LM2903BIDDFR [TI]
LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators;
| 型号： | LM2903BIDDFR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators |
| 文件： | 总55页 (文件大小：3799K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM393B, LM2903B, LM193, LM293,LM293A, LM393,LM393A,LM2903,LM2903V
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
LM393B, LM2903B, LM193, LM293, LM393 and LM2903 Dual Comparators
1 Features
3 Description
•
•
NEW LM393B and LM2903B
Improved specifications of B-version
– Maximum rating: up to 38 V
The LM393B and LM2903B devices are the next
generation versions of the industry-standard LM393
and LM2903 comparator family. These next
generation
B-version
comparators
provide
– ESD rating (HBM): 2k V
outstanding value for cost-sensitive applications
featuring lower offset voltage, higher supply voltage
capability, lower supply current, lower input bias
current, lower propagation delay, and improved 2 kV
ESD performance and input ruggedness through
dedicated ESD clamps. The LM393B and LM2903B
can drop-in replace the LM293, LM393 and LM2903,
for both "A" and "V" grades.
– Low input offset: 0.37 mV
– Low input bias current: 3.5 nA
– Low supply-current: 200 µA per comparator
– Faster response time of 1 µsec
– Extended temperature range for LM393B
– Available in tiny 2 x 2mm WSON package
B-version is drop-in replacement for LM293,
LM393 and LM2903, A and V versions
Common-mode input voltage range includes
ground
•
•
•
All devices consist of two independent voltage
comparators that are designed to operate from a
single power supply over a wide range of voltages.
Quiescent current is independent of the supply
voltage, and the outputs can be connected to other
open-collector outputs to achieve wired-AND
relationships.
Differential input voltage range equal to maximum-
rated supply voltage: ±38 V
Low output saturation voltage
•
•
Output compatible with TTL, MOS, and CMOS
Device Information
PART NUMBER
2 Applications
PACKAGE(1) BODY SIZE (NOM)
•
•
•
•
•
•
•
•
•
•
Vacuum robot
Single phase UPS
Server PSU
Cordless power tool
Wireless Infrastructure
Applicances
Building Automation
Factory automation & control
Motor drives
LM393B, LM2903B,
LM193, LM293, LM293A,
LM393, LM393A, LM2903,
LM2903V, LM2903AV
SOIC (8)
4.90 mm x 3.91 mm
3.00 mm x 3.00 mm
LM393B, LM2903B,
LM293, LM293A, LM393, VSSOP (8)
LM393A, LM2903
LM293, LM393, LM393A,
PDIP (8)
9.81 mm × 6.35 mm
6.20 mm x 5.30 mm
LM2903
LM393, LM393A, LM2903 SO (8)
LM393B, LM2903B,
LM393, LM393A, LM2903, TSSOP (8)
LM2903V, LM2903AV
Infotainment & cluster
3.00 mm x 4.40 mm
LM393B
SOT-23 (8)
WSON (8)
2.90 mm x 1.60 mm
2.00 mm × 2.00 mm
LM393B, LM2903B
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Family Comparison Table...............................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................6
7.4 Thermal Information: LM193.......................................6
7.5 Thermal Information: LM293, LM393, LM2903
(all 'V' and 'A' suffixes)...................................................6
7.6 Thermal Information: LM393B and LM2903B.............7
7.7 Electrical Characteristics LM393B.............................. 7
7.8 Electrical Characteristics LM2903B............................ 8
7.9 Switching Characteristics LM393B and LM2903B......8
7.10 Electrical Characteristics for LM193, LM293,
7.14 Typical Characteristics, LMx93, LM2903 (all 'V'
and 'A' suffixes)........................................................... 12
7.15 Typical Characteristics, LM393B and LM2903B..... 13
8 Detailed Description......................................................19
8.1 Overview...................................................................19
8.2 Functional Block Diagram.........................................19
8.3 Feature Description...................................................19
8.4 Device Functional Modes..........................................19
9 Application and Implementation..................................20
9.1 Application Information............................................. 20
9.2 Typical Application.................................................... 20
10 Power Supply Recommendations..............................23
11 Layout...........................................................................23
11.1 Layout Guidelines................................................... 23
11.2 Layout Example...................................................... 23
12 Device and Documentation Support..........................24
12.1 Related Links.......................................................... 24
12.2 Receiving Notification of Documentation Updates..24
12.3 Support Resources................................................. 24
12.4 Trademarks.............................................................24
12.5 Electrostatic Discharge Caution..............................24
12.6 Glossary..................................................................24
13 Mechanical, Packaging, and Orderable
and LM393 (without A suffix).........................................9
7.11 Electrical Characteristics for LM293A and
LM393A.......................................................................10
7.12 Electrical Characteristics for LM2903,
LM2903V, and LM2903AV...........................................11
7.13 Switching Characteristics: LM193, LM239,
Information.................................................................... 24
LM393, LM2903, all 'A' and 'V' versions...................... 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision AC (February 2020) to Revision AD (October 2020)
Page
•
Updated the numbering format for tables, figures and cross-references throughout the document...................1
Changes from Revision AB (December 2019) to Revision AC (February 2020)
Page
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Changed front page Features, Applications and Description text to highlight B version.................................... 1
Added WSON and SOT-23-8 packages............................................................................................................. 1
Added Links to Family Table ..............................................................................................................................3
Added DDF and DSG pkgs to Thermal Table.....................................................................................................7
Changes from Revision AA (September 2019) to Revision AB (December 2019)
Page
Changed LM393B and LM2903B from Preview to Active status........................................................................1
Added Family Comparison Table........................................................................................................................3
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Changes from Revision Z (October 2017) to Revision AA (September 2019)
Page
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Added "B" devices with various text changes throughout datasheet..................................................................1
Deleted from Device Information old LM193 CDIP and LCCC package references and drawings. These are
on the LM139-MIL datasheet..............................................................................................................................1
Added "B" devices Thermal Information table.................................................................................................... 7
Added "B" device electrical tables...................................................................................................................... 7
Added "B" device graphs .................................................................................................................................13
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•
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LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
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SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
5 Family Comparison Table
LM393
LM393A
LM2903V
LM2903AV
LM293
LM293A
Specification
Supply Votlage
LM393B LM2903B
3 to 36 3 to 36
LM2903
2 to 30
1 to 2.5
LM193
2 to 30
1 to 2.5
Units
V
2 to 30
1 to 2.5
2 to 32
1 to 2.5
2 to 30
1 to 2.5
Total Supply Current
(5V to 36V max)
0.6 to 0.8 0.6 to 0.8
−40 to 85 −40 to 125
mA
Temperature Range
ESD (HBM)
0 to 70
1000
−40 to 125
1000
−40 to 125
1000
−55 to 125 −25 to 85
°C
V
2000
± 4
2000
± 4
1000
± 9
1000
Offset Voltage
(Max over temp)
± 9
± 4
± 15
± 4
± 9
± 4
± 15
V
Input Bias Current (typ / max)
Response Time (typ)
3.5 / 25
1
3.5 / 25
1
25 / 250
1.3
25 / 250
1.3
25 / 250
1.3
25 / 100
1.3
25 / 250
1.3
nA
µsec
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LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
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6 Pin Configuration and Functions
1OUT
1IN−
1IN+
GND
VCC
1
2
3
4
8
7
6
5
2OUT
2IN−
2IN+
Figure 6-1. D, DGK, JG, P, PS, DDF or PW Package 8-Pin SOIC, VSSOP, PDIP, SO, or TSSOP Top View
8
V+
1OUT
1
2
Exposed
Thermal
Die Pad
on
1INœ
7
6
2OUT
2INœ
1IN+
GND
3
4
Underside
5
2IN+
Connect thermal pad directly to GND pin.
