LM1117T-1.8/NOPB [TI]
IC,VOLT REGULATOR,FIXED,+1.8V,BIPOLAR,SIP,3PIN,PLASTIC;型号: | LM1117T-1.8/NOPB |
厂家: | TEXAS INSTRUMENTS |
描述: | IC,VOLT REGULATOR,FIXED,+1.8V,BIPOLAR,SIP,3PIN,PLASTIC |
文件: | 总22页 (文件大小:566K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
National Semiconductor is now part of
Texas Instruments.
Search http://www.ti.com/ for the latest technical
information and details on our current products and services.
June 2004
LM1117/LM1117I
800mA Low-Dropout Linear Regulator
General Description
Features
n Available in 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable
Versions
The LM1117 is a series of low dropout voltage regulators
with a dropout of 1.2V at 800mA of load current. It has the
same pin-out as National Semiconductor’s industry standard
LM317.
n Space Saving SOT-223 and LLP Packages
n Current Limiting and Thermal Protection
The LM1117 is available in an adjustable version, which can
set the output voltage from 1.25V to 13.8V with only two
external resistors. In addition, it is also available in five fixed
voltages, 1.8V, 2.5V, 2.85V, 3.3V, and 5V.
n Output Current
n Line Regulation
n Load Regulation
n Temperature Range
— LM1117
800mA
0.2% (Max)
0.4% (Max)
The LM1117 offers current limiting and thermal shutdown. Its
circuit includes a zener trimmed bandgap reference to as-
sure output voltage accuracy to within 1%.
0˚C to 125˚C
−40˚C to 125˚C
— LM1117I
The LM1117 series is available in LLP, TO-263, SOT-223,
TO-220, and TO-252 D-PAK packages. A minimum of 10µF
tantalum capacitor is required at the output to improve the
transient response and stability.
Applications
n 2.85V Model for SCSI-2 Active Termination
n Post Regulator for Switching DC/DC Converter
n High Efficiency Linear Regulators
n Battery Charger
n Battery Powered Instrumentation
Typical Application
Active Terminator for SCSI-2 Bus
10091905
Fixed Output Regulator
10091928
© 2004 National Semiconductor Corporation
DS100919
www.national.com
Ordering Information
Package
Temperature
Range
Part Number
Packaging Marking
Transport Media
NSC
Drawing
MP04A
3-lead
0˚C to +125˚C
LM1117MPX-ADJ
LM1117MPX-1.8
LM1117MPX-2.5
LM1117MPX-2.85
LM1117MPX-3.3
LM1117MPX-5.0
LM1117IMPX-ADJ
LM1117IMPX-3.3
LM1117IMPX-5.0
LM1117T-ADJ
N03A
N12A
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Rails
SOT-223
N13A
N04A
N05A
N06A
−40˚C to +125˚C
0˚C to +125˚C
N03B
N05B
N06B
3-lead TO-220
3-lead TO-252
LM1117T-ADJ
LM1117T-1.8
LM1117T-2.5
LM1117T-2.85
LM1117T-3.3
LM1117T-5.0
LM1117DT-ADJ
LM1117DT-1.8
LM1117DT-2.5
LM1117DT-2.85
LM1117DT-3.3
LM1117DT-5.0
LM1117IDT-ADJ
LM1117IDT-3.3
LM1117IDT-5.0
1117ADJ
T03B
LM1117T-1.8
Rails
LM1117T-2.5
Rails
LM1117T-2.85
Rails
LM1117T-3.3
Rails
LM1117T-5.0
Rails
0˚C to +125˚C
LM1117DTX-ADJ
LM1117DTX-1.8
LM1117DTX-2.5
LM1117DTX-2.85
LM1117DTX-3.3
LM1117DTX-5.0
LM1117IDTX-ADJ
LM1117IDTX-3.3
LM1117IDTX-5.0
LM1117LDX-ADJ
LM1117LDX-1.8
LM1117LDX-2.5
LM1117LDX-2.85
LM1117LDX-3.3
LM1117LDX-5.0
LM1117ILDX-ADJ
LM1117ILDX-3.3
LM1117ILDX-5.0
