LM1084IT-ADJ/NOPB [TI]
LM1084 5A Low Dropout Positive Regulators; LM1084 5A低压降稳压器正
| 型号： | LM1084IT-ADJ/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM1084 5A Low Dropout Positive Regulators |
| 文件： | 总22页 (文件大小：2095K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM1084
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SNVS037F –SEPTEMBER 1999–REVISED MARCH 2013
LM1084 5A Low Dropout Positive Regulators
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1
FEATURES
DESCRIPTION
The LM1084 is a series of low dropout voltage
positive regulators with a maximum dropout of 1.5V
at 5A of load current. It has the same pin-out as TI's
industry standard LM317.
2
•
Available in 3.3V, 5.0V, 12V and Adjustable
Versions
•
•
•
•
•
Current Limiting and Thermal Protection
Output Current 5A
The LM1084 is available in an adjustable version,
which can set the output voltage with only two
external resistors. It is also available in three fixed
voltages: 3.3V, 5.0V and 12.0V. The fixed versions
intergrate the adjust resistors.
Industrial Temperature Range −40°C to 125°C
Line Regulation 0.015% (typical)
Load Regulation 0.1% (typical)
APPLICATIONS
The LM1084 circuit includes
bandgap reference, current limiting and thermal
shutdown.
a zener trimmed
•
•
•
Post Regulator for Switching DC/DC Conveter
High Efficiency Linear Regulators
Battery Charger
Connection Diagram
Figure 1. TO-220 Top View
Figure 2. DDPAK/TO-263 Top View
Figure 3. Basic Functional Diagram, Adjustable
Version
Figure 4. Application Circuit
1.2V to 15V Adjustable Regulator
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM1084
SNVS037F –SEPTEMBER 1999–REVISED MARCH 2013
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Simplified Schematic
Figure 5.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Maximum Input to Output Voltage Differential
LM1084-ADJ
LM1084-12
29V
18V
LM1084-3.3
27V
LM1084-5.0
25V
(3)
Power Dissipation
Internally Limited
150°C
Junction Temperature (TJ)(4)
Storage Temperature Range
Lead Temperature
-65°C to 150°C
260°C, to 10 sec
2000V
(5)
ESD Tolerance
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes.
(4) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to THERMAL
CONSIDERATIONS in the Application Note.
(5) For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
Operating Ratings(1)
Junction Temperature Range (TJ)
(2)
Control Section
Output Section
−40°C to 125°C
−40°C to 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to THERMAL
CONSIDERATIONS in the Application Note.
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Electrical Characteristics
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire
junction temperature range for operation.
Min
Typ
Max
Symbol
VREF
Parameter
Conditions
Units
(1)
(2)
(1)
Reference Voltage
LM1084-ADJ
1.238
1.225
1.250
1.250
1.262
1.270
V
V
IOUT = 10mA, VIN−VOUT = 3V
10mA ≤IOUT ≤ IFULL LOAD,1.5V ≤ (VIN−VOUT) ≤ 25V
(3)
VOUT
Output Voltage
LM1084-3.3
IOUT = 0mA, VIN = 8V
0 ≤ IOUT ≤IFULL LOAD, 4.8V≤ VIN ≤15V
(3)
3.270
3.235
3.300
3.300
3.330
3.365
V
V
LM1084-5.0
IOUT = 0mA, VIN = 8V
0 ≤ IOUT ≤ IFULL LOAD, 6.5V ≤ VIN ≤ 20V
