LM26CIM5X-YHA

更新时间:2024-09-18 01:41:05
品牌:NSC
描述:Accurate, Factory Preset Thermostat

LM26CIM5X-YHA 概述

Accurate, Factory Preset Thermostat 准确,出厂预设温控器

LM26CIM5X-YHA 数据手册

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March 2005  
LM26  
SOT-23, 3˚C Accurate, Factory Preset Thermostat  
n Portable Battery Powered Systems  
n Fan Control  
The LM26 is a precision, single digital-output, low-power  
n Industrial Process Control  
General Description  
thermostat comprised of an internal reference, DAC, tem-  
perature sensor and comparator. Utilizing factory program-  
ming, it can be manufactured with different trip points as well  
as different digital output functionality. The trip point (TOS  
n HVAC Systems  
n Remote Temperature Sensing  
n Electronic System Protection  
)
can be preset at the factory to any temperature in the range  
of −55˚C to +110˚C in 1˚C increments. The LM26 has one  
digital output (OS/OS/US/US), one digital input (HYST) and  
one analog output (VTEMP). The digital output stage can be  
preset as either open-drain or push-pull. In addition, it can be  
factory programmed to be active HIGH or LOW. The digital  
output can be factory programmed to indicate an over tem-  
perature shutdown event (OS or OS) or an under tempera-  
ture shutdown event (US or US). When preset as an over-  
temperature shutdown (OS) it will go LOW to indicate that  
the die temperature is over the internally preset TOS and go  
HIGH when the temperature goes below (TOS–THYST). Simi-  
larly, when preprogrammed as an undertemperature shut-  
down (US) it will go HIGH to indicate that the temperature is  
below TUS and go LOW when the temperature is above  
(TUS+THYST). The typical hysteresis, THYST, can be set to  
2˚C or 10˚C and is controlled by the state of the HYST pin. A  
VTEMP analog output provides a voltage that is proportional  
to temperature and has a −10.82mV/˚C output slope.  
Features  
n Internal comparator with pin programmable 2˚C or 10˚C  
hysteresis  
n No external components required  
n Open Drain or push-pull digital output; supports CMOS  
logic levels  
n Internal temperature sensor with VTEMP output pin  
n VTEMP output allows after-assembly system testing  
n Internal voltage reference and DAC for trip-point setting  
n Currently available in 5-pin SOT-23 plastic package  
n Excellent power supply noise rejection  
Key Specifications  
j
Power Supply Voltage  
2.7V to 5.5V  
40µA(max)  
j
Power Supply Current  
20µA(typ)  
Available parts are detailed in the ordering information. For  
other part options, contact a National Semiconductor Dis-  
tributor or Sales Representative for information on minimum  
order qualification. The LM26 is currently available in a  
5-lead SOT-23 package.  
j
Hysteresis Temperature  
2˚C or 10˚C(typ)  
Temperature Trip Point Accuracy  
Temperature Range  
−55˚C to +110˚C  
+120˚C  
LM26CIM  
3˚C (max)  
4˚C (max)  
Applications  
n Microprocessor Thermal Management  
n Appliances  
LM26CIM5-TPA Simplified Block Diagram and Connection Diagram  
10132301  
The LM26CIM5-TPA has a fixed trip point of 85˚C.  
For other trip point and output function availability,  
please see ordering information or contact National Semiconductor.  
© 2005 National Semiconductor Corporation  
DS101323  
www.national.com  
Ordering Information  
For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteris-  
tics Section. Contact National Semiconductor for other set points and output options.  