LM1117SX-ADJ
LM1117SX-2.85
LM1117SX-3.3
LM1117SX-5.0
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
TD03B
−40˚C to +125˚C
0˚C to +125˚C
8-lead LLP
LDC08A
1117-18
1117-25
1117-28
1117-33
1117-50
−40˚C to 125˚C
0˚C to +125˚C
1117IAD
1117I33
1117I50
TO-263
LM1117SADJ
LM1117S2.85
LM1117S3.3
LM1117S5.0
TS3B
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2
Block Diagram
10091901
Connection Diagrams
TO-263
SOT-223
10091944
Top View
10091904
Top View
TO-220
10091945
Side View
LLP
10091902
Top View
TO-252
10091946
When using the LLP package
Pins 2, 3 & 4 must be connected together and
Pins 5, 6 & 7 must be connected together
Top View
10091938
Top View
3
www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
TO-220 (T) Package
SOT-223 (IMP) Package
ESD Tolerance (Note 3)
260˚C, 10 sec
260˚C, 4 sec
2000V
Maximum Input Voltage (VIN to GND)
Power Dissipation (Note 2)
Junction Temperature (TJ)
(Note 2)
20V
Operating Ratings (Note 1)
Input Voltage (VIN to GND)
Internally Limited
15V
150˚C
Junction Temperature Range (TJ)(Note 2)
LM1117
LM1117I
0˚C to 125˚C
Storage Temperature Range
Lead Temperature
-65˚C to 150˚C
−40˚C to 125˚C
LM1117 Electrical Characteristics
Typicals and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in Boldface type apply over the entire junc-
tion temperature range for operation, 0˚C to 125˚C.
Min
(Note 5)
Typ
(Note 4)
Max
(Note 5)
Symbol
Parameter
Conditions
Units
VREF
Reference Voltage
LM1117-ADJ
IOUT = 10mA, VIN-VOUT = 2V, TJ = 25˚C
10mA ≤ IOUT ≤ 800mA, 1.4V ≤ VIN-VOUT
≤ 10V
1.238
1.250
1.250
1.262
V
V
1.225
1.270
VOUT
Output Voltage
LM1117-1.8
IOUT = 10mA, VIN = 3.8V, TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 3.2V ≤ VIN ≤ 10V
LM1117-2.5
1.782
1.800
1.800
1.818
V
V
1.746
1.854
IOUT = 10mA, VIN = 4.5V, TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 3.9V ≤ VIN ≤ 10V
LM1117-2.85
2.475
2.500
2.500
2.525
V
V
2.450
2.550
IOUT = 10mA, VIN = 4.85V, TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 4.25V ≤ VIN ≤ 10V
0 ≤ IOUT ≤ 500mA, VIN = 4.10V
LM1117-3.3
2.820
2.790
2.790
2.850
2.850
2.850
2.880
2.910
2.910
V
V
V
IOUT = 10mA, VIN = 5V TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 4.75V≤ VIN ≤ 10V
LM1117-5.0
3.267
3.300
3.300
3.333
V
V
3.235
3.365
IOUT = 10mA, VIN = 7V, TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V
LM1117-ADJ
4.950
5.000
5.000
5.050
V
V
4.900
5.100
∆VOUT
Line Regulation
(Note 6)
IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V
LM1117-1.8
0.035
1
0.2
6
%
mV
IOUT = 0mA, 3.2V ≤ VIN ≤ 10V
LM1117-2.5
1
6
mV
IOUT = 0mA, 3.9V ≤ VIN ≤ 10V
LM1117-2.85
IOUT = 0mA, 4.25V ≤ VIN ≤ 10V
LM1117-3.3
1
1
1
6
6
mV
mV
mV
IOUT = 0mA, 4.75V ≤ VIN ≤ 15V
LM1117-5.0
IOUT = 0mA, 6.5V ≤ VIN ≤ 15V
10
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4
LM1117 Electrical Characteristics (Continued)
Typicals and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in Boldface type apply over the entire junc-
tion temperature range for operation, 0˚C to 125˚C.
