DS36C280 [TI]
DS36C280 Slew Rate Controlled CMOS EIA-RS-485 Transceiver;
| 型号： | DS36C280 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS36C280 Slew Rate Controlled CMOS EIA-RS-485 Transceiver |
| 文件： | 总14页 (文件大小：321K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS36C280
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SNLS097C –JULY 2000–REVISED FEBRUARY 2013
DS36C280 Slew Rate Controlled CMOS EIA-RS-485 Transceiver
Check for Samples: DS36C280
1
FEATURES
DESCRIPTION
The DS36C280 is a low power differential bus/line
transceiver designed to meet the requirements of RS-
485 Standard for multipoint data transmission. In
addition, it is compatible with TIA/EIA-422-B.
2
•
100% RS-485 Compliant
Guaranteed RS-485 Device Interoperation
–
•
•
Low Power CMOS Design: ICC 500 μA max
Adjustable Slew Rate Control
The slew rate control feature allows the user to set
the driver rise and fall times by using an external
resistor. Controlled edge rates can reduce switching
EMI.
–
Minimizes EMI Effects
•
Built-In Power Up/Down Glitch-Free Circuitry
–
Permits Live Transceiver
Insertion/Displacement
The CMOS design offers significant power savings
over its bipolar and ALS counterparts without
sacrificing ruggedness against ESD damage. The
device is ideal for use in battery powered or power
conscious applications. ICC is specified at 500 μA
maximum.
•
•
SOIC Packages
Industrial Temperature Range: −40°C to
+85°C
•
On-board Thermal Shutdown Circuitry
–
Prevents Damage to the Device in the Event
of Excessive Power Dissipation
The driver and receiver outputs feature TRI-STATE
capability. The driver outputs operate over the entire
common mode range of −7V to +12V. Bus contention
or fault situations are handled by a thermal shutdown
circuit, which forces the driver outputs into the high
impedance state.
•
•
•
•
•
Wide Common Mode Range: −7V to +12V
(1)
Receiver Open Input Fail-safe
¼ unit load (DS36C280): ≥128 nodes
½ unit load (DS36C280T): ≥64 nodes
ESD (human body model): ≥2 kV
The receiver incorporates a fail safe circuit which
guarantees a high output state when the inputs are
(1)
left open
.
(1) Non-terminated, Open Inputs only
Connection and Logic Diagram
Figure 1. See Package Number D (R-PDSO-G8)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
DS36C280
SNLS097C –JULY 2000–REVISED FEBRUARY 2013
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Truth Table(1)
DRIVER SECTION
DE/RE*
DI
H
L
DO/RI
DO*/RI*
H
H
L
L
H
Z
H
L
X
Z
RECEIVER SECTION
DE/RE*
RI-RI*
≥+0.2V
≤−0.2V
X
RO
H
L
L
L
H
L
Z
(1)
OPEN
H
(1) Non-terminated, Open Inputs only
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC
Input Voltage (DE/RE*, & DI)
Common Mode (VCM
)
+12V
−0.5V to (VCC +0.5V)
)
Driver Output/Receiver Input
Input Voltage (DO/RI, DO*/RI*)
Receiver Output Voltage
±15V
±14V
−0.5V to (VCC +0.5V)
Maximum Package Power Dissipation @ +25°C
M Package 1190 mV, derate
Storage Temperature Range
Lead Temperature
9.5 mW/°C above +25°C
−65°C to +150°C
+260°C
(Soldering 4 sec.)
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to
imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device
operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Recommended Operating Conditions
Min
+4.75
−7
Typ
Max
+5.25
+12
Units
Supply Voltage (VCC
)
+5.0
V
V
Bus Voltage
Operating Free Air Temperature (TA)
DS36C280T
−40
+25
+25
+85
+70
°C
°C
DS36C280
0
2
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Electrical Characteristics(1)(2)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
Typ
Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD1
VOD0
VOD0*
VOD2
Differential Output Voltage
Output Voltage
IO = 0 mA (No Load)
1.5
0
5.0
5.0
5.0
V
V
V
V
V
(422)
(485)
IO = 0 mA
Output Voltage
(Output to GND)
RL = 50Ω
0
Differential Output Voltage
(Termination Load)
(422)
(485)
Figure 2
2.0
1.5
2.8
2.3
RL = 27Ω
