INA281 [TI]
INA281, â4-V to 110-V, 1.3-MHz Current-Sense Amplifier;型号: | INA281 |
厂家: | TEXAS INSTRUMENTS |
描述: | INA281, â4-V to 110-V, 1.3-MHz Current-Sense Amplifier |
文件: | 总28页 (文件大小:1478K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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INA281
SBOSA29 –JUNE 2020
INA281, –4-V to 110-V, 1.3-MHz Current-Sense Amplifier
1 Features
3 Description
The INA281 is
a high-precision current sense
1
•
•
•
Wide common-mode voltage:
amplifier that can measure voltage drops across
shunt resistors over a wide common-mode range
from –4 V to 110 V. The negative common-mode
voltage allows the device to operate below ground,
thus accommodating precise measurement of
recirculating currents in half-bridge applications. The
combination of a low offset voltage, small gain error
and high DC CMRR enables highly accurate current
measurement. The INA281 is not only designed for
DC current measurement, but also for high-speed
applications (like fast overcurrent protection, for
example) with a high bandwidth of 1.3 MHz and an
65-dB AC CMRR (at 50 kHz).
–
–
Operational voltage: −4 V to +110 V
Survival voltage: −20 V to +120 V
Excellent CMRR:
–
–
120-dB DC CMRR
65-dB AC CMRR at 50 kHz
Accuracy:
–
Gain:
–
–
Gain error: ±0.5% (maximum)
Gain drift: ±20 ppm/°C (maximum)
–
Offset:
The INA281 operates from a single 2.7-V to 20-V
supply, drawing 1.5 mA of supply current. The
INA281 is available with five gain options: 20 V/V, 50
V/V, 100 V/V, 200 V/V, and 500 V/V. These gain
options address wide dynamic range for current-
sensing applications.
–
–
Offset voltage: ±55 µV (typical)
Offset drift: ±0.1 µV/°C (typical)
•
Available gains:
–
–
–
–
–
INA281A1, INA281B1 : 20 V/V
INA281A2, INA281B2 : 50 V/V
INA281A3, INA281B3 : 100 V/V
INA281A4, INA281B4 : 200 V/V
INA281A5, INA281B5 : 500 V/V
The INA281 is specified over an operating
temperature range of −40 °C to +125 °C and is
offered in a space-saving SOT-23 package with two
pin-out variants.
•
•
•
High bandwidth: 1.3 MHz
Slew rate: 2.5V/µs
Device Information(1)
PART NUMBER
INA281
PACKAGE
BODY SIZE (NOM)
Quiescent current: 1.5 mA
SOT-23 (5)
2.90 mm × 1.60 mm
2 Applications
(1) For all available packages, see the package option addendum
at the end of the data sheet.
•
•
•
•
Active antenna system mMIMO (AAS)
Macro remote radio unit (RRU)
48-V rack server
Functional Block Diagram
VS
VCM
48-V merchant network & server power supply
(PSU)
ISENSE
•
•
•
•
Solenoid control
Valve control
R1
IN+
+
Current
RSENSE
Bias
Feedback
R1
Telecom equipment
Power supplies
OUT
-
INœ
Buffer
Load
RL
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
INA281
SBOSA29 –JUNE 2020
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Table of Contents
7.4 Device Functional Modes........................................ 13
Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application .................................................. 16
Power Supply Recommendations...................... 17
1
2
3
4
5
6
Features.................................................................. 1
8
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Typical Characteristics.............................................. 6
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
9
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
11 Device and Documentation Support ................. 19
11.1 Documentation Support ........................................ 19
11.2 Receiving Notification of Documentation Updates 19
11.3 Support Resources ............................................... 19
11.4 Trademarks........................................................... 19
11.5 Electrostatic Discharge Caution............................ 19