Figure 6-2. DSG Package 8-Pin WSON With Exposed Pad Top View
Table 6-1. Pin Functions
PIN
SOIC, VSSOP,
PDIP, SO, DDF and
TSSOP
I/O
DESCRIPTION
NAME
DSG
1OUT
1IN–
1IN+
GND
2IN+
2IN-
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Output
Input
Input
—
Output pin of comparator 1
Negative input pin of comparator 1
Positive input pin of comparator 1
Ground
Input
Input
Output
—
Positive input pin of comparator 2
Negative input pin of comparator 2
Output pin of comparator 2
Positive Supply
2OUT
VCC
Thermal
Pad
—
PAD
—
Connect directly to GND pin
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SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
36
UNIT
Non-B Versions
VCC Supply voltage(2)
–0.3
V
B Versions Only
38
Non-B Versions
-36
-38
36
VID
Differential input voltage(3)
V
B Versions Only
Non-B Versions
B Versions Only
38
36
VI
Input voltage (either input)
Input current(5)
–0.3
V
mA
V
38
IIK
VO
-50
36
Non-B Versions
B Versions Only
Non-B Versions
B Versions Only
Output voltage
–0.3
38
20
IO
Output current
mA
25
ISC
TJ
Duration of output short circuit to ground(4)
Operating virtual-junction temperature
Unlimited
150
150
°C
°C
Tstg Storage temperature
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Production Processing Does Not Necessarily Include Testing of All Parameters.
(2) All voltage values, except differential voltages, are with respect to network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and turns on parasitic transistors that increases ICC and may cause output to be
incorrect. Normal operation resumes when input current is removed.
7.2 ESD Ratings
VALUE
UNIT
LM393B and LM2903B Only
V(ESD) Electrostatic discharge
All Other Versions
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
±750
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
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7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
2
MAX
30
UNIT
non-V devices
Supply voltage, VS = (V+) – (V–)
Input voltage range, VIVR
V devices
2
32
V
"B" version devices
non-B devices
3
36
0
(V+) – 2.0
V
"B" version devices
LM193
–0.1
–55
–40
–40
–25
0
125
125
85
LM2903, LM2903V, LM2903AV, LM2903B
LM393B
Ambient temperature, TA
°C
LM293, LM293A
LM393, LM393A
85
70
7.4 Thermal Information: LM193
LM193
D
THERMAL METRIC(1)
UNIT
(SOIC)
8 pin
126.4
70
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
64.9
20.3
64.5
n/a
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information: LM293, LM393, LM2903 (all 'V' and 'A' suffixes)
LM293, LM393, LM2903
D
DGK
P
PS
(SO)
PW
(TSSOP)
THERMAL METRIC(1)
UNIT
(SOIC) (VSSOP) (PDIP)
8 pin
131.8
78.4
72.2
26.5
71.1
8 pin
199.4
90.2
8 pin
73.7
62.6
50.8
39.2
50.7
8 pin
139
98.9
83.7
47.4
83
8 pin
194.1
77.0
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
RθJB
ψJT
Junction-to-board thermal resistance
120.8
21.5
123.0
13.1
Junction-to-top characterization parameter
Junction-to-board characterization parameter
ψJB
119.1
121.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
7.6 Thermal Information: LM393B and LM2903B
LM393B, LM2903B
DGK DDF
D
PW
DSG
THERMAL METRIC(1)
UNIT
(SOIC) (TSSOP) (VSSOP) (SOT-23) (WSON)
8 pin
148.5
90.2
91.8
38.5
91.1
-
8 pin
200.6
89.6
131.3
22.1
129.6
-
8 pin
193.7
82.9
115.5
20.8
113.9
-
8 pin
197.9
119.2
115.4
19.4
113.7
-
8 pins
96.9
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
119.0
63.1
RθJB
ψJT
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
12.4
ψJB
63.0
RθJC(bot) Junction-to-case (bottom) thermal resistance
37.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.7 Electrical Characteristics LM393B
VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
–2.5
–4
TYP
MAX
UNIT
VS = 5 to 36V
±0.37
2.5
VIO
Input offset voltage
mV
VS = 5 to 36V, TA = –40°C to +85°C
4
–25
–3.5
±0.5
nA
nA
nA
nA
V
IB
Input bias current
Input offset current
TA = –40°C to +85°C
–50
–10
–25
10
IOS
TA = –40°C to +85°C
25
VCM
VCM
Common mode range
Common mode range
VS = 3 to 36V
(V–)
(V–)
(V+) – 1.5
(V+) – 2.0
VS = 3 to 36V, TA = –40°C to +85°C
V
Large signal differential voltage
amplification
VS = 15V, VO = 1.4V to 11.4V;
RL ≥ 15k to (V+)
AVD
50
200
110
V/mV
mV
ISINK ≤ 4mA, VID = -1V
400
550
Low level output Voltage {swing
from (V–)}
VOL
ISINK ≤ 4mA, VID = -1V
TA = –40°C to +85°C
mV
(V+) = VO = 5 V; VID = 1V
0.1
0.3
21
20
50
nA
nA
mA
µA
µA
IOH-LKG
IOL
High-level output leakage current
Low level output current
(V+) = VO = 36V; VID = 1V
VOL = 1.5V; VID = -1V; VS = 5V
VS = 5 V, no load
6
400
550
600
800
IQ
Quiescent current (all comparators)
VS = 36 V, no load, TA = –40°C to +85°C
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SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
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7.8 Electrical Characteristics LM2903B
VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
–2.5
–4
TYP
MAX
UNIT
VS = 5 to 36V
±0.37
2.5
VIO
Input offset voltage
mV
VS = 5 to 36V, TA = –40°C to +125°C
4
–25
–3.5
±0.5
nA
nA
nA
nA
V
IB
Input bias current
TA = –40°C to +125°C
–50
–10
–25
10
IOS
Input offset current
Common mode range
TA = –40°C to +125°C
VS = 3 to 36V
25
(V–)
(V–)
(V+) – 1.5
(V+) – 2.0
VCM
VS = 3 to 36V, TA = –40°C to +125°C
V
Large signal differential voltage
amplification
VS = 15V, VO = 1.4V to 11.4V;
RL ≥ 15k to (V+)
AVD
50
200
110
V/mV
mV
ISINK ≤ 4mA, VID = -1V
400
550
Low level output Voltage {swing
from (V–)}
VOL
ISINK ≤ 4mA, VID = -1V
TA = –40°C to +125°C
mV
(V+) = VO = 5 V; VID = 1V
0.1
0.3
21
20
50
nA
nA
mA
µA
µA
IOH-LKG
IOL
High-level output leakage current
Low level output current
(V+) = VO = 36V; VID = 1V
VOL = 1.5V; VID = -1V; VS = 5V
VS = 5 V, no load
6
400
550
600
800
IQ
Quiescent current (all comparators)
VS = 36 V, no load, TA = –40°C to +125°C
7.9 Switching Characteristics LM393B and LM2903B
VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Propagation delay time, high-to-low;
TTL input signal (1)
tresponse
tresponse
TTL input with Vref = 1.4V
300
ns
Propagation delay time, high-to-low;
Small scale input signal (1)
Input overdrive = 5mV, Input step = 100mV
1000
ns
(1) High-to-low and low-to-high refers to the transition at the input.
