LM2756TMX/NOPB [TI]

具有 32 指数调光步进、采用微型 SMD 封装的多显示无电感器 LED 驱动器 | YFQ | 20 | -30 to 85;


型号：	LM2756TMX/NOPB
厂家：	TEXAS INSTRUMENTS
描述：	具有 32 指数调光步进、采用微型 SMD 封装的多显示无电感器 LED 驱动器 \| YFQ \| 20 \| -30 to 85 驱动接口集成电路电感器驱动器
文件：	总25页 (文件大小：635K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LM2756

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SNVS504C –JULY 2007–REVISED MAY 2013

LM2756 Multi-Display Inductorless LED Driver with 32 Exponential Dimming Steps in

DSBGA

Check for Samples: LM2756

FEATURES

APPLICATIONS

•

Drives up to 8 LEDs with up to 30mA of Diode

Current Each

•

Dual Display LCD Backlighting for Portable

Applications

•

32 Exponential Dimming Steps with 800:1

Dimming Ratio for Group A (Up to 6 LEDs)

•

Large Format LCD Backlighting

Display Backlighting with Indicator Light

8 Linear Dimming States for Groups B (Up to 3

LEDs) and D1C (1 LED)

DESCRIPTION

The LM2756 is

a highly integrated, switched-

•

Programmable Auto-Dimming Function

capacitor, multi-display LED driver that can drive up

to 8 LEDs in parallel with a total output current of

180mA. Regulated internal current sources deliver

excellent current and brightness matching in all LEDs.

3 Independently Controlled LED Groups Via

I²C Compatible Interface

•

Up to 90% Efficiency

Total Solution Size < 21mm²

The LED driver current sinks are split into three

independently controlled groups. The primary group

(Group A) can be configured to drive four, five or six

LEDs for use in the main phone display, while the

secondary group (Group B) can be configured to

drive one, two or three LEDs for driving secondary

displays, keypads and/or indicator LEDs. An

additional driver, D1C, is provided for additional

indicator lighting functions.

Low Profile 20 Bump DSBGA Package

(1.615mm × 2.015mm × 0.6mm)

•

0.4% Accurate Current Matching

Internal Soft-Start Limits Inrush Current

True Shutdown Isolation for LED’s

Wide Input Voltage Range (2.7V to 5.5V)

Active High Hardware Enable

Typical Application Circuit

GROUP A

GROUP B

GROUP C

D1A D2A

D3A D4A

D62

D1B

D1C

D53

V_IN

OUT

C1+

1 µF

LM2756

C1-

C2+

GND

C2-

SCL SET

HWEN SDIO

I C Control

Signals

Capacitors: Murata GNM1M2R61C105ME18D 1 µF dual

capacitors, or 1 µF single capacitor equivalent

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM2756

SNVS504C –JULY 2007–REVISED MAY 2013

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DESCRIPTION (CONTINUED)

The device provides excellent efficiency without the use of an inductor by operating the charge pump in a gain of

3/2 or in Pass-Mode. The proper gain for maintaining current regulation is chosen, based on LED forward

voltage, so that efficiency is maximized over the input voltage range.

The LM2756 is available in TI's tiny 20-bump, 0.4mm pitch, thin DSBGA package.

Figure 1. Minimum Layout

Connection Diagram

Top View

Bottom View

Figure 2. 20 Bump DSBGA Package

Package Number YFQ0020AAA

PIN DESCRIPTIONS

Bump #s

Pin Names

Pin Descriptions

YFQ0020AAA

V_IN

V_OUT

Input voltage. Input range: 2.7V to 5.5V.

A1, C1, B1, B2

D3, E3,E4, D4

C4, B4

Charge Pump Output Voltage

C1+, C1-, C2+, C2-

D1A-D4A

D53, D62

D1B

Flying Capacitor Connections

LED Drivers - GroupA

LED Drivers - Configurable Current Sinks. Can be assigned to GroupA or GroupB

LED Drivers - GroupB

D1C

LED Driver - Indicator LED

I_SET

Placing a resistor (R_SET) between this pin and GND sets the full-scale LED current for

DxA , DxB, D53, D62 and D1C LEDs.

Full-Scale LED Current = 189 × (1.25V ÷ R_SET

)

HWEN

SDIO

SCL

Hardware Enable Pin. High = Normal Operation, Low = RESET

Serial Data Input/Output Pin

Serial Clock Pin

Ground

A4, D1

GND

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SNVS504C –JULY 2007–REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

(1)(2)(3)

Absolute Maximum Ratings

V_INpin voltage

-0.3V to 6.0V

SCL, SDIO, HWEN pin voltages

-0.3V to (V_IN+0.3V)

w/ 6.0V max

I_DxxPin Voltages

-0.3V to (V_VOUT+0.3V)

w/ 6.0V max

Continuous Power Dissipation

Internally Limited

(4)

Junction Temperature (T_J-MAX

Storage Temperature Range

)

150°C

-65°C to +150° C

(5)

Maximum Lead Temperature (Soldering)

ESD Rating⁽⁶⁾

Human Body Model

2.0kV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) All voltages are with respect to the potential at the GND pins.

