DS90LV031A [TI]
3V 四路 CMOS 差动线路驱动器;
| 型号： | DS90LV031A |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3V 四路 CMOS 差动线路驱动器 驱动 线路驱动器或接收器 驱动程序和接口 |
| 文件： | 总19页 (文件大小：912K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS90LV031A
www.ti.com
SNLS020C –JULY 1999–REVISED APRIL 2013
DS90LV031A 3V LVDS Quad CMOS Differential Line Driver
Check for Samples: DS90LV031A
1
FEATURES
DESCRIPTION
The DS90LV031A is a quad CMOS differential line
driver designed for applications requiring ultra low
power dissipation and high data rates. The device is
designed to support data rates in excess of 400 Mbps
(200 MHz) utilizing Low Voltage Differential Signaling
(LVDS) technology.
23
•
>400 Mbps (200 MHz) switching rates
0.1 ns typical differential skew
•
•
•
•
•
•
•
•
0.4 ns maximum differential skew
2.0 ns maximum propagation delay
3.3V power supply design
The
DS90LV031A
accepts
low
voltage
±350 mV differential signaling
LVTTL/LVCMOS input levels and translates them to
low voltage (350 mV) differential output signals. In
addition the driver supports a TRI-STATE® function
that may be used to disable the output stage,
disabling the load current, and thus dropping the
device to an ultra low idle power state of 13 mW
typical.
Low power dissipation (13mW at 3.3V static)
Interoperable with existing 5V LVDS devices
Compatible with IEEE 1596.3 SCI LVDS
standard
•
•
•
Compatible with TIA/EIA-644 LVDS standard
Industrial operating temperature range
The EN and EN* inputs allow active Low or active
High control of the TRI-STATE outputs. The enables
are common to all four drivers. The DS90LV031A and
companion line receiver (DS90LV032A) provide a
new alternative to high power psuedo-ECL devices
for high speed point-to-point interface applications.
Available in SOIC and TSSOP surface mount
packaging
Connection Diagram
Figure 1. Dual-In-Line
See Package Number D (R-PDSO-G16) or
PW (R-PDSO-G16)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TRI-STATE is a registered trademark of Texas Instruments.
2
3
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
DS90LV031A
SNLS020C –JULY 1999–REVISED APRIL 2013
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Functional Diagram
Truth Table
Enables
Input
DIN
X
Outputs
EN
EN*
DOUT+
DOUT−
L
H
Z
L
Z
H
L
All other combinations of ENABLE inputs
L
H
H
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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(1)
Absolute Maximum Ratings
Supply Voltage (VCC
Input Voltage (DIN
Enable Input Voltage (EN, EN*)
)
−0.3V to +4V
−0.3V to (VCC + 0.3V)
−0.3V to (VCC + 0.3V)
−0.3V to +3.9V
)
Output Voltage (DOUT+, DOUT−
)
Short Circuit Duration
(DOUT+, DOUT−
)
Continuous
Maximum Package Power Dissipation @ +25°C
D Package
1088 mW
866 mW
PW Package
Derate D Package
8.5 mW/°C above +25°C
6.9 mW/°C above +25°C
−65°C to +150°C
Derate PW Package
Storage Temperature Range
Lead Temperature Range
Soldering (4 sec.)
+260°C
+150°C
Maximum Junction Temperature
(2)
ESD Rating
(HBM, 1.5 kΩ, 100 pF)
≥ 6 kV
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
(2) ESD Ratings:
HBM (1.5 kΩ, 100 pF) ≥ 6 kV
Recommended Operating Conditions
Min
Typ
Max
Units
Supply Voltage (VCC
)
+3.0
+3.3
+3.6
V
Operating Free Air Temperature (TA)
Industrial
−40
+25
+85
°C
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Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified.
