INA159_12 [TI]

Precision, Gain of 0.2 Level Translation;
INA159_12
型号: INA159_12
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Precision, Gain of 0.2 Level Translation

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INA159  
SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
Precision, Gain of 0.2 Level Translation  
DIFFERENCE AMPLIFIER  
FD EATURES  
DESCRIPTION  
GAIN OF 0.2 TO INTERFACE 10V SIGNALS  
TO SINGLE-SUPPLY ADCs  
The INA159 is a high slew rate, G = 1/5 difference amplifier  
consisting of a precision op amp with a precision resistor  
network. The gain of 1/5 makes the INA159 useful to  
couple 10V signals to single-supply analog-to-digital  
converters (ADCs), particularly those operating on a single  
+5V supply. The on-chip resistors are laser-trimmed for  
accurate gain and high common-mode rejection. Excellent  
temperature coefficient of resistance (TCR) tracking of the  
resistors maintains gain accuracy and common-mode  
rejection over temperature. The input common-mode  
voltage range extends beyond the positive and negative  
supply rails. It operates on a total of +1.8V to +5.5V single  
or split supplies. The INA159 reference input uses two  
resistors for easy mid-supply or reference biasing.  
D
D
D
D
D
D
GAIN ACCURACY: 0.024% (max)  
WIDE BANDWIDTH: 1.5MHz  
HIGH SLEW RATE: 15V/µs  
LOW OFFSET VOLTAGE: 100µV  
LOW OFFSET DRIFT: 1.5µV/°C  
SINGLE-SUPPLY OPERATION DOWN TO 1.8V  
AD PPLICATIONS  
INDUSTRIAL PROCESS CONTROLS  
D
INSTRUMENTATION  
The difference amplifier is the foundation of many  
commonly-used circuits. The INA159 provides this circuit  
function without using an expensive external precision  
resistor network. The INA159 is available in an MSOP-8  
surface-mount package and is specified for operation over  
the extended industrial temperature range, −40°C to  
+125°C.  
D
DIFFERENTIAL TO SINGLE-ENDED  
CONVERSION  
D
AUDIO LINE RECEIVERS  
VREF  
5V  
V+  
20k  
100k  
SENSE  
IN  
REF V+  
R1  
DOUT  
100  
+IN  
ADS8325  
ADC  
DCLOCK  
CS  
C1  
1000pF  
IN  
100k  
40k  
+IN  
REF 2  
REF 1  
GND  
VIN  
40k  
INA159  
Figure 1. Typical Application  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
ꢀꢁ ꢂ ꢃꢄ ꢅ ꢆꢇ ꢂꢈ ꢃ ꢉꢆꢉ ꢊꢋ ꢌꢍ ꢎ ꢏꢐ ꢑꢊꢍꢋ ꢊꢒ ꢓꢔ ꢎ ꢎ ꢕꢋꢑ ꢐꢒ ꢍꢌ ꢖꢔꢗ ꢘꢊꢓ ꢐꢑꢊ ꢍꢋ ꢙꢐ ꢑꢕꢚ ꢀꢎ ꢍꢙꢔ ꢓꢑꢒ  
ꢓ ꢍꢋ ꢌꢍꢎ ꢏ ꢑꢍ ꢒ ꢖꢕ ꢓ ꢊ ꢌꢊ ꢓ ꢐ ꢑꢊ ꢍꢋꢒ ꢖ ꢕꢎ ꢑꢛꢕ ꢑꢕ ꢎ ꢏꢒ ꢍꢌ ꢆꢕꢜ ꢐꢒ ꢇꢋꢒ ꢑꢎ ꢔꢏ ꢕꢋꢑ ꢒ ꢒꢑ ꢐꢋꢙ ꢐꢎ ꢙ ꢝ ꢐꢎ ꢎ ꢐ ꢋꢑꢞꢚ  
ꢀꢎ ꢍ ꢙꢔꢓ ꢑ ꢊꢍ ꢋ ꢖꢎ ꢍ ꢓ ꢕ ꢒ ꢒ ꢊꢋ ꢟ ꢙꢍ ꢕ ꢒ ꢋꢍꢑ ꢋꢕ ꢓꢕ ꢒꢒ ꢐꢎ ꢊꢘ ꢞ ꢊꢋꢓ ꢘꢔꢙ ꢕ ꢑꢕ ꢒꢑꢊ ꢋꢟ ꢍꢌ ꢐꢘ ꢘ ꢖꢐ ꢎ ꢐꢏ ꢕꢑꢕ ꢎ ꢒꢚ  
Copyright 2005, Texas Instruments Incorporated  
www.ti.com  
www.ti.com  
SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be  
(1)  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V  
Signal Input Terminals (−IN and +IN), Voltage . . . . . . . . . . . . . 30V  
Reference (REF 1 and REF2) and Sense Pins  
handledwith appropriate precautions. Failure to observe  
proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to  
complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could  
cause the device not to meet its published specifications.  
Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA  
Voltage . . . . . . . . . . . . . . . . . . . . . . . . (V−) − 0.5V to (V+) + 0.5V  
Output Short Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous  
Operating Temperature . . . . . . . . . . . . . . . . . . . . . −40°C to +150°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C  
ESD Rating  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PACKAGE  
MARKING  
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V  
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000V  
PRODUCT PACKAGE-LEAD  
INA159 MSOP-8  
(1)  
DGK  
CJB  
(1)  
Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods  
may degrade device reliability. These are stress ratings only, and  
functional operation of the device at these or any other conditions  
beyond those specified is not supported.  
For the most current package and ordering information, see the  
Package Option Addendum at the end of this document, or see  
the TI web site at www.ti.com.  
PIN CONFIGURATIONS  
TOP VIEW  
MSOP  
INA159  
1
2
3
4
REF 2  
V+  
REF 1  
8
7
6
5
IN  
OUT  
+IN  
SENSE  
V
2
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
ELECTRICAL CHARACTERISTICS: V = +5V  
S
Boldface limits apply over the specified temperature range, T = −40°C to +125°C.  
A
At T = +25°C, R = 10kconnected to V /2, REF pin 1 connected to ground, and REF pin 2 connected to V  
= 5V, unless otherwise noted.  
A
L
S
REF  
INA159  
TYP  
PARAMETER  
(1)  
CONDITIONS  
MIN  
MAX  
UNIT  
OFFSET VOLTAGE  
RTO  
(1)  
Initial  
V
V
=
2.5V, Reference and Input Pins Grounded  
100  
1.5  
20  
0.002  
0.002  
500  
µV  
µV/°C  
µV/V  
%
OS  
S
vs Temperature  
vs Power Supply  
Reference Divider Accuracy  
over Temperature  
PSRR  
V
=
0.9V to 2.75V  
100  
0.024  
S
(2)  
%
(3)  
INPUT IMPEDANCE  
Differential  
Common-Mode  
240  
60  
kΩ  
kΩ  
INPUT VOLTAGE RANGE  
Common-Mode Voltage  
Range  
RTI  
V
CM  
Positive  
Negative  
17.5  
−12.5  
V
V
Common-Mode Rejection  
Ratio  
CMRR  
V
= −10V to +10V, R = 0Ω  
80  
96  
dB  
CM  
S
over Temperature  
94  
dB  
(4)  
OUTPUT VOLTAGE NOISE  
RTO  
f = 0.1Hz to 10Hz  
f = 10kHz  
10  
30  
µV  
PP  
nV/Hz  
GAIN  
V
= 4.096V, R Connected to GND,  
REF2 L  
(V ) − (V ) = −10V to +10V, V = 0V  
CM  
IN+  
IN−  
Initial  
Error  
vs Temperature  
Nonlinearity  
G
0.2  
0.005  
1
V/V  
%
ppm/°C  
% of FS  
0.024  
0.0002  
OUTPUT  
Voltage, Positive  
Voltage, Negative  
Current Limit, Continuous to Common  
Capacitive Load  
V
V
= 4.096V, R Connected to GND  
(V+) − 0.1  
(V−) + 0.048 (V−) + 0.01  
60  
(V+) − 0.02  
V
V
mA  
pF  
REF2  
REF2  
L
= 4.096V, R Connected to GND  
L
See Typical Characteristic  
110  
Open-Loop Output Impedance  
R
f = 1MHz, I = 0  
O
O
FREQUENCY RESPONSE  
Small-Signal Bandwidth  
Slew Rate  
Settling Time, 0.01%  
Overload Recovery Time  
−3dB  
1.5  
15  
1
MHz  
V/µs  
µs  
SR  
t
4V Output Step, C = 100pF  
L
S
50% Overdrive  
250  
ns  
POWER SUPPLY  
Specified Voltage Range  
Operating Voltage Range  
V
+5  
V
V
S
+1.8  
+5.5  
1.5  
I
= 0mA, V  
=
2.5V,  
O
S
Quiescent Current  
I
1.1  
mA  
Q
