DS15BA101SDX/NOPB [TI]
具有可调输出电压的 1.5Gbps 差动缓冲器 | NGQ | 8 | -40 to 85;
| 型号： | DS15BA101SDX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有可调输出电压的 1.5Gbps 差动缓冲器 | NGQ | 8 | -40 to 85 放大器 光电二极管 |
| 文件： | 总12页 (文件大小：804K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
DS15BA101 1.5 Gbps Differential Buffer with Adjustable Output Voltage
Check for Samples: DS15BA101
1
FEATURES
DESCRIPTION
The DS15BA101 is a high-speed differential buffer for
cable driving, level translation, signal buffering, and
signal repeating applications. Its fully differential
signal path ensures exceptional signal integrity and
noise immunity and it drives both differential and
single-ended transmission lines at data rates in
excess of 1.5 Gbps.
2
•
•
•
•
•
•
•
Data Rates from DC to 1.5+ Gbps
Differential or Single-ended Input
Adjustable Output Amplitude
Single 3.3V Supply
Industrial -40°C to +85°C Temperature
Low Power: 150 mW (typ) at 1.5 Gbps
Space-saving 3 x 3 mm WSON-8 Package
Output voltage amplitude is adjustable via a single
external resistor for level translation and cable driving
applications into 50-ohm single-ended and 100-ohm
differential mode impedances.
APPLICATIONS
•
•
•
•
Cable Extension Applications
Level Translation
The DS15BA101 is powered from a single 3.3V
supply and consumes 150 mW (typ) at 1.5 Gbps. It
operates over the full −40°C to +85°C industrial
temperature range and is available in a space saving
3x3 mm WSON-8 package.
Signal Buffering and Repeating
Security Cameras
Typical Application
100-ohm Differential Cable
(i.e. CAT5e/6/7, Twinax)
LVDS
LVPECL
CML
50-ohm Coaxial Cable
(i.e. Belden 9914)
DS15BA101
DS15EA101
150 Mbps
to
Max Cable Loss ~ 35 dB @ 750 MHz
1.5 Gbps
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2013, Texas Instruments Incorporated
DS15BA101
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Supply Voltage
−0.5V to 3.6V
−0.3V to VCC+0.3V
28 mA
Input Voltage (all inputs)
Output Current
Storage Temperature Range
Junction Temperature
−65°C to +150°C
+150°C
Lead Temperature
(Soldering 4 Sec)
+260°C
+90.7°C/W
+41.2°C/W
5 kV
θJA WSON-8
θJC WSON-8
Package Thermal Resistance
ESD Rating (HBM)
ESD Rating (MM)
250V
(1) "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of "Electrical Characteristics" specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – GND):
3.3V ±5%
Operating Free Air Temperature (TA)
DS15BA101SD
−40°C to +85°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
Symbol Parameter
Conditions
See Note(3)
Reference
Min
0.8
Typ
Max
Units
V
VICM
Input Common Mode Voltage
IN+, IN-
VCC –
VID/2
VID
Differential Input Voltage Swing
Output Common Mode Voltage
100
2000
mVP−P
V
VOS
OUT+, OUT-
VCC –
VOUT/2
VOUT
Output Voltage
Single-ended, 25Ω load
RVO = 953Ω 1%,
400
mVP-P
Single-ended, 25Ω load
RVO = 487Ω 1%,
See Note(4)
800
45
mVP-P
mA
ICC
Supply Current
49
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to GND.
(2) Typical values are stated for VCC = +3.3V and TA = +25°C.
(3) Specification is ensured by characterization.
(4) Maximum ICC is measured at VCC = +3.465V and TA = +70°C.
2
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS15BA101
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1)
.
Symbol
DRMAX
tLHT
Parameter
Conditions
See Note(2)
20% – 80%(3)
Reference
IN+, IN-
Min
Typ
Max
Units
Maximum Data Rate
1.5
2.0
Gbps
Output Low to High Transition
Time
OUT+, OUT-
120
120
220
220
ps
ps
tHLT
Output High to Low Transition
Time
tPLHD
tPHLD
tTJ
Propagation Low to High Delay See Note(2)
Propagation High to Low Delay See Note(2)
0.95
0.95
1.10
1.10
26
1.35
1.35
ns
ns
Total Jitter
1.5 Gbps
psP-P
(1) Typical values are stated for VCC = +3.3V and TA = +25°C.
(2) Specification is ensured by characterization.
(3) Specification is ensured by characterization and verified by test.
CONNECTION DIAGRAM
IN+
IN-
OUT+
OUT-
GND
VCC
1
2
3
4
8
7
6
5
DAP
GND
(GND)
R
VO
Figure 1. 8-Pad WSON
See NGQ Package
PIN DESCRIPTIONS
Pin #
Name
Description
1
2
3
4
5
6
7
8
IN+
Non-inverting input pin.
IN-
Inverting input pin.
GND
RVO
Circuit common (ground reference).
Output voltage amplitude control. Connect a resistor to VCC to set output voltage.
Positive power supply (+3.3V).
VCC
GND
OUT-
OUT+
Circuit common (ground reference).
Inverting output pin.
Non-inverting output pin.
Copyright © 2006–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS15BA101
DS15BA101
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
www.ti.com
DEVICE OPERATION
INPUT INTERFACING
The DS15BA101 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple
AC or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. The IN+ and IN-
pins are self-biased at approximately 2.1V with VCC = 3.3V. The following three figures illustrate typical DC-
coupled interface to common differential drivers.
