DRV8601_V01 [TI]
DRV8601 Haptic Driver for DC Motors (ERMs) and Linear Vibrators (LRAs) With Ultra-Fast Turnon;
| 型号： | DRV8601_V01 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DRV8601 Haptic Driver for DC Motors (ERMs) and Linear Vibrators (LRAs) With Ultra-Fast Turnon |
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DRV8601
SLOS629D –JULY 2010–REVISED OCTOBER 2016
DRV8601 Haptic Driver for DC Motors (ERMs) and Linear Vibrators (LRAs)
With Ultra-Fast Turnon
1 Features
3 Description
The DRV8601 is a single-supply haptic driver that is
optimized to drive a DC motor (also known as
Eccentric Rotating Mass or ERM in haptics
terminology) or a linear vibrator (also known as
Linear Resonant Actuator or LRA in haptics
terminology) using a single-ended PWM input signal.
With a fast turn-on time of 100 µs, the DRV8601 is an
excellent haptic driver for use in mobile phones and
other portable electronic devices.
1
•
High Current Output: 400 mA
•
Wide Supply Voltage Range (2.5 V to 5.5 V) for
Direct Battery Operation
•
•
•
•
•
•
•
Low Quiescent Current: 1.7 mA (Typical)
Fast Startup Time: 100 µs
Low Shutdown Current: 10 nA
Output Short-Circuit Protection
Thermal Protection
The DRV8601 drives up to 400 mA from
a
Enable Pin is 1.8-V Compatible
3.3-V supply. Near rail-to-rail output swing under load
ensures sufficient voltage drive for most DC motors.
Differential output drive allows the polarity of the
voltage across the output to be reversed quickly,
thereby enabling motor speed control in both
clockwise and counter-clockwise directions, allowing
quick motor stopping. A wide input voltage range
allows precise speed control of both DC motors and
linear vibrators.
Available in a 3-mm x 3-mm VQFN Package
(DRB) and 2-mm x 2-mm MicroStar Junior™
PBGA Package (ZQV)
2 Applications
•
•
•
•
•
Mobile Phones
Tablets
With a typical quiescent current of 1.7 mA and a
shutdown current of 10 nA, the DRV8601 is ideal for
portable applications. The DRV8601 has thermal and
output short-circuit protection to prevent the device
from being damaged during fault conditions.
Portable Gaming Consoles
Portable Navigation Devices
Appliance Consoles
Device Information(1)
PART NUMBER
PACKAGE
DRB (8)
ZQV (8)
BODY SIZE (NOM)
3.00 mm × 3.00 mm
2.00 mm × 2.00 mm
DRV8601
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
spacer
Block Diagram
Application
Processor
OUT-
REFOUT
OUT+
C
LRA or
ERM
IN1
IN2
EN
M
PWM2
GPIO
2.5 V œ 5.5 V
V
DD
C
(VDD)
GND
DRV8601
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8601
SLOS629D –JULY 2010–REVISED OCTOBER 2016
www.ti.com
Table of Contents
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Applications ............................................... 11
Power Supply Recommendations...................... 15
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Operating Characteristics.......................................... 5
6.7 Typical Characteristics.............................................. 5
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
8
9
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
11 Device and Documentation Support ................. 17
11.1 Receiving Notification of Documentation Updates 17
11.2 Community Resources.......................................... 17
11.3 Trademarks........................................................... 17
11.4 Electrostatic Discharge Caution............................ 17
11.5 Glossary................................................................ 17
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (January 2016) to Revision D
Page
•
•
•
•
Added the ZQV package to the Features list and the Device Information table .................................................................... 1
Added the ZQV pinout to the Pin Configuration and Functions section................................................................................. 3
Added ZQV values to the Thermal Information table ............................................................................................................. 4
Added Figure 20 .................................................................................................................................................................. 16
Changes from Revision B (January 2012) to Revision C
Page
•
Added ESD Rating table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
Changes from Revision A (May 2011) to Revision B
Page
•
Changed RI value from 49.9 kΩ to 100 kΩ in Conditions statement in Typical Characteristics............................................. 5
Changes from Original (July 2010) to Revision A
Page
•
•
•
Added the DRB package to the Features list ......................................................................................................................... 1
Updated Application Information section.............................................................................................................................. 11
Added polarity to motor in application diagrams in Figure 16, Figure 17, and Figure 18 .................................................... 11
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5 Pin Configuration and Functions
DRB Package
8-Pin VQFN
Top View
ZQV Package
8-Ball
Top View
1
2
3
4
8
7
6
5
EN
REFOUT
IN2
OUT–
GND
VDD
A
B
hÜÇ-
9b
ë55
Thermal
Pad
Db5
hÜÇ+
IN1
OUT+
C
w9ChÜÇ
Lb2
Lb1
1
2
3
Pin Functions
PIN
TYPE(1)
DESCRIPTION
DRB
NO.