11.6 Glossary................................................................ 19
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
DATE
REVISION
NOTES
June 2020
*
Initial release
2
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5 Pin Configuration and Functions
INA281A: DBV Package
5-Pin SOT-23
INA281B: DBV Package
5-Pin SOT-23
Top View
Top View
OUT
GND
IN+
1
2
3
5
Vs
OUT
GND
Vs
1
2
3
5
INœ
4
INœ
4
IN+
Not to scale
Not to scale
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
GND
IN–
INA281A
INA281B
2
4
3
1
5
2
5
4
1
3
Ground
Input
Ground
Shunt resistor negative sense input
Shunt resistor positive sense input
Output voltage
IN+
Input
OUT
Vs
Output
Power
Power supply
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply Voltage
(VS)
–0.3
22
V
Differential (VIN+) – (VIN–), INA281A5, INA281B5
Analog Inputs,
VIN+, VIN–
–6
–12
6
Differential (VIN+) – (VIN–), All others
12
V
(2)
Common-mode
–20
120
VS + 0.3
150
Output
GND – 0.3
–55
V
TA
Operating temperature
Junction temperature
Storage temperature
°C
°C
°C
TJ
150
Tstg
–65
150
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per
±2000
ANSI/ESDA/JEDEC JS-001, all pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
–4
NOM
48
MAX
110
UNIT
V
VCM
VS
Common-mode input range
Operating supply range
Differential sense input range
Ambient temperature
2.7
0
5
20
V
VSENSE
TA
VS / G
125
V
–40
°C
6.4 Thermal Information
INA281
THERMAL METRIC(1)
DBV (SOT-23)
5 PINS
184.7
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
105.6
47.2
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
21.5
ΨJB
46.9
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT
VCM
Common-mode input range(1)
TA = –40 °C to +125 °C
–4
110
V
–4 V ≤ VCM ≤ 110 V, TA = –40 °C to
+125 °C
120
140
dB
dB
Common-mode rejection ratio, input
referred
CMRR
f = 50 kHz
65
±100
±55
INA281x1
±500
±300
±250
±200
±150
±1
INA281x2
Vos
Offset voltage, input referred
INA281x3
±30
µV
INA281x4
±30
INA281x5
±15
dVos/dT Offset voltage drift
TA = –40 ℃ to +125 ℃
±0.1
µV/℃
2.7 V ≤ VS ≤ 20 V,
TA = –40 °C to +125 °C
Power supply rejection ratio, input
referred
PSRR
IB
±1.5
±10
µV/V
IB+, VSENSE = 0 V
IB–, VSENSE = 0 V
10
10
20
20
30
30
uA
uA
Input bias current
(1) Common-mode voltage at both VIN+ and VIN- must not exceed the specified common-mode input range.
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Electrical Characteristics (continued)
at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
INA281x1
INA281x2
INA281x3
INA281x4
INA281x5
20
50
V/V
V/V
V/V
V/V
V/V
%
G
Gain
100
200
500
±0.07
±2
GND + 50 mV ≤ VOUT ≤ VS – 200 mV
±0.5
GERR
Gain error
TA = –40 °C to +125 °C
±20 ppm/°C
%
NLERR
Nonlinearity error
0.01
No sustained oscillations, no isolation
resistor
Maximum capacitive load
500
pF
VOLTAGE OUTPUT
Swing to Vs (Power supply rail)
VS
0.07
–
VS
0.15
–
RLOAD = 10 kΩ, TA = –40 °C to +125 °C
V
V
RLOAD = 10 kΩ, VSENSE = 0 V,
TA = –40 °C to +125 °C
Swing to ground
0.005
0.02
FREQUENCY RESPONSE
INA281x1, CLOAD = 5 pF,
VSENSE = 200 mV
1300
1300
1000
900
INA281x2, CLOAD = 5 pF,
VSENSE = 80 mV
INA281x3, CLOAD = 5 pF,
VSENSE = 40 mV
BW
SR
Bandwidth
kHz
INA281x4, CLOAD = 5 pF,
VSENSE = 20 mV
INA281x5, CLOAD = 5 pF,
VSENSE = 8 mV
900
2.5
10
Slew rate
Rising edge
V/µs
µs
VOUT = 4 V ± 0.1 V step, Output settles
to 0.5%
VOUT = 4 V ± 0.1 V step, Output settles
to 1%
Settling time
5
1
VOUT = 4 V ± 0.1 V step, Output settles
to 5%
NOISE
Ven
Voltage noise density
50
nV/√Hz
POWER SUPPLY
Vs
Supply voltage
TA = –40 °C to +125 °C
TA = –40 °C to +125 °C
2.7
20
2
V
1.5
mA
mA
IQ
Quiescent current
2.25
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6.6 Typical Characteristics
All specifications at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V, unless otherwise noted.
