ISO121 [TI]

±10V 输入、精密电压检测隔离式放大器;
ISO121
型号: ISO121
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

±10V 输入、精密电压检测隔离式放大器

放大器
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ISO120  
ISO121  
Precision Low Cost  
ISOLATION AMPLIFIER  
FEATURES  
APPLICATIONS  
100% TESTED FOR PARTIAL DISCHARGE  
INDUSTRIAL PROCESS CONTROL: Trans-  
ducer Isolator for Thermocouples, RTDs,  
Pressure Bridges, and Flow Meters, 4mA  
to 20mA Loop Isolation  
ISO120: Rated 1500Vrms  
ISO121: Rated 3500Vrms  
HIGH IMR: 115dB at 60Hz  
GROUND LOOP ELIMINATION  
MOTOR AND SCR CONTROL  
POWER MONITORING  
USER CONTROL OF CARRIER  
FREQUENCY  
LOW NONLINEARITY: ±0.01% max  
BIPOLAR OPERATION: VO = ±10V  
0.3"-WIDE 24-PIN HERMETIC DIP, ISO120  
SYNCHRONIZATION CAPABILITY  
ANALYTICAL MEASUREMENTS  
BIOMEDICAL MEASUREMENTS  
DATA ACQUISITION  
TEST EQUIPMENT  
WIDE TEMP RANGE: –55°C to +125°C  
(ISO120)  
DESCRIPTION  
The ISO120 and ISO121 are precision isolation ampli-  
fiers incorporating a novel duty cycle modulation-  
demodulation technique. The signal is transmitted  
digitally across a 2pF differential capacitive barrier.  
With digital modulation the barrier characteristics do  
not affect signal integrity, which results in excellent  
reliability and good high frequency transient immu-  
nity across the barrier. Both the amplifier and barrier  
capacitors are housed in a hermetic DIP. The ISO120  
and ISO121 differ only in package size and isolation  
voltage rating.  
Isolation Barrier  
C1H  
C1L  
C2H  
C2L  
Sense  
VIN  
VOUT  
Signal  
Com 1  
Signal  
Com 2  
Ext Osc  
+VS1  
–VS2  
These amplifiers are easy to use. No external compo-  
nents are required for 60kHz bandwidth. With the  
addition of two external capacitors, precision specifi-  
cations of 0.01% max nonlinearity and 150µV/°C max  
VOS drift are guaranteed with 6kHz bandwidth. A  
power supply range of ±4.5V to ±18V and low quies-  
cent current make these amplifiers ideal for a wide  
range of applications.  
Gnd 1  
–VS1  
Gnd 2  
+VS2  
International Airport Industrial Park  
Mailing Address: PO Box 11400  
Cable: BBRCORP  
Tucson, AZ 85734  
Street Address: 6730 S. Tucson Blvd.  
Tucson, AZ 85706  
Tel: (520) 746-1111 Twx: 910-952-1111  
Telex: 066-6491  
FAX: (520) 889-1510  
Immediate Product Info: (800) 548-6132  
© 1988 Burr-Brown Corporation  
PDS-820D  
Printed in U.S.A. March, 1992  
SBOS158  
SPECIFICATIONS  
ELECTRICAL  
At TA = +25°C: VS1 = VS2 = ±15V: and RL = 2k, unless otherwise noted.  
ISO120BG, ISO121BG  
ISO120G, ISO120SG(4), ISO121G  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNITS  
ISOLATION  
Voltage Rated Continuous ISO120: AC 60Hz  
TMIN to TMAX  
TMIN to TMAX  
TMIN to TMAX  
1500  
2121  
3500  
4950  
2500  
5600  
*
*
*
*
*
*
Vrms  
VDC  
Vrms  
VDC  
Vrms  
Vrms  
dB  
dB  
dB  
dB  
|| pF  
µArms  
DC  
ISO121: AC 60Hz  
DC  
TMIN to TMAX  
100% Test (AC 60Hz): ISO120  
1s; Partial Discharge 5pC  
1s; Partial Discharge 5pC  
1500Vrms  
ISO121  
Isolation Mode Rejection ISO 120: AC 60Hz  
115  
160  
115  
160  
1014 || 2  
0.18  
*
*
*
*
*
*
DC  
ISO121: AC60Hz  
DC  
3500Vrms  
Barrier Impedance  
Leakage Current  
VISO = 240Vrms, 60Hz  
0.5  
*
GAIN(4)  
VO = ±10V  
Nominal Gain  
Gain Error  
Gain vs Temperature  
Nonlinearity  
Nominal Gain  
Gain Error  
Gain vs Temperature  
Nonlinearity  
C1 = C2 = 1000pF  
1
±0.04  
±5  
±0.005  
1
±0.04  
±40  
±0.02  
1
V/V  
±0.1  
±20  
±0.01  
±0.05  
±10  
±0.01  
1
±0.05  
±40  
±0.04  
±0.25  
±40  
±0.05  
%FSR  
ppm/°C  
%FSR  
V/V  
%FSR  
ppm/°C  
%FSR  
C1 = C2 = 0  
±0.25  
±0.1  
±0.25  
±0.1  
INPUT OFFSET VOLTAGE(4)  
Initial Offset  
vs Temperature  
Initial Offset  
C1 = C2 = 1000pF  
C1 = C2 = 0  
±5  
±100  
±25  
±25  
±150  
±100  
±10  
±150  
±40  
±50  
±400  
±100  
mV  
µV/°C  
mV  
vs Temperature  
