LM26CIM5X-VHA [TI]

Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 3Cel, RECTANGULAR, SURFACE MOUNT, PLASTIC, SOT-23, 5 PIN;


型号：	LM26CIM5X-VHA
厂家：	TEXAS INSTRUMENTS
描述：	Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 3Cel, RECTANGULAR, SURFACE MOUNT, PLASTIC, SOT-23, 5 PIN 输出元件传感器换能器
文件：	总12页 (文件大小：295K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LM26

LM26 SOT-23, +/-3C Accurate, Factory Preset Thermostat

Literature Number: SNIS115Q

September 9, 2009

LM26

SOT-23, ±3°C Accurate, Factory Preset Thermostat

Fan Control

■

General Description

Industrial Process Control

The LM26 is a precision, single digital-output, low-power ther-

HVAC Systems

mostat comprised of an internal reference, DAC, temperature

sensor and comparator. Utilizing factory programming, it can

be manufactured with different trip points as well as different

digital output functionality. The trip point (T_OS) can be preset

at the factory to any temperature in the range of −55°C to

+110°C in 1°C increments. The LM26 has one digital output

(OS/OS/US/US), one digital input (HYST) and one analog

output (V_TEMP). The digital output stage can be preset as ei-

ther open-drain or push-pull. In addition, it can be factory

programmed to be active HIGH or LOW. The digital output

can be factory programmed to indicate an over temperature

shutdown event (OS or OS) or an under temperature shut-

down event (US or US). When preset as an overtemperature

shutdown (OS) it will go LOW to indicate that the die temper-

ature is over the internally preset T_OSand go HIGH when the

temperature goes below (T_OS–T_HYST). Similarly, when pre-

programmed as an undertemperature shutdown (US) it will

go HIGH to indicate that the temperature is below T_USand go

LOW when the temperature is above (T_US+T_HYST). The typical

hysteresis, T_HYST, can be set to 2°C or 10°C and is controlled

by the state of the HYST pin. A V_TEMPanalog output provides

a voltage that is proportional to temperature and has a

−10.82mV/°C output slope.

Remote Temperature Sensing

Electronic System Protection

Features

Internal comparator with pin programmable 2°C or 10°C

■

hysteresis

No external components required

■

Open Drain or push-pull digital output; supports CMOS

logic levels

Internal temperature sensor with V_TEMPoutput pin

■

V_TEMPoutput allows after-assembly system testing

Internal voltage reference and DAC for trip-point setting

Currently available in 5-pin SOT-23 plastic package

Excellent power supply noise rejection

UL Recognized Component

Key Specifications

■ꢀPower Supply Voltage

■ꢀPower Supply Current

2.7V to 5.5V

40µA (max)

20µA (typ)

Available parts are detailed in the ordering information. For

other part options, contact a National Semiconductor Distrib-

utor or Sales Representative for information on minimum

order qualification. The LM26 is currently available in a 5-lead

SOT-23 package.

■ꢀHysteresis Temperature

2°C or 10°C (typ)

Temperature Trip Point Accuracy

Temperature Range

−55°C to +110°C

+120°C

LM26CIM

Applications

±3°C (max)

±4°C (max)

Microprocessor Thermal Management

■

Appliances

Portable Battery Powered Systems

■

LM26CIM5-TPA Simplified Block Diagram and Connection Diagram

10132301

The LM26CIM5-TPA has a fixed trip point of 85°C.

For other trip point and output function availability,

please see ordering information or contact National Semiconductor.

101323

www.national.com

Ordering Information

For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteristics

Section. Contact National Semiconductor for other set points and output options.