200
100
0
160
140
120
100
80
60
G = 20
G = 50
G = 100
G = 200
G = 500
40
-100
-200
20
0
10
100
1k 10k
Frequency (Hz)
100k
1M
-75 -50 -25
0
25
50
75 100 125 150 175
Temperature (èC)
Figure 2. Common-Mode Rejection Ratio vs Frequency
0.250
G = 20
Figure 1. Common-Mode Rejection Ratio vs Temperature
60
G = 50
50
40
30
20
G = 100
G = 200
G = 500
0.125
0.000
G = 20
G = 50
G = 100
G = 200
G = 500
10
0
-0.125
-10
-0.250
10
100
1k
10k
Frequency (Hz)
100k
1M
10M
-75 -50 -25
0
25
50
75 100 125 150 175
Temperature (èC)
Figure 3. Gain vs Frequency
Figure 4. Gain Error vs Temperature
25
20
15
10
5
25
20
15
10
5
VS = 2.7 to 20V, VCM = 48V
VS = 2.7 to 20V, VCM = 120V
VS = 2.7 to 20V, VCM = -4V
VS = 0V, VCM = 120V
VS = 5V
VS = 20V
VS = 2.7V
VS = 0V
VS = 0V, VCM = -4V
0
0
VS = 0V and 20V, VCM = -20V
-5
-5
-10
-10
-20
0
20
40
Common-Mode Voltage (V)
60
80
100
120
-75 -50 -25
0
25
50
75 100 125 150 175
Temperature (èC)
VSENSE = 0 V
Figure 5. Input Bias Current vs Common-Mode Voltage
Figure 6. Input Bias Current vs Temperature
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Typical Characteristics (continued)
All specifications at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V, unless otherwise noted.
240
200
160
120
80
140
120
100
80
IB+
IB-
IB+
IB-
IB+, VS = 0V
IB-, VS = 0V
IB+, VS = 0V
IB-, VS = 0V
60
40
40
20
0
0
-40
-80
-120
-160
-20
-40
-60
-80
0
200
400
VSENSE (mV)
600
800
1000
0
100
200
VSENSE (mV)
300
400
Figure 7. INA281x1 Input Bias Current vs VSENSE
Figure 8. INA281x2, INA281x3 Input Bias Current vs VSENSE
100
80
60
40
20
0
VS
IB+, G=200
IB+, G=500
IB-
IB+, VS = 0V
IB-, VS = 0V
25èC
125èC
-40èC
VS - 1
VS - 2
GND + 2
GND + 1
GND
-20
0
20
40
60
80
100
0
5
10
15
20
25
Output Current (mA)
30
35
40
VSENSE (mV)
VS = 2.7 V
Figure 10. Output Voltage vs Output Current
Figure 9. INA281x4, INA281x5 Input Bias Current vs VSENSE
VS
VS
VS - 1
VS - 2
VS - 3
25èC
125èC
-40èC
25èC
125èC
-40èC
VS - 1
VS - 2
VS - 3
GND + 3
GND + 2
GND + 1
GND
GND + 3
GND + 2
GND + 1
GND
0
5
10
15
Output Current (mA)
20
25
30
35
40
0
5
10
15
Output Current (mA)
20
25
30
35
40
VS = 5 V
Figure 11. Output Voltage vs Output Current
VS = 20 V
Figure 12. Output Voltage vs Output Current
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Typical Characteristics (continued)
All specifications at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V, unless otherwise noted.
