LM136H-5.0/NOPB [TI]
5.0 V 基准二极管 | NDV | 3 | -55 to 125;
| 型号： | LM136H-5.0/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5.0 V 基准二极管 | NDV | 3 | -55 to 125 二极管 |
| 文件： | 总25页 (文件大小：1014K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM136-5.0, LM236-5.0, LM336-5.0
www.ti.com
SNVS750D –JUNE 1999–REVISED MARCH 2013
LM136-5.0, LM236-5.0, LM336-5.0 5.0V Reference Diode
Check for Samples: LM136-5.0, LM236-5.0, LM336-5.0
1
FEATURES
DESCRIPTION
The LM136-5.0/LM236-5.0/LM336-5.0 integrated
2
•
•
•
•
•
•
•
•
•
Adjustable 4V to 6V
circuits are precision 5.0V shunt regulator diodes.
These monolithic IC voltage references operate as a
low temperature coefficient 5.0V zener with 0.6Ω
dynamic impedance. A third terminal on the LM136-
5.0 allows the reference voltage and temperature
coefficient to be trimmed easily.
Low Temperature Coefficient
Wide Operating Current of 600 μA to 10 mA
0.6Ω Dynamic Impedance
± 1% Initial Tolerance Available
Specified Temperature Stability
Easily Trimmed for Minimum Temperature Drift
Fast Turn-on
The LM136-5.0 series is useful as a precision 5.0V
low voltage reference for digital voltmeters, power
supplies or op amp circuitry. The 5.0V makes it
convenient to obtain a stable reference from low
voltage supplies. Further, since the LM136-5.0
operates as a shunt regulator, it can be used as
either a positive or negative voltage reference.
Three Lead Transistor Package
The LM136-5.0 is rated for operation over −55°C to
+125°C while the LM236-5.0 is rated over a −25°C to
+85°C temperature range. The LM336-5.0 is rated for
operation over a 0°C to +70°C temperature range.
See the Connection Diagrams for available packages.
For applications requiring 2.5V see LM136-2.5.
Connection Diagrams
Figure 1. TO-92 Plastic Package
(Bottom View)
Figure 2. TO Metal Can Package
(Bottom View)
Figure 3. SOIC Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM136-5.0, LM236-5.0, LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013
www.ti.com
Typical Applications
Figure 4. 5.0V Reference
† Adjust to 5.00V
* Any silicon signal diode
Figure 5. 5.0V Reference with Minimum
Temperature Coefficient
* Does not affect temperature coefficient
Figure 6. Trimmed 4V to 6V Reference
with Temperature Coefficient
Independent of Breakdown Voltage
2
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
www.ti.com
SNVS750D –JUNE 1999–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)
ABSOLUTE MAXIMUM RATINGS
Reverse Current
15
10
mA
mA
°C
Forward Current
Storage Temperature
Operating Temperature Range
LM136-5.0
−60 to +150
(2)
−55 to +150
−25 to +85
0 to +70
°C
°C
°C
LM236-5.0
LM336-5.0
Soldering Information
TO-92 Package (10 sec.)
TO Package (10 sec.)
SOIC Package
260
300
°C
°C
Vapor Phase (60 sec.)
Infrared (15 sec.)
215
220
°C
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its specified operating conditions.
(2) For elevated temperature operation, Tj max see THERMAL CHARACTERISTICS
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
LM136
LM236
150°C
125°C
100°C
TO
LM336
Thermal Resistance
TO-92
SOIC-8
θja (Junction to Ambient)
180°C/W (0.4″ Leads)
170°C/W (0.125″ Leads)
N/A
440°C/W
165°C/W
θja (Junction to Case)
80°C/W
N/A
ELECTRICAL CHARACTERISTICS
LM136A-5.0/LM236A-5.0
LM136-5.0/LM236-5.0
LM336B-5.0
Parameter
Conditions
LM336-5.0
Typ
Units
Min
Typ
Max
Min
Max
Reverse Breakdown TA=25°C, IR=1 mA
Voltage
LM136-5.0/LM236-5.0/LM336-5.0
LM136A-5.0/LM236A-5.0, LM336B-5.0
Reverse Breakdown TA=25°C,
4.9
5.00
5.00
6
5.1
5.05
12
4.8
5.00
5.00
6
5.2
5.1
20
V
V
4.95
4.90
mV
Change
With Current
600 μA≤IR≤10 mA
Reverse Dynamic
Impedance
TA=25°C, IR=1 mA, f = 100 Hz
0.6
1.2
0.6
4
2
Ω
Temperature Stability VR Adjusted 5.00V
(2)
IR=1 mA, (Figure 15)
0°C≤TA≤70°C (LM336-5.0)
12
mV
(1) Unless otherwise specified, the LM136-5.0 is specified from −55°C≤TA≤+125°C, the LM236-5.0 from −25°C≤TA≤+85°C and the LM336-
5.0 from 0°C≤TA≤+70°C.
