DRV5057Z4QDBZT [TI]
DRV5057 Linear Hall Effect Sensor With PWM Output;
| 型号： | DRV5057Z4QDBZT |
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TEXAS INSTRUMENTS |
| 描述： | DRV5057 Linear Hall Effect Sensor With PWM Output |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DRV5057
SBAS646A – NOVEMBER 2018 – REVISED AUGUST 2020
DRV5057 Linear Hall Effect Sensor With PWM Output
1 Features
3 Description
•
•
•
•
PWM-output linear Hall effect magnetic sensor
The DRV5057 is a linear Hall effect sensor that
responds proportionally to magnetic flux density. The
device can be used for accurate position sensing in a
wide range of applications.
Operates from 3.3-V and 5-V power supplies
2-kHz clock output with 50% quiescent duty cycle
Magnetic sensitivity options (at VCC = 5 V):
– A1/Z1: 2%D/mT, ±21-mT range
– A2/Z2: 1%D/mT, ±42-mT range
– A3/Z3: 0.5%D/mT, ±84-mT range
– A4/Z4: 0.25%D/mT, ±168-mT range
Open-drain output with 20-mA sink capability
Compensation for magnet temperature drift for
A1/A2/A3/A4 Versions and None for Z1/Z2/Z3/Z4
Versions
The device operates from 3.3-V or 5-V power
supplies. When no magnetic field is present, the
output produces a clock with a 50% duty cycle. The
output duty cycle changes linearly with the applied
magnetic flux density, and four sensitivity options
maximize the output dynamic range based on the
required sensing range. North and south magnetic
poles produce unique outputs. The typical pulse-width
modulation (PWM) carrier frequency is 2 kHz.
•
•
•
Industry standard package:
– Surface-mount SOT-23
– Through-hole TO-92
Magnetic flux perpendicular to the top of the package
is sensed, and the two package options provide
different sensing directions.
2 Applications
Because the PWM signal is based on edge-to-edge
timing, signal integrity is maintained in the presence of
voltage noise or ground potential mismatch. This
signal is suitable for distance transmission in noisy
environments, and the always-present clock allows
the system controller to confirm there are good
interconnects. Additionally, the device features
magnet temperature compensation to counteract how
magnets drift for linear performance across a wide –
40°C to +125°C temperature range. Device options
for no temperature compensation of magnet drift are
also available.
•
•
•
•
•
•
•
•
•
Precise position sensing
Industrial automation and robotics
Home appliances
Gamepads, pedals, keyboards, triggers
Height leveling, tilt and weight measurement
Fluid flow rate measurement
Medical devices
Absolute angle encoding
Current sensing
Device Information
PART NUMBER
PACKAGE (1)
BODY SIZE (NOM)
2.92 mm × 1.30 mm
4.00 mm × 3.15 mm
SOT-23 (3)
TO-92 (3)
DRV5057
(1) For all available packages, see the package option
addendum at the end of the data sheet.
PWM
Output
VCC
VDD
Duty Cycle
DRV5057
VCC
Controller
8%
25%
38%
50%
69%
75%
92%
VOH
VOL
OUT
GPIO
GND
Time
North
0 mT
South
Magnetic Field
Typical Schematic
Magnetic Response
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5057
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SBAS646A – NOVEMBER 2018 – REVISED AUGUST 2020
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 Specifications.................................................................. 3
6.1 Absolute Maximum Ratings........................................ 3
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................4
6.6 Magnetic Characteristics.............................................4
6.7 Typical Characteristics................................................6
7 Detailed Description......................................................10
7.1 Overview...................................................................10
7.2 Functional Block Diagram.........................................10
7.3 Feature Description...................................................10
7.4 Device Functional Modes..........................................13
8 Application and Implementation..................................14
8.1 Application Information............................................. 14
8.2 Typical Applications.................................................. 15
8.3 What to Do and What Not to Do............................... 22
9 Power Supply Recommendations................................23
10 Layout...........................................................................23
10.1 Layout Guidelines................................................... 23
10.2 Layout Examples ................................................... 23
11 Device and Documentation Support..........................24
11.1 Documentation Support.......................................... 24
11.2 Receiving Notification of Documentation Updates..24
11.3 Support Resources................................................. 24
