
VCC
Unlimited
Unlimited
V / µs
V
OUT, OUT1, OUT2
OUT, OUT1, OUT2
–0.3
–5
VCC + 0.3
5
Output current
mA
T
Magnetic flux density, BMAX
Junction temperature, TJ
Storage temperature, Tstg
105
150
°C
–65
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±6000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification
JESD22-C101(2)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.65
0
MAX
5.5
5.5
5
UNIT
V
VCC
VO
IO
Power supply voltage
Output voltage
V
Output current
–5
mA
°C
TA
Operating ambient temperature
–40
85
7.4 Thermal Information
DRV5032
THERMAL METRIC(1)
DBZ (SOT-23)
3 PINS
DMR (X2SON)
4 PINS
LPG (TO-92)
3 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
356
159
183.1
°C/W
°C/W
RθJC(to
p)
128
77
74.2
RθJB
Junction-to-board thermal resistance
94
11.4
92
102
0.9
158.8
15.2
°C/W
°C/W
°C/W
ψJT
ψJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
100
158.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6
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7.5 Electrical Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PUSH-PULL OUTPUT DRIVER
VOH
VOL
High-level output voltage
Low-level output voltage
IOUT = –1 mA
VCC – 0.35 VCC – 0.1
0.1
V
V
IOUT = 1 mA
0.3
OPEN-DRAIN OUTPUT
High impedance output leakage
current
IOZ
VCC = 5.5 V, OUT = 5.5 V
IOUT = 1 mA
5
100
0.3
nA
V
VOL
Low-level output voltage
0.1
DU, FA, FC, FD, AJ, ZE VERSIONS
fS
tS
Frequency of magnetic sampling
13.3
27
20
50
37
75
Hz
ms
Period of magnetic sampling
Average current consumption
VCC = 1.8 V
VCC = 3 V
VCC = 5 V
1.3
1.6
2.3
ICC(AVG)
3.5
µA
FB VERSION
fS
tS
Frequency of magnetic sampling
3.5
5
200
8.5
Hz
ms
Period of magnetic sampling
Average current consumption
117
286
VCC = 1.8 V
VCC = 3 V
VCC = 5 V
0.54
0.69
1.06
ICC(AVG)
1.8
µA
ALL VERSIONS
ICC(PK) Peak current consumption
tON
2
55
40
2.7
mA
µs
Power-on time (see Figure 20)
100
tACTIVE
Active time period (see Figure 20)
µs
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7.6 Magnetic Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DU VERSION
OUT1 pin (north)(2)
–3.9
1.2
–2.5
2.5
–1.2
3.9
BOP
Magnetic threshold operate point
Magnetic threshold release point
mT
OUT2 pin (south)
OUT1 pin (north)(2)
OUT2 pin (south)
Each output
–3.5
0.9
–1.8
1.8
–0.9
3.5
BRP
mT
mT
BHYS
Magnetic hysteresis: |BOP – BRP
|
0.1
0.7
1.9
FA, FB, FC VERSIONS
BOP
BRP
Magnetic threshold operate point
Magnetic threshold release point
±1.5
±0.5
0.8
±3
±1.5
1.5
±4.8
±3
3
mT
mT
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
FD VERSION
OUT1 pin (north)(2)
OUT2 pin (south)
OUT1 pin (north)(2)
OUT2 pin (south)
Each output
–4.8
1.5
–3
–3
3
–1.5
4.8
–0.5
3
BOP
Magnetic threshold operate point
Magnetic threshold release point
mT
–1.5
1.5
1.5
BRP
mT
mT
0.5
0.8
BHYS
Magnetic hysteresis: |BOP – BRP
|
3
AJ VERSION
BOP
BRP
Magnetic threshold operate point
Magnetic threshold release point
±4
±3
±7
±5.6
1.4
±9.5
±7.5
3
mT
mT
mT
BHYS
Magnetic hysteresis: |BOP – BRP
|
0.5
ZE VERSION
BOP
BRP
Magnetic threshold operate point
Magnetic threshold release point
±33
±30
1.2
±47
±43
4
±63
±58
8.5
mT
mT
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
(1) For a graphical description of magnetic thresholds, see the Magnetic Response section.