(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J= 160°C (typ.) and

disengages at T_J= 155°C (typ.).

(5) For detailed soldering specifications and information, please refer to TI Application Note 1112: Micro SMD Wafer Level Chip Scale

Package (AN-1112) SNVA009.

(6) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7)

(1)(2)

Operating Rating

Input Voltage Range

2.7V to 5.5V

2.0V to 4.0V

LED Voltage Range

Junction Temperature (T_J) Range

Ambient Temperature (T_A) Range⁽³⁾

-30°C to +105°C

-30°C to +85°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2) All voltages are with respect to the potential at the GND pins.

(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP

105°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (θ_JA), as given by the following equation: T_A-MAX= T_J-MAX-OP– (θ_JA× P_D-MAX).

Thermal Properties

Junction-to-Ambient Thermal

Resistance (θ_JA),

40°C/W

YFQ0020 Package

(1)

(1) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to TI

Application Note 1112: Micro SMD Wafer Level Chip Scale Package (AN-1112) SNVA009.

Electrical Characteristics⁽¹⁾⁽²⁾

Limits in standard typeface are for T_J= 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: V_IN= 3.6V; V_HWEN= V_IN; V_DxA= V_DxB= V_DxC= 0.4V; R_SET= 11.8kΩ; GroupA = GroupB = GroupC

= Fullscale Current; ENA, ENB, ENC Bits = “1”; SD53, SD62, 53A, 62A Bits = "0"; C1 = C2 = C_IN= C_OUT= 1.0µF;

(1) All voltages are with respect to the potential at the GND pins.

(2) Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the

most likely norm.

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Electrical Characteristics⁽¹⁾⁽²⁾(continued)

Limits in standard typeface are for T_J= 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: V_IN= 3.6V; V_HWEN= V_IN; V_DxA= V_DxB= V_DxC= 0.4V; R_SET= 11.8kΩ; GroupA = GroupB = GroupC

= Fullscale Current; ENA, ENB, ENC Bits = “1”; SD53, SD62, 53A, 62A Bits = "0"; C1 = C2 = C_IN= C_OUT= 1.0µF;

Specifications related to output current(s) and current setting pins (I_Dxxand I_SET) apply to GroupA and GroupB. ⁽³⁾

(3)

Specifications related to output current(s) and current setting pins (I_Dxxand I_SET) apply to GroupA and GroupB.

Symbol

Parameter

Condition

Min

Typ

Max

Units

2.7V ≤ V_IN≤ 5.5V

ENA = '1', 53A = 62A = '0'', ENB = ENC = '0'

4 LEDs in GroupA

18.65

(-8%)

21.90

(+8%)

(%)

20.28

Output Current Regulation

GroupA

2.7V ≤ V_IN≤ 5.5V

ENA = '1', 53A = 62A = '1', ENB = ENC = '0'

6 LEDs in GroupA

18.70

(-8.5%)

22.10

(+8.5%)

(%)

20.40

20.00

2.7V ≤ V_IN≤ 5.5V

ENB = '1', 53A = 62A = '0', ENA = ENC = '0'

3 LEDs in GroupB

Output Current Regulation

GroupB

18.40

(-8%)

21.60

(+8%)

(%)

Output Current Regulation

IDC

2.7V ≤ V_IN≤ 5.5V

ENC = '1', ENA = ENB = '0'

18.20

(-7.5%)

21.20

(+7.5%)

(%)

I_Dxx

19.70

Maximum Diode Current per Dxx

Output⁽⁴⁾

R_SET= 8.33kΩ

22.5

DxA

Output Current Regulation

3.2V ≤ V_IN≤ 5.5V

22.5

DxB

GroupA, GroupB, and GroupC Enabled V_LED= 3.6V

(4)

R_SET= 10.5kΩ

22.5

DxC

GroupA (4 LEDs)

GroupA (6 LEDs)

GroupB (3 LEDs)

0.4

1.0

0.7

1.8

2.7

2.5

I_Dxx-

MATCH

LED Current Matching⁽⁵⁾

2.7V ≤ V_IN≤ 5.5V

V_Dxx1x to 3/2x Gain Transition

Threshold

V_DxTH

V_DxAand/or V_DxBFalling

150

Current sink Headroom Voltage

I_Dxx= 95% ×I_Dxx(nom.)

