DS90UR916Q-Q1 [TI]

具有图像增强功能的 5MHz 至 65MHz 24 位彩色 FPD-Link II 解串器;
DS90UR916Q-Q1
型号: DS90UR916Q-Q1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有图像增强功能的 5MHz 至 65MHz 24 位彩色 FPD-Link II 解串器

光电二极管
文件: 总48页 (文件大小:628K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DS90UR916Q  
www.ti.com  
SNOSB46E MARCH 2011REVISED APRIL 2013  
DS90UR916Q 5 - 65 MHz 24-bit Color FPD-Link II Deserializer with Image Enhancement  
Check for Samples: DS90UR916Q  
1
FEATURES  
DESCRIPTION  
The DS90UR916Q FPD-Link II deserializer operates  
with the DS90UR905Q FPD-Link II serializer to  
2
5 – 65 MHz PCLK support (140 Mbps – 1.82  
Gbps)  
deliver 24-bit digital video data over  
a single  
RGB888 + VS, HS, DE Support  
differential pair. The DS90UR916Q provides features  
designed to enhance image quality at the display.  
The high speed serial bus scheme of FPD-Link II  
greatly eases system design by eliminating skew  
problems between clock and data, reduces the  
number of connector pins, reduces the interconnect  
size, weight, and cost, and overall eases PCB layout.  
In addition, internal DC balanced decoding is used to  
support AC-coupled interconnects.  
Image Enhancement - White Balance LUTs and  
Adaptive Hi-FRC Dithering  
AC Coupled STP Interconnect Cable up to 10  
Meters  
@ Speed Link BIST Mode and Reporting Pin  
I2C Compatible Serial Control Bus  
Power Down Mode Minimizes Power  
Dissipation  
The DS90UR916Q Des (deserializer) recovers the  
data (RGB) and control signals and extracts the clock  
from the serial stream. The Des locks to the incoming  
serial data stream without the use of a training  
sequence or special SYNC patterns, and does not  
require a reference clock. A link status (LOCK) output  
signal is provided. The DS90UR916Q is ideally suited  
for 24-bit color applications. White balance lookup  
tables and adaptive Hi-FRC dithering provide the user  
a cost-effective means to enhance display image  
quality.  
1.8V or 3.3V Compatible LVCMOS I/O Interface  
Automotive Grade Product: AEC-Q100 Grade 2  
Qualified  
>8 kV HBM and ISO 10605 ESD Rating  
FAST Random Ddata Lock; No Reference  
Clock Required  
Adjustable Input Receiver Equalization  
LOCK (Real Time Link Status) Reporting Pin  
EMI Minimization on Output Parallel Bus  
(SSCG)  
Serial transmission is optimized with user selectable  
receiver equalization. EMI is minimized by the use of  
low voltage differential signaling, output slew control,  
and the Des may be configured to generate Spread  
Spectrum Clock and Data on its parallel outputs.  
Output Slew Control (OS)  
Backward Compatible Mode for Operation with  
Older Generation Devices  
The DS90UR916Qis offered in a 60-pin WQFN  
package. It is specified over the automotive AEC-  
Q100 grade 2 temperature range of -40°C to +105°C.  
APPLICATIONS  
Automotive Display for Navigation  
Automotive Display for Entertainment  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011–2013, Texas Instruments Incorporated  
DS90UR916Q  
SNOSB46E MARCH 2011REVISED APRIL 2013  
www.ti.com  
Applications Diagram  
V
V
DDIO  
DDn  
V
V
DDIO  
(1.8Vor3.3V)  
DDn  
1.8V (1.8Vor3.3V)  
1.8V  
FPD-Link II  
1 Pair / AC Coupled  
R[7:0]  
G[7:0]  
R[7:0]  
G[7:0]  
RGB Display  
QVGA to XGA  
24-bit or  
18-bit dithered  
color depth  
B[7:0]  
B[7:0]  
HS  
VS  
DE  
PCLK  
100 nF  
100 nF  
HOST  
Graphics  
Processor  
HS  
DOUT+  
DOUT-  
RIN+  
RIN-  
VS  
DE  
PCLK  
100 ohm STP Cable  
CMF  
PDB  
DS90UR905Q  
Serializer  
DS90UR916Q  
Deserializer  
LOCK  
PASS  
PDB  
CONFIG [1:0]  
RFB  
BISTEN  
BISTEN  
STRAP pins  
not shown  
VODSEL  
DeEmph  
SCL  
SDA  
ID[x]  
SCL  
SDA  
ID[x]  
Optional  
Optional  
DAP  
DAP  
Figure 1.  
Block Diagrams  
STRAP INPUT  
SSCG  
CONFIG [1:0]  
LF_MODE  
OS_PCLK/DATA  
OSS_SEL  
CMF  
24  
RGB [7:0]  
RFB  
HS  
VS  
DE  
EQ [3:0]  
OSC_SEL [2:0]  
SSC [3:0]  
RIN+  
RIN-  
MAPSEL [1:0]  
STRAP INPUT  
OP_LOW  
Error  
Detector  
PASS  
BISTEN  
PDB  
SCL  
SCA  
ID[x]  
Clock and  
Data  
Recovery  
PCLK  
LOCK  
Timing and  
Control  
DS90UR916Q œ DESERIALIZER  
Figure 2.  
2
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DS90UR916Q  
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SNOSB46E MARCH 2011REVISED APRIL 2013  
DS90UR916Q Pin Diagram  
NC  
RES  
NC  
46  
47  
48  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
VDDL  
VDDIR  
RIN+  
G[0]/OSC_SEL[0]  
G[1]/OSC_SEL[1]  
G[2]/OSC_SEL[2]  
G[3]  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
RIN-  
CMF  
CMLOUTP  
CMLOUTN  
VDDCMLO  
VDDR  
VDDIO  
DS90UR916Q  
TOP VIEW  
G[4]/EQ[0]  
G[5]/EQ[1]  
G[6]/EQ[2]  
G[7]/EQ[3]  
B[0]  
DAP = GND  
ID[x]  
BOLD PIN NAME œ indicates I/O strap  
VDDPR  
VDDSC  
PDB  
pin associated with output pin  
B[1]/RFB  
B[2]/OSS_SEL  
NC  
NC  
Figure 3. Deserializer - DS90UR916Q — Top View  
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SNOSB46E MARCH 2011REVISED APRIL 2013  
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DS90UR916Q Deserializer Pin Descriptions(1)  
Pin Name  
Pin #  
I/O, Type  
Description  
LVCMOS Parallel Interface  
R[7:0]  
G[7:0]  
B[7:0]  
HS  
33, 34, 35,  
I, STRAP,  
RED Parallel Interface Data Output Pins (MSB = 7, LSB = 0)  
36, 37, 39, O, LVCMOS In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 5). These pins  
40, 41  
are inputs during power-up (See STRAP Inputs).  
20, 21, 22,  
I, STRAP,  
GREEN Parallel Interface Data Output Pins (MSB = 7, LSB = 0)  
23, 25, 26, O, LVCMOS In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 5). These pins  
27, 28  
are inputs during power-up (See STRAP Inputs).  
9, 10, 11,  
I, STRAP,  
BLUE Parallel Interface Data Output Pins (MSB = 7, LSB = 0)  
12, 14, 17, O, LVCMOS In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 5). These pins  
18, 19  
are inputs during power-up (See STRAP Inputs).  
8
O, LVCMOS Horizontal Sync Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Video  
control signal pulse width must be 3 PCLKs or longer to be transmitted when the Control  
Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition  
pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal is limited to 2  
transitions per 130 PCLKs.  
VS  
DE  
7
6
O, LVCMOS Vertical Sync Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Video  
control signal is limited to 1 transition per 130 PCLKs. Thus, the minimum pulse width is 130  
PCLKs.  
O, LVCMOS Data Enable Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Video  
control signal pulse width must be 3 PCLKs or longer to be transmitted when the Control  
Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition  
pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal is limited to 2  
transitions per 130 PCLKs.  
PCLK  
LOCK  
5
O, LVCMOS Pixel Clock Output  
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Strobe  
edge set by RFB function.  
32  
O, LVCMOS LOCK Status Output  
LOCK = 1, PLL is Locked, outputs are active LOCK = 0, PLL is unlocked, RGB[7:0], HS, VS,  
DE and PCLK output states are controlled by OSS_SEL (See Table 5). May be used as Link  
Status or to flag when Video Data is active (ON/OFF).  
PASS  
42  
O, LVCMOS PASS Output (BIST Mode)  
PASS = 1, error free transmission  
PASS = 0, one or more errors were detected in the received payload  
Route to test point for monitoring, or leave open if unused.  
Control and Configuration — STRAP PINS  
For a High State, use a 10 kpull up to VDDIO; for a Low State, the IO includes an internal pull down. The STRAP pins are read upon  
power-up and set device configuration. Pin Number listed along with shared RGB Output name in square brackets.  
CONFIG[1:0]  
10 [B6],  
9 [B7]  
STRAP  
Operating Modes — Pin or Register Control  
I, LVCMOS These pins determine the DS90UR916’s operating mode and interfacing device.  
w/ pull-down CONFIG[1:0] = 00: Interfacing to DS90UR905, Control Signal Filter DISABLED  
CONFIG[1:0] = 01: Interfacing to DS90UR905, Control Signal Filter ENABLED  
CONFIG[1:0] = 10: Interfacing to DS90UR241  
CONFIG[1:0] = 11: Interfacing to DS90C241  
LF_MODE  
12 [B4]  
STRAP  
SSCG Low Frequency Mode — Pin or Register Control  
I, LVCMOS Only required when SSCG is enabled, otherwise LF_MODE condition is a DON’T CARE (X).  
w/ pull-down LF_MODE = 1, SSCG in low frequency mode (PCLK = 5-20 MHz)  
LF_MODE = 0, SSCG in high frequency mode (PCLK = 20-65 MHz)  
OS_PCLK  
OS_DATA  
11 [B5]  
14 [B3]  
STRAP  
PCLK Output Slew Select — Pin or Register Control  
I, LVCMOS OS_PCLK = 1, increased PCLK slew  
w/ pull-down OS_PCLK = 0, normal (default)  
STRAP  
Data Output Slew Select — Pin or Register Control  
I, LVCMOS OS_DATA = 1, increased DATA slew  
w/ pull-down OS_DATA = 0, normal (default)  
(1) 1 = HIGH, 0 = LOW.  
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Product Folder Links: DS90UR916Q  
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SNOSB46E MARCH 2011REVISED APRIL 2013  
DS90UR916Q Deserializer Pin Descriptions(1) (continued)  
Pin Name  
Pin #  
I/O, Type  
Description  
OP_LOW  
42 PASS  
STRAP  
Outputs held Low when LOCK = 1 — Pin or Register Control  
I, LVCMOS NOTE: IT IS NOT RECOMMENDED TO USE ANY OTHER STRAP OPTIONS WITH THIS  
w/ pull-down STRAP FUNCTION  
OP_LOW = 1: all outputs are held LOW during power up until released by programming  
OP_LOW release/set register HIGH  
NOTE: Before the device is powered up, the outputs are in tri-state.  
See Figure 23 and Figure 24.  
OP_LOW = 0: all outputs toggle normally as soon as LOCK goes HIGH (default).  
OSS_SEL  
17 [B2]  
18 [B1]  
STRAP  
Output Sleep State Select — Pin or Register Control  
I, LVCMOS NOTE: OSS_SEL STRAP CANNOT BE USED IF OP_LOW =1  
w/ pull-down OSS_SEL is used in conjunction with PDB to determine the state of the outputs when  
inactive. (See Table 5).  
RFB  
STRAP  
Pixel Clock Output Strobe Edge Select — Pin or Register Control  
I, LVCMOS RFB = 1, parallel interface data and control signals are strobed on the rising clock edge.  
w/ pull-down RFB = 0, parallel interface data and control signals are strobed on the falling clock edge.  