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SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
7.10 Electrical Characteristics for LM193, LM293, and LM393 (without A suffix)
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM293
LM393
LM193
(1)
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
TYP MAX
MIN TYP
MAX
VCC = 5 V to 30 V,
VIC = VICR min,
VO = 1.4 V
25°C
2
5
9
2
5
VIO
Input offset voltage
mV
Full range
9
25°C
Full range
25°C
3
25
5
–25
50
250
IIO
Input offset current
Input bias current
VO = 1.4 V
VO = 1.4 V
nA
nA
100
–25 –100
–300
–250
–400
IIB
Full range
0 to
VCC – 1.5
0 to
VCC – 1.5
25°C
Common-mode input-voltage
range(2)
VICR
V
0 to
VCC – 2
0 to
VCC – 2
Full range
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
Large-signal differential-voltage
amplification
AVD
25°C
50
200
50
200
0.1
V/mV
VOH = 5 V
VID = 1 V
25°C
Full range
25°C
0.1
50
1
nA
µA
IOH
High-level output current
VOH = 30 V
VID = 1 V
1
150
0.8
400
700
130
400
700
VOL
IOL
Low-level output voltage
Low-level output current
Supply current
IOL = 4 mA,
VOL = 1.5 V,
RL = ∞
VID = –1 V
mV
mA
mA
Full range
25°C
VID = –1 V
VCC = 5 V
VCC = 30 V
6
6
25°C
1
0.45
0.55
1
ICC
Full range
2.5
2.5
(1) Full range (minimum or maximum) for LM193 is –55°C to 125°C, for LM293 is –25°C to 85°C, and for LM393 is 0°C to 70°C. All
characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) The voltage at either input should not be allowed to go negative by more than 0.3 V otherwise output may be incorrect and excessive
input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be
in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state.
Either or both inputs can go to maximum VCC level without damage.
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7.11 Electrical Characteristics for LM293A and LM393A
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM293A
LM393A
(1)
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
TYP
MAX
25°C
Full range
25°C
1
2
4
VCC = 5 V to 30 V, VO = 1.4 V
VIC = VICR(min)
VIO
IIO
IIB
Input offset voltage
Input offset current
Input bias current
mV
nA
nA
5
50
VO = 1.4 V
VO = 1.4 V
Full range
25°C
150
–250
–400
–25
Full range
0 to
VCC – 1.5
25°C
Full range
25°C
VICR
Common-mode input-voltage range(2)
V
0 to
VCC – 2
Large-signal differential-voltage
amplification
VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
AVD
50
200
0.1
V/mV
VOH = 5 V,
VID = 1 V
VID = 1 V
25°C
Full range
25°C
50
1
nA
µA
IOH
High-level output current
VOH = 30 V,
110
400
700
VOL
IOL
Low-level output voltage
Low-level output current
Supply current
IOL = 4 mA,
VOL = 1.5 V,
RL = ∞
VID = –1 V
mV
mA
mA
Full range
25°C
VID = –1 V,
VCC = 5 V
VCC = 30 V
6
25°C
0.60
0.72
1
ICC
Full range
2.5
(1) Full range (minimum or maximum) for LM293A is –25°C to 85°C, and for LM393A is 0°C to 70°C. All characteristics are measured with
zero common-mode input voltage, unless otherwise specified.
(2) The voltage at either input should not be allowed to go negative by more than 0.3 V otherwise output may be incorrect and excessive
input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be
in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state.
Either or both inputs can go to maximum VCC level without damage.
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7.12 Electrical Characteristics for LM2903, LM2903V, and LM2903AV
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM2903, LM2903V
LM2903AV
(1)
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN TYP MAX
MIN TYP MAX
VCC = 5 V to MAX(2)
VO = 1.4 V,
,
25°C
2
5
7
1
5
2
4
VIO
Input offset voltage
mV
Full range
15
VIC = VICR(min)
,
25°C
Full range
25°C
50
50
IIO
Input offset current
Input bias current
VO = 1.4 V
VO = 1.4 V
nA
nA
200
200
–25 –250
–500
–25 –250
–500
IIB
Full range
0 to
VCC – 1.5
0 to
VCC – 1.5
25°C
Full range
25°C
Common-mode input-
voltage range(3)
VICR
V
0 to
VCC – 2
0 to
VCC – 2
Large-signal differential- VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD
25
100
25
100
V/mV
voltage amplification
RL ≥ 15 kΩ to VCC
VOH = 5 V,
VID = 1 V
VID = 1 V
25°C
Full range
25°C
0.1
50
1
0.1
50
1
nA
µA
IOH
High-level output current
VOH = VCC MAX(2)
,
150
400
700
150
400
700
VOL
IOL
Low-level output voltage IOL = 4 mA,
Low-level output current VOL = 1.5 V,
VID = –1 V,
mV
mA
mA
Full range
25°C
VID = –1 V
VCC = 5 V
VCC = MAX
6
6
25°C
0.8
1
0.8
1
ICC
Supply current
RL = ∞
Full range
2.5
2.5
(1) Full range (minimum or maximum) for LM2903 is –40°C to 125°C. All characteristics are measured with zero common-mode input
voltage, unless otherwise specified.
(2) VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
(3) The voltage at either input should not be allowed to go negative by more than 0.3 V otherwise output may be incorrect and excessive
input current can flow. The upper end of the common-mode voltage range is limited by VCC – 2V. However only one input needs to be
in the valid common mode range, the other input can go up the maximum VCC level and the comparator provides a proper output state.
Either or both inputs can go to maximum VCC level without damage.