(1) (2) (3)
Symbol
VOD1
Parameter
Conditions
Pin
Min
Typ
350
4
Max
450
35
Units
mV
Differential Output Voltage
RL = 100Ω (Figure 2)
DOUT−
DOUT+
250
ΔVOD1
Change in Magnitude of VOD1 for
Complementary Output States
|mV|
VOS
Offset Voltage
1.125
1.25
5
1.375
25
V
ΔVOS
Change in Magnitude of VOS for
Complementary Output States
|mV|
VOH
VOL
VIH
VIL
IIH
Output Voltage High
Output Voltage Low
Input Voltage High
Input Voltage Low
Input Current
1.38
1.03
1.6
V
V
0.90
2.0
DIN
EN,
EN*
,
VCC
0.8
V
GND
−10
−10
−1.5
V
VIN = VCC or 2.5V
VIN = GND or 0.4V
ICL = −18 mA
±1
±1
+10
+10
μA
μA
V
IIL
Input Current
VCL
IOS
Input Clamp Voltage
Output Short Circuit Current
−0.8
−6.0
(4)
ENABLED,
DOUT−
DOUT+
−9.0
mA
DIN = VCC, DOUT+ = 0V or
DIN = GND, DOUT− = 0V
(4)
IOSD
IOFF
IOZ
Differential Output Short Circuit
Current
ENABLED, VOD = 0V
−6.0
±1
−9.0
+20
+10
8.0
mA
μA
Power-off Leakage
VOUT = 0V or 3.6V,
VCC = 0V or Open
−20
−10
Output TRI-STATE Current
EN = 0.8V and EN* = 2.0V
VOUT = 0V or VCC
±1
μA
ICC
No Load Supply Current Drivers
Enabled
DIN = VCC or GND
VCC
5.0
23
mA
mA
mA
ICCL
ICCZ
Loaded Supply Current Drivers
Enabled
RL = 100Ω All Channels, DIN = VCC
30
or GND (all inputs)
No Load Supply Current Drivers
Disabled
DIN = VCC or GND,
2.6
6.0
EN = GND, EN* = VCC
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except: VOD1 and ΔVOD1
.
(2) All typicals are given for: VCC = +3.3V, TA = +25°C.
(3) The DS90LV031A is a current mode device and only functions within datasheet specifications when a resistive load is applied to the
driver outputs typical range is (90Ω to 110Ω)
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
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Switching Characteristics - Industrial
(1) (2) (3)
VCC = +3.3V ±10%, TA = −40°C to +85°C
Symbol
tPHLD
Parameter
Conditions
Min
0.8
0.8
0
Typ
1.18
1.25
0.07
0.1
Max
2.0
2.0
0.4
0.5
1.0
1.2
1.5
1.5
5
Units
ns
Differential Propagation Delay High to Low
RL = 100Ω, CL = 10 pF
(Figure 3 and Figure 4)
tPLHD
tSKD1
tSKD2
tSKD3
tSKD4
tTLH
Differential Propagation Delay Low to High
ns
(4)
Differential Pulse Skew |tPHLD − tPLHD
|
ns
(5)
Channel-to-Channel Skew
0
ns
(6)
Differential Part to Part Skew
0
ns
(7)
Differential Part to Part Skew
0
ns
Rise Time
0.38
0.40
ns
tTHL
Fall Time
ns
tPHZ
tPLZ
tPZH
tPZL
Disable Time High to Z
Disable Time Low to Z
Enable Time Z to High
Enable Time Z to Low
RL = 100Ω, CL = 10 pF
(Figure 5 and Figure 6)
ns
5
ns
7
ns
7
ns
(8)
fMAX
Maximum Operating Frequency
200
250
MHz
(1) All typicals are given for: VCC = +3.3V, TA = +25°C.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, and tf ≤ 1 ns.
(3) CL includes probe and jig capacitance.
(4) tSKD1, |tPHLD − tPLHD| is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
(5) tSKD2 is the Differential Channel-to-Channel Skew of any event on the same device.
(6) tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation
delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
(7) tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
(8) fMAX generator input conditions: tr = tf < 1ns, (0% to 100%), 50% duty cycle, 0V to 3V. Output Criteria: duty cycle = 45%/55%, VOD >
250mV, all channels switching.