Order Number

Bulk Rail

3000 Units in Tape &

Reel

NS Package

Number

Top Mark

Trip Point Setting

Output Function

LM26CIM5-BPB

LM26CIM5-DPB

LM26CIM5-HHD

LM26CIM5-NPA

LM26CIM5-PHA

LM26CIM5-RPA

LM26CIM5-SHA

LM26CIM5-SPA

LM26CIM5-TPA

LM26CIM5-VHA

LM26CIM5-VPA

LM26CIM5-XHA

LM26CIM5-XPA

LM26CIM5-YHA

LM26CIM5-YPA

LM26CIM5-ZHA

LM26CIM5X-BPB

LM26CIM5X-DPB

LM26CIM5X-HHD

LM26CIM5X-NPA

LM26CIM5X-PHA

LM26CIM5X-RPA

LM26CIM5X-SHA

LM26CIM5X-SPA

LM26CIM5X-TPA

LM26CIM5X-VHA

LM26CIM5X-VPA

LM26CIM5X-XHA

LM26CIM5X-XPA

LM26CIM5X-YHA

LM26CIM5X-YPA

LM26CIM5X-ZHA

TBPB

TDPB

THHD

TNPA

TPHA

TRPA

TSHA

TSPA

TTPA

TVHA

TVPA

TXHA

TXPA

TYHA

TYPA

TZHA

MA05B

−45°C

−25°C

0°C

Open Drain US

Push Pull US

45°C

50°C

65°C

70°C

75°C

85°C

90°C

95°C

100°C

105°C

110°C

115°C

120°C

Open Drain OS

Connection Diagram

10132302

Pin Descriptions

Number

Name

Function

Connection

Hysteresis control, digital input

GND for 10°C or V⁺for 2°C

System GND

HYST

Ground, connected to the back side of the die

through lead frame.

GND

Analog output voltage proportional to

temperature

V_TEMP

V⁺

Leave floating or connect to a high impedance node.

2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR

information see Section Titled NOISE CONSIDERATIONS.

Supply input

Overtemperature Shutdown open-drain active Controller interrupt, system or power supply shutdown; pull-up

low thermostat digital output

resistor ≥ 10kΩ

Overtemperature Shutdown push-pull active

Controller interrupt, system or power supply shutdown

high thermostat digital output

Undertemperature Shutdown open-drain active

low thermostat digital output

System or power supply shutdown; pull-up resistor ≥ 10kΩ

Undertemperature Shutdown push-pull active

System or power supply shutdown

high thermostat digital output

Note: pin 5 functionality and trip point setting are programmed during LM26 manufacture.

www.national.com

Storage Temperature

−65°C to + 150°C

Absolute Maximum Ratings (Note 1)

ESD Susceptibility (Note 4)

Human Body Model

Machine Model

Input Voltage

6.0V

2500V

250V

Input Current at any pin (Note 2)

Package Input Current (Note 2)

Package Dissipation at T_A= 25°C

ꢁ(Note 3)

5mA

20mA

Operating Ratings (Note 1)

Specified Temperature Range

LM26CIM

500mW

T_MIN≤ T_A≤ T_MAX

Soldering Information

SOT23 Package

−55°C ≤ T_A≤ +125°C

+2.7V to +5.5V

+5.5V

Positive Supply Voltage (V⁺)

Maximum V_OUT

Vapor Phase (60 seconds)

Infrared (15 seconds)

215°C

220°C

LM26 Electrical Characteristics

The following specifications apply for V⁺= 2.7V_DCto 5.5V_DC, and V_TEMPload current = 0µA unless otherwise specified. Boldface

limits apply for T_A= T_J= T_MINto T_MAX; all other limits T_A= T_J= 25°C unless otherwise specified.

Typical

LM26CIM

Limits

Units

Symbol

Parameter

Conditions

(Note 6)

(Limits)

(Note 7)

Temperature Sensor

Trip Point Accuracy (Includes V_REF, DAC,

Comparator Offset, and Temperature

Sensitivity errors)

±3

±4

°C (max)

-55°C ≤ T_A≤ +110°C

+120°C

HYST = GND

HYST = V⁺

°C

Trip Point Hysteresis

V_TEMPOutput Temperature Sensitivity

−10.82

mV/°C

V_TEMPTemperature Sensitivity Error to

Equation:

−30°C ≤ T_A≤ 120°C,

2.7V ≤ V⁺≤ 5.5V

±3

°C (max)

V_O= (−3.479×10⁻⁶×(T−30)²)

+ (−1.082×10⁻²×(T−30)) + 1.8015V

−55°C ≤ T_A≤ 120°C,

4.5V ≤ V⁺≤ 5.5V

T_A= 30°C

±3

±2.5

°C (max)

0.070

Source ≤ 1 μA

Sink ≤ 40 μA

V_TEMPLoad Regulation

0.7

mV (max)

