DS90LV027M/NOPB [TI]

LVDS 双路高速差动驱动器 | D | 8 | 0 to 70;
DS90LV027M/NOPB
型号: DS90LV027M/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LVDS 双路高速差动驱动器 | D | 8 | 0 to 70

驱动 光电二极管 接口集成电路 驱动器
文件: 总14页 (文件大小:443K)
中文:  中文翻译
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DS90LV027  
www.ti.com  
SNLS003C JUNE 1998REVISED APRIL 2013  
DS90LV027 LVDS Dual High Speed Differential Driver  
Check for Samples: DS90LV027  
1
FEATURES  
DESCRIPTION  
The DS90LV027 is a dual LVDS driver device  
optimized for high data rate and low power  
applications. The DS90LV027 is a current mode  
driver allowing power dissipation to remain low even  
at high frequency. In addition, the short circuit fault  
current is also minimized. The device is in a 8-lead  
SOIC package. The DS90LV027 has a flow-through  
design for easy PCB layout. The differential driver  
outputs provides low EMI with its low output swings  
typically 340 mV. Perfect for high speed transfer of  
clock and data. Pair with any of TI's LVDS receivers.  
23  
Ultra Low Power Dissipation  
Operating Range above 155 Mbps  
Flow-through pinout simplifies PCB layout  
Conforms to TIA/EIA-644 Standard  
8-Lead SOIC Package Saves Space  
VCM ±1V center around 1.2V  
Low Differential Output Swing Typical 340 mV  
Power Off Protection (outputs in high  
impedance)  
Connection Diagram  
Figure 1. Dual-In-Line  
See Package Number D (R-PDSO-G8)  
Functional Diagram  
Truth Table(1)  
Input/Output  
DI  
L
DO+  
L
DO  
H
H
H
L
DI > 0.8V and DI < 2.0V  
X
X
(1) H = Logic high level  
L = Logic low level  
X = indeterminant  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
TRI-STATE is a registered trademark of Texas Instruments.  
2
3
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1998–2013, Texas Instruments Incorporated  
DS90LV027  
SNLS003C JUNE 1998REVISED APRIL 2013  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)  
Absolute Maximum Ratings  
Supply Voltage (VCC  
)
0.3V to +6V  
0.3V to (VCC + 0.3V)  
0.3V to +3.9V  
Input Voltage (DI)  
Output Voltage (DO±)  
Maximum Package Power Dissipation @ +25°C  
D Package  
1190 mW  
9.5 mW/°C above +25°C  
65°C to +150°C  
Derate D Package  
Storage Temperature Range  
Lead Temperature Range  
Soldering (4 sec.)  
+260°C  
(2)  
ESD Rating  
(HBM 1.5 kΩ, 100 pF)  
4.5 kV  
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply  
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.  
(2) ESD Rating: HBM (1.5 kΩ, 100 pF) 4.5 kV  
Recommended Operating Conditions  
Min  
3.0  
0
Typ  
3.3  
25  
Max  
3.6  
70  
Units  
V
Supply Voltage (VCC  
)
Temperature (TA)  
°C  
Electrical Characteristics  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.  
(1) (2) (3)  
Symbol  
Parameter  
Conditions  
Pin  
Min  
Typ  
Max  
Units  
DIFFERENTIAL DRIVER CHARACTERISTICS  
VOD  
ΔVOD  
VOH  
VOL  
VOS  
ΔVOS  
IOZD  
IOXD  
IOSD  
VIH  
Output Differential Voltage  
VOD Magnitude Change  
Output High Voltage  
Output Low Voltage  
Offset Voltage  
RL = 100Ω (Figure 2)  
DO+,  
DO−  
250  
0
340  
10  
450  
35  
mV  
mV  
V
1.43  
1.09  
1.25  
5
1.6  
0.9  
0.9  
0
V
1.6  
25  
V
Offset Magnitude Change  
TRI-STATE® Leakage  
Power-off Leakage  
mV  
μA  
μA  
mA  
V
VOUT = VCC or GND  
0
±1  
±10  
±10  
6  
VOUT = 3.6V or GND, VCC = 0V  
0
±1  
Output Short Circuit Current  
Input High Voltage  
4  
DI  
2.0  
VCC  
0.8  
±10  
±10  
VIL  
Input Low Voltage  
GND  
V
IIH  
Input High Current  
VIN = 3.6V or 2.4V  
VIN = GND or 0.5V  
ICL = 18 mA  
±1  
±1  
0.8  
1
μA  
μA  
V
IIL  
Input Low Current  
VCL  
ICC  
Input Clamp Voltage  
Power Supply Current  
1.5  
No Load  
VIN = VCC or GND  
VCC  
4
mA  
mA  
RL = 100Ω  
8
11  
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground  
except VOD  
.
(2) All typicals are given for: VCC = +3.3V and TA = +25°C.  
(3) The DS90LV027 is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers  
outputs.  
2
Submit Documentation Feedback  
Copyright © 1998–2013, Texas Instruments Incorporated  
Product Folder Links: DS90LV027  
 