Initial Offset  
±250  
±500  
µV/°C  
vs Supply  
±VS1 or ±VS2 = ±4.5V to ±18V  
±2  
±2  
mV/V  
Noise  
4
4
µV/Hz  
INPUT  
Voltage Range(1)  
Resistance  
±10  
±15  
200  
*
*
*
V
kΩ  
OUTPUT  
Voltage Range  
Current Drive  
Capacitive Load Drive  
Ripple Voltage(2)  
±10  
±5  
±12.5  
±15  
0.1  
*
*
*
*
*
*
V
mA  
µF  
10  
mVp-p  
FREQUENCY RESPONSE  
Small Signal Bandwith  
C1 = C2 = 0  
C1 = C2 = 1000pF  
60  
6
2
*
*
*
kHz  
kHz  
V/µs  
Slew Rate  
Settling Time  
0.1%  
0.01%  
VO = ±10V  
C2 = 100pF  
C1 = C2 = 1000pF  
50% Output Overload,  
C1 = C2 = 0  
50  
350  
150  
*
*
*
µs  
µs  
µs  
Overload Recovery Time(3)  
POWER SUPPLIES  
Rated Voltage  
Voltage Range  
Quiescent Current: VS1  
VS2  
15  
*
V
V
mA  
mA  
±4.5  
±18  
±5.5  
±6.5  
*
*
*
*
±4.0  
±5.0  
*
*
TEMPERATURE RANGE  
Specification: BG and G  
SG(4)  
Operating  
Storage  
–25  
–25  
–55  
–65  
85  
85  
125  
150  
–25  
–55  
–55  
–55  
85  
°C  
°C  
°C  
125  
125  
150  
°C  
θJA: ISO120  
40  
25  
40  
25  
°C/W  
°C/W  
ISO121  
*Specifications same as ISO120BG, ISO121BG.  
NOTE: (1) Input voltage range = ±10V for VS1, VS2 =±4.5VDC to ±18VDC. (2) Ripple frequency is at carrier frequency. (3) Overload recovery is approximately three times  
the settling time for other values of C2. (4) The SG-grade is specified –55°C to +125°C; performance of the SG in the –25°C to +85°C temperature range is the same  
as the BG-grade.  
ISO120/121  
2
ABSOLUTE MAXIMUM RATINGS  
CONNECTION DIAGRAM  
Supply Voltage (any supply) ............................................................... 18V  
VIN, Sense Voltage .......................................................................... ±100V  
External Oscillator Input .................................................................... ±25V  
Signal Common 1 to Ground 1 ........................................................... ±1V  
Signal Common 2 to Ground 2 ........................................................... ±1V  
Continuous Isolation Voltage: ISO120 ...................................... 1500Vrms  
ISO121....................................... 3500Vrms  
VISO, dv/dt ...................................................................................... 20kV/µs  
Junction Temperature ...................................................................... 150°C  
Storage Temperature..................................................... –65°C to +150°C  
Lead Temperature (soldering, 10s) ............................................... +300°C  
Output Short Duration ......................................... Continuous to Common  
(1)  
C1H 1/1  
24/40 Gnd 1  
23/39 VIN  
C1L  
+VS1  
–VS1  
2/2  
3/3  
4/4  
22/38 Ext Osc  
21/37 Com 1  
PACKAGE INFORMATION(1)  
Com 2 9/17  
VOUT 10/18  
16/24 –VS2  
15/23 +VS2  
14/22 C2L  
13/21 C2H  
PACKAGE DRAWING  
MODEL  
PACKAGE  
NUMBER  
ISO120G  
ISO120BG  
ISO120SG  
24-Pin DIP  
24-Pin DIP  
24-Pin DIP  
225  
225  
225  
Sense 11/19  
Gnd 2 12/20  
ISO121G  
ISO121BG  
40-Pin DIP  
40-Pin DIP  
206  
206  
NOTE: (1) First pin number is for ISO120.  
Second pin number is for ISO121.  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix D of Burr-Brown IC Data Book.  
ORDERING INFORMATION  
TEMPERATURE  
MODEL  
RANGE  
ISO120G  
ISO120BG  
ISO120SG  
ISO121G  
ISO121BG  
–25°C to 85°C  
–25°C to 85°C  
–55C to 125°C  
–25°C to 85°C  
–25°C to 85°C  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Electrostatic discharge can cause damage ranging from per-  
formancedegradationtocompletedevicefailure.Burr-Brown  
Corporationrecommendsthatallintegratedcircuitsbehandled  
and stored using appropriate ESD protection methods.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
3
ISO120/121  
TYPICAL PERFORMANCE CURVES  
TA = +25°C; VS1 = VS2 = ±15V; and RL = 2k, unless otherwise noted.  