Min
(Note 5)
Typ
(Note 4)
Max
(Note 5)
Symbol
Parameter
Conditions
Units
∆VOUT
Load Regulation
(Note 6)
LM1117-ADJ
VIN-VOUT = 3V, 10 ≤ IOUT ≤ 800mA
LM1117-1.8
0.2
1
0.4
10
%
mV
VIN = 3.2V, 0 ≤ IOUT ≤ 800mA
LM1117-2.5
1
10
mV
VIN = 3.9V, 0 ≤ IOUT ≤ 800mA
LM1117-2.85
VIN = 4.25V, 0 ≤ IOUT ≤ 800mA
LM1117-3.3
1
1
10
10
mV
mV
VIN = 4.75V, 0 ≤ IOUT ≤ 800mA
LM1117-5.0
VIN = 6.5V, 0 ≤ IOUT ≤ 800mA
IOUT = 100mA
1
15
mV
V
V
IN-V OUT Dropout Voltage
(Note 7)
1.10
1.15
1.20
1200
1.20
1.25
1.30
1500
IOUT = 500mA
V
IOUT = 800mA
V
ILIMIT
Current Limit
VIN-VOUT = 5V, TJ = 25˚C
LM1117-ADJ
800
mA
Minimum Load
Current (Note 8)
Quiescent Current
VIN = 15V
1.7
5
5
mA
mA
LM1117-1.8
10
VIN ≤ 15V
LM1117-2.5
5
10
mA
VIN ≤ 15V
LM1117-2.85
VIN ≤ 10V
5
5
10
10
mA
mA
LM1117-3.3
VIN ≤ 15V
LM1117-5.0
VIN ≤ 15V
5
10
mA
%/W
dB
Thermal Regulation
Ripple Regulation
TA = 25˚C, 30ms Pulse
fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE
= 1VPP
0.01
75
0.1
60
Adjust Pin Current
Adjust Pin Current
Change
60
120
5
µA
10 ≤ IOUT≤ 800mA,
1.4V ≤ VIN-VOUT ≤ 10V
0.2
0.5
0.3
0.003
15.0
3.0
10
µA
%
Temperature Stability
Long Term Stability
RMS Output Noise
Thermal Resistance
Junction-to-Case
TA = 125˚C, 1000Hrs
%
(% of VOUT), 10Hz ≤ f ≤10kHz
3-Lead SOT-223
%
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
3-Lead TO-220
3-Lead TO-252
Thermal Resistance
Junction-to-Ambient
(No air flow)
3-Lead SOT-223 (No heat sink)
3-Lead TO-220 (No heat sink)
3-Lead TO-252 (Note 9) (No heat sink)
3-Lead TO-263
136
79
92
55
8-Lead LLP(Note 10)
40
5
www.national.com
LM1117I Electrical Characteristics
Typicals and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in Boldface type apply over the entire junc-
tion temperature range for operation, −40˚C to 125˚C.
Min
(Note 5)
Typ
(Note 4)
Max
(Note 5)
Symbol
Parameter
Conditions
Units
VREF
Reference Voltage
LM1117I-ADJ
IOUT = 10mA, VIN-VOUT = 2V, TJ = 25˚C
10mA ≤ IOUT ≤ 800mA, 1.4V ≤ VIN-VOUT
≤ 10V
1.238
1.250
1.250
1.262
V
V
1.200
1.290
VOUT
∆VOUT
∆VOUT
Output Voltage
LM1117I-3.3
IOUT = 10mA, VIN = 5V, TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 4.75V ≤ VIN ≤ 10V
LM1117I-5.0
3.267
3.300
3.300
3.333
V
V
3.168
3.432
IOUT = 10mA, VIN = 7V, TJ = 25˚C
0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V
LM1117I-ADJ
4.950
5.000
5.000
5.050
V
V
4.800
5.200
Line Regulation
(Note 6)
IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V
LM1117I-3.3
0.035
0.3
10
%
IOUT = 0mA, 4.75V ≤ VIN ≤ 15V
LM1117I-5.0
1
1
mV
mV
%
IOUT = 0mA, 6.5V ≤ VIN ≤ 15V
LM1117I-ADJ
15
Load Regulation
(Note 6)
VIN-VOUT = 3V, 10 ≤ IOUT ≤ 800mA
LM1117I-3.3
0.2
1
0.5
15
VIN = 4.75V, 0 ≤ IOUT ≤ 800mA
LM1117I-5.0
mV
VIN = 6.5V, 0 ≤ IOUT ≤ 800mA
IOUT = 100mA
1
20
mV
V
V
IN-V OUT Dropout Voltage
1.10
1.15
1.20
1200
1.30
1.35
1.40
1500
(Note 7)
IOUT = 500mA
V
IOUT = 800mA
V
ILIMIT
Current Limit
VIN-VOUT = 5V, TJ = 25˚C
LM1117I-ADJ
800
mA
Minimum Load
Current (Note 8)
Quiescent Current
VIN = 15V
1.7
5
5
mA
mA
LM1117I-3.3
VIN ≤ 15V
15
LM1117I-5.0
VIN ≤ 15V
5
15
mA
%/W
dB
Thermal Regulation
Ripple Regulation
TA = 25˚C, 30ms Pulse
fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE
= 1VPP
0.01
75
0.1
60
Adjust Pin Current
Adjust Pin Current
Change
60
120
10
µA
10 ≤ IOUT≤ 800mA,
1.4V ≤ VIN-VOUT ≤ 10V
0.2
0.5
µA
%
Temperature Stability
Long Term Stability
RMS Output Noise
Thermal Resistance
Junction-to-Case
TA = 125˚C, 1000Hrs
0.3
%
(% of VOUT), 10Hz ≤ f ≤10kHz
3-Lead SOT-223
0.003
15.0
10
%
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
3-Lead TO-252
Thermal Resistance
Junction-to-Ambient
No air flow)
3-Lead SOT-223 (No heat sink)
3-Lead TO-252 (No heat sink)(Note 9)
8-Lead LLP(Note 10)
136
92
40
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
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6
Note 2: The maximum power dissipation is a function of T
, θ , and T . The maximum allowable power dissipation at any ambient temperature is
JA A
J(max)
P
= (T
–T )/θ . All numbers apply for packages soldered directly into a PC board.