EQ[3:0]  
20 [G7],  
21 [G6],  
22 [G5],  
23 [G4]  
STRAP  
I, LVCMOS (See Table 2).  
w/ pull-down  
Receiver Input Equalization — Pin or Register Control  
OSC_SEL[2:0]  
SSC[3:0]  
26 [G2],  
27 [G1],  
28 [G0]  
STRAP  
Oscillator Select — Pin or Register Control  
I, LVCMOS (See Table 6 and Table 7).  
w/ pull-down  
34 [R6],  
35 [R5],  
36 [R4],  
37 R[3]  
STRAP  
Spread Spectrum Clock Generation (SSCG) Range Select — Pin or Register Control  
I, LVCMOS (See Table 3 and Table 4).  
w/ pull-down  
MAP_SEL[1:0]  
40 [R1],  
41 [R0]  
STRAP  
Bit Mapping Backward Compatibility / DS90UR241 Options — Pin or Register Control  
I, LVCMOS Normal setting to b'00. See (Table 8).  
w/ pull-down  
Control and Configuration  
PDB  
59  
I, LVCMOS Power Down Mode Input  
w/ pull-down PDB = 1, Des is enabled (normal operation).  
Refer to POWER UP REQUIREMENTS AND PDB PIN in the Applications Information  
Section.  
PDB = 0, Des is in power-down.  
When the Des is in the power-down state, the LVCMOS output state is determined by  
Table 5. Control Registers are RESET.  
ID[x]  
56  
3
I, Analog  
Serial Control Bus Device ID Address Select — Optional  
Resistor to Ground and 10 kpull-up to 1.8V rail. (See Table 9).  
SCL  
I, LVCMOS Serial Control Bus Clock Input - Optional  
SCL requires an external pull-up resistor to VDDIO  
.
SDA  
2
I/O, LVCMOS Serial Control Bus Data Input / Output - Optional  
Open Drain SDA requires an external pull-up resistor to VDDIO  
.
BISTEN  
44  
I, LVCMOS BIST Enable Input — Optional  
w/ pull-down BISTEN = 1, BIST is enabled  
BISTEN = 0, BIST is disabled  
RES  
NC  
47  
I, LVCMOS Reserved - tie LOW  
w/ pull-down  
1, 15, 16,  
30, 31, 45,  
46, 60  
Not Connected  
Leave pin open (float)  
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DS90UR916Q Deserializer Pin Descriptions(1) (continued)  
Pin Name  
Pin #  
I/O, Type  
Description  
FPD-Link II Serial Interface  
RIN+  
RIN-  
CMF  
49  
50  
51  
I, LVDS  
I, LVDS  
I, Analog  
True Input. The input must be AC Coupled with a 100 nF capacitor.  
Inverting Input. The input must be AC Coupled with a 100 nF capacitor.  
Common-Mode Filter  
VCM center-tap is a virtual ground which may be ac-coupled to ground to increase receiver  
common mode noise immunity. Recommended value is 4.7 μF or higher.  
CMLOUTP  
CMLOUTN  
52  
53  
O, LVDS  
O, LVDS  
Test Monitor Pin — EQ Waveform  
NC or connect to test point. Requires Serial Bus Control to enable.  
Test Monitor Pin — EQ Waveform  
NC or connect to test point. Requires Serial Bus Control to enable.  
Power and Ground(2)  
VDDL  
29  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Ground  
Logic Power, 1.8 V ±5%  
VDDIR  
VDDR  
48  
43, 55  
4, 58  
57  
Input Power, 1.8 V ±5%  
RX High Speed Logic Power, 1.8 V ±5%  
SSCG Power, 1.8 V ±5%  
VDDSC  
VDDPR  
VDDCMLO  
VDDIO  
GND  
PLL Power, 1.8 V ±5%  
54  
RX High Speed Logic Power, 1.8 V ±5%  
13, 24, 38  
DAP  
LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10% (VDDIO)  
DAP is the large metal contact at the bottom side, located at the center of the WQFN  
package. Connected to the ground plane (GND) with at least 9 vias.  
(2) The VDD (VDDn and VDDIO) supply ramp should be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms then a capacitor on  
the PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.  
6
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SNOSB46E MARCH 2011REVISED APRIL 2013  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
Supply Voltage – VDDn (1.8V)  
Supply Voltage – VDDIO  
LVCMOS I/O Voltage  
Receiver Input Voltage  
Junction Temperature  
Storage Temperature  
60L WQFN Package  
0.3V to +2.5V  
0.3V to +4.0V  
0.3V to +(VDDIO + 0.3V)  
0.3V to (VDD + 0.3V)  
+150°C  
65°C to +150°C  
470mW  
Maximum Power Dissipation Capacity at  
25°C 470mW  
Derate above 25C  
1/θJA mW / °C  
24.6 °C/W  
2.8 °C/W  
±8 kV  
θJA(based on 9 thermal vias)  
θJC(based on 9 thermal vias)  
ESD Rating (HBM)  
ESD Rating (CDM)  
ESD Rating (MM)  
±1 kV  
±250 V  
ESD Rating (ISO10605), RD = 2kΩ, CS = 150pF or RD = 2kΩ, CS = 330pF or RD = 330Ω, CS = 150pF  
Air Discharge (RIN+, RIN−  
Contact Discharge (RIN+, RIN−  
ESD Rating (ISO10605), RD = 330Ω, CS = 330pF  
Air Discharge (RIN+, RIN−  
Contact Discharge (RIN+, RIN−  
ESD Rating (IEC 61000–4–2), RD = 330Ω, CS = 150pF  
Air Discharge (RIN+, RIN−  
Contact Discharge (RIN+, RIN−  
For soldering specifications see product folder at www.ti.com and SNOA549  
)
±30 kV  
±10 kV  
)
)
±15 kV  
±10 kV  
)
)
±25 kV  
±10 kV  
)
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of  
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or  
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating  
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
Recommended Operating Conditions  
Min  
1.71  
1.71  
Nom  
1.8  
Max  
1.89  
1.89  
Units  
Supply Voltage (VDDn  
)
V
V
LVCMOS Supply Voltage (VDDIO  
OR  
)
)
1.8  
LVCMOS Supply Voltage (VDDIO  
3.0  
40  
5
3.3  
3.6  
+105  
65  
V
Operating Free Air Temperature (TA)  
PCLK Clock Frequency  
Supply Noise(1)  
+25  
°C  
MHz  
mVP-P  
50  
(1) Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with  
amplitude = 100 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter  
cable shows no error when the noise frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the  
noise frequency is less than 400 kHz.  
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Deserializer DC Electrical Characteristics(1)(2)(3)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symb  
ol  
Parameter  
Conditions  
Pin/Freq.  
Units  
Min  
Typ  
Max  
3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V  
VIH  
VIL  
IIN  
High Level Input Voltage  
Low Level Input Voltage  
Input Current  
2.2  
GND  
15  
VDDIO  
0.8  
V
V
PDB, BISTEN  
VIN = 0V or VDDIO  
±1  
+15  
μA  
R[7:0], G[7:0],  
B[7:0], HS, VS,  
DE, PCLK, LOCK,  
PASS  
High Level Output  
Voltage  
VOH  
IOH = 2 mA, OS_PCLK/DATA = L  
2.4  
VDDIO  
V
V
R[7:0], G[7:0],  
B[7:0], HS, VS,  
DE, PCLK, LOCK,  
PASS  
Low Level Output  
Voltage  
VOL  
IOL = +2 mA, OS_PCLK/DATA = L  
GND  
0.4  
Output Short Circuit  
Current  
VDDIO = 3.3V  
VOUT = 0V, OS_PCLK/DATA = L/H  
PCLK  
36  
37  
mA  
mA  
µA  
IOS  
VDDIO = 3.3V  
VOUT = 0V  
OS_PCLK/DATA = L/H  
Output Short Circuit  
Current  
Des Outputs  
Outputs  
TRI-STATE® Output  
Current  
PDB = 0V, OSS_SEL = 0V,  
VOUT = 0V or VDDIO  
IOZ  
15  
+15  
1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V  
VIH  
VIL  
IIN  
High Level Input Voltage  
Low Level Input Voltage  
Input Current  
1.235  
GND  
15  
VDDIO  
0.595  
+15  
V
V
PDB, BISTEN  
VIN = 0V or VDDIO  
±1  
μA  
High Level Output  
Voltage  
VDDIO  
0.45  
R[7:0], G[7:0],  
B[7:0], HS, VS,  
DE, PCLK, LOCK,  
PASS  
VOH  
VOL  
IOH = 2 mA, OS_PCLK/DATA = L  
VDDIO  
V
V
Low Level Output  
Voltage  
IOL = +2 mA, OS_PCLK/DATA = L  
GND  
0.45  
VDDIO = 1.8V  
VOUT = 0V  
OS_PCLK/DATA = L/H  
Output Short Circuit  
Current  
PCLK  
18  
18  
mA  
mA  
IOS  
VDDIO = 1.8V  
VOUT = 0V  
OS_PCLK/DATA = L/H  
Output Short Circuit  
Current  
Des Outputs  
Outputs  
TRI-STATE® Output  
Current  
PDB = 0V, OSS_SEL = 0V,  
VOUT = 0V or VDDIO  
IOZ  
-15  
+50  
50  
+15  
µA  
mV  
mV  
Differential Input  
Threshold High Voltage  
VTH  
VTL  
VCM = +1.2V (Internal VBIAS  
)
Differential Input  
Threshold Low Voltage  
Common Mode Voltage,  
Internal VBIAS  
RIN+, RIN-  
VCM  
IIN  
1.2  
V
µA  
Input Current  
VIN = 0V or VDDIO  
-15  
80  
+15  
120  
Internal Termination  
Resistor  
RT  
100  
(1) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground  
except VOD, ΔVOD, VTH and VTL which are differential voltages.  
(2) Typical values represent most likely parametric norms at VDD = 3.3V, Ta = +25 degC, and at the Recommended Operation Conditions at  
the time of product characterization and are not ensured.  
(3) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as  
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and  
are not ensured.  
8
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Deserializer DC Electrical Characteristics(1)(2)(3) (continued)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symb  
ol  
Parameter  
Conditions  
Pin/Freq.  
Units  
Min  
Typ  
Max  
CML DRIVER OUTPUT DC SPECIFICATIONS – EQ TEST PORT  
Differential Output  
Voltage  
VOD  
VOS  
RT  
RL = 100Ω  
RL = 100Ω  
542  
1.4  
mV  
V
Offset Voltage  
Single-ended  
CMLOUTP,  
CMLOUTN  
Internal Termination  
Resistor  
80  
100  
120  
SUPPLY CURRENT  
IDD1  
Checker Board Pattern,  
OS_PCLK/DATA = H,  
EQ = 001,  
SSCG=ON,CMLOUTP/N  
enabled  
VDD= 1.89V  
VDDIO=1.89V  
All VDD pins  
93  
33  
110  
45  
mA  
mA  
Deserializer  
Supply Current  
(includes load current)  
IDDIO1  
VDDIO  
VDDIO = 3.6V  
62  
75  
mA  
CL = 4pF, Figure 4  
VDD= 1.89V  
VDDIO=1.89V  
VDDIO = 3.6V  
All VDD pins  
VDDIO  
40  
5
3000  
50  
µA  
µA  
µA  
IDDZ  
Deserializer Supply  
Current Power Down  
PDB = 0V, All other  
LVCMOS Inputs = 0V  
IDDIOZ  
10  
100  
Deserializer Switching Characteristics  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
tRCP  
Parameter  
PCLK Output Period  
PCLK Output Duty Cycle  
Conditions  
Pin/Freq.  