(2) X2SON package only.
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7.7 Typical Characteristics
1.4
1.2
1
3
2.5
2
0.8
0.6
0.4
0.2
0
1.5
1
1.65 V
3 V
5.5 V
1.65 V
3 V
5.5 V
0.5
0
-40
-10
20
Temperature (èC)
50
80
-40
-10
20
Temperature (èC)
50
80
D016
D011
Figure 1. ICC(AVG) vs Temperature (20-Hz versions)
Figure 2. ICC(AVG) vs Temperature (5-Hz version)
8
7
6
5
4
3
2
6
5
4
3
2
1
FA, FB, FC, FD Versions
AJ Version
DU Version
FA, FB, FC, FD Versions
AJ Version
DU Version
-40
-20
0
20 40
Temperature (°C)
60
80
100
-40
-20
0
20 40
Temperature (°C)
60
80
100
D023
D025
Figure 3. |BOP| vs Temperature
Figure 4. |BRP| vs Temperature
8
7
6
5
4
3
2
6
5
4
3
2
1
FA, FB, FC, FD Versions
AJ Version
DU Version
FA, FB, FC, FD Versions
AJ Version
DU Version
1.5
2.5
3.5
Supply Voltage (V)
4.5
5.5
1.5
2.5
3.5
Supply Voltage (V)
4.5
5.5
D022
D024
Figure 5. |BOP| vs VCC
Figure 6. |BRP| vs VCC
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Typical Characteristics (continued)
60
60
55
50
45
40
35
30
55
50
45
40
35
30
-40
-10
20
Temperature (°C)
50
80
-40
-10
20
Temperature (°C)
50
80
D020
D021
Figure 7. ZE Version |BOP| vs Temperature
Figure 8. ZE Version |BRP| vs Temperature
50
45
44
43
42
41
40
49
48
47
46
45
1.5
2.5
3.5
Supply Voltage (V)
4.5
5.5
1.5
2.5
3.5
Supply Voltage (V)
4.5
5.5
D018
D019
Figure 9. ZE Version |BOP| vs VCC
Figure 10. ZE Version |BRP| vs VCC
2
1.5
1
2
1.5
1
0.5
0
0.5
0
4
5
6
Magnetic Threshold Operate Point (mT)
7
8
9
9.5
3
4
5
Magnetic Threshold Release Point (mT)
6
7
7.5
D102
D103
TA = 25°C, VCC = 1.65 V to 5.5 V
TA = 25°C, VCC = 1.65 V to 5.5 V
Figure 11. AJ Version BOP Probability Density Function
Figure 12. AJ Version BRP Probability Density Function
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Typical Characteristics (continued)
5
4
3
2
1
0
0.5
1
1.5 2
Magnetic Hysteresis (mT)
2.5
3
D101
TA = 25°C, VCC = 1.65 V to 5.5 V
Figure 13. AJ Version BHYS Probability Density Function
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8 Detailed Description
8.1 Overview
The DRV5032 device is a magnetic sensor with a digital output that indicates when the magnetic flux density
threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a low-
frequency oscillator that enables ultra-low average power consumption. By operating from a 1.65-V to 5.5-V
supply, the device periodically measures magnetic flux density, updates the output, and enters a low-power sleep
state.
8.2 Functional Block Diagram
0.1 ꢀF
(min)
VCC
(1)
VCC
Ultra-low-power
Voltage
Oscillator
Regulator
OUT/OUT1
Output
Control
REF
(1)
Element Bias
VCC
Offset
Amp
Cancellation
OUT2
Temperature
Compensation
(1) Output type depends on device version
GND
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8.3 Feature Description
8.3.1 Magnetic Flux Direction
The DRV5032 device is sensitive to the magnetic field component that is perpendicular to the top of the package
(as shown in Figure 14).
TO-92
B
B
B
SOT-23
X2SON
PCB
Figure 14. Direction of Sensitivity
The magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet.
