DS90UB903Q-Q1 [TI]

具有双向控制通道的 10 - 43MHz 18 位色彩 FPD-Link III 串行器;
DS90UB903Q-Q1
型号: DS90UB903Q-Q1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有双向控制通道的 10 - 43MHz 18 位色彩 FPD-Link III 串行器

驱动 光电二极管 线路驱动器或接收器 驱动程序和接口
文件: 总45页 (文件大小:1099K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DS90UB903Q, DS90UB904Q  
www.ti.com  
SNLS332E JUNE 2010REVISED APRIL 2013  
DS90UB903Q/DS90UB904Q 10 - 43MHz 18 Bit Color FPD-Link III Serializer and  
Deserializer with Bidirectional Control Channel  
Check for Samples: DS90UB903Q, DS90UB904Q  
1
FEATURES  
DESCRIPTION  
The DS90UB903Q/DS90UB904Q chipset offers a  
FPD-Link III interface with a high-speed forward  
channel and a bidirectional control channel for data  
transmission over a single differential pair. The  
2
10 MHz to 43 MHz Input PCLK Support  
210 Mbps to 903 Mbps Data Throughput  
Single Differential Pair Interconnect  
DS90UB903Q/904Q  
incorporates  
differential  
Bidirectional Control Interface Channel with  
I2C Support  
signaling on both the high-speed forward channel and  
bidirectional control channel data paths. The  
Serializer/ Deserializer pair is targeted for direct  
connections between graphics host controller and  
displays modules. This chipset is ideally suited for  
driving video data to displays requiring 18-bit color  
depth (RGB666 + HS, VS, and DE) along with  
bidirectional control channel bus. The primary  
transport converts 21 bit data over a single high-  
speed serial stream, along with a separate low  
latency bidirectional control channel transport that  
accepts control information from an I2C port. Using  
TI’s embedded clock technology allows transparent  
full-duplex communication over a single differential  
pair, carrying asymmetrical bidirectional control  
channel information in both directions. This single  
serial stream simplifies transferring a wide data bus  
over PCB traces and cable by eliminating the skew  
problems between parallel data and clock paths. This  
significantly saves system cost by narrowing data  
paths that in turn reduce PCB layers, cable width,  
and connector size and pins.  
Embedded Clock with DC Balanced Coding to  
Support AC-Coupled Interconnects  
Capable to Drive up to 10 Meters Shielded  
Twisted-Pair  
I2C Compatible Serial Interface  
Single Hardware Device Addressing Pin  
Up to 4 General Purpose Input (GPI)/ Output  
(GPO)  
LOCK Output Reporting Pin and AT-SPEED  
BIST Diagnosis Feature to Validate Link  
Integrity  
Integrated Termination Resistors  
1.8V- or 3.3V-Compatible Parallel Bus Interface  
Single Power Supply at 1.8V  
ISO 10605 ESD and IEC 61000-4-2 ESD  
Compliant  
Automotive Grade Product: AEC-Q100 Grade 2  
Qualified  
In addition, the Deserializer inputs provide  
equalization control to compensate for loss from the  
media over longer distances. Internal DC balanced  
encoding/decoding is used to support AC-Coupled  
interconnects.  
Temperature Range 40°C to +105°C  
No Reference Clock Required on Deserializer  
Programmable Receive Equalization  
EMI/EMC Mitigation  
The Serializer is offered in a 40-pin lead in WQFN  
and Deserializer is offered in a 48-pin WQFN  
packages.  
DES Programmable Spread Spectrum  
(SSCG) Outputs  
DES Receiver Staggered Outputs  
APPLICATIONS  
Automotive Display Systems  
Central Information Displays  
Navigation Displays  
Rear Seat Entertainment  
Touch Screen Displays  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010–2013, Texas Instruments Incorporated  
DS90UB903Q, DS90UB904Q  
SNLS332E JUNE 2010REVISED APRIL 2013  
www.ti.com  
Typical Application Diagram  
Parallel  
Data Out  
18+3  
Parallel  
Data In  
18+3  
FPD-Link III  
Graphics  
Controller  
--  
Video  
Display  
Module,  
Touch Panel  
4
4
DS90UB903Q  
DS90UB904Q  
GPO  
GPI  
2
Bidirectional  
Control Channel  
2
Processor  
Bidirectional  
Control Bus  
Bidirectional  
Control Bus  
Serializer  
Deserializer  
Figure 1. Typical Application Circuit  
Block Diagrams  
R
T
R
T
R
R
T
DOUT+  
DOUT-  
21  
T
RIN+  
RIN-  
R/G/B[5:0],  
HS,VS,DE  
21  
R/G/B[5:0],  
HS,VS,DE  
4
4
GPI[3:0]  
GPO[3:0]  
PCLK  
LOCK  
PASS  
Clock  
Gen  
PCLK  
PLL  
Clock  
Gen  
CDR  
Timing  
and  
Control  
PDB  
PDB  
Timing  
and  
Control  
MODE  
BISTEN  
MODE  
SDA  
SCL  
SDA  
SCL  
ID[x]  
ID[x]  
DS90UB903Q - SERIALIZER  
DS90UB904Q - DESERIALIZER  
Figure 2. Block Diagram  
DS90UB903Q  
Serializer  
DS90UB904Q  
Deserializer  
FPD-Link III  
R[5:0]  
G[5:0]  
B[5:0]  
VS  
HS  
DE  
R[5:0]  
G[5:0]  
B[5:0]  
VS  
HS  
DE  
Timing  
Controller  
PCLK  
Graphics  
Controller  
---  
Video  
Processor  
LCD  
Display  
---  
PLL  
PCLK  
PDB  
MODE  
BISTEN  
GPI[3:0]  
PDB  
MODE  
Config.  
Touch Panel  
Config.  
GPO[3:0]  
mC  
2
SDA  
SCL  
SDA  
SCL  
2
I C  
mC  
I C  
Figure 3. Application Block Diagram  
2
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Copyright © 2010–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
www.ti.com  
SNLS332E JUNE 2010REVISED APRIL 2013  
DS90UB903Q Pin Diagram  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
20 GPO[1]  
19 GPO[0]  
V
DDIO  
DIN[8]  
DIN[9]  
DAP = GND  
18  
V
DDCML  
17 DOUT+  
16 DOUT-  
V
DDD  
DS9UB903Q  
Serializer  
40-Pin WQFN  
(Top View)  
DIN[10]  
DIN[11]  
15  
14  
V
V
DDT  
DIN[12]  
DIN[13]  
DIN[14]  
DIN[15]  
DDPLL  
13 PDB  
12 MODE  
11 RES  
Serializer - DS90UB903Q  
40 Pin WQFN (Top View)  
See Package Number RTA0040A  
DS90UB903Q SERIALIZER PIN DESCRIPTIONS  
Pin Name  
Pin No.  
I/O, Type  
Description  
LVCMOS PARALLEL INTERFACE  
DIN[20:0]  
PCLK  
5, 4, 3, 2, 1,  
40, 39, 38, 37,  
36, 35, 33, 32,  
30, 29, 28, 27,  
26, 25, 24, 23  
Inputs,  
LVCMOS  
w/ pull down  
Parallel data inputs.  
6
Input, LVCMOS Pixel Clock Input Pin. Strobe edge set by TRFB control register.  
w/ pull down  
GENERAL PURPOSE OUTPUT (GPO)  
GPO[3:0] 22, 21, 20, 19  
Output,  
General-purpose output pins can be used to control and respond to various  
commands.  
LVCMOS  
BIDIRECTIONAL CONTROL BUS - I2C COMPATIBLE  
Input/Output,  
Open Drain  
Clock line for the bidirectional control bus communication  
SCL  
SDA  
7
8
SCL requires an external pull-up resistor to VDDIO  
.
Input/Output,  
Open Drain  
Data line for the bidirectional control bus communication  
SDA requires an external pull-up resistor to VDDIO  
I2C Mode select  
.
MODE = L, Master mode (default); Device generates and drives the SCL clock line.  
Device is connected to slave peripheral on the bus. (Serializer initially starts up in  
Standby mode and is enabled through remote wakeup by Deserializer)  
MODE = H, Slave mode; Device accepts SCL clock input and attached to an I2C  
controller master on the bus. Slave mode does not generate the SCL clock, but uses  
the clock generated by the Master for the data transfers.  
Input, LVCMOS  
w/ pull down  
MODE  
ID[x]  
12  
9
Device ID Address Select  
Resistor to Ground and 10 kpull-up to 1.8V rail. See Table 3  
Input, analog  
CONTROL AND CONFIGURATION  
Copyright © 2010–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
SNLS332E JUNE 2010REVISED APRIL 2013  
www.ti.com  
DS90UB903Q SERIALIZER PIN DESCRIPTIONS (continued)  
Pin Name  
Pin No.  
I/O, Type  
Description  
Power down Mode Input Pin.  
PDB = H, Serializer is enabled and is ON.  
PDB = L, Serailizer is in Power Down mode. When the Serializer is in Power Down,  
the PLL is shutdown, and IDD is minimized. Programmed control register data are  
NOT retained and reset to default values  
Input, LVCMOS  
w/ pull down  
PDB  
13  
Input, LVCMOS Reserved.  
RES  
10, 11  
w/ pull down  
This pin MUST be tied LOW.  
FPD-LINK III INTERFACE  
Input/Output,  
CML  
Non-inverting differential output, bidirectional control channel input. The interconnect  
must be AC Coupled with a 100 nF capacitor.  
DOUT+  
DOUT-  
17  
16  
Input/Output,  
CML  
Inverting differential output, bidirectional control channel input. The interconnect must  
be AC Coupled with a 100 nF capacitor.  
POWER AND GROUND  
VDDPLL  
14  
15  
18  
34  
Power, Analog PLL Power, 1.8V ±5%  
VDDT  
Power, Analog Tx Analog Power, 1.8V ±5%  
Power, Analog CML & Bidirectional Channel Driver Power, 1.8V ±5%  
Power, Digital Digital Power, 1.8V ±5%  
VDDCML  
VDDD  
Power, Digital Power for I/O stage. The single-ended inputs and SDA, SCL are powered from VDDIO  
VDDIO can be connected to a 1.8V ±5% or 3.3V ±10%  
.
VDDIO  
31  
Ground, DAP DAP must be grounded. DAP is the large metal contact at the bottom side, located at  
the center of the WQFN package. Connected to the ground plane (GND) with at least  
16 vias.  
VSS  
DAP  
4
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Copyright © 2010–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
www.ti.com  
SNLS332E JUNE 2010REVISED APRIL 2013  
DS90UB904Q Pin Diagram  
PASS  
ROUT[4]  
ROUT[5]  
ROUT[6]  
ROUT[7]  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
RES/CMLOUTP  
RES/CMLOUTN  
DAP = GND  
V
DDCML  
RIN+  
V
DDIO2  
DS90UB904Q  
RIN-  
RES  
ROUT[8]  
ROUT[9]  
Deserializer  
48-Pin WQFN  
(Top View)  
BISTEN  
V
DDD  
ROUT[10]  
ROUT[11]  
ROUT[12]  
ROUT[13]  
V
DDPLL  
RES  
MODE  
ID[x]  
Deserializer - DS90UB904Q  
48 Pin WQFN (Top View)  
See Package Number RHS0048A  
DS90UB904Q DESERIALIZER PIN DESCRIPTIONS  
Pin Name  
Pin No.  
I/O, Type  
Description  
LVCMOS PARALLEL INTERFACE  
ROUT[20:0]  
PCLK  
5, 6, 8, 9, 10,  
11, 12, 13, 14,  
15, 16, 18, 19,  
21, 22, 23, 24,  
25, 26, 27, 28  
Outputs,  
LVCMOS  
Parallel data outputs.  
Output,  
LVCMOS  
Pixel Clock Output Pin.  