Min  
Typ  
Max  
200  
57  
Units  
ns  
PCLK  
PCLK  
15.38  
43  
T
tRDC  
SSCG=OFF, 5–65MHz  
SSCG=ON, 5–20MHz  
SSCG=ON, 20–65MHz  
50  
59  
53  
%
35  
65  
%
40  
60  
%
tCLH  
LVCMOS  
Low-to-High  
Transition Time, Figure 5  
VDDIO = 1.8V  
CL = 4 pF (lumped load)  
PCLK/RGB[7:0], HS, VS,  
DE  
2.1  
2.0  
1.6  
1.5  
ns  
ns  
ns  
ns  
VDDIO = 3.3V  
CL = 4 pF (lumped load)  
tCHL  
LVCMOS  
High-to-Low  
Transition Time, Figure 5  
VDDIO = 1.8V  
CL = 4 pF (lumped load)  
PCLK/RGB[7:0], HS, VS,  
DE  
VDDIO = 3.3V  
CL = 4 pF (lumped load)  
tROS  
Data Valid before PCLK – Set  
Up Time, Figure 9  
VDDIO = 1.71 to 1.89V or  
3.0 to 3.6V  
CL = 4 pF (lumped load)  
RGB[7:0], HS, VS, DE  
RGB[7:0], HS, VS, DE  
0.27  
0.45  
0.55  
T
T
tROH  
Data Valid after PCLK – Hold  
Time, Figure 9  
VDDIO = 1.71 to 1.89V or  
3.0 to 3.6V  
0.4  
6
CL = 4 pF (lumped load)  
tHBLANK Horizontal Blanking Time  
HS  
tRCP  
ms  
ms  
ms  
ms  
ns  
tDDLT  
Deserializer Lock Time,  
Figure 8  
SSC[3:0] = 0000 (OFF)(1)  
SSC[3:0] = 0000 (OFF)(1)  
SSC[3:0] = ON(1)  
PCLK = 5 MHz  
PCLK = 65MHz  
PCLK = 5MHz  
PCLK = 65MHz  
3
4
30  
SSC[3:0] = ON(1)  
6
tDD  
Des Delay - Latency, Figure 6  
Des Period Jitter  
139*T  
975  
500  
550  
140*T  
1700  
1000  
1250  
(2)  
tDPJ  
SSC[3:0] = OFF(3)(4)  
PCLK = 5 MHz  
PCLK = 10 MHz  
PCLK = 65 MHz  
ps  
ps  
ps  
(1) tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK.  
(2) Specification is ensured by design and is not tested in production.  
(3) tDPJ is the maximum amount the period is allowed to deviate over many samples.  
(4) Specification is ensured by characterization and is not tested in production.  
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Deserializer Switching Characteristics (continued)  
Over recommended operating supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
SSC[3:0] = OFF(4)(5)  
Pin/Freq.  
PCLK = 5 MHz  
Min  
Typ  
675  
375  
500  
0.9  
Max  
Units  
ps  
(2)  
tDCCJ  
Des Cycle-to-Cycle Jitter  
1150  
900  
PCLK = 10 MHz  
ps  
PCLK = 65 MHz  
1150  
ps  
UI(6)  
tRJIT  
Des Input Jitter Tolerance,  
Figure 11  
EQ = OFF,  
SSCG = OFF,  
PCLK = 65MHz  
for jitter freq < 2MHz  
for jitter freq > 6MHz  
0.5  
UI  
ns  
BIST Mode  
tPASS BIST PASS Valid Time,  
BISTEN = 1, Figure 12  
SSCG Mode  
1
10  
fDEV  
Spread Spectrum Clocking  
Deviation Frequency  
PCLK = 5 to 65 MHz,  
SSC[3:0] = ON  
±0.5  
8
±2  
%
fMOD  
Spread Spectrum Clocking  
Modulation Frequency  
PCLK = 5 to 65 MHz,  
SSC[3:0] = ON  
100  
kHz  
(5) tDCCJ is the maximum amount of jitter between adjacent clock cycles.  
(6) UI – Unit Interval is equivalent to one serialized data bit width (1UI = 1 / 28*PCLK). The UI scales with PCLK frequency.  
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Recommended Timing for the Serial Control Bus  
Over +3.3V supply and temperature ranges unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
>0  
Typ  
Max  
100  
400  
Units  
kHz  
kHz  
us  
fSCL  
SCL Clock Frequency  
Standard Mode  
Fast Mode  
>0  
tLOW  
SCL Low Period  
SCL High Period  
Standard Mode  
Fast Mode  
4.7  
1.3  
4.0  
0.6  
4.0  
us  
tHIGH  
Standard Mode  
Fast Mode  
us  
us  
tHD;STA Hold time for a start or a  
repeated start condition,  
Figure 13  
Standard Mode  
Fast Mode  
us  
0.6  
4.7  
0.6  
us  
us  
us  
tSU:STA Set Up time for a start or a  
repeated start condition,  
Figure 13  
Standard Mode  
Fast Mode  
tHD;DAT Data Hold Time, Figure 13  
Standard Mode  
Fast Mode  
0
3.45  
0.9  
us  
us  
ns  
ns  
us  
us  
us  
us  
ns  
ns  
ns  
ns  
0
tSU;DAT Data Set Up Time, Figure 13  
Standard Mode  
Fast Mode  
250  
100  
4.0  
0.6  
4.7  
1.3  
tSU;STO Set Up Time for STOP  
Condition, Figure 13  
Standard Mode  
Fast Mode  
tBUF  
Bus Free Time Between STOP Standard Mode  
and START, Figure 13  
Fast Mode  
tr  
SCL & SDA Rise Time,  
Figure 13  
Standard Mode  
Fast Mode  
1000  
300  
300  
300  
tf  
SCL & SDA Fall Time,  
Figure 13  
Standard Mode  
Fast mode  
DC and AC Serial Control Bus Characteristics  
Over 3.3V supply and temperature ranges unless otherwise specified.  
Symbol  
VIH  
VIL  
Parameter  
Input High Level  
Conditions  
Min  
2.2  
Typ  
Max  
VDDIO  
0.8  
Units  
V
SDA and SCL  
SDA and SCL  
Input Low Level Voltage  
Input Hysteresis  
GND  
V
VHY  
VOL  
Iin  
>50  
mV  
V
SDA, IOL = 1.25mA  
0
0.4  
SDA or SCL, Vin = VDDIO or GND  
-15  
+15  
µA  
ns  
ns  
ns  
ns  
ns  
pF  
tR  
SDA RiseTime – READ  
SDA Fall Time – READ  
SDA, RPU = X, Cb 400pF  
40  
25  
tF  
tSU;DAT Set Up Time — READ  
tHD;DAT Hold Up Time — READ  
520  
55  
tSP  
Cin  
Input Filter  
50  
Input Capacitance  
SDA or SCL  
<5  
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AC Timing Diagrams and Test Circuits  
V
DDIO  
PCLK  
w/ RFB = L  
GND  
V
DDIO  
RGB[n] (odd),  
VS, HS  
GND  
V
DDIO  
RGB[n] (even),  
DE  
GND  
Figure 4. Checkerboard Data Pattern  
V
DDIO  
80%  
20%  
GND  
t
t
CHL  
CLH  
Figure 5. Deserializer LVCMOS Transition Times  
START  
BIT  
STOP START  
BIT BIT  
STOP  
BIT  
RIN  
0
1
2
23  
0
1
2
23  
(Diff.)  
SYMBOL N  
SYMBOL N+1  
t
DD  
PCLK  
(RFB = L)  
RGB[7:0],  
SYMBOL N-2  
SYMBOL N-1  
SYMBOL N  
HS, VS, DE  
Figure 6. Deserializer Delay – Latency  
1/2 V  
DDIO  
PDB  
RIN  
(Diff.)  
active  
"X"  
t
XZR  
PCLK,  
RGB[7:0],  
DE, HS, VS,  
PASS, LOCK  
active  
Z (TRI-STATE)  
Figure 7. Deserializer Disable Time (OSS_SEL = 0)  
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2.0V  
PDB  
0.8V  
RIN  
(Diff.)  
Don‘t Care  
t
DDLT  
TRI-STATE  
or LOW  
LOCK  
Z or L  
t
RxZ  
RGB[7:0],  
HS, VS, DE  
TRI-STATE or LOW or Pulled Up  
Z or L or PU  
PCLK  
(RFB = L)  
TRI-STATE or LOW  
IN LOCK TIME  
Z or L  
OFF  
OFF  
ACTIVE  
Figure 8. Deserializer PLL Lock Times and PDB TRI-STATE Delay(1)  
Note: (1) When the Serializer output is at TRI-STATE the Deserializer will lose PLL lock. Resynchronization / Relock must occur before data transfer require  
tPLD  
V
DDIO  
PCLK  
w/ RFB = H  
1/2 V  
DDIO  
GND  
V
DDIO  
RGB[n],  
VS, HS, DE  
1/2 V  
DDIO  
GND  
t
t
ROH  
ROS  
Figure 9. Deserializer Output Data Valid (Setup and Hold) Times with SSCG = Off  
V
DDIO  
PCLK  
w/ RFB = H  
1/2 V  
DDIO  
GND  
RGB[n],  
VS, HS, DE  
1/2 V  
DDIO  
1/2 V  
V
DDIO  
DDIO  
GND  
t
t
ROH  
ROS  
Figure 10. Deserializer Output Data Valid (Setup and Hold) Times with SSCG = On  
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Ideal Data  
Bit End  
Sampling  
Window  
Ideal Data Bit  
Beginning  
V
TH  
0V  
RxIN_TOL  
Left  
RxIN_TOL  
Right  
V
TL  
Ideal Center Position (t /2)  
BIT  
t
(1 UI)  
BIT  
t
RJIT = RxIN_TOL (Left + Right)  
Sampling Window = 1 UI - t  
RJIT  
Figure 11. Receiver Input Jitter Tolerance  
BISTEN  
1/2 V  
DDIO  
tPASS  
PASS  
(w/ errors)  
1/2 V  
DDIO  
Prior BIST Result  
Current BIST Test - Toggle on Error  
Result Held  
Figure 12. BIST PASS Waveform  
SDA  
SCL  
t
BUF  
t
t
LOW  
t
f
t
r
HD;STA  
t
t
SP  
t
f
r
t
t
SU;STA  
t
HD;STA  
SU;STO  
t
HIGH  
t
t
SU;DAT  
HD;DAT  
STOP START  
START  
REPEATED  
START  
Figure 13. Serial Control Bus Timing Diagram  
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FUNCTIONAL DESCRIPTION  
The DS90UR905 / DS90UR916Q chipset transmits and receives 27-bits of data (24-high speed color bits and 3  
low speed video control signals) over a single serial FPD-Link II pair operating at 140Mbps to 1.82Gbps. The  
serial stream also contains an embedded clock, video control signals and the DC-balance information which  
enhances signal quality and supports AC coupling. The pair is intended for use with each other but is backward  
compatible with previous generations of FPD-Link II as well.  
The Des can attain lock to a data stream without the use of a separate reference clock source, which greatly  
simplifies system complexity and overall cost. The Des also synchronizes to the Ser regardless of the data  
pattern, delivering true automatic “plug and lock” performance. It can lock to the incoming serial stream without  
the need of special training patterns or sync characters. The Des recovers the clock and data by extracting the  
embedded clock information, validating and then deserializing the incoming data stream providing a parallel  
LVCMOS video bus to the display. White balance LUTs and dithering features are provided to enable display  
image enhancement.  
The DS90UR905 / DS90UR916Q chipset can operate in 24-bit color depth (with VS,HS,DE encoded in the DCA  
bit) or in 18-bit color depth (with VS, HS, DE encoded in DCA or mapped into the high-speed data bits). In 18–bit  
color applications, the three video signals maybe sent encoded via the DCA bit (restrictions apply) or sent as  
“data bits” along with three additional general purpose signals.  