D
J(max) A JA
Note 3: For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
Note 4: Typical Values represent the most likely parametric norm.
Note 5: All limits are guaranteed by testing or statistical analysis.
Note 6: Load and line regulation are measured at constant junction room temperature.
Note 7: The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the
output voltage has dropped 100mV from the nominal value obtained at V = V
+1.5V.
IN
OUT
Note 8: The minimum output current required to maintain regulation.
2
Note 9: Minimum pad size of 0.038in
Note 10: Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22˚C. For information about improved
thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.
Typical Performance Characteristics
Dropout Voltage (VIN-V
)
Short-Circuit Current
OUT
10091922
10091923
Load Regulation
LM1117-ADJ Ripple Rejection
10091943
10091906
7
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Typical Performance Characteristics (Continued)
LM1117-ADJ Ripple Rejection vs. Current
Temperature Stability
10091925
10091907
Adjust Pin Current
LM1117-2.85 Load Transient Response
10091926
10091908
LM1117-5.0 Load Transient Response
LM1117-2.85 Line Transient Response
10091909
10091910
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8
Typical Performance Characteristics (Continued)
LM1117-5.0 Line Transient Response
10091911
Application Note
1.0 External Capacitors/Stability
1.1 Input Bypass Capacitor
An input capacitor is recommended. A 10µF tantalum on the
input is a suitable input bypassing for almost all applications.
1.2 Adjust Terminal Bypass Capacitor
The adjust terminal can be bypassed to ground with a by-
pass capacitor (CADJ) to improve ripple rejection. This by-
pass capacitor prevents ripple from being amplified as the
output voltage is increased. At any ripple frequency, the
impedance of the CADJ should be less than R1 to prevent the
ripple from being amplified:
<
R1
1/(2π*fRIPPLE*CADJ
)
10091917
The R1 is the resistor between the output and the adjust pin.
Its value is normally in the range of 100-200Ω. For example,
FIGURE 1. Basic Adjustable Regulator
3.0 Load Regulation
>
with R1 = 124Ω and fRIPPLE = 120Hz, the CADJ should be
11µF.
1.3 Output Capacitor
The LM1117 regulates the voltage that appears between its
output and ground pins, or between its output and adjust
pins. In some cases, line resistances can introduce errors to
the voltage across the load. To obtain the best load regula-
tion, a few precautions are needed.
The output capacitor is critical in maintaining regulator sta-
bility, and must meet the required conditions for both mini-
mum amount of capacitance and ESR (Equivalent Series
Resistance). The minimum output capacitance required by
the LM1117 is 10µF, if a tantalum capacitor is used. Any
increase of the output capacitance will merely improve the
loop stability and transient response. The ESR of the output
capacitor should range between 0.3Ω - 22Ω. In the case of
the adjustable regulator, when the CADJ is used, a larger
output capacitance (22µf tantalum) is required.
Figure 2, shows a typical application using a fixed output
regulator. The Rt1 and Rt2 are the line resistances. It is
obvious that the VLOAD is less than the VOUT by the sum of
the voltage drops along the line resistances. In this case, the
load regulation seen at the RLOAD would be degraded from
the data sheet specification. To improve this, the load should
be tied directly to the output terminal on the positive side and
directly tied to the ground terminal on the negative side.