Reference and Input Pins Grounded  
TEMPERATURE RANGE  
Specified Range  
Operating Range  
Storage Range  
−40  
−40  
−65  
+125  
+150  
+150  
°C  
°C  
°C  
Thermal Resistance  
MSOP-8  
q
JA  
Surface-Mount  
150  
°C/W  
(1)  
(2)  
(3)  
(4)  
Includes effects of amplifier input bias and offset currents.  
Reference divider accuracy specifies the match between the reference divider resistors using the configuration in Figure 2.  
Internal resistors are ratio matched but have 20% absolute value.  
Includes effects of amplifier input current noise and thermal noise contribution of resistor network.  
3
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
+5V  
V+  
7
100k  
100k  
20k  
2
3
5
6
The test is performed by  
measuring the output  
with the reference  
applied to alternate  
OUT  
reference resistors, and  
calculating a result such  
that the amplifier offset is  
cancelled in the final  
measurement.  
40k  
40k  
1
8
INA159  
4
V
Figure 2. Test Circuit for Reference Divider Accuracy  
TYPICAL CHARACTERISTICS  
At T = +25°C, R = 10kconnected to V /2, REF pin 1 connected to ground, and REF pin 2 connected to V = 5V, unless otherwise noted.  
REF  
A
L
S
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION  
OFFSET VOLTAGE PRODUCTION DISTRIBUTION  
µ
_
Offset Voltage Drift ( V/ C)  
µ
Offset Voltage ( V)  
GAIN vs FREQUENCY  
POWER−SUPPLY REJECTION RATIO vs FREQUENCY  
0
10  
20  
30  
40  
50  
130  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10  
10  
100  
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
4
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
TYPICAL CHARACTERISTICS (continued)  
At T = +25°C, R = 10kconnected to V /2, REF pin 1 connected to ground, and REF pin 2 connected to V = 5V, unless otherwise noted.  
REF  
A
L
S
COMMON−MODE REJECTION RATIO vs FREQUENCY  
QUIESCENT CURRENT vs TEMPERATURE  
VS = 5.5V  
120  
110  
100  
90  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
VS = 5V  
80  
70  
60  
VS = 1.8V  
50  
40  
30  
20  
10  
100  
1k  
10k  
100k  
1M  
10M  
50  
25  
0
25  
50  
75  
100  
125  
Frequency (Hz)  
_
Temperature ( C)  
SHORT−CIRCUIT CURRENT vs TEMPERATURE  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
120  
100  
80  
60  
40  
20  
0
VS  
=
2.75V  
_
TA  
=
40  
C
VS  
= 2.5V  
_
TA = +25  
C
_
TA  
=
40  
C
TA  
=
+125_C  
_
TA = +125  
C
VS  
= 0.9V  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
20  
40  
60  
80  
VS  
= 2.5V  
VS  
VS  
=
0.9V  
2.5V  
=
VS  
25  
=
2.75V  
100  
0
50  
10  
20  
30  
40  
50  
60  
70  
80  
90  
25  
0
50  
75  
100  
125  
_
Output Current (mA)  
Temperature ( C)  
TOTAL HARMONIC DISTORTION + NOISE  
vs FREQUENCY  
OUTPUT VOLTAGE NOISE SPECTRAL DENSITY  
vs FREQUENCY  
1000  
100  
10  
0.01  
0.25VPP  
2k  
4VPP  
600  
0.001  
1
10  
10  
100  
1k  
10k  
100k  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
5
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
TYPICAL CHARACTERISTICS (continued)  
At T = +25°C, R = 10kconnected to V /2, REF pin 1 connected to ground, and REF pin 2 connected to V  
= 5V, unless otherwise noted.  