ZQV
NO.
NAME
EN
1
7
4
3
5
8
2
6
B1
B2
C3
C2
B3
A1
C1
A3
I
Chip enable
GND
IN1
P
I
Ground
Input to driver
Input to driver
Positive output
Negative output
Reference voltage output
Supply voltage
IN2
I
OUT+
OUT–
REFOUT
VDD
O
O
O
P
(1) I = Input, O = Output, P = Power
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range, TA ≤ 25°C (unless otherwise noted)(1)
MIN
–0.3
–0.3
MAX
6
UNIT
V
VDD
VI
Supply voltage
Input voltage, INx, EN
VDD + 0.3
V
Output continuous total power dissipation
Operating free-air temperature
Operating junction temperature
Storage temperature
See Thermal Information
TA
–40
–40
–65
85
°C
°C
°C
TJ
150
150
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±4000
±1500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
2.5
NOM
MAX UNIT
VDD Supply voltage
5.5
V
V
VIH
VIL
TA
ZL
High-level input voltage
Low-level input voltage
EN
EN
1.15
0.5
85
V
Operating free-air temperature
Load impedance
–40
6.4
°C
Ω
6.4 Thermal Information
DRV8601
THERMAL METRIC(1)
DRB
ZQV
8 BALLS
78
UNIT
8 PINS
52.8
63
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
155
65
28.4
2.7
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
5
ψJB
28.6
11.4
50
RθJC(bot)
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
at TA = 25°C, Gain = 2 V/V, RL= 10 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Output offset voltage
(measured differentially)
|VOO
|
VI = 0 V, VDD = 2.5 V to 5.5 V
9
mV
VDD = 5.0 V, Io = 400 mA
VDD = 3.3 V, Io = 300 mA
VDD = 2.5 V, Io = 200 mA
VDD = 5.0 V, Io = 400 mA
VDD = 3.3 V, Io = 300 mA
VDD = 2.5 V, Io = 200 mA
–4.55
–2.87
–2.15
4.55
Negative differential output voltage
VIN+ = VDD, VIN– = 0 V or
VIN+ = 0 V, VIN– = VDD
VOD,N
V
(VOUT+–VOUT–
)
Positive differential output voltage
(VOUT+–VOUT–
VIN+ = VDD, VIN– = 0 V or
VIN+ = 0 V, VIN– = VDD
VOD,P
2.87
V
)
2.15
|IIH
|
High-level EN input current
Low-level EN input current
VDD = 5.5 V, VI = 5.8 V
VDD = 5.5 V, VI = –0.3 V
1.2
1.2
2
μA
μA
mA
μA
|IIL|
IDD(Q) Supply current
VDD = 2.5 V to 5.5 V, No load, EN = VIH
EN = VIL, VDD = 2.5 V to 5.5 V, No load
1.7
IDD(SD) Supply current in shutdown mode
0.01
0.9
6.6 Operating Characteristics
at TA = 25°C, Gain = 2 V/V, RL = 10 Ω (unless otherwise noted)
PARAMETER
Input impedance
Output impedance
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MΩ
kΩ
ZI
2
ZO
Shutdown mode (EN = VIL)
>10
6.7 Typical Characteristics
Table 1. Table of Graphs
FIGURE
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Output voltage (High)
Output voltage (Low)
Output voltage
Output voltage
Supply current
Shutdown supply current
Power dissipation
Slew rate
vs Load current
vs Load current
vs Input voltage, RL = 10 Ω
vs Input voltage, RL = 20 Ω
vs Supply voltage
vs Supply voltage
vs Supply voltage
vs Supply voltage
vs Time
Output transition
Startup
Figure 9, Figure 10
Figure 11
vs Time
Shutdown
vs Time
Figure 12
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6
5
4
3
2
1
0
0
−1
−2
−3
−4
−5
−6
VDD = 2.5 V
VDD = 3.3 V
VDD = 5 V
VDD = 2.5 V
VDD = 3.3 V
VDD = 5 V
−500m
−400m
−300m
−200m
−100m
0
0
100m
200m
300m
400m
500m
IOUT − Load Current − A
IOUT − Load Current − A
Figure 1. Output Voltage (High) vs Load Current
Figure 2. Output Voltage (Low) vs Load Current
5
4
5
4
VDD = 2.5 V
VDD = 3.3 V
