DS34LV87T [TI]
增强型 CMOS 四路差分线路驱动器;
| 型号： | DS34LV87T |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 增强型 CMOS 四路差分线路驱动器 驱动 驱动器 |
| 文件： | 总15页 (文件大小：928K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS34LV87T
www.ti.com
SNLS116D –JULY 2006–REVISED APRIL 2013
DS34LV87T Enhanced CMOS Quad Differential Line Driver
Check for Samples: DS34LV87T
1
FEATURES
DESCRIPTION
The DS34LV87T is a high speed quad differential
CMOS driver that meets the requirements of both
TIA/EIA-422-B and ITU-T V.11. The CMOS
DS34LV87T features low static ICC of 100 μA max
which makes it ideal for battery powered and power
conscious applications. The TRI-STATE enable, EN,
allows the device to be disabled when the device is
not in use to minimize power. The dual enable
scheme allows for flexibility in turning devices on or
off.
•
•
•
•
Meets TIA/EIA-422-B (RS-422) and ITU-T V.11
Recommendation
Interoperable With Existing 5V RS-422
Networks
Ensured VOD of 2V Min Over Operating
Conditions
Balanced Output Crossover for Low EMI
(Typical Within 40 mV of 50% Voltage Level)
•
•
•
•
Low Power Design (330 μW @ 3.3V Static)
ESD ≥ 7 kV on Cable I/O Pins (HBM)
Industrial Temperature Range
Protection diodes protect all the driver inputs against
electrostatic discharge. The driver and enable inputs
(DI and EN) are compatible with LVTTL and
LVCMOS devices. Differential outputs have the same
VOD (≥2V) ensure as the 5V version. The outputs
have enhanced ESD Protection providing greater
than 7 kV tolerance.
Ensured AC Parameter:
–
–
Maximum Driver Skew: 2 ns
Maximum Transition Time: 10 ns
•
•
Pin Compatible With DS26C31
Available in SOIC Packaging
TRUTH TABLE(1)
Connection Diagram
Enables
Input
DI
X
Outputs
EN
L
DO+
Z
DO−
Z
H
H
H
L
H
L
L
H
(1) L = Low logic state
X = Irrelevant
Figure 1. Dual-In-Line Package (Top View)
See Package Number D0016A
H = High logic state
Z = TRI-STATE
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS34LV87T
SNLS116D –JULY 2006–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Supply Voltage (VCC
)
−0.5V to +7V
−0.5V to VCC + 0.5V
−0.5V to VCC + 0.5V
±20 mA
Enable Input Voltage (EN)
Driver Input Voltage (DI)
Clamp Diode Current
DC Output Current, per pin
Driver Output Voltage
±150 mA
(Power Off: DO+, DO−)
−0.5V to +7V
Maximum Package Power Dissipation
@+25°C
D Package
1226 mW
9.8 mW/°C above +25°C
−65°C to +150°C
+260°C
Derate D Package
Storage Temperature Range
Lead Temperature Range (Soldering, 4 sec.)
ESD Ratings (HBM, 1.5k, 100 pF)
Driver Outputs
Other Pins
≥ 7 kV
≥ 2.5 kV
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the device should be operated at these limits. The table of Electrical Characteristics specifies conditions of device operation.
RECOMMENDED OPERATING CONDITIONS
Min
3.0
Typ
3.3
25
Max
3.6
Units
V
Supply Voltage (VCC
)
Operating Free Air
Temperature Range (TA)
DS34LV87T
−40
+85
°C
Input Rise and Fall Time
500
ns
2
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Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS34LV87T
DS34LV87T
www.ti.com
SNLS116D –JULY 2006–REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS(1)(2)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
VOD1
Parameter
Conditions
RL= ∞, (No Load)
Pin
Min
Typ
3.3
2.6
7
Max
Units
V
Output Differential Voltage
Output Differential Voltage
DO+,
DO−
4.0
VOD2
RL = 100Ω See Figure 2
2
V
ΔVOD2
Change in Magnitude of
Output Differential Voltage
−400
400
3.5
mV
VOD3
Output Differential Voltage
RL = 3900Ω (V.11), See
3.2
V
Figure 2(3)
VOC
Common Mode Voltage
RL = 100Ω See Figure 2
1.5
6
2
V
ΔVOC
Change in Magnitude of
Common Mode Voltage
−400
−40
400
mV
IOZ
TRI-STATE Leakage Current
Output Short Circuit Current
Output Leakage Current
VOUT = VCC or GND
Drivers Disabled
±0.5
±20
μA
ISC
VOUT = 0V
−70
−150
mA
VIN = VCC or GND(4)
IOFF
VCC= 0V, VOUT = 3V
0.03
100
−100
VCC
0.8
μA
μA
V
VCC = 0V, VOUT = −0.25V
−0.08
VIH
VIL
IIH
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Clamp Voltage
DI,
EN
2.0
GND
V
VIN= VCC
10
μA
μA
V
IIL
VIN = GND
−10
VCL
ICC
IIN = −18 mA
−1.5
Power Supply Current
No Load, VIN (all) = VCC or GND
VCC
100
μA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except differential voltages VOD1, VOD2, VOD3
.
