DS560MB410ZASR [TI]

具有 2x2 交叉点多路复用器的 56Gbps 4 通道转接驱动器 | ZAS | 101 | -40 to 85;


型号：	DS560MB410ZASR
厂家：	TEXAS INSTRUMENTS
描述：	具有 2x2 交叉点多路复用器的 56Gbps 4 通道转接驱动器 \| ZAS \| 101 \| -40 to 85 驱动复用器驱动器
文件：	总10页 (文件大小：1018K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DS560MB410

ZHCSRB0 –DECEMBER 2022

DS560MB410 具有交叉点的低功耗56Gbps PAM4 4 通道线性转接驱动器

1 特性

3 说明

• 四通道多协议线性均衡器，支持高达28GBd

(PAM4) 和32GBd (NRZ) 的接口

• 适用于高达CEI-56G、以太网(400 GbE)、光纤通

道(64GFC)、InfiniBand^™(HDR) 和CPRI/eCPRI

PCB 和铜缆应用

DS560MB410 是一款低功耗、高性能四通道线性均衡

器，支持多速率、多协议接口，使用四级脉冲振幅调制

(PAM4) 时最高可达 28GBD，使用非归零码 (NRZ) 调

制时最高可达 32GBD。它用于扩展背板、中板和有源

铜缆 (ACC) 应用中高速串行链路的覆盖范围并提升稳

定性。DS560MB410 可将两个 ASIC 之间的覆盖范围

增加至比正常的ASIC 到ASIC 范围高18dB 以上。

• 可选择的CTLE 升压曲线，用于补偿PCB 或电缆

损耗

• 具有引脚或寄存器控制的集成2x2 交叉点，适用于

多路复用器、扇出和信号交叉

• 低功耗：160mW/通道（典型值）

• 无需散热器

• 无缝支持CR/KR 链路训练、自动协商和FEC 直通

功能的CTLE 线性均衡

• 在13.28GHz 下，将远距离链路扩展至比正常的

ASIC 至ASIC 性能高18dB+

每个通道独立运行，用户可选择的 CTLE 升压曲线经

过优化，可均衡 PCB 或铜缆损耗曲线。DS560MB410

均衡的线性特性保留了流经转接驱动器的输入信号特

性。这种透明性使链路伙伴ASIC 能够在链路训练期间

自由协商 Tx 均衡器系数，并支持任务模式下的单个通

道正向纠错 (FEC) 直通，同时更大限度地降低对延迟

的影响。

• 用于PAM-4 眼图对称性增强的眼图扩展器

• 低输入至输出延迟：80ps（典型值）

• 低附加随机抖动

封装信息⁽¹⁾

封装尺寸（标称值）

器件型号

封装

DS560MB410

ZAS (nFBGA, 101)

6.00mm × 6.00mm

• 小型6.00mm x 6.00mm 小型球状引脚栅格阵列

(BGA) 封装，可轻松实现直通布线

• 无需参考时钟

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

• 单个2.5V ±5% 电源

• –40°C 至+85°C 的环境温度范围

RX0P

RX0N

TX0P

TX0N

2 应用

RX1P

RX1N

TX1P

TX1N

• 背板(KR) 和中板C2C 连接单元接口(AUI) 范围扩

展

• 有源铜缆(ACC)（SFP56、QSFP56、QSFP-DD

或OSFP）

RX2P

RX2N

TX2P

TX2N

RX3P

RX3N

TX3P

TX3N

• 实现故障转移冗余的多路复用器/多路信号分离器

VDD

1 k

SDA⁽¹⁾

SDC⁽¹⁾

SMBus

Target mode

To system SMBus

EN_SMB

Address straps

(pull-up, pull-down, or

float)

ADDR0

ADDR1

SMBus Target

mode

Float for SMBus Target

READ_EN_N

VDD

ALL_DONE_N

GND

mode, or connect to next

device’s READ_EN_N for

SMBus Controller mode

2.5V

0.1

(2x)

(4x)

(1) SMBus signals need to be pulled up elsewhere in the system.