1000
500
0.00
-0.10
-0.20
-0.30
-0.40
-0.50
200
100
50
20
10
5
2
1
0.5
0.2
0.1
0.05
VS = 5V
VS = 20V
VS = 2.7V
0.02
0.01
10
100
1k
10k
Frequency (Hz)
100k
1M
10M
-75 -50 -25
0
25
50
75 100 125 150 175
Temperature (èC)
Figure 13. Output Impedance vs Frequency
Figure 14. Swing to Supply vs Temperature
0.020
0.015
0.010
0.005
0.000
100
VS = 5V
VS = 20V
VS = 2.7V
G = 20
G = 500
80
70
60
50
40
30
20
10
10
100
1k 10k
Frequency (Hz)
100k
1M
-75 -50 -25
0
25
50
75 100 125 150 175
Temperature (èC)
Figure 16. Input Referred Noise vs Frequency
Figure 15. Swing to GND vs Temperature
2
1.8
1.6
1.4
1.2
1
VS = 20V
VS = 5V
G = 20 to 50
VS = 2.7V
G = 100 to 500
0.8
0
2.5
5
7.5
10
12.5
Output Voltage (V)
15
17.5
20
Time (1 s/div)
Figure 17. Input Referred Noise
Figure 18. Quiescent Current vs Output Voltage
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Typical Characteristics (continued)
All specifications at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V, unless otherwise noted.
2
1.8
1.6
1.4
1.2
1
50
40
30
20
10
0
VS = 5V
VS = 20V
VS = 2.7V
VS = 5V, Sourcing
VS = 5V, Sinking
VS = 20V, Sourcing
VS = 20V, Sinking
VS = 2.7V, Sourcing
VS = 2.7V, Sinking
0.8
-75 -50 -25
0
25
50
75 100 125 150 175
-75 -50 -25
0
25
50
75 100 125 150 175
Temperature (èC)
Temperature (èC)
Figure 19. Quiescent Current vs Temperature
Figure 20. Short-Circuit Current vs Temperature
2
2
1.8
1.6
1.4
1.2
1
VS = 5V
VS = 20V
VS = 2.7V
1.8
1.6
1.4
1.2
1
25èC
125èC
-40èC
0.8
0.8
0
2
4
6
8
Supply Voltage (V)
10
12
14
16
18
20
-20
0
20
40
Common-Mode Voltage (V)
60
80
100
120
Figure 21. Quiescent Current vs Supply Voltage
Figure 22. Quiescent Current vs Common-Mode Voltage
VCM
VOUT
0V
0V
0V
0V
Time (10 ms/div)
Time (12.5ms/div)
Figure 24. INA281x3 Step Response
Figure 23. Common-Mode Voltage Fast Transient Pulse
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Typical Characteristics (continued)
All specifications at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN– = 0.5 V / Gain, VCM = VIN– = 48 V, unless otherwise noted.
Supply Voltage
Output Voltage
Supply Voltage
Output Voltage
0V
0V
Time (5 ms/div)
Figure 25. Start-Up Response
Time (50 ms/div)
Figure 26. Supply Transient Response
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7 Detailed Description
7.1 Overview
The INA281 is a high- or low-side current-sense amplifier that offers a wide common-mode range, precision zero-
drift topology, excellent common-mode rejection ratio (CMRR), high bandwidth, and fast slew rate. Different gain
versions are available to optimize the output dynamic range based on the application. The INA281 is designed
using a transconductance architecture with a current-feedback amplifier that enables low bias currents of 20 µA
with a common-mode voltage of 110 V.
7.2 Functional Block Diagram
VS
Load
Supply
ISENSE
R1
IN+
+
Current
RSENSE
Bias
Feedback
R1
OUT
-
INœ
Buffer
Load
RL
GND
7.3 Feature Description
7.3.1 Amplifier Input Common-Mode Signal
The INA281 supports large input common-mode voltages from –4 V to +110 V. Because of the internal topology,
the common-mode range is not restricted by the power-supply voltage (VS). This allows for the INA281 to be
used for both low- and high-side current-sensing applications.
7.3.1.1 Input-Signal Bandwidth
The INA281 –3-dB bandwidth is gain-dependent, with several gain options of 20 V/V, 50 V/V, 100 V/V, 200 V/V,
and 500 V/V. The unique multistage design enables the amplifier to achieve high bandwidth at all gains. This
high bandwidth provides the throughput and fast response that is required for the rapid detection and processing
of overcurrent events.