2.0 Output Voltage
The LM1117 adjustable version develops a 1.25V reference
voltage, VREF, between the output and the adjust terminal.
As shown in Figure 1, this voltage is applied across resistor
R1 to generate a constant current I1. The current IADJ from
the adjust terminal could introduce error to the output. But
since it is very small (60µA) compared with the I1 and very
constant with line and load changes, the error can be ig-
nored. The constant current I1 then flows through the output
set resistor R2 and sets the output voltage to the desired
level.
For fixed voltage devices, R1 and R2 are integrated inside
the devices.
9
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With an extremely large output capacitor (≥1000 µF), and
with input instantaneously shorted to ground, the regulator
could be damaged.
Application Note (Continued)
In this case, an external diode is recommended between the
output and input pins to protect the regulator, as shown in
Figure 4.
10091918
FIGURE 2. Typical Application using Fixed Output
Regulator
When the adjustable regulator is used (Figure 3), the best
performance is obtained with the positive side of the resistor
R1 tied directly to the output terminal of the regulator rather
than near the load. This eliminates line drops from appearing
effectively in series with the reference and degrading regu-
lation. For example, a 5V regulator with 0.05Ω resistance
between the regulator and load will have a load regulation
due to line resistance of 0.05Ω x IL. If R1 (=125Ω) is con-
nected near the load, the effective line resistance will be
0.05Ω (1+R2/R1) or in this case, it is 4 times worse. In
addition, the ground side of the resistor R2 can be returned
near the ground of the load to provide remote ground sens-
ing and improve load regulation.
10091915
FIGURE 4. Regulator with Protection Diode
5.0 Heatsink Requirements
When an integrated circuit operates with an appreciable
current, its junction temperature is elevated. It is important to
quantify its thermal limits in order to achieve acceptable
performance and reliability. This limit is determined by sum-
ming the individual parts consisting of a series of tempera-
ture rises from the semiconductor junction to the operating
environment. A one-dimensional steady-state model of con-
duction heat transfer is demonstrated in Figure 5. The heat
generated at the device junction flows through the die to the
die attach pad, through the lead frame to the surrounding
case material, to the printed circuit board, and eventually to
the ambient environment. Below is a list of variables that
may affect the thermal resistance and in turn the need for a
heatsink.
RθJC (Component
Variables)
Rθ CA (Application
Variables)
Leadframe Size & Material Mounting Pad Size,
Material, & Location
10091919
No. of Conduction Pins
Placement of Mounting
Pad
FIGURE 3. Best Load Regulation using Adjustable
Output Regulator
Die Size
PCB Size & Material
Traces Length & Width
Adjacent Heat Sources
4.0 Protection Diodes
Die Attach Material
Molding Compound Size
and Material
Under normal operation, the LM1117 regulators do not need
any protection diode. With the adjustable device, the internal
resistance between the adjust and output terminals limits the
current. No diode is needed to divert the current around the
regulator even with capacitor on the adjust terminal. The
adjust pin can take a transient signal of 25V with respect to
the output voltage without damaging the device.
Volume of Air
Ambient Temperatue
Shape of Mounting Pad
When a output capacitor is connected to a regulator and the
input is shorted to ground, the output capacitor will discharge
into the output of the regulator. The discharge current de-
pends on the value of the capacitor, the output voltage of the
regulator, and rate of decrease of VIN. In the LM1117 regu-
lators, the internal diode between the output and input pins
can withstand microsecond surge currents of 10A to 20A.
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10
Application Note (Continued)
The next parameter which must be calculated is the maxi-
mum allowable temperature rise, TR(max):
TR(max) = TJ(max)-TA(max)
where TJ(max) is the maximum allowable junction tempera-
ture (125˚C), and TA(max) is the maximum ambient tem-
perature which will be encountered in the application.
Using the calculated values for TR(max) and PD, the maxi-
mum allowable value for the junction-to-ambient thermal
resistance (θJA) can be calculated:
θJA = TR(max)/PD
10091937
If the maximum allowable value for θJA is found to be
≥136˚C/W for SOT-223 package or ≥79˚C/W for TO-220
package or ≥92˚C/W for TO-252 package, no heatsink is
needed since the package alone will dissipate enough heat
to satisfy these requirements. If the calculated value for θJA
falls below these limits, a heatsink is required.
