FPC202RHUT [TI]
采用扩展 I/O 的 双端口控制器 | RHU | 56 | -40 to 85;
| 型号： | FPC202RHUT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用扩展 I/O 的 双端口控制器 | RHU | 56 | -40 to 85 控制器 接口集成电路 |
| 文件： | 总12页 (文件大小：955K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FPC202
ZHCSHP5A –DECEMBER 2017 –REVISED JANUARY 2023
采用扩展I/O 的FPC202 双端口控制器
1 特性
2 应用
• 支持跨两个端口进行控制信号管理和I2C 聚合
• 每个端口具有四个LED 驱动器和12 个通用I/O
• 通用输出可用于驱动超过4 个LED（每个端口）
• 整合了多个FPC202 器件，用于通过单个主机接口
控制总共28 个端口
• 无需使用分立式I2C 多路复用器、LED 驱动器和高
引脚计数FPGA/CPLD 控制器件
• 通过处理接近端口的全部低速控制信号来降低PCB
布线复杂性
• 可选I2C（高达1MHz）或SPI（高达10MHz）主
机控制接口
• 从模块中自动预取用户指定的重要数据
• 广播模式允许对所有FPC202 控制器的全部端口同
步执行写操作
• ToR/聚合/核心交换机和路由器
• 无线基础设施基带单元和远程无线电单元
• 网络接口卡(NIC) 和主机总线适配器(HBA)
• 存储卡和存储机架
• SFP、QSFP、QSFP-DD、OSFP、Mini-SAS HD
端口管理
3 说明
FPC202 双端口控制器用作低速信号聚合器，适用于
SFP、QSFP 和 Mini-SAS HD 等通用端口类型。
FPC202 能够跨两个端口聚合所有低速控制和 I2C 信
号，并为主机提供一个易于使用的管理接口（I2C 或
SPI）。利用连接到主机的一个公共控制接口，可以在
高端口数应用使用多个FPC202。
• 用于端口状态指示的高级LED 功能，包括可编程闪
烁和调光功能
• 可定制中断事件
• 单独的主机侧I/O 电压：1.8V 至3.3V
• 采用小型QFN 封装，能够放置在PCB 底部、端口
下方
器件信息(1)
封装尺寸（标称值）
器件型号
FPC202
封装
QFN (56)
5.00mm × 11.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
INT
SCL
SDA
HOST
CONTROLLER
FPC202 DUAL PORT CONTROLLER WITH EXPANDED I/Os
FPC202 DUAL PORT CONTROLLER WITH EXPANDED I/Os
PORT 0
PORT 1
PORT 0
PORT 1
I2C,
I2C,
STATUS,
CONTROL
STATUS,
CONTROL
SFP,
QSFP,
SFP,
SFP,
QSFP,
SFP,
QSFP,
QSFP-DD,
OSFP
QSFP,
QSFP-DD,
OSFP
QSFP-DD,
OSFP
QSFP-DD,
OSFP
PORT 0
PORT 1
PORT 2
PORT 3
Copyright © 2017, Texas Instruments Incorporated
简化版方框图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SNLS565
FPC202
www.ti.com.cn
ZHCSHP5A –DECEMBER 2017 –REVISED JANUARY 2023
Table of Contents
7.1 Documentation Support.............................................. 4
7.2 接收文档更新通知....................................................... 4
7.3 支持资源......................................................................4
7.4 Trademarks.................................................................4
7.5 静电放电警告.............................................................. 4
7.6 术语表......................................................................... 4
8 Mechanical, Packaging, and Orderable Information....4
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 修订历史记录.....................................................................2
5 说明（续）.........................................................................3
6 Device Comparison Table...............................................3
7 Device and Documentation Support..............................4
4 修订历史记录
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (December 2017) to Revision A (January 2023)
Page
• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1
Copyright © 2023 Texas Instruments Incorporated
2
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Product Folder Links: FPC202
FPC202
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ZHCSHP5A –DECEMBER 2017 –REVISED JANUARY 2023
5 说明（续）
FPC202 所采用的设计允许将其放置在PCB 底部、压合连接器下方，由此可简化布线。凭借这种本地控制端口低
速信号的方法，可以使用 I/O 数更少的控制器件（FPGA、CPLD 和 MCU）并减少布线层拥塞，从而降低系统物
料清单(BOM) 成本。
FPC202 能够与标准的 SFF-8431、SFF-8436 和 SFF-8449 低速管理接口（包括连接每个端口的专用