7.13 Switching Characteristics: LM193, LM239, LM393, LM2903, all 'A' and 'V' versions
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
1.3
UNIT
100-mV input step with 5-mV overdrive
TTL-level input step
RL connected to 5 V through 5.1 kΩ,
CL = 15 pF(1) (2)
Response time
µs
0.3
(1) CL includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
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7.14 Typical Characteristics, LMx93, LM2903 (all 'V' and 'A' suffixes)
TA= 25°C, VS= 5V, RPULLUP=5.1k, CL = 15 pF, VCM=0V unless otherwise noted.
80
70
60
50
40
30
20
10
0
1.8
1.6
1.4
1.2
1
TA = –55°C
TA = –55°C
TA = 25°C
TA = 0°C
TA = 0°C
TA = 25°C
TA = 70°C
TA = 70°C
0.8
0.6
0.4
0.2
0
TA = 125°C
TA = 125°C
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
VCC – Supply Voltage – V
VCC – Supply Voltage – V
Figure 7-1. Supply Current vs Supply Voltage
Figure 7-2. Input Bias Current vs Supply Voltage
6
10
5
Overdrive = 5 mV
1
4
TA = 125°C
Overdrive = 20 mV
3
TA = 25°C
0.1
Overdrive = 100 mV
TA = –55°C
2
1
0
0.01
0.001
-1
0.01
0.1
1
10
100
-0.3
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25
IO – Output Sink Current – mA
t – Time – µs
Figure 7-4. Response Time for Various Overdrives
Negative Transition
Figure 7-3. Output Saturation Voltage
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6
5
Overdrive = 5 mV
4
Overdrive = 20 mV
3
Overdrive = 100 mV
2
1
0
-1
-0.3
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25
t – Time – µs
Figure 7-5. Response Time for Various Overdrives Positive Transition
7.15 Typical Characteristics, LM393B and LM2903B
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV
unless otherwise noted.
550
525
500
475
450
425
400
375
350
325
300
275
250
500
460
420
380
340
300
260
220
180
140
100
No Load, Output High
-40°C
0°C
25°C
85°C
125°C
-40°C
25°C
85°C
125°C
VS=3V
-0.5 -0.25
0
0.25 0.5 0.75 1
Input Voltage (V)
1.25 1.5 1.75
2
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
Figure 7-7. Total Supply Current vs. Input Voltage
at 3V
Figure 7-6. Total Supply Current vs. Supply Voltage
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500
460
420
380
340
300
260
220
180
140
100
500
460
420
380
340
300
260
220
180
140
100
-40°C
0°C
25°C
85°C
125°C
-40°C
0°C
25°C
85°C
125°C
VS=3.3V
-0.5 -0.25
VS=5V
-0.5
0
0.25 0.5 0.75 1
Input Voltage (V)
1.25 1.5 1.75
2
0
0.5
1
1.5 2
Input Voltage (V)
2.5
3
3.5
4
Figure 7-8. Total Supply Current vs. Input Voltage
at 3.3V
Figure 7-9. Total Supply Current vs. Input Voltage
at 5V
500
460
420
380
340
300
260
550
510
470
430
390
350
310
220
270
-40°C
0°C
25°C
85°C
125°C
-40°C
0°C
25°C
85°C
125°C
180
230
140
190
VS=12V
VS=36V
100
150
-1
0
1
2
3
4
5
6
Input Voltage (V)
7
8
9
10 11
0
3
6
9
12 15 18 21 24 27 30 33 36
Input Voltage (V)
Figure 7-10. Total Supply Current vs. Input Voltage
at 12V
Figure 7-11. Total Supply Current vs. Input Voltage
at 36V
2
1.5
1
2
1.5
1
0.5
0
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
VS = 3V
63 Channels
-1.5
-2
VS = 5V
62 Channels
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Figure 7-12. Input Offset Voltage vs. Temperature
at 3V
Figure 7-13. Input Offset Voltage vs. Temperature
at 5V
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2
1.5
1
2
1.5
1
0.5
0
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
VS = 12V
62 Channels
-1.5
-2
VS = 36V
62 Channels
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Figure 7-14. Input Offset Voltage vs. Temperature
at 12V
Figure 7-15. Input Offset Voltage vs. Temperature
at 36
2
1.5
1
2
1.5
1
0.5
0
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
TA = -40°C
62 Channels
-1.5
-2
TA = 25°C
62 Channels
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
Figure 7-16. Input Offset Voltage vs. Supply
Voltage at -40°C
Figure 7-17. Input Offset Voltage vs. Supply
Voltage at 25°C
2
1.5
1
2
1.5
1
0.5
0
0.5
0
-0.5
-1
-0.5
-1
TA = 125èC
62 Channels
-1.5
-2
TA = 85°C
62 Channels
-1.5
-2
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
Figure 7-18. Input Offset Voltage vs. Supply
Voltage at 85°C
Figure 7-19. Input Offset Voltage vs. Supply
Voltage at 125°C
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0
-0.5
-1
0
-0.5
-1
125°C
85°C
25°C
0°C
VCM=0V
VS=5V
-40°C
-1.5
-2
-1.5
-2
-2.5
-3
-2.5
-3
125°C
85°C
25°C
0°C
-3.5
-4
-3.5
-4
-4.5
-5
-4.5
-5
-40°C
-0.5
0
0.5
1
1.5
2
Input Voltage (V)
2.5
3
3.5
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
Figure 7-21. Input Bias Current vs. Input Voltage at
5V
Figure 7-20. Input Bias Current vs. Supply Voltage
0
1
VS=12V
-0.5
VS=36V
0.5
0
-1
-1.5
-2
-0.5
-1
-1.5
-2
-2.5
-3
-2.5
-3
125°C
85°C
25°C
0°C
-3.5
-4
125°C
85°C
25°C
0°C
-3.5
-4
-4.5
-5
-4.5
-5
-40°C
-40°C
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5
Input Voltage (V)
0
4
8
12
16 20
Input Voltage (V)
24
28
32
36
Figure 7-22. Input Bias Current vs. Input Voltage at
12V
Figure 7-23. Input Bias Current vs. Input Voltage at
36V
10
10
VS = 3V
VS = 5V
1
1
100m
100m
125°C
125°C
10m
1m
10m
1m
85°C
25°C
0°C
85°C
25°C
0°C
-40°C
-40°C
10m
100m
1m
Output Sinking Current (A)
10m
100m
10m
100m
1m
Output Sinking Current (A)
10m
100m
Figure 7-24. Output Low Voltage vs. Output
Sinking Current at 3V
Figure 7-25. Output Low Voltage vs. Output
Sinking Current at 5V
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10
10
VS = 12V
VS = 36V
1
100m
10m
1m
1
100m
125°C
85°C
25°C
0°C
125°C
85°C
25°C
0°C
10m
1m
-40°C
-40°C
10m
100m
1m
Output Sinking Current (A)
10m
100m
10m
100m
1m
Output Sinking Current (A)
10m
100m
Figure 7-26. Output Low Voltage vs. Output
Sinking Current at 12V
Figure 7-27. Output Low Voltage vs.Output Sinking
Current at 36V
100
100
50 Output set high
VOUT = VS
20
50 Output set high
VOUT = VS
20
10
5
10
5
2
1
2
1
0.5
0.5
0.2
0.1
0.2
0.1
0.05
0.05
0.02
0.01
0.02
0.01
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
Figure 7-28. Output High Leakage Current
vs.Temperature at 5V
Figure 7-29. Output High Leakage Current vs.