(2) Temperature stability for the LM336 and LM236 family is specified by design. Design limits are specified (but not 100% percent
production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality
levels. Stability is defined as the maximum charge in VREF from 25°C to TA(min) or TA(max).
Copyright © 1999–2013, Texas Instruments Incorporated
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3
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
(1)
LM136A-5.0/LM236A-5.0
LM136-5.0/LM236-5.0
LM336B-5.0
LM336-5.0
Typ
Parameter
Conditions
Units
Min
Typ
7
Max
18
Min
Max
−25°C≤TA≤+85°C (LM236-5.0)
−55°C≤TA≤+125°C (LM136-5.0)
mV
mV
20
36
Reverse Breakdown
Change
600 μA≤IR≤10 mA
6
17
6
24
mV
With Current
Adjustment Range
Circuit of Figure 14
IR = 1 mA
±1
±1
V
Reverse Dynamic
Impedance
0.8
1.6
0.8
2.5
Ω
Long Term Stability
TA=25°C±0.1°C, IR=1 mA, t = 1000 hrs
20
20
ppm
4
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
www.ti.com
SNVS750D –JUNE 1999–REVISED MARCH 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Reverse Voltage Change
Zener Noise Voltage
Figure 7.
Figure 8.
Dynamic Impedance
Response Time
Figure 9.
Figure 10.
Reverse Characteristics
Temperature Drift
Figure 11.
Figure 12.
Copyright © 1999–2013, Texas Instruments Incorporated
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Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Forward Characteristics
Figure 13.
6
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
www.ti.com
SNVS750D –JUNE 1999–REVISED MARCH 2013
APPLICATION HINTS
The LM136-5.0 series voltage references are much easier to use than ordinary zener diodes. Their low
impedance and wide operating current range simplify biasing in almost any circuit. Further, either the breakdown
voltage or the temperature coefficient can be adjusted to optimize circuit performance.
Figure 14 shows an LM136-5.0 with a 10k potentiometer for adjusting the reverse breakdown voltage. With the
addition of R1 the breakdown voltage can be adjusted without affecting the temperature coefficient of the device.
The adjustment range is usually sufficient to adjust for both the initial device tolerance and inaccuracies in buffer
circuitry.
If minimum temperature coefficient is desired, four diodes can be added in series with the adjustment
potentiometer as shown in Figure 15. When the device is adjusted to 5.00V the temperature coefficient is
minimized. Almost any silicon signal diode can be used for this purpose such as a 1N914, 1N4148 or a 1N457.
For proper temperature compensation the diodes should be in the same thermal environment as the LM136-5.0.
It is usually sufficient to mount the diodes near the LM136-5.0 on the printed circuit board. The absolute
resistance of the network is not critical and any value from 2k to 20k will work. Because of the wide adjustment
range, fixed resistors should be connected in series with the pot to make pot setting less critical.
Figure 14. LM136-5.0 with Pot for Adjustment of
Breakdown Voltage (Trim Range = ±1.0V Typical)
Figure 15. Temperature Coefficient Adjustment
(Trim Range = ±0.5V Typical)
Typical Applications
* Adjust for 6.25V across R1
Figure 16. Precision Power Regulator with Low Temperature Coefficient
Copyright © 1999–2013, Texas Instruments Incorporated
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7
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013
www.ti.com
Figure 17. 5V Crowbar
Figure 18. Adjustable Shunt Regulator
Figure 19. Linear Ohmmeter
Figure 20. Op Amp with Output Clamped
Figure 21. Bipolar Output Reference
Figure 22. 5.0V Square Wave Calibrator
8
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
www.ti.com
SNVS750D –JUNE 1999–REVISED MARCH 2013
Figure 23. 10V Buffered Reference
Figure 24. Low Noise Buffered Reference
Figure 25. Wide Input Range Reference
Schematic Diagram
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
LM136-5.0, LM236-5.0, LM336-5.0