+2.7V ≤ V⁺≤ +5.5V,

−30°C ≤ T_A≤ +120°C

V_TEMPLine Regulation

Supply Current

−0.2

mV/V

µA (max)

I_S

Digital Output and Input

Logical “1” Output Leakage Current

(Note 9)

I_OUT(“1”)

V⁺= +5.0V

0.001

µA (max)

V (max)

I_OUT= +1.2mA and

V_OUT(“0”)

V⁺≥2.7V; I_OUT= +3.2mA

and V⁺≥4.5V; (Note 8)

Logical “0” Output Voltage

0.4

I_SOURCE= 500µA, V⁺≥

0.8 × V⁺

V⁺− 1.5

V (min)

2.7V

V_OUT(“1”)

Logical “1” Push-Pull Output Voltage

I_SOURCE= 800µA, V

≥4.5V

HYST Input Logical ”1“ Threshold

Voltage

V_IH

V_IL

0.8 × V⁺

0.2 × V⁺

V (min)

V (max)

HYST Input Logical ”0“ Threshold

Voltage

www.national.com

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: When the input voltage (V_I) at any pin exceeds the power supply (V_I< GND or V_I> V⁺), the current at that pin should be limited to 5mA. The 20mA

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal

operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T_JMAX(maximum junction temperature), θ_JA(junction to

ambient thermal resistance) and T_A(ambient temperature). The maximum allowable power dissipation at any temperature is P_D= (T_JMAX–T_A) / θ_JAor the number

given in the Absolute Maximum Ratings, whichever is lower. For this device, T_JMAX= 150°C. For this device the typical thermal resistance (θ_JA) of the different

package types when board mounted follow:

Package Type

θ_JA

SOT23-5, MA05B

250°C/W

Note 4: The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 5: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices.

Note 6: Typicals are at T_J= T_A= 25°C and represent most likely parametric norm.

Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 8: Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would

increase by 1.28mW when I_OUT= 3.2mA and V_OUT= 0.4V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die

temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification.

Note 9: The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every

15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.

Part Number Template

The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of the output as

follows:

The place holders xy describe the set point temperature as shown in the following table.

x (10x)

y (1x)

Temperature (°C)

x (10x)

y (1x)

Temperature (°C)

−5

−4

−3

−2

−1

−0

The value of z describes the assignment/function of the output as shown in the following table:

Open-Drain/ Push-

Active-Low/High

OS/US

Value of z

Digital Output Function

Pull

Active-Low, Open-Drain, OS output

Active-Low, Open-Drain, US output

Active-High, Push-Pull, OS output

Active-High, Push-Pull, US output

For example:

•

the part number LM26CIM5-TPA has T_OS= 85°C, and programmed as an active-low open-drain overtemperature shutdown

output.

the part number LM26CIM5-FPD has T_US= −5°C, and programmed as an active-high, push-pull undertemperature shutdown

output.

Active-high open-drain and active-low push-pull options are available, please contact National Semiconductor for more information.

www.national.com

Functional Description

LM26 OPTIONS

10132312

10132313

LM26-_ _A

LM26-_ _B

10132314

10132315

LM26-_ _C

LM26-_ _D

FIGURE 1. Output Pin Options Block Diagrams

The LM26 can be factory programmed to have a trip point

anywhere in the range of −55°C to +110°C.

A. Observe that OS is high.

B. Drive V_TEMPto ground.

Applications Hints

C. Observe that OS is now low.

D. Release the V_TEMPpin.

E. Observe that OS is now high.

AFTER-ASSEMBLY PCB TESTING

The LM26's V_TEMPoutput allows after-assembly PCB testing

by following a simple test procedure. Simply measuring the

V_TEMPoutput voltage will verify that the LM26 has been as-

sembled properly and that its temperature sensing circuitry is

functional. The V_TEMPoutput has very weak drive capability

that can be overdriven by 1.5mA. Therefore, one can simply

force the V_TEMPvoltage to cause the digital output to change

state, thereby verifying that the comparator and output cir-

cuitry function after assembly. Here is a sample test proce-

dure that can be used to test the LM26CIM5-TPA which has

an 85°C trip point.