(2) All typical values are given for VCC= 3.3V and TA = +25°C.
(3) This specification limit is for compliance with TIA/EIA-422-B and ITU-T V.11.
(4) Only one output shorted at a time. The output (true or complement) is configured High.
Copyright © 2006–2013, Texas Instruments Incorporated
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3
Product Folder Links: DS34LV87T
DS34LV87T
SNLS116D –JULY 2006–REVISED APRIL 2013
www.ti.com
SWITCHING CHARACTERISTICS(1)(2)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Min Typ Max Units
tPHLD
Differential Propagation Delay
High to Low
RL = 100Ω, CL = 50 pF
See Figure 3 and Figure 4
6
6
10.5
11
16
16
ns
ns
ns
tPLHD
tSKD
Differential Propagation Delay
Low to High
Differential Skew
0.5
2.0
|tPHLD–tPLHD
|
tSK1
tSK2
tTLH
Skew, Pin to Pin (same device)
Skew, Part to Part(3)
1.0
3.0
2.0
5.0
ns
ns
Differential Transition Time
Low to High (20% to 80%)
4.2
4.7
10
10
ns
ns
tTHL
Differential Transition Time
High to Low (80% to 20%)
tPHZ
tPLZ
tPZH
tPZL
fMAX
Disable Time High to Z
Disable Time Low to Z
See Figure 5 and Figure 6
12
9
20
20
32
32
ns
ns
Enable Time Z to High
Enable Time Z to Low
Maximum Operating Frequency(4)
22
22
32
ns
ns
MHz
(1) f = 1 MHz, tr and tf ≤ 6 ns (10% to 90%).
(2) See TIA/EIA-422-B specifications for exact test conditions.
(3) Devices are at the same VCC and within 5°C within the operating temperature range.
(4) All channels switching, output duty cycle criteria is 40%/60% measured at 50%. This parameter is ensured by design and
characterization.
4
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Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS34LV87T
DS34LV87T
www.ti.com
SNLS116D –JULY 2006–REVISED APRIL 2013
PARAMETER MEASUREMENT INFORMATION
Figure 2. Differential Driver DC Test Circuit
Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit
Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50%, Zo = 50Ω, tr ≤ 10 ns, tf ≤
10 ns.
CL includes probe and fixture capacitance.
Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms
Copyright © 2006–2013, Texas Instruments Incorporated
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5
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DS34LV87T
SNLS116D –JULY 2006–REVISED APRIL 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 5. Driver Single-Ended Tri-state Test Circuit
Figure 6. Driver Single-Ended Tri-state Waveforms
6
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Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS34LV87T
DS34LV87T
www.ti.com
SNLS116D –JULY 2006–REVISED APRIL 2013
TYPICAL APPLICATION INFORMATION
General application guidelines and hints for differential drivers and receivers may be found in the following
application notes:
•
•
Transmission Line Drivers and Receivers for TIA/EIA Standards RS-422 and RS-423(SNLA137)
A Comparison of Differential Termination Techniques(SNLA304)
Power Decoupling Recommendations:
Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 μF in
parallel with 0.01 μF at the power supply pin. A 10 μF or greater tantalum or electrolytic should be connected at
the power entry point on the printed circuit board.
RT is optional although highly recommended to reduce reflection
Figure 7. Typical Driver Connection
Figure 8. Typical Driver Output Waveforms
Copyright © 2006–2013, Texas Instruments Incorporated
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DS34LV87T
SNLS116D –JULY 2006–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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Copyright © 2006–2013, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DS34LV87TM/NOPB
DS34LV87TMX/NOPB
ACTIVE
SOIC
SOIC
D
D
16
16
48
RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
DS34LV87
TM
ACTIVE
2500 RoHS & Green
SN
DS34LV87
TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Apr-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS34LV87TMX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Apr-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 16
SPQ
Length (mm) Width (mm) Height (mm)
356.0 356.0 35.0
DS34LV87TMX/NOPB
D
2500
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Apr-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
SOIC
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
DS34LV87TM/NOPB
D
16
48
495
8
4064
3.05
Pack Materials-Page 3
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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Copyright © 2022, Texas Instruments Incorporated
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