DS36C279 [TI]

DS36C279 Low Power EIA-RS-485 Transceiver with Sleep Mode;


型号：	DS36C279
厂家：	TEXAS INSTRUMENTS
描述：	DS36C279 Low Power EIA-RS-485 Transceiver with Sleep Mode
文件：	总18页 (文件大小：886K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DS36C279

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SNLS098B –JULY 2000–REVISED APRIL 2013

DS36C279 Low Power EIA-RS-485 Transceiver with Sleep Mode

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FEATURES

DESCRIPTION

The DS36C279 is a low power differential bus/line

transceiver designed to meet the requirements of RS-

485 Standard for multipoint data transmission. In

addition it is compatible with TIA/EIA-422-B.

•

100% RS-485 Compliant

Specified RS-485 Device Interoperation

–

•

Low Power CMOS Design: I_CC500 μA Max

Automatic Sensing Sleep Mode

The sleep mode feature automatically puts the device

in a power saving mode when both the driver and

receiver are disabled.⁽²⁾The device is ideal for use in

power conscious applications where the device may

be disabled for extended periods of time.

–

Reduces I_CCto 10 μA Maximum

•

Built-in Power Up/Down Glitch-Free Circuitry

–

Permits Live Transceiver

Intersection/Displacement

The driver and receiver outputs feature TRI-STATE

capability. The driver outputs operate over the entire

common mode range of −7V to +12V. Bus contention

or fault situations that cause excessive power

dissipation within the device are handled by a thermal

shutdown circuit, which forces the driver outputs into

a high impedance state.

•

SOIC Packages

Industrial Temperature Range: −40°C to

+85°C

•

On-Board Thermal Shutdown Circuitry

–

Prevents Damage to the Device in the Event

of Excessive Power Dissipation

The receiver incorporates a fail safe circuit which

ensures a high output state when the inputs are left

open.⁽³⁾

•

Wide Common Mode Range: −7V to +12V

Receive Open Input Fail-Safe⁽¹⁾

¼ Unit Load (DS36C279): ≥ 128 Nodes

½ Unit Load (DS36C279T): ≥ 64 Nodes

ESD (Human Body Model): ≥ 2 kV

Drop-In Replacement for:

The DS36C279T is fully specified over the industrial

temperature range (−40°C to +85°C).

(2) Device enters sleep mode if enable conditions are held > 600

–

LTC485 MAX485 DS75176 DS3695

(1) Non-terminated, open input only

(3) Non-terminated, open input only

Connection and Logic Diagram

Figure 1. See Package Number D

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

DS36C279

SNLS098B –JULY 2000–REVISED APRIL 2013

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TRUTH TABLE

DRIVER SECTION

RE*

DO/RI

DO*/RI*

RECEIVER SECTION

RE*

RI-RI*

≥+0.2V

≤−0.2V

(1)

(2)

OPEN

(1) Device enters sleep mode if enable conditions are held > 600 ns

(2) Non-terminated, open input only

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾

Supply Voltage (V_CC

Input Voltage (DE, RE*, & DI)

Common Mode (V_CM

)

+12V

−0.5V to (V_CC+0.5V)

±15V

)

Driver Output/Receiver Input

Input Voltage (DO/RI, DO*/RI*)

Receiver Output Voltage

±14V

−0.5V to (V_CC+0.5V)

Maximum Package Power Dissipation

@ +25°C

D Package 1190 mW, derate

9.5 mW/°C above +25°C

−65°C to +150°C

+260°C

Storage Temperature Range

Lead Temperature

(Soldering 4 sec)

(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that

the devices should be operated at these limits. The table of Electrical Characteristics specifies conditions of device operation.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

RECOMMENDED OPERATING CONDITIONS

Min

+4.75

−7

Typ

Max

+5.25

+12

Units

Supply Voltage (V_CC

)

+5.0

Bus Voltage

Operating Free Air Temperature (T_A)

DS36C279T

DS36C279

−40

+25

+85

°C

+70

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ELECTRICAL CHARACTERISTICS⁽¹⁾⁽²⁾

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified

Symbol

Parameter

Conditions

Reference

Min

Typ

Max

Unit

DIFFERENTIAL DRIVER CHARACTERISTICS

V_OD1

V_OD0

V_OD0*

V_OD2

Differential Output Voltage

Output Voltage

I_O= 0 mA (No Load)