11.4 Trademarks............................................................. 24
11.5 Electrostatic Discharge Caution..............................24
11.6 Glossary..................................................................24
12 Mechanical, Packaging, and Orderable
Information.................................................................... 24
4 Revision History
Changes from Revision * (November 2018) to Revision A (August 2020)
Page
•
•
•
•
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Added Zero TC sensitivity options .....................................................................................................................1
Added Zero TC information to Section 6.6 ........................................................................................................ 4
Fixed labels for some of the plots for graphs for DRV5057 A1/A2/A3/A4 devices and added Zero TC
characteristics plots for DRV5057 Z1/Z2/Z3/Z4 devices in Section 6.7 .............................................................6
Updated Section 7.3.4 section for Zero TC options..........................................................................................12
•
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5 Pin Configuration and Functions
VCC
1
2
3
GND
OUT
Not to scale
Figure 5-1. DBZ Package 3-Pin SOT-23 Top View
1
2
3
VCC GND OUT
Figure 5-2. LPG Package 3-Pin TO-92 Top View
Pin Functions
PIN
TYPE
DESCRIPTION
NAME SOT-23
TO-92
GND
OUT
VCC
3
2
1
2
3
1
Ground Ground reference
Output Analog output
Power Power supply. Connect this pin to a ceramic capacitor to ground with a value of at least 0.01 µF.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
MAX UNIT
VCC
Power supply voltage
Output voltage
VCC
7
6
V
V
OUT
OUT
Output current
30
mA
T
B
Magnetic flux density
Operating junction temperature
Storage temperature
Unlimited
–40
TJ
150
150
°C
°C
Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
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6.2 ESD Ratings
VALUE
±3000
±750
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
3.63
UNIT
3
VCC
Power-supply voltage(1)
V
4.5
0
5.5
5.5
20
VO
IO
Output pullup voltage
V
Output continuous current
Operating ambient temperature(2)
0
mA
°C
TA
–40
125
(1) There are two isolated operating VCC ranges. For more information see the Section 7.3.3 section.
(2) Power dissipation and thermal limits must be observed.
6.4 Thermal Information
DRV5057
THERMAL METRIC(1)
SOT-23 (DBZ)
TO-92 (LPG)
UNIT
3 PINS
170
66
3 PINS
121
67
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
RθJB
ΨJT
ΨJB
Junction-to-board thermal resistance
49
97
Junction-to-top characterization parameter
Junction-to-board characterization parameter
1.7
7.6
48
97
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mA
ms
ICC
tON
fPWM
DJ
Operating supply current
Power-on time (see Figure 7-4)(2)
PWM carrier frequency
6
10
B(1) = 0 mT, no load on OUT
0.6
2.0
±0.1
0.9
2.2
1.8
kHz
%D(1)
nA
Duty cycle peak-to-peak jitter
From change in B to change in OUT
IOZ
High-impedance output leakage current VCC = 5 V
Low-level output voltage IOUT = 20 mA
100
0.4
VOL
0.15
V
(1) This unit is a percentage of duty cycle.
(2) tON is the time from when VCC goes above 3 V until the first rising edge of the first valid pulse.
6.6 Magnetic Characteristics
for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
DL
Linear duty cycle range
8
92 %D(1)
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for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
Clamped-low duty cycle
Clamped-high duty cycle
Quiescent duty cycle(2)
TEST CONDITIONS
B(1) < –250 mT
MIN
TYP
MAX UNIT
DCL
DCH
DQ
5.3
6
6.7
%D
94.7
B > 250 mT
93.3
46
94
50
B = 0 mT, TA = 25°C, VCC = 3.3 V or 5 V
54
%D
%
High-temperature operating stress for
1000 hours
VQΔL Quiescent duty cycle lifetime drift
< 0.5
DRV5057A1/Z1
1.88
0.94
0.47
0.23
1.13
0.56
0.28
0.138
2
1
2.12
1.06
0.53
0.27
1.27
0.64
0.32
0.162
DRV5057A2/Z2
DRV5057A3/Z3
DRV5057A4/Z4
DRV5057A1/Z1
DRV5057A2/Z2
DRV5057A3/Z3
DRV5057A4/Z4
DRV5057A1/Z1
DRV5057A2/Z2
DRV5057A3/Z3
DRV5057A4/Z4
VCC = 5 V,
TA = 25°C
0.5
0.25
1.2
S
Sensitivity(5)
%D/mT
0.6
VCC = 3.3 V,
TA = 25°C
0.3
0.15
±21
±42
±84
±168
Linear magnetic flux density sensing
range(2) (3) (5)
VCC = 5 V,
TA = 25°C
BL
mT
Sensitivity temperature compensation DRV5057A1, DRV5057A2, DRV5057A3,
for magnets(4)
DRV5057A4
STC
0.12
%/°C
Sensitivity temperature compensation DRV5057Z1, DRV5057Z2, DRV5057Z3,
STCz
SLE
0
±1
±1
%/°C
%
for magnets(4) (5)
DRV5057Z4
Sensitivity linearity error(2)
Output duty cycle is within DL
Sensitivity error over operating VCC
range
RSE
Output duty cycle is within DL
%
Quiescent error over operating VCC
range
SΔL
< 0.5
%
(1) B is the applied magnetic flux density.