5.0
+0.2
5.0
(3)
ΔVOD2
VOD3
VOC
Balance of VOD2
RL = 27Ω or 50Ω
−0.2
0.1
2.0
V
V
|VOD2 − VOD2*
|
(422, 485)
Differential Output Voltage
(Full Load)
R1 = 54Ω, R2 = 375Ω
VTEST = −7V to +12V
RL = 27Ω
Figure 3
1.5
Driver Common Mode
Output Voltage
(485)
(422)
Figure 2
0
0
3.0
3.0
V
V
RL = 50Ω
(3)
ΔVOC
Balance of VOC
RL = 27Ω or
RL = 50Ω
−0.2
+0.2
V
|VOC − VOC*
|
(422, 485)
(485)
IOSD
Driver Output Short-Circuit
Current
VO = +12V
200
+250
mA
mA
VO = −7V
(485)
−190
−250
RECEIVER CHARACTERISTICS
VTH
Differential Input High
Threshold Voltage
VO = VOH, IO = −0.4 mA
−7V ≤ VCM ≤ +12V
VO = VOL, IO = 0.4 mA
−7V ≤ VCM ≤ +12V
VCM = 0V
+0.035 +0.2
V
V
(4)
(422, 485)
VTL
Differential Input Low
Threshold Voltage
−0.2 −0.035
VHST
RIN
RIN
IIN
Hysteresis(5)
70
mV
kΩ
kΩ
mA
mA
mA
mA
mA
mA
mA
mA
mV
V
Input Resistance
Input Resistance
−7V ≤ VCM ≤ +12V
−7V ≤ VCM ≤ +12V
Other Input = 0V
DE = VIL, RE* = VIL
VCC = 4.75 to 5.25
or 0V
DS36C280T
DS36C280
24
48
0
68
68
Line Input Current
DS36C280
VIN = +12V
VIN = −7V
0.19
−0.1
0.19
−0.1
0.19
−0.1
0.19
−0.1
0.25
−0.2
0.5
(6)
0
DS36C280T VIN = +12V
0
VIN = −7V
0
−0.4
0.25
−0.2
0.5
IING
Line Input Current
Other Input = 0V
DE = VIL, RE* = VIL
VCC = +3.0V
DS36C280
VIN = +12V
0
(6)
Glitch
VIN = −7V
0
DS36C280T VIN = +12V
0
or 0V TA = 25°C
RS = 500Ω
VIN = −7V
(422)
0
−0.4
±400
(7)
IB
Input Balance Test
VOH
VOL
IOSR
IOZR
High Level Output Voltage
Low Level Output Voltage
Short Circuit Current
IOH = −4 mA, VID = +0.2V
IOL = +4 mA, VID = −0.2V
VO = GND
RO
Figure 12
3.5
7
4.6
0.3
35
0.5
85
±1
V
RO
mA
μA
TRI-STATE Leakage Current
VO = 0.4V to 2.4V
DEVICE CHARACTERISTICS
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD1 and VOD2
.
(2) All typicals are given for: VCC = +5.0V, TA = + 25°C.
(3) Delta |VOD2| and Delta |VOC| are changes in magnitude of VOD2 and VOC, respectively, that occur when input changes state.
(4) Threshold parameter limits specified as an algebraic value rather than by magnitude.
(5) Hysteresis defined as VHST = VTH − VTL
.
(6) IIN includes the receiver input current and driver TRI-STATE leakage current.
(7) For complete details of test, see RS-485.
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Electrical Characteristics(1)(2) (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
2.0
Typ
Max Units
VIH
VIL
IIH
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
VCC
0.8
2
V
V
GND
DE/RE*,
DI
VIH = VCC
VCC = 5.0V
VCC = +3.0V
SR = 0V
μA
μA
μA
mA
μA
μA
IIL
−2
VIL = 0V
−2
SR
−1
ICCR
ICCD
Power Supply Current
(No Load)
Driver OFF, Receiver ON
Driver ON, Receiver OFF
200
200
500
500
VCC
Switching Characteristics(1)(2)(3)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol
Parameter
Conditions
Reference
Min
Typ
Max
Units
DRIVER CHARACTERISTICS
tPHLD
tPLHD
tSKD
Differential Propagation
Delay High to Low
RL = 54Ω, CL = 100 pF
Figure 6, Figure 7
10
399
1000
ns
Differential Propagation
Delay Low to High
10
0
400
1
1000
10
ns
ns
Differential Skew
|tPHLD − tPLHD
Rise Time
Fall Time
|
tr
SR = Open
SR = 100 kΩ
SR = Short
CL = 15 pF
CL = 100 pF
2870
3070
1590
1640
337
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tf
tr
Rise Time
Fall Time
tf
tr
Rise Time
Fall Time
100
100
1000
1000
2000
800
tf
348
tPHZ
tPLZ
tPZH
tPZL
Disable Time High to Z
Disable Time Low to Z
Enable Time Z to High
Enable Time Z to Low
Figure 8, Figure 9
Figure 10, Figure 11
Figure 8, Figure 9
Figure 10, Figure 11
1100
500
300
500
300
500
RECEIVER CHARACTERISTICS
tPHL
Propagation Delay
High to Low
CL = 15 pF
30
210
190
400
400
ns
ns
tPLH
Propagation Delay
Low to High
Figure 13, Figure 14
30
0
tSK
Skew, |tPHL − tPLH
|
20
50
55
40
45
50
ns
ns
ns
ns
ns
tPLZ
tPHZ
tPZL
tPZH
Output Disable Time
CL = 15 pF
150
150
150
150
Figure 15, Figure 16,
Figure 17
Output Enable Time
(1) All typicals are given for: VCC = +5.0V, TA = + 25°C.
(2) CL includes probe and jig capacitance.