Strobe edge set by RRFB control register.  
4
GENERAL PURPOSE INPUT (GPI)  
General-purpose input pins can be used to control and respond to various  
commands.  
GPI[3:0] 30, 31, 32, 33 Input, LVCMOS  
BIDIRECTIONAL CONTROL BUS - I2C COMPATIBLE  
Input/Output,  
Open Drain  
Clock line for the bidirectional control bus communication  
SCL  
SDA  
2
1
SCL requires an external pull-up resistor to VDDIO  
.
Input/Output,  
Open Drain  
Data line for bidirectional control bus communication  
SDA requires an external pull-up resistor to VDDIO  
I2C Mode select  
.
MODE = L, Master mode; Device generates and drives the SCL clock line, where  
Input, LVCMOS required such as Read. Device is connected to slave peripheral on the bus.  
MODE  
ID[x]  
47  
48  
w/ pull up  
MODE = H, Slave mode (default); Device accepts SCL clock input and attached to an  
I2C controller master on the bus. Slave mode does not generate the SCL clock, but  
uses the clock generated by the Master for the data transfers.  
Device ID Address Select  
Resistor to Ground and 10 kpull-up to 1.8V rail. See Table 4.  
Input, analog  
CONTROL AND CONFIGURATION  
Copyright © 2010–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
SNLS332E JUNE 2010REVISED APRIL 2013  
www.ti.com  
DS90UB904Q DESERIALIZER PIN DESCRIPTIONS (continued)  
Pin Name  
Pin No.  
I/O, Type  
Description  
Power down Mode Input Pin.  
PDB = H, Deserializer is enabled and is ON.  
PDB = L, Deserializer is in Power Down mode. When the Deserializer is in Power  
Down. Programmed control register data are NOT retained and reset to default  
values.  
Input, LVCMOS  
w/ pull down  
PDB  
35  
LOCK Status Output Pin.  
Output,  
LVCMOS  
LOCK = H, PLL is Locked, outputs are active  
LOCK = L, PLL is unlocked, ROUT and PCLK output states are controlled by  
OSS_SEL control register. May be used as Link Status.  
LOCK  
RES  
34  
Reserved.  
Pins 38, 39: Route to test point or leave open if unused. See also FPD-LINK III  
INTERFACE pin description section.  
Pin 46: This pin MUST be tied LOW.  
Pin 43: Leave pin open.  
38, 39, 43, 46  
-
BIST MODE  
BIST Enable Pin.  
BISTEN = H, BIST Mode is enabled.  
BISTEN = L, BIST Mode is disabled.  
Input, LVCMOS  
w/ pull down  
BISTEN  
44  
37  
PASS Output Pin for BIST mode.  
Output,  
PASS = H, ERROR FREE Transmission  
PASS  
LVCOMS  
PASS = L, one or more errors were detected in the received payload.  
Leave Open if unused. Route to test point (pad) recommended.  
FPD-LINK III INTERFACE  
Input/Output,  
CML  
Non-inverting differential input, bidirectional control channel output. The interconnect  
must be AC Coupled with a 100 nF capacitor.  
RIN+  
RIN-  
41  
Input/Output,  
CML  
Inverting differential input, bidirectional control channel output. The interconnect must  
be AC Coupled with a 100 nF capacitor.  
42  
38  
Non-inverting CML Output  
Monitor point for equalized differential signal. Test port is enabled via control  
registers.  
CMLOUTP  
CMLOUTN  
Output, CML  
Output, CML  
Inverting CML Output  
Monitor point for equalized differential signal. Test port is enabled via control  
registers.  
39  
3
POWER AND GROUND  
SSCG Power, 1.8V ±5%  
Power supply must be connected regardless if SSCG function is in operation.  
VDDSSCG  
Power, Digital  
Power, Digital  
LVCMOS I/O Buffer Power, The single-ended outputs and control input are powered  
from VDDIO. VDDIO can be connected to a 1.8V ±5% or 3.3V ±10%  
VDDIO1/2/3  
29, 20, 7  
VDDD  
17  
36  
40  
45  
Power, Digital Digital Core Power, 1.8V ±5%  
Power, Analog Rx Analog Power, 1.8V ±5%  
Power, Analog Bidirectional Channel Driver Power, 1.8V ±5%  
Power, Analog PLL Power, 1.8V ±5%  
VDDR  
VDDCML  
VDDPLL  
DAP must be grounded. DAP is the large metal contact at the bottom side, located at  
VSS  
DAP  
Ground, DAP the center of the WQFN package. Connected to the ground plane (GND) with at least  
16 vias.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
6
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Copyright © 2010–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
www.ti.com  
SNLS332E JUNE 2010REVISED APRIL 2013  
Absolute Maximum Ratings(1)(2)(3)  
Supply Voltage – VDDn (1.8V)  
0.3V to +2.5V  
0.3V to +4.0V  
Supply Voltage – VDDIO  
LVCMOS Input Voltage I/O Voltage  
0.3V to + (VDDIO + 0.3V)  
0.3V to +(VDD + 0.3V)  
0.3V to (VDD + 0.3V)  
+150°C  
CML Driver I/O Voltage (VDD  
)
CML Receiver I/O Voltage (VDD  
)
Junction Temperature  
Storage Temperature  
65°C to +150°C  
Maximum Package Power Dissipation Capacity  
Package Derating  
1/θJA °C/W above +25°  
θJA(based on 16 thermal vias)  
θJC(based on 16 thermal vias)  
θJA(based on 16 thermal vias)  
θJC(based on 16 thermal vias)  
30.7 °C/W  
6.8 °C/W  
40 Lead WQFN  
48 Lead WQFN  
26.9 °C/W  
4.4 °C/W  
ESD Rating (IEC 61000-4-2)  
RD = 330, CS = 150pF  
±25 kV  
Air Discharge (DOUT+, DOUT-, RIN+, RIN-)  
Contact Discharge (DOUT+, DOUT-, RIN+, RIN-)  
ESD Rating (ISO10605)  
±10 kV  
RD = 330, CS = 150/330pF  
RD = 2K, CS = 150/330pF  
±15 kV  
ESD Rating (ISO10605)  
Air Discharge (DOUT+, DOUT-, RIN+, RIN-)  
Contact Discharge (DOUT+, DOUT-, RIN+, RIN-)  
ESD Rating (HBM)  
±10 kV  
±8 kV  
ESD Rating (CDM)  
±1 kV  
ESD Rating (MM)  
±250 V  
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of  
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or  
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating  
Conditions indicate conditions at which the device is functional; the device should not be operated beyond such conditions.  
(2) For soldering specifications: see product folder at www.ti.com  
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
Recommended Operating Conditions(1)  
Min  
1.71  
1.71  
Nom  
1.8  
Max  
1.89  
1.89  
Units  
Supply Voltage (VDDn  
)
V
V
LVCMOS Supply Voltage (VDDIO  
OR  
)
)
1.8  
LVCMOS Supply Voltage (VDDIO  
3.0  
3.3  
3.6  
25  
V
VDDn (1.8V)  
VDDIO (1.8V)  
VDDIO (3.3V)  
mVp-p  
mVp-p  
mVp-p  
°C  
Supply Noise  
25  
50  
Operating Free Air Temperature (TA)  
PCLK Clock Frequency  
-40  
10  
+25  
+105  
43  
MHz  
(1) Supply noise testing was done with minimum capacitors (as shown on Figure 37 and Figure 38) on the PCB. A sinusoidal signal is AC  
coupled to the VDDn (1.8V) supply with amplitude = 25 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the  
Ser and output of the Des with 10 meter cable shows no error when the noise frequency on the Ser is less than 1 MHz. The Des on the  
other hand shows no error when the noise frequency is less than 750 kHz.  
Copyright © 2010–2013, Texas Instruments Incorporated  
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Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
SNLS332E JUNE 2010REVISED APRIL 2013  
www.ti.com  
Electrical Characteristics(1)(2)(3)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
LVCMOS DC SPECIFICATIONS 3.3V I/O (SER INPUTS, DES OUTPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)  
VIH  
VIL  
High Level Input  
Voltage  
VIN = 3.0V to 3.6V  
2.0  
VIN  
V
Low Level Input  
Voltage  
VIN = 3.0V to 3.6V  
GND  
-20  
0.8  
+20  
V
µA  
V
IIN  
Input Current  
VIN = 0V or 3.6V, VIN = 3.0V to 3.6V  
VDDIO = 3.0V to 3.6V, IOH = 4 mA  
±1  
VOH  
High Level Output  
Voltage  
2.4  
VDDIO  
VOL  
IOS  
Low Level Output  
Voltage  
VDDIO = 3.0V to 3.6V, IOL = +4 mA  
GND  
0.4  
V
Serializer GPO  
-24  
-39  
±1  
Outputs  
Output Short Circuit  
Current  
VOUT = 0V  
mA  
µA  
Deserializer LVCMOS  
Outputs  
TRI-STATE Output  
Current  
PDB = 0V,  
VOUT = 0V or VDD  
IOZ  
LVCMOS Outputs  
-20  
+20  
LVCMOS DC SPECIFICATIONS 1.8V I/O (SER INPUTS, DES OUTPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)  
VIH  
High Level Input  
Voltage  
VIN = 1.71V to 1.89V  
0.65 VIN  
VIN +0.3  
V
VIL  
Low Level Input  
Voltage  
VIN = 1.71V to 1.89V  
GND  
-20  
0.35 VIN  
+20  
IIN  
Input Current  
VIN = 0V or 1.89V, VIN = 1.71V to 1.89V  
VDDIO = 1.71V to 1.89V, IOH = 4 mA  
±1  
µA  
V
VOH  
High Level Output  
Voltage  
VDDIO  
0.45  
-
VDDIO  
VOL  
IOS  
Low Level Output  
Voltage  
VDDIO = 1.71V to 1.89V  
IOL = +4 mA  
Deserializer LVCMOS  
Outputs  
GND  
0.45  
V
Serializer GPO  
Outputs  
-11  
-20  
±1  
Output Short Circuit  
Current  
VOUT = 0V  
mA  
µA  
Deserializer LVCMOS  
Outputs  
IOZ  
TRI-STATE Output  
Current  
PDB = 0V,  
VOUT = 0V or VDD  
LVCMOS Outputs  
-20  
+20  
CML DRIVER DC SPECIFICATIONS (DOUT+, DOUT-)  
Output Differential  
Voltage  
|VOD  
|
RT = 100(Figure 8)  
RL = 100Ω  
268  
340  
412  
50  
mV  
mV  
V
Output Differential  
Voltage Unbalance  
ΔVOD  
1
VDD - VOD  
1
VOS  
Output Differential  
Offset Voltage  
VDD (MIN)  
VOD (MAX)  
-
VDD (MAX)  
VOD (MIN)  
-
RL = 100(Figure 8)  
RL = 100Ω  
ΔVOS  
IOS  
Offset Voltage  
Unbalance  
50  
mV  
mA  
Output Short Circuit  
Current  
DOUT+/- = 0V  
-27  
RT  
Differential Internal  
Termination  
Differential across DOUT+ and DOUT-  
80  
100  
120  
Resistance  
CML RECEIVER DC SPECIFICATIONS (RIN+, RIN-)  
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as  
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and  
are not ensured.  
(2) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground  
except VOD, ΔVOD, VTH and VTL which are differential voltages.  
(3) Typical values represent most likely parametric norms at 1.8V or 3.3V, TA = +25°C, and at the Recommended Operation Conditions at  
the time of product characterization and are not ensured.  