(2) See the Section 7.3.2 section.
(3) BL describes the minimum linear sensing range at 25°C taking into account the maximum VQ and sensitivity tolerances.
(4) STC describes the rate the device increases Sensitivity with temperature. For more information, see the Section 7.3.4 section and
Figure 6-7 to Figure 6-20.
(5) Product Preview data only for DRV5055Z1 - DRV5055Z4 device options.
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6.7 Typical Characteristics
for TA = 25°C (unless otherwise noted)
2.2
2
2.2
2
5057Z1
5057Z2
5057Z3
5057Z4
5057A1
5057A2
5057A3
5057A4
1.8
1.6
1.4
1.2
1
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5
Supply (V)
4.5 4.6 4.7 4.8 4.9
5
Supply (V)
5.1 5.2 5.3 5.4 5.5
D010
VCC = 5.0 V
VCC = 5.0 V
Figure 6-2. Sensitivity vs Supply Voltage
Figure 6-1. Sensitivity vs Supply Voltage
1.3
1.2
1.3
1.2
1.1
1
1.1
5057Z1
5057Z2
5057Z3
5057Z4
5057A1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
5057A2
5057A3
5057A4
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
3
3.1
3.2
3.3
Supply (V)
3.4
3.5
3.6
3
3.1
3.2
3.3
Supply (V)
3.4
3.5
3.6
D011
VCC = 3.3 V
VCC = 3.3 V
Figure 6-4. Sensitivity vs Supply Voltage
Figure 6-3. Sensitivity vs Supply Voltage
10
10
VCC = 3.3 V
VCC = 5.0 V
VCC = 3.3 V
VCC = 5.0 V
9
9
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
D022
DRV5057Z1/Z2/Z3/Z4
DRV5057A1/A2/A3/A4
Figure 6-6. Supply Current vs Temperature
Figure 6-5. Supply Current vs Temperature
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2.5
2.25
2
2.5
2.25
2
+3STD
AVG
-3STD
1.75
1.5
1.25
1
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0.75
0.5
0.25
0
+3STD
AVG
-3STD
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057A1, VCC = 5.0 V
DRV5057A1, VCC = 3.3 V
Figure 6-7. Sensitivity vs Temperature
Figure 6-8. Sensitivity vs Temperature
2.5
2.5
2.25
2
2.25
2
1.75
1.5
1.25
1
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0.75
0.5
0.25
0
+3STD
AVG
-3STD
+3STD
AVG
-3STD
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057Z1, VCC = 5.0 V
DRV5057Z1, VCC = 3.3 V
Figure 6-9. Sensitivity vs Temperature
Figure 6-10. Sensitivity vs Temperature
1.5
1.4
1.3
1.2
1.1
1
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
+3STD
AVG
-3STD
+3STD
AVG
-3STD
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057A2, VCC = 5.0 V
DRV5057A2, VCC = 3.3 V
Figure 6-11. Sensitivity vs Temperature
Figure 6-12. Sensitivity vs Temperature
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1.5
1.4
1.3
1.2
1.1
1
1.5
1.4
1.3
1.2
1.1
1
+3STD
AVG
-3STD
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
+3STD
AVG
-3STD
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057Z2, VCC = 5.0 V
DRV5057Z2, VCC = 3.3 V
Figure 6-13. Sensitivity vs Temperature
Figure 6-14. Sensitivity vs Temperature
1
1
+3STD
AVG
-3STD
+3STD
AVG
-3STD
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057A3, VCC = 5.0 V
DRV5057A3, VCC = 3.3 V
Figure 6-15. Sensitivity vs Temperature
Figure 6-16. Sensitivity vs Temperature
1
1
+3STD
AVG
-3STD
+3STD
AVG
-3STD
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057Z3, VCC = 5.0 V
DRV5057Z3, VCC = 3.3 V
Figure 6-17. Sensitivity vs Temperature
Figure 6-18. Sensitivity vs Temperature
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0.5
0.45
0.4
0.5
0.45
0.4
+3STD
AVG
-3STD
+3STD
AVG
-3STD
0.35
0.3
0.35
0.3
0.25
0.2
0.25
0.2
0.15
0.1
0.15
0.1
0.05
0
0.05
0
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057A4, VCC = 5.0 V
DRV5057A4, VCC = 3.3 V
Figure 6-19. Sensitivity vs Temperature
Figure 6-20. Sensitivity vs Temperature
0.5
0.5
+3STD
AVG
-3STD
+3STD
AVG
-3STD
0.45
0.4
0.45
0.4
0.35
0.3
0.35
0.3
0.25
0.2
0.25
0.2
0.15
0.1
0.15
0.1
0.05
0
0.05
0
-40 -20
0
20
40
60
80 100 120 140
-40 -20
0
20
40
60
80 100 120 140
Temperature (èC)
Temperature (èC)
DRV5057Z4, VCC = 5.0 V
DRV5057Z4, VCC = 3.3 V