A
L
S
REF  
0.1Hz TO 10Hz NOISE  
SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE  
60  
50  
40  
30  
20  
10  
0
VS = 5V  
100  
1000  
Load Capacitance (pF)  
3000  
Time (1s/div)  
SMALL−SIGNAL STEP RESPONSE  
LARGE−SIGNAL STEP RESPONSE  
Time (500ns/div)  
Time (500ns/div)  
SETTLING TIME  
VOUT = 4V Step  
CL = 100pF  
Time (250ns/div)  
6
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SBOS333B − JULY 2005 − REVISED OCTOBER 2005  
Where one REF pin is connected to the reference, and the  
other pin grounded (1/2 reference connection):  
APPLICATION INFORMATION  
The internal op amp of the INA159 has a rail-to-rail  
common-mode voltage capability at its inputs. A rail-to-rail  
op amp allows the use of 10V inputs into a circuit biased  
to 1/2 of a 5V reference (2.5V quiescent output). The inputs  
to the op amp will swing from approximately 400mV to  
3.75V in this application.  
(
)
[(  
)
(
)]  
)]  
VCM) + V) ) 5 V) * 0.5VREF  
(3)  
(4)  
(
)
[(  
)
(
VCM* + V* * 5 0.5VREF * V*  
Some typical values are shown in Table 1.  
The unique input topology of the INA159 eliminates the  
input offset transition region typical of most rail-to-rail  
complementary stage operational amplifiers. This allows  
the INA159 to provide superior glitch- and transition-free  
performance over the entire common-mode range.  
Table 1. Common-Mode Range For Various  
Supply and Reference Voltages  
REF 1 and REF 2 Connected Together  
V+  
5
V−  
0
V
V
V
CM−  
REF  
CM+  
3
15  
−15  
Good layout practice includes the use of a 0.1µF bypass  
capacitor placed closely across the supply pins.  
5
0
2.5  
17.5  
−12.5  
−6.25  
5
0
1.25  
23.75  
1/2 Reference Connection  
COMMON-MODE RANGE  
V+  
5
V−  
0
V
V
V
REF  
CM+  
CM−  
5
17.5  
19.76  
23.75  
11.55  
13.55  
16.675  
−12.5  
−10.24  
−6.25  
−8.25  
−6.25  
−3.125  
The common-mode range of the INA159 is a function of  
supply voltage and reference. Where both pins, REF1 and  
REF2, are connected together:  
5
0
4.096  
2.5  
5
0
3.3  
3.3  
3.3  
0
3.3  
(
)
[( ]  
)
VCM) + V) ) 5 V) * VREF  
(1)  
(2)  
0
2.5  
0
1.25  
(
)
[
(
)]  
VCM* + V* * 5 VREF * V*  
7
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Table 2. Input and Output Relationships for Various Reference and Connection Combinations  
V
V
for V = 0 LINEAR V RANGE USEFUL V  
SWING  
REF  
OUT  
IN  
IN  
OUT  
(V)  
(V)  
(V)  
(V)  
REF CONNECTION  
+10  
0
−10  
4.5  
( 2V swing)  
0.5  
5V  
5
2.5  
V+  
100kΩ  
20kΩ  
SENSE  
IN  
+10  
0
−10  
4.048  
( 2V swing)  
0.048  
4.096  
3.3  
2.048  
1.65  
1.25  
0.9  
+10  
0
−7.885  
3.65  
(−1.577V, +2V swing)  
0.048  
OUT  
VREF  
40k  
100k  
+IN  
REF 2  
REF 1  
VIN  
+10 (also +5)  
0
−6 (also −5)  
3.25  
(−1.2V, +2V swing)  
0.048  
2.5  
40kΩ  
INA159  
+10  
0
−4.26  
2.9  
(−0.852V, +2V swing)  