VDD = 5 V
VDD = 2.5 V
VDD = 3.3 V
VDD = 5 V
3
3
2
2
1
1
0
0
−1
−2
−3
−4
−5
−1
−2
−3
−4
−5
RL = 10 Ω
RL = 20 Ω
0
1
2
3
4
5
0
1
2
3
4
5
VIN − Input Voltage − V
VIN − Input Voltage − V
Figure 3. Output Voltage vs Input Voltage
Figure 4. Output Voltage vs Input Voltage
3m
2m
1m
0
10n
8n
6n
4n
2n
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD − Supply Voltage − V
VDD − Supply Voltage − V
Figure 5. Supply Current vs Supply Voltage
Figure 6. Shutdown Supply Current vs Supply Voltage
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300m
250m
200m
150m
100m
50m
2.0
1.5
1.0
0.5
0.0
RL = 20Ω
RL = 10Ω
RL = 20 Ω
Differential Measurement
Saturated VOUT+ − VOUT−
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD − Supply Voltage − V
VDD − Supply Voltage − V
Figure 7. Power Dissipation vs Supply Voltage
Figure 8. Slew Rate vs Supply Voltage
4.0
3.0
2.0
1.0
0.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
RL = 20 Ω
VDD = 3.3 V
RL = 20 Ω
VDD = 5.0 V
OUT+
OUT−
OUT+
OUT−
0
1u
2u
3u
4u
5u
6u
7u
8u
9u
10u
0
1u
2u
3u
4u
5u
6u
7u
8u
9u
10u
t − Time − s
t − Time − s
Figure 9. Output Transition vs Time
Figure 10. Output Transition vs Time
RL = 20 Ω
VDD = 3.3 V
CR = 0.001 µF
EN
OUT−
EN
OUT−
4.0
3.0
2.0
1.0
0.0
4.0
3.0
2.0
1.0
0.0
RL = 20 Ω
VDD = 3.3 V
CR = 0.001 µF
0
100u
200u
300u
400u
500u
0
100u
200u
300u
400u
500u
t − Time − s
t − Time − s
Figure 11. Startup vs Time
Figure 12. Shutdown vs Time
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7 Detailed Description
7.1 Overview
DRV8601 is a single-supply haptic driver that is optimized to drive ERM or LRAs. DRV8601 can drive in both
clockwise and counter-clockwise directions, as well as stop the motor quickly. This is possible due to the fact that
outputs are driven differentially and are capable of driving or sinking current. DRV8601 also eliminates long
vibration tails which are undesirable in haptic feedback systems.
The DRV8601 can accept a single-ended PWM source or single-ended DC control voltage and perform single-
ended to differential conversion. A PWM signal is typically generated using software, and many different
advanced haptic sensations can be produced by inputting different types of PWM signals into the DRV8601.
7.2 Functional Block Diagram
Application
Processor
OUT-
REFOUT
OUT+
C
LRA or
ERM
IN1
IN2
EN
M
PWM2
GPIO
2.5 V œ 5.5 V
V
DD
C
(VDD)
GND
DRV8601
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Support for ERM and LRA Actuators
Linear vibrators (also known as Linear Resonant Actuators or LRA in haptics terminology) vibrate only at their
resonant frequency. Usually, linear vibrators have a high-Q frequency response, due to which there is a rapid
drop in vibration performance at offsets of 3 to 5 Hz from the resonant frequency. Therefore, while driving a
linear vibrator with the DRV8601, ensure that the commutation of the input PWM signal is within the prescribed
frequency range for the chosen linear vibrator. Vary the duty cycle of the PWM signal symmetrically above and
below 50% to vary the strength of the vibration. As in the case of DC motors, the PWM signal is typically
generated using software, and many different advanced haptic sensations can be produced by applying different
PWM signals into the DRV8601.