The bandwidth of the device also depends on the applied VSENSE voltage. Figure 27 shows the bandwidth
performance profile of the device over frequency as output voltage increases for each gain variation. As shown in
Figure 27, the device exhibits the highest bandwidth with higher VSENSE voltages, and the bandwidth is higher
with lower device gain options. Individual requirements determine the acceptable limits of error for high-
frequency, current-sensing applications. Testing and evaluation in the end application or circuit is required to
determine the acceptance criteria and validate whether or not the performance levels meet the system
specifications.
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Feature Description (continued)
1400
1200
1000
800
600
INA281A1
INA281A2
INA281A3
INA281A4
INA281A5
400
200
0
1
2
3
Output Voltage (V)
Figure 27. Bandwidth vs Output Voltage
7.3.1.2 Low Input Bias Current
The INA281 inputs draw a 20-µA (typical) bias current at a common-mode voltage as high as 110 V, which
enables precision current sensing on applications that require lower current leakage.
7.3.1.3 Low VSENSE Operation
The INA281 operates with high performance across the entire valid VSENSE range. The zero-drift input
architecture of the INA281 provides the low offset voltage and low offset drift needed to measure low VSENSE
levels accurately across the wide operating temperature of –40 °C to +125 °C. Low VSENSE operation is
particularly beneficial when using low ohmic shunts for low current measurements, as power losses across the
shunt are significantly reduced.
7.3.1.4 Wide Fixed Gain Output
The INA281 gain error is < 0.5% at room temperature, with a maximum drift of 20 ppm/°C over the full
temperature range of –40 °C to +125 °C. The INA281 is available in multiple gain options of 20 V/V, 50 V/V, 100
V/V, 200 V/V, and 500 V/V, which the system designer should select based on their desired signal-to-noise ratio
and other system requirements.
The INA281 closed-loop gain is set by a precision, low-drift internal resistor network. The ratio of these resistors
are excellently matched, while the absolute values may vary significantly. TI does not recommend adding
additional resistance around the INA281 to change the effective gain because of this variation, however. The
typical values of the gain resistors are described in Table 1.
Table 1. Fixed Gain Resistor
GAIN
R1
RL
20 (V/V)
50 (V/V)
100 (V/V)
200 (V/V)
500 (V/V)
25 kΩ
10 kΩ
10 kΩ
5 kΩ
500 kΩ
500 kΩ
1000 kΩ
1000 kΩ
1000 kΩ
2 kΩ
7.3.1.5 Wide Supply Range
The INA281 operates with a wide supply range from 2.7 V to 20 V. The output stage supports a wide output
range, while the INA281x1 (gain of 20 V/V) at a supply voltage of 20 V allows a maximum acceptable differential
input of 1 V. When paired with the small input offset voltage of the INA281, systems with very wide dynamic
ranges of current measurement can be supported.
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7.4 Device Functional Modes
7.4.1 Unidirectional Operation
The INA281 measures the differential voltage developed by current flowing through a resistor that is commonly
referred to as a current-sensing resistor or a current-shunt resistor. The INA281 operates in unidirectional mode
only, meaning it only senses current sourced from a power supply to a system load as shown in Figure 28.
5 V
48-V
Supply
ISENSE
R1
IN+
+
Current
Feedback
RSENSE
Bias
R1
OUT
-
INœ
Buffer
RL
Load
GND
Figure 28. Unidirectional Application
The linear range of the output stage is limited to how close the output voltage can approach ground under zero-
input conditions. The zero current output voltage of the INA281 is very small, with a maximum of GND + 20 mV.
Make sure to apply a differential input voltage of (20 mV / Gain) or greater to keep the INA281 output in the
linear region of operation.
7.4.2 High Signal Throughput
With a bandwidth of 1.3 MHz at a gain of 20 V/V and a slew rate of 2.5 V/µs, the INA281 is specifically designed
for detecting and protecting applications from fast inrush currents. As shown in Table 2, the INA281 responds in
less than 2 µs for a system measuring a 75-A threshold on a 2-mΩ shunt.