DS90LV027  
www.ti.com  
SNLS003C JUNE 1998REVISED APRIL 2013  
Switching Characteristics  
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified.  
(1) (2)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
DIFFERENTIAL DRIVER CHARACTERISTICS  
tPHLD  
tPLHD  
tSKD  
tTLH  
Differential Propagation Delay High to Low  
Differential Propagation Delay Low to High  
RL = 100Ω, CL = 5 pF  
(Figure 3 and Figure 4)  
1.5  
1.5  
0
3.4  
3.5  
0.1  
1
6
6
ns  
ns  
ns  
ns  
ns  
Differential Skew |tPHLD tPLHD  
Transition Low to High Time  
Transition High to Low Time  
|
1.9  
3
0
tTHL  
0
1
3
(1) CL includes probe and fixture capacitance.  
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr 6 ns, tf 6 ns (10%-90%).  
PARAMETER MEASUREMENT INFORMATION  
Figure 2. Differential Driver DC Test Circuit  
Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit  
Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms  
Copyright © 1998–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: DS90LV027  
 
 
DS90LV027  
SNLS003C JUNE 1998REVISED APRIL 2013  
www.ti.com  
APPLICATION INFORMATION  
Table 1. Device Pin Descriptions  
Pin #  
2, 3  
6, 7  
5, 8  
4
Name  
DI  
Description  
TTL/CMOS driver input pins  
Non-inverting driver output pin  
Inverting driver output pin  
Ground pin  
DO+  
DO−  
GND  
1
VCC  
Positive power supply pin,  
+3.3V ± 0.3V  
4
Submit Documentation Feedback  
Copyright © 1998–2013, Texas Instruments Incorporated  
Product Folder Links: DS90LV027  
 
DS90LV027  
www.ti.com  
SNLS003C JUNE 1998REVISED APRIL 2013  
REVISION HISTORY  
Changes from Revision B (April 2013) to Revision C  
Page  
Changed layout of National Data Sheet to TI format ............................................................................................................ 4  
Copyright © 1998–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: DS90LV027  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DS90LV027M/NOPB  
DS90LV027MX/NOPB  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
95  
RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
90LV  
027M  
ACTIVE  
2500 RoHS & Green  
SN  
90LV  
027M  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DS90LV027MX/NOPB  
SOIC  
D
8
2500  
330.0  
12.4  
6.5  
5.4  
2.0  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
DS90LV027MX/NOPB  
D
8
2500  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TUBE  
T - Tube  
height  
L - Tube length  
W - Tube  
width  
B - Alignment groove width  
*All dimensions are nominal  
Device  
Package Name Package Type  
SOIC  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
DS90LV027M/NOPB  
D
8
95  
495  
8
4064  
3.05  
Pack Materials-Page 3  
PACKAGE OUTLINE  
D0008A  
SOIC - 1.75 mm max height  
SCALE 2.800  
SMALL OUTLINE INTEGRATED CIRCUIT  
C
SEATING PLANE  
.228-.244 TYP  
[5.80-6.19]  
.004 [0.1] C  
A
PIN 1 ID AREA  
6X .050  
[1.27]  
8
1
2X  
.189-.197  
[4.81-5.00]  
NOTE 3  
.150  
[3.81]  
4X (0 -15 )  
4
5
8X .012-.020  
[0.31-0.51]  
B
.150-.157  
[3.81-3.98]  
NOTE 4  
.069 MAX  
[1.75]  
.010 [0.25]  
C A B  
.005-.010 TYP  
[0.13-0.25]  
4X (0 -15 )  
SEE DETAIL A  
.010  
[0.25]  
.004-.010  
[0.11-0.25]  
0 - 8  
.016-.050  
[0.41-1.27]  
DETAIL A  
TYPICAL  
(.041)  
[1.04]  
4214825/C 02/2019  
NOTES:  
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.  
Dimensioning and tolerancing per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed .006 [0.15] per side.  
4. This dimension does not include interlead flash.  
5. Reference JEDEC registration MS-012, variation AA.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
D0008A  
SOIC - 1.75 mm max height  
SMALL OUTLINE INTEGRATED CIRCUIT  
8X (.061 )  
[1.55]  
SYMM  
SEE  
DETAILS  
1
8
8X (.024)  
[0.6]  
SYMM  
(R.002 ) TYP  
[0.05]  
5
4
6X (.050 )  
[1.27]  
(.213)  
[5.4]  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:8X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED  
METAL  
EXPOSED  
METAL  
.0028 MAX  
[0.07]  
.0028 MIN  
[0.07]  
ALL AROUND  
ALL AROUND  
SOLDER MASK  
DEFINED  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4214825/C 02/2019  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
D0008A  
SOIC - 1.75 mm max height  
SMALL OUTLINE INTEGRATED CIRCUIT  
8X (.061 )  
[1.55]  
SYMM  
1
8
8X (.024)  
[0.6]  
SYMM  
(R.002 ) TYP  
[0.05]  
5
4
6X (.050 )  
[1.27]  
(.213)  
[5.4]  
SOLDER PASTE EXAMPLE  
BASED ON .005 INCH [0.125 MM] THICK STENCIL  
SCALE:8X  
4214825/C 02/2019  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
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