This condition exists when a south magnetic pole is near the top of the package. The magnetic flux that travels
from the top to the bottom of the package results in negative millitesla values.
positive B
negative B
N
S
S
N
PCB
PCB
Figure 15. Flux Direction Polarity
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Feature Description (continued)
8.3.2 Device Version Comparison
The following table lists the available device versions.
MAXIMUM
THRESHOLD
MAGNETIC
RESPONSE
OUTPUT
TYPE
SAMPLING
RATE
PACKAGES
VERSION
AVAILABLE
SOT-23, X2SON, TO-92
SOT-23, X2SON, TO-92
SOT-23, TO-92
DRV5032DU
DRV5032FA
DRV5032FB
DRV5032FC
DRV5032FD
DRV5032AJ
DRV5032ZE
3.9 mT
Unipolar
Omnipolar
Omnipolar
Omnipolar
Unipolar
Push-pull
Push-pull
Push-pull
Open-drain
Push-pull
Open-drain
Open-drain
20 Hz
20 Hz
5 Hz
4.8 mT
20 Hz
20 Hz
20 Hz
20 Hz
SOT-23, TO-92
X2SON, TO-92
9.5 mT
63 mT
Omnipolar
Omnipolar
SOT-23, X2SON, TO-92
SOT-23, TO-92
8.3.2.1 Magnetic Threshold
Devices that have a lower magnetic threshold detect magnets at a farther distance. Higher thresholds generally
require a closer distance or larger magnet.
8.3.2.2 Magnetic Response
The FA, FB, FC, AJ, and ZE device versions have omnipolar functionality, and these versions all respond to the
north and south poles the same way as shown in Figure 16.
OUT
BHYS
BHYS
VCC
0V
0 mT
B
BOP BRP
BRP BOP
north
south
Figure 16. Omnipolar Functionality
The DU and FD device versions have unipolar functionality. Pin OUT1 only responds to flux in the top-down
direction (north), and pin OUT2 only responds to flux in the bottom-up direction (south).
OUT1
OUT2
BHYS
BHYS
VCC
VCC
0V
0 mT
0V
0 mT
B
B
BOP BRP
BRP BOP
north
south
north
south
Figure 17. Unipolar Functionality
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8.3.2.3 Output Type
The DU, FA, FB, and FD device versions have push-pull CMOS outputs that can drive a VCC or ground level.
The FC, AJ, and ZE device versions have open-drain outputs that can become high impedance or drive ground.
For these versions, an external pullup resistor must be used.
VCC
Output
Output
Control
Output
Output
Control
Figure 18. Push-Pull Output (Simplified)
Figure 19. Open-Drain Output (Simplified)
8.3.2.4 Sampling Rate
When the DRV5032 device powers up, it measures the first magnetic sample and sets the output within the tON
time. The output is latched, and the device enters an ultra-low-power sleep state. After each tS time, the device
measures a new sample and updates the output, if necessary. If the magnetic field does not change between
periods, the output does not change.
VCC
1.65 V
tON
time
tACTIVE
tS
tS
ICC
ICC(PK)
time
Output
VCC
2nd sample
3rd sample
Invalid
1st sample
GND
time
Figure 20. Timing Diagram
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8.3.3 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 21
shows the tolerances and side-view dimensions.
SOT-23
Top View
SOT-23
Side View
centered
650 µm
70 µm
80 µm
X2SON
Top View
X2SON
Side View
centered
60 µm
250 µm
50 µm
TO-92
Top View
2 mm
2 mm
TO-92
Side View
1.54 mm
1.61 mm
±50 µm
1030 µm
115 µm
Figure 21. Hall Element Location
8.4 Device Functional Modes
The DRV5032 device has one mode of operation that applies when the Recommended Operating Conditions are
met.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DRV5032 device is typically used to detect the proximity of a magnet. The magnet is often attached to a
movable component in the system.
9.1.1 Output Type Tradeoffs
The push-pull output allows for the lowest system power consumption because there is no current leakage path
when the output drives high or low. The open-drain output involves a leakage path through the external pullup
resistor when the output drives low.
The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor
drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of
sensors.