4.950
4.900
5.000
5.000
5.050
5.100
V
V
LM1084-12
IOUT = 0mA, VIN = 15V
0 ≤ IOUT ≤ IFULL LOAD, 13.5V ≤ VIN ≤ 25V
11.880
11.760
12.000
12.000
12.120
12.240
V
V
ΔVOUT
Line Regulation
LM1084-ADJ
IOUT =10mA, 1.5V≤ (VIN-VOUT) ≤ 15V
0.015
0.035
0.2
0.2
%
%
(4)
LM1084-3.3
IOUT = 0mA, 4.8V ≤ VIN ≤ 15V
0.5
1.0
6
6
mV
mV
LM1084-5.0
IOUT = 0mA, 6.5V ≤ VIN ≤ 20V
0.5
1.0
10
10
mV
mV
LM1084-12
I OUT =0mA, 13.5V ≤ VIN ≤ 25V
1.0
2.0
25
25
mV
mV
ΔVOUT
Load Regulation
LM1084-ADJ
(VIN-V OUT) = 3V, 10mA ≤ IOUT ≤ IFULL LOAD
0.1
0.2
0.3
0.4
%
%
(4)
LM1084-3.3
VIN = 5V, 0 ≤ IOUT ≤ IFULL LOAD
3
7
15
20
mV
mV
LM1084-5.0
VIN = 8V, 0 ≤ IOUT ≤ IFULL LOAD
5
10
20
35
mV
mV
LM1084-12
VIN = 15V, 0 ≤ IOUT ≤ IFULL LOAD
12
24
36
72
mV
mV
(5)
Dropout Voltage
LM1084-ADJ, 3.3, 5, 12
ΔVREF, ΔVOUT = 1%, IOUT = 5A
1.3
1.5
V
ILIMIT
Current Limit
LM1084-ADJ
V
V
IN−VOUT = 5V
IN−VOUT = 25V
5.5
0.3
8.0
0.6
A
A
LM1084-3.3
VIN = 8V
5.5
5.5
5.5
8.0
8.0
8.0
5
A
LM1084-5.0
VIN = 10V
A
LM1084-12
VIN = 17V
A
Minimum Load
LM1084-ADJ
(6)
Current
VIN −VOUT = 25V
10.0
10.0
10.0
10.0
mA
mA
mA
mA
Quiescent Current
LM1084-3.3
VIN = 18V
5.0
5.0
5.0
LM1084-5.0
V
IN ≤ 20V
LM1084-12
IN ≤ 25V
V
(1) All limits are specified by testing or statistical analysis.
(2) Typical Values represent the most likely parametric norm.
(3) IFULLLOAD is defined in the current limit curves. The IFULLLOAD Curve defines the current limit as a function of input-to-output voltage.
Note that 30W power dissipation for the LM1084 is only achievable over a limited range of input-to-output voltage.
(4) Load and line regulation are measured at constant junction temperature, and are ensured up to the maximum power dissipation of 30W.
Power dissipation is determined by the input/output differential and the output current. ensured maximum power dissipation will not be
available over the full input/output range.
(5) Dropout voltage is specified over the full output current range of the device.
(6) The minimum output current required to maintain regulation.
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Electrical Characteristics (continued)
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire
junction temperature range for operation.
Min
Typ
Max
Symbol
Parameter
Conditions
Units
(1)
(2)
(1)
Thermal Regulation
Ripple Rejection
TA = 25°C, 30ms Pulse
0.003
0.015
%/W
fRIPPLE = 120Hz, = COUT = 25µF Tantalum,
IOUT = 5A
LM1084-ADJ, CADJ, = 25µF, (VIN−VO) = 3V
LM1084-3.3, VIN = 6.3V
LM1084-5.0, VIN = 8V
LM1084-12 VIN = 15V
LM1084
60
60
60
54
75
72
68
60
55
0.2
dB
dB
dB
dB
µA
µA
Adjust Pin Current
120
5
Adjust Pin Current
Change
10mA ≤ IOUT ≤ IFULL LOAD
1.5V ≤ VIN−VOUT ≤ 25V
,
Temperature Stability
Long Term Stability
RMS Output Noise
0.5
0.3
%
%
%
TA =125°C, 1000Hrs
1.0
10Hz ≤ f≤ 10kHz
0.003
(% of VOUT
)
Thermal Resistance
Junction-to-Case
3-Lead DDPAK/TO-263: Control Section/Output Section
3-Lead TO-220: Control Section/Output Section
0.65/2.7
0.65/2.7
°C/W
°C/W
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Typical Performance Characteristics
Dropout Voltage (VIN−VOUT
)
Short-Circuit Current
Figure 6.