Temperature at 36V
1000
1000
125°C
85°C
25°C
-40°C
125°C
85°C
25°C
-40°C
VS = 5V
VS = 5V
900
800
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
VCM = 0V
CL = 15pF
RP = 5.1k
VCM = 0V
CL = 15pF
RP = 5.1k
5
10
100
Input Overdrive (mV)
1000
5
10
100
Input Overdrive (mV)
1000
Figure 7-30. High to Low Propagation Delay vs.
Input Overdrive Voltage, 5V
Figure 7-31. Low to High Propagation Delay vs.
Input Overdrive Voltage, 5V
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1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
125°C
85°C
25°C
-40°C
125°C
85°C
25°C
-40°C
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
5
10
100
Input Overdrive (mV)
1000
5
10
100
Input Overdrive (mV)
1000
Figure 7-32. High to Low Propagation Delay vs.
Input Overdrive Voltage, 12V
Figure 7-33. Low to High Propagation Delay vs.
Input Overdrive Voltage, 12V
1000
1000
125°C
85°C
25°C
-40°C
125°C
85°C
25°C
-40°C
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
900
800
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
5
10
100
Input Overdrive (mV)
1000
5
10
100
Input Overdrive (mV)
1000
Figure 7-34. High to Low Propagation Delay vs.
Input Overdrive Voltage, 36V
Figure 7-35. Low to High Propagation Delay vs.
Input Overdrive Voltage, 36V
6
6
VREF = VCC/2
VREF = VCC/2
5
5
4
4
20mV Overdrive
20mV Overdrive
3
3
100mV
Overdrive
5mV
Overdrive
2
2
1
5mV Overdrive
100mV
1
Overdrive
0
0
-1
-1
-0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Time (ms)
1
1.1
-0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Time (ms)
1
1.1
Figure 7-36. Response Time for Various
Overdrives, High-to-Low Transition
Figure 7-37. Response Time for Various
Overdrives, Low-to-High Transition
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8 Detailed Description
8.1 Overview
These dual comparators have the ability to operate up to absolute maximum of 36 V (38 V for the "B" version) on
the supply pin. This device has proven ubiquity and versatility across a wide range of applications. This is due to
very wide supply voltages range, low Iq and fast response of the devices.
The open-drain output allows the user to configure the output's logic high voltage (VOH) and can be used to
enable the comparator to be used in AND functionality.
8.2 Functional Block Diagram
V
CC
80-µA
Current Regulator
80 µA
10 µA
60 µA
10 µA
COMPONENT COUNT
Epi-FET
Diodes
1
2
2
Resistors
IN+
IN−
OUT
Transistors 30
GND
Figure 8-1. Schematic (Each Comparator)
8.3 Feature Description
The comparator consists of a PNP darlington pair input, allowing the device to operate with very high gain and
fast response with minimal input bias current. The input Darlington pair creates a limit on the input common
mode voltage capability, allowing the comparator to accurately function from ground to VCC– 1.5 V input. Allow
for VCC– 2 V at cold temperature.
The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN sinks current when
the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is resistive
and scales with the output current. See Figure 7-3 for VOL values with respect to the output current.
8.4 Device Functional Modes
8.4.1 Voltage Comparison
The device operates solely as a voltage comparator, comparing the differential voltage between the positive and
negative pins and outputting a logic low or high impedance (logic high with pullup) based on the input differential
polarity.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The device is typically used to compare a single signal to a reference or two signals against each other. Many
users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an
MCU or logic device. The wide supply range and high voltage capability makes this comaprator optimal for level
shifting to a higher or lower voltage.
9.2 Typical Application
VLOGIC
Rpullup
VLOGIC
Rpullup
VSUP
VSUP
Vin
Vin+
Vin-
+
½ LM2903
+
½ LM2903
Vref
CL
CL
Figure 9-1. Single-Ended and Differential Comparator Configurations
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 9-1 as the input parameters.
Table 9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
0 V to Vsup-2 V
4.5 V to VCC maximum
0 V to VCC maximum
1 µA to 4 mA
100 mV
Input Voltage Range
Supply Voltage
Logic Supply Voltage
Output Current (RPULLUP
Input Overdrive Voltage
Reference Voltage
)
2.5 V
Load Capacitance (CL)
15 pF
9.2.2 Detailed Design Procedure
When using the device in a general comparator application, determine the following:
•
•
•
•
Input Voltage Range
Minimum Overdrive Voltage
Output and Drive Current
Response Time
9.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to
account. If temperature operation is below 25°C the VICR can range from 0 V to VCC– 2.0 V. This limits the input
voltage range to as high as VCC– 2.0 V and as low as 0 V. Operation outside of this range can yield incorrect
comparisons.
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LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
www.ti.com
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
The following is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common-mode range:
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not
conducting
2. When IN- is higher than common-mode and IN+ is within common-mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common-mode and IN- is within common-mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common-mode, the output is low and the output transistor is sinking
current
9.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the
comparator over the offset voltage (VIO). To make an accurate comparison the Overdrive Voltage (VOD) should
be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the
comparator, with the response time decreasing with increasing overdrive. Figure 9-2 and Figure 9-3 show
positive and negative response times with respect to overdrive voltage.
9.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pullup voltage. The output current produces
a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use Section
7.14 to determine VOL based on the output current.
The output current can also effect the transient response. See Section 9.2.2.4 for more information.
9.2.2.4 Response Time
Response time is a function of input over drive. See Section 9.2.3 for typical response times. The rise and falls
times can be determined by the load capacitance (CL), load/pullup resistance (RPULLUP) and equivalent collector-
emitter resistance (RCE).
•
•
The rise time (τR) is approximately τR ~ RPULLUP × CL
The fall time (τF) is approximately τF ~ RCE × CL
– RCE can be determine by taking the slope of Section 7.14 in its linear region at the desired temperature, or
by dividing the VOL by Iout
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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V
LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
www.ti.com
9.2.3 Application Curves
The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe.
6
5
6
5
4
4
3
3
5mV OD
2
2
5mV OD
1
1
20mV OD
20mV OD
100mV OD
0
0
100mV OD
2.25
œ1
-0.25
œ1
0.25
0.75
1.25
1.75
œ0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec)
Time (usec)
C004
C006
Figure 9-2. Response Time for Various Overdrives Figure 9-3. Response Time for Various Overdrives
(Positive Transition) (Negative Transition)
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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V
LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
www.ti.com
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
10 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, TI recommends to use a bypass
capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the input
common-mode range of the comparator and create an inaccurate comparison.