8
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Electrical Characteristics(1)(2)(3)  
(continued)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Differential Threshold  
High Voltage  
VTH  
+90  
(Figure 10)  
RIN+ - RIN-  
mV  
VTL  
VIN  
Differential Threshold  
Low Voltage  
-90  
Differential Input  
Voltage Range  
180  
-20  
mV  
µA  
IIN  
Input Current  
VIN = VDD or 0V, VDD = 1.89V  
±1  
+20  
120  
RT  
Differential Internal  
Termination  
Differential across RIN+ and RIN-  
80  
100  
Resistance  
SER/DES SUPPLY CURRENT *DIGITAL, PLL, AND ANALOG VDD  
IDDT  
RT = 100Ω  
WORST CASE pattern  
(Figure 5)  
Serializer (Tx)  
VDDn Supply Current  
(includes load  
current)  
62  
55  
2
90  
VDDn = 1.89V  
PCLK = 43 MHz  
Default Registers  
mA  
RT = 100Ω  
RANDOM PRBS-7 pattern  
IDDIOT  
VDDIO = 1.89V  
PCLK = 43 MHz  
Default Registers  
5
Serializer (Tx)  
VDDIO Supply  
Current (includes load  
current)  
RT = 100Ω  
WORST CASE pattern  
(Figure 5)  
mA  
µA  
VDDIO = 3.6V  
PCLK = 43 MHz  
Default Registers  
7
15  
IDDTZ  
VDDn = 1.89V  
VDDIO = 1.89V  
VDDIO = 3.6V  
370  
55  
775  
125  
135  
Serializer (Tx) Supply PDB = 0V; All other  
Current Power-down LVCMOS Inputs = 0V  
IDDIOTZ  
65  
IDDR  
VDDn = 1.89V, CL = 8 pF  
PCLK = 43 MHz  
SSCG[3:0] = ON  
Default Registers  
Deserializer (Rx)  
WORST CASE Pattern  
60  
53  
21  
49  
96  
VDDn Supply Current  
(Figure 5)  
(includes load  
VDDn = 1.89V, CL = 8 pF  
current)  
PCLK = 43 MHz  
Default Registers  
RANDOM PRBS-7 Pattern  
mA  
IDDIOR  
VDDIO = 1.89V, CL = 8 pF  
PCLK = 43 MHz  
Default Registers  
Deserializer (Rx)  
WORST CASE Pattern  
32  
83  
VDDIO Supply  
(Figure 5)  
Current (includes load  
VDDIO = 3.6V, CL = 8 pF  
current)  
PCLK = 43 MHz  
Default Registers  
WORST CASE Pattern  
IDDRZ  
VDDn = 1.89V  
VDDIO = 1.89V  
VDDIO = 3.6V  
42  
8
400  
40  
Deserializer (Rx)  
PDB = 0V; All other  
Supply Current  
IDDIORZ  
µA  
LVCMOS Inputs = 0V  
Power-down  
350  
800  
Recommended Serializer Timing for PCLK(1)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
tTCP  
Transmit Clock Period  
23.3  
T
100  
ns  
tTCIH  
tTCIL  
tCLKT  
fOSC  
Transmit Clock Input High  
Time  
0.4T  
0.4T  
0.5  
0.5T  
0.5T  
0.6T  
0.6T  
3
ns  
ns  
10 MHz – 43 MHz  
Transmit Clock Input Low  
Time  
PCLK Input Transition Time  
(Figure 11)  
ns  
Internal oscillator clock  
source  
25  
MHz  
(1) Recommended Input Timing Requirements are input specifications and not tested in production.  
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Serializer Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
tLHT  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
CML Low-to-High Transition  
Time  
RL = 100(Figure 6)  
150  
330  
ps  
tHLT  
CML High-to-Low Transition  
Time  
RL = 100(Figure 6)  
150  
330  
ps  
tDIS  
tDIH  
tPLD  
tSD  
Data Input Setup to PCLK  
Data Input Hold from PCLK  
Serializer PLL Lock Time  
2.0  
2.0  
ns  
ns  
Serializer Data Inputs (Figure 12)  
RL = 100(1)(2)  
1
2
ms  
RT = 100, PCLK = 10–43 MHz  
Register 0x03h b[0] (TRFB = 1)  
(Figure 14)  
6.386T  
+ 5  
6.386T  
+ 12  
6.386T  
+ 19.7  
Serializer Delay  
ns  
UI  
UI  
tJIND  
Serializer output intrinsic deterministic  
jitter . Measured (cycle-cycle) with  
PRBS-7 test pattern  
Serializer Output  
Deterministic Jitter  
0.13  
0.04  
PCLK = 43 MHz(3)(4)  
tJINR  
Serializer output intrinsic random jitter  
(cycle-cycle). Alternating-1,0 pattern.  
PCLK = 43 MHz(3)(4)  
Serializer Output Random  
Jitter  
tJINT  
Serializer output peak-to-peak jitter  
includes deterministic jitter, random  
jitter, and jitter transfer from serializer  
input. Measured (cycle-cycle) with  
PRBS-7 test pattern.  
Peak-to-peak Serializer  
Output Jitter  
0.396  
UI  
PCLK = 43 MHz(3)(4)  
λSTXBW  
δSTX  
Serializer Jitter Transfer  
Function -3 dB Bandwidth  
PCLK = 43 MHz, Default Registers  
(Figure 20)(3)  
1.90  
MHz  
dB  
Serializer Jitter Transfer  
Function (Peaking)  
PCLK = 43 MHz, Default Registers  
(Figure 20)(3)  
0.944  
δSTXf  
Serializer Jitter Transfer  
Function (Peaking  
Frequency)  
PCLK = 43 MHz, Default Registers  
(Figure 20)(3)  
500  
kHz  
(1) tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK  
(2) Specification is ensured by design.  
(3) Typical values represent most likely parametric norms at 1.8V or 3.3V, TA = +25°C, and at the Recommended Operation Conditions at  
the time of product characterization and are not ensured.  
(4) UI – Unit Interval is equivalent to one ideal serialized data bit width. The UI scales with PCLK frequency.  
Deserializer Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
tRCP  
Parameter  
Conditions  
tRCP = tTCP  
Pin/Freq.  
Min  
Typ  
Max  
Units  
Receiver Output Clock Period  
PCLK  
23.3  
T
100  
ns  
tPDC  
Default Registers  
SSCG[3:0] = OFF  
PCLK Duty Cycle  
PCLK  
45  
50  
55  
%
LVCMOS Low-to-High Transition  
Time  
VDDIO: 1.71V to 1.89V or  
3.0 to 3.6V,  
tCLH  
tCHL  
1.3  
2.0  
2.8  
CL = 8 pF (lumped load) PCLK  
Default Registers  
ns  
LVCMOS High-to-Low Transition  
Time  
1.3  
1.6  
2.0  
2.4  
2.8  
3.3  
3.3  
(Figure 16)(1)  
LVCMOS Low-to-High Transition  
Time  
VDDIO: 1.71V to 1.89V or  
3.0 to 3.6V,  
CL = 8 pF (lumped load)  
Default Registers  
(Figure 16)(1)  
tCLH  
tCHL  
Deserializer ROUTn  
Data Outputs  
ns  
ns  
LVCMOS High-to-Low Transition  
Time  
1.6  
2.4  
tROS  
tROH  
ROUT Setup Data to PCLK  
ROUT Hold Data to PCLK  
VDDIO: 1.71V to 1.89V or  
3.0V to 3.6V,  
CL = 8 pF (lumped load) Data Outputs  
Default Registers  
0.38T  
0.38T  
0.5T  
0.5T  
Deserializer ROUTn  
(1) Specification is ensured by characterization and is not tested in production.  
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Deserializer Switching Characteristics (continued)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Deserializer Delay  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
Units  
Default Registers  
Register 0x03h b[0]  
(RRFB = 1) (Figure 17)  
4.571T  
+ 8  
4.571T  
+ 12  
4.571T  
+ 16  
tDD  
10 MHz–43 MHz  
ns  
tDDLT  
tRJIT  
Deserializer Data Lock Time  
Receiver Input Jitter Tolerance  
(Figure 15)(2)  
10 MHz–43 MHz  
43 MHz  
10  
ms  
UI  
(Figure 19,  
0.53  
Figure 21)(3)(4)  
tRCJ  
10 MHz  
43 MHz  
10 MHz  
43 MHz  
10 MHz  
43 MHz  
300  
120  
425  
320  
320  
300  
550  
250  
600  
480  
500  
500  
PCLK  
Receiver Clock Jitter  
ps  
ps  
ps  
SSCG[3:0] = OFF(1)(5)  
tDPJ  
PCLK  
Deserializer Period Jitter  
SSCG[3:0] = OFF(1)(6)  
tDCCJ  
Deserializer Cycle-to-Cycle Clock PCLK  
Jitter  
SSCG[3:0] = OFF(1)(7)  
fdev  
Spread Spectrum Clocking  
Deviation Frequency  
±0.5% to  
±2.0%  
20 MHz–43 MHz  
20 MHz–43 MHz  
%
LVCMOS Output Bus  
SSC[3:0] = ON  
(Figure 22)  
fmod  
Spread Spectrum Clocking  
Modulation Frequency  
9 kHz to  
66 kHz  
kHz  
(2) tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK  
(3) UI – Unit Interval is equivalent to one ideal serialized data bit width. The UI scales with PCLK frequency.  
(4) tRJIT max (0.61UI) is limited by instrumentation and actual tRJIT of in-band jitter at low frequency (<2 MHz) is greater 1 UI.  
(5) tDCJ is the maximum amount of jitter measured over 30,000 samples based on Time Interval Error (TIE).  
(6) tDPJ is the maximum amount the period is allowed to deviate measured over 30,000 samples.  
(7) tDCCJ is the maximum amount of jitter between adjacent clock cycles measured over 30,000 samples.  
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Units  
Bidirectional Control Bus AC Timing Specifications (SCL, SDA) - I2C Compliant  
Over recommended supply and temperature ranges unless otherwise specified. See Figure 4.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
RECOMMENDED INPUT TIMING REQUIREMENTS(1)  
fSCL  
SCL Clock Frequency  
SCL Low Period  
>0  
4.7  
4.0  
100  
kHz  
µs  
tLOW  
tHIGH  
SCL High Period  
µs  
Hold time for a start or a repeated start  
condition  
tHD:STA  
tSU:STA  
4.0  
4.7  
µs  
µs  
Set Up time for a start or a repeated  
start condition  
fSCL = 100 kHz  
tHD:DAT  
tSU:DAT  
tSU:STO  
tr  
Data Hold Time  
0
3.45  
µs  
ns  
µs  
ns  
ns  
pF  
Data Set Up Time  
250  
4.0  
Set Up Time for STOP Condition  
SCL & SDA Rise Time  
SCL & SDA Fall Time  
Capacitive load for bus  
1000  
300  
tf  
Cb  
400  
SWITCHING CHARACTERISTICS(2)  
Serializer MODE = 0 – R/W  
Register 0x05 = 0x40'h  
100  
100  
fSCL  
SCL Clock Frequency  
SCL Low Period  
kHz  
µs  
Deserializer MODE = 0 – READ  
Register 0x06 b[6:4] = 0x00'h  
Serializer MODE = 0 – R/W  
Register 0x05 = 0x40'h  
tLOW  
4.7  
4.0  
Deserializer MODE = 0 – READ  
Register 0x06 b[6:4] = 0x00'h  
Serializer MODE = 0 – R/W  
Register 0x05 = 0x40'h  
tHIGH  
SCL High Period  
µs  
Deserializer MODE = 0 – READ  
Register 0x06 b[6:4] = 0x00'h  
Hold time for a start or a repeated start  
condition  
Serializer MODE = 0  
Register 0x05 = 0x40'h  
tHD:STA  
tSU:STA  
4.0  
4.7  
µs  
µs  
Set Up time for a start or a repeated  
start condition  
Serializer MODE = 0  
Register 0x05 = 0x40'h  
tHD:DAT  
tSU:DAT  
tSU:STO  
tf  
Data Hold Time  
0
3.45  
300  
µs  
ns  
µs  
ns  
Data Set Up Time  
250  
4.0  
Set Up Time for STOP Condition  
SCL & SDA Fall Time  
Serializer MODE = 0  
Bus free time between a stop and start  
condition  
tBUF  
Serializer MODE = 0  
Serializer MODE = 1  
4.7  
µs  
1
tTIMEOUT NACK Time out  
ms  
Deserializer MODE = 1  
Register 0x06 b[2:0]=111'b  
25  
(1) Recommended Input Timing Requirements are input specifications and not tested in production.  