Figure 6-21. Sensitivity vs Temperature
Figure 6-22. Sensitivity vs Temperature
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7 Detailed Description
7.1 Overview
The DRV5057 is a 3-pin pulse-width modulation (PWM) output Hall effect sensor with fully integrated signal
conditioning, temperature compensation circuits, mechanical stress cancellation, and amplifiers. The device
operates from 3.3-V and 5-V (±10%) power supplies, measures magnetic flux density, and outputs a pulse-width
modulated, 2-kHz digital signal.
7.2 Functional Block Diagram
VCC
Element Bias
Bandgap
Reference
0 …F
Offset Cancellation
GND
Trim Registers
Temperature
Compensation
VCC
OUT
Precision
PWM Driver
Amplifier
7.3 Feature Description
7.3.1 Magnetic Flux Direction
As shown in Figure 7-1, the DRV5057 is sensitive to the magnetic field component that is perpendicular to the
top of the package.
TO-92
B
B
SOT-23
PCB
Figure 7-1. Direction of Sensitivity
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Magnetic flux that travels from the bottom to the top of the package is considered positive in this document. This
condition exists when a south magnetic pole is near the top (marked-side) of the package. Magnetic flux that
travels from the top to the bottom of the package results in negative millitesla values. Figure 7-2 shows flux
direction.
N
S
S
N
PCB
PCB
Figure 7-2. Flux Direction for Positive B
7.3.2 Sensitivity Linearity
The device produces a pulse-width modulated digital signal output. As shown in Figure 7-3, the duty-cycle of the
PWM output signal is proportional to the magnetic field detected by the Hall element of the device. If there is no
magnetic field present, the duty cycle is 50%. The DRV5057 can detect both magnetic north and south poles.
The output duty cycle maintains a linear relationship with the input magnetic field from 8% to 92%.
PWM
Output
Duty Cycle
8%
25%
38%
50%
69%
75%
92%
VOH
VOL
Time
North
0 mT
South
Magnetic Field
Figure 7-3. Magnetic Response
7.3.3 Operating VCC Ranges
The DRV5057 has two recommended operating VCC ranges: 3 V to 3.63 V and 4.5 V to 5.5 V. When VCC is in
the middle region between 3.63 V to 4.5 V, the device continues to function but sensitivity is less known because
there is a crossover threshold near 4 V that adjusts device characteristics.
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7.3.4 Sensitivity Temperature Compensation for Magnets
Magnets generally produce weaker fields as temperature increases. The DRV5057A1 - DRV5057A4 device
options have a temperature compensation feature that is designed to directly compensate the average drift of
neodymium (NdFeB) magnets and partially compensate ferrite magnets. The residual induction (Br) of a magnet
typically reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite. When the operating temperature of a system
is reduced, temperature drift errors are also reduced. The DRV5057Z1 - DRV5057Z4 devices options do not
compensate for the drift external magnets
7.3.5 Power-On Time
After the VCC voltage is applied, the DRV5057 requires a short initialization time before the output is set. The
parameter tON describes the time from when VCC crosses 3 V until OUT is within 5% of VQ, with 0 mT applied
and no load attached to OUT. Figure 7-4 shows this timing diagram.
VCC
3 V
tON
time
Output
95% × VQ
Invalid
time
Figure 7-4. tON Definition
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7.3.6 Hall Element Location
Figure 7-5 shows the location of the sensing element inside each package option.
SOT-23
Top View
SOT-23
Side View
centered
50 µm
650 µm
80 µm
TO-92
Top View
2 mm
2 mm
TO-92
Side View
1.54 mm
1.61 mm
50 µm
1030 µm
115 µm
Figure 7-5. Hall Element Location
7.4 Device Functional Modes
The DRV5057 has one mode of operation that applies when the Recommended Operating Conditions are met.