简化原理图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SNLS733

DS560MB410

ZHCSRB0 –DECEMBER 2022

www.ti.com.cn

Table of Contents

6.2 Receiving Notification of Documentation Updates......4

6.3 Support Resources..................................................... 4

6.4 Trademarks.................................................................4

6.5 Electrostatic Discharge Caution..................................4

6.6 术语表......................................................................... 4

7 Mechanical, Packaging, and Orderable Information....4

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 说明（续）.........................................................................3

6 Device and Documentation Support..............................4

6.1 Documentation Support.............................................. 4

4 Revision History

DATE

REVISION

NOTES

December 2022

Initial Release

Submit Document Feedback

Product Folder Links: DS560MB410

DS560MB410

ZHCSRB0 –DECEMBER 2022

www.ti.com.cn

5 说明（续）

DS560MB410 在每对相邻通道之间包含一个完整的 2×2 交叉点，可支持 2 到 1 多路复用和 1 到 2 多路分解以实

现故障转移冗余，还支持1 对2 扇出以实现诊断监控，以及支持信号交叉以实现PCB 布线灵活性。交叉点可通过

引脚或SMBus 寄存器接口进行控制。

DS560MB410 具有小型封装尺寸和经优化的高速信号退出，非常适合小型应用。简化的均衡控制、低功耗和超低

附加抖动使其适用于背板和中板上的芯片至芯片范围扩展和信号分配。6.00mm × 6.00mm 小尺寸可轻松适应有源

铜缆(ACC) 装配应用，无需散热器。

DS560MB410 采用单个电源，可尽可能减少对外部组件的需求。这些特性降低了 PCB 布局布线复杂度以及物料

清单 (BOM) 成本。DS560MB410 可通过 SMBus 或外部 EEPROM 进行配置。单个 EEPROM 最多可由 16 个器

件共享。

Submit Document Feedback

Product Folder Links: DS560MB410

DS560MB410

ZHCSRB0 –DECEMBER 2022

www.ti.com.cn

6 Device and Documentation Support

6.1 Documentation Support

6.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, DS560MB410 Programmer's Guide

• Texas Instruments, 50 GbE PAM4 Equalization Optimization with TI DS560MB410 Redrivers

6.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

6.3 Support Resources

6.4 Trademarks

InfiniBand^™is a trademark of InfiniBand Trade Association.

所有商标均为其各自所有者的财产。

6.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

6.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: DS560MB410

PACKAGE OPTION ADDENDUM

www.ti.com

3-Mar-2023

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

DS560MB410ZASR

DS560MB410ZAST

ACTIVE

NFBGA

ZAS

101

2500 RoHS & Green

250 RoHS & Green

SNAGCU

Level-3-260C-168 HR

-40 to 85

DS56MB410

Samples

SNAGCU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

3-Mar-2023

Addendum-Page 2

PACKAGE OUTLINE

ZAS0101A

NFBGA - 1.2 mm max height

SCALE 2.200

PLASTIC BALL GRID ARRAY

6.1

5.9

BALL A1 CORNER

INDEX AREA

6.1

5.9

(0.91)

1.2 MAX

SEATING PLANE

0.08 C

0.25

TYP

0.15

BALL TYP

5 TYP

SYMM

(0.5) TYP

SYMM

TYP

0.35

101X

0.25

0.15

0.05

C A

0.5 TYP

4222303/A 09/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

ZAS0101A

NFBGA - 1.2 mm max height

PLASTIC BALL GRID ARRAY

101X ( 0.25)

(0.5) TYP

SYMM

LAND PATTERN EXAMPLE

SCALE:15X

0.05 MAX

METAL UNDER

SOLDER MASK

0.05 MIN

0.25)

METAL

(

SOLDER MASK

OPENING

(

0.25)

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4222303/A 09/2015

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).

www.ti.com

EXAMPLE STENCIL DESIGN

ZAS0101A

NFBGA - 1.2 mm max height

PLASTIC BALL GRID ARRAY

101X ( 0.25)

(0.5) TYP

METAL

TYP

(R0.05) TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:20X

4222303/A 09/2015

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

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