Order Number  
Bulk Rail  
NS Package  
Number  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
MA05B  
3000 Units in Tape & Reel  
LM26CIM5X-NPA  
LM26CIM5X-PHA  
LM26CIM5X-RPA  
LM26CIM5X-SHA  
LM26CIM5X-SPA  
LM26CIM5X-TPA  
LM26CIM5X-VHA  
LM26CIM5X-VPA  
LM26CIM5X-XHA  
LM26CIM5X-XPA  
LM26CIM5X-YHA  
LM26CIM5X-YPA  
LM26CIM5X-ZHA  
Top Mark  
TNPA  
TPHA  
TRPA  
TSHA  
TSPA  
TTPA  
TVHA  
TVPA  
TXHA  
TXPA  
TYHA  
TYPA  
TZHA  
Trip Point Setting Output Function  
LM26CIM5-NPA  
LM26CIM5-PHA  
LM26CIM5-RPA  
LM26CIM5-SHA  
LM26CIM5-SPA  
LM26CIM5-TPA  
LM26CIM5-VHA  
LM26CIM5-VPA  
LM26CIM5-XHA  
LM26CIM5-XPA  
LM26CIM5-YHA  
LM26CIM5-YPA  
LM26CIM5-ZHA  
45˚C  
50˚C  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
Open Drain OS  
65˚C  
70˚C  
75˚C  
85˚C  
90˚C  
95˚C  
100˚C  
105˚C  
110˚C  
115˚C  
120˚C  
Connection Diagram  
10132302  
Pin Description  
Pin  
Pin  
Function  
Connection  
Number  
Name  
HYST  
GND  
1
2
Hysteresis control, digital input  
Ground, connected to the back side of  
the die through lead frame.  
Analog output voltage proportional to  
temperature  
GND for 10˚C or V+ for 2˚C  
System GND  
3
4
VTEMP  
V+  
Leave floating or connect to a high impedance  
node.  
Supply input  
2.7V to 5.5V with a 0.1µF bypass capacitor. For  
PSRR information see Section Titled NOISE  
CONSIDERATIONS.  
5
OS  
OS  
US  
US  
Overtemperature Shutdown open-drain  
active low thermostat digital output  
Overtemperature Shutdown push-pull  
active high thermostat digital output  
Undertemperature Shutdown open-drain  
active low thermostat digital output  
Undertemperature Shutdown push-pull  
active high thermostat digital output  
Controller interrupt, system or power supply  
shutdown; pull-up resistor 10kΩ  
Controller interrupt, system or power supply  
shutdown  
System or power supply shutdown; pull-up  
resistor 10kΩ  
System or power supply shutdown  
Note: pin 5 functionality and trip point setting are programmed during LM26 manufacture.  
www.national.com  
2
Absolute Maximum Ratings (Note 1)  
ESD Susceptibility (Note 4)  
Human Body Model  
Machine Model  
2500V  
250V  
Input Voltage  
6.0V  
Input Current at any pin (Note 2)  
Package Input Current(Note 2)  
Package Dissipation at TA = 25˚C  
(Note 3)  
5mA  
20mA  
Operating Ratings(Note 1)  
Specified Temperature Range  
500mW  
TMIN TA TMAX  
−55˚C TA +125˚C  
+2.7V to +5.5V  
+5.5V  
Soldering Information  
SOT23 Package  
LM26CIM  
Positive Supply Voltage (V+)  
Maximum VOUT  
Vapor Phase (60 seconds)  
Infrared (15 seconds)  
Storage Temperature  
215˚C  
220˚C  
−65˚C to + 150˚C  
LM26 Electrical Characteristics  
The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified. Bold-  
face limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25˚C unless otherwise specified.  