Duty Cycle = 25%
Duty Cycle = 75%
VPWM
0 V
1/fRESONANCE
VOUT, Average
Figure 13. LRA Example for 1/2 Full-Scale Drive
The DRV8601 is designed to drive a DC motor (also known as Eccentric Rotating Mass or ERM in haptics
terminology) in both clockwise and counter-clockwise directions, as well as to stop the motor quickly. This is
made possible because the outputs are fully differential and capable of sourcing and sinking current. This feature
helps eliminate long vibration tails which are undesirable in haptic feedback systems.
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Feature Description (continued)
Copyright © 2016, Texas Instruments Incorporated
Figure 14. Reversal of Direction of Motor Spin Using DRV8601
Another common approach to driving DC motors is the concept of overdrive voltage. To overcome the inertia of
the mass of the motor, they are often overdriven for a short amount of time before returning to the rated voltage
of the motor in order to sustain the rotation of the motor. The DRV8601 can overdrive a motor up to the VDD
voltage. Overdrive is also used to stop (or brake) a motor quickly. The DRV8601 can brake up to a voltage of
–VDD. For safe and reliable overdrive voltage and duration, refer to the data sheet of the motor.
7.3.2 Internal Reference
The internal voltage divider at the REFOUT pin of this device sets a mid-supply voltage for internal references
and sets the output common mode voltage to VDD/2. Adding a capacitor to this pin filters any noise into this pin
and increases the PSRR. REFOUT also determines the rise time of VO+ and VO when the device is taken out of
shutdown. The larger the capacitor, the slower the rise time. Although the output rise time depends on the
bypass capacitor value.
7.3.3 Shutdown Mode
DRV8601 has a shutdown mode which is controlled using the EN pin. EN pin is 1.8-V compatible. By pulling EN
pin low, the device enters low power state, consuming only 10 nA of shutdown current.
7.4 Device Functional Modes
DRV8601 is an analog input with differential output. DRV8601 does not require any digital interface to set up the
device. DRV8601 can be configured in various modes by configuring the device in differential or single ended
mode as described in Application and Implementation.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV8601 is intended to be used for haptic applications in a portable product that already has an application
processor with analog output interface. As DRV8601 accepts PWM input, it can be directly hooked up to the
processor GPIO and can drive PWM outputs.
2.5 V œ 5.5 V VDD
OUT+
IN1
+
LRA
M
or
ERM
œ
OUTœ
IN2
REFOUT
Bias
Circuitry
GND
EN
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Figure 15. Typical Application Block Diagram
DRV8601 can be operated in different instances as listed in Typical Applications which facilitates in the design
process for system engineers.
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8.2 Typical Applications
8.2.1 Pseudo-Differential Feedback with Internal Reference
Same Voltage as
PWM I/O Supply
CR
REFOUT
IN2
VDD
OUT-
+
LRA or
DC Motor
Shutdown
Control
DRV8601
EN
–
RI
SE PWM
IN1
OUT+
GND
RF
CF
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Figure 16. Pseudo-Differential Feedback with Internal Reference
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Typical Applications (continued)
8.2.1.1 Design Requirements
The parameters are located in Table 2.
Table 2. Design Parameters
PARAMETER
EXAMPLE
2.5 V – 5.5 V
PWM output
GPIO control
LRA or ERMs
Power supply
Host processor
Actuator type
8.2.1.2 Detailed Design Procedure
In the pseudo-differential feedback configuration (Figure 16), feedback is taken from only one of the output pins,
thereby reducing the number of external components required for the solution. The DRV8601 has an internal
reference voltage generator which keeps the REFOUT voltage at VDD/2. The internal reference voltage can be
used if and only if the PWM voltage is the same as the supply voltage of the DRV8601 (if VPWM = VDD, as
assumed in this section).
Having VPWM= VDD ensures that there is no voltage signal applied to the motor at a PWM duty cycle of 50%. This
is a convenient way of temporarily stopping the motor without powering off the DRV8601. Also, this configuration
ensures that the direction of rotation of the motor changes when crossing a PWM duty cycle of 50% in both
directions. For example, if an ERM motor rotates in the clockwise direction at 20% duty cycle, it will rotate in the
counter-clockwise direction at 80% duty cycle at nearly the same speed.