FIGURE 5. Cross-sectional view of Integrated Circuit
Mounted on a printed circuit board. Note that the case
temperature is measured at the point where the leads
contact with the mounting pad surface
As a design aid, Table 1 shows the value of the θJA of
SOT-223 and TO-252 for different heatsink area. The copper
patterns that we used to measure these θJAs are shown at
the end of the Application Notes Section. Figure 7 and Figure
8 reflects the same test results as what are in the Table 1
The LM1117 regulators have internal thermal shutdown to
protect the device from over-heating. Under all possible
operating conditions, the junction temperature of the LM1117
must be within the range of 0˚C to 125˚C. A heatsink may be
required depending on the maximum power dissipation and
maximum ambient temperature of the application. To deter-
mine if a heatsink is needed, the power dissipated by the
regulator, PD , must be calculated:
Figure 9 and Figure 10 shows the maximum allowable power
dissipation vs. ambient temperature for the SOT-223 and
TO-252 device. Figures Figure 11 and Figure 12 shows the
maximum allowable power dissipation vs. copper area (in2)
for the SOT-223 and TO-252 devices. Please see AN1028
for power enhancement techniques to be used with SOT-223
and TO-252 packages.
IIN = IL + IG
PD = (VIN-VOUT)I + VIN G
I
L
Figure 6 shows the voltages and currents which are present
in the circuit.
*Application Note AN-1187 discusses improved thermal per-
formance and power dissipation for the LLP.
10091916
FIGURE 6. Power Dissipation Diagram
TABLE 1. θJA Different Heatsink Area
Copper Area
Layout
Thermal Resistance
Top Side (in2)*
Bottom Side (in2)
(θJA,˚C/W) SOT-223
(θJA,˚C/W) TO-252
1
2
0.0123
0.066
0.3
0.53
0.76
1
0
0
136
123
84
103
87
60
54
52
47
84
70
63
57
57
89
72
3
0
4
0
75
5
0
69
6
0
66
7
0
0.2
0.4
0.6
0.8
1
115
98
8
0
9
0
89
10
11
12
13
0
82
0
79
0.066
0.175
0.066
0.175
125
93
11
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Application Note (Continued)
TABLE 1. θJA Different Heatsink Area (Continued)
Layout
14
Copper Area Thermal Resistance
0.284
0.392
0.5
0.284
0.392
0.5
83
75
70
61
55
53
15
16
*Tab of device attached to topside copper
www.national.com
12
Application Note (Continued)
10091936
FIGURE 10. Maximum Allowable Power Dissipation vs.
Ambient Temperature for TO-252
10091913
FIGURE 7. θJA vs. 1oz Copper Area for SOT-223
10091914
10091934
FIGURE 11. Maximum Allowable Power Dissipation vs.
1oz Copper Area for SOT-223
FIGURE 8. θJA vs. 2oz Copper Area for TO-252
10091912
10091935
FIGURE 9. Maximum Allowable Power Dissipation vs.
Ambient Temperature for SOT-223
FIGURE 12. Maximum Allowable Power Dissipation vs.
2oz Copper Area for TO-252
13
www.national.com
Application Note (Continued)
10091941
FIGURE 13. Top View of the Thermal Test Pattern in Actual Scale
www.national.com
14
Application Note (Continued)
10091942
FIGURE 14. Bottom View of the Thermal Test Pattern in Actual Scale
15
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Typical Application Circuits
10091927
10091930
5V Logic Regulator with Electronic Shutdown*
Adjusting Output of Fixed Regulators
10091931
Regulator with Reference
10091929
1.25V to 10V Adjustable Regulator with Improved
Ripple Rejection
www.national.com
16
Typical Application Circuits (Continued)
10091932
Battery Backed-Up Regulated Supply
10091933
Low Dropout Negative Supply
17
www.national.com
Physical Dimensions inches (millimeters)
unless otherwise noted
3-Lead SOT-223
NS Package Number MP04A
3-Lead TO-220
NS Package Number T03B
www.national.com
18
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
3-Lead TO-263
NS Package Number TS3B
19
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
3-Lead TO-252
NS Package Number TD03B
8-Lead LLP
NS Package Number LDC08A
www.national.com
20
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
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Support Center
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Fax: 81-3-5639-7507
Email: new.feedback@nsc.com
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www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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