Data Transfer  
The DS90UR905 / DS90UR916Q chipset will transmit and receive a pixel of data in the following format: C1 and  
C0 represent the embedded clock in the serial stream. C1 is always HIGH and C0 is always LOW. b[23:0]  
contain the scrambled RGB data. DCB is the DC-Balanced control bit. DCB is used to minimize the short and  
long-term DC bias on the signal lines. This bit determines if the data is unmodified or inverted. DCA is used to  
validate data integrity in the embedded data stream and can also contain encoded control (VS,HS,DE). Both  
DCA and DCB coding schemes are generated by the Ser and decoded by the Des automatically. Figure 14  
illustrates the serial stream per PCLK cycle.  
b
1
0
b
1
1
D
C
A
b
0
b
1
b
2
b
3
b
5
b
9
C
1
b
4
b
6
b
7
b
8
D
C
B
b
1
2
b
1
3
b
1
4
b
1
5
b
1
6
b
1
7
b
1
8
b
1
9
b
2
0
b
2
1
b
2
2
b
2
3
C
0
Figure 14. FPD-Link II Serial Stream (905/916)  
Des OPERATING MODES AND BACKWARD COMPATIBILITY (CONFIG[1:0])  
The DS90UR916Q is also backward compatible with previous generations of FPD-Link II. Configuration modes  
are provided for backwards compatibility with the DS90C124 FPD-Link II Generation 1, and also the DS90UR124  
FPD-Link II Generation 2 chipset by setting the respective mode with the CONFIG[1:0] pins or control register as  
shown in Table 1. The selection also determines whether the Video Control Signal filter feature is enabled or  
disabled in Normal mode.  
When the DS90UR916 deserializer is configured to operate in backward compatible modes the image  
enhancement features (white balance and FRC dithering) are not available.  
Table 1. DS90UR916Q Des Modes  
CONFIG1  
CONFIG0  
Mode  
Des Device  
DS90UR905  
DS90UR905  
DS90UR241  
DS90C241  
L
L
L
H
L
Normal Mode, Control Signal Filter disabled  
Normal Mode, Control Signal Filter enabled  
Backwards Compatible GEN2  
Backwards Compatible GEN1  
H
H
H
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Video Control Signal Filter  
When operating the devices in Normal Mode, the Video Control Signals (DE, HS, VS) have the following  
restrictions:  
Normal Mode with Control Signal Filter Enabled:  
DE and HS — Only 2 transitions per 130 clock cycles are transmitted, the transition pulse must be 3  
PCLK or longer.  
Normal Mode with Control Signal Filter Disabled:  
DE and HS — Only 2 transitions per 130 clock cycles are transmitted, no restriction on minimum transition  
pulse.  
VS — Only 1 transition per 130 clock cycles are transmitted, minimum pulse width is 130 clock cycles.  
Video Control Signals are defined as low frequency signals with limited transitions. Glitches of a control signal  
can cause a visual display error. This feature allows for the chipset to validate and filter out any high frequency  
noise on the control signals. See Figure 15.  
PCLK  
IN  
HS/VS/DE  
IN  
Latency  
PCLK  
OUT  
Pulses 1 or 2  
PCLKs wide  
Filetered OUT  
HS/VS/DE  
OUT  
Figure 15. Video Control Signal Filter Waveform  
DESERIALIZER Functional Description  
The Des converts a single input serial data stream to a wide parallel output bus, and also provides a signal  
check for the chipset Built In Self Test (BIST) mode. Several image enhancement features are provided (Note  
that these features are not available when operating in backward compatible modes). White balance LUTs allow  
the user to define and target the color temperature of the display. Adaptive Hi-FRC dithering enables the  
presentation of “true-color” images on an 18–bit color display. The device can be configured via external pins and  
strap pins or through the optional serial control bus. The Des features enhance signal quality on the link by  
supporting: an equalizer input and also the FPD-Link II data coding that provides randomization, scrambling, and  
DC balancing of the data. The Des includes multiple features to reduce EMI associated with display data  
transmission. This includes the randomization and scrambling of the data and also the output spread spectrum  
clock generation (SSCG) support. The Des features power saving features with a power down mode, and  
optional LVCMOS (1.8 V) interface compatibility.  
Image Enhancement Features  
White Balance  
The White Balance feature enables similar display appearance when using LCD’s from different vendors. It  
compensates for native color temperature of the display, and adjusts relative intensities of R, G, B to maintain  
specified color temperature. Programmable control registers are used to define the contents of three LUTs (8-bit  
color value for Red, Green and Blue) for the White Balance Feature. The LUTs map input RGB values to new  
output RGB values. There are three LUTs, one LUT for each color. Each LUT contains 256 entries, 8-bits per  
entry with a total size of 6144 bits (3 x 256 x 8). All entries are readable and writable. Calibrated values are  
loaded into registers through the I2C interface (deserializer is a slave device). This feature may also be applied  
to lower color depth applications such as 18–bit (666) and 16–bit (565). White balance is enabled and configured  
via serial bus register control.  
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LUT contents. The user must define and load the contents of the LUT for each color (R,G,B). Regardless of the  
color depth being driven (888, 666, 656), the user must always provide contents for 3 complete LUTs - 256  
colors x 8 bits x 3 tables. Unused bits - LSBs -shall be set to “0” by the user.  
When 24-bit (888) input data is being driven to a 24-bit display, each LUT (R, G and B) must contain 256 unique  
8-bit entries. The 8-bit white balanced data is then available at the output of the DS90UR916 deserailizer, and  
driven to the display.  
When 18-bit (666) input data is being driven to an 18-bit display, the white balance feature may be used in one of  
two ways. First, simply load each LUT with 256, 8-bit entries. Each 8-bit entry is a 6-bit value (6 MSBs) with the 2  
LSBs set to “00”. Thus as total of 64 unique 6-bit white balance output values are available for each color (R, G  
and B). The 6-bit white balanced data is available at the output of the DS90UR916 deserializer, and driven  
directly to the display.  
Alternatively, with 6-bit input data the user may choose to load complete 8-bit values into each LUT. This mode  
of operation provides the user with finer resolution at the LUT output to more closely achieve the desired white  
point of the calibrated display. Although 8-bit data is loaded, only 64 unique 8-bit white balance output values are  
available for each color (R, G and B). The result is 8-bit white balanced data. Before driving to the output of the  
deserializer, the 8-bit data must be reduced to 6-bit with an FRC dithering function. To operate in this mode, the  
user must configure the DS90UR916 to enable the FRC2 function.  
Examples of the three types of LUT configurations described are shown in Figure 16.  
Enabling white balance.The user must load all 3 LUTs prior to enabling the white balance feature. The following  
sequence must be followed by the user.  
To initialize white balance after power-on:  
1. Load contents of all 3 LUTs . This requires a sequential loading of LUTs - first RED, second GREEN, third  
BLUE. 256, 8-bit entries must be loaded to each LUT. Page registers must be set to select each LUT.  
2. Enable white balance  
By default, the LUT data may not be reloaded after initialization at power-on.  
An option does exist to allow LUT reloading after power-on and initial LUT loading (as described above). This  
option may only be used after enabling the white balance reload feature via the associated serial bus control  
register. In this mode the LUTs may be reloaded by the master controller via I2C. This provides the user with the  
flexibility to refresh LUTs periodically , or upon system requirements to change to a new set of LUT values. The  
host controller loads the updated LUT values via the serial bus interface. There is no need to disable the white  
balance feature while reloading the LUT data. Refreshing the white balance to the new set of LUT data will be  
seamless - no interruption of displayed data.  
It is important to note that initial loading of LUT values requires that all 3 LUTs be loaded sequentially. When  
reloading, partial LUT updates may be made. Refer to USING IMAGE ENHANCEMENT FEATURES for a  
detailed description of the LUT loading and reloading procedures.  
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8-bit in / 8 bit out  
6-bit in / 6 bit out  
6-bit in / 8 bit out  
Gray level Data Out  
Gray level Data Out  
Gray level Data Out  
Entry  
(8-bits)  
Entry  
(8-bits)  
Entry  
(8-bits)  
0
1
2
3
4
5
6
7
8
9
00000000b  
00000001b  
00000011b  
00000011b  
00000110b  
00000110b  
00000111b  
00000111b  
00001000b  
00001010b  
0 00000000b  
1 N/A  
0
00000001b  
1 N/A  
2 N/A  
3 N/A  
2 N/A  
3 N/A  
4 00000100b  
5 N/A  
4
00000110b  
5 N/A  
6 N/A  
7 N/A  
6 N/A  
7 N/A  
8 00001000b  
9 N/A  
8
00001011b  
9 N/A  
10 N/A  
11 N/A  
10 00001001b  
11 00001011b  
10 N/A  
11 N/A  
.
.
.
.
.
.
248 11111010b  
249 11111010b  
250 11111011b  
251 11111011b  
252 11111110b  
253 11111101b  
254 11111101b  
255 11111111b  
248 11111000b  
249 N/A  
248 11111010b  
249 N/A  
250 N/A  
250 N/A  
251 N/A  
252 11111100b  
253 N/A  
251 N/A  
252 11111111b  
253 N/A  
254 N/A  
255 N/A  
254 N/A  
255 N/A  
Figure 16. White Balance LUT Configurations  
Adaptive Hi-FRC Dithering  
The Adaptive FRC Dithering Feature delivers product-differentiating image quality. It reduces 24-bit RGB (8 bits  
per sub-pixel) to 18-bit RGB (6 bits per sub-pixel), smoothing color gradients, and allowing the flexibility to use  
lower cost 18-bit displays. FRC (Frame Rate Control) dithering is a method to emulate “missing” colors on a  
lower color depth LCD display by changing the pixel color slightly with every frame. FRC is achieved by  
controlling on and off pixels over multiple frames (Temporal). Static dithering regulates the number of on and off  
pixels in a small defined pixel group (Spatial). The FRC module includes both Temporal and Spatial methods and  
also Hi-FRC. Conventional FRC can display only 16,194,277 colors with 6-bit RGB source. “Hi-FRC” enables full  
(16,777,216) color on an 18-bit LCD panel. The “adaptive” FRC module also includes input pixel detection to  
apply specific Spatial dithering methods for smoother gray level transitions. When enabled, the lower LSBs of  
each RGB output are not active; only 18 bit data (6 bits per R,G and B) are driven to the display. This feature is  
enabled via serial bus register control.  
Two FRC functional blocks are available, and may be independently enabled. FRC1 precedes the white balance  
LUT, and is intended to be used when 24-bit data is being driven to an 18-bit display with a white balance LUT  
that is calibrated for an 18-bit data source. The second FRC block, FRC2, follows the white balance block and is  
intended to be used when fine adjustment of color temperature is required on an 18-bit color display, or when a  
24-bit source drives an 18-bit display with a white balance LUT calibrated for 24-bit source data.  
For proper operation of the FRC dithering feature, the user must provide a description of the display timing  
control signals. The timing mode, “sync mode” (HS, VS) or “DE only” must be specified, along with the active  
polarity of the timing control signals. All this information is entered to DS90UR916 control registers via the serial  
bus interface.  
Adaptive Hi-FRC dithering consists of several components. Initially, the incoming 8-bit data is expanded to 9-bit  
data. This allows the effective dithered result to support a total of 16.7 million colors. The incoming 9-bit data is  
evaluated, and one of four possible algorithms is selected. The majority of incoming data sequences are  
supported by the default dithering algorithm. Certain incoming data patterns (black/white pixel, full on/off sub-  
pixel) require special algorithms designed to eliminate visual artifacts associated with these specific gray level  
transitions. Three algorithms are defined to support these critical transitions.  
An example of the default dithering algorithm is illustrated in Figure 17. The “1” or “0” value shown in the table  
describes whether the 6-bit value is increased by 1 (“1”) or left unchanged (“0”). In this case, the 3 truncated  
LSBs are “001”.  