9.2 Typical Applications
9.2.1 General-Purpose Magnet Sensing
distance
VCC
DRV5032
VCC
Controller
GPIO
N
S
OUT
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 22. Typical Application Diagram
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETER
VCC
EXAMPLE VALUE
3.3 V
Magnet
1-cm Cube NdFeB
2.5 cm
Closest magnet distance
Magnetic flux density at closest distance
Magnetic flux density when magnet moves away
7.8 mT
Close to 0 mT
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9.2.1.2 Detailed Design Procedure
When designing a digital-switch magnetic sensing system, the user should consider these three variables: the
magnet, sensing distance, and threshold of the sensor.
The DRV5032 device has a detection threshold specified by parameter BOP. To reliably activate the sensor, the
magnet must apply greater than the maximum specified BOP. In such a system, the sensor typically detects the
magnet before it has moved to the closest position. When the magnet moves away from the sensor, it must apply
less than the minimum specified BRP to reliably release the sensor.
Magnets are made from various ferromagnetic materials that have trade-offs in cost, drift with temperature,
absolute max temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet.
Thickness
Thickness
Width
Distance
Distance
Diameter
S
N
Length
S
N
B
B
Figure 23. Rectangular Block and Cylinder Magnets
Use Equation 1 for the rectangular block shown in Figure 23:
Br
Œ ( (
WL
2D 4D2 + W2 + L2
WL
2(D + T) 4(D + T)2 + W2 + L2
B =
arctan
œ arctan
) (
))
(1)
Use Equation 2 for the cylinder shown in Figure 23:
Br
2
D + T
(0.5C)2 + (D + T)2
D
B =
œ
(
)
(0.5C)2 + D2
where
•
•
•
•
•
W is width.
L is length.
T is thickness (the direction of magnetization).
D is distance.
C is diameter.
(2)
An online tool that uses these formulas is located at http://www.ti.com/product/drv5033.
All magnetic materials generally have a lower Br at higher temperatures. Systems should have margin to account
for this, as well as for mechanical tolerances.
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9.2.1.3 Application Curve
60
55
50
45
40
35
30
25
20
15
10
5
0
1
1.5
2
2.5
3
Distance (cm)
3.5
4
4.5
5
D017
Figure 24. Magnetic Profile of a 1-cm Cube NdFeB Magnet
9.2.2 Three-Position Switch
This application uses the DRV5032FD for a three-position switch.
1
2
3
PCB
Figure 25. Three-Position Slider Switch With Embedded Magnet
9.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 2.
Table 2. Design Parameters
DESIGN PARAMETER
Hall effect device
VCC
EXAMPLE VALUE
DRV5032FD
5 V
Switch travel distance
Magnet
5 mm in each direction
10-mm cylinder
±0.5 mm
Mechanical tolerance per position
9.2.2.2 Detailed Design Procedure
A standard 2-pole magnet produces strong perpendicular flux components near the outer edges of the poles, and
no perpendicular flux near the center at the north-south pole boundary. When the DRV5032FD is below the
center of the magnet, it receives close to 0 mT, and both outputs drive high. If the switch with the embedded
magnet moves left or right, the sensor receives a north or south field, and OUT1 or OUT2 drive low. This
provides 3 digital states of detection.
The length of the magnet should ideally be two times the distance of travel toward each side. Then, when the
switch is pushed to either side, the outer edge of the magnet is positioned directly above the sensor where it
applies the strongest perpendicular flux component.
To determine the magnitude of magnetic flux density for a given magnet and distance, TI recommends to either
use simulation software, test with a linear Hall effect sensor, or test with a gaussmeter.
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9.2.2.3 Application Curve
Figure 26 shows the typical magnetic flux lines around a 2-pole magnet.
Figure 26. Typical Magnetic Flux Lines
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9.3 Do's and Don'ts
The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, therefore a
correct magnet approach must be used for the sensor to detect the field. Figure 27 shows correct and incorrect
approaches.
CORRECT
S
N
S
N
N
S
INCORRECT
N
S
Figure 27. Correct and Incorrect Magnet Approaches
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10 Power Supply Recommendations
The DRV5032 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.1 µF.