Typical  
LM26CIM  
Limits  
Units  
Symbol  
Parameter  
Conditions  
(Note 6)  
(Limits)  
(Note 7)  
Temperature Sensor  
Trip Point Accuracy (Includes  
REF, DAC, Comparator Offset,  
-55˚C TA +110˚C  
3
4
˚C (max)  
˚C (max)  
V
and Temperature Sensitivity  
errors)  
+120˚C  
Trip Point Hysteresis  
HYST = GND  
HYST = V+  
11  
2
˚C  
˚C  
VTEMP Output Temperature  
Sensitivity  
−10.82  
mV/˚C  
VTEMP Temperature Sensitivity  
Error to Equation:  
−30˚C TA 120˚C,  
2.7V V+ 5.5V  
−55˚C TA 120˚C,  
4.5V V+ 5.5V  
TA = 30˚C  
3
3
˚C (max)  
VO = (−3.479x10−6x(T−30)2)  
˚C (max)  
+
(−1.082x10−2x(T−30))  
+
1.8015V  
2.5  
0.7  
˚C (max)  
mV  
VTEMP Load Regulation  
−1µA IL 0  
0.070  
−0.2  
0 IL +40µA  
+2.7V V+ +5.5V,  
mV (max)  
mV/V  
VTEMP Line Regulation  
Supply Current  
−30˚C TA  
+120˚C  
IS  
16  
20  
µA (max)  
µA (max)  
40  
Digital Output and Input  
IOUT(“1”)  
Logical “1” Output Leakage  
V+ = +5.0V  
0.001  
1
µA (max)  
V (max)  
Current (Note 9)  
VOUT(“0”)  
Logical “0” Output Voltage  
IOUT = +1.2mA and  
V+2.7V;  
0.4  
IOUT = +3.2mA and  
V+4.5V; (Note 8)  
ISOURCE = 500µA,  
V+ 2.7V  
VOUT(“1”)  
Logical “1” Push-Pull Output  
Voltage  
0.8 x V+  
V+ − 1.5  
0.8 x V+  
0.2 x V+  
V (min)  
V (min)  
V (min)  
V (max)  
ISOURCE = 800µA,  
V+4.5V  
VIH  
VIL  
HYST Input Logical ”1“ Threshold  
Voltage  
HYST Input Logical ”0“ Threshold  
Voltage  
3
www.national.com  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed  
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test  
conditions.  
+
<
>
V ), the current at that pin should be limited to 5mA. The 20mA  
Note 2: When the input voltage (V ) at any pin exceeds the power supply (V  
GND or V  
I
I
I
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal  
operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.  
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
(maximum junction temperature), θ (junction to  
JA  
Jmax  
ambient thermal resistance) and T (ambient temperature). The maximum allowable power dissipation at any temperature is P = (T  
–T )/θ or the number  
A
D
Jmax  
A JA  
given in the Absolute Maximum Ratings, whichever is lower. For this device, T  
= 150˚C. For this device the typical thermal resistance (θ ) of the different  
Jmax  
JA  
package types when board mounted follow:  
Package Type  
θJA  
SOT23-5, MA05B  
250˚C/W  
Note 4: The human body model is a 100pF capacitor discharge through a 1.5kresistor into each pin. The machine model is a 200pF capacitor discharged directly  
into each pin.  
Note 5: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices.  
Note 6: Typicals are at T = T = 25˚C and represent most likely parametric norm.  
J
A
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would increase  
by 1.28mW when I  
=3.2mA and V  
=0.4V. With a thermal resistance of 250˚C/W, this power dissipation would cause an increase in the die temperature of  
OUT  
OUT  
about 0.32˚C due to self heating. Self heating is not included in the trip point accuracy specification.  
Note 9: The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15˚C  
increase in temperature. For example, the 1nA typical current at 25˚C would increase to 16nA at 85˚C.  
Part Number Template  
The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of the output as  
follows:  
The place holders xy describe the set point temperature as shown in the following table.  
x (10x)  
y (1x)  
Temperature (˚C)  
x (10x)  
y (1x)  
Temperature (˚C)  
A
B
C
D
E
F
H
J
-
-
−5  
−4  
−3  
−2  
−1  
−0  
0
N
P
R
S
T
V
X
Y
Z
N
P
R
S
T
V
-
4
5
-
6
-
7
-
8
-
9
H
J
K
L
10  
11  
12  
1
-
K
L
2
-
3
The value of z describes the assignment/function of the output as shown in the following table:  
Open-Drain/  
Active-Low/High  
Push-Pull  
OS/US  
Value of z  
Digital Output Function  
0
0
1
1
0
0
1
1
0
1
0
1
A
B
C
D
Active-Low, Open-Drain, OS output  
Active-Low, Open-Drain, US output  
Active-High, Push-Pull, OS output  
Active-High, Push-Pull, US output  
For example:  
the part number LM26CIM5-TPA has TOS = 85˚C, and programmed as an active-low open-drain overtemperature shutdown  
output.  
the part number LM26CIM5-FPD has TUS = −5˚C, and programmed as an active-high, push-pull undertemperature shutdown  
output.  