ISOLATION MODE VOLTAGE  
vs FREQUENCY ISO120  
ISOLATION MODE VOLTAGE  
vs FREQUENCY ISO121  
Max DC Rating  
5k  
Max DC Rating  
2.1k  
1k  
Max AC  
Rating  
Max AC  
Rating  
1k  
Degraded  
Degraded  
Performance  
Performance  
100  
10  
100  
10  
Typical  
Performance  
Typical  
Performance  
100  
1k  
10k  
100k  
1M  
10M  
100M  
100  
100  
1
1k  
10k  
100k  
1M  
10M  
100M  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
BANDWIDTH vs C2  
PHASE SHIFT vs C2  
100nF  
10nF  
100  
10  
C2 = 1000pF  
C2 = 0  
1000pF  
1
0
0.1  
1k  
10k  
100  
1k  
10k  
100k  
–3dB Frequency (Hz)  
Frequency (Hz)  
ISOLATION LEAKAGE CURRENT  
vs FREQUENCY  
PSRR vs FREQUENCY  
100mA  
10mA  
1mA  
60  
54  
3500 Vrms  
1500 Vrms  
40  
+VS1, +VS2  
100µA  
10µA  
–VS1, –VS2  
20  
0
240 Vrms  
1µA  
0.1µA  
1
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
ISO120/121  
4
TYPICAL PERFORMANCE CURVES (CONT)  
TA = +25°C; VS1 = VS2 = ±15V; and RL = 2k, unless otherwise noted.  
IMR vs FREQUENCY  
160  
SIGNAL RESPONSE vs CARRIER FREQUENCY  
–20dB/dec (for comparison only)  
140  
120  
100  
80  
0
–20  
–40  
60  
40  
1
1k  
0
10  
100  
1k  
10k  
100k  
1M  
0
0
fC  
0
2fC  
0
3fC  
0
fIN (Hz)  
Frequency (Hz)  
f
OUT (Hz)  
fc/2  
fC/2  
fC/2  
SYNCHRONIZATION RANGE at 25°C  
±4Vp SINE WAVE INPUT TO EXT OSC  
NOISE vs SMALL SIGNAL BANDWIDTH  
12  
10  
8
10nF  
Typical  
Free Run  
Frequency  
C2 = C1*  
6
1000pF  
4
C2 = 2C1  
2
0
*C1 5000pF  
0
0.1f–3dB  
0.2f–3dB  
0.5f–3dB  
f–3dB  
10k  
100k  
1M  
C
2 C1  
Normalized Frequency  
Frequency (Hz)  
SINE RESPONSE  
(f = 20kHz, C2 = 0)  
SINE RESPONSE  
(f = 2kHz, C2 = 0)  
+10  
+10  
0
0
–10  
–10  
0
50  
100  
500  
1000  
Time (µs)  
Time (µs)  
FPO  
BLEED  
TO EDGE  
OF BOX  
5
ISO120/121  
TYPICAL PERFORMANCE CURVES (CONT)  
TA = +25°C; VS1 = VS2 = ±15V; and RL = 2k, unless otherwise noted.  
STEP RESPONSE  
STEP RESPONSE  
+10  
0
+10  
0
–10  
–10  
+10  
0
+10  
0
–10  
–10  
0
50  
100  
0
250  
500  
Time (µs)  
Time (µs)  
THEORY OF OPERATION  
The ISO120 and ISO121 isolation amplifiers comprise input  
and output sections galvanically isolated by matched 1pF  
capacitors built into the ceramic barrier. The input is duty-  
cycle modulated and transmitted digitally across the barrier.  
The output section receives the modulated signal, converts it  
back to an analog voltage and removes the ripple component  
inherent in the demodulation. The input and output sections  
are laser-trimmed for exceptional matching of circuitry com-  
mon to both input and output sections.  
SYNCHRONIZED MODE  
A unique feature of the ISO120 and ISO121 is the ability to  
synchronize the modulator to an external signal source. This  
capability is useful in eliminating trouble-some beat fre-  
quencies in multi-channel systems and in rejecting AC  
signals and their harmonics. To use this feature, external  
capacitors are connected at C1 and C2 (Figure 1) to change  
the free-running carrier frequency. An external signal is  
applied to the Ext Osc pin. This signal forces the current  
source to switch at the frequency of the external signal. If  
VIN is zero, and the external source has a 50% duty cycle,  
operation proceeds as described above, except that the switch-  
ing frequency is that of the external source. If the external  
signal has a duty cycle other than 50%, its average value is  
not zero. At start-up, the current source does not switch until  
the integrator establishes an output equal to the average DC  
value of the external signal. At this point, the external signal  
is able to trigger the current source, producing a triangular  
waveform, symmetrical about the new DC value, at the  
output of A1. For VIN = 0, this waveform has a 50% duty  
cycle. As VIN varies, the waveform retains its DC offset, but  
varies in duty cycle to maintain charge balance around A1.  
Operation of the demodulator is the same as outlined above.  