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Selecting the Sensitivity Option
Select the highest DRV5057 sensitivity option that can measure the required range of magnetic flux density so
that the output voltage swing is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a
magnet. TI created an online tool to help with simple magnet calculations on the DRV5057 product folder.
8.1.2 Decoding a PWM
A PWM output helps system designers drive signals for long distances in noisy environments, with the ability to
retrieve the signal accurately. A decoder is employed at the load to retrieve the analog magnetic signal. Two
different methods of decoding are discussed in this section.
8.1.2.1 Decoding a PWM (Digital)
8.1.2.1.1 Capture and Compare Timer Interrupt
Many microcontrollers have a capture and compare timer mode that can simplify the PWM decoding process.
Use the timer in capture and compare mode with an interrupt that triggers on both the rising and falling edges of
the signal to obtain both the relative high (on) and low (off) time of the PWM. Make sure that the timer period is
significantly faster than the period of the PWM, based on the desired resolution. Calculate the percent duty cycle
(%D) of the PWM with Equation 1 by using the relative on and off time of the signal.
OnTime
%D =
ì 100
OnTime + OffTime
8.1.2.1.2 Oversampling and Counting With a Timer Interrupt
(1)
If a capture and compare timer is not available, a standard timer interrupt and a counter can be used. Configure
the timer interrupt to be significantly faster than the period of the PWM, based on the desired resolution. Count
how many times the timer interrupts while the signal is high (OnTime), then count how many times the timer
interrupts while the signal is low (OffTime). Then use Equation 1 to calculate the duty cycle.
8.1.2.1.3 Accuracy and Resolution
The accuracy and resolution for the methods described in the Section 8.1.2.1.1 and Section 8.1.2.1.2 sections
depends significantly on the timer sampling frequency. Equation 2 calculates the least significant bit of the duty
cycle (%DLSB) based on the chosen timer sampling frequency.
PWMfrequency
%DLSB
=
ì 100
TIMER frequency
(2)
For example, with a 2-kHz PWM and a 400-kHz sampling frequency, the %DLSB is:
(2 kHz / 400 kHz) × 100 = 0.5%DLSB
If the sampling frequency in increased to 2-MHz, the %DLSB is improved to be:
(2 MHz / 400 kHz) × 100 = 0.1%DLSB
However, accuracy and resolution are still subject to noise and sensitivity.
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8.1.2.2 Decoding a PWM (Analog)
If an analog signal is needed at the end of a large travel distance, first use a microcontroller to digitally decode
the PWM, then use a DAC to produce the analog signal. If an analog signal is needed after a short signal travel
distance, use an analog output device, such as the DRV5055.
If an analog signal is needed at the end of a large travel distance and a microcontroller is unavailable, use a low-
pass filter to convert the PWM signal into an analog voltage, as shown in Figure 8-1. When using this method,
note the following:
•
A ripple appears at the analog voltage output, causing a decrease in accuracy. The ripple intensity and
frequency depend on the values chosen for R and C in the filter.
•
The minimum and maximum voltages of the PWM must be known to calculate the magnetic field strength
from the analog voltage. Thus, if the signal is traveling a large distance, then the minimum and maximum
values must be either measured or buffered back to a known value.
PWM Signal
Analog Signal
R
C
Figure 8-1. Low-Pass RC Filter
8.2 Typical Applications
The DRV557-Q1 is a very robust linear position sensor for applications such as throttle positions, brakes, and
clutch pedals. In linear position applications, depending on the mechanical placement and design limitations, two
common types of magnet orientations are selected: full-swing and half-swing.
8.2.1 Full-Swing Orientation Example
In the full-swing orientation, a magnet travels in parallel to the DRV5057-Q1 surface. In this case, the magnetic
range extends from south polarity to north polarity, and allows the DRV5057-Q1 to use the full linear magnetic
flux density sensing range.
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S
N
Figure 8-2. Full-Swing Orientation Example
8.2.1.1 Design Requirements
Use the parameters listed in Table 8-1 for this design example.