Mathematically, the output voltage is given by Equation 1:
Vdd
2
R
1
æ
ö
F
V
= 2 ´
V
-
´
´
O,DIFF
IN
ç
÷
R
1 + sR C
è
ø
I
F
F
where
•
•
sRFCF is the Laplace Transform variable
VIN is the single-ended input voltage
(1)
RF is normally set equal to RI (RF = RI) so that an overdrive voltage of VDD is achieved when the PWM duty cycle
is set to 100%. The optional feedback capacitor, CF, forms a low-pass filter together with the feedback resistor
RF, and therefore, the output differential voltage is a function of the average value of the input PWM signal.
When driving a motor, design the cutoff frequency of the low-pass filter to be sufficiently lower than the PWM
frequency in order to eliminate the PWM frequency and its harmonics from entering the motor. This is desirable
when driving motors which do not sufficiently reject the PWM frequency by themselves. When driving a linear
vibrator in this configuration, if the feedback capacitor CF is used, care must be taken to make sure that the low-
pass cutoff frequency is higher than the resonant frequency of the linear vibrator.
When driving motors which can sufficiently reject the PWM frequency by themselves, the feedback capacitor
may be eliminated. For this example, the output voltage is given by Equation 2:
Vdd
2
R
F
æ
ö
V
= 2 ´
V
-
´
O,DIFF
IN
ç
÷
R
è
ø
I
(2)
where the only difference from Equation 1 is that the filtering action of the capacitor is not present.
Table 3. Component Design Table
COMPONENT
VALUE
CR
RI
10 nF / 6.3 V
50 K / 0.01%
50 K / 0.01%
0.01 μF / 6.3 V
RF
CF
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8.2.1.3 Application Curves
Table 4 lists the application curves for this application and following applications from Typical Characteristics.
Table 4. Table of Graphs
FIGURE
Output voltage (High)
Output voltage (Low)
Output voltage
Output voltage
Supply current
Shutdown supply current
Power dissipation
Slew rate
vs Load current
vs Load current
vs Input voltage, RL = 10 Ω
vs Input voltage, RL = 20 Ω
vs Supply voltage
vs Supply voltage
vs Supply voltage
vs Supply voltage
vs Time
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Output transition
Startup
Figure 9, Figure 10
Figure 11
Figure 12
vs Time
Shutdown
vs Time
8.2.2 Pseudo-Differential Feedback with Level-Shifter
VDD
CR
VDD
REFOUT
IN2
EN
IN1
Shutdown
Control
OUT-
–
LRA or
DC Motor
2kΩ
DRV8601
+
RI
OUT+
10kΩ
GND
SE PWM
47kΩ
RF
CF
Copyright © 2016, Texas Instruments Incorporated
Figure 17. Pseudo-Differential Feedback with Level-Shifter
8.2.2.1 Design Requirements
The parameters are located in Table 5.
Table 5. Design Parameters
PARAMETER
EXAMPLE
2.5 V – 5.5 V
PWM output
GPIO control
LRA or ERMs
Power supply
Host processor
Actuator type
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8.2.2.2 Detailed Design Procedure
This configuration is desirable when a regulated supply voltage for the DRV8601 (VDD) is availble, but that
voltage is different than the PWM input voltage (VPWM). A single NPN transistor can be used as a low-cost level
shifting solution. This ensures that VIN = VDD even when VPWM ≠ VDD. A regulated supply for the DRV8601 is still
recommended in this scenario. If the supply voltage varies, the PWM level shifter output will follow, and this will,
in turn, cause a change in vibration strength. However, if the variance is acceptable, the DRV8601 will still
operate properly when connected directly to a battery, for example. A 50% duty cycle will still translate to zero
vibration strength across the life cycle of the battery. RF is normally set equal to RI (RF = RI) so that an overdrive
voltage of VDD is achieved when the PWM duty cycle is set to 100%.
Table 6. Component Design Table
COMPONENT
VALUE
CR
RI
10 nF / 6.3 V
50 K / 0.01%
50 K / 0.01%
0.01 μF / 6.3 V
RF
CF
8.2.3 Differential Feedback With External Reference
C
R*Gain
2.5 V – 5.5 V
2*R
CR
REFOUT
VDD
2*R
IN2
EN
IN1
OUT-
+
LRA or
DC Motor
Shutdown
Control
DRV8601
–
R
OUT+
SE PWM
GND
R*Gain
C
Copyright © 2016, Texas Instruments Incorporated
Figure 18. Differential Feedback with External Reference
8.2.3.1 Design Requirements
The parameters are located in Table 7.
