LM27CIM5X-1HJ [TI]
Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 3Cel, RECTANGULAR, SURFACE MOUNT, PLASTIC, SOT-23, 5 PIN;
| 型号： | LM27CIM5X-1HJ |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 3Cel, RECTANGULAR, SURFACE MOUNT, PLASTIC, SOT-23, 5 PIN 输出元件 传感器 换能器 |
| 文件： | 总17页 (文件大小：1019K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM27
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SNIS124D –AUGUST 2002–REVISED JULY 2013
LM27 SOT-23, ±3°C Accurate, 120°C-150°C Factory Preset Thermostat
Check for Samples: LM27
1
FEATURES
DESCRIPTION
The LM27 is a precision, single digital-output, low-
power thermostat comprised of an internal reference,
DAC, temperature sensor and comparator. Utilizing
factory programming, it can be manufactured with
different trip points as well as different digital output
functionality. The trip point (TOS) can be preset at the
factory to any temperature in the range of +120°C to
+150°C in 1°C increments. The LM27 has one digital
output (OS/OS/US/US), one digital input (HYST) and
one analog output (VTEMP). The digital output stage
can be preset as either open-drain or push-pull. In
addition, it can be factory programmed to be active
HIGH or LOW. The digital output can be factory
programmed to indicate an over temperature
shutdown event (OS or OS) or an under temperature
shutdown event (US or US). When preset as an
overtemperature shutdown (OS) it will go LOW to
indicate that the die temperature is over the internally
preset TOS and go HIGH when the temperature goes
below (TOS–THYST). Similarly, when preprogrammed
as an undertemperature shutdown (US) it will go
HIGH to indicate that the temperature is below TUS
and go LOW when the temperature is above
(TUS+THYST). The typical hysteresis, THYST, can be set
to 2°C or 10°C and is controlled by the state of the
HYST pin. A VTEMP analog output provides a voltage
2
•
Internal Comparator with Pin Selectable 2°C or
10°C Hysteresis
•
•
No External Components Required
Open-drain or Push-pull Digital Output;
Supports CMOS Logic Levels
•
•
•
•
•
Internal Temperature Sensor with VTEMP Output
Pin
VTEMP Output Allows After-assembly System
Testing
Internal Voltage Reference and DAC for Trip-
point Setting
Currently Available in 5-pin SOT-23 Plastic
Package
Excellent Power Supply Noise Rejection
APPLICATIONS
•
•
•
•
•
•
•
Microprocessor Thermal Management
Appliances
Portable Battery Powered Systems
Fan Control
Industrial Process Control
HVAC Systems
that is proportional to temperature and has
a
−10.7mV/°C output slope.
Electronic System Protection
Currently, there are several standard parts available,
see Table 1. For other part options, contact a Texas
Instruments Distributor or Sales Representative for
information on minimum order qualification. The
LM27 is currently available in a 5-lead SOT-23
package.
KEY SPECIFICATIONS
•
•
•
•
Power Supply Voltage 2.7V to 5.5V
Power Supply Current 40μA (Max), 15μA (Typ)
Hysteresis Temperature 2°C or 10°C (Typ)
Temperature Trip Point Accuracy ±3°C (Max)
Simplified Block Diagram and Connection Diagram LM27CIM5-2HJ (140°C Trip-Point)
TOS
HYST
GND
OS
TOS- THYST
HYST
Temp. of
Leads
REF
TEMP
SENSOR
OS
V+=2.7V
to 5.5V
VTEMP
LM27-2HJ
HYST=GND for 10oC Hysteresis
HYST=V+ for 2oC Hysteresis
VTEMP=(-3.552x10-6x(T-30)2)+(-10.69576x10-3x(T-30))+1.8386V
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
LM27
SNIS124D –AUGUST 2002–REVISED JULY 2013
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Table 1. Summary Table of Trip Point and Output Function Capabilities of Released Parts(1)
Orderable Device
LM27CIM5-ZHJ
LM27CIM5-1HJ
LM27CIM5-2HJ
Trip Point Temperature (°C)
Digital Output Function
120
130
140
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
(1) Other device options have not been released to market, contact Texas Instruments for volume and other requirements for release.
Connection Diagram
1
2
3
5
4
OS, OS, US
or US
HYST
GND
LM27
VTEMP
V+
PIN DESCRIPTIONS
Pin Number
Pin Name
HYST
Function
Connection
GND for 10°C or V+ for 2°C
1
2
Hysteresis control, digital input
GND
Ground, connected to the back side of System GND
the die through lead frame.