(I_Dxx(nom) ≈ 20mA)

V_HR

Requirement

(6)

Gain = 3/2

2.4

0.9

Open-Loop Charge Pump Output

Resistance

R_OUT

Ω

Gain = 1

I_Q

Quiescent Supply Current

Shutdown Supply Current

I_SETPin Voltage

Gain = 1.5x, No Load

All ENx bits = "0"

2.7V ≤ V_IN≤ 5.5V

2.1

2.5

5.5

µA

I_SD

V_SET

3.7

1.25

I_{DxA-B-C /}Output Current to Current Set Ratio

189

I_SET

GroupA, GroupB, GroupC

Switching Frequency

Start-up Time

f_SW

1.0

1.3

1.6

MHz

µs

t_START

V_OUT= 90% steady state

250

Reset

0.580

V_IN

V_HWEN

HWEN Voltage Thresholds

2.7V ≤ V_IN≤ 5.5V

Normal Operation

1.075

I²C Compatible Interface Voltage Specifications (SCL, SDIO)

(3) C_IN, C_VOUT, C₁, and C₂: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics

(4) The maximum total output current for the LM2756 should be limited to 180mA. The total output current can be split among any of the

three Groups (I_DxA= I_DxB= I_DxC= 30mA Max.). Under maximum output current conditions, special attention must be given to input

voltage and LED forward voltage to ensure proper current regulation. See the Maximum Output Current section of the datasheet for

more information.

(5) For the two groups of current sinks on a part (GroupA and GroupB), the following are determined: the maximum sink current in the

group (MAX), the minimum sink current in the group (MIN), and the average sink current of the group (AVG). For each group, two

matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the

matching figure for the Group. The matching figure for a given part is considered to be the highest matching figure of the two Groups.

The typical specification provided is the most likely norm of the matching figure for all parts.

(6) For each Dxxpin, headroom voltage is the voltage across the internal current sink connected to that pin. For Group A, B, and C current

sinks, V_HRx= V_OUT-V_LED. If headroom voltage requirement is not met, LED current regulation will be compromised.

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Electrical Characteristics⁽¹⁾⁽²⁾(continued)

Limits in standard typeface are for T_J= 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: V_IN= 3.6V; V_HWEN= V_IN; V_DxA= V_DxB= V_DxC= 0.4V; R_SET= 11.8kΩ; GroupA = GroupB = GroupC

= Fullscale Current; ENA, ENB, ENC Bits = “1”; SD53, SD62, 53A, 62A Bits = "0"; C1 = C2 = C_IN= C_OUT= 1.0µF;

Specifications related to output current(s) and current setting pins (I_Dxxand I_SET) apply to GroupA and GroupB. ⁽³⁾

Symbol

V_IL

Parameter

Input Logic Low "0"

Condition

Min

Typ

Max

0.710

V_IN

Units

2.7V ≤ V_IN≤ 5.5V

I_LOAD= 3.5mA

V_IH

Input Logic High "1"

Output Logic Low "0"

1.225

V_OL

400

I²C Compatible Interface Timing Specifications (SCL, SDIO)⁽⁷⁾

(8)

t₁

t₂

t₃

SCL (Clock Period)

294

100

Data In Setup Time to SCL High

Data Out stable After SCL Low

SDIO Low Setup Time to SCL Low

(Start)

t₄

t₅

100

SDIO High Hold Time After SCL High

(Stop)

(7) SCL and SDIO should be glitch-free in order for proper brightness control to be realized.

(8) SCL is tested with a 50% duty-cycle clock.

Figure 3.

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BLOCK DIAGRAM

OUT

1 mF

C1+

C1-

C2+

C2-

OUT D1A D2A D3A D4A D53

D62

D1B

D1C

2.7V to 5.5V

3/2X and 1X

Regulated Charge Pump

GroupB

Current Sinks

D1C Current

Sink

1 mF

GroupA Current Sinks

GAIN

CONTROL

1.3 MHz.

Switch

Frequency

Soft-

Start

1.25V

Ref.

Brightness

Control

Brightness

Control

Brightness

Control

SCL

SDIO

HWEN

General Purpose Register

I C Interface

Block

Brightness Control Registers

Group A and Group B

Brightness Control Register

D1C

LM2756

SET

GND

SET

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Typical Performance Characteristics

Unless otherwise specified: T_A= 25°C; V_IN= 3.6V; V_HWEN= V_IN; V_LEDxA= V_LEDxB= V_LED1C= 3.6V; R_SET= 11.8kΩ; C₁=C₂= C_IN

C_VOUT= 1µF; ENA = ENB = ENC = '1'.

LED Drive Efficiency

Input Voltage

100

= 3.0V

4 LEDs

LED

BankA = 6 LEDs

LED

= 3.3V

= 3.6V

LED

5 LEDs

= 3.3V

LED

6 LEDs

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

Figure 4.

Figure 5.

Input Current

Input Voltage

GroupA Diode Current

Input Voltage

200

175

150

125

100

21.50

21.00

20.50

20.00

19.50

19.00

18.50

BankA = 6 LEDs

= 3.6V

= +85°C

LED

= +25°C

= 3.3V

= 3.0V

LED

= -30°C

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

Figure 6.

Figure 7.