(2) Specification is ensured by design.  
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SDA  
SCL  
t
BUF  
t
f
t
t
HD;STA  
t
r
LOW  
t
t
f
r
t
t
HD;STA  
SU;STA  
t
SU;STO  
t
HIGH  
t
t
SU;DAT  
HD;DAT  
STOP START  
START  
REPEATED  
START  
Figure 4. Bidirectional Control Bus Timing  
Bidirectional Control Bus DC Characteristics (SCL, SDA) - I2C Compliant  
Over recommended supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
VIH  
VIL  
0.7 x  
VDDIO  
Input High Level  
SDA and SCL  
VDDIO  
V
0.3 x  
VDDIO  
Input Low Level Voltage  
SDA and SCL  
SDA and SCL  
GND  
V
VHY  
IOZ  
IIN  
Input Hysteresis  
>50  
±1  
mV  
µA  
µA  
pF  
TRI-STATE Output Current  
Input Current  
PDB = 0V, VOUT = 0V or VDD  
-20  
-20  
+20  
+20  
SDA or SCL, Vin = VDDIO or GND  
±1  
CIN  
VOL  
Input Pin Capacitance  
<5  
SCL and SDA, VDDIO = 3.0V  
IOL = 1.5 mA  
0.36  
0.36  
V
V
Low Level Output Voltage  
SCL and SDA, VDDIO = 1.71V  
IOL = 1 mA  
AC Timing Diagrams and Test Circuits  
Device Pin Name  
Signal Pattern  
T
PCLK  
(RFB = H)  
D
/R  
IN OUT  
Figure 5. “Worst Case” Test Pattern  
80%  
20%  
80%  
Vdiff  
Vdiff = 0V  
20%  
t
t
LHT  
HLT  
Vdiff = (D  
+) - (D  
-)  
OUT  
OUT  
Figure 6. Serializer CML Output Load and Transition Times  
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100 nF  
100 nF  
D
+
OUT  
50W  
50W  
SCOPE  
BW 8 4.0 GHz  
Z
Diff  
= 100W  
100W  
D
-
OUT  
Figure 7. Serializer CML Output Load and Transition Times  
D
D
+
OUT  
21  
R
D
IN  
L
-
OUT  
PCLK  
Figure 8. Serializer VOD DC Diagram  
D
OUT  
-
Single Ended  
V
V
V
OD-  
OD  
OD+  
V
D
OUT  
+
OS  
ö
0V  
Differential  
V
OD+  
0V  
(D +)-(D )  
OUT OUT-  
V
OD-  
Figure 9. Serializer VOD DC Diagram  
RIN+  
RIN+  
RIN-  
V
TH  
V
CM  
V
TL  
V
V
IN  
V
ID  
V
IN  
ID  
RIN-  
GND  
Figure 10. Differential VTH/VTL Definition Diagram  
V
DD  
80%  
80%  
PCLK  
20%  
20%  
0V  
t
t
CLKT  
CLKT  
Figure 11. Serializer Input Clock Transition Times  
14  
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t
TCP  
PCLK  
DINn  
V
DDIO  
/2  
V
/2  
V
V
/2  
DDIO  
DDIO  
t
t
DIH  
DIS  
DDIO  
Setup  
Hold  
V
/2  
V
/2  
DDIO  
DDIO  
0V  
Figure 12. Serializer Setup/Hold Times  
VDDIO/2  
PDB  
PCLK  
t
PLD  
TRI-STATE  
TRI-STATE  
Output Active  
D
±
OUT  
Figure 13. Serializer Data Lock Time  
SYMBOL N  
VDDIO/2  
SYMBOL N+1  
SYMBOL N+2  
SYMBOL N+3  
D
IN  
t
SD  
PCLK  
SYMBOL N-4  
SYMBOL N-3  
SYMBOL N-2  
SYMBOL N-1  
SYMBOL N  
0V  
DOUT+-  
Figure 14. Serializer Delay  
VDDIO/2  
PDB  
t
DDLT  
R
IN±  
LOCK  
TRI-STATE  
VDDIO/2  
Figure 15. Deserializer Data Lock Time  
80%  
20%  
80%  
20%  
Deserializer  
8 pF  
lumped  
t
t
CHL  
CLH  
Figure 16. Deserializer LVCMOS Output Load and Transition Times  
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SYMBOL N  
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SYMBOL N + 1  
SYMBOL N + 2  
SYMBOL N + 3  
SYMBOL N + 3  
RIN±  
0V  
t
DD  
PCLK  
VDDIO/2  
SYMBOL N - 3  
SYMBOL N - 2  
SYMBOL N - 1  
SYMBOL N  
SYMBOL N+1  
ROUTn  
Figure 17. Deserializer Delay  
t
RCP  
V
DDIO  
PCLK  
1/2 V  
1/2 V  
DDIO  
DDIO  
0V  
V
DDIO  
ROUT[n],  
VS, HS  
1/2 V  
DDIO  
1/2 V  
DDIO  
0V  
t
t
ROH  
ROS  
Figure 18. Deserializer Output Setup/Hold Times  
Ideal Data  
Bit End  
Sampling  
Window  
Ideal Data Bit  
Beginning  
V
TH  
0V  
RxIN_TOL  
Left  
RxIN_TOL  
Right  
V
TL  
Ideal Center Position (t /2)  
BIT  
t
(1 UI)  
BIT  
t
= RxIN_TOL (Left + Right)  
RJIT  
Sampling Window = 1 UI - t  
RJIT  
Figure 19. Receiver Input Jitter Tolerance  
2
0
-2  
-4  
-6  
-8  
-10  
-12  
-14  
-16  
-18  
1.0E+04  
1.0E+05  
1.0E+06  
1.0E+07  
MODULATION FREQUENCY (Hz)  
Figure 20. Typical Serializer Jitter Transfer Function Curve at 43 MHz  
16  
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0.62  
0.61  
0.60  
0.59  
0.58  
0.57  
0.56  
0.55  
0.54  
0.53  
0.52  
1.0E+06  
JITTER FREQUENCY (Hz)  
1.0E+04  
1.0E+05  
1.0E+07  
Figure 21. Typical Deserializer Input Jitter Tolerance Curve at 43 MHz  
Frequency  
FPCLK+  
FPCLK  
FPCLK-  
fdev (max)  
fdev  
fdev (min)  
Time  
1 / fmod  
Figure 22. Spread Spectrum Clock Output Profile  
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Table 1. DS90UB903Q Control Registers  
Addr  
(Hex)  
Name  
Bits Field  
R/W  
Default  
Description  
7-bit address of Serializer; 0x58'h  
(1011_000X'b) default  
7:1  
DEVICE ID  
0
I2C Device ID  
RW  
0xB0'h  
0x00'h  
0: Device ID is from ID[x]  
0
SER ID SEL  
RESERVED  
1: Register I2C Device ID overrides ID[x]  
7:3  
Reserved  
Standby mode control. Retains control register data.  
Supported only when MODE = 0  
2
STANDBY  
RW  
0
0
0: Enabled. Low-current Standby mode with wake-up  
capability. Suspends all clocks and functions.  
1: Disabled. Standby and wake-up disabled  
1
2
Reset  
DIGITAL  
RESET0  
1: Resets the device to default register values. Does not  
1
0
RW  
RW  
self clear affect device I2C Bus or Device ID  
0
1: Digital Reset, retains all register values  
DIGITAL RESET1  
self clear  
Reserved  
Reserved  
7:0  
7:6  
RESERVED  
RESERVED  
0x20'h  
11'b  
Reserved  
Reserved  
Auto VDDIO detect  
Allows manual setting of VDDIO by register.  
0: Disable  
1: Enable (auto detect mode)  
VDDIO Control  
VDDIO Mode  
5
4
VDDIO CONTOL  
VDDIO MODE  
RW  
1
1
VDDIO voltage set  
Only used when VDDIOCONTROL = 0  
0: 1.8V  
1: 3.3V  
I2C Pass-Through  
0: Disabled  
RW  
RW  
I2C PASS-  
THROUGH  
I2C Pass-Through  
RESERVED  
3
2
1
0
3
1: Enabled  
RESERVED  
Reserved  
Switch over to internal 25 MHz Oscillator clock in the  
absence of PCLK  
0: Disable  
1: Enable  
PCLK_AUTO  
1
PCLK_AUTO  
RW  
RW  
1
Pixel Clock Edge Select:  
0: Parallel Interface Data is strobed on the Falling Clock  
Edge.  
TRFB  
0
TRFB  
1
1: Parallel Interface Data is strobed on the Rising Clock  
Edge.  
4
5
RESERVED  
I2C Bus Rate  
7:0  
7:0  
RESERVED  
0x80'h  
0x40'h  
0xC0'h  
Reserved  
I2C SCL frequency is determined by the following:  
fSCL = 6.25 MHz / Register value (in decimal)  
0x40'h = ~100 kHz SCL (default)  
I2C BUS RATE  
RW  
RW  
Note: Register values <0x32'h are NOT supported.  
Deserializer Device ID = 0x60'h  
(1100_000X'b) default  
7:1  
DES DEV ID  
6
7
DES ID  
0
RESERVED  
SLAVE DEV ID  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
Reserved  
7:1  
0
RW  
0x00'h  
Slave Device ID. Sets remote slave I2C address.  