3
4
VTEMP
V+
Analog output voltage proportional to
temperature
Leave floating or connect to a high impedance node.
Supply input
2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR
information see NOISE CONSIDERATIONS.
5(1)
OS
Overtemperature Shutdown open-drain Controller interrupt, system or power supply shutdown;
active low thermostat digital output pull-up resistor ≥ 10kΩ
OS
Overtemperature Shutdown totem-pull Controller interrupt, system or power supply shutdown
active high thermostat digital output
US
Undertemperature Shutdown open-
drain active low thermostat digital
output
System or power supply shutdown; pull-up resistor ≥ 10kΩ
US
Undertemperature Shutdown totem-
pull active high thermostat digital
output
System or power supply shutdown
(1) Pin 5 functionality and trip point setting are programmed during LM27 manufacture.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings(1)
Input Voltage
Input Current at any pin(2)
6.0V
5mA
Package Input Current(2)
20mA
Package Dissipation at TA = 25°C(3)
500mW
Vapor Phase (60 seconds)
Infrared (15 seconds)
215°C
220°C
Soldering Information(4)
Storage Temperature
ESD Susceptibility(5)
SOT23 Package
−65°C to + 150°C
2500V
Human Body Model
Machine Model
250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA.
The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input
current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device,
TJmax = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted refer to Table 2
(4) See http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
(5) The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Table 2.
Package Type
θJA
SOT23-5, DBV
250°C/W
Operating Ratings(1)
Specified Temperature Range
LM27CIM
T
MIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ +150°C
+2.7V to +5.5V
+5.5V
Positive Supply Voltage (V+)
Maximum VOUT
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
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LM27 Electrical Characteristics
The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified.
Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified.
Parameter
LM27CIM
Limits(2)
Units
(Limits)
Symbol
Conditions
Typical(1)
Temperature Sensor
Trip Point Accuracy (Includes VREF, DAC, +120°C<TA<+150°C
Comparator Offset, and Temperature
Sensitivity errors)
±3
°C (max)
Trip Point Hysteresis
HYST = GND
HYST = V+
10
2
°C
°C
VTEMP Output Temperature Sensitivity
−10.82
mV/°C
°C (max)
VTEMP Temperature Sensitivity Error to
Equation:
−30°C ≤ TA ≤ 150°C, 2.7V ≤
V+ ≤ 5.5V
±3
±3
VO = (−3.552×10−6×(T−30)2+
−55°C ≤ TA ≤ 150°C, 4.5V ≤
V+ ≤ 5.5V
°C (max)
(−10.695×10−3×(T−30))+ 1.8386V (1)
TA = 25°C
±2.5
°C (max)
mV
VTEMP Load Regulation
Source ≤ 1 μA
Sink ≤ 40 μA
+2.7V ≤ V+ ≤ +5.5V,
−30°C ≤ TA ≤ +120°C
0.070
0.7
mV (max)
mV/V
VTEMP Line Regulation
Supply Current
−0.2
IS
15
22
40
µA (max)
µA (max)
Digital Output and Input
IOUT(“1”)
Logical “1” Output Leakage Current(3)
V+ = +5.0V
0.001
1
µA (max)
V (max)
VOUT(“0”)
Logical “0” Output Voltage
IOUT = +1.2mA and
V+≥2.7V; IOUT = +3.2mA
and V+≥4.5V(4)
0.4
VOUT(“1”)
Logical “1” Push-Pull Output Voltage
ISOURCE = 500µA, V+ ≥ 2.7V
ISOURCE = 800µA, V+≥4.5V
0.8 × V+
V+ − 1.5
0.8 × V+
0.2 × V+
V (min)
V (min)
V (min)
V (max)
VIH
VIL
HYST Input Logical ”1“ Threshold Voltage
HYST Input Logical ”0“ Threshold Voltage
(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).
(3) The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the
current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.
(4) Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the
LM27 would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation
would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point
accuracy specification.
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Part Number Template
The series of digits labeled xyz in the part number LM27CIM-xyz, describe the set point value and the function of
the output as follows:
The place holders xy describe the set point temperature as shown in the following table.
x (10x)
y (1x)
Temperature (°C)
-
-
H
J
0
1
-
K
L
N
P
R
S
T
V
-
2
-
3
-
4
-
5
-
6
-
7
-
8
-
9
Z
1
2
3
12
13
14
15
-
-
-
The value of z describes the assignment/function of the output as shown in the following table:
Open-Drain/ Push-
Active-Low/High
OS/US
Value of z
Digital Output Function
Pull
0
0
1
1
0
0
1
0
1
J
K
L
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, US output
Active-High, Push-Pull, OS output
Active-High, Push-Pull, US output
0
1
1
N
For example:
•
the part number LM27CIM5-2SJ has TOS = 147°C, and programmed as an active-low open-drain
overtemperature shutdown output.