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F0L0  
PD1  
Frame = 0, Line = 0  
Pixel Data one  
Cell Value 010  
R[7:2]+0, G[7:2]+1, B[7:2]+0  
LSB=001  
three lsb of 9 bit data (8 to 9 for Hi-Frc)  
Pixel Index  
PD1  
PD2  
PD3  
PD4  
PD5  
PD6  
PD7  
PD8  
LSB = 001  
F0L0  
F0L1  
F0L2  
F0L3  
010  
101  
000  
000  
000  
000  
000  
000  
000  
000  
010  
101  
000  
000  
000  
000  
000  
101  
010  
000  
000  
000  
000  
000  
010  
000  
000  
101  
000  
000  
000  
000  
R = 4/32  
G = 4/32  
B = 4/32  
F1L0  
F1L1  
F1L2  
F1L3  
000  
000  
000  
000  
000  
111  
000  
000  
000  
000  
000  
000  
000  
000  
000  
111  
000  
000  
000  
000  
000  
111  
000  
000  
000  
000  
000  
000  
000  
000  
000  
111  
R = 4/32  
G = 4/32  
B = 4/32  
F2L0  
F2L1  
F2L2  
F2L3  
000  
000  
010  
101  
000  
000  
000  
000  
010  
101  
000  
000  
000  
000  
000  
000  
010  
000  
000  
101  
000  
000  
000  
000  
000  
101  
010  
000  
000  
000  
000  
000  
R = 4/32  
G = 4/32  
B = 4/32  
F3L0  
F3L1  
F3L2  
F3L3  
000  
000  
000  
000  
000  
000  
000  
111  
000  
000  
000  
000  
000  
111  
000  
000  
000  
000  
000  
000  
000  
000  
000  
111  
000  
000  
000  
000  
000  
111  
000  
000  
R = 4/32  
G = 4/32  
B = 4/32  
Figure 17. Default FRC Algorithm  
Signal Quality Enhancers  
Des — Input Equalizer Gain (EQ)  
The Des can enable receiver input equalization of the serial stream to increase the eye opening to the Des input.  
Note this function cannot be seen at the RxIN+/- input but can be observed at the serial test port (CMLOUTP/N)  
enabled via the Serial Bus control registers. The equalization feature may be controlled by the external pin or by  
register.  
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Table 2. Receiver Equalization Configuration Table  
INPUTS  
Effect  
EQ3  
L
EQ2  
L
EQ1  
L
EQ0  
H
~1.5 dB  
~3 dB  
L
L
H
L
H
L
H
H
L
H
~4.5 dB  
~6 dB  
L
H
L
H
H
H
H
H
X
H
~7.5 dB  
~9 dB  
L
H
L
H
H
H
X
H
~10.5 dB  
~12 dB  
OFF*  
H
X
H
L
* Default Setting is EQ = Off  
The quality of the equalized signal may be assessed by monitoring the differential eye opening at the  
CMLOUTP/N. The Receiver Differential Input Threshold and Input Jitter Tolerance define the acceptable data  
eye opening. A differential probe should be used to measure across a 100Ohm termination resistor between the  
CMLOUTP/N pins. Figure 18 illustrates the eye opening.  
Ideal Data Bit  
End  
Ideal Data Bit  
Beginning  
Minimum Eye  
Width  
VTH - VTL  
RxIN_TOL -L  
RxIN_TOL -R  
t
BIT  
(1UI)  
Figure 18. CMLOUT Eye Opening  
EMI Reduction Features  
Output Slew (OS_PCLK/DATA)  
The parallel bus outputs (RGB[7:0], VS, HS, DE and PCLK) of the Des feature a selectable output slew. The  
DATA ((RGB[7:0], VS, HS, DE) are controlled by strap pin or register bit OS_DATA. The PCLK is controlled by  
strap pin or register bit OS_PCLK. When the OS_PCLK/DATA = HIGH, the maximum slew rate is selected.  
When the OS_PCLK/DATA = LOW, the minimum slew rate is selected. Use the higher slew rate setting when  
driving longer traces or a heavier capacitive load.  
Common Mode Filter Pin (CMF) — Optional  
The Des provides access to the center tap of the internal termination. A capacitor may be placed on this pin for  
additional common-mode filtering of the differential pair. This can be useful in high noise environments for  
additional noise rejection capability. A 0.1µF capacitor may be connected to this pin to Ground.  
SSCG Generation — Optional  
The Des provides an internally generated spread spectrum clock (SSCG) to modulate its outputs. Both clock and  
data outputs are modulated. This will aid to lower system EMI. Output SSCG deviations to ±2.0% (4% total) at up  
to 35kHz modulations nominally are available. See Table 3. This feature may be controlled by external STRAP  
pins or by register.  
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Table 3. SSCG Configuration (LF_MODE = L) — Des Output  
SSC[3:0] Inputs  
Result  
LF_MODE = L (20 - 65 MHz)  
SSC3  
SSC2  
L
SSC1  
L
SSC0  
L
fdev (%)  
Off  
fmod (kHz)  
L
L
Off  
L
L
H
L
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
L
L
H
H
L
PCLK/2168  
PCLK/1300  
L
L
H
L
L
H
H
H
H
L
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
H
H
H
H
L
L
H
L
L
H
H
L
PCLK/868  
PCLK/650  
L
H
L
H
H
H
H
L
H
L
H
H
H
Table 4. SSCG Configuration (LF_MODE = H) — Des Output  
SSC[3:0] Inputs  
Result  
LH_MODE = H (5 - 20 MHz)  
SSC3  
L
SSC2  
L
SSC1  
L
SSC0  
L
fdev (%)  
Off  
fmod (kHz)  
Off  
L
L
L
H
L
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
±2.0  
±0.5  
±1.0  
±1.5  
L
L
H
H
L
PCLK/620  
PCLK/370  
L
L
H
L
L
H
H
H
H
L
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
H
H
H
H
L
L
H
L
L
H
H
L
PCLK/258  
PCLK/192  
L
H
L
H
H
H
H
L
H
L
H
H
H
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Frequency  
fdev(max)  
F
F
PCLK+  
F
PCLK  
fdev(min)  
Time  
PCLK-  
1/fmod  
Figure 19. SSCG Waveform  
1.8V or 3.3V VDDIO Operation  
The Des parallel bus and Serial Bus Interface can operate with 1.8 V or 3.3 V levels (VDDIO) for target (Display)  
compatibility. The 1.8 V levels will offer a lower noise (EMI) and also a system power savings.  
Power Saving Features  
PowerDown Feature (PDB)  
The Des has a PDB input pin to ENABLE or POWER DOWN the device. This pin can be controlled by the  
system to save power, disabling the Des when the display is not needed. An auto detect mode is also available.  
In this mode, the PDB pin is tied High and the Des will enter POWER DOWN when the serial stream stops.  
When the serial stream starts up again, the Des will lock to the input stream and assert the LOCK pin and output  
valid data. In POWER DOWN mode, the Data and PCLK output states are determined by the OSS_SEL status.  
Note – in POWER DOWN, the optional Serial Bus Control Registers are RESET.  
Stop Stream SLEEP Feature  
The Des will enter a low power SLEEP state when the input serial stream is stopped. A STOP condition is  
detected when the embedded clock bits are not present. When the serial stream starts again, the Des will then  
lock to the incoming signal and recover the data. Note – in STOP STREAM SLEEP, the optional Serial Bus  
Control Registers values are RETAINED.  
CLOCK-DATA RECOVERY STATUS FLAG (LOCK) and OUTPUT STATE SELECT (OSS_SEL)  
When PDB is driven HIGH, the CDR PLL begins locking to the serial input and LOCK goes from TRI-STATE to  
LOW (depending on the value of the OSS_SEL setting). After the DS90UR916Q completes its lock sequence to  
the input serial data, the LOCK output is driven HIGH, indicating valid data and clock recovered from the serial  
input is available on the parallel bus and PCLK outputs. The PCLK output is held at its current state at the  
change from OSC_CLK (if this is enabled via OSC_SEL) to the recovered clock (or vice versa).  
If there is a loss of clock from the input serial stream, LOCK is driven Low and the state of the RGB/VS/HS/DE  
outputs are based on the OSS_SEL setting (STRAP PIN configuration or register).  
Oscillator Output — Optional  
The Des provides an optional PCLK output when the input clock (serial stream) has been lost. This is based on  
an internal oscillator. The frequency of the oscillator may be selected. This feature may be controlled by the  
external pin or by register. See Table 6 and Table 7.  
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Table 5. OSS_SEL and PDB Configuration — Des Outputs(1)  
INPUTS  
OUTPUTS  
RGB/HS/VS/DE  
Serial Input  
PDB  
L
OSS_SEL  
PCLK  
LOCK  
PASS  
X
X
L
Z
L
Z
L
Z
L
Z
L
Static  
Static  
Active  
H
H
H
X
Z
Z*  
L
L
H
Active  
Active  
H
H
(1) If pin is strapped HIGH, output will be pulled up  
Table 6. OSC (Oscillator) Mode — Des Output  
INPUTS  
Embedded PCLK  
See(1)  
OUTPUTS  
PCLK  
OSC Output  
Toggling  
RGB/HS/VS/DE  
LOCK  
PASS  
L
L
L
Present  
Active  
H
H
(1) Absent and OSC_SEL 000  
PDB  
(DES)  
RIN  
(Diff.)  
active serial stream  
X
H
H
LOCK  
L
Z
Z
Z
L
Z
Z
Z
RGB[7:0],  
HS, VS, DE  
Z
Z
PCLK*  
(DES)  
H
H
PASS  
L
L
Z
Z
Locking  
Active  
C0 or C1 Error  
In Bit Stream  
Active  
OFF  
OFF  
(Loss of LOCK)  
CONDITIONS: * RFB = L, and OSS_SEL = H  
Figure 20. Des Outputs with Output State Select Low (OSS_SEL = H)  
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PDB  
(DES)  
RIN  
(Diff.)  
active serial stream  
X
H
H
LOCK  
Z
L
L
L
L
L
Z
L
L
L
RGB[7:0],  
HS, VS, DE  
PCLK*  
(DES)  
H
H
PASS  
L
L
Z
Z
C0 or C1 Error  
In Bit Stream  
Locking  
Active  
Active  
OFF  
OFF  
(Loss of LOCK)  
CONDITIONS: * RFB = L, and OSS_SEL = L  
Figure 21. Des Outputs with Output State Select High (OSS_SEL = L)  
Table 7. OSC_SEL (Oscillator) Configuration  
OSC_SEL[2:0] INPUTS  
PCLK Oscillator Output  
OSC_SEL2  
OSC_SEL1  
OSC_SEL0  
L
L
L
L
L
H
L
Off – Feature Disabled – Default  
50 MHz ±40%  
L
H
H
L
25 MHz ±40%  
L
H
L
16.7 MHz ±40%  
12.5 MHz ±40%  
10 MHz ±40%  
H
H
H
H
L
H
L
H
H
8.3 MHz ±40%  
H
6.3 MHz ±40%  
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PDB  
(DES)  
RIN  
(Diff.)  
active serial stream  
X
H
H
LOCK  
Z
L
L
L
L
L
Z
RGB[7:0],  
HS, VS, DE  
L
L
PCLK*  
(DES)  
f
f
H
H
PASS  
L
Z
L
Z
Locking  
Active  
C0 or C1 Error  
In Bit Stream  
Active  
OFF  
OFF  
(Loss of LOCK)  
CONDITIONS: * RFB = L, OSS_SEL = L , and OSC_SEL not equal to 000.  
Figure 22. Des Outputs with Output State High and PCLK Output Oscillator Option Enabled  
OP_LOW — Optional  
The OP_ LOW feature is used to hold the LVCMOS outputs (except the LOCK output) at a LOW state. This  
feature is enabled by setting the OP_LOW strap pin = HIGH, followed by the rising edge of PDB. The user must  
toggle the OP_LOW Set/Reset register bit to release the outputs to the normal toggling state. Note that the  
release of the outputs can only occur when LOCK is HIGH. When the OP_LOW feature is enabled, anytime  
LOCK = LOW, the LVCMOS outputs will toggle to a LOW state again. The OP_ LOW strap pin feature is  
assigned to output PASS pin 42.  
Restrictions on other straps:  
1) Other straps should not be used in order to keep RGB[7:0], HS, VS, DE, and PCLK at a true LOW state. Other  
features should be selected thru I2C.  