Slave ID  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
8
9
Reserved  
Reserved  
Reserved  
Reserved  
7:0  
7:0  
7:0  
7:0  
0x00'h  
0x01'h  
0x00'h  
0x00'h  
A
B
18  
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Table 1. DS90UB903Q Control Registers (continued)  
Addr  
(Hex)  
Name  
Reserved  
PCLK Detect  
Reserved  
Bits Field  
R/W  
Default  
Description  
7:3  
2
RESERVED  
0x00'h  
Reserved  
1: Valid PCLK detected  
0: Valid PCLK not detected  
PCLK DETECT  
RESERVED  
R
0
0
0
C
3
Reserved  
Cable Link Detect  
Status  
0: Cable link not detected  
1: Cable link detected  
0
LINK DETECT  
R
D
E
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
7:0  
7:0  
7:0  
7:0  
7:0  
7:0  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
GPCR[7]  
0x11'h  
0x01'h  
0x03'h  
0x03'h  
0x03'h  
0x03'h  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
0: LOW  
F
10  
11  
12  
GPCR[6]  
1: HIGH  
GPCR[5]  
GPCR[4]  
General Purpose  
Control Reg  
13  
7:0  
RW  
0x00'h  
GPCR[3]  
GPCR[2]  
GPCR[1]  
GPCR[0]  
Table 2. DS90UB904Q Control Registers  
Addr  
(Hex)  
Name  
Bits  
Field  
R/W  
Default  
Description  
RW  
0xC0'h  
7-bit address of Deserializer; 0x60h  
(1100_000X) default  
7:1  
DEVICE ID  
0
I2C Device ID  
0: Device ID is from ID[x]  
0
DES ID SEL  
RESERVED  
1: Register I2C Device ID overrides ID[x]  
7:3  
0x00'h  
Reserved  
Remote Wake-up Select  
1: Enable  
Generate remote wakeup signal automatically wake-up  
the Serializer in Standby mode  
0: Disable  
2
REM_WAKEUP  
RW  
0
0
1
Reset  
Puts the Serializer in Standby mode  
1: Resets the device to default register values. Does not  
1
0
DIGITALRESET0  
DIGITALRESET1  
RW  
RW  
self clear affect device I2C Bus or Device ID  
0
1: Digital Reset, retains all register values  
self clear  
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Table 2. DS90UB904Q Control Registers (continued)  
Addr  
(Hex)  
Name  
Bits  
7:6  
5
Field  
RESERVED  
AUTO_CLOCK  
R/W  
Default  
00'b  
0
Description  
RESERVED  
Auto Clock  
Reserved  
1: Output PCLK or Internal 25 MHz Oscillator clock  
0: Only PCLK when valid PCLK present  
RW  
RW  
Output Sleep State Select  
0: Outputs = TRI-STATE, when LOCK = L  
1: Outputs = LOW , when LOCK = L  
OSS Select  
4
OSS_SEL  
0
SSCG Select  
0000: Normal Operation, SSCG OFF (default)  
0001: fmod (kHz) PCLK/2168, fdev ±0.50%  
0010: fmod (kHz) PCLK/2168, fdev ±1.00%  
0011: fmod (kHz) PCLK/2168, fdev ±1.50%  
0100: fmod (kHz) PCLK/2168, fdev ±2.00%  
0101: fmod (kHz) PCLK/1300, fdev ±0.50%  
0110: fmod (kHz) PCLK/1300, fdev ±1.00%  
0111: fmod (kHz) PCLK/1300, fdev ±1.50%  
1000: fmod (kHz) PCLK/1300, fdev ±2.00%  
1001: fmod (kHz) PCLK/868, fdev ±0.50%  
1010: fmod (kHz) PCLK/868, fdev ±1.00%  
1011: fmod (kHz) PCLK/868, fdev ±1.50%  
1100: fmod (kHz) PCLK/868, fdev ±2.00%  
1101: fmod (kHz) PCLK/650, fdev ±0.50%  
1110: fmod (kHz) PCLK/650, fdev ±1.00%  
1111: fmod (kHz) PCLK/650, fdev ±1.50%  
2
SSCG  
3:0  
SSCG  
0000'b  
RESERVED  
7:6  
5
RESERVED  
11'b  
1
Reserved  
Auto voltage control  
0: Disable  
1: Enable (auto detect mode)  
VDDIO Control  
VDDIO CONTROL  
RW  
RW  
VDDIO voltage set  
Only used when VDDIOCONTROL = 0  
0: 1.8V  
1: 3.3V  
I2C Pass-Through Mode  
0: Disabled  
VDDIO Mode  
4
3
VDDIO MODE  
0
1
I2C PASS-  
THROUGH  
3
I2C Pass-Through  
RW  
RW  
1: Enabled  
0: Disable  
1: Enable  
Auto ACK  
2
1
AUTO ACK  
RESERVED  
0
0
RESERVED  
Reserved  
Pixel Clock Edge Select  
0: Parallel Interface Data is strobed on the Falling Clock  
RRFB  
0
RRFB  
RW  
RW  
1
Edge  
1: Parallel Interface Data is strobed on the Rising Clock  
Edge.  
EQ Gain  
00'h = ~0.0 dB  
01'h = ~4.5 dB  
03'h = ~6.5 dB  
07'h = ~7.5 dB  
0F'h = ~8.0 dB  
1F'h = ~11.0 dB  
3F'h = ~12.5 dB  
FF'h = ~14.0 dB  
4
5
EQ Control  
7:0  
7:0  
EQ  
0x00'h  
0x00'h  
RESERVED  
RESERVED  
Reserved  
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Table 2. DS90UB904Q Control Registers (continued)  
Addr  
(Hex)  
Name  
Bits  
Field  
R/W  
Default  
Description  
RESERVED  
7
RESERVED  
0
Reserved  
Prescales the SCL clock line when reading data byte  
from a slave device (MODE = 0)  
000 : ~100 kHz SCL (default)  
001 : ~125 kHz SCL  
101 : ~11 kHz SCL  
110 : ~33 kHz SCL  
SCL Prescale  
Remote NACK  
6:4  
SCL_PRESCALE  
RW  
000'b  
111 : ~50 kHz SCL  
Other values are NOT supported.  
Remote NACK Timer Enable  
In slave mode (MODE = 1) if bit is set the I2C core will  
REM_NACK_TIME  
R
automatically timeout when no acknowledge condition  
was detected.  
1: Enable  
6
3
RW  
RW  
1
0: Disable  
Remote NACK Timeout.  
000: 2.0 ms  
001: 5.2 ms  
010: 8.6 ms  
Remote NACK  
2:0  
7:1  
NACK_TIMEOUT  
SER DEV ID  
111'b  
011: 11.8 ms  
100: 14.4 ms  
101: 18.4 ms  
110: 21.6 ms  
111: 25.0 ms  
RW  
RW  
0xB0'h  
0x00'h  
Serializer Device ID = 0x58'h  
(1011_000X'b) default  
7
SER ID  
0
7:1  
0
RESERVED  
ID[0] INDEX  
RESERVED  
ID[1] INDEX  
RESERVED  
ID[2] INDEX  
RESERVED  
ID[3] INDEX  
RESERVED  
ID[4] INDEX  
RESERVED  
ID[5] INDEX  
RESERVED  
ID[6] INDEX  
RESERVED  
ID[7] INDEX  
RESERVED  
ID[0] MATCH  
RESERVED  
ID[1] MATCH  
RESERVED  
ID[2] MATCH  
RESERVED  
ID[3] MATCH  
RESERVED  
ID[4] MATCH  
RESERVED  
Reserved  
Target slave Device ID slv_id0 [7:1]  
Reserved  
8
9
ID[0] Index  
ID[1] Index  
ID[2] Index  
ID[3] Index  
ID[4] Index  
ID[5] Index  
ID[6] Index  
ID[7] Index  
ID[0] Match  
ID[1] Match  
ID[2] Match  
ID[3] Match  
ID[4] Match  
7:1  
0
Target slave Device ID slv_id1 [7:1]  
Reserved  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
RW  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
0x00'h  
7:1  
0
Target slave Device ID slv_id2 [7:1]  
Reserved  
A
7:1  
0
Target slave Device ID slv_id3 [7:1]  
Reserved  
B
7:1  
0
Target slave Device ID slv_id4 [7:1]  
Reserved  
C
7:1  
0
Target slave Device ID slv_id5 [7:1]  
Reserved  
D
7:1  
0
Target slave Device ID slv_id6 [7:1]  
Reserved  
E
7:1  
0
Target slave Device ID slv_id7 [7:1]  
Reserved  
F
7:1  
0
Alias to match Device ID slv_id0 [7:1]  
Reserved  
10  
11  
12  
13  
14  
7:1  
0
Alias to match Device ID slv_id1 [7:1]  
Reserved  
7:1  
0
Alias to match Device ID slv_id2 [7:1]  
Reserved  
7:1  
0
Alias to match Device ID slv_id3 [7:1]  
Reserved  
7:1  
0
Alias to match Device ID slv_id4 [7:1]  
Reserved  
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Table 2. DS90UB904Q Control Registers (continued)  
Addr  
(Hex)  
Name  
Bits  
Field  
R/W  
Default  
Description  
7:1  
0
ID[5] MATCH  
RESERVED  
ID[6] MATCH  
RESERVED  
ID[7] MATCH  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
Alias to match Device ID slv_id5 [7:1]  
15  
16  
17  
ID[5] Match  
RW  
0x00'h  
Reserved  
7:1  
0
Alias to match Device ID slv_id6 [7:1]  
ID[6] Match  
ID[7] Match  
RW  
RW  
0x00'h  
0x00'h  
Reserved  
7:1  
0
Alias to match Device ID slv_id [7:1]  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
18  
19  
1A  
1B  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
7:0  
7:0  
7:0  
7:0  
7:3  
2
0x00'h  
0x01'h  
0x00'h  
0x00'h  
0x00'h  
0
Signal Detect  
Status  
0: Active signal not detected  
1: Active signal detected  
1C  
1
0
R
R
0
0
0: CDR/PLL Unlocked  
1: CDR/PLL Locked  
LOCK Pin Status  
1D  
1E  
1F  
20  
21  
22  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
7:0  
7:0  
7:0  
7:0  
7:0  
7:0  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
0x17'h  
0x07'h  
0x01'h  
0x01'h  
0x01'h  
0x01'h  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
GPCR[7]  
GPCR[6]  
GPCR[5]  
GPCR[4]  
GPCR[3]  
GPCR[2]  
GPCR[1]  
GPCR[0]  
0: LOW  
1: HIGH  
General Purpose  
Control Reg  
23  
7:0  
RW  
0x00'h  
BIST Enable  
24  
25  
BIST  
0
BIST_EN  
RW  
R
0
0: Normal operation  
1: Bist Enable  
BIST_ERR  
7:0  
7:6  
BIST_ERR  
0x00'h  
00'b  
Bist Error Counter  
11: Enable remote wake up mode  
00: Normal operation mode  
Other values are NOT supported  
REM_WAKEUP_  
EN  
RW  
Remote Wake  
Enable  
26  
27  
5:0  
7:6  
5:0  
7:5  
RESERVED  
BCC  
RW  
RW  
0
00'b  
0
Reserved  
11: Normal operation mode  
Reserved  
BCC  
RESERVED  
RESERVED  
0
Reserved  
CMLOUT P/N  
Enable  
1: Disabled (Default)  
0: Enabled  
3F  
CMLOUT Config  
4
RW  
1
0
3:0  
RESERVED  
Reserved  
22  
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FUNCTIONAL DESCRIPTION  
The DS90UB903Q/904Q FPD-Link III chipset is intended for video display applications. The Serializer/  
Deserializer chipset operates from a 10 MHz to 43 MHz pixel clock frequency. The DS90UB903Q transforms a  
21-bit wide parallel LVCMOS data bus along with a bidirectional control bus into a single high-speed differential  
pair. The high-speed serial bit stream contains an embedded clock and DC-balance information which enhances  
signal quality to support AC coupling. The DS90UB904Q receives the single serial data stream and converts it  
back into a 21-bit wide parallel data bus together with the bidirectional control channel data bus.  
The control channel function of the DS90UB903Q/904Q provides bidirectional communication between the host  
processor and display. The integrated control channel transfers data simultaneously over the same differential  
pair used for video data interface. This interface offers advantages over other chipsets by eliminating the need  
for additional wires for programming and control. The control supports I2C port. The bidirectional control channel  
offers asymmetrical communication and is not dependent on video blanking intervals.  
DISPLAY APPLICATION  
The DS90UB903Q/904Q chipset is intended for interface between a host (graphics processor) and a Display. It  
supports a 21 bit parallel video bus for 18-bit color depth (RGB666) display format. In a RGB666 configuration,  
18 color bits (R[5:0], G[5:0], B[5:0]), Pixel Clock (PCLK) and three control bits (VS, HS and DE) are supported  
across the serial link.  
The DS90UB903Q Serializer accepts a 21-bit parallel data bus along with a bidirectional control bus. The parallel  
data and bidirectional control channel information is converted into a single differential link. The integrated  
bidirectional control channel bus supports I2C compatible operation for controlling auxiliary data transport to and  
from host processor and display module. The DS90UB904Q Deserializer extracts the clock/control information  
from the incoming data stream and reconstructs the 21-bit data with control channel data.  