Active-high open-drain and active-low push-pull options are available, please contact National Semiconductor for more informa-  
tion.  
www.national.com  
4
Functional Description  
LM26 OPTIONS  
10132312  
10132313  
LM26-_ _A  
LM26-_ _B  
10132314  
10132315  
LM26-_ _C  
LM26-_ _D  
FIGURE 1. Output Pin Options Block Diagrams  
The LM26 can be factory programmed to have a trip point  
anywhere in the range of −55˚C to +110˚C.  
3.  
4.  
5.  
A. Observe that OS is high.  
B. Drive VTEMP to ground.  
Applications Hints  
C. Observe that OS is now low.  
D. Release the VTEMP pin.  
E. Observe that OS is now high.  
AFTER-ASSEMBLY PCB TESTING  
The LM26’s VTEMP output allows after-assembly PCB testing  
by following a simple test procedure. Simply measuring the  
VTEMP output voltage will verify that the LM26 has been  
assembled properly and that its temperature sensing cir-  
cuitry is functional. The VTEMP output has very weak drive  
capability that can be overdriven by 1.5mA. Therefore, one  
can simply force the VTEMP voltage to cause the digital  
output to change state, thereby verifying that the comparator  
and output circuitry function after assembly. Here is a  
sample test procedure that can be used to test the  
LM26CIM5-TPA which has an 85˚C trip point.  
A. Observe that OS is high.  
B. Drive VTEMP voltage down gradually.  
C. When OS goes low, note the VTEMP voltage.  
>
D. VTEMPTrig = VTEMP at OS trigger (HIGH- LOW)  
E. Calculate Ttrig using Equation (2).  
A. Gradually raise VTEMP until OS goes HIGH. Note  
VTEMP  
.
1. Turn on V+ and measure VTEMP. Then calculate the  
temperature reading of the LM26 using the equation:  
B. Calculate THYST using Equation (2).  
VO = (−3.479x10−6x(T−30)2) + (−1.082x10−2x(T−30)) +  
VTEMP LOADING  
1.8015V  
(1)  
The VTEMP output has very weak drive capability (40µA  
source, 1µA sink). So care should be taken when attaching  
circuitry to this pin. Capacitive loading may cause the VTEMP  
output to oscillate. Simply adding a resistor in series as  
shown in Figure 2 will prevent oscillations from occurring. To  
determine the value of the resistor follow the guidelines  
given in Table 1. The same value resistor will work for either  
placement of the resistor. If an additional capacitive load is  
placed directly on the LM26 output, rather than across  
CLOAD, it should be at least a factor of 10 smaller than  
or  
(2)  
2. Verify that the temperature measured in step one is  
within ( 3˚C + error of reference temperature sensor) of  
the ambient/board temperature. The ambient/board tem-  
perature (reference temperature) should be measured  
using an extremely accurate calibrated temperature sen-  
sor.  
CLOAD  
.
5
www.national.com  
This presumes that the ambient air temperature is almost the  
same as the surface temperature; if the air temperature were  
much higher or lower than the surface temperature, the  
actual temperature measured would be at an intermediate  
temperature between the surface temperature and the air  
temperature.  
Applications Hints (Continued)  
TABLE 1. Resistive compensation for capacitive  
loading of VTEMP  
CLOAD  
100pF  
1nF  
R ()  
0
To ensure good thermal conductivity, the backside of the  
LM26 die is directly attached to the GND pin (pin 2). The  
temperatures of the lands and traces to the other leads of the  
LM26 will also affect the temperature that is being sensed.  