11 Layout
11.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches. To achieve this, it is best to add a bypass capacitor between the supply voltage
and ground. This should be implemented on the positive power supply and negative supply (if available). If a
negative supply is not being used, do not put a capacitor between the IC's GND pin and system ground.
Minimize coupling between outputs and inverting inputs to prevent output oscillations. Do not run output and
inverting input traces in parallel unless there is a VCC or GND trace between output and inverting input traces to
reduce coupling. When series resistance is added to inputs, place resistor close to the device.
11.2 Layout Example
Ground
Better
0.1mF
VCC
1
2
3
4
8
7
6
5
1OUT
1IN-
VCC
2OUT
2IN-
Input Resistors
Close to device
OK
VCC or GND
1IN+
GND
Ground
2IN+
Figure 11-1. LM2903 Layout Example
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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V
LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V
SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020
www.ti.com
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 12-1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
LM193
LM293
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
LM293A
LM393
LM393A
LM2903
LM2903V
LM393B
LM2903B
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM193DR
LM193DRG4
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
8
8
8
2500
2500
2500
2500
2000
2000
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM193
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
LM193
LM2903AVQDR
LM2903AVQDRG4
LM2903AVQPWR
LM2903AVQPWRG4
LM2903BIDDFR
SOIC
D
Green (RoHS
& no Sb/Br)
L2903AV
L2903AV
L2903AV
L2903AV
2903B
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
PW
PW
DDF
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
ACTIVE SOT-23-THIN
Green (RoHS
& no Sb/Br)
LM2903BIDGKR
LM2903BIDR
PREVIEW
ACTIVE
VSSOP
SOIC
DGK
D
8
8
2500
2500
TBD
Call TI
Call TI
-40 to 125
-40 to 125
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
L2903B
LM2903BIDSGR
LM2903BIPWR
LM2903D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WSON
TSSOP
SOIC
DSG
PW
D
8
8
8
8
8
8
8
8
3000
2000
75
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
903B
Green (RoHS
& no Sb/Br)
L2903B
Green (RoHS
& no Sb/Br)
LM2903
LM2903DE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM2903
LM2903DG4
LM2903DGKR
LM2903DGKRG4
LM2903DR
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM2903
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(MAP, MAS, MAU)
(MAP, MAS, MAU)
LM2903
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
NIPDAU | SN
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
2500
2500
50
(1)
(2)
(3)
(4/5)
(6)
LM2903DRE4
LM2903DRG3
LM2903DRG4
LM2903P
ACTIVE
SOIC
SOIC
SOIC
PDIP
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-25 to 85
LM2903
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
Green (RoHS
& no Sb/Br)
SN
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU | SN
SN
LM2903
LM2903
LM2903P
L2903
D
Green (RoHS
& no Sb/Br)
P
Green (RoHS
& no Sb/Br)
LM2903PSR
SO
PS
PS
PW
PW
PW
D
2000
2000
2000
2000
2000
75
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LM2903PSRG4
LM2903PWR
SO
Green (RoHS
& no Sb/Br)
L2903
TSSOP
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
TSSOP
TSSOP
SOIC
Green (RoHS
& no Sb/Br)
L2903
LM2903PWRG3
LM2903PWRG4
LM2903QD
Green (RoHS
& no Sb/Br)
L2903
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
L2903
Green (RoHS
& no Sb/Br)
2903Q
2903Q
2903Q
L2903V
L2903V
L2903V
L2903V
LM293A
LM2903QDG4
LM2903QDRG4
LM2903VQDR
LM2903VQDRG4
LM2903VQPWR
LM2903VQPWRG4
LM293AD
D
75
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
2000
2000
75
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
PW
PW
D
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM293ADE4
LM293ADGKR
LM293ADGKRG4
LM293ADR
LM293ADRG4
LM293D
ACTIVE
SOIC
VSSOP
VSSOP
SOIC
D
DGK
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
0 to 70
LM293A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
2500
2500
2500
2500
75
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(MDP, MDS, MDU)
(MDP, MDS, MDU)
LM293A
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
LM293A
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
LM293
LM293DGKR
LM293DGKRG4
LM293DR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(MCP, MCS, MCU)
(MCP, MCS, MCU)
LM293
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
LM293DRE4
LM293DRG3
LM293DRG4
LM293P
SOIC
D
Green (RoHS
& no Sb/Br)
LM293
SOIC
D
Green (RoHS
& no Sb/Br)
LM293
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
NIPDAU
NIPDAU
NIPDAU
LM293
PDIP
P
Green (RoHS
& no Sb/Br)
LM293P
LM293PE4
PDIP
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
LM293P
LM393AD
SOIC
D
75
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LM393A
LM393ADE4
LM393ADG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM393A
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM393A
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
DGK
DGK
D
Qty
2500
2500
2500
2500
2500
50
(1)
(2)
(3)
(4/5)
(6)
LM393ADGKR
LM393ADGKRG4
LM393ADR
ACTIVE
VSSOP
VSSOP
SOIC
8
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-40 to 85
(M8P, M8S, M8U)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
(M8P, M8S, M8U)
LM393A
LM393A
LM393A
LM393AP
LM393AP
L393A
Green (RoHS
& no Sb/Br)
LM393ADRE4
LM393ADRG4
LM393AP
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
PDIP
P
Green (RoHS
& no Sb/Br)