SNVS750D –JUNE 1999–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0
PACKAGE OPTION ADDENDUM
www.ti.com
22-Nov-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM136-5.0-MW8
LM136AH-5.0
ACTIVE WAFERSALE
YS
0
3
1
RoHS & Green
Call TI
Level-1-NA-UNLIM
Call TI
-55 to 125
-40 to 125
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO
TO
TO
TO
TO
TO
TO
NDV
1000
Non-RoHS &
Non-Green
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
( LM136AH5.0, LM13
6AH5.0)
LM136AH-5.0/NOPB
LM136H-5.0
NDV
NDV
NDV
NDV
NDV
NDV
3
3
3
3
3
3
1000 RoHS & Green
Level-1-NA-UNLIM
Call TI
-40 to 125
-55 to 125
-55 to 125
-55 to 125
-25 to 85
-25 to 85
( LM136AH5.0, LM13
6AH5.0)
1000
Non-RoHS &
Non-Green
( LM136H5.0, LM136
H5.0)
LM136H-5.0/NOPB
LM236AH-5.0/NOPB
LM236H-5.0
1000 RoHS & Green
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
( LM136H5.0, LM136
H5.0)
1000 RoHS & Green
( LM236AH5.0, LM23
6AH5.0)
1000
Non-RoHS &
Non-Green
( LM236H5.0, LM236
H5.0)
LM236H-5.0/NOPB
1000 RoHS & Green
Level-1-NA-UNLIM
( LM236H5.0, LM236
H5.0)
LM336-5 MWC
ACTIVE WAFERSALE
YS
D
0
8
1
RoHS & Green
RoHS & Green
Call TI
SN
Level-1-NA-UNLIM
-40 to 85
0 to 70
LM336BM-5.0/NOPB
ACTIVE
ACTIVE
ACTIVE
NRND
SOIC
SOIC
TO-92
SOIC
SOIC
SOIC
TO-92
95
Level-1-260C-UNLIM
LM336
BM5.0
LM336BMX-5.0/NOPB
LM336BZ-5.0/NOPB
LM336M-5.0
D
LP
D
8
3
8
8
8
3
2500 RoHS & Green
1800 RoHS & Green
SN
Call TI
Call TI
SN
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM336
BM5.0
LM336
BZ5.0
95
95
Non-RoHS
& Green
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
LM336
M5.0
LM336M-5.0/NOPB
LM336MX-5.0/NOPB
LM336Z-5.0/NOPB
ACTIVE
ACTIVE
ACTIVE
D
RoHS & Green
LM336
M5.0
D
2500 RoHS & Green
1800 RoHS & Green
SN
LM336
M5.0
LP
Call TI
LM336
Z-5.0
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Nov-2021
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM336BMX-5.0/NOPB
LM336MX-5.0/NOPB
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.5
6.5
5.4
5.4
2.0
2.0
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM336BMX-5.0/NOPB
LM336MX-5.0/NOPB
SOIC
SOIC
D
D
8
8
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM336BM-5.0/NOPB
LM336M-5.0
D
D
D
D
SOIC
SOIC
SOIC
SOIC
8
8
8
8
95
95
95
95
495
495
495
495
8
8
8
8
4064
4064
4064
4064
3.05
3.05
3.05
3.05
LM336M-5.0
LM336M-5.0/NOPB
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
LP0003A
TO-92 - 5.34 mm max height
S
C
A
L
E
1
.
2
0
0
S
C
A
L
E
1
.
2
0
0
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54)
NOTE 3
SEATING
PLANE
2X
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
3X
0.55
0.38
2X
2.6 0.2
3X
0.35
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
STRAIGHT LEAD OPTION
2.67
2.03
3X
4.19
3.17
3
1
2
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A
TO-92 - 5.34 mm max height
TO-92
FULL R
TYP
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X ( 0.85) HOLE
2X
METAL
(1.5)
2X (1.5)
2X
SOLDER MASK
OPENING
2
3
1
(R0.05) TYP
2X (1.07)
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX
ALL AROUND
TYP
( 1.4)
2X ( 1.4)
METAL
3X ( 0.9) HOLE
METAL
2X
2
3
1
SOLDER MASK
OPENING
(R0.05) TYP
(2.6)
SOLDER MASK
OPENING
(5.2)
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A
TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP
0.5 MIN
16.5
15.5
11.0
8.5
9.75
8.50
19.0
17.5
3.7-4.3 TYP
2.9
2.4
6.75
5.95
TYP
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
PACKAGE OUTLINE
NDV0003H
TO-CAN - 2.67 mm max height
S
C
A
L
E
1
.
2
5
0
TO-46
4.95
4.55
0.76 MAX
2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
0.483
0.407
3X
5.32-5.56
2
3
1
45
(
2.54)
1.16
0.92
1.22
0.72
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
www.ti.com
EXAMPLE BOARD LAYOUT
NDV0003H
TO-CAN - 2.67 mm max height
TO-46
(2.54)
0.07 MAX
ALL AROUND
(
1.2)
METAL
3
3X ( 0.7) VIA
SOLDER MASK
OPENING
(1.27)
1
(R0.05) TYP
2X ( 1.2)
METAL
2
0.07 MAX
TYP
2X
SOLDER MASK
OPENING
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
4219876/A 01/2017
www.ti.com
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