11 Layout
11.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. It is common
practice to embed Hall effect sensors within plastic or aluminum enclosures and sensing magnets on the outside.
Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the
opposite side possible.
11.2 Layout Examples
VCC
SEL
VCC
Thermal
Pad
GND
VCC
GND
OUT
GND
OUT
OUT
Figure 28. Layout Examples
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
•
•
•
•
•
Texas Instruments, DRV5032-SOLAR-EVM user's guide
Texas Instruments, Power Gating Systems with Magnetic Sensors TI TechNote
Texas Instruments, Low-Power Door and Window Sensor With Sub-1GHz and 10-Year Coin Cell Battery Life
Texas Instruments, Magnetic Tamper Detection Using Low-Power Hall Effect Sensors
Texas Instruments, Fault Monitoring for Overhead Fault Indicators Using Ultra-Low-Power
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
3000
250
(1)
(2)
(3)
(4/5)
(6)
DRV5032AJDBZR
DRV5032AJDBZT
DRV5032AJDMRR
DRV5032AJDMRT
DRV5032AJLPG
ACTIVE
SOT-23
SOT-23
X2SON
X2SON
TO-92
DBZ
3
3
4
4
3
3
3
3
4
4
3
3
3
3
4
4
Green (RoHS
& no Sb/Br)
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
(1M6W, 2AJ)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBZ
Green (RoHS
& no Sb/Br)
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
(1M6W, 2AJ)
2AJ
DMR
DMR
LPG
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
2AJ
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
32AJ
DRV5032AJLPGM
DRV5032DUDBZR
DRV5032DUDBZT
DRV5032DUDMRR
DRV5032DUDMRT
DRV5032DULPG
DRV5032DULPGM
DRV5032FADBZR
DRV5032FADBZT
DRV5032FADMRR
DRV5032FADMRT
TO-92
LPG
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
32AJ
SOT-23
SOT-23
X2SON
X2SON
TO-92
DBZ
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
2DU
DBZ
Green (RoHS
& no Sb/Br)
2DU
DMR
DMR
LPG
3000
250
Green (RoHS
& no Sb/Br)
2DU
Green (RoHS
& no Sb/Br)
2DU
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
32DU
TO-92
LPG
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
32DU
SOT-23
SOT-23
X2SON
X2SON
DBZ
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(1LVW, 2FA)
(1LVW, 2FA)
2FA
DBZ
Green (RoHS
& no Sb/Br)
DMR
DMR
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
2FA
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
LPG
LPG
DBZ
DBZ
LPG
LPG
DBZ
DBZ
LPG
LPG
DMR
DMR
LPG
LPG
DBZ
DBZ
LPG
Qty
1000
3000
3000
250
(1)
(2)
(3)
(4/5)
(6)
DRV5032FALPG
DRV5032FALPGM
DRV5032FBDBZR
DRV5032FBDBZT
DRV5032FBLPG
DRV5032FBLPGM
DRV5032FCDBZR
DRV5032FCDBZT
DRV5032FCLPG
DRV5032FCLPGM
DRV5032FDDMRR
DRV5032FDDMRT
DRV5032FDLPG
DRV5032FDLPGM
DRV5032ZEDBZR
DRV5032ZEDBZT
DRV5032ZELPG
ACTIVE
TO-92
TO-92
3
3
3
3
3
3
3
3
3
3
4
4
3
3
3
3
3
Green (RoHS
& no Sb/Br)
SN
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
32FA
32FA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SOT-23
SOT-23
TO-92
Green (RoHS
& no Sb/Br)
(1LWW, 2FB)
(1LWW, 2FB)
32FB
Green (RoHS