Figure 7.
Load Regulation
LM1084-ADJ Ripple Rejection
Figure 8.
Figure 9.
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Typical Performance Characteristics (continued)
LM1084-ADJ Ripple Rejection vs Current
Temperature Stability
Figure 10.
Figure 11.
Adjust Pin Current
LM1084-ADJ Load Transient Response
Figure 12.
Figure 13.
LM1084-ADJ LineTransient Response
Maximum Power Dissipation
Figure 14.
Figure 15.
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APPLICATION NOTE
GENERAL
Figure 16 shows a basic functional diagram for the LM1084-Adj (excluding protection circuitry) . The topology is
basically that of the LM317 except for the pass transistor. Instead of a Darlingtion NPN with its two diode voltage
drop, the LM1084 uses a single NPN. This results in a lower dropout voltage. The structure of the pass transistor
is also known as a quasi LDO. The advantage a quasi LDO over a PNP LDO is its inherently lower quiescent
current. The LM1084 is ensured to provide a minimum dropout voltage 1.5V over temperature, at full load.
Figure 16. Basic Functional Diagram for the LM1084, excluding Protection circuitry
OUTPUT VOLTAGE
The LM1084 adjustable version develops at 1.25V reference voltage, (VREF), between the output and the adjust
terminal. As shown in figure 2, this voltage is applied across resistor R1 to generate a constant current I1. This
constant current then flows through R2. The resulting voltage drop across R2 adds to the reference voltage to
sets the desired output voltage.
The current IADJ from the adjustment terminal introduces an output error . But since it is small (120uA max), it
becomes negligible when R1 is in the 100Ω range.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
Figure 17. Basic Adjustable Regulator
STABILITY CONSIDERATION
Stability consideration primarily concern the phase response of the feedback loop. In order for stable operation,
the loop must maintain negative feedback. The LM1084 requires a certain amount series resistance with
capacitive loads. This series resistance introduces a zero within the loop to increase phase margin and thus
increase stability. The equivalent series resistance (ESR) of solid tantalum or aluminum electrolytic capacitors is
used to provide the appropriate zero (approximately 500 kHz).
The Aluminum electrolytic are less expensive than tantalums, but their ESR varies exponentially at cold
temperatures; therefore requiring close examination when choosing the desired transient response over
temperature. Tantalums are a convenient choice because their ESR varies less than 2:1 over temperature.
The recommended load/decoupling capacitance is a 10uF tantalum or a 50uF aluminum. These values will
assure stability for the majority of applications.
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The adjustable versions allows an additional capacitor to be used at the ADJ pin to increase ripple rejection. If
this is done the output capacitor should be increased to 22uF for tantalums or to 150uF for aluminum.
Capacitors other than tantalum or aluminum can be used at the adjust pin and the input pin. A 10uF capacitor is
a reasonable value at the input. See RIPPLE REJECTION section regarding the value for the adjust pin
capacitor.
It is desirable to have large output capacitance for applications that entail large changes in load current
(microprocessors for example). The higher the capacitance, the larger the available charge per demand. It is also
desirable to provide low ESR to reduce the change in output voltage:
ΔV = ΔI x ESR
It is common practice to use several tantalum and ceramic capacitors in parallel to reduce this change in the
output voltage by reducing the overall ESR.
Output capacitance can be increased indefinitely to improve transient response and stability.
RIPPLE REJECTION
Ripple rejection is a function of the open loop gain within the feed-back loop (refer to Figure 16 and Figure 17).
The LM1084 exhibits 75dB of ripple rejection (typ.). When adjusted for voltages higher than VREF, the ripple
rejection decreases as function of adjustment gain: (1+R1/R2) or VO/VREF. Therefore a 5V adjustment decreases
ripple rejection by a factor of four (−12dB); Output ripple increases as adjustment voltage increases.