Table 8-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
DRV5057
5 V
Device
VCC
Cylinder: 4.7625-mm diameter, 12.7-mm thick,
neodymium N52, Br = 1480 mT
Magnet
Travel distance
10 mm
Desired accuracy
< 0.1 mm
8.2.1.2 Detailed Design Procedure
Linear Hall effect sensors provide flexibility in mechanical design because many possible magnet orientations
and movements produce a usable response from the sensor. Figure 8-2 illustrates one of the most common
orientations that uses the full north to south range of the sensor and causes a close-to-linear change in magnetic
flux density as the magnet moves across the sensor. Figure 8-3 illustrates the close-to-linear change in magnetic
field present at the sensor as the magnet moves a given distance across the sensor. The usable linear region is
close to but less than the length (thickness) of the magnet.
When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and the range of the sensor. Select the DRV5057 with the highest sensitivity possible based on the
system distance requirements without railing the sensor PWM output. To determine the magnetic flux density the
sensor receives at the various positions of the magnet, use a magnetic field calculator or simulation software,
referring to magnet specifications, and testing.
Determine if the desired accuracy is met by comparing the maximum allowed duty cycle least significant bit
(%DLSBmax) with the noise level (PWM jitter) of the device. Equation 3 calculates the %DLSBmax by taking into
account the used length of the linear region (travel distance), the desired resolution, and the output PWM swing
(within the linear duty cycle range).
%D swing
%DLSBmax
=
ì Resolution
Travel Distance
(3)
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Thus, with this example (and a linear duty cycle range of 8%D to 92%D), using Equation 3 gives (92 – 8) / (10) ×
0.1 = 0.84%DLSBmax. This value is larger than the 0.1%D jitter, and therefore the desired accuracy can be
achieved by using Equation 2 to select a %DLSB that is equal to or less than 0.84. Then, simply calibrate the
magnet position to align the sensor output along the movement path.
8.2.1.3 Application Curve
Figure 8-3 shows the magnetic field present at the sensor as the magnet passes by as described in Figure 8-2.
The change in distance from the trough to the peak is approximately the length (thickness) of the magnet. B
changes based on the strength of the magnet and how close the magnet is to the sensor.
5
-9
9
D015
Distance
Figure 8-3. Magnetic Field vs Distance
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8.2.2 Half-Swing Orientation Example
In the half-swing orientation, a magnet travels perpendicular to the DRV5057-Q1 surface. In this case, the
magnetic range extends only to either the south or north pole, using only half of the DRV5057-Q1 linear
magnetic flux density sensing range.
Mechanical Component
S
PCB
Figure 8-4. Half-Swing Orientation Example
8.2.2.1 Design Requirements
Use the parameters listed in Table 8-2 for this design example.
Table 8-2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
DRV5057
5 V
Device
VCC
Cylinder: 4.7625 mm diameter, 12.7 mm thick,
Neodymium N52, Br = 1480 mT
Magnet
Travel distance
5 mm
Desired accuracy
< 0.1 mm
8.2.2.2 Detailed Design Procedure
As illustrated in Figure 8-4, this design example consists of a mechanical component that moves back and forth,
an embedded magnet with the south pole facing the printed-circuit board, and a DRV5057. The DRV5057
outputs a PWM that describes the precise position of the component. The component must not contain
ferromagnetic materials such as iron, nickel, and cobalt because these materials change the magnetic flux
density at the sensor.
When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and the range of the sensor. Select the DRV5057 with the highest sensitivity possible based on the
system distance requirements without railing the sensor PWM output. To determine the magnetic flux density the
sensor receives at the various positions of the magnet, use a magnetic field calculator or simulation software,
referring to magnet specifications, and testing.
Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature,
absolute maximum temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) produced in 3-dimensional space. For simple
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magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet. Figure 8-5 shows diagrams for Equation 4 and Equation 5.
Thickness
Thickness
Width
Distance
Distance
Diameter
S
N
Length
S
N
B
B
Figure 8-5. Rectangular Block and Cylinder Magnets
Use Equation 4 for the rectangular block shown in Figure 8-5:
Br
Π( (
WL
2D 4D2 + W2 + L2
WL
2(D + T) 4(D + T)2 + W2 + L2
B =
arctan
œ arctan
) (
))
(4)
(5)
Use Equation 5 for the cylinder illustrated in Figure 8-5:
Br
2
D + T
(0.5C)2 + (D + T)2
D
B =
œ
(
)
(0.5C)2 + D2
where:
•
•
•
•
•
W is width
L is length
T is thickness (the direction of magnetization)
D is distance
C is diameter
This example uses a cylinder magnet; therefore, Equation 5 can be used to create a lookup table for the
distances from a specific magnet based on a magnetic field strength. Figure 8-6 shows a magnetic field from 0
mm to 16 mm with the magnet defined in Table 8-2 as C = 4.7625 mm, T = 12.7 mm, and Br = 1480 mT.