GroupB Diode Current

GroupC Diode Current

Input Voltage

21.00

20.50

20.00

19.50

19.00

18.50

20.50

20.00

19.50

19.00

18.50

= +25°C

= +85°C

T_A= +85°C

= -30°C

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

Figure 8.

Figure 9.

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Typical Performance Characteristics (continued)

Unless otherwise specified: T_A= 25°C; V_IN= 3.6V; V_HWEN= V_IN; V_LEDxA= V_LEDxB= V_LED1C= 3.6V; R_SET= 11.8kΩ; C₁=C₂= C_IN

C_VOUT= 1µF; ENA = ENB = ENC = '1'.

GroupA Current Matching

Input Voltage

6 LEDs

Input Voltage

4 LEDs

21.6

21.1

20.6

20.1

22.10

21.25

20.40

19.55

18.70

D2A

D3A

D62

D3A

D2A

D1A

D4A

D1A

D53

19.6

19.1

D4A

18.6

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

VIN (V)

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

Figure 10.

Figure 11.

GroupB Current Matching

GroupA Diode Current

GroupA Brightness Code

Input Voltage

3 LEDs

21.6

20.8

20.0

19.2

18.4

D62

D1B

D53

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

Figure 12.

Figure 13.

GroupB Diode Current

GroupB Brightness Code

GroupC Diode Current

GroupC Brightness Code

Figure 14.

Figure 15.

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Typical Performance Characteristics (continued)

Unless otherwise specified: T_A= 25°C; V_IN= 3.6V; V_HWEN= V_IN; V_LEDxA= V_LEDxB= V_LED1C= 3.6V; R_SET= 11.8kΩ; C₁=C₂= C_IN

C_VOUT= 1µF; ENA = ENB = ENC = '1'.

Quiescent Current in Gain 1.5×

Shutdown Current

Input Voltage

3.00

2.80

GAIN = 3/2

= 11.8 kΩ

SET

= +85°C

2.60

2.40

2.20

2.00

1.80

1.60

= +25°C

= -30°C

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

(V)

Figure 16.

Figure 17.

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CIRCUIT DESCRIPTION

Overview

The LM2756 is a white LED driver system based upon an adaptive 3/2× - 1× CMOS charge pump capable of

supplying up to 180mA of total output current. With three separately controlled Groups of constant current sinks,

the LM2756 is an ideal solution for platforms requiring a single white LED driver for main display, sub display,

and indicator lighting. The tightly matched current sinks ensure uniform brightness from the LEDs across the

entire small-format display.

Each LED is configured in a common anode configuration, with the peak drive current being programmed

through the use of an external R_SETresistor. An I²C compatible interface is used to enable the device and vary

the brightness within the individual current sink Groups. For GroupA , 32 exponentially-spaced analog brightness

control levels are available. GroupB and GroupC have 8 linearly-spaced analog brightness levels.

Circuit Components

Charge Pump

The input to the 3/2× - 1× charge pump is connected to the V_INpin, and the regulated output of the charge pump

is connected to the V_OUTpin. The recommended input voltage range of the LM2756 is 2.7V to 5.5V. The device’s

regulated charge pump has both open loop and closed loop modes of operation. When the device is in open

loop, the voltage at V_OUTis equal to the gain times the voltage at the input. When the device is in closed loop,

the voltage at V_OUTis regulated to 4.6V (typ.). The charge pump gain transitions are actively selected to maintain

regulation based on LED forward voltage and load requirements.

LED Forward Voltage Monitoring

The LM2756 has the ability to switch gains (1x or 3/2x) based on the forward voltage of the LED load. This ability

to switch gains maximizes efficiency for a given load. Forward voltage monitoring occurs on all diode pins. At

higher input voltages, the LM2756 will operate in pass mode, allowing the V_OUTvoltage to track the input voltage.

As the input voltage drops, the voltage on the Dxx pins will also drop (V_DXX= V_VOUT– V_LEDx). Once any of the

active Dxx pins reaches a voltage approximately equal to 150mV, the charge pump will switch to the gain of 3/2.

This switch-over ensures that the current through the LEDs never becomes pinched off due to a lack of

headroom across the current sinks. Once a gain transition occurs, the LM2756 will remain in the gain of 3/2

until an I²C write to the part occurs. At that time, the LM2756 will re-evaluate the LED conditions and

select the appropriate gain.

Only active Dxx pins will be monitored. For example, if only GroupA is enabled, the LEDs in GroupB or GroupC

will not affect the gain transition point. If all 3 Groups are enabled, all diodes will be monitored, and the gain

transition will be based upon the diode with the highest forward voltage.

Configurable Gain Transition Delay

To optimize efficiency, the LM2756 has a user selectable gain transition delay that allows the part to ignore short

duration input voltage drops. By default, the LM2756 will not change gains if the input voltage dip is shorter than

3 to 6 milliseconds. There are four selectable gain transition delay ranges available on the LM2756. All delay

ranges are set within the VF Monitor Delay Register . Please refer to the Internal Registers of LM2756 section of

this datasheet for more information regarding the delay ranges.