A. Observe that OS is high.

B. Drive V_TEMPvoltage down gradually.

C. When OS goes low, note the V_TEMPvoltage.

D. V_TEMPTrig = V_TEMPat OS trigger (HIGH->LOW)

E. Calculate Ttrig using Equation 2.

A. Gradually raise V_TEMPuntil OS goes HIGH. Note

V_TEMP

1. Turn on V⁺and measure V_TEMP. Then calculate the

temperature reading of the LM26 using the equation:

B. Calculate T_HYSTusing Equation 2.

V_TEMPLOADING

V_O= (−3.479×10⁻⁶×(T−30)²) + (−1.082×10⁻²×(T

The V_TEMPoutput has very weak drive capability (1 µA source,

40 µA sink). So care should be taken when attaching circuitry

to this pin. Capacitive loading may cause the V_TEMPoutput to

oscillate. Simply adding a resistor in series as shown in Figure

2 will prevent oscillations from occurring. To determine the

value of the resistor follow the guidelines given in Table 1. The

same value resistor will work for either placement of the re-

sistor. If an additional capacitive load is placed directly on the

LM26 output, rather than across C_LOAD, it should be at least

−30)) + 1.8015V

(1)

(2)

2. Verify that the temperature measured in step one is

within (±3°C + error of reference temperature sensor) of

the ambient/board temperature. The ambient/board

temperature (reference temperature) should be

measured using an extremely accurate calibrated

temperature sensor.

a factor of 10 smaller than C_LOAD

www.national.com

TABLE 1. Resistive compensation for capacitive loading

of V_TEMP

mented to a surface. The temperature that the LM26 is sens-

ing will be within about +0.06°C of the surface temperature to

which the LM26's leads are attached to.

C_LOAD

R (Ω)

This presumes that the ambient air temperature is almost the

same as the surface temperature; if the air temperature were

much higher or lower than the surface temperature, the actual

temperature measured would be at an intermediate temper-

ature between the surface temperature and the air tempera-

ture.

≤100pF

1nF

8200

3000

1000

430

10nF

100nF

≥1µF

To ensure good thermal conductivity, the backside of the

LM26 die is directly attached to the GND pin (pin 2). The tem-

peratures of the lands and traces to the other leads of the

LM26 will also affect the temperature that is being sensed.

Alternatively, the LM26 can be mounted inside a sealed-end

metal tube, and can then be dipped into a bath or screwed

into a threaded hole in a tank. As with any IC, the LM26 and

accompanying wiring and circuits must be kept insulated and

dry, to avoid leakage and corrosion. This is especially true if

the circuit may operate at cold temperatures where conden-

sation can occur. Printed-circuit coatings and varnishes such

as Humiseal and epoxy paints or dips are often used to ensure

that moisture cannot corrode the LM26 or its connections.

10132317

a) R in series with capacitor

The junction to ambient thermal resistance (θ_JA) is the pa-

rameter used to calculate the rise of a part's junction temper-

ature due to its power dissipation. For the LM26 the equation

used to calculate the rise in the die junction temperature is as

follows:

(3)

where T_Ais the ambient temperature, V⁺is the power supply

voltage, I_Qis the quiescent current, I_{L_TEMP}is the load current

on the V_TEMPoutput, V_DOis the voltage on the digital output,

and I_DOis the load current on the digital output. Since the

LM26's junction temperature is the actual temperature being

measured, care should be taken to minimize the load current

that the LM26 is required to drive.

10132318

b) R in series with signal path

The tables shown in Figure 3 summarize the thermal resis-

tance for different conditions and the rise in die temperature

of the LM26 without any loading on V_TEMPand a 10k pull-up

resistor on an open-drain digital output with a 5.5V power

supply.