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Parameter Measurement Information
Figure 2. Driver VOD and VOS Test Circuit
Figure 3. Driver Propagation Delay and Transition Time Test Circuit
Figure 4. Driver Propagation Delay and Transition Time Waveforms
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Parameter Measurement Information (continued)
Figure 5. Driver TRI-STATE Delay Test Circuit
Figure 6. Driver TRI-STATE Delay Waveforms
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APPLICATION INFORMATION
General application guidelines and hints for LVDS drivers and receivers may be found in the following application
notes: LVDS Owner's Manual (SNLA187), AN-808 (SNLA028), AN-1035 (SNOA355), AN-977 (SNLA166), AN-
971 (SNLA165), AN-916 (SNLA219), AN-805 (SNOA233), AN-903 (SNLA034).
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
is shown in Figure 8. This configuration provides a clean signaling environment for the quick edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic differential impedance of the media
is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as
close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver
into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver
configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as
well as ground shifting, noise margin limits, and total termination loading must be taken into account.
The DS90LV031A differential line driver is a balanced current source design. A current mode driver, generally
speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode
driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in
one direction to produce a logic state and in the other direction to produce the other logic state. The output
current is typically 3.5 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode requires (as
discussed above) that a resistive termination be employed to terminate the signal and to complete the loop as
shown in Figure 8. AC or unterminated configurations are not allowed. The 3.5 mA loop current will develop a
differential voltage of 350 mV across the 100Ω termination resistor which the receiver detects with a 250 mV
minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold (350
mV – 100 mV = 250 mV)). The signal is centered around +1.2V (Driver Offset, VOS) with respect to ground as
shown in Figure 7. Note that the steady-state voltage (VSS) peak-to-peak swing is twice the differential voltage
(VOD) and is typically 700 mV.
The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its
quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver
increases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows
between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed
current between its output without any substantial overlap current. This is similar to some ECL and PECL
devices, but without the heavy static ICC requirements of the ECL/PECL designs. LVDS requires > 80% less
current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing
RS-422 drivers.
The TRI-STATE function allows the driver outputs to be disabled, thus obtaining an even lower power state when
the transmission of data is not required.
The footprint of the DS90LV031A is the same as the industry standard 26LS31 Quad Differential (RS-422) Driver
and is a step down replacement for the 5V DS90C031 Quad Driver.
Power Decoupling Recommendations
Bypass capacitors must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1µF
in parallel with 0.01µF, in parallel with 0.001µF at the power supply pin as well as scattered capacitors over the
printed circuit board. Multiple vias should be used to connect the decoupling capacitors to the power planes. A
10µF (35V) or greater solid tantalum capacitor should be connected at the power entry point on the printed circuit
board.
PC Board considerations
Use at least 4 PCB layers (top to bottom); LVDS signals, ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put TTL
and LVDS signals on different layers which are isolated by a power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
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Differential Traces
Use controlled impedance traces which match the differential impedance of your transmission medium (ie. cable)
and termination resistor. Run the differential pair trace lines as close together as possible as soon as they leave
the IC (stubs should be < 10mm long). This will help eliminate reflections and ensure noise is coupled as
common-mode. Lab experiments show that differential signals which are 1mm apart radiate far less noise than
traces 3mm apart since magnetic field cancellation is greater with the closer traces. Plus, noise induced on the
differential lines is much more likely to appear as common-mode which is rejected by the receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase
difference between signals which destroys the magnetic field cancellation benefits of differential signals and EMI
will result. (Note the velocity of propagation, v = c/Er where c (the speed of light) = 0.2997mm/ps or 0.0118
in/ps). Do not rely solely on the auto-route function for differential traces. Carefully review dimensions to match
differential impedance and provide isolation for the differential lines. Minimize the number of vias and other
discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels.
Within a pair of traces, the distance between the two traces should be minimized to maintain common-mode
rejection of the receivers. On the printed circuit board, this distance should remain constant to avoid
discontinuities in differential impedance. Minor violations at connection points are allowable.