2) OSS_SEL function is not available when O/P_LOW is tied H.  
Outputs RGB[7:0], HSYNC, VSYNC, DE, and PCLK are in TRI-STATE before PDB toggles HIGH because the  
OP_LOW strap value has not been recognized until the DS90UR916 powers up. Figure 23 shows the user  
controlled release of OP_LOW and automatic reset of OP_LOW set on the falling edge of LOCK. Figure 24  
shows the user controlled release of OP_LOW and manual reset of OP_LOW set. Note manual reset of  
OP_LOW can only occur when LOCK is H.  
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2.0V  
PDB  
LOCK  
OP_ LOW  
SET  
(Strap pin)  
User  
User  
controlled  
controlled  
OP_ LOW  
RELEASE/SET  
(Register)  
RGB[7:0],  
HS, VS, DE  
TRI-  
STATE  
ACTIVE  
ACTIVE  
ACTIVE  
TRI-  
STATE  
ACTIVE  
PCLK  
Figure 23. OP_LOW Auto Set  
2.0V  
PDB  
LOCK  
OP_LOW  
SET  
(Strap pin)  
User  
User  
controlled  
controlled  
OP_ LOW  
RELEASE/SET  
(Register)  
RGB[7:0],  
HS, VS, DE  
TRI-  
STATE  
ACTIVE  
ACTIVE  
TRI-  
STATE  
PCLK  
Figure 24. OP_LOW Manual Set/Reset  
Pixel Clock Edge Select (RFB)  
The RFB pin determines the edge that the data is strobed on. If RFB is High, output data is strobed on the Rising  
edge of the PCLK. If RFB is Low, data is strobed on the Falling edge of the PCLK. This allows for inter-  
operability with downstream devices. The Des output does not need to use the same edge as the Ser input. This  
feature may be controlled by the external pin or by register.  
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Control Signal Filter — Optional  
The Des provides an optional Control Signal (VS, HS, DE) filter that monitors the three video control signals and  
eliminates any pulses that are 1 or 2 PCLKs wide. Control signals must be 3 pixel clocks wide (in its HIGH or  
LOW state, regardless of which state is active). This is set by the CONFIG[1:0] or by the Control Register. This  
feature may be controlled by the external pin or by Register.  
Low Frequency Optimization (LF_Mode)  
This feature may be controlled by the external pin or by Register.  
Des — Map Select  
This feature may be controlled by the external pin or by Register.  
Table 8. Map Select Configuration  
INPUTS  
Effect  
MAPSEL1  
MAPSEL0  
L
L
Bit 4, Bit 5 on LSB  
DEFAULT  
L
H
LSB 0 or 1  
LSB 0  
H
H or L  
Strap Input Pins  
Configuration of the device maybe done via configuration input pins and the STRAP input pins, or via the Serial  
Control Bus. The STRAP input pins share select parallel bus output pins. They are used to load in configuration  
values during the initial power up sequence of the device. Only a pull-up on the pin is required when a HIGH is  
desired. By default the pad has an internal pull down, and will bias Low by itself. The recommended value of the  
pull up is 10 kΩ to VDDIO; open (NC) for Low, no pull-down is required (internal pull-down). If using the Serial  
Control Bus, no pull ups are required.  
Optional Serial Bus Control  
Please see the following section on the optional Serial Bus Control Interface.  
Optional BIST Mode  
Please see the following section on the chipset BIST mode for details.  
Built In Self Test (BIST)  
An optional At-Speed Built In Self Test (BIST) feature supports the testing of the high-speed serial link. This is  
useful in the prototype stage, equipment production, in-system test and also for system diagnostics. In the BIST  
mode only a input clock is required along with control to the Ser and Des BISTEN input pins. The Ser outputs a  
test pattern (PRBS7) and drives the link at speed. The Des detects the PRBS7 pattern and monitors it for errors.  
A PASS output pin toggles to flag any payloads that are received with 1 to 24 errors. Upon completion of the  
test, the result of the test is held on the PASS output until reset (new BIST test or Power Down). A high on PASS  
indicates NO ERRORS were detected. A Low on PASS indicates one or more errors were detected. The duration  
of the test is controlled by the pulse width applied to the Des BISTEN pin. During the BIST duration the  
deserializer data outputs toggle with a checkerboard pattern.  
Inter-operability is supported between this FPD-Link II device and all FPD-Link II generations (Gen 1/2/3) — see  
respective datasheets for details on entering BIST mode and control.  
Sample BIST Sequence  
See Figure 25 for the BIST mode flow diagram.  
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Step 1: Place the DS90UR905 Ser in BIST Mode by setting Ser BISTEN = H. For the DS90UR905 Ser or  
DS99R421 FPD-Link II Ser BIST Mode is enabled via the BISTEN pin. For the DS90C241 Ser or DS90UR241  
Ser, BIST mode is enetered by setting all the input data of the device to Low state. A PCLK is required for all the  
Ser options. When the Des detects the BIST mode pattern and command (DCA and DCB code) the RGB and  
control signal outputs are shut off.  
Step 2: Place the DS90UR916Q Des in BIST mode by setting the BISTEN = H. The Des is now in the BIST  
mode and checks the incoming serial payloads for errors. If an error in the payload (1 to 24) is detected, the  
PASS pin will switch low for one half of the clock period. During the BIST test, the PASS output can be  
monitored and counted to determine the payload error rate.  
Step 3: To Stop the BIST mode, the Des BISTEN pin is set Low. The Des stops checking the data and the final  
test result is held on the PASS pin. If the test ran error free, the PASS output will be High. If there was one or  
more errors detected, the PASS output will be Low. The PASS output state is held until a new BIST is run, the  
device is RESET, or Powered Down. The BIST duration is user controlled by the duration of the BISTEN signal.  
Step 4: To return the link to normal operation, the Ser BISTEN input is set Low. The Link returns to normal  
operation.  
Figure 26 shows the waveform diagram of a typical BIST test for two cases. Case 1 is error free, and Case 2  
shows one with multiple errors. In most cases it is difficult to generate errors due to the robustness of the link  
(differential data transmission etc.), thus they may be introduced by greatly extending the cable length, faulting  
the interconnect, reducing signal condition enhancements (De-Emphasis, VODSEL, or Rx Equalization).  
Normal  
Step 1: SER in BIST  
BIST  
Wait  
Step 2: Wait, DES in BIST  
BIST  
start  
Step 3: DES in Normal  
Mode - check PASS  
BIST  
stop  
Step 4: SER in Normal  
Figure 25. BIST Mode Flow Diagram  
BER Calculations  
It is possible to calculate the approximate Bit Error Rate (BER). The following is required:  
Pixel Clock Frequency (MHz)  
BIST Duration (seconds)  
BIST test Result (PASS)  
The BER is less than or equal to one over the product of 24 times the PCLK rate times the test duration. If we  
assume a 65MHz PCLK, a 10 minute (600 second) test, and a PASS, the BERT is 1.07 X 10E-12  
The BIST mode runs a check on the data payload bits. The LOCK pin also provides a link status. It the recovery  
of the C0 and C1 bits does not reconstruct the expected clock signal, the LOCK pin will switch Low. The  
combination of the LOCK and At-Speed BIST PASS pin provides a powerful tool for system evaluation and  
performance monitoring.  
28  
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BISTEN  
(SER)  
BISTEN  
(DES)  
PCLK  
(RFB = L)  
RGB[7:0]  
HS, VS, DE  
DATA  
(internal)  
PASS  
Prior Result  
Prior Result  
PASS  
FAIL  
X = bit error(s)  
DATA  
(internal)  
X
X
X
PASS  
BIST  
Result  
Normal  
PRBS  
Normal  
BIST Test  
BIST Duration  
Held  
Figure 26. BIST Waveforms  
Optional Serial Bus Control  
The DS90UR916 may also be configured by the use of a serial control bus that is I2C protocol compatible. By  
default, the I2C reg_0x00'h is set to 00'h and all configuration is set by control/strap pins. A write of 01'h to  
reg_0x00'h will enable/allow configuration by registers; this will override the control/strap pins. Multiple devices  
may share the serial control bus since multiple addresses are supported. See Figure 27.  
1.8V  
10 k  
V
DDIO  
ID[X]  
4.7k  
4.7k  
SER  
or  
R
ID  
HOST  
SCL  
SDA  
SCL  
SDA  
DES  
To other  
Devices  
Figure 27. Serial Control Bus Connection  
The serial bus is comprised of three pins. The SCL is a Serial Bus Clock Input. The SDA is the Serial Bus Data  
Input / Output signal. Both SCL and SDA signals require an external pull up resistor to VDDIO. For most  
applications a 4.7 k pull up resistor to VDDIO may be used. The resistor value may be adjusted for capacitive  
loading and data rate requirements. The signals are either pulled High, or driven Low.  
The third pin is the ID[X] pin. This pin sets one of four possible device addresses. Two different connections are  
possible. The pin may be pulled to VDD (1.8V, NOT VDDIO)) with a 10 kresistor; or a 10 kpull up resistor (to  
VDD1.8V, NOT VDDIO)) and a pull down resistor of the recommended value to set other three possible addresses  
may be used. See Table 9. Do not tie ID[x] directly to VSS.  
The Serial Bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when  
SCL transitions Low while SDA is High. A STOP occurs when SDA transition High while SCL is also HIGH. See  
Figure 28.  
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SDA  
SCL  
S
P
START condition, or  
STOP condition  
START repeat condition  
Figure 28. START and STOP Conditions  
To communicate with a remote device, the host controller (master) sends the slave address and listens for a  
response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is  
addressed correctly, it Acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't  
match a device's slave address, it Not-acknowledges (NACKs) the master by letting SDA be pulled High. ACKs  
also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs after  
every data byte is successfully received. When the master is reading data, the master ACKs after every data  
byte is received to let the slave know it wants to receive another data byte. When the master wants to stop  
reading, it NACKs after the last data byte and creates a stop condition on the bus. All communication on the bus  
begins with either a Start condition or a Repeated Start condition. All communication on the bus ends with a Stop  
condition. A READ is shown in Figure 29 and a WRITE is shown in Figure 30.  
If the Serial Bus is not required, the three pins may be left open (NC).  
Table 9. ID[x] Resistor Value – DS90UR916Q Des  
Resistor  
RID* k(5% tol)  
Address  
7'b  
Address  
8'b  
0 appended  
(WRITE)  
0.47  
2.7  
7b' 111 0001 (h'71)  
7b' 111 0010 (h'72)  
7b' 111 0011 (h'73)  
7b' 111 0110 (h'76)  
8b' 1110 0010 (h'E2)  
8b' 1110 0100 (h'E4)  
8b' 1110 0110 (h'E6)  
8b' 1110 1100 (h'EC)  
8.2  
Open  
*Note: RID 0 ohm, do not connect directly to VSS (GND), this is not a valid address.  
Register Address  
Slave Address  
Slave Address  
Data  
a
c
k
a
c
k
a
c
k
a
c
k
A
2
A
1
A
0
A
2
A
1
A
0
0
S
S
1
P
Figure 29. Serial Control Bus — READ  
Register Address  
Slave Address  
Data  
a
c
a
c
k
a
c
k
A
2
A
1
A
0
0
S
P
k
Figure 30. Serial Control Bus — WRITE  
30  
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Table 10. DESERIALIZER — Serial Bus Control Registers  
ADD  
(dec) (hex)  
ADD  
Default  
(bin)  
PAGE  
Register Name  
Bit(s)  
R/W  
Function  
Description  
0
0
0
Des Config 1  
7
R/W  
0
LFMODE  
0: 20 to 65 MHz Operation  
1: 5 to 20 MHz Operation  
6
5
R/W  
R/W  
R/W  
R/W  
0
OS_PCLK  
OS_DATA  
RFB  
0: Normal PCLK Output Slew  
1: Increased PCLK Slew  
0
0: Normal DATA OUTPUT Slew  
1: Increased Data Slew  
4
0
0: Data strobed on Falling edge of PCLK  
1: Data strobed on Rising edge of PCLK  
3:2  
00  
CONFIG  
00: Normal Mode, Control Signal Filter  
Disabled  
01: Normal Mode, Control Signal Filter  
Enabled  
10: Backwards Compatible (DS90UR241)  
11: Backwards Compatible (DS90C241)  
1
0
R/W  
0
SLEEP  
Note – not the same function as  
PowerDown (PDB)  
0: normal mode  
1: Sleep Mode – Register settings  
retained.  