HWEN Pin

The LM2756 has a hardware enable/reset pin (HWEN) that allows the device to be disabled by an external

controller without requiring an I²C write command. Under normal operation, the HWEN pin should be held high

(logic '1') to prevent an unwanted reset. When the HWEN is driven low (logic '0'), all internal control registers

reset to the default states and the part becomes disabled. Please see the Electrical Characteristics section of the

datasheet for required voltage thresholds.

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I²C Compatible Interface

Data Validity

The data on SDIO line must be stable during the HIGH period of the clock signal (SCL). In other words, state of

the data line can only be changed when SCL is LOW.

SCL

SDIO

data

change

allowed

data

change

allowed

data

valid

data

change

allowed

data

valid

Figure 18. Data Validity Diagram

A pull-up resistor between the controller's VIO line and SDIO must be greater than [(VIO-V_OL) / 3.5mA] to meet

the V_OLrequirement on SDIO. Using a larger pull-up resistor results in lower switching current with slower edges,

while using a smaller pull-up results in higher switching currents with faster edges.

Start and Stop Conditions

START and STOP conditions classify the beginning and the end of the I²C session. A START condition is

defined as SDIO signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined as

the SDIO transitioning from LOW to HIGH while SCL is HIGH. The I²C master always generates START and

STOP conditions. The I²C bus is considered to be busy after a START condition and free after a STOP condition.

During data transmission, the I²C master can generate repeated START conditions. First START and repeated

START conditions are equivalent, function-wise.

SDIO

SCL

STOP condition

TART condition

Figure 19. Start and Stop Conditions

Transfering Data

Every byte put on the SDIO line must be eight bits long, with the most significant bit (MSB) transferred first. Each

byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the

master. The master releases the SDIO line (HIGH) during the acknowledge clock pulse. The LM2756 pulls down

the SDIO line during the 9th clock pulse, signifying an acknowledge. The LM2756 generates an acknowledge

after each byte is received.

After the START condition, the I²C master sends a chip address. This address is seven bits long followed by an

eighth bit which is a data direction bit (R/W). The LM2756 address is 36h. For the eighth bit, a “0” indicates a

WRITE and a “1” indicates a READ. The second byte selects the register to which the data will be written. The

third byte contains data to write to the selected register.

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ack from slave

ack

ack from slave

ack stop

ack from slave

start

msb Chip Address lsb

ack

msb Register Add lsb

msb DATA lsb

SCL

SDIO

start

Id = 36h

ack

addr = 10h

ack

address h‘06 data

ack stop

w = write (SDIO = "0")

r = read (SDIO = "1")

ack = acknowledge (SDIO pulled down by either master or slave)

id = chip address, 36h for LM2756

Figure 20. Write Cycle

I²C Compatible Chip Address

The chip address for LM2756 is 0110110, or 36h.

MSB

LSB

R/W

ADR6

bit7

ADR5

bit6

ADR4

bit5

ADR3

bit4

ADR2

bit3

ADR1

bit2

ADR0

bit1

bit0

I C Slave Address (chip address)

Figure 21. Chip Address

Internal Registers of LM2756

Internal Hex Address

Power On Value

0000 0000

1110 0000

1111 1000

1111 0000

1111 1100

General Purpose Register

Group A Brightness Control Register

Group B Brightness Control Register

Group C Brightness Control Register

Ramp Step Time Register

VF Monitor Delay Ragister

10h

A0h

B0h

C0h

20h

60h

MSB

LSB

bit7

62A

bit6

53A

bit5

SD62

bit4

SD53

bit3

ENC

bit2

ENB

bit1

ENA

bit0

Figure 22. General Purpose Register Description

Internal Hex Address: 10h

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NOTE

ENA: Enables DxA LED drivers (Main Display)

ENB: Enables DxB LED drivers (Aux Lighting)

ENC: Enables D1C LED driver (Indicator Lighting)

SD53: Shuts down driver D53

SD62: Shuts down driver D62

53A: Configures D53 to GroupA

62A: Configures D62 to GroupA

DxA Brightness Control

MSB

LSB

bit7

bit6

bit5

DxA4

bit4

DxA3

bit3

DxA2

bit2

DxA1

bit1

DxA0

bit0

DxB Brightness Control

MSB

LSB

bit7

bit6

bit5

bit4

bit3

DxB2

bit2

DxB1

bit1

DxB0

bit0

DxC Brightness Control

MSB

LSB

bit7

bit6

bit5

bit4

bit3

D1C2

bit2

D1C1

bit1

D1C0

bit0

Figure 23. Brightness Control Register Description

Internal Hex Address: 0xA0 (GroupA), 0xB0 (GroupB), 0xC0 (GroupC)