(422)

(485)

1.5

5.0

I_O= 0 mA

(Output to GND)

Output Voltage

Differential Output Voltage

(Termination Load)

R_L= 50Ω

(422) See

2.0

1.5

−0.2

2.8

2.3

0.1

Figure 2

R_L= 27Ω

(485)

5.0

ΔV_OD2

V_OD3

V_OC

Balance of V_OD2

R_L= 27Ω or 50Ω

See⁽³⁾(422, 485)

See Figure 3

(485) See

+0.2

|V_OD2− V_OD2*

Differential Output Voltage

(Full Load)

R1 = 54Ω, R2 = 375Ω

V_TEST= −7V to +12V

1.5

2.0

5.0

Driver Common Mode

Output Voltage

R_L= 27Ω

R_L= 50Ω

3.0

Figure 2

(422)

See⁽³⁾

ΔV_OC

Balance of V_OC

R_L= 27Ω or

R_L= 50Ω

−0.2

+0.2

|V_OC− V_OC*

(422, 485)

I_OSD

Driver Output Short-Circuit

Current

V_O= +12V

(485) See Figure 5

(485)

200

+250

V_O= −7V

−190

−250

RECEIVER CHARACTERISTICS

V_TH

Differential Input High

Threshold Voltage

V_O= V_OH, I_O= −0.4 mA

−7V ≤ V_CM≤ +12V

+0.035

+0.2

See⁽⁴⁾

(422, 485)

V_TL

Differential Input Low

Threshold Voltage

V_O= V_OL, I_O= 0.4 mA

−7V ≤ V_CM≤ +12V

−0.2 −0.035

V_HST

R_IN

Hysteresis

V_CM= 0V

See⁽⁵⁾

kΩ

Input Resistance

−7V ≤ V_CM≤ +12V

DS36C279T

DS36C279

I_IN

Line Input Current

See⁽⁶⁾

Other Input = 0V,

DE = V_IL, RE* = V_IL,

V_CC= 4.75 to 5.25

or 0V

V_IN= +12V

V_IN= −7V

V_IN= +12V

V_IN= −7V

V_IN= +12V

V_IN= −7V

V_IN= +12V

V_IN= −7V

(422) See⁽⁷⁾

0.19

−0.1

0.19

−0.1

0.19

−0.1

0.19

−0.1

0.25

−0.2

0.5

DS36C279T

DS36C279

DS36C279T

−0.4

0.25

−0.2

0.5

I_ING

Line Input Current Glitch

See⁽⁶⁾

Other Input = 0V,

DE = V_IL, RE* = V_IL,

V_CC= +3.0V or 0V,

T_A= 25°C

−0.4

±400

I_B

Input Balance Test

RS = 500Ω

V_OH

V_OL

I_OSR

I_OZR

High Level Output Voltage

Low Level Output Voltage

Short Circuit Current

I_OH= −4 mA, V_ID= +0.2V

I_OL= +4 mA, V_ID= −0.2V

V_O= GND

3.5

4.6

0.3

See Figure 12

0.5

±1

μA

TRI-STATE Leakage Current

V_O= 0.4V to 2.4V

(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground

except V_OD1and V_OD2

(2) All typicals are given for: V_CC= +5.0V, T_A= + 25°C.

(3) Delta |V_OD2| and Delta |V _OC| are changes in magnitude of V_OD2and V_OC, respectively, that occur when input changes state.

(4) Threshold parameter limits specified as an algebraic value rather than by magnitude.

(5) Hysteresis defined as V_HST= V_TH− V_TL

(6) I_INincludes the receiver input current and driver TRI-STATE leakage current.

(7) For complete details of test, see RS-485.

