LM2904BIDGKR [TI]
Industry-Standard Dual Operational Amplifiers;
| 型号： | LM2904BIDGKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Industry-Standard Dual Operational Amplifiers |
| 文件： | 总61页 (文件大小：4195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
Industry-Standard Dual Operational Amplifiers
1 Features
3 Description
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•
Wide supply range of 3 V to 36 V (B version)
Quiescent current: 300 µA per amplifier (B version,
typical)
Unity-gain bandwidth of 1.2 MHz (B version)
Common-mode input voltage range includes
ground, enabling direct sensing near ground
Low input offset voltage of 3 mV at 25°C (A and B
versions, maximum)
The LM358B and LM2904B devices are the
next-generation versions of the industry-standard
operational amplifiers (op amps) LM358 and LM2904,
which include two high-voltage (36 V) op amps.
These devices provide outstanding value for cost-
sensitive applications, with features including low
offset (300 µV, typical), common-mode input range to
ground, and high differential input voltage capability.
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Internal RF and EMI filter (B version)
The LM358B and LM2904B op amps simplify circuit
design with enhanced features such as unity-gain
stability, lower offset voltage of 3 mV (maximum at
room temperature), and lower quiescent current of
300 µA per amplifier (typical). High ESD (2 kV, HBM)
and integrated EMI and RF filters enable the LM358B
and LM2904B devices to be used in the most rugged,
environmentally challenging applications.
On products compliant to MIL-PRF-38535, all
parameters are tested unless otherwise noted. On
all other products, production processing does not
necessarily include testing of all parameters.
2 Applications
•
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Merchant network and server power supply units
Multi-function printers
Power supplies and mobile chargers
Motor control: AC induction, brushed DC,
brushless DC, high-voltage, low-voltage,
permanent magnet, and stepper motor
Desktop PC and motherboard
Indoor and outdoor air conditioners
Washers, dryers, and refrigerators
AC inverters, string inverters, central inverters, and
voltage frequency drives
The LM358B and LM2904B amplifiers are available
in micro-sized packaging, such as the SOT23-8, as
well as industry standard packages including SOIC,
TSSOP, and VSSOP.
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Device Information
PART NUMBER(1)
PACKAGE
BODY SIZE (NOM)
LM358B, LM2904B,
LM358, LM358A, LM2904, SOIC (8)
LM2904V, LM258, LM258A
4.90 mm × 3.90 mm
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•
•
Uninterruptible power supplies
Programmable logic controllers
Electronic point-of-sale systems
LM358B, LM2904B,
LM358, LM358A, LM2904, TSSOP (8)
LM2490V
3.00 mm × 4.40 mm
LM358B, LM2904B,
RG
RF
LM358, LM358A, LM2904, VSSOP (8) 3.00 mm × 3.00 mm
LM2904V, LM258, LM258A
LM358B, LM2904B
LM358, LM2904
SOT-23 (8) 2.90 mm × 1.60 mm
SO (8)
5.20 mm × 5.30 mm
9.81 mm × 6.35 mm
LM358, LM2904, LM358A,
LM258, LM258A
PDIP (8)
R1
VOUT
VIN
LM158, LM158A
LM158, LM158A
CDIP (8)
9.60 mm × 6.67 mm
8.89 mm × 8.89 mm
LCCC (20)
C1
1
2pR1C1
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
f
=
-3 dB
VOUT
VIN
RF
1
( 1 + sR C (
= 1 +
RG
1
1
Single-Pole, Low-Pass Filter
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................4
6 Pin Configuration and Functions...................................5
7 Specifications.................................................................. 6
7.1 Absolute Maximum Ratings........................................ 6
7.2 ESD Ratings............................................................... 6
7.3 Recommended Operating Conditions.........................7
7.4 Thermal Information....................................................7
7.5 Electrical Characteristics: LM358B and LM358BA..... 8
7.6 Electrical Characteristics: LM2904B and
LM2904BA...................................................................10
7.7 Electrical Characteristics: LM358, LM358A.............. 12
7.8 Electrical Characteristics: LM2904, LM2904V.......... 13
7.9 Electrical Characteristics: LM158, LM158A.............. 14
7.10 Electrical Characteristics: LM258, LM258A............ 16
7.11 Typical Characteristics: LM358B and LM2904B..... 17
7.12 Typical Characteristics: LM158, LM158A,
8 Parameter Measurement Information..........................26
9 Detailed Description......................................................27
9.1 Overview...................................................................27
9.2 Functional Block Diagram: LM358B, LM358BA,
LM2904B, LM2904BA................................................. 27
9.3 Feature Description...................................................28
9.4 Device Functional Modes..........................................28
10 Application and Implementation................................29
10.1 Application Information........................................... 29
10.2 Typical Application.................................................. 29
11 Power Supply Recommendations..............................30
12 Layout...........................................................................30
12.1 Layout Guidelines................................................... 30
12.2 Layout Examples.................................................... 31
13 Device and Documentation Support..........................32
13.1 Receiving Notification of Documentation Updates..32
13.2 Support Resources................................................. 32
13.3 Trademarks.............................................................32
13.4 Electrostatic Discharge Caution..............................32
13.5 Glossary..................................................................32
14 Mechanical, Packaging, and Orderable
LM258, LM258A, LM358, LM358A, LM2904, and
LM2904V.....................................................................24
Information.................................................................... 33
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision Y (February 2021) to Revision Z (July 2021)
Page
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Deleted preview tag from LM358B and LM2904B SOT-23 (8) package in Device Information table.................1
Updated DDF (SOT-23) package thermal information in the Thermal Information table....................................7
Deleted Related Links from the Device and Documentation Support section.................................................. 32
Changes from Revision X (June 2020) to Revision Y (February 2021)
Page
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Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Added SOT23-8 (DDF) package information throughout data sheet..................................................................1
Deleted preview tag from LM358B and LM2904B VSSOP (8) package in Device Information table.................1
Added SOT23-8 (DDF) package information to Device Comparison Table .......................................................4
Added SOT23-8 (DDF) package information to the Pin Configuration and Functions section...........................5
Added DDF (SOT-23) package to the Thermal Information table.......................................................................7
Changes from Revision W (October 2019) to Revision X (June 2020)
Page
Added application links to Applications section.................................................................................................. 1
Deleted preview tag from LM358B and LM2904B TSSOP (8) package in Device Information table ................ 1