Table 7. Design Parameters
PARAMETER
EXAMPLE
2.5 V – 5.5 V
PWM output
GPIO control
1
Power supply
Host processor
Gain
Actuator type
LRA or ERMs
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DRV8601
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SLOS629D –JULY 2010–REVISED OCTOBER 2016
8.2.3.2 Detailed Design Procedure
This configuration is useful for connecting the DRV8601 to an unregulated power supply, most commonly a
battery. The gain can then be independently set so that the required motor overdrive voltage can be achieved
even when VPWM < VDD. This is often the case when VPWM = 1.8 V, and the desired overdrive voltage is 3.0 V or
above. Note that VDD must be greater than or equal to the desired overdrive voltage. A resistor divider can be
used to create a VPWM/2 reference for the DRV8601. If the shutdown control voltage is driven by a GPIO in the
same supply domain as VPWM, it can be used to supply the resistor divider as in Figure 18 so that no current is
drawn by the divider in shutdown.
In this configuration, feedback is taken from both output pins. The output voltage is given by Equation 3:
RF
V
PWM
1
æ
ö
VO,DIFF
=
V
-
´
´
IN
ç
÷
2
RI
1 + sRFCF
è
ø
where
•
•
sRFCF is the Laplace Transform variable
VIN is the single-ended input voltage
(3)
Note that this differs from Equation 1 for the pseudo-differential configuration by a factor of 2 because of
differential feedback. The optional feedback capacitor CF forms a low-pass filter together with the feedback
resistor RF, and therefore, the output differential voltage is a function of the average value of the input PWM
signal VIN. When driving a motor, design the cutoff frequency of the low-pass filter to be sufficiently lower than
the PWM frequency in order to eliminate the PWM frequency and its harmonics from entering the motor. This is
desirable when driving motors which do not sufficiently reject the PWM frequency by themselves. When driving a
linear vibrator in this configuration, if the feedback capacitor CF is used, care must be taken to make sure that the
low-pass cutoff frequency is higher than the resonant frequency of the linear vibrator.
When driving motors which can sufficiently reject the PWM frequency by themselves, the feedback capacitor
may be eliminated. For this example, the output voltage is given by Equation 4:
RF
V
PWM
æ
ö
VO,DIFF
=
V
-
´
IN
ç
÷
2
RI
è
ø
(4)
Where the only difference from Equation 3 is that the filtering action of the capacitor is not present.
8.2.3.2.1 Selecting Components
8.2.3.2.1.1 Resistors RI and RF
Choose RF and RI in the range of 20 kΩ to 100 kΩ for stable operation.
8.2.3.2.1.2 Capacitor CR
This capacitor filters any noise on the reference voltage generated by the DRV8601 on the REFOUT pin, thereby
increasing noise immunity. However, a high value of capacitance results in a large turn-on time. A typical value
of 1 nF is recommended for a fast turn-on time. All capacitors should be X5R dielectric or better.
Table 8. Component Design Table
COMPONENT
VALUE
CR
RI
10 nF / 6.3 V
50 K / 0.01%
50 K / 0.01%
0.01 μF / 6.3 V
RF
CF
9 Power Supply Recommendations
The DRV8601 device is designed to operate from an input-voltage supply range between 2.5 to 5.5 V. The
decoupling capacitor for the power supply should be placed closed to the device pin.
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10 Layout
10.1 Layout Guidelines
Use the following guidelines for the DRV8601 layout:
•
•
The decoupling capacitor for the power supply (VDD) should be placed closed to the device pin.
The REFOUT capacitor should be placed close to the device REFOUT pin.
10.2 Layout Example
Figure 19 shows a typical example of the layout for DRV8601. It is important that the power supply decoupling
caps and the REFOUT external capacitance be connected as close to the device as possible.