NOTE

DxA4-DxA0, D53, D62: Sets Brightness for DxA pins (GroupA). 11111=Fullscale

DxB2-DxB0: Sets Brightness for DxB pins (GroupB). 111=Fullscale

DxC2-DxC0: Sets Brightness for D1C pin. 111 = Fullscale

Full-Scale Current set externally by the following equation:

I_Dxx= 189 × 1.25V / R_SET

Table 1. Brightness Level Control Table (GroupA)

Brightness Code (hex)

Perceived Brightness Level (%)

0.125

0.313

0.625

1.125

1.313

1.688

2.063

2.438

2.813

3.125

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Table 1. Brightness Level Control Table (GroupA) (continued)

Brightness Code (hex)

Perceived Brightness Level (%)

3.75

4.375

5.25

6.25

7.5

8.75

12.5

16.875

18.75

22.5

26.25

31.25

37.5

43.75

52.5

61.25

87.5

100

GroupB and GroupC Brightness Levels (% of Full-Scale) = 10%, 20%, 30%, 40%, 50%, 60%, 70%, 100%

Ramp Step Time Register

MSB

LSB

bit7

bit6

bit5

bit4

bit3

bit2

RS1

bit1

RS0

bit0

Figure 24. Ramp Step Time Register Description

Internal Hex Address: 20h

NOTE

RS1-RS0: Sets Brightness Ramp Step Time. The Brightness ramp settings only affect

GroupA current sinks. ('00' = 100µs, '01' = 25ms, '10' = 50ms, '11' = 100ms).

VF Monitor Delay Register

MSB

LSB

bit7

bit6

bit5

bit4

bit3

bit2

VF1

bit1

VF0

bit0

Figure 25. VF Monitor Delay Register Description

Internal Hex Address: 60h

NOTE

VF1-VF0: Sets the Gain Transition Delay Time. The VF Monitor Delay can be set to four

different delay times. ('00' (Default) = 3-6msec., '01' = 1.5-3msec., '10' = 0.4-0.8msec., '11'

= 60-90µsec.).

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Application Information

Led configurations

The LM2756 has a total of 8 current sinks capable of sinking 180mA of total diode current. These 8 current sinks

are configured to operate in three independently controlled lighting regions. GroupA has four dedicated current

sinks, while GroupB and GroupC each have one. To add greater lighting flexibility, the LM2756 has two

additional drivers (D53 and D62) that can be assigned to either GroupA or GroupB through a setting in the

general purpose register.

At start-up, the default condition is four LEDs in GroupA, three LEDs in GroupB and a single LED in GroupC

(NOTE: GroupC only consists of a single current sink (D1C) under any configuration). Bits 53A and 62A in the

general purpose register control where current sinks D53 and D62 are assigned. By writing a '1' to the 53A or

62A bits, D53 and D62 become assigned to the GroupA lighting region. Writing a '0' to these bits assigns D53

and D62 to the GroupB lighting region. With this added flexibility, the LM2756 is capable of supporting

applications requiring 4, 5, or 6 LEDs for main display lighting, while still providing additional current sinks that

can be used for a wide variety of lighting functions.

Setting LED Current

The current through the LEDs connected to DxA and DxB can be set to a desired level simply by connecting an

appropriately sized resistor (R_SET) between the I_SETpin of the LM2756 and GND. The DxA, DxB and D1C LED

currents are proportional to the current that flows out of the I_SETpin and are a factor of 189 times greater than the

I_SETcurrent. The feedback loops of the internal amplifiers set the voltage of the I_SETpin to 1.25V (typ.). The

statements above are simplified in the equations below:

I_DxA/B/C(A)= 189 × (V_ISET/ R_SET

)

(1)

(2)

R_SET(Ω)= 189 × (1.25V / I_DxA/B/C

)

Once the desired R_SETvalue has been chosen, the LM2756 has the ability to internally dim the LEDs using

analog current scaling. The analog current level is set through the I²C compatible interface. LEDs connected to

GroupA can be dimmed to 32 different levels. GroupB and GroupC(D1C) have 8 analog current levels.

Please refer to the I²C Compatible Interface section of this datasheet for detailed instructions on how to adjust

the brightness control registers.

LED Current Ramping

The LM2756 provides an internal LED current ramping function that allows the GroupA LEDs to turn on and turn

off gradually over time. The target current level is set in the GroupA Brightness Control Register (0xA0). The total

ramp-up/ramp-down time is determind by the GroupA brightness level (0-31) and the user configurable ramp

step time.

Bits RS1 and RS2 in the Ramp Step Time Register (0x20) set the ramp step time to the following four times: '00'

= 100µsec., '01' = 25msec., '10' = 50msec., '11' = 100msec.

The LM2756 will always ramp-up (upon enable) and ramp-down (upon disable) through the brightness levels

until the target level is reached. At the default setting of '00', the LM2756's current ramping feature looks more

like a current step rather than a current ramp. Table 2 gives the approximate ramp-up/ramp-down times if the

GroupA brightness register is set to full-scale, or brightness code 31.