100W Differential T-Line
OUT+
IN+
100W
LVDS
DS15BA101
IN-
OUT-
Figure 2. Typical LVDS Driver DC-Coupled Interface to DS15BA101 Input
CML3.3V or CML2.5V
V
CC
50W
50W
100W Differential T-Line
IN+
IN-
OUT+
OUT-
100W
DS15BA101
Figure 3. Typical CML Driver DC-Coupled Interface to DS15BA101 Input
100W Differential T-Line
OUT+
IN+
100W
DS15BA101
LVPECL
IN-
OUT-
50W
50W
Figure 4. Typical LVPECL Driver DC-Coupled Interface to DS15BA101 Input
OUTPUT INTERFACING
The DS15BA101 uses current mode outputs. Single-ended output levels are 400 mVP-P into AC-coupled 100Ω
differential cable (with RVO = 953Ω) or into AC-coupled 50Ω coaxial cable (with RVO = 487Ω). Output level is
controlled by the value of the RVO resistor connected between the RVO and VCC
.
The RVO resistor should be placed as close as possible to the RVO pin. In addition, the copper in the plane layers
below the RVO network should be removed to minimize parasitic capacitance. The following figure illustrates
typical DC-coupled interface to common differential receivers and assumes that the receivers have high
impedance inputs. While most receivers have a common mode input range that can accomodate CML signals, it
is recommended to check respective receiver's datasheet prior to implementing the suggested interface
implementation.
4
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS15BA101
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
V
CC
50W
50W
100W Differential T-Line
OUT+
IN+
CML or
LVPECL or
LVDS
100W
DS15BA101
IN-
OUT-
Figure 5. Typical DS15BA101 Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver
CABLE EXTENDER APPLICATION
The DS15BA101 together with the DS15EA101 form a cable extender chipset optimized for extending serial data
streams from serializer/deserializer (SerDes) pairs and field programmable gate arrays (FPGAs) over 100Ω
differential (i.e. CAT5e/6/7 and twinax) and 50Ω coaxial cables. Setting correct DS15BA101 output amplitude and
proper cable termination are keys for optimal operation. The following two figures show recommended chipset
configuration for 100Ω differential and 50Ω coaxial cables.
V
CC
V
CC
50W
50W
0.1 mF
953W
0.1 mF
100W Differential TP Cable
1 mF
1 mF
1 mF
1 mF
R
VO
IN+
IN-
OUT+
OUT-
IN+
OUT+
100W
100W
DS15BA101
DS15EA101
IN-
CAP+
OUT-
CAP-
1 mF
Figure 6. Cable Extender Chipset Connection Diagram for 100Ω Differential Cables
V
CC
V
CC
50W
50W
0.1 mF
487W
0.1 mF
50W Coaxial Cable
1 mF
1 mF
1 mF
R
VO
IN+
IN-
OUT+
OUT-
IN+
OUT+
100W
50W
DS15BA101
DS15EA101
IN-
CAP+
OUT-
CAP-
25W
1 mF
Figure 7. Cable Extender Chipset Connection Diagram for 50Ω Coaxial Cables
Copyright © 2006–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS15BA101
DS15BA101
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
www.ti.com
REFERENCE DESIGN
There is a complete reference design (P/N: DriveCable02EVK) available for evaluation of the cable extender
chipset (DS15BA101 and DS15EA101). For more information, visit http://www.ti.com/tool/drivecable02evk.
Typical Performance
Figure 8. 1.5 Gbps Differential DS15BA101 Output
Figure 9. 1.5 Gbps Single-ended DS15BA101 Output
RVO = 953Ω, H:100 ps / DIV, V:100 mV / DIV
RVO = 487Ω, H:100 ps / DIV, V:100 mV / DIV
Figure 10. 2.0 Gbps Differential DS15BA101 Output
Figure 11. 2.0 Gbps Single-ended DS15BA101 Output
RVO = 953Ω, H:100 ps / DIV, V:100 mV / DIV
RVO = 487Ω, H:100 ps / DIV, V:100 mV / DIV
6
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS15BA101
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision I (April 2013) to Revision J
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 2006–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: DS15BA101
PACKAGE OPTION ADDENDUM
www.ti.com
12-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS15BA101SD/NOPB
DS15BA101SDE/NOPB
DS15BA101SDX/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
WSON
WSON
WSON
NGQ
8
8
8
1000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
BA101
ACTIVE
ACTIVE
NGQ
NGQ
250
Green (RoHS
& no Sb/Br)
-40 to 85
BA101
BA101
4500
Green (RoHS
& no Sb/Br)
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS15BA101SD/NOPB
WSON
NGQ
NGQ
NGQ
8
8
8
1000
250
178.0
178.0
330.0
12.4
12.4
12.4
3.3
3.3
3.3
3.3
3.3
3.3
1.0
1.0
1.0
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
DS15BA101SDE/NOPB WSON
DS15BA101SDX/NOPB WSON
4500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS15BA101SD/NOPB
DS15BA101SDE/NOPB
DS15BA101SDX/NOPB
WSON
WSON
WSON
NGQ
NGQ
NGQ
8
8
8
1000
250
213.0
213.0
367.0
191.0
191.0
367.0
55.0
55.0
35.0
4500
Pack Materials-Page 2
MECHANICAL DATA
NGQ0008A
SDA08A (Rev A)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明