NIPDAU | SN
NIPDAU
LM393APE4
PDIP
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
LM393APSR
SO
PS
2000
2000
2000
2000
3000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LM393APWR
LM393APWRE4
LM393APWRG4
LM393BIDDFR
TSSOP
TSSOP
TSSOP
PW
PW
PW
DDF
Green (RoHS
& no Sb/Br)
NIPDAU | SN
NIPDAU
L393A
Green (RoHS
& no Sb/Br)
L393A
Green (RoHS
& no Sb/Br)
NIPDAU
L393A
ACTIVE SOT-23-THIN
Green (RoHS
& no Sb/Br)
NIPDAU
393B
LM393BIDGKR
LM393BIDR
PREVIEW
ACTIVE
VSSOP
SOIC
DGK
D
8
8
2500
2500
TBD
Call TI
Call TI
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
LM393B
393B
LM393BIDSGR
LM393BIPWR
LM393D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WSON
TSSOP
SOIC
DSG
PW
D
8
8
8
8
3000
2000
75
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
0 to 70
Green (RoHS
& no Sb/Br)
LM393B
LM393
LM393
Green (RoHS
& no Sb/Br)
LM393DE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM393DG4
LM393DGKR
LM393DGKRG4
LM393DR
ACTIVE
SOIC
VSSOP
VSSOP
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-40 to 125
LM393
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(M9P, M9S, M9U)
(M9P, M9S, M9U)
LM393
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
Green (RoHS
& no Sb/Br)
LM393DRE4
LM393DRG3
LM393DRG4
LM393P
SOIC
D
Green (RoHS
& no Sb/Br)
LM393
SOIC
D
Green (RoHS
& no Sb/Br)
LM393
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
SN
LM393
PDIP
P
Green (RoHS
& no Sb/Br)
LM393P
LM393P
LM393P
L393
LM393PE3
PDIP
P
50
Pb-Free
(RoHS)
LM393PE4
PDIP
P
50
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU | SN
SN
LM393PSR
SO
PS
PS
PW
PW
PW
PW
PW
DGK
2000
2000
150
Green (RoHS
& no Sb/Br)
LM393PSRG4
LM393PW
SO
Green (RoHS
& no Sb/Br)
L393
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
VSSOP
Green (RoHS
& no Sb/Br)
L393
LM393PWG4
LM393PWR
LM393PWRG3
LM393PWRG4
PLM2903BIDGKR
150
Green (RoHS
& no Sb/Br)
L393
2000
2000
2000
2500
Green (RoHS
& no Sb/Br)
L393
Green (RoHS
& no Sb/Br)
L393
Green (RoHS
& no Sb/Br)
NIPDAU
Call TI
L393
TBD
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PLM393BIDGKR
ACTIVE
VSSOP
DGK
8
2500
TBD
Call TI
Call TI
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903, LM2903B, LM293 :
Automotive: LM2903-Q1, LM2903B-Q1
•
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2020
Enhanced Product: LM293-EP
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM193DR
SOIC
SOIC
D
D
8
8
8
8
8
2500
2500
2000
2000
3000
330.0
330.0
330.0
330.0
180.0
12.4
12.5
12.4
12.4
8.4
6.4
6.4
7.0
7.0
3.2
5.2
5.2
3.6
3.6
3.2
2.1
2.1
1.6
1.6
1.4
8.0
8.0
8.0
8.0
4.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q3
LM2903AVQDR
LM2903AVQPWR
LM2903AVQPWRG4
LM2903BIDDFR
TSSOP
TSSOP
PW
PW
DDF
SOT-
23-THIN
LM2903BIDR
LM2903BIDSGR
LM2903BIPWR
LM2903DGKR
LM2903DR
SOIC
WSON
TSSOP
VSSOP
SOIC
D
DSG
PW
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
2500
3000
2000
2500
2500
2500
2500
2500
2500
2500
2500
2000
330.0
180.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
8.4
6.4
2.3
7.0
5.3
6.4
6.4
6.4
6.4
6.4
6.4
6.4
7.0
5.2
2.3
3.6
3.4
5.2
5.2
5.2
5.2
5.2
5.2
5.2
3.6
2.1
1.15
1.6
1.4
2.1
2.1
2.1
2.1
2.1
2.1
2.1
1.6
8.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
Q1
Q2
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
12.4
12.4
12.4
12.4
12.8
15.4
12.8
12.4
12.4
12.4
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
LM2903DR
SOIC
D
LM2903DR
SOIC
D
LM2903DR
SOIC
D
LM2903DRG3
LM2903DRG4
LM2903DRG4
LM2903PWR
SOIC
D
SOIC
D
SOIC
D
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2020
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2903PWR
LM2903PWRG3
LM2903PWRG4
LM2903QDRG4
LM2903VQDR
LM2903VQPWR
LM2903VQPWRG4
LM293ADGKR
LM293ADR
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2000
2000
2000
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
3000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
180.0
12.4
12.4
12.4
12.4
12.5
12.4
12.4
12.4
12.4
12.4
15.4
12.8
12.4
12.4
12.4
12.8
12.4
12.8
12.4
12.4
12.4
12.4
12.4
12.8
15.4
12.4
12.4
12.4
12.4
12.4
8.4
7.0
7.0
7.0
6.4
6.4
7.0
7.0
5.3
6.4
6.4
6.4
6.4
6.4
6.4
5.3
6.4
6.4
6.4
6.4
6.4
5.3
6.4
6.4
6.4
6.4
6.4
6.4
7.0
7.0
7.0
3.2
3.6
3.6
3.6
5.2
5.2
3.6
3.6
3.4
5.2
5.2
5.2
5.2
5.2
5.2
3.4
5.2
5.2
5.2
5.2
5.2
3.4
5.2
5.2
5.2
5.2
5.2
5.2
3.6
3.6
3.6
3.2
1.6
1.6
1.6
2.1
2.1
1.6
1.6
1.4
2.1
2.1
2.1
2.1
2.1
2.1
1.4
2.1
2.1
2.1
2.1
2.1
1.4
2.1
2.1
2.1
2.1
2.1
2.1
1.6
1.6
1.6
1.4
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q3
SOIC
D
TSSOP
TSSOP
VSSOP
SOIC
PW
PW
DGK
D
LM293ADR
SOIC
D
LM293ADR
SOIC
D
LM293ADR
SOIC
D
LM293ADRG4
LM293ADRG4
LM293DGKR
LM293DR
SOIC
D
SOIC
D
VSSOP
SOIC
DGK
D
LM293DR
SOIC
D
LM293DRG3
LM293DRG4
LM293DRG4
LM393ADGKR
LM393ADR
SOIC
D
SOIC
D
SOIC
D
VSSOP
SOIC
DGK
D
LM393ADR
SOIC
D
LM393ADR
SOIC
D
LM393ADR
SOIC
D
LM393ADRG4
LM393ADRG4
LM393APWR
LM393APWR
LM393APWRG4
LM393BIDDFR
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
PW
PW
PW
DDF
SOT-
23-THIN
LM393BIDR
LM393BIDSGR
LM393BIPWR
LM393DGKR
LM393DR
SOIC
WSON
TSSOP
VSSOP
SOIC
D
DSG
PW
DGK
D
8
8
8
8
8
8
8
8
8
8
8
2500
3000
2000
2500
2500
2500
2500
2500
2500
2500
2000
330.0
180.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
8.4
6.4
2.3
7.0
5.3
6.4
6.4
6.4
6.4
6.4
6.4
7.0
5.2
2.3
3.6
3.4
5.2
5.2
5.2
5.2
5.2
5.2
3.6
2.1
1.15
1.6
1.4
2.1
2.1
2.1
2.1
2.1
2.1
1.6
8.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
Q1
Q2
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
12.4
12.4
12.4
12.4
15.4
12.8
12.4
12.4
12.4
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
LM393DR
SOIC
D
LM393DRG3
LM393DRG3
LM393DRG4
LM393DRG4