Table 2. Brightness Ramp-Up/Ramp-Down Times

Ramp Code

RS1-RS0

Ramp Step

Time

Total Ramp

Time

100µs

25ms

3.2ms

0.8s

50ms

1.6s

100ms

3.2s

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Maximum Output Current, Maximum LED Voltage, Minimum Input Voltage

The LM2756 can drive 8 LEDs at 22.5mA each (GroupA , GroupB, GroupC) from an input voltage as low as

3.2V, so long as the LEDs have a forward voltage of 3.6V or less (room temperature).

The statement above is a simple example of the LED drive capability of the LM2756. The statement contains the

key application parameters that are required to validate an LED-drive design using the LM2756: LED current

(I_LEDx), number of active LEDs (N_x), LED forward voltage (V_LED), and minimum input voltage (V_IN-MIN).

The equation below can be used to estimate the maximum output current capability of the LM2756:

I_{LED_MAX}= [(1.5 x V_IN) - V_LED- (I_ADDITIONAL× R_OUT)] / [(N_xx R_OUT) + k_HRx

]

(3)

(4)

I_{LED_MAX}= [(1.5 x V_IN) - V_LED- (I_ADDITIONAL× 2.4Ω)] / [(N_xx 2.4Ω) + k_HRx

]

I_ADDITIONALis the additional current that could be delivered to the other LED Groups.

R_OUT– Output resistance. This parameter models the internal losses of the charge pump that result in voltage

droop at the pump output V_OUT. Since the magnitude of the voltage droop is proportional to the total output

current of the charge pump, the loss parameter is modeled as a resistance. The output resistance of the LM2756

is typically 2.4Ω (V_IN= 3.6V, T_A= 25°C). In equation form:

V_VOUT= (1.5 × V_IN) – [(N_A× I_LEDA+ N_B× I_LEDB+ N_C× I_LEDC) × R_OUT

]

(5)

k_HR– Headroom constant. This parameter models the minimum voltage required to be present across the current

sinks for them to regulate properly. This minimum voltage is proportional to the programmed LED current, so the

constant has units of mV/mA. The typical k_HRof the LM2756 is 3.25mV/mA. In equation form:

(V_VOUT– V_LEDx) > k_HRx× I_LEDx

(6)

(7)

Typical Headroom Constant Values k_HRA= k_HRB= k_HRC= 3.25 mV/mA

The "I_LED-MAX" equation (Equation 3) is obtained from combining the R_OUTequation (Equation 5) with the k_HRx

equation (Equation 6) and solving for I_LEDx. Maximum LED current is highly dependent on minimum input voltage

and LED forward voltage. Output current capability can be increased by raising the minimum input voltage of the

application, or by selecting an LED with a lower forward voltage. Excessive power dissipation may also limit

output current capability of an application.

Total Output Current Capability

The maximum output current that can be drawn from the LM2756 is 180mA. Each driver Group has a maximum

allotted current per Dxx sink that must not be exceeded.

DRIVER TYPE

MAXIMUM Dxx CURRENT

30mA per DxA Pin

30mA per DxB Pin

30mA

DxA

DxB

D1C

The 180mA load can be distributed in many different configurations. Special care must be taken when running

the LM2756 at the maximum output current to ensure proper functionality.

Parallel Connected and Unused Outputs

Connecting the outputs in parallel does not affect internal operation of the LM2756 and has no impact on the

Electrical Characteristics and limits previously presented. The available diode output current, maximum diode

voltage, and all other specifications provided in the Electrical Characteristics table apply to this parallel output

configuration, just as they do to the standard LED application circuit.

All Dx current sinks utilize LED forward voltage sensing circuitry to optimize the charge-pump gain for maximum

efficiency. Due to the nature of the sensing circuitry, it is not recommended to leave any of the DxA (D1A-D4A,

D53, D62) pins open if diode GroupA is going to be used during normal operation. Leaving DxA pins

unconnected will force the charge-pump into 3/2× mode over the entire V_INrange negating any efficiency gain

that could have been achieved by switching to 1× mode at higher input voltages.

If the D1B or D1C drivers are not going to be used, make sure that the ENB and ENC bits in the general purpose

The D53 and D62 pins can be completely shutdown through the general purpose register by writing a '1' to the

SD53 or SD62 bits.

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Care must be taken when selecting the proper R_SETvalue. The current on any DxX pin must not exceed the

maximum current rating for any given current sink pin.