Table 2. Response Time
INA281
PARAMETER
Gain
EQUATION
AT VS = 5 V
20 V/V
100 A
75 A
G
IMAX
Maximum current
IThreshold
RSENSE
VOUT_MAX
VOUT_THR
SR
Threshold current
Current sense resistor value
Output voltage at maximum current
Output voltage at threshold current
Slew rate
2 mΩ
VOUT_MAX = IMAX × RSENSE × G
VOUT_THR = ITHR × RSENSE × G
4 V
3 V
2.5 V/µs
< 2 µs
Output response time
Tresponse= VOUT_THR / SR
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The INA281 amplifies the voltage developed across a current-sensing resistor as current flows through the
resistor to the load. The wide input common-mode voltage range and high common-mode rejection of the
INA281 make it usable over a wide range of voltage rails while still maintaining an accurate current
measurement.
8.1.1 RSENSE and Device Gain Selection
The accuracy of any current-sense amplifier is maximized by choosing the current-sense resistor to be as large
as possible. A large sense resistor maximizes the differential input signal for a given amount of current flow and
reduces the error contribution of the offset voltage. However, there are practical limits as to how large the
current-sense resistor can be in a given application because of the resistor size and maximum allowable power
dissipation. Equation 1 gives the maximum value for the current-sense resistor for a given power dissipation
budget:
PDMAX
RSENSE
<
2
IMAX
where:
•
•
PDMAX is the maximum allowable power dissipation in RSENSE
.
IMAX is the maximum current that will flow through RSENSE
.
(1)
An additional limitation on the size of the current-sense resistor and device gain is due to the power-supply
voltage, VS, and device swing-to-rail limitations. To make sure that the current-sense signal is properly passed to
the output, both positive and negative output swing limitations must be examined. Equation 2 provides the
maximum values of RSENSE and GAIN to keep the device from exceeding the positive swing limitation.
IMAX ª RSENSE ª GAIN < VSP
where:
•
•
•
IMAX is the maximum current that will flow through RSENSE
.
GAIN is the gain of the current-sense amplifier.
VSP is the positive output swing as specified in the data sheet.
(2)
To avoid positive output swing limitations when selecting the value of RSENSE, there is always a trade-off between
the value of the sense resistor and the gain of the device under consideration. If the sense resistor selected for
the maximum power dissipation is too large, then it is possible to select a lower-gain device to avoid positive
swing limitations.
The negative swing limitation places a limit on how small the sense resistor value can be for a given application.
Equation 3 provides the limit on the minimum value of the sense resistor.
IMIN ª RSENSE ª GAIN > VSN
where:
•
•
•
IMIN is the minimum current that will flow through RSENSE
GAIN is the gain of the current-sense amplifier.
VSN is the negative output swing of the device.
.
(3)
Table 3 shows an example of the different results obtained from using five different gain versions of the INA281.
From the table data, the highest gain device allows a smaller current-shunt resistor and decreased power
dissipation in the element.
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Application Information (continued)
Table 3. RSENSE Selection and Power Dissipation(1)
RESULTS AT VS = 5 V
PARAMETER
EQUATION
A1, B1
A2, B2
A3, B3
A4, B4
A5, B5
DEVICES
DEVICES
50 V/V
100 mV
10 mΩ
1 W
DEVICES
DEVICES
200 V/V
25 mV
DEVICES
G
Gain
20 V/V
250 mV
25 mΩ
2.5 W
100 V/V
50 mV
5 mΩ
500 V/V
10 mV
1 mΩ
VDIFF
RSENSE
PSENSE
Ideal differential input voltage
VDIFF = VOUT / G
Current sense resistor value
RSENSE = VDIFF / IMAX
2.5 mΩ
0.25 W
Current-sense resistor power dissipation
RSENSE × IMAX
2
0.5W
0.1 W
(1) Design example with 10-A full-scale current with maximum output voltage set to 5 V.
8.1.2 Input Filtering
NOTE
Input filters are not required for accurate measurements using the INA281, and use of
filters in this location is not recommended. If filter components are used on the input of the
amplifier, follow the guidelines in this section to minimize the effects on performance.
Based strictly on user design requirements, external filtering of the current signal may be desired. The initial
location that can be considered for the filter is at the output of the current-sense amplifier. Although placing the
filter at the output satisfies the filtering requirements, this location changes the low output impedance measured
by any circuitry connected to the output voltage pin. The other location for filter placement is at the current-sense
amplifier input pins. This location also satisfies the filtering requirement, but the components must be carefully
selected to minimally impact device performance. Figure 29 shows a filter placed at the input pins.
