DS25BR150TSD/NOPB [TI]
3.125Gbps LVDS 缓冲器 | NGQ | 8 | -40 to 85;
| 型号： | DS25BR150TSD/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.125Gbps LVDS 缓冲器 | NGQ | 8 | -40 to 85 |
| 文件： | 总16页 (文件大小：482K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS25BR150
www.ti.com
SNLS257E –APRIL 2007–REVISED APRIL 2013
DS25BR150 3.125 Gbps LVDS Buffer
Check for Samples: DS25BR150
1
FEATURES
DESCRIPTION
The DS25BR150 is a single channel 3.125 Gbps
LVDS buffer optimized for high-speed signal
transmission over printed circuit boards and balanced
cables. Fully differential signal paths ensure
exceptional signal integrity and noise immunity.
2
•
DC - 3.125 Gbps Low Jitter, High Noise
Immunity, Low Power Operation
•
On-Chip 100 Ω Input and Output Termination
Minimizes Insertion and Return Losses,
Reduces Component Count and Minimizes
Board Space
The DS25BR150 is a buffer/repeater with very low
power consumption. Other LVDS devices with similar
IO characteristics and with signal conditioning
features include the following products. The
DS25BR110 features four levels of equalization for
use as an optimized receiver device, the DS25BR120
features four levels of pre-emphasis for use as an
optimized driver device, and the DS25BR100 features
both pre-emphasis and equalization for use as an
optimized repeater device.
•
•
7 kV ESD on LVDS I/O Pins Protects Adjoining
Components
Small 3 mm x 3 mm WSON-8 Space Saving
Package
APPLICATIONS
•
•
Clock or Data Buffering / Repeating
OC-48 / STM-16 Clock or Data Buffering /
Repeating
Wide input common mode range allows the receiver
to accept signals with LVDS, CML and LVPECL
levels; the output levels are LVDS. A very small
package footprint requires a minimal space on the
board while the flow-through pinout allows easy board
layout. The differential inputs and outputs are
internally terminated with a 100Ω resistor to lower
device input and output return losses, reduce
component count, and further minimize board space.
•
•
InfiniBand
FireWire
Typical Application
CML
LVDS
ASIC / FPGA
LVPECL
ASIC / FPGA
BR150
LVDS
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
DS25BR150
SNLS257E –APRIL 2007–REVISED APRIL 2013
www.ti.com
Block Diagram
IN+
IN-
OUT+
OUT-
Pin Diagram
NC
IN+
IN-
1
2
3
4
8
7
6
5
VCC
DAP
GND
OUT+
OUT-
NC
NC
WSON Package
PIN DESCRIPTION
Pin Name
NC
Pin Name
Pin Type
Pin Description
1
NA
"NO CONNECT" pin.
IN+
2
Input
Input
NA
Non-inverting LVDS input pin.
Inverting LVDS input pin.
"NO CONNECT" pin.
IN-
3
NC
4
NC
5
NA
"NO CONNECT" pin.
OUT-
OUT+
VCC
GND
6
Output
Output
Power
Power
Inverting LVDS output pin.
Non-inverting LVDS Output pin.
Power supply pin.
7
8
DAP
Ground pad (DAP - die attach pad)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: DS25BR150
DS25BR150
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SNLS257E –APRIL 2007–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC
)
−0.3V to +4V
−0.3V to +4V
1V
LVDS Input Voltage (IN+, IN−)
Differential Input Voltage |VID|
LVDS Output Voltage (OUT+, OUT−)
LVDS Differential Output Voltage ((OUT+) - (OUT−))
LVDS Output Short Circuit Current Duration
Junction Temperature
−0.3V to (VCC + 0.3V)
0V to 1V
5 ms
+150°C
Storage Temperature Range
−65°C to +150°C
+260°C
Lead Temperature Range
Soldering (4 sec.)
Maximum Package Power Dissipation at
25°C
NGQ Package
2.08W
Derate NGQ Package
16.7 mW/°C above +25°C
+60.0°C/W
+12.3°C/W
≥7 kV
Package Thermal Resistance
θJA
θJC
ESD Susceptibility
HBM(3)
MM(4)
CDM(5)
≥250V
≥1250V
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human Body Model, applicable std. JESD22-A114C
(4) Machine Model, applicable std. JESD22-A115-A
(5) Field Induced Charge Device Model, applicable std. JESD22-C101-C
Recommended Operating Conditions
Min
3.0
0
Typ
Max
3.6
1
Units
V
Supply Voltage (VCC
)
3.3
Receiver Differential Input Voltage (VID
)
V
Operating Free Air Temperature (TA)
−40
+25
+85
°C
DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVDS OUTPUT DC SPECIFICATIONS (OUT+, OUT-)
VOD
Differential Output Voltage
250
-35
350
450
35
mV
mV
V
RL = 100Ω
RL = 100Ω
ΔVOD
Change in Magnitude of VOD for Complimentary
Output States
VOS
Offset Voltage
1.05
-35
1.2
1.375
35
ΔVOS
Change in Magnitude of VOS for Complimentary
Output States
mV
IOS
Output Short Circuit Current(4)
OUT to GND
OUT to VCC
-25
7.5
1.2
100
-50
50
mA
mA
pF
Ω
COUT
ROUT
Output Capacitance
Any LVDS Output Pin to GND
Between OUT+ and OUT-
Output Termination Resistor
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD and ΔVOD
.