Power Efficiency

Efficiency of LED drivers is commonly taken to be the ratio of power consumed by the LEDs (P_LED) to the power

drawn at the input of the part (P_IN). With a 3/2× - 1× charge pump, the input current is equal to the charge pump

gain times the output current (total LED current). The efficiency of the LM2756 can be predicted as follow:

P_LEDTOTAL= (V_LEDA× N_A× I_LEDA) + (V_LEDB× N_B× I_LEDB) + (V_LEDC× I_LEDC

)

(8)

(9)

P_IN= V_IN× I_IN

P_IN= V_IN× (GAIN × I_LEDTOTAL+ I_Q)

E = (P_LEDTOTAL÷ P_IN)

(10)

(11)

The LED voltage is the main contributor to the charge-pump gain selection process. Use of low forward-voltage

LEDs (3.0V- to 3.5V) will allow the LM2756 to stay in the gain of 1× for a higher percentage of the lithium-ion

battery voltage range when compared to the use of higher forward voltage LEDs (3.5V to 4.0V). See the LED

Forward Voltage Monitoring section of this datasheet for a more detailed description of the gain selection and

transition process.

For an advanced analysis, it is recommended that power consumed by the circuit (V_INx I_IN) for a given load be

evaluated rather than power efficiency.

Power Dissipation

The power dissipation (P_DISS) and junction temperature (T_J) can be approximated with the equations below. P_INis

the power generated by the 3/2× - 1× charge pump, P_LEDis the power consumed by the LEDs, T_Ais the ambient

temperature, and θ_JAis the junction-to-ambient thermal resistance for the DSBGA 20-bump package. V_INis the

input voltage to the LM2756, V_LEDis the nominal LED forward voltage, N is the number of LEDs and I_LEDis the

programmed LED current.

P_DISS= P_IN- P_LEDA- P_LEDB- P_LEDC

(12)

(13)

(14)

P_DISS= (GAIN × V_IN× I_{GroupA + GroupB + GroupC}) - (V_LEDA× N_A× I_LEDA) - (V_LEDB× N_B× I_LEDB) - (V_LEDC× I_LEDC

)

T_J= T_A+ (P_DISSx θ_JA)

The junction temperature rating takes precedence over the ambient temperature rating. The LM2756 may be

operated outside the ambient temperature rating, so long as the junction temperature of the device does not

exceed the maximum operating rating of 105°C. The maximum ambient temperature rating must be derated in

applications where high power dissipation and/or poor thermal resistance causes the junction temperature to

exceed 105°C.

Thermal Protection

Internal thermal protection circuitry disables the LM2756 when the junction temperature exceeds 160°C (typ.).

This feature protects the device from being damaged by high die temperatures that might otherwise result from

excessive power dissipation. The device will recover and operate normally when the junction temperature falls

below 155°C (typ.). It is important that the board layout provide good thermal conduction to keep the junction

temperature within the specified operating ratings.

Capacitor selection

The LM2756 requires 4 external capacitors for proper operation (C₁= C₂= C_IN= C_OUT= 1µF). Surface-mount

multi-layer ceramic capacitors are recommended. These capacitors are small, inexpensive and have very low

equivalent series resistance (ESR <20mΩ typ.). Tantalum capacitors, OS-CON capacitors, and aluminum

electrolytic capacitors are not recommended for use with the LM2756 due to their high ESR, as compared to

ceramic capacitors.

For most applications, ceramic capacitors with X7R or X5R temperature characteristic are preferred for use with

the LM2756. These capacitors have tight capacitance tolerance (as good as ±10%) and hold their value over

temperature (X7R: ±15% over -55°C to 125°C; X5R: ±15% over -55°C to 85°C).

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Capacitors with Y5V or Z5U temperature characteristic are generally not recommended for use with the LM2756.

Capacitors with these temperature characteristics typically have wide capacitance tolerance (+80%, -20%) and

vary significantly over temperature (Y5V: +22%, -82% over -30°C to +85°C range; Z5U: +22%, -56% over +10°C

to +85°C range). Under some conditions, a nominal 1µF Y5V or Z5U capacitor could have a capacitance of only

0.1µF. Such detrimental deviation is likely to cause Y5V and Z5U capacitors to fail to meet the minimum

capacitance requirements of the LM2756.

The recommended voltage rating for the capacitors is 10V to account for DC bias capacitance losses.

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REVISION HISTORY

Changes from Revision B (May 2013) to Revision C

Page

•

Changed layout of National Data Sheet to TI format .......................................................................................................... 18

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10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

LM2756TM/NOPB

LM2756TMX/NOPB

ACTIVE

DSBGA

YFQ

250

RoHS & Green

SNAGCU

Level-1-260C-UNLIM

-30 to 85

3000 RoHS & Green

SNAGCU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

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10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

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9-Aug-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

LM2756TM/NOPB

LM2756TMX/NOPB

DSBGA

YFQ

250

178.0

8.4

1.89

2.2

0.76

4.0

8.0

3000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

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9-Aug-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

LM2756TM/NOPB

LM2756TMX/NOPB

DSBGA

YFQ

250

210.0

185.0

35.0

3000

Pack Materials-Page 2

MECHANICAL DATA

YFQ0020xxx

0.600±0.075

TMD20XXX (Rev D)

D: Max = 2.048 mm, Min =1.987 mm

E: Max = 1.641 mm, Min =1.581 mm

4215083/A

12/12

A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

NOTES:

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LM2756TMX/NOPB [TI]

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