VS
VCM
1
f3dB
=
4ŒRINCIN
ISENSE
RIN
R1
R1
IN+
+
CIN
Current
RSENSE
Bias
Feedback
RIN
OUT
-
INœ
Buffer
Load
RL
GND
Figure 29. Filter at Input Pins
External series resistance provides a source of additional measurement error, so keep the value of these series
resistors to 10 Ω or less to reduce loss of accuracy. The internal bias network shown in Figure 29 creates a
mismatch in input bias currents (see Figure 7, Figure 8, and Figure 9) when a differential voltage is applied
between the input pins. If additional external series filter resistors are added to the circuit, a mismatch is created
in the voltage drop across the filter resistors. This voltage is a differential error voltage in the shunt resistor
voltage. In addition to the absolute resistor value, mismatch resulting from resistor tolerance can significantly
impact the error because this value is calculated based on the actual measured resistance.
The measurement error expected from the additional external filter resistors can be calculated using Equation 4,
and the gain error factor is calculated using Equation 5.
Gain Error (%) = 100 - (100 ´ Gain Error Factor)
(4)
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The gain error factor, shown in Equation 4, can be calculated to determine the gain error introduced by the
additional external series resistance. Equation 4 calculates the deviation of the shunt voltage, resulting from the
attenuation and imbalance created by the added external filter resistance. Table 4 provides the gain error factor
and gain error for several resistor values.
RB × R1
Gain Error Factor =
(RB × R1) + (RB × RIN) + (2 × RIN × R1)
Where:
•
•
•
RIN is the external filter resistance value.
R1 is the INA281 input resistance value specified in Table 1.
RB in the internal bias resistance, which is 6600 Ω ± 20%.
(5)
Table 4. Example Gain Error Factor and Gain Error for 10-Ω External Filter Input Resistors
DEVICE (GAIN)
A1 devices (20)
A2 devices (50)
A3 devices (100)
A4 devices (200)
A5 devices (500)
GAIN ERROR FACTOR
0.99658
GAIN ERROR (%)
–0.34185
0.99598
–0.40141
0.99598
–0.40141
0.99499
–0.50051
0.99203
–0.79663
8.2 Typical Application
The INA281 is a unidirectional, current-sense amplifier capable of measuring currents through a resistive shunt
with shunt common-mode voltages from –4 V to +110 V.
24 V
Solenoid
RSENSE
ISENSE
MCU
+
œ
ADC
INA
5 V
GND
Figure 30. Current Sensing in a Solenoid Application
8.2.1 Design Requirements
In this example application, the common-mode voltage ranges from 0 V to 24 V. The maximum sense current is
1.5 A, and a 5-V supply is available for the INA281. Following the design guidelines from RSENSE and Device
Gain Selection, a RSENSE of 50 mΩ and a gain of 50 V/V are selected to provide good output dynamic range.
Table 5 lists the design setup for this application.
Table 5. Design Parameters
DESIGN PARAMETERS
Power supply voltage
Common mode voltage range
Maximum sense current
RSENSE resistor
EXAMPLE VALUE
5 V
0 V to 24 V
1.5 A
50 mΩ
Gain option
50 V/V
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8.2.2 Detailed Design Procedure
The INA281 is designed to measure current in a typical solenoid application. The INA281 measures current
across the 50-mΩ shunt that is placed at the output of the half-bridge. The INA281 measures the differential
voltage across the shunt resistor, and the signal is internally amplified with a gain of 50 V/V. The output of the
INA281 is connected to the analog-to-digital converter (ADC) of an MCU to digitize the current measurements.
Solenoid loads are highly inductive and are often prone to failure. Solenoids are often used for position control,
precise fluid control, and fluid regulation. Measuring real-time current on the solenoid continuously can indicate
premature failure of the solenoid which can lead to a faulty control loop in the system. Measuring high-side
current also indicates if there are any ground faults on the solenoid or the FETs that can be damaged in an
application. The INA281, with high bandwidth and slew rate, can be used to detect fast overcurrent conditions to
prevent the solenoid damage from short-to-ground faults.