However, the adjustable version allows this degradation of ripple rejection to be compensated. The adjust
terminal can be bypassed to ground with a capacitor (CADJ). The impedance of the CADJ should be equal to or
less than R1 at the desired ripple frequency. This bypass capacitor prevents ripple from being amplified as the
output voltage is increased.
1/(2π*fRIPPLE*CADJ) ≤ R1
LOAD REGULATION
The LM1084 regulates the voltage that appears between its output and ground pins, or between its output and
adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the
best load regulation, a few precautions are needed.
Figure 18 shows a typical application using a fixed output regulator. Rt1 and Rt2 are the line resistances. VLOAD
is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation
seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied
directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side.
Figure 18. Typical Application using Fixed Output Regulator
When the adjustable regulator is used (Figure 19), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with
0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL.
If R1 (=125Ω) is connected near the load the effective line resistance will be 0.05Ω (1 + R2/R1) or in this case, it
is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to
provide remote ground sensing and improve load regulation.
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Figure 19. Best Load Regulation using Adjustable Output Regulator
PROTECTION DIODES
Under normal operation, the LM1084 regulator does not need any protection diode. With the adjustable device,
the internal resistance between the adjustment and output terminals limits the current. No diode is needed to
divert the current around the regulator even with a capacitor on the adjustment terminal. The adjust pin can take
a transient signal of ±25V with respect to the output voltage without damaging the device.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and rate of decrease of VIN. In the LM1084 regulator, the internal diode between the output and
input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor
(≥1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an
external diode is recommended between the output and input pins to protect the regulator, shown in Figure 20.
Figure 20. Regulator with Protection Diode
OVERLOAD RECOVERY
Overload recovery refers to regulator's ability to recover from a short circuited output. A key factor in the recovery
process is the current limiting used to protect the output from drawing too much power. The current limiting circuit
reduces the output current as the input to output differential increases. Refer to short circuit curve in the Typical
Performance Characteristics section.
During normal start-up, the input to output differential is small since the output follows the input. But, if the output
is shorted, then the recovery involves a large input to output differential. Sometimes during this condition the
current limiting circuit is slow in recovering. If the limited current is too low to develop a voltage at the output, the
voltage will stabilize at a lower level. Under these conditions it may be necessary to recycle the power of the
regulator in order to get the smaller differential voltage and thus adequate start up conditions. Refer to Typical
Performance Characteristics section for the short circuit current vs. input differential voltage.
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THERMAL CONSIDERATIONS
ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how
well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and
ambient (θJA). Thermal resistance has units of temperature per power (C/W). The higher the thermal resistance,
the hotter the IC.
The LM1084 specifies the thermal resistance for each package as junction to case (θJC). In order to get the total
resistance to ambient (θJA), two other thermal resistance must be added, one for case to heat-sink (θCH) and one
for heatsink to ambient (θHA). The junction temperature can be predicted as follows:
TJ = TA + PD (θJC + θCH + θHA) = TA + PD θJA
TJ is junction temperature, TA is ambient temperature, and PD is the power consumption of the device. Device
power consumption is calculated as follows:
IIN = IL + IG
PD = (VIN−VOUT) IL + VINIG
Figure 21 shows the voltages and currents which are present in the circuit.
Figure 21. Power Dissipation Diagram
Once the devices power is determined, the maximum allowable (θJA (max)) is calculated as:
θJA (max) = TR(max)/PD = TJ(max) − TA(max)/PD
The LM1084 has different temperature specifications for two different sections of the IC: the control section and
the output section. The Electrical Characteristics table shows the junction to case thermal resistances for each of
these sections, while the maximum junction temperatures (TJ(max)) for each section is listed in the Absolute
Maximum Ratings section of the datasheet. TJ(max) is 125°C for the control section, while TJ(max) is 150°C for the
output section.