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ELECTRICAL CHARACTERISTICS⁽¹⁾⁽²⁾(continued)

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified

Symbol

Parameter

Conditions

Reference

Min

Typ

Max

Unit

DEVICE CHARACTERISTICS

V_IH

V_IL

I_IH

High Level Input Voltage

Low Level Input Voltage

High Level Input Current

Low Level Input Current

DE,

RE*,

2.0

V_CC

0.8

GND

V_IH= V_CC

V_CC= 5V

μA

I_IL

V_IL= 0V

−2

V_CC= +3.0V

−2

I_CC

Power Supply Current

(No Load)

Driver and Receiver ON

Driver OFF, Receiver ON

Driver ON, Receiver OFF

Sleep Mode

200

0.2

500

I_CCR

I_CCD

I_CCX

V_CC

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SWITCHING CHARACTERISTICS⁽¹⁾⁽²⁾

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified

Symbol

Parameter

Conditions

Reference

Min

Typ

Max

Units

DRIVER CHARACTERISTICS

t_PHLD

t_PLHD

t_SKD

Differential Propagation

Delay High to Low

R_L= 54Ω, C_L= 100 pF

Differential Propagation

Delay Low to High

See Figure 6 and

Figure 7

Differential Skew

|t_PHLD− t_PLHD

Rise Time

Fall Time

t_r

t_f

t_PHZ

Disable Time High to Z

Disable Time Low to Z

Enable Time Z to High

Enable Time Z to Low

C_L= 15 pF

RE* = L

See Figure 8 and

Figure 9

200

t_PLZ

t_PZH

t_PZL

t_PSH

t_PSL

See Figure 10 and

Figure 11

200

250

C_L= 100 pF

RE* = L

See Figure 8 and

Figure 9

See Figure 10 and

Figure 11

Driver Enable from Sleep

Mode to Output High

C_L= 100 pF

See⁽³⁾

See Figure 8 and

Figure 9

Driver Enble from Sleep

Mode to Output Low

C_L= 100 pF

See⁽³⁾

See Figure 10 and

Figure 11

RECEIVER CHARACTERISTICS

t_PHL

Propagation Delay

High to Low

C_L= 15 pF

210

190

400

See Figure 13 and

Figure 14

t_PLH

Propagation Delay

Low to High

t_SK

Skew, |t_PHL− t_PLH

t_PLZ

t_PHZ

t_PZL

t_PZH

t_PSH

Output Disable Time

C_L= 15 pF DE = H

150

250

See Figure 15,

Figure 16 and

Figure 17

Output Enable Time

Receiver Enable from Sleep

Mode to Output High

C_L= 15 pF

See⁽³⁾

See Figure 15 and

Figure 17

t_PSL

Receiver Enable from Sleep

Mode to Output Low

C_L= 15 pF

See⁽³⁾

See Figure 15 and

Figure 16

250

(1) All typicals are given for: V_CC= +5.0V, T_A= + 25°C.

(2) C_Lincludes probe and jig capacitance.

(3) For enable from sleep mode delays DE = L and RE* = H for greater than 600 ns prior to test (device is in sleep mode).

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PARAMETER MEASUREMENT INFORMATION

Figure 2. Driver V_OD2and V_OC

Figure 3. Driver V_OD3

Vtest = −7V to +12V

Figure 4. Driver V_OHand V_OL

Figure 5. Driver I_OSD

Figure 6. Driver Differential Propagation Delay Test Circuit

Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times

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Figure 8. TRI-STATE and Sleep Mode Test Circuit

Figure 9. TRI-STATE and Sleep Mode Waveforms

(t_PZH, (t_PSH), t_PHZ

)

(t_PZH, (t_PSH), t_PHZ)

Figure 10. TRI-STATE and Sleep Mode Test Circuit Figure 11. TRI-STATE and Sleep Mode Waveforms

(t_PZL, (t_PSL), t_PLZ(t_PZL, (t_PSL), t_PLZ

)

Figure 12. Receiver V_OHand V_OL

Figure 13. Receiver Differential Propagation Delay

Test Circuit

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Figure 14. Receiver Differential Propagation Delay Waveforms

Figure 15. Receiver TRI-STATE and Sleep Mode Test Circuit

Figure 16. Receiver Enable and Disable Waveforms (t_PLZ, t_PZL, (t_PSL))

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Figure 17. Receiver Enable and Disable Waveforms (t_PHZ, t_PZH, (t_PSH))

Figure 18. Entering Sleep Mode Conditions

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TYPICAL APPLICATION INFORMATION

Figure 19. Typical RS-485 Bus Interface

Table 1. DEVICE PIN DESCRIPTIONS

Pin No.