FIGURE 2. Resistor placement for capacitive loading

compensation of V_TEMP

NOISE CONSIDERATIONS

SOT23-5

The LM26 has excellent power supply noise rejection. Listed

below is a variety of signals used to test the LM26 power sup-

ply rejection. False triggering of the output was not observed

when these signals where coupled into the V+ pin of the

LM26.

no heat sink

small heat sink

T_J−T_A

(°C)

T_J−T_A

(°C)

θ_JA

(°C/W)

250

θ_JA

(°C/W)

TBD

Still Air

0.11

TBD

•

square wave 400kHz, 1Vp-p

square wave 2kHz, 200mVp-p

sine wave 100Hz to 1MHz, 200mVp-p

Moving Air

TBD

FIGURE 3. Thermal resistance (θ_JA) and temperature rise

Testing was done while maintaining the temperature of the

LM26 one degree centigrade way from the trip point with the

output not activated.

due to self heating (T_J−T_A)

MOUNTING CONSIDERATIONS

The LM26 can be applied easily in the same way as other

integrated-circuit temperature sensors. It can be glued or ce-

www.national.com

Typical Applications

10132303

Note: The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM26 goes low, the fan will speed up.

FIGURE 4. Two Speed Fan Speed Control

10132320

FIGURE 5. Fan High Side Drive

10132321

FIGURE 6. Fan Low Side Drive

www.national.com

10132322

FIGURE 7. Audio Power Amplifier Thermal Protection

10132323

FIGURE 8. Simple Thermostat

www.national.com

Physical Dimensions inches (millimeters) unless otherwise noted

5-Lead Molded SOT-23 Plastic Package, JEDEC

Order Number LM26CIM5 or LM26CIM5X

NS Package Number MA05B

www.national.com

Notes

For more National Semiconductor product information and proven design tools, visit the following Web sites at:

www.national.com

Products

www.national.com/amplifiers

Design Support

www.national.com/webench

Amplifiers

WEBENCH® Tools

App Notes

Audio

www.national.com/audio

www.national.com/timing

www.national.com/adc

www.national.com/interface

www.national.com/lvds

www.national.com/power

www.national.com/appnotes

www.national.com/refdesigns

www.national.com/samples

www.national.com/evalboards

www.national.com/packaging

www.national.com/quality/green

www.national.com/contacts

www.national.com/quality

www.national.com/feedback

www.national.com/easy

Clock and Timing

Data Converters

Interface

Reference Designs

Samples

Eval Boards

LVDS

Packaging

Power Management

Green Compliance

Distributors

Switching Regulators www.national.com/switchers

LDOs

www.national.com/ldo

www.national.com/led

www.national.com/vref

www.national.com/powerwise

Quality and Reliability

Feedback/Support

Design Made Easy

Applications & Markets

Mil/Aero

LED Lighting

Voltage References

PowerWise® Solutions

www.national.com/solutions

www.national.com/milaero

www.national.com/solarmagic

www.national.com/training

Serial Digital Interface (SDI) www.national.com/sdi

Temperature Sensors

PLL/VCO

www.national.com/tempsensors SolarMagic™

www.national.com/wireless

PowerWise® Design

University

THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION

(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY

OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO

SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,

IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT.

TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT

NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL

PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR

APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND

APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE

NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.

EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO

LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE

AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR

PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL

COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and

whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected

to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform

can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.

National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other

brand or product names may be trademarks or registered trademarks of their respective holders.

For the most current product information visit us at www.national.com

National Semiconductor

Americas Technical

Support Center

National Semiconductor Europe

Technical Support Center

Email: europe.support@nsc.com

National Semiconductor Asia

Pacific Technical Support Center

Email: ap.support@nsc.com

National Semiconductor Japan

Technical Support Center

Email: jpn.feedback@nsc.com

Email: support@nsc.com

Tel: 1-800-272-9959

www.national.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

Audio

Applications

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

www.ti.com/industrial

www.ti.com/medical

www.ti.com/security

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

Medical

Security

Logic

Space, Avionics and Defense www.ti.com/space-avionics-defense

Transportation and Automotive www.ti.com/automotive

Power Mgmt

Microcontrollers

RFID

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

Video and Imaging

www.ti.com/video

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page

e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

LM26CIM5X-VHA [TI]

相关型号：

LM26CIM5X-VHA/NOPB

LM26CIM5X-VPA

LM26CIM5X-VPA

LM26CIM5X-VPA/NOPB

LM26CIM5X-XHA

LM26CIM5X-XHA

LM26CIM5X-XHA/NOPB

LM26CIM5X-XPA

LM26CIM5X-XPA

LM26CIM5X-XPA/NOPB

LM26CIM5X-YHA

LM26CIM5X-YHA/NOPB