8200  
3000  
1000  
430  
10nF  
100nF  
1µF  
Alternatively, the LM26 can be mounted inside a sealed-end  
metal tube, and can then be dipped into a bath or screwed  
into a threaded hole in a tank. As with any IC, the LM26 and  
accompanying wiring and circuits must be kept insulated and  
dry, to avoid leakage and corrosion. This is especially true if  
the circuit may operate at cold temperatures where conden-  
sation can occur. Printed-circuit coatings and varnishes such  
as Humiseal and epoxy paints or dips are often used to  
ensure that moisture cannot corrode the LM26 or its connec-  
tions.  
The junction to ambient thermal resistance (θJA) is the pa-  
rameter used to calculate the rise of a part’s junction tem-  
perature due to its power dissipation. For the LM26 the  
equation used to calculate the rise in the die junction tem-  
perature is as follows:  
10132317  
a) R in series with capacitor  
(3)  
where TA is the ambient temperature, V+ is the power supply  
voltage, IQ is the quiescent current, IL_TEMP is the load  
current on the VTEMP output, VDO is the voltage on the digital  
output, and IDO is the load current on the digital output. Since  
the LM26’s junction temperature is the actual temperature  
being measured, care should be taken to minimize the load  
current that the LM26 is required to drive.  
The tables shown in Figure 3 summarize the thermal resis-  
tance for different conditions and the rise in die temperature  
of the LM26 without any loading on VTEMP and a 10k pull-up  
resistor on an open-drain digital output with a 5.5V power  
supply.  
10132318  
b) R in series with signal path  
FIGURE 2. Resistor placement for capacitive loading  
compensation of VTEMP  
SOT23-5  
SOT23-5  
no heat sink  
small heat sink  
θJA  
(˚C/W)  
250  
TJ−TA  
θJA  
(˚C/W)  
TBD  
TJ−TA  
(˚C)  
NOISE CONSIDERATIONS  
(˚C)  
0.11  
TBD  
The LM26 has excellent power supply noise rejection. Listed  
below is a variety of signals used to test the LM26 power  
supply rejection. False triggering of the output was not ob-  
served when these signals where coupled into the V+ pin of  
the LM26.  
Still Air  
TBD  
TBD  
Moving Air  
TBD  
TBD  
FIGURE 3. Thermal resistance (θJA) and temperature  
rise due to self heating (TJ−TA)  
square wave 400kHz, 1Vp-p  
square wave 2kHz, 200mVp-p  
sine wave 100Hz to 1MHz, 200mVp-p  
Testing was done while maintaining the temperature of the  
LM26 one degree centigrade way from the trip point with the  
output not activated.  
MOUNTING CONSIDERATIONS  
The LM26 can be applied easily in the same way as other  
integrated-circuit temperature sensors. It can be glued or  
cemented to a surface. The temperature that the LM26 is  
sensing will be within about +0.06˚C of the surface tempera-  
ture to which the LM26’s leads are attached to.  
www.national.com  
6
Typical Applications  
10132303  
Note: The fan’s control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM26 goes low, the fan will speed up.  
FIGURE 4. Two Speed Fan Speed Control  
10132320  
FIGURE 5. Fan High Side Drive  
10132321  
FIGURE 6. Fan Low Side Drive  
7
www.national.com  
Typical Applications (Continued)  
10132322  
FIGURE 7. Audio Power Amplifier Thermal Protection  
10132323  
FIGURE 8. Simple Thermostat  
www.national.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted  
5-Lead Molded SOT-23 Plastic Package, JEDEC  
Order Number LM26CIM5 or LM26CIM5X  
NS Package Number MA05B  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
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LM26LV TI The LM26LV/LM26LV-Q1 is a low-voltage, precision, dual-output, low-power temperature switch and temperature sensor. 获取价格
LM26LV-Q1 TI 汽车级、±3°C、1.6V-5.5V、出厂预设跳变点温度开关 获取价格

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