0.048  
1.8  
5V  
V+  
+10  
0
−10  
4.5  
( 2V swing)  
0.5  
2.5  
1.8  
2.5  
1.8  
100k  
20k  
IN  
SENSE  
OUT  
VREF  
+10  
0
−8.76  
3.8  
(−1.752V, +2V swing)  
0.048  
100k  
40k  
40k  
+IN  
REF 2  
REF 1  
VIN  
+10  
0
−5.76  
3.2  
(−1.15V, +2V swing)  
0.048  
INA159  
1.2  
1.2  
8
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VREF  
5V  
V+  
100k  
20k  
SENSE  
IN  
REF V+  
R1  
DOUT  
100  
+IN  
ADS8325  
DCLOCK  
ADC  
C1  
1000pF  
IN  
CS  
100k  
40k  
40k  
+IN  
REF 2  
REF 1  
GND  
VIN  
INA159  
Figure 3. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs  
VREF  
5V  
V+  
100k  
20k  
SENSE  
IN  
REF V+  
R1  
DOUT  
100  
ADS8361 or  
ADS7861  
ADC  
+IN  
DCLOCK  
CS  
C1  
1000pF  
IN  
100k  
40k  
40k  
+IN  
REF 2  
REF 1  
GND  
VIN  
INA159  
Figure 4. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs with  
Pseudo-Differential Inputs (such as the ADS7861 and ADS8361)  
9
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VREF  
5V  
V+  
100k  
100k  
20k  
IN  
SENSE  
REF V+  
ADC  
R1  
100  
+IN  
IN  
C1  
1000pF  
40k  
40k  
+IN  
REF 2  
REF 1  
VIN  
GND  
INA159  
a) Unipolar, Noninverting, G = 0.2  
VREF  
5V  
V+  
100k  
20k  
IN  
SENSE  
REF V+  
ADC  
R1  
100  
+IN  
IN  
C1  
1000pF  
100k  
40k  
40k  
+IN  
REF 2  
REF 1  
VIN  
GND  
INA159  
b) Bipolar, Noninverting, G = 0.2  
VREF  
5V  
V+  
100k  
20k  
SENSE  
IN  
REF V+  
ADC  
R1  
100  
+IN  
IN  
C1  
1000pF  
100k  
40k  
40k  
+IN  
REF 2  
REF 1  
GND  
INA159  
VIN  
c) Unipolar, Unity Gain  
Figure 5. Basic INA159 Configurations  
10  
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5V  
V+  
100k  
20k  
SENSE A  
OUT A  
IN A  
VIN  
100  
1000pF  
100k  
40k  
40k  
+IN A  
REF 2A  
REF 1A  
VIN+  
INA159  
VREF  
V+  
100k  
20k  
REF V+  
+IN  
IN B  
SENSE B  
OUT B  
5V  
ADC  
100  
IN  
1000pF  
GND  
100k  
40k  
40k  
+IN B  
REF 2B  
REF 1B  
INA159  
Figure 6. Differential ADC Drive  
11  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Nov-2005  
PACKAGING INFORMATION  
Orderable Device  
INA159AIDGKR  
INA159AIDGKT  
INA159AIDGKTG4  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
MSOP  
DGK  
8
8
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MSOP  
MSOP  
DGK  
DGK  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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Logic  
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logic.ti.com  
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Microcontrollers  
power.ti.com  
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Security  
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Wireless  
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Copyright 2005, Texas Instruments Incorporated  

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