DS75176BTN/NOPB [TI]
DS75176B/DS75176BT Multipoint RS-485/RS-422 Transceivers; DS75176B / DS75176BT多点RS - 485 / RS -422收发器
| 型号： | DS75176BTN/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS75176B/DS75176BT Multipoint RS-485/RS-422 Transceivers |
| 文件： | 总14页 (文件大小：943K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS75176B, DS75176BT
www.ti.com
SNLS381C –JULY 1998–REVISED APRIL 2013
DS75176B/DS75176BT Multipoint RS-485/RS-422 Transceivers
Check for Samples: DS75176B, DS75176BT
1
FEATURES
DESCRIPTION
The DS75176B is a high speed differential TRI-
23
•
Meets EIA Standard RS485 for Multipoint Bus
Transmission and is Compatible with RS-422.
STATE®bus/line transceiver designed to meet the
requirements of EIA standard RS485 with extended
common mode range (+12V to −7V), for multipoint
data transmission. In addition, it is compatible with
RS-422.
•
Small Outline (SOIC) Package Option Available
for Minimum Board Space.
•
•
•
22 ns Driver Propagation Delays.
Single +5V Supply.
The driver and receiver outputs feature TRI-STATE
capability, for the driver outputs over the entire
common mode range of +12V to −7V. Bus contention
or fault situations that cause excessive power
dissipation within the device are handled by a thermal
shutdown circuit, which forces the driver outputs into
the high impedance state.
−7V to +12V Bus Common Mode Range
Permits ±7V Ground Difference Between
Devices on the Bus.
•
•
Thermal Shutdown Protection.
High Impedance to Bus with Driver in TRI-
STATE or with Power Off, Over the Entire
Common Mode Range Allows the Unused
Devices on the Bus to be Powered Down.
DC specifications are guaranteed over the 0 to 70°C
temperature and 4.75V to 5.25V supply voltage
range.
•
•
Pin Out Compatible with DS3695/A and
SN75176A/B.
Combined Impedance of a Driver Output and
Receiver Input is Less Than One RS485 Unit
Load, Allowing up to 32 Transceivers on the
Bus.
•
70 mV Typical Receiver Hysteresis.
Connection and Logic Diagram
Figure 1. Top View
See Package Number P0008E or D0008A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TRI-STATE is a registered trademark of Texas Instruments.
2
3
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS75176B, DS75176BT
SNLS381C –JULY 1998–REVISED APRIL 2013
www.ti.com
(1)(2)
Absolute Maximum Ratings
Supply Voltage, VCC
7V
7V
Control Input Voltages
Driver Input Voltage
7V
Driver Output Voltages
+15V/ −10V
+15V/ −10V
5.5V
Receiver Input Voltages (DS75176B)
Receiver Output Voltage
(3)
Continuous Power Dissipation @ 25°C
for SOIC Package
for PDIP Package
675 mW
(4)
900 mW
Storage Temperature Range
−65°C to +150°C
Lead Temperature
(Soldering, 4 seconds)
260°C
500V
ESD Rating (HBM)
(1) “Absolute Maximum Ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Derate linearly @ 6.11 mW/°C to 400 mW at 70°C.
(4) Derate linearly at 5.56 mW/°C to 650 mW at 70°C.
Recommended Operating Conditions
Min
4.75
−7
Max
5.25
+12
Units
Supply Voltage, VCC
V
V
Voltage at Any Bus Terminal
(Separate or Common Mode)
Operating Free Air Temperature TA
DS75176B
0
+70
+85
+12
°C
°C
V
DS75176BT
−40
−12
(1)
Differential Input Voltage, VID
(1) Differential - Input/Output bus voltage is measured at the noninverting terminal A with respect to the inverting terminal B.