LM393PWR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
TSSOP
PW
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2020
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM393PWR
LM393PWRG3
LM393PWRG4
TSSOP
TSSOP
TSSOP
PW
PW
PW
8
8
8
2000
2000
2000
330.0
330.0
330.0
12.4
12.4
12.4
7.0
7.0
7.0
3.6
3.6
3.6
1.6
1.6
1.6
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM193DR
LM2903AVQDR
LM2903AVQPWR
LM2903AVQPWRG4
LM2903BIDDFR
LM2903BIDR
LM2903BIDSGR
LM2903BIPWR
LM2903DGKR
LM2903DR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2000
2000
3000
2500
3000
2000
2500
2500
2500
2500
2500
2500
350.0
340.5
853.0
853.0
210.0
340.5
210.0
853.0
364.0
340.5
853.0
364.0
333.2
364.0
350.0
338.1
449.0
449.0
185.0
338.1
185.0
449.0
364.0
338.1
449.0
364.0
345.9
364.0
43.0
20.6
35.0
35.0
35.0
20.6
35.0
35.0
27.0
20.6
35.0
27.0
28.6
27.0
TSSOP
TSSOP
SOT-23-THIN
SOIC
PW
PW
DDF
D
WSON
TSSOP
VSSOP
SOIC
DSG
PW
DGK
D
LM2903DR
SOIC
D
LM2903DR
SOIC
D
LM2903DR
SOIC
D
LM2903DRG3
SOIC
D
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2020
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2903DRG4
LM2903DRG4
LM2903PWR
LM2903PWR
LM2903PWRG3
LM2903PWRG4
LM2903QDRG4
LM2903VQDR
LM2903VQPWR
LM2903VQPWRG4
LM293ADGKR
LM293ADR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2000
2000
2000
2000
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
3000
2500
3000
2000
2500
2500
2500
2500
2500
2500
2500
853.0
340.5
853.0
364.0
364.0
853.0
350.0
340.5
853.0
853.0
364.0
853.0
340.5
333.2
364.0
340.5
853.0
364.0
364.0
853.0
364.0
340.5
853.0
364.0
340.5
853.0
364.0
333.2
853.0
340.5
364.0
853.0
853.0
210.0
340.5
210.0
853.0
364.0
853.0
340.5
333.2
364.0
340.5
853.0
449.0
338.1
449.0
364.0
364.0
449.0
350.0
338.1
449.0
449.0
364.0
449.0
338.1
345.9
364.0
338.1
449.0
364.0
364.0
449.0
364.0
338.1
449.0
364.0
338.1
449.0
364.0
345.9
449.0
338.1
364.0
449.0
449.0
185.0
338.1
185.0
449.0
364.0
449.0
338.1
345.9
364.0
338.1
449.0
35.0
20.6
35.0
27.0
27.0
35.0
43.0
20.6
35.0
35.0
27.0
35.0
20.6
28.6
27.0
20.6
35.0
27.0
27.0
35.0
27.0
20.6
35.0
27.0
20.6
35.0
27.0
28.6
35.0
20.6
27.0
35.0
35.0
35.0
20.6
35.0
35.0
27.0
35.0
20.6
28.6
27.0
20.6
35.0
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
SOIC
D
TSSOP
TSSOP
VSSOP
SOIC
PW
PW
DGK
D
LM293ADR
SOIC
D
LM293ADR
SOIC
D
LM293ADR
SOIC
D
LM293ADRG4
LM293ADRG4
LM293DGKR
LM293DR
SOIC
D
SOIC
D
VSSOP
SOIC
DGK
D
LM293DR
SOIC
D
LM293DRG3
LM293DRG4
LM293DRG4
LM393ADGKR
LM393ADR
SOIC
D
SOIC
D
SOIC
D
VSSOP
SOIC
DGK
D
LM393ADR
SOIC
D
LM393ADR
SOIC
D
LM393ADR
SOIC
D
LM393ADRG4
LM393ADRG4
LM393APWR
LM393APWR
LM393APWRG4
LM393BIDDFR
LM393BIDR
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
SOT-23-THIN
SOIC
PW
PW
PW
DDF
D
LM393BIDSGR
LM393BIPWR
LM393DGKR
LM393DR
WSON
TSSOP
VSSOP
SOIC
DSG
PW
DGK
D
LM393DR
SOIC
D
LM393DRG3
LM393DRG3
LM393DRG4
LM393DRG4
SOIC
D
SOIC
D
SOIC
D
SOIC
D
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Oct-2020
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM393PWR
LM393PWR
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
8
8
8
8
2000
2000
2000
2000
364.0
853.0
364.0
853.0
364.0
449.0
364.0
449.0
27.0
35.0
27.0
35.0
LM393PWRG3
LM393PWRG4
Pack Materials-Page 5
PACKAGE OUTLINE
DDF0008A
SOT-23 - 1.1 mm max height
S
C
A
L
E
4
.
0
0
0
PLASTIC SMALL OUTLINE
C
2.95
2.65
SEATING PLANE
TYP
PIN 1 ID
AREA
0.1 C
A
6X 0.65
8
1
2.95
2.85
NOTE 3
2X
1.95
4
5
0.4
0.2
8X
0.1
C A
B
1.65
1.55
B
1.1 MAX
0.20
0.08
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.1
0.0
0 - 8
0.6
0.3
DETAIL A
TYPICAL
4222047/B 11/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
1
8
8X (0.45)
SYMM
6X (0.65)
5
4
(R0.05)
TYP
(2.6)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222047/B 11/2015
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
(R0.05) TYP
8
1
8X (0.45)
SYMM
6X (0.65)
5
4
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4222047/B 11/2015
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
GENERIC PACKAGE VIEW
DSG 8
2 x 2, 0.5 mm pitch
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224783/A
www.ti.com
PACKAGE OUTLINE
DSG0008A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
B
A
PIN 1 INDEX AREA
2.1
1.9
0.32
0.18
0.4
0.2
ALTERNATIVE TERMINAL SHAPE
TYPICAL
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
EXPOSED
THERMAL PAD
(0.2) TYP
0.9 0.1
5
4
6X 0.5
2X
1.5
9
1.6 0.1
8
1
0.32
0.18
8X
0.4
0.2
PIN 1 ID
8X
0.1
C A B
C
0.05
4218900/D 04/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DSG0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.9)
(
0.2) VIA
8X (0.5)
TYP
1
8
8X (0.25)
(0.55)
SYMM
9
(1.6)
6X (0.5)
5
4
SYMM
(1.9)
(R0.05) TYP
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4218900/D 04/2020
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DSG0008A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.5)
METAL
8
SYMM
1
8X (0.25)
(0.45)
SYMM
9
(0.7)
6X (0.5)
5
4
(R0.05) TYP
(0.9)
(1.9)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4218900/D 04/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
8
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
SEATING PLANE
TYP
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
5
1
3.1
2.9
NOTE 3
2X
1.95
4
0.30
0.19
8X
4.5
4.3
1.2 MAX
B
0.1
C A
B
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 - 8
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
8X (0.45)
(R0.05)
1
4
TYP
8
SYMM
6X (0.65)
5
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
(R0.05) TYP
8X (0.45)
1
4
8
SYMM
6X (0.65)
5
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
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