FREE-RUNNING MODE  
An input amplifier (A1, Figure1) integrates the difference  
between the input current (VIN/200k) and a switched  
±100µA current source. This current source is implemented  
by a switchable 200µA source and a fixed 100µA current  
sink. To understand the basic operation of the input section,  
assume that VIN = 0. The integrator will ramp in one  
direction until the comparator threshold is exceeded. The  
comparator and sense amp will force the current source to  
switch; the resultant signal is a triangular waveform with a  
50% duty cycle. If VIN changes, the duty cycle of the  
integrator will change to keep the average DC value at the  
output of A1 near zero volts. This action converts the input  
voltage to a duty-cycle modulated triangular waveform at  
the output of A1 near zero volts. This action converts the  
input voltage to a duty-cycle modulated triangular wave-  
form at the output of A1 with a frequency determined by the  
internal 150pF capacitor. The comparator generates a fast  
rise time square wave that is simultaneously fed back to keep  
A1 in charge balance and also across the barrier to a  
differential sense amplifier with high common-mode rejec-  
tion characteristics. The sense amplifier drives a switched  
current source surrounding A2. The output stage balances  
the duty-cycle modulated current against the feedback cur-  
rent through the 200kfeedback resistor, resulting in an  
average value at the Sense pin equal to VIN. The sample and  
hold amplifiers in the output feedback loop serve to remove  
undesired ripple voltages inherent in the demodulation process.  
Synchronizing to a Sine  
or Triangle Wave External Clock  
The ideal external clock signal for the ISO120/121 is a ±4V  
sine wave or ±4V, 50% duty-cycle triangle wave. The ext osc  
pin of the ISO120/121 can be driven directly with a ±3V to  
±5V sine or 25% to 75% duty-cycle triangle wave and the ISO  
amp's internal modulator/demodulator circuitry will synchro-  
nize to the signal.  
Synchronizing to signals below 400kHz requires the addition  
of two external capacitors to the ISO120/121. Connect one  
capacitor in parallel with the internal modulator capacitor and  
connect the other capacitor in parallel with the internal de-  
modulator capacitor as shown in Figure 1.  
ISO120/121  
6
(1)  
(1)  
C1  
C2  
Isolation Barrier  
C1H  
C1L  
C2L  
C2H  
200µA  
200µA  
1pF  
1pF  
1pF  
1pF  
X
X
Sense  
100µA  
Sense  
150pF  
A1  
150pF  
200kΩ  
30kΩ  
200kΩ  
Sense  
VOUT  
VIN  
100µA  
Signal  
Com 1  
Ext  
Signal  
Com 2  
A2  
16kΩ  
S/H  
G = 1 G = 6  
S/H  
Osc  
16kΩ  
50pF  
+VS1 Gnd 1 –VS1  
+VS2 Gnd 2 –VS2  
NOTE: (1) Optional. See text.  
FIGURE 1. Block Diagram.  
The value of the external modulator capacitor, C1, depends on  
the frequency of the external clock signal. Table I lists  
recommended values.  
Synchronizing to a 400kHz to 700kHz  
Square-Wave External Clock  
At frequencies above 400kHz, an internal clamp and filter  
provides signal conditioning so that a square-wave signal can  
be used to directly drive the ISO120/121. A square-wave  
external clock signal can be used to directly drive the ISO120/  
121 ext osc pin if: the signal is in the 400kHz to 700kHz  
frequency range with a 25% to 75% duty cycle, and ±3V to  
±20V level. Details of the internal clamp and filter circuitry  
are shown in Figure 1.  
C1, C2 ISO120/121  
EXTERNAL CLOCK  
FREQUENCY RANGE  
MODULATOR, DEMODULATOR  
EXTERNAL CAPACITOR  
400kHz to 700kHz  
200kHz to 400kHz  
100kHz to 200kHz  
50kHz to 100kHz  
20kHz to 50kHz  
10kHz to 20kHz  
5kHz to 10kHz  
none  
500pF  
1000pF  
2200pF  
4700pF  
0.01µF  
0.022µF  
Synchronizing to a 10% to 90%  
Duty-cycle External Clock  
TABLE I. Recommended ISO120/121 External Modulator/  
Demodulator Capacitor Values vs External Clock  
Frequency.  
With the addition of the signal conditioning circuit shown in  
Figure 2, any 10% to 90% duty-cycle square-wave signal can  
be used to drive the ISO120/121 ext osc pin. With the values  
shown, the circuit can be driven by a 4Vp-p TTL signal. For  
a higher or lower voltage input, increase or decrease the 1kΩ  
resistor, RX, proportionally. e.g. for a ±4V square wave  
(8Vp-p) RX should be increased to 2k.  
The value of the external demodulator capacitor, C2, depends  
on the value of the external modulator capacitor. To assure  
stability, C2 must be greater than 0.8 • C1. A larger value for  
C2 will decrease bandwidth and improve stability:  
The value of CX used in the Figure 2 circuit depends on the  
frequency of the external clock signal. Table II shows recom-  
mended capacitor values.  
1. 2  
f
3 dB  
200k150 pF + C  
(
)
2
Note: For external clock frequencies below 400kHz, external  
modulator/demodulator capacitors are required on the  
ISO120/121 as before.  
Where:  
f–3dB –3dB bandwidth of ISO amp with external C2 (Hz)  
C2 = External demodulator capacitor (f)  
For example, with C2 = 0.01µF, the f–3dB bandwidth of the  
ISO120/121 is approximately 600Hz.  