DS90UB903Q  
Serializer  
DS90UB904Q  
Deserializer  
FPD-Link III  
R[5:0]  
G[5:0]  
B[5:0]  
VS  
R[5:0]  
G[5:0]  
B[5:0]  
VS  
Graphics  
Controller  
---  
Timing  
Controller  
LCD Display  
--  
Touch Panel  
HS  
DE  
PCLK  
HS  
DE  
PCLK  
Video  
Processor  
SDA  
SCL  
2
SDA  
SCL  
2
mC  
mC  
I C  
I C  
Figure 23. Typical Display System Diagram  
SERIAL FRAME FORMAT  
The DS90UB903Q/904Q chipset will transmit and receive a pixel of data in the following format:  
I2C  
Bit 0 to Bit 20  
Figure 24. Serial Bitstream for 28-bit Symbol  
The High Speed Forward Channel is a 28-bit symbol composed of 21 bits of data containing video data & control  
information transmitted from Serializer to Deserializer. CLK1 and CLK0 represent the embedded clock in the  
serial stream. CLK1 is always HIGH and CLK0 is always LOW. This data payload is optimized for signal  
transmission over an AC coupled link. Data is randomized, balanced and scrambled.  
The bidirectional control channel data is transferred along with the high-speed forward data over the same serial  
link. This architecture provides a full duplex low speed forward channel across the serial link together with a high  
speed forward channel without the dependence of the video blanking phase.  
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DESCRIPTION OF BIDIRECTIONAL CONTROL BUS AND I2C MODES  
The I2C compatible interface allows programming of the DS90UB903Q, DS90UB904Q, or an external remote  
device (such as a display) through the bidirectional control channel. Register programming transactions to/from  
the DS90UB903Q/904Q chipset are employed through the clock (SCL) and data (SDA) lines. These two signals  
have open-drain I/Os and both lines must be pulled-up to VDDIO by external resistor. Figure 4 shows the timing  
relationships of the clock (SCL) and data (SDA) signals. Pull-up resistors or current sources are required on the  
SCL and SDA busses to pull them high when they are not being driven low. A logic zero is transmitted by driving  
the output low. A logic high is transmitted by releasing the output and allowing it to be pulled-up externally. The  
appropriate pull-up resistor values will depend upon the total bus capacitance and operating speed. The  
DS90UB903Q/904Q I2C bus data rate supports up to 100 kbps according to I2C specification.  
To start any data transfer, the DS90UB903Q/904Q must be configured in the proper I2C mode. Each device can  
function as an I2C slave proxy or master proxy depending on the mode determined by MODE pin. The Ser/Des  
interface acts as a virtual bridge between Master Controller Unit (MCU) and the remote device. When the MODE  
pin is set to High, the device is treated as a slave proxy; acts as a slave on behalf of the remote slave. When  
addressing a remote peripheral or Serializer/Deserializer (not wired directly to the MCU), the slave proxy will  
forward any byte transactions sent by the Master controller to the target device. When MODE pin is set to Low,  
the device will function as a master proxy device; acts as a master on behalf of the I2C master controller. Note  
that the devices must have complementary settings for the MODE configuration. For example, if the Serializer  
MODE pin is set to High then the Deserializer MODE pin must be set to Low and vice-versa.  
Bus Activity:  
Master  
Register  
Address  
Slave  
Address  
Data  
SDA Line  
7-bit Address  
P
S
0
A
C
K
A
C
K
A
C
K
Bus Activity:  
Slave  
Figure 25. Write Byte  
N
A
C
K
Bus Activity:  
Master  
Register  
Address  
Slave  
Address  
Slave  
Address  
S
P
SDA Line  
S
7-bit Address  
7-bit Address  
0
1
A
C
K
A
C
K
A
C
K
Data  
Bus Activity:  
Slave  
Figure 26. Read Byte  
ACK  
LSB  
MSB  
N/ACK  
SDA  
SCL  
MSB  
LSB  
R/W  
Direction  
7-bit Slave Address  
Data Byte  
Bit  
Acknowledge  
*Acknowledge  
or Not-ACK  
from the Device  
8
9
8
9
1
2
6
7
1
2
Repeated for the Lower Data Byte  
and Additional Data Transfers  
START  
STOP  
Figure 27. Basic Operation  
24  
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SDA  
SCL  
S
P
STOP condition  
START condition, or  
START repeat condition  
Figure 28. START and STOP Conditions  
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SLAVE CLOCK STRETCHING  
In order to communicate and synchronize with remote devices on the I2C bus through the bidirectional control  
channel, slave clock stretching must be supported by the I2C master controller/MCU. The chipset utilizes bus  
clock stretching (holding the SCL line low) during data transmission; where the I2C slave pulls the SCL line low  
prior to the 9th clock of every I2C data transfer (before the ACK signal). The slave device will not control the  
clock and only stretches it until the remote peripheral has responded.  
Any remote access involves the clock stretching period following the transmitted byte, prior to completion of the  
acknowledge bit. Since each byte transferred to the I2C slave must be acknowledged separately, the clock  
stretching will be done for each byte sent by the host controller. For remote accesses, the “Response Delay”  
shown is on the order of 12 µs (typical). See Application Note AN-2173 (SNLA131) for more details.  
ID[X] ADDRESS DECODER  
The ID[x] pin is used to decode and set the physical slave address of the Serializer/Deserializer (I2C only) to  
allow up to six devices on the bus using only a single pin. The pin sets one of six possible addresses for each  
Serializer/Deserializer device. The pin must be pulled to VDD (1.8V, NOT VDDIO)) with a 10 kresistor and a  
pull down resistor (RID) of the recommended value to set the physical device address. The recommended  
maximum resistor tolerance is 0.1% worst case (0.2% total tolerance).  
1.8V  
10k  
V
DDIO  
ID[x]  
RPU  
RPU  
SER  
or  
R
ID  
HOST  
SCL  
SDA  
SCL  
SDA  
DES  
To other  
Devices  
Figure 29. Bidirectional Control Bus Connection  
Table 3. ID[x] Resistor Value – DS90UB903Q  
ID[x] Resistor Value - DS90UB903Q Ser  
Resistor RID (±0.1%)  
Address 7'b(1)  
Address 8'b 0 appended (WRITE)  
0, GND  
2.0k  
7b' 101 1000 (h'58)  
7b' 101 1001 (h'59)  
7b' 101 1010 (h'5A)  
7b' 101 1011 (h'5B)  
7b' 101 1100 (h'5C)  
7b' 101 1110 (h'5E)  
8b' 1011 0000 (h'B0)  
8b' 1011 0010 (h'B2)  
8b' 1011 0100 (h'B4)  
8b' 1011 0110 (h'B6)  
8b' 1011 1000 (h'B8)  
8b' 1011 1100 (h'BC)  
4.7k  
8.2k  
12.1k  
39.0k  
(1) Specification is ensured by design.  
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Table 4. ID[x] Resistor Value – DS90UB904Q  
ID[x] Resistor Value - DS90UB904Q Des  
Address 7'b(1)  
Resistor RID (±0.1%)  
Address 8'b 0 appended (WRITE)  
8b' 1100 0000 (h'C0)  
0, GND  
2.0k  
7b' 110 0000 (h'60)  
7b' 110 0001 (h'61)  
8b' 1100 0010 (h'C2)  
4.7k  
7b' 110 0010 (h'62)  
8b' 1100 0100 (h'C4)  
8.2k  
7b' 110 0011 (h'63)  
8b' 1101 0110 (h'C6)  
12.1k  
39.0k  
7b' 110 0100 (h'64)  
8b' 1101 1000 (h'C8)  
7b' 110 0110 (h'66)  
8b' 1100 1100 (h'CC)  
(1) Specification is ensured by design.  
CAMERA MODE OPERATION  
In Camera mode, I2C transactions originate from the Deserializer from the Master controller (Figure 30). The I2C  
slave core in the Deserializer will detect if a transaction is intended for the Serializer or a slave at the Serializer.  
Commands are sent over the bidirectional control channel to initiate the transactions. The Serializer will receive  
the command and generate an I2C transaction on its local I2C bus. At the same time, the Serializer will capture  
the response on the I2C bus and return the response as a command on the forward channel link. The  
Deserializer parses the response and passes the appropriate response to the Deserializer I2C bus.  
To configure the devices for camera mode operation, set the Serializer MODE pin to Low and the Deserializer  
MODE pin to High. Before initiating any I2C commands, the Deserializer needs to be programmed with the target  
slave device addresses and Serializer device address. SER_DEV_ID Register 0x07h sets the Serializer device  
address and SLAVE_x_MATCH/SLAVE_x_INDEX registers 0x08h~0x17h set the remote target slave addresses.  
The slave address match registers must also be set. In slave mode the address register is compared with the  
address byte sent by the I2C master. If the addresses are equal to any of registers values, the I2C slave will  
acknowledge the transaction to the I2C master allowing reads or writes to target device.  
DS90UB904Q  
DS90UB903Q  
Deserializer  
Host  
--  
Serializer  
FPGA  
--  
Video  
Processor  
CMOS  
Image  
Sensor  
DIN[20:0]  
PCLK  
ROUT[20:0]  
PCLK  
µC  
I2C  
I2C  
SDA  
SCL  
SDA  
SCL  
Figure 30. Typical Camera System Diagram  
DISPLAY MODE OPERATION  
In Display mode, I2C transactions originate from the controller attached to the Serializer. The I2C slave core in  
the Serializer will detect if a transaction targets (local) registers within the Serialier or the (remote) registers within  
the Deserializer or a remote slave connected to the I2C master interface of the Deserializer. Commands are sent  
over the forward channel link to initiate the transactions. The Deserializer will receive the command and generate  
an I2C transaction on its local I2C bus. At the same time, the Deserializer will capture the response on the I2C  
bus and return the response as a command on the bidirectional control channel. The Serializer parses the  
response and passes the appropriate response to the Serializer I2C bus.  
The physical device ID of the I2C slave in the Serializer is determined by the analog voltage on the ID[x] input. It  
can be reprogrammed by using the SER_DEV_ID register and setting the bit . The device ID of the logical I2C  
slave in the Deserializer is determined by programming the DES ID in the Serializer. The state of the ID[x] input  
on the Deserializer is used to set the device ID. The I2C transactions between Ser/Des will be bridged between  
the host to the remote slave.  
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To configure the devices for display mode operation, set the Serializer MODE pin to High and the Deserializer  
MODE pin to Low. Before initiating any I2C commands, the Serializer needs to be programmed with the target  
slave device address and Serializer device address. DES_DEV_ID Register 0x06h sets the Deserializer device  
address and SLAVE_DEV_ID register 0x7h sets the remote target slave address. If the I2C slave address  
matches any of registers values, the I2C slave will acknowledge the transaction allowing read or write to target  
device. Note: In Display mode operation, registers 0x08h~0x17h on Deserializer must be reset to 0x00.  
PROGRAMMABLE CONTROLLER  
An integrated I2C slave controller is embedded in each of the DS90UB903Q Serializer and DS90UB904Q  
Deserializer. It must be used to access and program the extra features embedded within the configuration  
registers. Refer to Table 1 and Table 2 for details of control registers.  
I2C PASS THROUGH  
I2C pass-through provides an alternative means to independently address slave devices. The mode enables or  
disables I2C bidirectional control channel communication to the remote I2C bus. This option is used to determine  
whether or not an I2C instruction is to be transferred over to the remote I2C device. When enabled, the I2C bus  
traffic will continue to pass through and will be received by I2C devices downstream. If disabled, I2C commands  
will be excluded to the remote I2C device. The pass through function also provides access and communication to  
only specific devices on the remote bus. The feature is effective for both Camera mode and Display mode.  
SYNCHRONIZING MULTIPLE LINKS  
For applications requiring synchronization across multiple links, it is recommended to utilize the General Purpose  
Input/Output (GPI/GPO) pins to transmit control signals to synchronize slave peripherals together. To  
synchronize the peripherals properly, the system controller needs to provide a sync signal output. Note this form  
of synchronization timing relationship has a non-deterministic latency. After the control data is reconstructed from  
the birectional control channel, there will be a time variation of the GPI/GPO signals arriving at the different target  
devices (between the parallel links). The maximum latency delta (t1) of the GPI/GPO data transmitted across  
multiple links is 25 us.  