R/W  
R/W  
0
0
REG Control  
0: Configurations set from control pins /  
STRAP pins  
1: Configurations set from registers (except  
I2C_ID)  
0
0
1
2
1
2
Slave ID  
7
0: Address from ID[X] Pin  
1: Address from Register  
6:0  
R/W 1110000 ID[X]  
Serial Bus Device ID, Four IDs are:  
7b '1110 001 (h'71)  
7b '1110 010 (h'72)  
7b '1110 011 (h'73)  
7b '1110 110 (h'76)  
All other addresses are Reserved.  
Des Features 1  
7
6
R/W  
R/W  
R/W  
0
0
OP_LOW  
Release/Set  
0: set outputs state LOW (except LOCK)  
1: release output LOW state, outputs  
toggling normally  
Note: This register only works during LOCK  
= 1.  
OSS_SEL  
MAP_SEL  
Output Sleep State Select  
0:PCLK/RGB[7:0]/HS/VS/DE = L, LOCK =  
Normal, PASS = H  
1:PCLK/RGB[7:0]/HS/VS/DE = Tri-State,  
LOCK = Normal, PASS = H  
5:4  
00  
Special for Backwards Compatible Mode  
with DS90UR241)  
00: bit 4, 5 on LSB  
01: LSB zero or one  
10: LSB zero  
11: LSB zero  
3
R/W  
R/W  
0
OP_LOW strap  
bypass  
0: strap will determine whether OP_LOW  
feature is ON or OFF  
1: Turns OFF OP_LOW feature  
2:0  
00  
OSC_SEL  
000: OFF  
001: 50 MHz ±40%  
010: 25 MHz ±40%  
011: 16.7 MHz ±40%  
100: 12.5 MHz ±40%  
101: 10 MHz ±40%  
110: 8.3 MHz ±40%  
111: 6.3 MHz ±40%  
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Table 10. DESERIALIZER — Serial Bus Control Registers (continued)  
ADD  
(dec) (hex)  
ADD  
Default  
(bin)  
PAGE  
Register Name  
Bit(s)  
R/W  
Function  
Description  
0
3
3
Des Features 2  
7:5  
R/W  
000  
EQ Gain  
000: ~1.625 dB  
001: ~3.25 dB  
010: ~4.87 dB  
011: ~6.5 dB  
100: ~8.125 dB  
101: ~9.75 dB  
110: ~11.375 dB  
111: ~13 dB  
4
R/W  
R/W  
0
EQ Enable  
SSC  
0: EQ = disabled  
1: EQ = enabled  
3:0  
0000  
IF LF_MODE = 0, then:  
000: SSCG OFF  
0001: fdev = ±0.5%, fmod = PCLK/2168  
0010: fdev = ±1.0%, fmod = PCLK/2168  
0011: fdev = ±1.5%, fmod = PCLK/2168  
0100: fdev = ±2.0%, fmod = PCLK/2168  
0101: fdev = ±0.5%, fmod = PCLK/1300  
0110: fdev = ±1.0%, fmod = PCLK/1300  
0111: fdev = ±1.5%, fmod = PCLK/1300  
1000: fdev = ±2.0%, fmod = PCLK/1300  
1001: fdev = ±0.5%, fmod = PCLK/868  
1010: fdev = ±1.0%, fmod = PCLK/868  
1011: fdev = ±1.5%, fmod = PCLK/868  
1100: fdev = ±2.0%, fmod = PCLK/868  
1101: fdev = ±0.5%, fmod = PCLK/650  
1110: fdev = ±1.0%, fmod = PCLK/650  
1111: fdev = ±1.5%, fmod = PCLK/650  
IF LF_MODE = 1, then:  
000: SSCG OFF  
0001: fdev = ±0.5%, fmod = PCLK/620  
0010: fdev = ±1.0%, fmod = PCLK/620  
0011: fdev = ±1.5%, fmod = PCLK/620  
0100: fdev = ±2.0%, fmod = PCLK/620  
0101: fdev = ±0.5%, fmod = PCLK/370  
0110: fdev = ±1.0%, fmod = PCLK/370  
0111: fdev = ±1.5%, fmod = PCLK/370  
1000: fdev = ±2.0%, fmod = PCLK/370  
1001: fdev = ±0.5%, fmod = PCLK/258  
1010: fdev = ±1.0%, fmod = PCLK/258  
1011: fdev = ±1.5%, fmod = PCLK/258  
1100: fdev = ±2.0%, fmod = PCLK/258  
1101: fdev = ±0.5%, fmod = PCLK/192  
1110: fdev = ±1.0%, fmod = PCLK/192  
1111: fdev = ±1.5%, fmod = PCLK/192  
0
0
4
4
CMLOUT Config  
7
R/W  
0
Repeater Enable  
0: Output CMLOUTP/N = disabled  
1: Output CMLOUTP/N = enabled  
6:0  
7
R/W 0000000 Reserved  
Reserved  
21  
15  
FRC  
Configuration  
R/W  
0
Timing mode  
select  
Select display timing mode  
0: DE only mode  
1: Sync mode (VS, HS)  
6
5
R/W  
R/W  
R/W  
R/W  
R/W  
0
0
0
0
0
0
VS Polarity  
HS Polarity  
DE Polarity  
FRC2 enable  
FRC1 enable  
Reserved  
0: Active HIGH  
1: Active LOW  
0: Active HIGH  
1: Active LOW  
4
0: Active HIGH  
1: Active LOW  
3
0: FRC2 disabled  
1: FRC2 enabled  
2
0: FRC1 disabled  
1: FRC1 enabled  
[1:0]  
Reserved  
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Table 10. DESERIALIZER — Serial Bus Control Registers (continued)  
ADD  
(dec) (hex)  
ADD  
Default  
(bin)  
PAGE  
Register Name  
Bit(s)  
R/W  
Function  
Description  
0
22  
16  
White Balance  
Configuration  
[7:6]  
R/W  
0
Page Setting  
00: Configuration Registers  
01: Red LUT  
10: Green LUT  
11: Blue LUT  
5
4
R/W  
R/W  
0
0
White Balance  
Enable  
0: WB disabled  
1: WB enabled  
Reload Enable  
0: Reload disabled  
1: Reload enabled  
[3:0]  
0
Reserved  
Reserved  
1
2
3
0 -  
255  
00 - White Balance  
FF Red LUT  
[FF:0]  
R/W  
R/W  
R/W  
N/A  
Red LUT  
256 8–bit entries to be applied to the Red  
subpixel data  
0 -  
255  
00 - White Balance  
FF Green LUT  
[FF:0]  
[FF:0]  
N/A  
N/A  
Green LUT  
Blue LUT  
256 8–bit entries to be applied to the Green  
subpixel data  
0 -  
255  
00 - White Balance  
FF Blue LUT  
256 8–bit entries to be applied to the Blue  
subpixel data  
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APPLICATIONS INFORMATION  
DISPLAY APPLICATION  
The DS90UR905/916Q chipset is intended for interface between a host (graphics processor) and a Display. It  
supports an 24-bit color depth (RGB888) and up to 1024 X 768 display formats. In a RGB888 application, 24  
color bits (R[7:0], G[7:0], B[7:0]), Pixel Clock (PCLK) and three control bits (VS, HS and DE) are supported  
across the serial link with PCLK rates from 5 to 65 MHz. The chipset may also be used in 18-bit color  
applications. In this application three to six general purpose signals may also be sent from host to display.  
The Des is expected to be located close to its target device. The interconnect between the Des and the target  
device is typically in the 1 to 3 inch separation range. The input capacitance of the target device is expected to  
be in the 5 to 10 pF range. Care should be taken on the PCLK output trace as this signal is edge sensitive and  
strobes the data. It is also assumed that the fanout of the Des is one. If additional loads need to be driven, a  
logic buffer or mux device is recommended.  
TYPICAL APPLICATION CONNECTION  
Figure 31 shows a typical application of the DS90UR916Q Des using serial bus control mode for a 65 MHz 24-bit  
Color Display Application. The LVDS inputs utilize 100 nF coupling capacitors to the line and the Receiver  
provides internal termination. Bypass capacitors are placed near the power supply pins. At a minimum, seven 0.1  
µF capacitors and two 4.7 µF capacitors should be used for local device bypassing. System GPO (General  
Purpose Output) signals control the PDB and the BISTEN pins. In this application the RRFB pin is tied Low to  
strobe the data on the falling edge of the PCLK.  
The DS90UR916 will most often be used in serial bus control mode as this is required to enable the image  
enhancement features of the device. The schematic illustrates the proper connection of SDA and SCL to the pull-  
up resistors as well as the external resistor network to the ID[x] pin..  
The interface to the target display is with 3.3V LVCMOS levels, thus the VDDIO pin is connected to the 3.3 V rail.  
A delay cap is placed on the PDB signal to delay the enabling of the device until power is stable.  
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DS90UR916Q (DES)  
VDDIO  
1.8V  
VDDL  
VDDIO  
VDDIO  
VDDIO  
C8  
C3  
C4  
C5  
C14  
C11  
C12 C15  
FB2  
FB1  
FB3  
FB4  
FB5  
VDDSC  
VDDPR  
VDDR  
C9  
C10  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
R0  
C16  
C6  
VDDIR  
VDDCMLO  
G7  
G6  
G5  
G4  
G3  
G2  
G1  
G0  
C17  
C1  
C7  
FB6  
LVCMOS  
Parallel  
Video  
Interface  
Serial  
FPD-Link II  
Interface  
RIN+  
RIN-  
CMF  
C2  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
C13  
TP_A  
TP_B  
CMLOUTP  
CMLOUTN  
Host  
Control  
BISTEN  
PDB  
HS  
VS  
DE  
C18  
PCLK  
LOCK  
PASS  
1.8V  
10k  
RID  
8
NC  
ID[X]  
VDDIO  
RES  
DAP (GND)  
4.7k  
4.7k  
SCL  
SDA  
C1 - C2 = 0.1 mF (50 WV)  
C3 - C13 = 0.1 mF  
C14 - C17 = 4.7 mF  
C18 = >10 mF  
RID (see ID[x] Resistor Value Table)  
FB1-FB6: Impedance = 1 kW,  
low DC resistance (<1W)  
Figure 31. DS90UR916Q Typical Connection Diagram — Pin Control  
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POWER UP REQUIREMENTS AND PDB PIN  
At power-on, the PDB pin must be LOW. The transition to the HIGH state (normal operating mode) may only  
occur after all power supplies are stable and above the minimum recommended operating voltage. All other  
LVCMOS inputs must also remain LOW prior to power supplies stabilized at the recommended operating  
voltages. Active driving of inputs and the transition of PDB to the HIGH state should be delayed 1usec after  
power supplies are stabilized.  
TRANSMISSION MEDIA  
The Ser/Des chipset is intended to be used in a point-to-point configuration, through a PCB trace, or through  
twisted pair cable. The Ser and Des provide internal terminations providing a clean signaling environment. The  
interconnect for LVDS should present a differential impedance of 100 Ohms. Use cables and connectors that  
have matched differential impedance to minimize impedance discontinuities. Shielded or un-shielded cables may  
be used depending upon the noise environment and application requirements.  
LIVE LINK INSERTION  
The Ser and Des devices support live pluggable applications. The automatic receiver lock to random data “plug &  
go” hot insertion capability allows the DS90UR916Q to attain lock to the active data stream during a live insertion  
event.  