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
Distance (mm)
8
9
10 11 12 13 14 15 16
D009
Figure 8-6. Magnetic Field vs Distance
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In this setup, each gain version of the sensor produces the corresponding duty cycle shown in Figure 8-7 for
0 mm to 16 mm.
100
DRV5057A1
DRV5057A2
95
DRV5057A3
DRV5057A4
90
85
80
75
70
65
60
55
50
0
1
2
3
4
5
6
7
Distance (mm)
8
9
10 11 12 13 14 15 16
D008
Figure 8-7. %D vs South Pole Distance (All Gains)
With a desired 5-mm movement swing, select the DRV5057 with the largest possible sensitivity that fits the
system requirements for the magnet distance to the sensor. Assume that for this example, because of
mechanical restrictions, the magnet at the nearest point to the sensor must be selected to be within 5 mm to
8 mm. The largest sensitivity option (A1) does not work in this situation because the device output is railed at the
farthest allowed distance of 8 mm. The A2 version is not railed at this point, and is therefore the sensor selected
for this example. Choose the closest point of the magnet to the sensor to be a distance that allows the magnet to
get as close to the sensor as possible without railing but stays within the selectable 5-mm to 8-mm allowed
range. Because the A2 version rails at approximately 6 mm, choose a closest distance of 6.5 mm to allow for a
little bit of margin. With this choice, Figure 8-8 shows the %D response at the sensor across the full movement
range.
100
DRV5057A2
95
90
85
80
75
70
65
60
55
50
6.5
7
7.5
8
8.5
Distance (mm)
9
9.5 10 10.5 11 11.5
D007
Figure 8-8. %D vs South Pole Distance (Gain A2)
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The magnetic field strength is calculated using Equation 6, where a negative number represents the opposite
pole (in this example a south pole is over the sensor, causing the results to be a positive number).
%D - 50
(
)
B =
Gain
(6)
For example, if the A2 version of the DRV5057 measured a duty cycle of %D = 74.6% using Equation 1, then the
magnetic field strength present at the sensor is (74.6 – 50) / 1 = 24.6 mT.
Using the lookup table that was used to create the plot in Figure 8-6, the distance from the magnet at 24.6 mT is
D ≈ 8.2 mm.
For more accurate results, the lookup table can be calibrated along the movement path of the magnet.
Additionally, instead of using the calibrated lookup table for each measurement, consider using a best-fit
polynomial equation from the curve for the desired movement range to calculate D in terms of B.
The curve in Figure 8-8 is not linear; therefore, the achievable accuracy varies for each position along the
movement path. The location with the worst accuracy is where there is the smallest change in output for a given
amount of movement, which in this example is where the magnet is farthest from the sensor (at 11.5 mm).
Determine if the desired accuracy is met by checking if the needed %DLSB at this location for the specified
accuracy is greater than the noise level (PWM jitter) of 0.1%D. Thus, with a desired accuracy of 0.1 mm, the
needed %DLSB is the change in %D between 11.4 mm and 11.5 mm. Using the lookup table to find B and then
solving for %D in Equation 6, at 11.5 mm, B = 11.815 mT (which equates to 61.815%D), and at 11.4 mm B =
12.048 mT (which equates to 62.048%D). The difference in %D between these two points is 62.048 – 61.815 =
0.223%DLSB. This value is larger than the 0.1%D jitter, so the desired accuracy can be met as long as a %DLSB
is selected that is equal to or less than 0.223 using Equation 2.
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8.3 What to Do and What Not to Do
The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package. Therefore, to
correctly detect the magnetic field, make sure to use the correct magnet orientation for the sensor. Figure 8-9
shows correct and incorrect orientation.
CORRECT
N
S
S
N
N
S
INCORRECT
N
S
Figure 8-9. Correct and Incorrect Magnet Orientation
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9 Power Supply Recommendations
Use a decoupling capacitor placed close to the device to provide local energy with minimal inductance. Use a
ceramic capacitor with a value of at least 0.01 µF.
10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the
opposite side possible.
