DS26LS31N [TI]
DS26LS31C/DS26LS31M Quad High Speed Differential Line Driver; DS26LS31C / DS26LS31M四路高速差分线路驱动器
| 型号： | DS26LS31N |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS26LS31C/DS26LS31M Quad High Speed Differential Line Driver |
| 文件： | 总13页 (文件大小：885K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS26LS31C, DS26LS31M
www.ti.com
SNOSBK1C –JUNE 1998–REVISED APRIL 2013
DS26LS31C/DS26LS31M Quad High Speed Differential Line Driver
Check for Samples: DS26LS31C, DS26LS31M
1
FEATURES
DESCRIPTION
The DS26LS31 is a quad differential line driver
2
•
•
•
•
•
Output Skew—2.0 ns Typical
designed for digital data transmission over balanced
lines. The DS26LS31 meets all the requirements of
EIA Standard RS-422 and Federal Standard 1020. It
is designed to provide unipolar differential drive to
twisted-pair or parallel-wire transmission lines.
Input to output delay—10 ns Typical
Operation from Single 5V Supply
Outputs Won't Load Line when VCC = 0V
Four Line Drivers in One Package for
Maximum Package Density
The circuit provides an enable and disable function
common to all four drivers. The DS26LS31 features
•
•
•
Output Short-Circuit Protection
Complementary Outputs
TRI-STATE
outputs
and
logically
ANDed
complementary outputs. The inputs are all LS
compatible and are all one unit load.
Meets the Requirements of EIA Standard RS-
422
•
•
Pin Compatible with AM26LS31
Available in Military and Commercial
Temperature Range
Logic and Connection Diagrams
Top View
For Complete Military Product Specifications, refer to the appropriate SMD or MDS.
Figure 1. PDIP Package
See Package D0016A or NFG0016E
See Package Numbers NAJ0020A, NFE0016A or NAD0016A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS26LS31C, DS26LS31M
SNOSBK1C –JUNE 1998–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
7V
7V
Input Voltage
Output Voltage
5.5V
Output Voltage (Power OFF)
Maximum Power Dissipation (3) at 25°C
Cavity Package
−0.25 to 6V
1509 mW
1476 mW
1051 mW
NFG0016E Package
D0016A Package
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the devices should be operated at these limits. The Electrical Characteristics provide conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Derate cavity package 10.1 mW/°C above 25°C; derate molded DIP package 11.9 mW/°C above 25°C; derate SO package 8.41 mW/°C
above 25°C.
Operating Conditions
Min
Max
Units
Supply Voltage, VCC
DS26LS31M
4.5
5.5
V
V
DS26LS31
4.75
5.25
Temperature, TA
DS26LS31M
−55
+125
+70
°C
°C
DS26LS31
0
Electrical Characteristics(1)(2)(3)
Parameter
Test Conditions
IOH = −20 mA
Min
Typ
Max
Units
V
VOH
VOL
VIH
VIL
IIL
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
2.5
IOL = 20 mA
0.5
V
2.0
V
0.8
−200
20
V
Input Low Current
VIN = 0.4V
VIN = 2.7V
VIN = 7V
−40
μA
μA
mA
μA
μA
V
IIH
Input High Current
II
Input Reverse Current
TRI-STATE Output Current
0.1
IO
VO = 2.5V
VO = 0.5V
IIN = −18 mA
20
−20
−1.5
−150
60
VCL
ISC
ICC
Input Clamp Voltage
Output Short-Circuit Current
Power Supply Current
−30
mA
mA
All Outputs Disabled or Active
35
(1) Unless otherwise specified min/max limits apply across the −55°C to +125°C temperature range for the DS726LS31M and across the
0°C to +70°C range for the DS26LS31. All typicals are given for V CC = 5V and TA = 25°C.
(2) All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground unless
otherwise specified.
(3) Only one output at a time should be shorted.
2
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M
www.ti.com
SNOSBK1C –JUNE 1998–REVISED APRIL 2013
Switching Characteristics
VCC = 5V, TA = 25°C
Parameter
Test Conditions
CL = 30 pF
Min
Typ
10
Max
15
Units
ns
tPLH
tPHL
Skew
tLZ
Input to Output
Input to Output
Output to Output
Enable to Output
Enable to Output
Enable to Output
Enable to Output
CL = 30 pF
10
15
ns
CL = 30 pF
2.0
15
6.0
35
ns
CL = 10 pF, S2 Open
CL = 10 pF, S1 Open
CL = 30 pF, S2 Open
CL = 30 pF, S1 Open
ns
tHZ
15
25
ns
tZL
20
30
ns
tZH
20
30
ns
AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS
S1 and S2 of load circuit are closed except where shown.
Figure 2. AC Test Circuit
f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns
Figure 3. Propagation Delays
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M
SNOSBK1C –JUNE 1998–REVISED APRIL 2013
www.ti.com
f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns
Figure 4. Enable and Disable Times
TYPICAL APPLICATIONS
RT is optional although highly recommended to reduce reflection.
Figure 5. Two-Wire Balanced System, RS-422
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M
www.ti.com
SNOSBK1C –JUNE 1998–REVISED APRIL 2013
Typical Performance Characteristics
DS26LS31CN Unloaded IC
vs
DS26LS31 ICC
vs VCC
Frequency
vs TA
vs TA
Figure 6.
Figure 7.
DS26LS31CN VOH
vs IOH
DS26LS31CN VOL
vs IOL
vs TA
vs TA
Figure 8.
Figure 9.
DS26LS31CN VOD
vs IO
vs TA
Figure 10.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS26LS31C DS26LS31M
DS26LS31C, DS26LS31M
SNOSBK1C –JUNE 1998–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 5
6
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS26LS31C DS26LS31M
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
AM26LS31PC
NRND
PDIP
NFG
16
25
TBD
Call TI
Call TI
0 to 70
DS26LS31CN
AM26LS31PC
DS26LS31CM
DS26LS31CM
DS26LS31CM
NRND
SOIC
SOIC
D
D
16
16
48
48
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
DS26LS31CM/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS26LS31CMX
NRND
SOIC
SOIC
D
D
16
16
2500
2500
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
DS26LS31CM
DS26LS31CM
DS26LS31CMX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS26LS31CN
DS26LS31CN/NOPB
DS26LS31N
NRND
ACTIVE
NRND
PDIP
PDIP
PDIP
NFG
NFG
NFG
16
16
16
25
25
25
TBD
Call TI
CU SN
Call TI
Call TI
Level-1-NA-UNLIM
Call TI
0 to 70
0 to 70
0 to 70
DS26LS31CN
AM26LS31PC
Pb-Free
(RoHS)
DS26LS31CN
AM26LS31PC
TBD
DS26LS31CN
AM26LS31PC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS26LS31CMX
SOIC
SOIC
D
D
16
16
2500
2500
330.0
330.0
16.4
16.4
6.5
6.5
10.3
10.3
2.3
2.3
8.0
8.0
16.0
16.0
Q1
Q1
DS26LS31CMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS26LS31CMX
SOIC
SOIC
D
D
16
16
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
DS26LS31CMX/NOPB
Pack Materials-Page 2
MECHANICAL DATA
NFG0016E
N16E (Rev G)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明