7
ISO120/121  
connected directly to VOUT or may be connected to a remote  
load to eliminate errors due to IR drops. Pins are provided  
for use of external integrator capacitors. The C1H and C2H  
pins are connected to the integrator summing junctions and  
are therefore particularly sensitive to external pickup. This  
sensitivity will most often appear as degraded IMR or PSR  
performance. AC or DC currents coupled into these pins  
results in VERROR = IERROR X 200kat the output. Guarding  
of these pins to their respective Signal Common, or C1L and  
C2L is strongly recommended. For similar reasons, long  
traces or physically large capacitors are not desirable. If  
wound-foil capacitors are used, the outside foil should be  
connected to C1L and C2L, respectively.  
10kΩ  
CX  
RX  
1µF  
Sq Wave In  
1kΩ  
OPA602  
Triangle Out  
to ISO120/121  
Ext Osc  
FIGURE 2. Square Wave to Triangle Wave Signal Condi-  
tioner for Driving ISO120/121 Ext Osc Pin.  
Optional Gain and Offset Adjustments  
EXTERNAL CLOCK  
Rated gain accuracy and offset performance can be achieved  
with no external adjustments, but the circuit of Figure 4a  
may be used to provide a gain trim of ±0.5% for values  
shown; greater range may be provided by increasing the size  
of R1 and R2. Every 2kincrease in R1 will give an  
additional 1% adjustment range, with R2 2R1. If safety or  
convenience dictates location of the adjustment potenti-  
ometer on the other side of the barrier from the position  
shown in Figure 4a, the positions of R1 and R2 may be  
reversed. Gains greater than one may be obtained by using  
the circuit of Figure 4b. Note that the effect of input offset  
errors will be multiplied at the output in proportion to the  
increase in gain. Also, the small-signal bandwidth will be  
decreased in inverse proportion to the increase in gain. In  
most instances, a precision gain block at the input of the  
isolation amplifier will provide better overall performance.  
FREQUENCY RANGE  
CX  
400kHz to 700kHz  
200kHz to 400kHz  
100kHz to 200kHz  
50kHz to 100kHz  
20kHz to 50kHz  
10kHz to 20kHz  
5kHz to 10kHz  
30pF  
180pF  
680pF  
1800pF  
3300pF  
0.01µF  
0.022µF  
TABLE II. Recommended CX Values vs Frequency for  
Figure 2 Circuit.  
BASIC OPERATION  
Signal and Power Connections  
Figure 3 shows proper power and signal connections. Each  
power supply pin should be bypassed with 1µF tantalum  
capacitor located as close to the amplifier as possible. All  
ground connections should be run independently to a com-  
mon point if possible. Signal Common on both input and  
output sections provide a high-impedance point for sensing  
signal ground in noisy applications. Signal Common must  
have a path to ground for bias current return and should be  
maintained within ±1V of Gnd. The output sense pin may be  
Figure 5 shows a method for trimming VOS of the ISO120  
and ISO121. This circuit may be applied to either Signal  
Com (input or output) as desired for safety or convenience.  
With the values shown, ±15V supplies and unity gain, the  
circuit will provide ±150mV adjustment range and 0.25mV  
(1)  
C1  
Guard  
Isolation Barrier  
(1)  
C2  
C1H  
C1L  
VIN  
Guard  
C2L  
Sense  
VOUT  
C2H  
RL  
–VS2  
+V  
S2  
+VS2  
Signal  
Com1  
+
+
Gnd 2  
Signal  
Com 2  
+1µF  
1µF  
–VS1  
Gnd1  
+VS1  
+
+VS1  
Ext(2)  
Osc  
+
+1µF  
+1µF  
NOTE: (1) Optional. See text. (2) Ground if not used.  
FIGURE 3. Power and Signal Connections.  
ISO120/121  
8
resolution with a typical trim potentiometer. The output will  
have some sensitivity to power supply variations. For a  
±100mV trim, power supply sensitivity is 8mV/V at the  
output.  
output are not significant under these circumstances unless  
the input signal contains significant components above  
250kHz.  
There are two ways to use these characteristics. One is to  
move the carrier frequency low enough that the troublesome  
signal components are attenuated to an acceptable level as  
shown in Signal Response vs Carrier Frequency. This in  
effect limits the bandwidth of the amplifier. The Synchroni-  
zation Range performance curve shows the relationship  
between carrier frequency and the value of C1. To maintain  
stability, C2 must also be connected and must be equal to or  
larger in value than C1. C2 may be further increased in value  
for additional attenuation of the undesired signal compo-  
nents and provides the additional benefit of reducing the  
residual carrier ripple at the output. See the Bandwidth vs C2  
performance curve.  
R2  
R1  
2kΩ  
1kΩ  
VIN  
VOUT  
Sense  
GND1  
FIGURE 4a. Gain Adjust.  