(1) (2)
Electrical Characteristics
0°C ≤ TA≤ 70°C, 4.75V < VCC< 5.25V unless otherwise specified
Symbol
Parameter
Conditions
Min Typ Max Units
VOD1
Differential Driver Output
Voltage (Unloaded)
IO = 0
5
V
(3)
VOD2
Differential Driver Output
Voltage (with Load)
See (Figure 2)
R = 50Ω; (RS-422)
R = 27Ω; (RS-485)
2
V
V
1.5
ΔVOD
Change in Magnitude of Driver
Differential Output Voltage For
Complementary Output States
Driver Common Mode Output Voltage
Change in Magnitude of Driver
Common Mode Output Voltage
For Complementary Output States
0.2
V
VOC
See (Figure 2)
R = 27Ω
3.0
0.2
V
V
Δ|VOC
|
(1) All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
(2) All typicals are given for VCC = 5V and TA = 25°C.
(3) All worst case parameters for which this note is applied, must be increased by 10% for DS75176BT. The other parameters remain valid
for −40°C < TA < +85°C.
2
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS75176B DS75176BT
DS75176B, DS75176BT
www.ti.com
SNLS381C –JULY 1998–REVISED APRIL 2013
Electrical Characteristics (1) (2) (continued)
0°C ≤ TA≤ 70°C, 4.75V < VCC< 5.25V unless otherwise specified
Symbol
VIH
Parameter
Input High Voltage
Conditions
Min Typ Max Units
2
V
VIL
VCL
IIL
Input Low Voltage
Input Clamp Voltage
Input Low Current
Input High Current
Input Current
0.8
−1.5
−200
20
DI, DE,
RE , E
IIN = −18 mA
VIL = 0.4V
VIH = 2.4V
VIN = 12V
VIN = −7V
μA
μA
IIH
IIN
DO/RI, DO/RI
VCC = 0V or 5.25V
DE = 0V
+1.0
−0.8
mA
mA
VTH
Differential Input Threshold Voltage for
Receiver
−7V ≤ VCM ≤ + 12V
−0.
2
+0.2
V
ΔVTH
VOH
VOL
Receiver Input Hysteresis
VCM = 0V
70
mV
V
Receiver Output High Voltage
IOH = −400 μA
2.7
12
(3)
Output Low Voltage
RO
IOL = 16 mA
0.5
V
IOZR
OFF-State (High Impedance)
Output Current at Receiver
Receiver Input Resistance
Supply Current
VCC = Max
±20
μA
0.4V ≤ VO ≤ 2.4V
−7V ≤ VCM ≤ +12V
No Load(3)
RIN
ICC
kΩ
mA
mA
mA
mA
mA
Driver Outputs Enabled
Driver Outputs Disabled
55
35
(3)
IOSD
Driver Short-Circuit
Output Current
VO = −7V
−250
+250
−85
(3)
VO = +12V
IOSR
Receiver Short-Circuit
Output Current
VO = 0V
−15
Switching Characteristics
VCC = 5.0V, TA = 25°C
Symbol
tPLH
tPHL
tr
Parameter
Driver Input to Output
Conditions
Min
Typ
12
Max
Units
ns
RLDIFF = 60Ω
22
22
18
18
Driver Input to Output
Driver Rise Time
Driver Fall Time
CL1 = CL2 = 100 pF
RLDIFF = 60Ω
17
ns
ns
tf
CL1 =CL2 = 100 pF
(Figure 4 and Figure 6)
ns
tZH
tZL
tLZ
tHZ
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
CL = 100 pF (Figure 5 and Figure 7) S1
Open
29
31
13
19
100
60
ns
ns
ns
ns
CL = 100 pF (Figure 5 and Figure 7) S2
Open
CL = 15 pF (Figure 5 and Figure 7) S2
Open
30
CL = 15 pF (Figure 5 and Figure 7) S1
Open
200
tPLH
tPHL
tZL
Receiver Input to Output
Receiver Input to Output
Receiver Enable to Output Low
CL = 15 pF (Figure 3 and Figure 8)
S1 and S2 Closed
30
32
15
37
37
20
ns
ns
ns
CL = 15 pF (Figure 3 and Figure 9) S2
Open
tZH
tLZ
tHZ
Receiver Enable to Output High
Receiver Disable from Low
Receiver Disable from High
CL = 15 pF (Figure 3 and Figure 9) S1
Open
11
28
13
20
32
35
ns
ns
ns
CL = 15 pF (Figure 3 and Figure 9) S2
Open
CL = 15 pF (Figure 3 and Figure 9) S1
Open
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS75176B DS75176BT
DS75176B, DS75176BT
SNLS381C –JULY 1998–REVISED APRIL 2013
www.ti.com
AC TEST CIRCUITS
Note: S1 and S2 of load circuit are closed except as otherwise
mentioned.