(3) Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Copyright © 2007–2013, Texas Instruments Incorporated
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SNLS257E –APRIL 2007–REVISED APRIL 2013
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVDS INPUT DC SPECIFICATIONS (IN+, IN-)
VID
Input Differential Voltage
0
1
V
mV
mV
V
VTH
VTL
Differential Input High Threshold
Differential Input Low Threshold
Common Mode Voltage Range
VCM = +0.05V or VCC-0.05V
VID = 100 mV
0
0
+100
−100
VCMR
0.05
VCC -
0.05
VIN = 3.6V or 0V
VCC = 3.6V or 0V
±1
±10
μA
IIN
Input Current
CIN
RIN
Input Capacitance
Any LVDS Input Pin to GND
Between IN+ and IN-
1.7
pF
Input Termination Resistor
100
Ω
SUPPLY CURRENT
ICC
Supply Current
27
35
mA
AC Electrical Characteristics(1)
Over recommended operating supply and temperature ranges unless otherwise specified.(2)(3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVDS OUTPUT AC SPECIFICATIONS (OUT+, OUT-)
tPHLD
tPLHD
tSKD1
tSKD2
tLHT
Differential Propagation Delay High to Low
370
355
15
520
520
100
160
150
150
ps
ps
ps
ps
ps
ps
RL = 100Ω
RL = 100Ω
Differential Propagation Delay Low to High
(4)
Pulse Skew |tPLHD − tPHLD
Part to Part Skew(5)
Rise Time
|
45
80
tHLT
Fall Time
80
JITTER PERFORMANCE (Figure 5)
tDJ1
VID = 350 mV
VCM = 1.2V
K28.5 (NRZ)
2.5 Gbps
11
15
33
41
ps
ps
Deterministic Jitter (Peak-to-Peak Value )(6)
tDJ2
3.125 Gbps
1.25 GHz
tRJ1
tRJ2
VID = 350 mV
VCM = 1.2V
Clock (RZ)
0.5
1
ps
Random Jitter (RMS Value)(7)
1.5625 GHz
2.5 Gbps
0.5
1
ps
tTJ1
tTJ2
VID = 350 mV
VCM = 1.2V
PRBS-23 (NRZ)
0.04
0.07
0.11
0.15
UIP-P
UIP-P
Total Jitter (Peak to Peak Value)(8)
3.125 Gbps
(1) Specification is ensured by characterization and is not tested in production.
(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(3) Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
(4) tSKD1, |tPLHD − tPHLD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
(5) tSKD2, Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This
specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
(6) Tested with a combination of the 1100000101 (K28.5+ character) and 0011111010 (K28.5- character) patterns. Input stimulus jitter is
subtracted algebraically.
(7) Measured on a clock edge with a histogram and an accumulation of 1500 histogram hits. Input stimulus jitter is subtracted geometrically.
(8) Measured on an eye diagram with a histogram and an accumulation of 3500 histogram hits. Input stimulus jitter is subtracted.
4
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Product Folder Links: DS25BR150
DS25BR150
www.ti.com
SNLS257E –APRIL 2007–REVISED APRIL 2013
DC TEST CIRCUITS
V
OH
OUT+
IN+
IN-
Power Supply
Power Supply
R
L
R
D
OUT-
V
OL
Figure 1. Differential Driver DC Test Circuit
AC Test Circuits and Timing Diagrams
OUT+
OUT-
IN+
IN-
Signal Generator
R
L
R
D
Figure 2. Differential Driver AC Test Circuit
Figure 3. Propagation Delay Timing Diagram
Figure 4. LVDS Output Transition Times
CHARACTERIZATION
BOARD
50W
Microstrip
50W
Microstrip
DS25BR150
L=4"
L=4"
PATTERN
GENERATOR
OSCILLOSCOPE
L=4"
L=4"
50W
Microstrip
50W
Microstrip
Figure 5. Jitter Measurements Test Circuit
Copyright © 2007–2013, Texas Instruments Incorporated
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DS25BR150
SNLS257E –APRIL 2007–REVISED APRIL 2013
Device Operation
www.ti.com
INPUT INTERFACING
The DS25BR150 accepts differential signals and allows simple AC or DC coupling. With a wide common mode
range, the DS25BR150 can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The
following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the
DS25BR150 inputs are internally terminated with a 100Ω resistor.