Note: The user must verify that the timing variations between the different links are within their system and timing  
specifications.  
The maximum time (t1) between the rising edge of GPI/GPO (i.e. sync signal) arriving at SER A and SER B is 25  
us.  
DES A  
GPI[n] Input  
DES B  
GPI[n] Input  
SER A  
GPO[n] Output  
SER B  
GPO[n] Output  
t1  
Figure 31. GPI/GPO Delta Latency  
GENERAL PURPOSE I/O (GPI/GPO)  
The DS90UB903Q/904Q has up to 4 GPO and 4 GPI on the Serializer and Deserializer respectively. The  
GPI/GPO maximum switching rate is up to 66 kHz for communication between Deserializer GPI to Serializer  
GPO.  
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AT-SPEED BIST (BISTEN, PASS)  
An optional AT SPEED Built in Self Test (BIST) feature supports at speed testing of the high-speed serial and  
the bidirectional control channel link. Control pins at the Deserializer are used to enable the BIST test mode and  
allow the system to initiate the test and set the duration. A HIGH on PASS pin indicates that all payloads  
received during the test were error free during the BIST duration test. A LOW on this pin at the conclusion of the  
test indicates that one or more payloads were detected with errors.  
The BIST duration is defined by the width of BISTEN. BIST starts when Deserializer LOCK goes HIGH and  
BISTEN is set HIGH. BIST ends when BISTEN goes LOW. Any errors detected after the BIST Duration are not  
included in PASS logic.  
Note: AT-SPEED BIST is only available in the Camera mode and not the Display mode  
The following diagram shows how to perform system AT SPEED BIST:  
Serializer MODE = 0 and Deserializer MODE = 1  
Apply power for Serializer and Deserializer  
Normal  
Step 1: Enable AT SPEED BIST by placing the  
Deserializer in BIST by mode setting BISTEN = H  
BIST Wait  
Step 4: Place System in  
Normal Operating Mode  
BISTEN = L  
Step 2: Deserializer will setup Serializer and enable BIST  
mode through Bidirectional control channel  
communication and then reacquire forward channel clock  
BIST Start  
Step 3: Stop AT SPEED BIST by turning off BIST  
mode with BISTEN = L at the Deserializer.  
BIST Stop  
Figure 32. AT-SPEED BIST System Flow Diagram  
Step 1: Place the Deserializer in BIST Mode.  
Serializer and Deserializer power supply must be supplied. Enable the AT SPEED BIST mode on the  
Deserializer by setting the BISTEN pin High. The 904 GPI[1:0] pins are used to select the PCLK frequency of the  
on-chip oscillator for the BIST test on high speed data path.  
Table 5. BIST Oscillator Frequency Select  
Des GPI[1:0]  
Oscillator Source  
External PCLK  
min (MHz)  
typ (MHz)  
max (MHz)  
00  
01  
10  
11  
10  
43  
Internal  
Internal  
Internal  
50  
25  
12.5  
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The Deserializer GPI[1:0] set to 00 will bypass the on-chip oscillator and an external oscillator to Serializer PCLK  
input is required. This allows the user to operate BIST under different frequencies other than the predefined  
ranges.  
Step 2: Enable AT SPEED BIST by placing the Serializer into BIST mode.  
Deserializer will communicate through the bidirectional control channel to configure Serializer into BIST mode.  
Once the BIST mode is set, the Serializer will initiate BIST transmission to the Deserializer.  
Wait 10 ms for Deserializer to acquire lock and then monitor the LOCK pin transition from LOW to HIGH. At this  
point, AT SPEED BIST is operational and the BIST process has begun. The Serializer will start transfer of an  
internally generated PRBS data pattern through the high speed serial link. This pattern traverses across the  
interconnecting link to the Deserializer. Check the status of the PASS pin; a HIGH indicates a pass, a LOW  
indicates a fail. A fail will stay LOW for ½ a clock cycle. If two or more bits in the serial frame fail, the PASS pin  
will toggle ½ clock cycle HIGH and ½ clock cycle low. The user can use the PASS pin to count the number of  
fails on the high speed link. In addition, there is a defined SER and DES register that will keep track of the  
accumulated error count. The Serializer 903 GPO[0] pin will be assigned as a PASS flag error indicator for the  
bidirectional control channel link.  
Recovered  
Pixel Clock  
BISTEN  
Case 1: No bit errors  
Recovered  
Pixel Data  
Previous  
—BIST“ State  
PASS  
—BIST“ State  
—BIST“ State  
—BIST“ State  
Case 2: Bit error(s)  
Recovered  
Pixel Data  
B
B
B
B
Previous  
—BIST“ State  
PASS  
E
E
E
E
Case 3: Bit error(s) AFTER BIST  
Duration  
Recovered  
Pixel Data  
B
Previous  
PASS  
—BIST“ State  
B = Bad Pixel  
PE = Payload Error  
BIST Duration  
(when BISTEN=H)  
BIST Status  
(when BISTEN=L)  
Figure 33. BIST Timing Diagram  
Step 3: Stop at SPEED BIST by turning off BIST mode in the Deserializer to determine Pass/Fail.  
To end BIST, the system must pull BISTEN pin of the Deserializer LOW. The BIST duration is fully defined by  
the BISTEN width and Deserializer LOCK is HIGH; thus the Bit Error Rate is determined by how long the system  
holds BISTEN HIGH.  
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BIST Duration (s)  
fpixel (MHz)  
Pixel  
x Total Pixels Transmitted = Total Bits Transmitted  
BIST Duration (s) x  
=
1 Pixel period (ns) x Total Bits  
Bit (Pixel) Error Rate  
(for passing BIST)  
[Total Bits Transmitted] -1  
=
=
[Total Bits Transmitted x Bits/Pixel] -1  
Figure 34. BIST BER Calculation  
Step 4: Place system in Normal Operating Mode by disabling BIST at the Serializer.  
Once Step 3 is complete, AT SPEED BIST is over and the Deserializer is out of BIST mode. To fully return to  
Normal mode, apply Normal input data into the Serializer.  
Any PASS result will remain unless it is changed by a new BIST session or cleared by asserting and releasing  
PDB. The default state of PASS after a PDB toggle is HIGH.  
It is important to note that AT SPEED BIST will only determine if there is an issue on the link that is not related to  
the clock and data recovery of the link (whose status is flagged with LOCK pin).  
LVCMOS VDDIO OPTION  
1.8V or 3.3V SER Inputs and DES Outputs are user seletable to provide compatibility with 1.8V and 3.3V system  
interfaces.  
REMOTE WAKE UP (Camera Mode)  
After initial power up, the Serializer is in a low-power Standby mode. The Deserializer (controlled by ECU/MCU)  
'Remote Wake-up' register allows the Deserializer side to generate a signal across the link to remotely wake-up  
the Serializer. Once the Serializer detects the wake-up signal Serializer switches from Standby mode to active  
mode. In active mode, the Serializer locks onto PCLK input (if present), otherwise the on-chip oscillator is used  
as the input clock source. Note the MCU controller should monitor the Deserializer LOCK pin and confirm LOCK  
= H before performing any I2C communication across the link.  
For Remote Wake-up to function properly:  
The chipset needs to be configured in Camera mode: Serializer MODE = 0 and Deserializer MODE = 1  
Serializer expects remote wake-up by default at power on.  
Configure the control channel driver of the Deserializer to be in remote wake-up mode by setting Deserializer  
Register 0x26h = 0xC0h  
Perform remote wake-up on Serializer by setting Deserializer Register 0x01 b[2] = 1  
Return the control channel driver of the Deserializer to the normal operation mode by setting Deserializer  
Register 0x26h = 0x00h  
Configure the control channel driver of the Deserializer to be in normal operation mode by setting Deserializer  
Register 0x27h = 0xC0h.  
Serializer can also be put into standby mode by programming the Deserializer remote wake-up control register  
0x01 b[2] REM_WAKEUP to 0.  
POWERDOWN  
The SER has a PDB input pin to ENABLE or Powerdown the device. The modes can be controlled by the host  
and is used to disable the Link to save power when the remote device is not operational. An auto mode is also  
available. In this mode, the PDB pin is tied High and the SER switches over to an internal oscillator when the  
PCLK stops or not present. When a PCLK starts again, the SER will then lock to the valid input PCLK and  
transmits the data to the DES. In powerdown mode, the high-speed driver outputs are static (High).  
The DES has a PDB input pin to ENABLE or Powerdown the device. This pin can be controlled by the system  
and is used to disable the DES to save power. An auto mode is also available. In this mode, the PDB pin is tied  
High and the DES will enter powerdown when the serial stream stops. When the serial stream starts up again,  
the DES will lock to the input stream and assert the LOCK pin and output valid data. In powerdown mode, the  
Data and PCLK outputs are set by the OSS_SEL control register.  
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POWER UP REQUIREMENTS AND PDB PIN  
It is required to delay and release the PDB input signal after VDD (VDDn and VDDIO) power supplies have  
settled to the recommended operating voltages. A external RC network can be connected to the PDB pin to  
ensure PDB arrives after all the VDD have stabilized.  
SIGNAL QUALITY ENHANCERS  
Des - Receiver Input Equalization (EQ)  
The receiver inputs provided input equalization filter in order to compensate for loss from the media. The level of  
equalization is controlled via register setting. Note this function can be observed at the CMLOUTP/N test port  
enabled via the control registers.  
EMI REDUCTION  
Des - Receiver Staggered Output  
The Receiver staggered outputs allows for outputs to switch in a random distribution of transitions within a  
defined window. Outputs transitions are distributed randomly. This minimizes the number of outputs switching  
simultaneously and helps to reduce supply noise. In addition it spreads the noise spectrum out reducing overall  
EMI.  
Des Spread Spectrum Clocking  
The DS90UB904Q parallel data and clock outputs have programmable SSCG ranges from 9 kHz–66 kHz and  
±0.5%–±2% from 20 MHz to 43 MHz. The modulation rate and modulation frequency variation of output spread is  
controlled through the SSC control registers.  
PIXEL CLOCK EDGE SELECT (TRFB/RRFB)  
The TRFB/RRFB selects which edge of the Pixel Clock is used. For the SER, this register determines the edge  
that the data is latched on. If TRFB register is 1, data is latched on the Rising edge of the PCLK. If TRFB register  
is 0, data is latched on the Falling edge of the PCLK. For the DES, this register determines the edge that the  
data is strobed on. If RRFB register is 1, data is strobed on the Rising edge of the PCLK. If RRFB register is 0,  
data is strobed on the Falling edge of the PCLK.  
PCLK  
DIN/  
ROUT  
TRFB/RRFB: 0  
TRFB/RRFB: 1  
Figure 35. Programmable PCLK Strobe Select  
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APPLICATIONS INFORMATION  
AC COUPLING  
The SER/DES supports only AC-coupled interconnects through an integrated DC balanced decoding scheme.  
External AC coupling capacitors must be placed in series in the FPD-Link III signal path as illustrated in  
Figure 36.  
D
+
OUT  
R
+
IN  
D
R
D
-
R
IN  
-
OUT  
Figure 36. AC-Coupled Connection  
For high-speed FPD-Link III transmissions, the smallest available package should be used for the AC coupling  
capacitor. This will help minimize degradation of signal quality due to package parasitics. The I/O’s require a 100  
nF AC coupling capacitors to the line.  
TYPICAL APPLICATION CONNECTION  
Figure 37 shows a typical connection of the DS90UB903Q Serializer.  