10.2 Layout Examples
VCC
GND
VCC
GND
OUT
OUT
Figure 10-1. Layout Examples
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
•
•
•
Texas Instruments, Using Linear Hall Effect Sensors to Measure Angle tech note
Texas Instruments, Incremental Rotary Encoder Design Considerations tech note
Texas Instruments, DRV5055 Ratiometric Linear Hall Effect Sensor data sheet
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
DBZ
DBZ
LPG
LPG
DBZ
DBZ
LPG
LPG
DBZ
DBZ
LPG
LPG
DBZ
DBZ
LPG
LPG
Qty
3000
250
(1)
(2)
(3)
(4/5)
(6)
DRV5057A1QDBZR
DRV5057A1QDBZT
DRV5057A1QLPG
DRV5057A1QLPGM
DRV5057A2QDBZR
DRV5057A2QDBZT
DRV5057A2QLPG
DRV5057A2QLPGM
DRV5057A3QDBZR
DRV5057A3QDBZT
DRV5057A3QLPG
DRV5057A3QLPGM
DRV5057A4QDBZR
DRV5057A4QDBZT
DRV5057A4QLPG
DRV5057A4QLPGM
ACTIVE
SOT-23
SOT-23
TO-92
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Green (RoHS
& no Sb/Br)
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
57A1
57A1
57A1
57A1
57A2
57A2
57A2
57A2
57A3
57A3
57A3
57A3
57A4
57A4
57A4
57A4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
TO-92
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
SOT-23
SOT-23
TO-92
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
TO-92
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
SOT-23
SOT-23
TO-92
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
1000
3000
3000
250
Green (RoHS
& no Sb/Br)
TO-92
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
SOT-23
SOT-23
TO-92
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
1000
3000
Green (RoHS
& no Sb/Br)
TO-92
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
3000
250
(1)
(2)
(3)
(4/5)
(6)
DRV5057Z1QDBZR
DRV5057Z1QDBZT
DRV5057Z2QDBZR
DRV5057Z2QDBZT
DRV5057Z3QDBZR
DRV5057Z3QDBZT
DRV5057Z4QDBZR
DRV5057Z4QDBZT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
3
3
3
3
3
3
3
3
Green (RoHS
& no Sb/Br)
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
57Z1
57Z1
57Z2
57Z2
57Z3
57Z3
57Z4
57Z4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBZ
Green (RoHS
& no Sb/Br)
SN
SN
SN
SN
SN
SN
SN
DBZ
3000
250
Green (RoHS
& no Sb/Br)
DBZ
Green (RoHS
& no Sb/Br)
DBZ
3000
250
Green (RoHS
& no Sb/Br)
DBZ
Green (RoHS
& no Sb/Br)
DBZ
3000
250
Green (RoHS
& no Sb/Br)
DBZ
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2020
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DRV5057 :
Automotive: DRV5057-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Aug-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV5057A1QDBZR
DRV5057A1QDBZT
DRV5057A2QDBZR
DRV5057A2QDBZT
DRV5057A3QDBZR
DRV5057A3QDBZT
DRV5057A4QDBZR
DRV5057A4QDBZT
DRV5057Z1QDBZR
DRV5057Z1QDBZT
DRV5057Z2QDBZR
DRV5057Z2QDBZT
DRV5057Z3QDBZR
DRV5057Z3QDBZT
DRV5057Z4QDBZR
DRV5057Z4QDBZT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Aug-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV5057A1QDBZR
DRV5057A1QDBZT
DRV5057A2QDBZR
DRV5057A2QDBZT
DRV5057A3QDBZR
DRV5057A3QDBZT
DRV5057A4QDBZR
DRV5057A4QDBZT
DRV5057Z1QDBZR
DRV5057Z1QDBZT
DRV5057Z2QDBZR
DRV5057Z2QDBZT
DRV5057Z3QDBZR
DRV5057Z3QDBZT
DRV5057Z4QDBZR
DRV5057Z4QDBZT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3000
250
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
213.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
S
C
A
L
E
1
.
3
0
0
TRANSISTOR OUTLINE
4.1
3.9
3.25
3.05
0.55
0.40
3X
5.05
MAX
3
1
3X (0.8)
3X
15.5
15.1
0.48
0.35
0.51
0.36
3X
3X
2X 1.27 0.05
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
1
3
2
0.86
0.66
(0.5425)
4221343/C 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
FULL R
TYP
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X ( 0.75) VIA
2X
METAL
(1.7)
2X (1.7)
2X
SOLDER MASK
OPENING
2
3
1
2X (1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221343/C 01/2018
www.ti.com
TAPE SPECIFICATIONS
LPG0003A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0
1
13.0
12.4
0
1
1 MAX
21
18
2.5 MIN
6.5
5.5
9.5
8.5
0.25
0.15
19.0
17.5
3.8-4.2 TYP
0.45
0.35
6.55
6.15
12.9
12.5
4221343/C 01/2018
www.ti.com
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
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