R1 || R2  
VIN  
When periodic noise from external sources such as system  
clocks and DC/DC converters are a problem, ISO120 and  
ISO121 can be used to reject this noise. The amplifier can be  
synchronized to an external frequency source, fEXT, placing  
the amplifier response curve at one of the frequency and  
amplitude nulls indicated in the Signal Response vs Carrier  
Frequency performance curve. For proper synchronization,  
choose C1 as shown in the Synchronization Range perfor-  
mance curve. Remember that C2 C1 is a necessary condi-  
tion for stability of the isolation amplifier. This curve shows  
the range of lock at the fundamental frequency for a 4V  
sinusoidal signal source. The applications section shows the  
ISO120 and ISO121 synchronized to isolation power sup-  
plies, while Figure 6 shows circuitry with opto-isolation  
suitable for driving the Ext Osc input from TTL levels.  
Sense  
VOUT  
GND1  
R1  
R2  
R1  
R1  
Gain = 1 +  
+
(R )  
200k  
2
FIGURE 4b. Gain Setting.  
+VS1 or +VS2  
Signal Com 1  
or  
1MΩ  
100kΩ  
Signal Com 2  
10kΩ  
–VS1 or –VS2  
+5V  
200Ω  
+15V  
2.5kΩ  
C2  
2
8
6
5
FIGURE 5. VOS Adjust.  
Ext Osc on  
ISO120 (pin 22)  
2.5kΩ  
10kΩ  
CARRIER FREQUENCY CONSIDERATIONS  
C1  
As previously discussed, the ISO120 and ISO121 amplifiers  
transmit the signal across the iso-barrier by a duty-cycle  
modulation technique. This system works like any linear  
amplifier for input signals having frequencies below one  
half the carrier frequency, fC. For signal frequencies above  
fC/2, the behavior becomes more complex. The Signal Re-  
sponse vs Carrier Frequency performance curve describes  
this behavior graphically. The upper curve illustrates the  
response for input signals varying from DC to fC/2. At input  
frequencies at or above fC/2, the device generates an output  
signal component that varies in both amplitude and fre-  
quency, as shown by the lower curve. The lower horizontal  
scale shows the periodic variation in the frequency of the  
output component. Note that at the carrier frequency and its  
harmonics, both the frequency and amplitude of the re-  
sponse go the zero. These characteristics can be exploited in  
certain applications. It should be noted that when C1 is zero,  
the carrier frequency is nominally 500kHz and the –3dB  
point of the amplifier is 60kHz. Spurious signals at the  
TTL  
3
fIN  
140E-6  
6N136  
C1  
=
– 350pF  
( )  
fIN  
C2 = 10 X C1, with a minimum 10nF  
FIGURE 6. Synchronization with Isolated Drive Circuit for  
Ext Osc Pin.  
ISOLATION MODE VOLTAGE  
Isolation mode voltage (IMV) is the voltage appearing be-  
tween isolated grounds Gnd 1 and Gnd 2. IMV can induce  
error at the output as indicated by the plots of IMV vs  
Frequency. It should be noted that if the IMV frequency  
exceeds fC/2, the output will display spurious outputs in a  
manner similar to that described above, and the amplifier  
response will be identical to that shown in the Signal Re-  
sponse vs Carrier Frequency performance curve. This occurs  
9
ISO120/121  
because IMV-induced errors behave like input-referred error  
signals. To predict the total IMR, divide the isolation voltage  
by the IMR shown in IMR vs Frequency performance curve  
and compute the amplifier response to this input-referred  
error signal from the data given in the Signal Response vs  
Carrier Frequency performance curve. Due to effects of very  
high-frequency signals, typical IMV performance can be  
achieved only when dV/dT of the isolation mode voltage  
falls below 1000V/µs. For convenience, this is plotted in the  
typical performance curves for the ISO120 and ISO121 as a  
function of voltage and frequency for sinusoidal voltages.  
When dV/dT exceeds 1000V/µs but falls below 20kV/µs,  
performance may be degraded. At rates of change above  
20kV/µs, the amplifier may be damaged, but the barrier  
retains its full integrity. Lowering the power supply voltages  
below ±15V may decrease the dV/dT to 500V/µs for typical  
performance, but the maximum dV/dT of 20kV/µs remains  
unchanged.  
effectively shorting itself out. This action redistributes elec-  
trical charge within the dielectric and is known as partial  
discharge. If, as is the case with AC, the applied voltage  
gradient across the device continues to rise, another partial  
discharge cycle begins. The importance of this phenomenon  
is that, if the discharge does not occur, the insulation system  
retains its integrity. If the discharge begins, and is allowed  
to continue, the action of the ions and electrons within the  
defect will eventually degrade any organic insulation system  
in which they occur. The measurement of partial discharge  
is still useful in rating the devices and providing quality  
control of the manufacturing process. Since the ISO120 and  
ISO121 do not use organic insulation, partial discharge is  
non-destructive.  
The inception voltage for these voids tends to be constant, so  
that the measurement of total charge being redistributed  
within the dielectric is a very good indicator of the size of  
the voids and their likelihood of becoming an incipient  
failure. The bulk inception voltage, on the other hand, varies  
with the insulation system, and the number of ionization  
defects and directly establishes the absolute maximum volt-  
age (transient) that can be applied across the test device  
before destructive partial discharge can begin. Measuring  
the bulk extinction voltage provides a lower, more conserva-  
tive voltage from which to derive a safe continuous rating.  