•
the part number LM27CIM5-ZLN has TUS = 123°C, and programmed as an active-high, push-pull
undertemperature shutdown output.
Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more
information.
Note: Currently, there are several standard parts available, see Table 1. For other part options, contact a Texas
Instruments Distributor or Sales Representative for information on minimum order qualification
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FUNCTIONAL DESCRIPTION
LM27 OPTIONS — Output Pin Options Block Diagrams
HYST
GND
HYST
US
V+
OS
HYST
HYST
REF
REF
-
+
GND
TEMP
SENSOR
TEMP
-
SENSOR
+
VTEMP
VTEMP
V+
LM27__K
LM27__J
Figure 1. LM27-_ _J
Figure 2. LM27-_ _K
V+
V+
HYST
GND
OS
V+
HYST
GND
US
V+
HYST
HYST
REF
+
REF
-
TEMP
TEMP
-
+
SENSOR
SENSOR
VTEMP
VTEMP
LM27__L
LM27__N
Figure 3. LM27-_ _L
Figure 4. LM27-_ _N
The LM27 can be factory programmed to have a trip point anywhere in-between 120°C to 150°C.
Applications Hints
AFTER-ASSEMBLY PCB TESTING
The LM27's VTEMP output allows after-assembly PCB testing by following a simple test procedure. Simply
measuring the VTEMP output voltage will verify that the LM27 has been assembled properly and that its
temperature sensing circuitry is functional. The VTEMP output has very weak drive capability that can be
overdriven by 1.5mA. Therefore, one can simply force the VTEMP voltage to cause the digital output to change
state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test
procedure that can be used to test the LM27CIM5X-2HJ which has a 140°C trip point.
1. Turn on V+ and measure VTEMP. Then calculate the temperature reading of the LM27 using the equation:
VO = (−3.552×10−6×(T−30)2) + (−10.69576×10−3×(T−30)) + 1.8386V
(2)
or
1.8386 - VTEMP
3.552 x 10-6
T = -1475.49 + 2.2668 x 106
+
(3)
2. Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of
the ambient/board temperature. The ambient/board temperature (reference temperature) should be
measured using an extremely accurate calibrated temperature sensor, which is in close proximity to and
mounted on the same PCB as the LM27 perhaps even touching the GND lead of the LM27 if possible. The
LM27 will sence the board temperature not the ambient temperature (see MOUNTING CONSIDERATIONS)
3.
(a) Observe that OS is high.
(b) Drive VTEMP to ground.
(c) Observe that OS is now low.
(d) Release the VTEMP pin.
(e) Observe that OS is now high.
4.
(a) Observe that OS is high.
(b) Drive VTEMP voltage down gradually.
(c) When OS goes low, note the VTEMP voltage.
(d) VTEMPTrig = VTEMP at OS trigger (HIGH->LOW)
(e) Calculate Ttrig using Equation 3.
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5.
(a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP
.
(b) Calculate THYST using Equation 3.
VTEMP LOADING
The VTEMP output has very weak drive capability (1 µA source, 40 µA sink). So care should be taken when
attaching circuitry to this pin. Capacitive loading may cause the VTEMP output to oscillate. Simply adding a resistor
in series as shown in Figure 6 will prevent oscillations from occurring. To determine the value of the resistor
follow the guidelines given in Table 3. The same value resistor will work for either placement of the resistor. If an
additional capacitive load is placed directly on the LM27 output, rather than across CLOAD, it should be at least a
factor of 10 smaller than CLOAD
.
Table 3. Resistive compensation for capacitive loading of VTEMP
CLOAD
≤100pF
1nF
R (Ω)
0
8200
3000
1000
430
10nF
100nF
≥1µF
Resistor placement for capacitive loading compensation of VTEMP
Heavy Capacitive
OS/OS/US/
HYST
GND
Load, Cable/Wiring
US
LM27
VTEMP
V+
CLOAD
0.1PF
R
Figure 5. R in series with capacitor
Heavy Capacitive
OS/OS/US/
HYST
GND
Load, Cable/Wiring
US
R
LM27
VTEMP
V+
CLOAD
0.1Pf
Figure 6. R in series with signal path
NOISE CONSIDERATIONS
The LM27 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM27
power supply rejection. False triggering of the output was not observed when these signals where coupled into
the V+ pin of the LM27.