& no Sb/Br)
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
TO-92
Green (RoHS
& no Sb/Br)
32FB
SOT-23
SOT-23
TO-92
Green (RoHS
& no Sb/Br)
(1M7W, 2FC)
(1M7W, 2FC)
32FC
Green (RoHS
& no Sb/Br)
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
TO-92
Green (RoHS
& no Sb/Br)
32FC
X2SON
X2SON
TO-92
Green (RoHS
& no Sb/Br)
2FD
Green (RoHS
& no Sb/Br)
2FD
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
32FD
TO-92
Green (RoHS
& no Sb/Br)
32FD
SOT-23
SOT-23
TO-92
Green (RoHS
& no Sb/Br)
(1M8W, 2ZE)
(1M8W, 2ZE)
32ZE
Green (RoHS
& no Sb/Br)
1000
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV5032ZELPGM
ACTIVE
TO-92
LPG
3
3000
Green (RoHS
& no Sb/Br)
SN
N / A for Pkg Type
-40 to 85
32ZE
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5032AJDBZR
DRV5032AJDBZR
DRV5032AJDBZT
DRV5032AJDBZT
DRV5032AJDMRR
DRV5032AJDMRT
DRV5032DUDBZR
DRV5032DUDBZT
DRV5032DUDMRR
DRV5032DUDMRT
DRV5032FADBZR
DRV5032FADBZR
DRV5032FADBZT
DRV5032FADBZT
DRV5032FADMRR
DRV5032FADMRT
DRV5032FBDBZR
DRV5032FBDBZR
SOT-23
SOT-23
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DMR
DMR
DBZ
DBZ
DMR
DMR
DBZ
DBZ
DBZ
DBZ
DMR
DMR
DBZ
DBZ
3
3
3
3
4
4
3
3
4
4
3
3
3
3
4
4
3
3
3000
3000
250
178.0
180.0
180.0
178.0
179.0
179.0
180.0
180.0
180.0
180.0
178.0
180.0
180.0
178.0
179.0
180.0
180.0
178.0
9.0
8.4
8.4
9.0
8.4
8.4
8.4
8.4
8.4
8.4
9.0
8.4
8.4
9.0
8.4
8.4
8.4
9.0
3.15
3.15
3.15
3.15
1.27
1.27
3.15
3.15
1.27
1.27
3.15
3.15
3.15
3.15
1.27
1.27
3.15
3.15
2.77
2.77
2.77
2.77
1.57
1.57
2.77
2.77
1.57
1.57
2.77
2.77
2.77
2.77
1.57
1.57
2.77
2.77
1.22
1.22
1.22
1.22
0.5
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q1
Q1
Q3
Q3
Q1
Q1
Q3
Q3
Q3
Q3
Q1
Q1
Q3
Q3
250
3000
250
0.5
3000
250
1.22
1.22
0.5
3000
250
0.5
3000
3000
250
1.22
1.22
1.22
1.22
0.5
250
3000
250
0.5
3000
3000
1.22
1.22
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2020
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5032FBDBZT
DRV5032FBDBZT
DRV5032FCDBZR
DRV5032FCDBZR
DRV5032FCDBZT
DRV5032FCDBZT
DRV5032FDDMRR
DRV5032FDDMRT
DRV5032ZEDBZR
DRV5032ZEDBZR
DRV5032ZEDBZT
DRV5032ZEDBZT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DMR
DMR
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
4
4
3
3
3
3
250
250
180.0
178.0
180.0
178.0
180.0
178.0
179.0
180.0
178.0
180.0
178.0
180.0
8.4
9.0
8.4
9.0
8.4
9.0
8.4
8.4
9.0
8.4
9.0
8.4
3.15
3.15
3.15
3.15
3.15
3.15
1.27
1.27
3.15
3.15
3.15
3.15
2.77
2.77
2.77
2.77
2.77
2.77
1.57
1.57
2.77
2.77
2.77
2.77
1.22
1.22
1.22
1.22
1.22
1.22
0.5
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q3
Q3
Q3
Q3
3000
3000
250
250
3000
250
0.5
3000
3000
250
1.22
1.22
1.22
1.22
250
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV5032AJDBZR
DRV5032AJDBZR
DRV5032AJDBZT
DRV5032AJDBZT
DRV5032AJDMRR
SOT-23
SOT-23
SOT-23
SOT-23
X2SON
DBZ
DBZ
DBZ
DBZ
DMR
3
3
3
3
4
3000
3000
250
180.0
183.0
183.0
180.0
203.0
180.0
183.0
183.0
180.0
203.0
18.0