8.2.2.1 Overload Recovery With Negative VSENSE
The INA281 is a unidirectional current-sense amplifier that is meant to operate with a positive differential input
voltage (VSENSE). If negative VSENSE is applied, the device is placed in an overload condition and requires time to
recover once VSENSE returns positive. The required overload recovery time increases with more negative VSENSE
.
8.2.3 Application Curve
Figure 31 shows the output response of a solenoid.
6
VCM
VOUT
4
2
40
30
20
10
0
0
Time (50 ms/div)
Figure 31. Solenoid Control Current Response
9 Power Supply Recommendations
The INA281 power supply can be 5 V, whereas the input common-mode voltage can vary between –4 V to 110
V. The output voltage range of the OUT pin, however, is limited by the voltage on the power-supply pin.
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10 Layout
10.1 Layout Guidelines
Attention to good layout practices is always recommended.
•
Connect the input pins to the sensing resistor using a Kelvin or 4-wire connection. This connection technique
makes sure that only the current-sensing resistor impedance is detected between the input pins. Poor routing
of the current-sensing resistor commonly results in additional resistance present between the input pins.
Given the very low ohmic value of the current resistor, any additional high-current carrying impedance can
cause significant measurement errors.
•
Place the power-supply bypass capacitor as close as possible to the device power supply and ground pins.
The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added
to compensate for noisy or high-impedance power supplies.
10.2 Layout Example
Supply
Voltage
OUT
GND
IN +
Vs
Bypass
Cap
Via to GND Plane
Ground Plane
IN -
Figure 32. INA281A Recommended Layout
OUT
GND
Vs
IN -
Via to GND Plane
Supply
Voltage
IN +
Bypass
Cap
Ground Plane
Figure 33. INA281B Recommended Layout
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following: Texas Instruments, INA281EVM user's guide
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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29-Aug-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
Qty
3000
250
(1)
(2)
(3)
(4/5)
(6)
INA281A1IDBVR
INA281A1IDBVT
INA281A2IDBVR
INA281A2IDBVT
INA281A3IDBVR
INA281A3IDBVT
INA281A4IDBVR
INA281A4IDBVT
INA281A5IDBVR
INA281A5IDBVT
INA281B1IDBVR
INA281B1IDBVT
INA281B2IDBVR
INA281B2IDBVT
INA281B3IDBVR
INA281B3IDBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
2B3C
2B3C
2B4C
2B4C
2B5C
2B5C
2B6C
2B6C
2B7C
2B7C
2B8C
2B8C
2B9C
2B9C
2BAC
2BAC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
3000
250
(1)
(2)
(3)
(4/5)
(6)
INA281B4IDBVR
INA281B4IDBVT
INA281B5IDBVR
INA281B5IDBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
2BBC
2BBC
2BCC
2BCC
ACTIVE
ACTIVE
ACTIVE
DBV
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
DBV
3000
250
Green (RoHS
& no Sb/Br)
DBV
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Aug-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
INA281A1IDBVR
INA281A1IDBVT
INA281A2IDBVR
INA281A2IDBVT
INA281A3IDBVT
INA281A4IDBVR
INA281A4IDBVT
INA281A5IDBVR
INA281A5IDBVT
INA281B1IDBVR
INA281B1IDBVT
INA281B2IDBVR
INA281B2IDBVT
INA281B3IDBVR
INA281B3IDBVT
INA281B4IDBVR
INA281B5IDBVR
INA281B5IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Aug-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
INA281A1IDBVR
INA281A1IDBVT
INA281A2IDBVR
INA281A2IDBVT
INA281A3IDBVT
INA281A4IDBVR
INA281A4IDBVT
INA281A5IDBVR
INA281A5IDBVT
INA281B1IDBVR
INA281B1IDBVT
INA281B2IDBVR
INA281B2IDBVT
INA281B3IDBVR
INA281B3IDBVT
INA281B4IDBVR
INA281B5IDBVR
INA281B5IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
183.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
3000
250
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
2X 0.95
1.9
3.05
2.75
1.9
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
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EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/E 09/2019
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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