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS  
Circuit board layout and stack-up for the LVDS Ser/Des devices should be designed to provide low-noise power  
feed to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to  
minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly  
improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane  
capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at  
high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass  
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the  
range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the  
tantalum capacitors should be at least 5X the power supply voltage being used.  
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per  
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power  
entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is  
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors  
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external  
bypass capacitor will increase the inductance of the path.  
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size  
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of  
these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple  
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At  
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing  
the impedance at high frequency.  
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate  
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not  
required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power  
pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as  
PLLs.  
Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the LVDS  
lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely-coupled differential lines of 100  
Ohms are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled  
noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled lines will also  
radiate less.  
Information on the WQFN style package is provided in TI Application Note: AN-1187 (SNOA401).  
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LVDS INTERCONNECT GUIDELINES  
See AN-1108 (SNLA008) and AN-905 (SNLA035) for full details.  
Use 100Ω coupled differential pairs  
Use the S/2S/3S rule in spacings  
– S = space between the pair  
– 2S = space between pairs  
– 3S = space to LVCMOS signal  
Minimize the number of Vias  
Use differential connectors when operating above 500Mbps line speed  
Maintain balance of the traces  
Minimize skew within the pair  
Terminate as close to the TX outputs and RX inputs as possible  
Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the TI  
web site at: www.ti.com/lvds  
USING IMAGE ENHANCEMENT FEATURES  
The DS90UR916Q offers two FRC dithering blocks and one White Balance lookup table. Depending upon the  
color depth of the source data, display and LUT contents, these blocks may be independently enabled or  
disabled in various combinations. Refer to Table 11 below for recommendations.  
Table 11. Enabling Image Enhancement Features  
Source  
24-bit  
24-bit  
24-bit  
18-bit  
18-bit  
18-bit  
White Balance LUT  
Display  
24-bit  
18-bit  
18-bit  
24-bit  
18-bit  
18-bit  
FRC1  
FRC2  
24-bit  
24-bit  
18-bit  
24-bit  
24-bit  
18-bit  
Disabled  
Disabled  
Enabled  
Disabled  
Disabled  
Disabled  
Disabled  
Enabled  
Disabled  
Disabled  
Enabled  
Disabled  
If the white balance feature is to be used all 3 LUTs must be fully loaded after initial power-up. LUTs must be  
loaded sequentially — first Red, second Green, third Blue — and all 256 values must be loaded into each LUT.  
After power-up the following procedure must be followed.  
1. Power-on (reload = disable by default)  
2. Enable WB  
3. Set page Register RED  
4. Initial RED LUT load (all 256 bytes) '916 will self clear page register  
5. Set page Register GREEN  
6. Initial GREEN LUT load (all 256 bytes) '916 will self clear page register  
7. Set page Register BLUE  
8. Initial BLUE LUT load (all 256 bytes) '916 will self clear page register  
Once all LUTs are loaded, ‘916 will enable the WB output  
To reload LUT contents, after the initial load at power-up, the following procedure must be followed.  
1. Enable RELOAD  
2. Set appropriate page register (RED, GREEN or BLUE)  
3. Load new LUT values (any sequence, any order, any number)  
4. Load appropriate R, G or B 255 value to clear page register  
5. Set appropriate page register (RED, GREEN or BLUE)  
6. Load new LUT values (any sequence, any order, any number)  
7. Load appropriate R, G or B 255 value to clear page register  
Copyright © 2011–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
37  
Product Folder Links: DS90UR916Q  
 
DS90UR916Q  
SNOSB46E MARCH 2011REVISED APRIL 2013  
www.ti.com  
8. Set appropriate page register (RED, GREEN or BLUE)  
9. Load new LUT values (any sequence, any order, any number)  
10. Load appropriate R, G or B 255 value to clear page register  
11. Disable RELOAD  
ALTERNATE COLOR / DATA MAPPING  
Color Mapped data Pin names are provided to specify a recommended mapping for 24-bit Color Applications.  
Seven [7] is assumed to be the MSB, and Zero [0] is assumed to be the LSB. While this is recommended it is not  
required. When connecting to earlier generations of FPD-Link II Ser and Des devices, a color mapping review is  
recommended to ensure the correct connectivity is obtained. Table 12 provides examples for interfacing to 18-bit  
applications with or without the video control signals embedded. The DS90UR916Q Des also provides additional  
flexibility with the MAP_SEL feature as well.  
Table 12. Alternate Color / Data Mapping — See Text Below  
18-bit  
RGB  
18-bit  
RGB  
18-bit  
RGB  
24-bit  
RGB  
905 Pin  
Name  
916 Pin  
Name  
24-bit  
RGB  
18-bit  
RGB  
18-bit  
RGB  
18-bit  
RGB  
0
LSB R0  
R1  
GP0  
GP1  
R0  
RO  
R1  
R2  
R3  
R4  
R5  
R6  
R7  
G0  
G1  
G2  
G3  
G4  
G5  
G6  
G7  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
HS  
VS  
DE  
RO  
R1  
R2  
R3  
R4  
R5  
R6  
R7  
G0  
G1  
G2  
G3  
G4  
G5  
G6  
G7  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
HS  
VS  
DE  
R0  
R1  
R2  
R3  
R4  
R5  
R6  
R7  
G0  
G1  
G2  
G3  
G4  
G5  
G6  
G7  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
HS  
VS  
DE  
R0  
R1  
R2  
R3  
R4  
R5  
R6  
R7  
G0  
G1  
G2  
G3  
G4  
G5  
G6  
G7  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
HS  
VS  
DE  
GP0  
GP1  
R0  
LSB R0  
R1  
0
0
0
R0  
R1  
R2  
R3  
R4  
R5  
0
R2  
R2  
R0  
R1  
R2  
R3  
R4  
R5  
0
R3  
R1  
R1  
R3  
R4  
R2  
R2  
R4  
MSB R5  
LSB G0  
G1  
R3  
R3  
MSB R5  
LSB G0  
G1  
R4  
R4  
R5  
R5  
G2  
GP2  
GP3  
G0  
G1  
G2  
G3  
G4  
G5  
GP4  
GP5  
B0  
GP2  
GP3  
G0  
G1  
G2  
G3  
G4  
G5  
GP4  
GP5  
B0  
G2  
0
G3  
G3  
0
G0  
G1  
G2  
G3  
G4  
G5  
0
G4  
G4  
G0  
G1  
G2  
G3  
G4  
G5  
0
MSB G5  
LSB B0  
B1  
MSB G5  
LSB0  
B1  
B2  
B2  
B3  
B3  
B4  
B4  
0
MSB B5  
HS  
MSB B5  
HS  
0
B0  
B1  
B2  
B3  
B4  
B5  
HS  
VS  
DE  
B0  
B1  
B2  
B3  
B4  
B5  
HS  
VS  
VS  
B1  
B1  
VS  
DE  
B2  
B2  
DE  
GP0  
GP1  
GP2  
GND  
GND  
GND  
B3  
B3  
GP0  
GP1  
GP2  
GND  
GND  
GND  
B4  
B4  
B5  
B5  
HS  
VS  
DE  
HS  
VS  
DE  
Scenario  
4
Scenario  
3
Scenario  
2
Scenario  
1
905 Pin  
Name  
916 Pin  
Name  
Scenario  
1
Scenario  
2
Scenario  
3
Scenario  
4
38  
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Copyright © 2011–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UR916Q  
 
DS90UR916Q  
www.ti.com  
SNOSB46E MARCH 2011REVISED APRIL 2013  
Scenario 4  
Scenario 4 supports an 18-bit RGB color mapping and 3 embedded video control signals. All LSBs are set to “0”.  
FRC and white balance may be enabled with this scenario.  
Scenario 3  
Scenario 3 supports an 18-bit RGB color mapping, 3 un-embedded video control signals, and up to three general  
purpose signals. This scenario is NOT supported when FRC or white balance are enabled on the DS90UR916.  
Scenario 2  
Scenario 2 supports an 18-bit RGB color mapping, 3 embedded video control signals, and up to six general  
purpose signals. This scenario is NOT supported when FRC or white balance are enabled on the DS90UR916.  
Scenario 1  
Scenario 1 supports the 24-bit RGB color mapping, along with the 3 embedded video control signals. This is the  
native mode for the chipset. FRC and white balance may be enabled with this scenario.  
Copyright © 2011–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
39  
Product Folder Links: DS90UR916Q  
 
DS90UR916Q  
SNOSB46E MARCH 2011REVISED APRIL 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision D (April 2013) to Revision E  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 39  
40  
Submit Documentation Feedback  
Copyright © 2011–2013, Texas Instruments Incorporated  
Product Folder Links: DS90UR916Q  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
DS90UR916QSQ/NOPB  
DS90UR916QSQE/NOPB  
DS90UR916QSQX/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
WQFN  
WQFN  
WQFN  
NKB  
NKB  
NKB  
60  
60  
60  
1000 RoHS & Green  
250 RoHS & Green  
2000 RoHS & Green  
SN  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 105  
-40 to 105  
-40 to 105  
UR916QSQ  
SN  
SN  
UR916QSQ  
UR916QSQ  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
3-Jun-2022  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DS90UR916QSQ/NOPB WQFN  
DS90UR916QSQE/NOPB WQFN  
DS90UR916QSQX/NOPB WQFN  
NKB  
NKB  
NKB  
60  
60  
60  
1000  
250  
330.0  
178.0  
330.0  
16.4  
16.4  
16.4  
9.3  
9.3  
9.3  
9.3  
9.3  
9.3  
1.3  
1.3  
1.3  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
2000  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
3-Jun-2022  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DS90UR916QSQ/NOPB  
DS90UR916QSQE/NOPB  
DS90UR916QSQX/NOPB  
WQFN  
WQFN  
WQFN  
NKB  
NKB  
NKB  
60  
60  
60  
1000  
250  
356.0  
208.0  
356.0  
356.0  
191.0  
356.0  
35.0  
35.0  
35.0  
2000  
Pack Materials-Page 2  
PACKAGE OUTLINE  
NKB0060B  
VQFN - 0.8 mm max height  
S
C
A
L
E
1
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD  
9.1  
8.9  
A
B
PIN 1 INDEX AREA  
9.1  
8.9  
0.8  
0.7  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
2X 7  
6.3 0.1  
SYMM  
EXPOSED  
THERMAL PAD  
(0.1) TYP  
16  
30  
15  
31  
SYMM  
61  
2X 7  
1
0.3  
60X  
45  
0.2  
56X 0.5  
60  
46  
0.1  
C A B  
0.7  
0.5  
PIN 1 ID  
0.05  
60X  
4214995/A 03/2018  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
NKB0060B  
VQFN - 0.8 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(
6.3)  
SYMM  
SEE SOLDER MASK  
DETAIL  
60X (0.8)  
60X (0.25)  
46  
60  
1
45  
56X (0.5)  
(1.1) TYP  
(1.2) TYP  
SYMM  
(R0.05) TYP  
(
0.2) TYP  
VIA  
61  
(0.6) TYP  
(8.6)  
15  
31  
30  
16  
(0.6) TYP  
(1.2) TYP  
(1.1) TYP  
(8.6)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 8X  
0.07 MIN  
ALL AROUND  
0.07 MAX  
ALL AROUND  
METAL UNDER  
SOLDER MASK  
METAL EDGE  
EXPOSED METAL  
SOLDER MASK  
OPENING  
EXPOSED  
METAL  
SOLDER MASK  
OPENING  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214995/A 03/2018  
NOTES: (continued)  
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
NKB0060B  
VQFN - 0.8 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
25X ( 1)  
(1.2) TYP  
46  
60X (0.8)  
60X (0.25)  
60  
1
45  
56X (0.5)  
(R0.05) TYP  
(1.2) TYP  
(8.6)  
61  
SYMM  
15  
31  
16  
30  
SYMM  
(8.6)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 MM THICK STENCIL  
SCALE: 8X  
EXPOSED PAD 61  
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE  
4214995/A 03/2018  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
TI products.  
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022, Texas Instruments Incorporated  

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