100/400kHz I2C 接口）兼容。该器件还提供有其他通用引脚来驱动端口状态 LED 或控制电源开关。LED 驱动程
序器具有便利的功能，例如可编程闪烁和调光功能。连接主机控制器的接口可在 1.8V 至 3.3V 的单独电源电压下
运行，以支持低压I/O。
对于每个端口，FPC202 总共具有四个 LED 驱动器、12 个通用 I/O 和两个下行 I2C 总线。利用这组扩展的 I/O，
可以控制系统内的其他元件和功能。如果每个端口需要四个以上LED，则通用输出可用于驱动更多LED。
FPC202 可以从每个模块中用户指定的寄存器中预取数据，这样方便主机通过一个快速I2C（速度高达 1MHz）或
SPI（速度高达 10MHz）接口来读取数据。此外，FPC202 还可以触发主机中断，提示某受控端口上发生了重要
的用户可配置事件。这样一来，便无需再持续轮询模块。
6 Device Comparison Table
PART NUMBER
PORTS
LED DRIVERS PER PORT
GPIOs PER PORT
ACCESSIBLE DOWNSTREAM
ADDRESSES
FPC202
FPC402
FPC401
2
4
4
4
2
2
12
6
All valid I2C addresses
All valid I2C addresses
6
MSA addresses: 0xA0, 0xA2
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: FPC202
FPC202
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ZHCSHP5A –DECEMBER 2017 –REVISED JANUARY 2023
7 Device and Documentation Support
7.1 Documentation Support
7.1.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, FPC202 Programmer's Guide
• Texas Instruments, FPC401 Evaluation Module (EVM) User's Guide
Click here to request access to these documents in the FPC202 MySecure folder.
7.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
7.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
7.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
7.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
7.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: FPC202
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
FPC202RHUR
FPC202RHUT
ACTIVE
ACTIVE
WQFN
WQFN
RHU
RHU
56
56
2000 RoHS & Green
250 RoHS & Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
FPC2
FPC2
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2022
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
FPC202RHUR
FPC202RHUT
WQFN
WQFN
RHU
RHU
56
56
2000
250
330.0
178.0
24.4
24.4
5.3
5.3
11.3
11.3
1.0
1.0
8.0
8.0
24.0
24.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
FPC202RHUR
FPC202RHUT
WQFN
WQFN
RHU
RHU
56
56
2000
250
367.0
213.0
367.0
191.0
45.0
55.0
Pack Materials-Page 2
PACKAGE OUTLINE
RHU0056A
WQFN - 0.8 mm max height
S
C
A
L
E
2
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
5.15
4.85
A
B
PIN 1 INDEX AREA
11.15
10.85
0.8
0.7
C
SEATING PLANE
0.08 C
0.05
0.00
2X 3.5
2.4 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
21
28
20
29
SYMM
57
8.4 0.1
2X 9.5
1
48
0.30
0.18
52X 0.5
PIN 1 ID
56X
56
49
0.1
C A B
0.5
0.3
56X
0.05
4219076/A 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHU0056A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2.4)
SEE SOLDER MASK
DETAIL
SYMM
49
56
56X (0.6)
56X (0.24)
1
48
52X (0.5)
(R0.05) TYP
(8.4)
(
0.2) TYP
VIA
SYMM
(10.8)
57
4X (1.28)
2X (3.95)
29
20
21
28
2X (0.95)
(4.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219076/A 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RHU0056A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.63) TYP
49
56
56X (0.6)
56X (0.24)
1
48
52X (0.5)
(R0.05) TYP
5X (1.28)
(0.64)
57
SYMM
(10.8)
12X (1.08)
12X
(1.06)
20
29
21
28
SYMM
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 10X
EXPOSED PAD 57
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4219076/A 01/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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