Figure 2.
Figure 3.
Note: Unless otherwise specified the switches are closed.
Figure 4.
Figure 5.
Switching Time Waveforms
Figure 6. Driver Propagation Delays and Transition Times
Figure 7. Driver Enable and Disable Times
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS75176B DS75176BT
DS75176B, DS75176BT
www.ti.com
SNLS381C –JULY 1998–REVISED APRIL 2013
Note: Differential input voltage may may be realized by grounding RI and pulsing RI between +2.5V and −2.5V
Figure 8. Receiver Propagation Delays
Figure 9. Receiver Enable and Disable Times
Table 1. DS75176B Transmitting(1)
Function Tables
Inputs
Line Condition
Outputs
RE
X
DE
1
DI
1
DO
DO
1
No Fault
No Fault
X
0
1
Z
Z
X
1
0
0
X
0
X
X
Z
X
1
Fault
Z
(1) X — Don't care condition
Z — High impedance state
Fault — Improper line conditons causing excessive power dissipation
in the driver, such as shorts or bus contention situations
**This is a fail safe condition
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS75176B DS75176BT
DS75176B, DS75176BT
SNLS381C –JULY 1998–REVISED APRIL 2013
www.ti.com
Table 2. DS75176B Receiving(1)
Inputs
Outputs
RE
0
DE
0
RI-RI
≥ +0.2V
≤ −0.2V
Inputs Open**
X
RO
1
0
0
0
0
0
1
1
0
Z
(1) X — Don't care condition
Z — High impedance state
Fault — Improper line conditons causing excessive power dissipation
in the driver, such as shorts or bus contention situations
**This is a fail safe condition
TYPICAL APPLICATION
6
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS75176B DS75176BT
DS75176B, DS75176BT
www.ti.com
SNLS381C –JULY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: DS75176B DS75176BT
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS75176BM
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
95
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
DS751
76BM
DS75176BM/NOPB
DS75176BMX
ACTIVE
ACTIVE
ACTIVE
D
D
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
0 to 70
DS751
76BM
2500
2500
TBD
0 to 70
DS751
76BM
DS75176BMX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
0 to 70
DS751
76BM
DS75176BN
ACTIVE
ACTIVE
PDIP
PDIP
P
P
8
8
40
40
TBD
Call TI
Call TI
Call TI
0 to 70
0 to 70
DS75176BN
DS75176BN/NOPB
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
DS75176BN
DS75176BTM
DS75176BTM/NOPB
DS75176BTMX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
P
P
8
8
8
8
8
8
95
95
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
Call TI
Call TI
Level-1-260C-UNLIM
Call TI
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
DS751
76BTM
Green (RoHS
& no Sb/Br)
DS751
76BTM
2500
2500
40
TBD
DS751
76BTM
DS75176BTMX/NOPB
DS75176BTN
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
DS751
76BTM
TBD
DS75176
BTN
DS75176BTN/NOPB
40
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
DS75176
BTN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS75176BMX
DS75176BMX/NOPB
DS75176BTMX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
6.5
6.5
6.5
6.5
5.4
5.4
5.4
5.4
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
DS75176BTMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS75176BMX
DS75176BMX/NOPB
DS75176BTMX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
349.0
349.0
349.0
349.0
337.0
337.0
337.0
337.0
45.0
45.0
45.0
45.0
DS75176BTMX/NOPB
Pack Materials-Page 2
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