•
•
•
square wave 400kHz, 1Vp-p
square wave 2kHz, 200mVp-p
sine wave 100Hz to 1MHz, 200mVp-p
Testing was done while maintaining the temperature of the LM27 one degree centigrade way from the trip point
with the output not activated.
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MOUNTING CONSIDERATIONS
The LM27 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM27 is sensing will be within about +0.06°C of the surface
temperature to which the LM27's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity, the backside of the LM27 die is directly attached to the GND pin (pin 2).
The temperatures of the lands and traces to the other leads of the LM27 will also affect the temperature that is
being sensed.
Alternatively, the LM27 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM27 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LM27 or its connections.
The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction
temperature due to its power dissipation. For the LM27 the equation used to calculate the rise in the die junction
temperature is as follows:
TJ = TA + 4JA(V+IQ + (V+ - VTEMP)IL_TEMP + VDO DO
I )
(4)
where TA is the ambient temperature, V+ is the power supply voltage, IQ is the quiescent current, IL_TEMP is the
load current on the VTEMP output, VDO is the voltage on the digital output, and IDO is the load current on the digital
output. Since the LM27's junction temperature is the actual temperature being measured, care should be taken
to minimize the load current that the LM27 is required to drive.
The tables shown in Table 4 summarize the thermal resistance for different conditions and the rise in die
temperature of the LM27 without any loading on VTEMP and a 10k pull-up resistor on an open-drain digital output
with a 5.5V power supply.
Table 4. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA)
SOT23-5
SOT23-5
no heat sink
small heat sink
θJA
TJ−TA
θJA
TJ−TA
(°C/W)
(°C)
(°C/W)
(°C)
Still Air
250
0.11
TBD
TBD
TBD
TBD
TBD
Moving Air
TBD
Typical Applications
12V
System Fan
Sanyo Denki
109R0612T4H12
HYST
GND
OS
V+
LM27
+5V
10k
VTEMP
0.1PF
The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the LM27
goes low, the fan will speed up.
Figure 7. Two Speed Fan Speed Control
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5V
HYST
OS
V+
GND
R1
(100k)
NDS356P
LM27
VTEMP
1N4001
0.1
5V
5V Fan
MC05J3
Comair-Rotron
Figure 8. Fan High Side Drive
12V
1N4001
Vout
TOYO
USTF802512HW
HYST
GND
OS
V+
R1
(10k)
LM27
2N2222
VTEMP
0.1
5V
Figure 9. Fan Low Side Drive
5V
THERMALLY COUPLED
+28V
8:
HYST
OS
V+
IC2
LM27
+
-
GND
NDS356P
VTEMP
100k
-28V
IC1
LM3886
1N4001
5V
Audio
Input
0.1PF
20k
3.3PF
1k
47k
5V Fan
MC05J3
10PF
Comair-Rotron
Figure 10. Audio Power Amplifier Thermal Protection
5V
HYST
GND
OS
V+
Heater
Supply
R1
(10k)
LM27
VTEMP
Heater
0.1
5V
Figure 11. Simple Thermostat
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REVISION HISTORY
Changes from Revision B (March 2013) to Revision C
Page
•
Deleted layout of National Data Sheet to TI format .............................................................................................................. 9
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PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
PACKAGING INFORMATION
Orderable Device
LM27CIM5-1HJ/NOPB
LM27CIM5-2HJ/NOPB
LM27CIM5-ZHJ/NOPB
LM27CIM5X-1HJ/NOPB
LM27CIM5X-2HJ/NOPB
LM27CIM5X-ZHJ/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
120 to 150
120 to 150
120 to 150
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
1000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
T1HJ
T2HJ
TZHJ
T1HJ
T2HJ
TZHJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
1000
1000
3000
3000
3000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM27CIM5-1HJ/NOPB
LM27CIM5-2HJ/NOPB
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
1000
1000
1000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
LM27CIM5-ZHJ/NOPB SOT-23
LM27CIM5X-1HJ/NOPB SOT-23
LM27CIM5X-2HJ/NOPB SOT-23
LM27CIM5X-ZHJ/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM27CIM5-1HJ/NOPB
LM27CIM5-2HJ/NOPB
LM27CIM5-ZHJ/NOPB
LM27CIM5X-1HJ/NOPB
LM27CIM5X-2HJ/NOPB
LM27CIM5X-ZHJ/NOPB
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
1000
1000
1000
3000
3000
3000
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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