In production, measuring at a level somewhat below the  
expected inception voltage and then derating by a factor  
related to expectations about system transients is an  
accepted practice.  
Leakage current is determined solely by the impedance of  
the 2pF barrier capacitance and is plotted in the Isolation  
Leakage Current vs Frequency curve.  
ISOLATION VOLTAGE RATINGS  
Because a long-term test is impractical in a manufacturing  
situation, the generally accepted practice is to perform a  
production test at a higher voltage for some shorter time. The  
relationship between actual test voltage and the continuous  
derated maximum specification is an important one. Histori-  
cally, Burr-Brown has chosen a deliberately conservative  
one: VTEST = (2 X ACrms continuous rating) + 1000V for 10  
seconds, followed by a test at rated ACrms voltage for one  
minute. This choice was appropriate for conditions where  
system transients are not well defined.  
Partial Discharge Testing  
Not only does this test method provide far more qualitative  
information about stress-withstand levels than did previous  
stress tests, but it provides quantitative measurements from  
which quality assurance and control measures can be based.  
Tests similar to this test have been used by some manufac-  
turers, such as those of high-voltage power distribution  
equipment, for some time, but they employed a simple  
measurement of RF noise to detect ionization. This method  
was not quantitative with regard to energy of the discharge,  
and was not sensitive enough for small components such as  
isolation amplifiers. Now, however, manufacturers of HV  
test equipment have developed means to quantify partial  
discharge. VDE, the national standards group in Germany  
and an acknowledged leader in high-voltage test standards,  
has developed a standard test method to apply this powerful  
technique. Use of partial discharge testing is an improved  
method for measuring the integrity of an isolation barrier.  
Recent improvements in high-voltage stress testing have  
produced a more meaningful test for determining maximum  
permissible voltage ratings, and Burr-Brown has chosen to  
apply this new technology in the manufacture and testing of  
the ISO120 and ISO121.  
Partial Discharge  
When an insulation defect such as a void occurs within an  
insulation system, the defect will display localized corona or  
ionization during exposure to high-voltage stress. This ion-  
ization requires a higher applied voltage to start the dis-  
charge and lower voltage to maintain it or extinguish it once  
started. The higher start voltage is known as the inception  
voltage, while the extinction voltage is that level of voltage  
stress at which the discharge ceases. Just as the total insula-  
tion system has an inception voltage, so do the individual  
voids. A voltage will build up across a void until its incep-  
tion voltage is reached, at which point the void will ionize,  
To accommodate poorly-defined transients, the part under  
test is exposed to voltage that is 1.6 times the continuous-  
rated voltage and must display 5pC partial discharge level  
in a 100% production test.  
ISO120/121  
10  
APPLICATIONS  
The ISO120 and ISO121 isolation amplifiers are used in  
2. Accurate isolation of signals from severe ground noise  
three categories of applications:  
and,  
3. Fault protection from high voltages in analog measure-  
ments.  
1. Accurate isolation of signals from high voltage ground  
potentials,  
Figures 7 through 12 show a variety of Application Circuits.  
APPLICATION CIRCUITS  
20µH  
+
'E  
+15V  
0.3µF  
8
PWS740-2  
4
6
1
10µF  
TO  
6
1
3
6
0.3µF  
0.3µF  
+VIN  
PWS740-1  
5
2
PWS740-3  
0.3µF  
4
3
4
TO  
3
5
20kΩ  
To other  
channels  
+15V  
20pF  
1.0µF  
IL = 0-20mA  
L 600Ω  
–VS1  
1.0µF  
R
4
3
1.0µF  
–15V  
22  
1.0µF  
23  
0-5V  
16  
15  
12  
10  
11  
VN2222  
ISO120  
1/4W  
250Ω  
0.1%  
9
+15V  
20kΩ  
System Uses:  
24  
1 - Oscillator/Driver  
8 - Transformers  
8 - Bridges  
21  
8 - ISO120s  
6.2V  
400mW  
8 - Transistors VN2222  
8 - Zener Diodes, 6.2V, 400mW, 20%  
Not all components shown.  
–15V  
FIGURE 7. Eight-channel Isolated 0-20mA Loop Driver.  
11  
ISO120/121  
3θ Y-Connected Power Transformer  
+VS2  
–VS1  
+VS1  
+VS1  
1
–VS2  
120Vrms  
100A  
3
4 15 16  
200kΩ  
8
C1  
2
1
+
2
11  
10  
10  
7
9
23  
ISO  
120  
VOUT  
0.005 Power Resistor  
0.001µF  
INA110  
13  
14  
21  
24  
6
200kΩ  
22  
–VSI  
C2  
9
12  
C1 = 1000pF  
C2 = 1000pF  
Differential input accurately senses power resistor voltage.  
Two resistors protect INA110 from open power resistor.  
High frequency spike reject filter has fCO = 400Hz.  
FIGURE 8. Isolated Powerline Monitor.  