DS90UB903Q (SER)  
1.8V  
VDDIO  
VDDT  
VDDIO  
C4  
C3  
FB2  
FB3  
FB1  
C12  
C8  
C13  
C9  
DIN0  
DIN1  
DIN2  
DIN3  
DIN4  
DIN5  
DIN6  
VDDPLL  
VDDCML  
VDDD  
C10  
C11  
C5  
C6  
C7  
FB4  
FB5  
DIN7  
DIN8  
DIN9  
DIN10  
DIN11  
DIN12  
DIN13  
LVCMOS  
Parallel  
Bus  
C1  
C2  
Serial  
DOUT+  
DOUT-  
DIN14  
DIN15  
DIN16  
DIN17  
DIN18  
FPD-Link III  
Interface  
1.8V  
DIN19  
DIN20  
PCLK  
10 kW  
LVCMOS  
Control  
Interface  
ID[X]  
MODE  
PDB  
RID  
GPO[0]  
GPO[1]  
GPO[2]  
GPO[3]  
GPO  
Control  
Interface  
NOTE:  
C1 - C2 = 0.1 mF (50 WV)  
C3 - C9 = 0.1 mF  
C10 - C13 = 4.7 mF  
C14 - C15 = >100 pF  
RPU = 1 kW to 4.7 kW  
RID (see ID[x] Resistor Value Table)  
FB1 - FB7: Impedance = 1 kW (@ 100 MHz)  
low DC resistance (<1W)  
VDDIO  
RPU  
RPU  
C15  
I2C  
Bus  
Interface  
SCL  
SDA  
FB6  
RES  
DAP (GND)  
The "Optional" components shown are  
provisions to provide higher system noise  
immunity and will therefore result in higher  
performance.  
FB7  
C14  
Optional  
Optional  
Figure 37. DS90UB903Q Typical Connection Diagram — Pin Control  
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Figure 38 shows a typical connection of the DS90UB904Q Deserializer.  
DS90UB904Q (DES)  
1.8V  
VDDIO  
VDDD  
VDDIO1  
VDDIO2  
VDDIO3  
FB1  
C13  
C11  
C8  
C12 C14  
FB6  
C3  
C4  
C5  
VDDR  
C9  
FB2  
FB3  
FB4  
VDDSSCG  
VDDPLL  
VDDCML  
C10  
ROUT0  
ROUT1  
ROUT2  
ROUT3  
ROUT4  
ROUT5  
ROUT6  
C15  
C6  
C7  
FB5  
C16  
C1  
ROUT7  
ROUT8  
ROUT9  
ROUT10  
ROUT11  
ROUT12  
ROUT13  
Serial  
RIN+  
RIN-  
LVCMOS  
Parallel  
Bus  
FPD-Link III  
Interface  
C2  
ROUT14  
ROUT15  
ROUT16  
ROUT17  
ROUT18  
ROUT19  
ROUT20  
TP_A  
TP_B  
RES_PIN38  
RES_PIN39  
LVCMOS  
Control  
Interface  
MODE  
PDB  
PCLK  
GPI[0]  
GPI[1]  
GPI[2]  
GPI[3]  
VDDIO  
RPU  
GPI  
Control  
Interface  
RPU  
C18  
I2C  
Bus  
SCL  
SDA  
FB7  
LOCK  
PASS  
Interface  
1.8V  
FB8  
C17  
Optional  
Optional  
NOTE:  
C1 - C2 = 0.1 mF (50 WV)  
C3 - C12 = 0.1 mF  
C13 - C16 = 4.7 mF  
C17 - C18 = >100 pF  
RPU = 1 kW to 4.7 kW  
10 kW  
ID[X]  
RES_PIN46  
DAP (GND)  
RID  
RID (see ID[x] Resistor Value Table)  
FB1 - FB8: Impedance = 1 kW (@ 100 MHz)  
low DC resistance (<1W)  
The "Optional" components shown are  
provisions to provide higher system noise  
immunity and will therefore result in higher  
performance.  
Figure 38. DS90UB904Q Typical Connection Diagram — Pin Control  
TRANSMISSION MEDIA  
The Ser/Des chipset is intended to be used over a wide variety of balanced cables depending on distance and  
signal quality requirements. The Ser/Des employ internal termination providing a clean signaling environment.  
The interconnect for FPD-Link III interface should present a differential impedance of 100 Ohms. Use of cables  
and connectors that have matched differential impedance will minimize impedance discontinuities. Shielded or  
un-shielded cables may be used depending upon the noise environment and application requirements. The  
chipset's optimum cable drive performance is achieved at 43 MHz at 10 meters length. The maximum signaling  
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Product Folder Links: DS90UB903Q DS90UB904Q  
 
DS90UB903Q, DS90UB904Q  
www.ti.com  
SNLS332E JUNE 2010REVISED APRIL 2013  
rate increases as the cable length decreases. Therefore, the chipset supports 50 MHz at shorter distances. Other  
cable parameters that may limit the cable's performance boundaries are: cable attenuation, near-end crosstalk  
and pair-to-pair skew. The maximum length of cable that can be used is dependant on the quality of the cable  
(gauge, impedance), connector, board (discontinuities, power plane), the electrical environment (e.g. power  
stability, ground noise, input clock jitter, PCLK frequency, etc.) and the application environment.  
The resulting signal quality at the receiving end of the transmission media may be assessed by monitoring the  
differential eye opening of the CMLOUT P/N output. A differential probe should be used to measure across the  
termination resistor at the CMLOUT P/N pins.  
For obtaining optimal performance, we recommend:  
Use Shielded Twisted Pair (STP) cable  
100Ω differential impedance and 24 AWG (or lower AWG) cable  
Low skew, impedance matched  
Ground and/or terminate unused conductors  
Figure 39 shows the Typical Performance Characteristics demonstrating various lengths and data rates using  
Rosenberger HSD and Leoni DACAR 538 Cable.  
70  
60  
50  
40  
30  
20  
10  
0
1960  
1680  
1400  
1120  
840  
DS90UB903Q/904Q  
560  
280  
0
0
5
15  
CABLE LENGTH (m)  
20  
25  
10  
*Note: Equalization is enabled for cable lengths greater than 7 meters  
Figure 39. Rosenberger HSD & Leoni DACAR 538 Cable Performance  
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS  
Circuit board layout and stack-up for the Ser/Des devices should be designed to provide low-noise power feed to  
the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize  
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by  
using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance  
for the PCB power system with low-inductance parasitics, which has proven especially effective at high  
frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass  
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the  
range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the  
tantalum capacitors should be at least 5X the power supply voltage being used.  
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per  
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power  
entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is  
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors  
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external  
bypass capacitor will increase the inductance of the path.  
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size  
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of  
these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple  
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At  
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing  
the impedance at high frequency.  
Copyright © 2010–2013, Texas Instruments Incorporated  
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SNLS332E JUNE 2010REVISED APRIL 2013  
www.ti.com  
Some devices provide separate power for different portions of the circuit. This is done to isolate switching noise  
effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin  
Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In  
some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs.  
Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the  
differential lines to prevent coupling from the LVCMOS lines to the differential lines. Closely-coupled differential  
lines of 100 Ohms are typically recommended for differential interconnect. The closely coupled lines help to  
ensure that coupled noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled  
lines will also radiate less.  
Information on the WQFN style package is provided in Application Note: AN-1187 “Leadless Leadframe Package  
(LLP) Application Report” (literature number SNOA401).  
INTERCONNECT GUIDELINES  
See AN-1108 (SNLA008) and AN-905 (SNLA035) for full details.  
Use 100Ω coupled differential pairs  
Use the S/2S/3S rule in spacings  
S = space between the pair  
2S = space between pairs  
3S = space to LVCMOS signal  
Minimize the number of Vias  
Use differential connectors when operating above 500Mbps line speed  
Maintain balance of the traces  
Minimize skew within the pair  
Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the Texas  
Instruments web site at: www.ti.com/lvds  
36  
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Copyright © 2010–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UB903Q DS90UB904Q  
DS90UB903Q, DS90UB904Q  
www.ti.com  
SNLS332E JUNE 2010REVISED APRIL 2013  
Revision History  
04/16/2012  
Added CMLOUT P/N in DS90UB904Q Deserializer Pin Descriptions  
Added ESD CDM and ESD MM values  
Added 3.3V I/O VOH conditions: IOH = -4 mA  
Corrected 3.3V I/O VOL conditions: IOL = +4 mA  
Changed NSID DS90UB903/904QSQX to qty 2500  
Added “Only used when VDDIOCONTROL = 0” note for UB904 Register 0x03 bit[4] description  
Added Register 0x27 BCC in UB904 Register table  
Added Register 0x3F CML Output in UB904 Register table  
Updated SLAVE CLOCK STRETCHING in Functional Description section  
Updated REMOTE WAKE UP (Camera Mode) procedure in Functional Description section  
Updated Des - Receiver Input Equalization (EQ) in Functional Description section  
Updated TRANSMISSION MEDIA in Applications Information section  
Copyright © 2010–2013, Texas Instruments Incorporated  
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DS90UB903Q, DS90UB904Q  
SNLS332E JUNE 2010REVISED APRIL 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision D (April 2013) to Revision E  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 37  
38  
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Copyright © 2010–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UB903Q DS90UB904Q  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 105  
-40 to 105  
-40 to 105  
-40 to 105  
-40 to 105  
-40 to 105  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
DS90UB903QSQ/NOPB  
DS90UB903QSQE/NOPB  
DS90UB903QSQX/NOPB  
DS90UB904QSQ/NOPB  
DS90UB904QSQE/NOPB  
DS90UB904QSQX/NOPB  
ACTIVE  
WQFN  
WQFN  
WQFN  
WQFN  
WQFN  
WQFN  
RTA  
40  
40  
40  
48  
48  
48  
1000  
Green (RoHS  
& no Sb/Br)  
SN  
SN  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
UB903QSQ  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
RTA  
RTA  
RHS  
RHS  
RHS  
250  
2500  
1000  
250  
Green (RoHS  
& no Sb/Br)  
UB903QSQ  
UB903QSQ  
UB904QSQ  
UB904QSQ  
UB904QSQ  
Green (RoHS  
& no Sb/Br)  
SN  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
Green (RoHS  
& no Sb/Br)  
2500  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Apr-2013  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DS90UB903QSQ/NOPB WQFN  
DS90UB903QSQE/NOPB WQFN  
DS90UB903QSQX/NOPB WQFN  
DS90UB904QSQ/NOPB WQFN  
DS90UB904QSQE/NOPB WQFN  
DS90UB904QSQX/NOPB WQFN  
RTA  
RTA  
RTA  
RHS  
RHS  
RHS  
40  
40  
40  
48  
48  
48  
1000  
250  
330.0  
178.0  
330.0  
330.0  
178.0  
330.0  
16.4  
16.4  
16.4  
16.4  
16.4  
16.4  
6.3  
6.3  
6.3  
7.3  
7.3  
7.3  
6.3  
6.3  
6.3  
7.3  
7.3  
7.3  
1.5  
1.5  
1.5  
1.3  
1.3  
1.3  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
2500  
1000  
250  
2500  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DS90UB903QSQ/NOPB  
DS90UB903QSQE/NOPB  
DS90UB903QSQX/NOPB  
DS90UB904QSQ/NOPB  
DS90UB904QSQE/NOPB  
DS90UB904QSQX/NOPB  
WQFN  
WQFN  
WQFN  
WQFN  
WQFN  
WQFN  
RTA  
RTA  
RTA  
RHS  
RHS  
RHS  
40  
40  
40  
48  
48  
48  
1000  
250  
367.0  
213.0  
367.0  
367.0  
213.0  
367.0  
367.0  
191.0  
367.0  
367.0  
191.0  
367.0  
38.0  
55.0  
38.0  
38.0  
55.0  
38.0  
2500  
1000  
250  
2500  
Pack Materials-Page 2  
MECHANICAL DATA  
RTA0040A  
SQA40A (Rev B)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
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requirements. Nonetheless, such components are subject to these terms.  
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Applications  
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