(3) SR = GND for all Switching Characteristics unless otherwise specified.
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PARAMETER MEASUREMENT INFORMATION
Figure 2. Driver VOD2 and VOC
Figure 3. Driver VOD3
Figure 4. Driver VOH and VOL
Vtest = −7V to +12V
Figure 5. Driver IOSD
Figure 6. Driver Differential Propagation Delay Test
Circuit
Figure 7. Driver Differential Propagation Delays
and Differential Rise and Fall Times
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Figure 8. TRI-STATE Test Circuit (tPZH , tPHZ
)
Figure 9. TRI-STATE Waveforms (tPZH, tPHZ)
Figure 10. TRI-STATE Test Circuit (tPZL, tPLZ
)
Figure 11. TRI-STATE Waveforms (tPZL, tPLZ)
Figure 12. Receiver VOH and VOL
Figure 13. Receiver Differential Propagation Delay
Test Circuit
Figure 14. Receiver Differential Propagation Delay Waveforms
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Figure 15. Receiver TRI-STATE Test Circuit
Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL
)
Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH
)
Typical Application Information
Figure 18. Typical Pin Connection
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Table 1. DEVICE PIN DESCRIPTIONS
Pin # Name
Description
1
RO
Receiver Output: When DE/RE* (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO*/RI* by 200 mV,
RO will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-
terminated) inputs.
2
3
SR
Slew Rate Control: A resistor connected to Ground controls the Driver Output rising and falling edge rates.
DE/RE* Combined Driver and Receiver Output Enable: When signal is LOW the receiver output is enabled and the driver outputs
are in TRI-STATE (OFF). When signaI is HlGH, the receiver output is in TRI-STATE (OFF) and the driver outputs are
enabled.
4
DI
Driver Input: When DE/RE* is HlGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and DO*/RI* will be
HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.
5
6
7
8
GND
Ground Connection
DO/RI
Driver Output/Receiver Input, 485 Bus Pin.
DO*/RI* Driver Output/Receiver Input, 485 Bus Pin.
VCC Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V.
Unit Load
A unit load for a RS-485 receiver is defined by the input current versus the input voltage curve. The gray shaded
region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to +12V at
+1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at −0.8 mA is
also defined as one unit load (see Figure 19 ). A RS-485 driver is capable of driving up to 32 unit loads. This
allows upto 32 nodes on a single bus. Although sufficient for many applications, it is sometime desirable to have
even more nodes. For example an aircraft that has 32 rows with 4 seats per row could benefit from having 128
nodes on one bus. This would allow signals to be transferred to and from each individual seat to 1 main station.
Usually there is one or two less seats in the last row of the aircraft near the restrooms and food storage area.
This frees the node for the main station.
The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available.
These devices will allow upto 64 nodes or 128 nodes guaranteed over temperature depending upon which option
is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial
temperature.
First, for a ½ UL device the top and bottom borders shown in Figure 19 are scaled. Both 0 mA reference points
at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at
−0.4 mA for the bottom border (see Figure 19 ). Second, for a ¼ UL device the top and bottom borders shown in
Figure 19 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other
reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see
Figure 19 ).
The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master
multi-slave type of application were the number of slaves exceeds 32, the DS36C278/279/280 may save in the
cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors.
The DS36C279 and DS36C280 have addition feature which offer more advantages. The DS36C279 has an
automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for EMI
conscious applications. Refer to the sleep mode and slew rate control portion of the application information
section in the corresponding datasheet for more information on these features.
Figure 19. Input Current vs Input Voltage
Operating Range
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Slew Rate Control
The DS36C280 features an adjustable slew rate control. This feature allows more control over EMl levels than
tradition fixed edge rate devices. The slew rate control may be adjusted with or without any external components.
The DS36C280 offers both low power (ICC 500 μA max) and low EMI for an RS-485 interface.
The slew rate control is located at pin two of the device and only controls the driver output edges. The slew rate
control pin (SR) may be left open or shorted to ground, with or without a resistor. When the SR pin is shorted to
ground without a resistor, the driver output edges will transition typically 350 ns. When the SR pin is left open,
the driver output edges will transition typically 3 μs. When the SR pin is shorted to ground with a resistor, the
driver output edges will transition between 350 ns and 3 μs depending on the resistor value. Refer to the slew
rate versus resistor value curve in this datasheet for determining resistor values and expected typical slew rate
value. Please note, when slowing the edge rates of the device will decrease the maximum data rate also.
Figure 20. Slew Rate Resistor
vs Differential Rise/Rise/Fall Time
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REVISION HISTORY
Changes from Revision B (February 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Nov-2017
PACKAGING INFORMATION
Orderable Device
DS36C280M/NOPB
DS36C280MX/NOPB
DS36C280TM/NOPB
DS36C280TMX/NOPB
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
OBSOLETE
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
TBD
TBD
TBD
TBD
Call TI
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36C28
0M
OBSOLETE
OBSOLETE
OBSOLETE
D
D
D
0 to 70
36C28
0M
0 to 70
36C28
0TM
0 to 70
36C28
0TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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5-Nov-2017
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