θJA (max) should be calculated separately for each section as follows:
θJA (max, CONTROL SECTION) = (125°C - TA(max))/PD
θJA (max, OUTPUT SECTION) = (150°C - TA(max))/PD
The required heat sink is determined by calculating its required thermal resistance (θHA (max)).
θHA (max) = θJA (max) − (θJC + θCH
)
(θHA (max)) should also be calculated twice as follows:
(θHA (max)) = θJA (max, CONTROL SECTION) - (θJC (CONTROL SECTION) + θCH
)
(θHA (max)) = θJA(max, OUTPUT SECTION) - (θJC (OUTPUT SECTION) + θCH
)
If thermal compound is used, θCH can be estimated at 0.2 C/W. If the case is soldered to the heat sink, then a
θCH can be estimated as 0 C/W.
After, θHA
is calculated for each section, choose the lower of the two θHA
values to determine the
(max)
(max)
appropriate heat sink.
If PC board copper is going to be used as a heat sink, then Figure 22 can be used to determine the appropriate
area (size) of copper foil required.
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Figure 22. Heat sink thermal Resistance vs Area
Typical Applications
Figure 23. 5V to 3.3V, 5A Regulator
Figure 24. Adjustable @ 5V
Figure 25. 1.2V to 15V Adjustable Regulator
Figure 26. 5V Regulator with Shutdown
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Figure 27. Battery Charger
Figure 28. Adjustable Fixed Regulator
Figure 29. Regulator with Reference
Figure 30. High Current Lamp Driver Protection
Figure 31. Battery Backup Regulated Supply
Figure 32. Ripple Rejection Enhancement
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Figure 33. Automatic Light control
Figure 34. Generating Negative Supply voltage
Figure 35. Remote Sensing
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REVISION HISTORY
Changes from Revision F (March 2013) to Revision G
Page
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM1084IS-3.3/NOPB
LM1084IS-5.0/NOPB
LM1084IS-ADJ
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
DDPAK/
TO-263
KTT
3
3
3
3
3
3
3
3
3
3
45
Pb-Free (RoHS
Exempt)
CU SN
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-3-245C-168 HR
Level-3-245C-168 HR
Call TI
LM1084
IS-3.3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KTT
KTT
KTT
KTT
KTT
NDE
NDE
NDE
45
45
Pb-Free (RoHS
Exempt)
LM1084
IS-5.0
DDPAK/
TO-263
TBD
LM1084
IS-ADJ
LM1084IS-ADJ/NOPB
LM1084ISX-3.3/NOPB
LM1084ISX-5.0/NOPB
LM1084ISX-ADJ/NOPB
LM1084IT-3.3/NOPB
LM1084IT-5.0/NOPB
LM1084IT-ADJ/NOPB
DDPAK/
TO-263
45
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM1084
IS-ADJ
DDPAK/
TO-263
500
500
500
45
Pb-Free (RoHS
Exempt)
LM1084
IS-3.3
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
LM1084
IS-5.0
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
LM1084
IS-ADJ
TO-220
TO-220
TO-220
Green (RoHS
& no Sb/Br)
LM1084
IT-3.3
45
Green (RoHS
& no Sb/Br)
LM1084
IT-5.0
45
Green (RoHS
& no Sb/Br)
LM1084
IT-ADJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM1084ISX-3.3/NOPB DDPAK/
TO-263
KTT
KTT
KTT
3
3
3
500
500
500
330.0
330.0
330.0
24.4
24.4
24.4
10.75 14.85
10.75 14.85
10.75 14.85
5.0
5.0
5.0
16.0
16.0
16.0
24.0
24.0
24.0
Q2
Q2
Q2
LM1084ISX-5.0/NOPB DDPAK/
TO-263
LM1084ISX-ADJ/NOPB DDPAK/
TO-263
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM1084ISX-3.3/NOPB
LM1084ISX-5.0/NOPB
LM1084ISX-ADJ/NOPB
DDPAK/TO-263
DDPAK/TO-263
DDPAK/TO-263
KTT
KTT
KTT
3
3
3
500
500
500
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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