20.0
20.0
18.0
35.0
250
3000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2020
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV5032AJDMRT
DRV5032DUDBZR
DRV5032DUDBZT
DRV5032DUDMRR
DRV5032DUDMRT
DRV5032FADBZR
DRV5032FADBZR
DRV5032FADBZT
DRV5032FADBZT
DRV5032FADMRR
DRV5032FADMRT
DRV5032FBDBZR
DRV5032FBDBZR
DRV5032FBDBZT
DRV5032FBDBZT
DRV5032FCDBZR
DRV5032FCDBZR
DRV5032FCDBZT
DRV5032FCDBZT
DRV5032FDDMRR
DRV5032FDDMRT
DRV5032ZEDBZR
DRV5032ZEDBZR
DRV5032ZEDBZT
DRV5032ZEDBZT
X2SON
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
X2SON
X2SON
SOT-23
SOT-23
SOT-23
SOT-23
DMR
DBZ
DBZ
DMR
DMR
DBZ
DBZ
DBZ
DBZ
DMR
DMR
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DMR
DMR
DBZ
DBZ
DBZ
DBZ
4
3
3
4
4
3
3
3
3
4
4
3
3
3
3
3
3
3
3
4
4
3
3
3
3
250
3000
250
203.0
183.0
183.0
203.0
203.0
180.0
183.0
183.0
180.0
203.0
203.0
183.0
180.0
202.0
180.0
183.0
180.0
202.0
180.0
203.0
203.0
180.0
183.0
180.0
183.0
203.0
183.0
183.0
203.0
203.0
180.0
183.0
183.0
180.0
203.0
203.0
183.0
180.0
201.0
180.0
183.0
180.0
201.0
180.0
203.0
203.0
180.0
183.0
180.0
183.0
35.0
20.0
20.0
35.0
35.0
18.0
20.0
20.0
18.0
35.0
35.0
20.0
18.0
28.0
18.0
20.0
18.0
28.0
18.0
35.0
35.0
18.0
20.0
18.0
20.0
3000
250
3000
3000
250
250
3000
250
3000
3000
250
250
3000
3000
250
250
3000
250
3000
3000
250
250
Pack Materials-Page 3
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DMR0004A
X2SON - 0.4 mm max height
SCALE 9.000
PLASTIC SMALL OUTLINE - NO LEAD
1.15
1.05
A
B
PIN 1 INDEX AREA
1.45
1.35
C
0.4 MAX
SEATING PLANE
0.08 C
0.05
0.00
2X 0.5
SYMM
2
3
EXPOSED
THERMAL PAD
5
SYMM
0.6±0.05
0.25
0.15
4X
PIN 1 ID
(OPTIONAL)
4
1
0.27
0.17
4X
0.8±0.05
0.1
C B
C
A
0.05
4222825/A 03/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.6)
(
0.2) VIA
2
3
SYMM
(0.8)
LAND PATTERN EXAMPLE
SCALE:35X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222825/A 03/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.57)
METAL
TYP
2
3
SYMM
(0.76)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4222825/A 03/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
S
C
A
L
E
1
.
3
0
0
TRANSISTOR OUTLINE
4.1
3.9
3.25
3.05
0.55
0.40
3X
5.05
MAX
3
1
3X (0.8)
3X
15.5
15.1
0.48
0.35
0.51
0.36
3X
3X
2X 1.27 0.05
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
1
3
2
0.86
0.66
(0.5425)
4221343/C 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
FULL R
TYP
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X ( 0.75) VIA
2X
METAL
(1.7)
2X (1.7)
2X
SOLDER MASK
OPENING
2
3
1
2X (1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221343/C 01/2018
www.ti.com
TAPE SPECIFICATIONS
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0
1
13.0
12.4
0
1
1 MAX
21
18
2.5 MIN
6.5
5.5
9.5
8.5
0.25
0.15
19.0
17.5
3.8-4.2 TYP
0.45
0.35
6.55
6.15
12.9
12.5
4221343/C 01/2018
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
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