5MΩ  
5.00V  
0V  
Calibration Signal  
1mV  
1kΩ  
+VS1  
C1  
Calibration  
Left Arm  
1/2W  
300kΩ  
+VS1  
12  
C2  
50kΩ  
1
0.0082(1)  
15  
4
2
21  
24  
22  
On  
+
39  
37  
40  
38  
13  
19  
18  
20  
500pF  
7
NE2H(2)  
ISO  
121  
11  
–VS1  
+VS1  
5
INA102  
17  
10  
6
200pF  
23  
Calibration  
14  
8
1/2W  
300kΩ  
4
9
+VS2  
–VS2  
0.0082  
50kΩ  
3
–VS1  
+VS1  
–VS1  
500pF  
NE2H  
On  
–VS1  
Right Arm  
Right Leg  
+VS1  
+VS1  
2
3
1/2W  
300kΩ  
32  
7
180kΩ  
20kΩ  
6
Gain = 1000  
OPA121  
29 PWS  
726A  
4
–VS1  
NE2H  
20pF  
1
4
14  
16  
–VS1  
1
20µH  
0.3  
NOTE: (1) All capacitor values in µF unless otherwise  
noted. Diodes are IN4148. (2) NE2H: Neon bulb, max  
striking voltage 95VAC  
.
+VS2  
FIGURE 9. Right-Leg Driven ECG Amplifier (with defibrillator protection and calibration).  
ISO120/121  
12  
+V  
15  
10kΩ  
10kΩ  
3
5kΩ  
23  
e1  
2
V =  
e1 =12V  
e2 =12V  
11  
9, 12  
10  
ISO  
120  
21  
22  
4
24  
16  
–V  
Charge/Discharge Control  
Control  
Section  
+V –V  
e49 =12V  
e50 =12V  
+V  
7
4
3
5kΩ  
23  
21  
15  
25kΩ  
25kΩ  
11  
10  
ISO  
120  
10kΩ  
5
6
2
9, 12  
22  
24  
4
16  
–V  
10kΩ  
INA105  
25kΩ  
25kΩ  
e50  
3
V =  
2
1
FIGURE 10. Battery Monitor for a 600V Battery Power System.  
11  
3
5
6
4
10  
8
7
1mA  
1mA  
+VS = 15V on PWS740  
RS  
XTR101  
150Ω  
0.01µF  
7
RL  
250Ω  
3
2
3
5
RTD  
(PT100)  
6
23  
21  
250Ω  
INA105  
11  
9
R1  
100Ω  
VOUT  
10  
ISO  
120  
1
R2  
4
2.5kΩ  
22  
4
24  
2mA  
Sync  
Gnd  
–VS = –15V  
NOTE: Some ISO120 connections left out for clarity.  
on PWS740  
FIGURE 11. Isolated 4-20mA Instrument Loop. (RTD shown).  
13  
ISO120/121  
23  
23  
11  
9
11  
9
10  
10  
ISO  
120  
ISO  
120  
VIN1  
VIN2  
VOUT1  
VOUT2  
21  
22  
21  
22  
12  
12  
16  
16  
15  
15  
V–  
V+  
V–  
V+  
4
4
Ext Osc  
Ext Osc  
24  
24  
3
3
–VS1  
–VS2  
+VS1  
+VS2  
0.3µF  
0.3µF  
20pF  
20pF  
1
4
1
4
Gnd1  
Gnd2  
20kΩ  
20kΩ  
PWS740-3  
PWS740-3  
3
6
3
3
6
3
1
2
5
1
2
5
V+  
PWS740-2  
PWS740-2  
6
4
6
4
8
4
6
Up to 6  
more  
channels  
PWS740-1  
20µH  
10µF  
3
5
0.3µF  
0.3µF  
FIGURE 12. Synchronized-Multichannel Isolation System.  
ISO120/121  
14  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Oct-2021  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
ISO120BG  
ISO120G  
NRND  
NRND  
NRND  
ACTIVE  
CDIP SB  
CDIP SB  
CDIP SB  
CDIP SB  
JVA  
JVA  
JVA  
JVD  
16  
16  
16  
16  
9
9
9
9
RoHS & Green  
RoHS & Green  
RoHS & Green  
RoHS & Green  
Call TI  
Call TI  
AU  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
ISO120BG  
ISO120G  
ISO120SG  
ISO121BG  
ISO120SG  
ISO121BG  
Call TI  
-55 to 125  
-55 to 125  
ISO121G  
ACTIVE  
CDIP SB  
JVD  
16  
9
RoHS & Green  
Call TI  
N / A for Pkg Type  
ISO121G  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Oct-2021  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
TUBE  
*All dimensions are nominal  
Device  
Package Name Package Type  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
ISO120BG  
ISO120G  
ISO120SG  
ISO121BG  
ISO121G  
JVA  
JVA  
JVA  
JVD  
JVD  
CDIP SB  
CDIP SB  
CDIP SB  
CDIP SB  
CDIP SB  
16  
16  
16  
16  
16  
9
9
9
9
9
506.98  
506.98  
506.98  
508  
15.24  
15.24  
15.24  
22.05  
22.05  
12290  
12290  
12290  
13080  
13080  
NA  
NA  
NA  
NA  
NA  
508  
Pack Materials-Page 1  
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
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