Name

Description

Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO*/RI* by 200 mV,

RO will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-

terminated) Inputs.

RE*

Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the receiver output

is in TRI-STATE (OFF). When RE* is HIGH and DE is LOW, the device will enter a low-current sleep mode after

600 ns.

Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are

in TRI-STATE (OFF). When RE* is HIGH and DE is LOW, the device will enter a low-current sleep mode after 600

ns.

Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and

DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.

GND

Ground Connection.

DO/RI

Driver Output/Receiver Input, 485 Bus Pin.

DO*/RI* Driver Output/Receiver Input, 485 Bus Pin.

V_CC

Positive Power Supply Connection: Recommended operating range for V_CCis +4.75V to +5.25V.

UNIT LOAD

A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray

shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to

+12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at

−0.8 mA is also defined as one unit load (see Figure 20). An RS-485 driver is capable of driving up to 32 unit

loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes

desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row would benefit

from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to

1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food

storage area. This frees the node for the main station.

The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available.

These devices will allow up to 64 nodes or 128 nodes specified over temperature depending upon which option

is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial

temperature.

First, for a ½ UL device the top and bottom borders shown in Figure 20 are scaled. Both 0 mA reference points

at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at

−0.4 mA for the bottom border (see Figure 20). Second, for a ¼ UL device the top and bottom borders shown in

Figure 20 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other

reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see

Figure 20).

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The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master

multi-slave type of application where the number of slaves exceeds 32, the DS36C278/279/280 may save in the

cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors.

Figure 20. Input Current vs Input Voltage Operating Range

The DS36C279 and DS36C280 have an additional feature which offers more advantages. The DS36C279 has

an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for

EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information

section in the corresponding datasheet for more information on these features.

SLEEP MODE

The DS36C279 features an automatic shutdown mode that allows the device to save power when not

transmitting data. Since the shutdown mode is automatic, no external components are required. It may be used

as little or as much as the application requires. The more the feature is utilized, the more power it saves.

The sleep mode is automatically entered when both the driver and receiver are disabled. This occurs when both

the DE pin is asserted to a logic low and the RE* pin is asserted to a logic high. Once both pins are asserted the

device will enter sleep mode typically in 50 ns. The DS36C279 is ensured to go into sleep mode within 600 ns

after both pins are asserted. The device wakes up (comes out of sleep mode) when either the DE pin is asserted

to a logic high and/or the RE* pin is asserted to a logic low. After the device enters sleep mode it will take longer

for the device to wake up than it does for the device to enable from TRI-STATE. Refer to data specifications t_PSL

and t_PSHand compare with t_PZLand t_PZHfor timing differences.

The benefit of the DS36C279 is definitely its power savings. When active the device has a maximum I_CCof

500 μA. When in sleep mode the device has a maximum I_CCof only 10 μA, which is 50 times less power than

when active. The I_CCwhen the device is active is already very low but when in sleep mode the I_CCis ultra low.

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REVISION HISTORY

Changes from Revision A (April 2013) to Revision B

Page

•

Changed layout of National Data Sheet to TI format .......................................................................................................... 11

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PACKAGE OPTION ADDENDUM

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18-Oct-2013

PACKAGING INFORMATION

Orderable Device

DS36C279M/NOPB

DS36C279MX/NOPB

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 85

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

36C27

ACTIVE

2500

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-1-260C-UNLIM

-40 to 85

36C27

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

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18-Oct-2013

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

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11-Oct-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

DS36C279MX/NOPB

SOIC

2500

330.0

12.4

6.5

5.4

2.0

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Oct-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOIC

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 35.0

DS36C279MX/NOPB

2500

Pack Materials-Page 2

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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

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requirements. Nonetheless, such components are subject to these terms.

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regulatory requirements in connection with such use.

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Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

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Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense

Video and Imaging

www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

DS36C279 [TI]

相关型号：

DS36C279M

DS36C279M/NOPB

DS36C279M/NOPB

DS36C279MDC

DS36C279MWC

DS36C279MX

DS36C279MX

DS36C279MX/NOPB

DS36C279MX/NOPB

DS36C279N

DS36C279TM

DS36C279TM/NOPB