100W Differential T-Line
IN+
OUT+
LVDS
DS25BR150
OUT-
IN-
Figure 6. Typical LVDS Driver DC-Coupled Interface to DS25BR150 Input
CML3.3V or CML2.5V
V
CC
50W
50W
100W Differential T-Line
IN+
IN-
OUT+
OUT-
DS25BR150
Figure 7. Typical CML Driver DC-Coupled Interface to DS25BR150 Input
LVPECL
Driver
LVDS
Receiver
100W Differential T-Line
IN+
IN-
OUT+
100W
OUT-
150-250W
150-250W
Figure 8. Typical LVPECL Driver DC-Coupled Interface to DS25BR150 Input
OUTPUT INTERFACING
The DS25BR150 outputs signals are compliant to the LVDS standard. It can be DC-coupled to most common
differential receivers. The following figure illustrates typical DC-coupled interface to common differential receivers
and assumes that the receivers have high impedance inputs. While most differential receivers have a common
mode input range that can accommodate LVDS compliant signals, it is recommended to check the respective
receiver's data sheet prior to implementing the suggested interface implementation.
6
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Product Folder Links: DS25BR150
DS25BR150
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SNLS257E –APRIL 2007–REVISED APRIL 2013
100W Differential T-Line
OUT+
IN+
IN-
CML or
LVPECL or
LVDS
DS25BR150
100W
OUT-
Figure 9. Typical DS25BR150 Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver
Copyright © 2007–2013, Texas Instruments Incorporated
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DS25BR150
SNLS257E –APRIL 2007–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
60
V
= 3.3V
CC
T
= 25°C
A
50
40
NRZ PRBS-7
2.5 Gbps
V
= 1.0V
ICM
30
20
V
= 2.4V
0.85
ICM
10
0
0.25
0.40
0.55
0.70
1.00
DIFFERENTIAL INPUT VOLTAGE (V)
Figure 10. A 2.5 Gbps NRZ PRBS-7 Output Eye Diagram
V:100 mV / DIV, H:75 ps / DIV
Figure 11. Total Jitter as a Function of Input Amplitude
60
V
= 3.3V
CC
T
= 25°C
A
50
40
NRZ PRBS-7
3.125 Gbps
V
= 1.0V
ICM
30
V
ICM
= 2.4V
20
10
0
0.25
0.40
0.55
0.70
0.85
1.00
DIFFERENTIAL INPUT VOLTAGE (V)
Figure 12. A 3.125 Gbps NRZ PRBS-7 Output Eye Diagram
V:100 mV / DIV, H:50 ps / DIV
Figure 13. Total Jitter as a Function of Input Amplitude
8
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Product Folder Links: DS25BR150
DS25BR150
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SNLS257E –APRIL 2007–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DS25BR150TSD/NOPB
ACTIVE
WSON
NGQ
8
1000 RoHS & Green
SN
Level-3-260C-168 HR
-40 to 85
2R150
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS25BR150TSD/NOPB WSON
NGQ
8
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
WSON NGQ
SPQ
Length (mm) Width (mm) Height (mm)
208.0 191.0 35.0
DS25BR150TSD/NOPB
8
1000
Pack Materials-Page 2
PACKAGE OUTLINE
NGQ0008A
WSON - 0.8 mm max height
SCALE 4.000
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
3.1
2.9
C
0.8
0.7
SEATING PLANE
0.08 C
1.6 0.1
SYMM
(0.1) TYP
0.05
0.00
EXPOSED
THERMAL PAD
4
5
8
SYMM
9
2X
2
0.1
1.5
1
6X 0.5
0.3
0.2
8X
0.1
C A B
C
0.5
0.3
PIN 1 ID
8X
0.05
4214922/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
NGQ0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
SYMM
8X (0.6)
1
8
(0.75)
8X (0.25)
9
SYMM
(2)
6X (0.5)
5
4
(R0.05) TYP
(
0.2) VIA
TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214922/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
NGQ0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.6)
SYMM
METAL
TYP
9
8
1
8X (0.25)
SYMM
(1.79)
6X (0.5)
5
4
(R0.05) TYP
(1.47)
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 9:
82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214922/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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