Termination
Use a resistor which best matches the differential impedance of your transmission line. The resistor should be
between 90Ω and 130Ω. Remember that the current mode outputs need the termination resistor to generate the
differential voltage. LVDS will not work without resistor termination. Typically, connect a single resistor across the
pair at the receiver end.
Surface mount 1% to 2% resistors are best. PCB stubs, component lead, and the distance from the termination
to the receiver inputs should be minimized. The distance between the termination resistor and the receiver
should be < 10mm (12mm MAX).
Probing LVDS Transmission Lines
Always use high impedance (> 100kΩ), low capacitance (< 2pF) scope probes with a wide bandwidth (1GHz)
scope. Improper probing will give deceiving results.
Cables and Connectors, General Comments
When choosing cable and connectors for LVDS it is important to remember:
Use controlled impedance media. The cables and connectors you use should have a matched differential
impedance of about 100Ω. They should not introduce major impedance discontinuities.
Balanced cables (e.g. twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax.) for
noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and
also tend to pick up electromagnetic radiation as common-mode (not differential mode) noise which is rejected by
the receiver. For cable distances < 0.5M, most cables can be made to work effectively. For distances 0.5M ≤ d ≤
10M, CAT 3 (category 3) twisted pair cable works well, is readily available and relatively inexpensive.
Fail-safe of an LVDS Interface
If the LVDS link as shown in Figure 8 needs to support the case where the Line Driver is disabled, powered off,
or removed (un-plugged) and the Receiver device is powered on and enabled, the state of the LVDS bus is
unknown and therefore the output state of the Receiver is also unknown. If this is of concern, please consult the
respective LVDS Receiver data sheet for guidance on Failsafe Biasing options for the LVDS interface to set a
known state on the inputs for these conditions.
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Figure 7. Driver Output Levels
TYPICAL APPLICATION
Figure 8. Point-to-Point Application
Typical Performance Curves
Figure 9. Typical DS90LV031A, DOUT (single ended) vs RL, TA = 25°C
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Typical Performance Curves (continued)
Figure 10. Typical DS90LV031A, DOUT vs RL,
VCC = 3.3V, TA = 25°C
PIN DESCRIPTIONS
Pin No.
Name
DIN
Description
Driver input pin, TTL/CMOS compatible
1, 7, 9, 15
2, 6, 10, 14
DOUT+
DOUT−
EN
Non-inverting driver output pin, LVDS levels
Inverting driver output pin, LVDS levels
Active high enable pin, OR-ed with EN*
Active low enable pin, OR-ed with EN
Power supply pin, +3.3V ± 0.3V
Ground pin
3, 5, 11, 13
4
12
16
8
EN*
VCC
GND
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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16-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS90LV031ATM
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
D
16
16
16
16
16
16
16
16
48
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
Level-1-260C-UNLIM
Call TI
DS90LV031A
TM
DS90LV031ATM/NOPB
DS90LV031ATMTC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
48
92
92
Green (RoHS
& no Sb/Br)
DS90LV031A
TM
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
TBD
DS90LV
031AT
DS90LV031ATMTC/NOPB
DS90LV031ATMTCX
DS90LV031ATMTCX/NOPB
DS90LV031ATMX
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
DS90LV
031AT
TBD
DS90LV
031AT
2500
2500
2500
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
DS90LV
031AT
TBD
DS90LV031A
TM
DS90LV031ATMX/NOPB
SOIC
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS90LV031A
TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS90LV031ATMTCX/NO TSSOP
PB
PW
16
2500
330.0
12.4
6.95
8.3
1.6
8.0
12.0
Q1
DS90LV031ATMX
SOIC
D
D
16
16
2500
2500
330.0
330.0
16.4
16.4
6.5
6.5
10.3
10.3
2.3
2.3
8.0
8.0
16.0
16.0
Q1
Q1
DS90LV031ATMX/NOPB SOIC
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS90LV031ATMTCX/NOP
B
TSSOP
PW
16
2500
349.0
337.0
45.0
DS90LV031ATMX
SOIC
SOIC
D
D
16
16
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
DS90LV031ATMX/NOPB
Pack Materials-Page 2
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