Dround
ëia
Figure 19. Typical Layout Example
Solder Paste Diameter:
0.28 mm
A1
B1
C1
A3
B3
C3
Solder Mask Diameter:
0.25 mm
B2
C2
Copper Trace Width:
0.38 mm
Figure 20. ZQV Land Pattern
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DRV8601
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SLOS629D –JULY 2010–REVISED OCTOBER 2016
11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
MicroStar Junior, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DRV8601DRBR
DRV8601DRBT
DRV8601NMBR
DRV8601ZQVR
ACTIVE
ACTIVE
ACTIVE
LIFEBUY
SON
SON
DRB
DRB
NMB
ZQV
8
8
8
8
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
8601
8601
HSMI
HSMI
NIPDAU
SNAGCU
SNAGCU
NFBGA
2500 RoHS & Green
2500 RoHS & Green
BGA
MICROSTAR
JUNIOR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2021
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Apr-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV8601DRBR
DRV8601DRBT
DRV8601NMBR
DRV8601ZQVR
SON
SON
DRB
DRB
NMB
ZQV
8
8
8
8
3000
250
330.0
180.0
330.0
330.0
12.4
12.4
8.4
3.3
3.3
2.3
2.3
3.3
3.3
2.3
2.3
1.1
1.1
1.4
1.4
8.0
8.0
4.0
4.0
12.0
12.0
8.0
Q2
Q2
Q1
Q1
NFBGA
2500
2500
BGA MI
CROSTA
R JUNI
OR
8.4
8.0
DRV8601ZQVR
BGA MI
CROSTA
R JUNI
OR
ZQV
8
2500
330.0
8.4
2.3
2.3
1.4
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Apr-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DRV8601DRBR
DRV8601DRBT
DRV8601NMBR
DRV8601ZQVR
SON
SON
DRB
DRB
NMB
ZQV
8
8
8
8
3000
250
367.0
210.0
338.1
338.1
367.0
185.0
338.1
338.1
35.0
35.0
20.6
20.6
NFBGA
2500
2500
BGA MICROSTAR
JUNIOR
DRV8601ZQVR
BGA MICROSTAR
JUNIOR
ZQV
8
2500
350.0
350.0
43.0
Pack Materials-Page 2
PACKAGE OUTLINE
NFBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
NMB0008A
A
2.1
1.9
B
BALL A1 CORNER
2.1
1.9
1 MAX
C
SEATING PLANE
0.12 C
BALL TYP
0.25
0.15
1
TYP
0.5 TYP
C
0.5 TYP
0.5 TYP
0.5 TYP
SYMM
1
B
A
TYP
0.35
0.25
8X Ø
1
2
3
0.15
0.05
C A B
C
SYMM
4224891/A 04/2019
NanoFree is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
NFBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
NMB0008A
(0.5) TYP
1
2
3
(0.5) TYP
A
B
SYMM
8X (Ø0.25)
C
SYMM
LAND PATTERN EXAMPLE
SCALE: 25X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
EXPOSED
METAL
(Ø 0.25)
SOLDER MASK
OPENING
EXPOSED
METAL
(Ø 0.25)
METAL
SOLDER MASK
OPENING
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224891/A 04/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer to Texas Instruments
Literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
NFBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
NMB0008A
(0.5) TYP
1
2
3
(0.5) TYP
A
B
SYMM
(R0.05)
C
8X ( 0.25)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.100 mm THICK STENCIL
SCALE: 25X
4224891/A 04/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
PACKAGE OUTLINE
DRB0008A
VSON - 1 mm max height
SCALE 4.000
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
DIM A
OPT 1
(0.1)
OPT 2
(0.2)
1.5 0.1
4X (0.23)
EXPOSED
THERMAL PAD
(DIM A) TYP
4
5
2X
1.95
1.75 0.1
8
1
6X 0.65
0.37
0.25
8X
PIN 1 ID
0.1
C A B
C
(OPTIONAL)
(0.65)
0.05
0.5
0.3
8X
4218875/A 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DRB0008A
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.5)
(0.65)
SYMM
8X (0.6)
(0.825)
8
8X (0.31)
1
SYMM
(1.75)
(0.625)
6X (0.65)
4
5
(R0.05) TYP
(
0.2) VIA
(0.23)
TYP
(0.5)
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4218875/A 01/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DRB0008A
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.65)
4X (0.23)
SYMM
METAL
TYP
8X (0.6)
4X
(0.725)
8
1
8X (0.31)
(2.674)
(1.55)
SYMM
6X (0.65)
4
5
(R0.05) TYP
(1.34)
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
84% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
4218875/A 01/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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