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Changes from Revision V (September 2018) to Revision W (October 2019)
Page
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Added specification in the Device Comparison Table ........................................................................................4
Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings ............................................................ 6
Changed VS to V+ in Recommended Operating Conditions ..............................................................................7
Changed Thermal Information for the LM158FK and LM158JG devices........................................................... 7
Added Typical Characteristics section for the LM358B and LM2490B op amps.............................................. 17
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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•
•
Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement
Information section........................................................................................................................................... 26
Changed the Functional Block Diagram .......................................................................................................... 27
Changes from Revision U (January 2017) to Revision V (September 2018)
Page
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Changed the data sheet title ..............................................................................................................................1
Changed first four items in the Features section ............................................................................................... 1
Changed the first item in the Applications section and added four new items ...................................................1
Changed voltage values in the first paragraph of the Description section..........................................................1
Changed text in the second paragraph of the Description section..................................................................... 1
Added devices LM358B and LM2904B to data sheet.........................................................................................1
Changed the first three rows of the Device Information table and added a a cross-referenced note for
PREVIEW-status devices................................................................................................................................... 1
Added Device Comparison table ....................................................................................................................... 4
Added a table note to the Pin Functions table ...................................................................................................5
Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition
statement............................................................................................................................................................6
Changed all entries in the Absolute Maximum Ratings table except TJ and Tstg .............................................. 6
Deleted lead temperature and case temperature from Absolute Maximum Ratings ......................................... 6
Changed device listings and their voltage values in the ESD Ratings table ......................................................6
Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions
condition statement ............................................................................................................................................7
Changed table entries for all parameters in the Recommended Operating Conditions table.............................7
Added rows to the Thermal Information table, and a table note regarding device-package combinations ....... 7
Deleted the Operating Conditions table............................................................................................................16
Added a condition statement to the Typical Characteristics section.................................................................24
Changed specific voltages to a Recommended Operating Conditions reference............................................ 27
Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................28
Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices............................................ 28
Changed the Section 9.3.3 section in multiple places throughout....................................................................28
Changed VCC to VS in the Section 10.1 section ...............................................................................................29
Subscripted the suffixes fro RI and RF .............................................................................................................29
Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a
dual op amp......................................................................................................................................................31
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Changes from Revision T (April 2015) to Revision U ()
Page
•
Changed data sheet title.....................................................................................................................................1
Changes from Revision S (January 2014) to Revision T (April 2015)
Page
•
Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ........... 1
Changes from Revision R (July 2010) to Revision S (Jauary 2014)
Page
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Converted this data sheet from the QS format to DocZone using the PDF on the web..................................... 1
Deleted Ordering Information table.....................................................................................................................1
Updated Features to include Military Disclaimer................................................................................................ 1
Added Typical Characteristics section..............................................................................................................24
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
www.ti.com
5 Device Comparison Table
SUPPLY
VOLTAGE
TEMPERATURE
VOS (MAXIMUM IQ / CH (TYPICAL AT INTEGRATED EMI
PART NUMBER
PACKAGE
RANGE
AT 25°C)
3 mV
3 mV
7 mV
7 mV
3 mV
7 mV
5 mV
3 mV
5 mV
3 mV
25°C)
300 µA
300 µA
350 µA
350 µA
350 µA
350 µA
350 µA
350 µA
350 µA
350 µA
FILTER
Yes
Yes
No
LM358B
LM2904B
LM358
3 V–36 V
3 V–36 V
3 V–32 V
3 V–26 V
3 V–32 V
3 V–32 V
3 V–32 V
3 V–32 V
3 V–32 V
3 V–32 V
–40°C to 85°C
–40°C to 125°C
0°C to 70°C
D, DDF, DGK, PW
D, DDF, DGK, PW
D, PW, DGK, P, PS
D, PW, DGK, P, PS
D, PW, DGK, P
D, PW
LM2904
LM358A
LM2904V
LM158
–40°C to 125°C
0°C to 70°C
No
No
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
–25°C to 85°C
–25°C to 85°C
No
No
JG, FK
LM158A
LM258
No
JG, FK
No
D, DGK, P
LM258A
No
D, DGK, P
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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6 Pin Configuration and Functions
OUT1
IN1œ
IN1+
Vœ
1
2
3
4
8
7
6
5
V+
OUT2
IN2œ
IN2+
NC
IN1œ
NC
4
5
6
7
8
18
17
16
15
14
NC
OUT2
NC
Not to scale
IN1+
NC
IN2œ
NC
Figure 6-1. D, DDF, DGK, P, PS, PW, and JG
Package
8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP,
and CDIP
Top View
Not to scale
NC - No internal connection
Figure 6-2. FK Package
20-Pin LCCC
Top View
Table 6-1. Pin Functions
PIN
I/O
DESCRIPTION
SOIC, SOT23-8, VSSOP, CDIP,
NAME
IN1–
LCCC(1)
PDIP, SO, TSSOP, CFP(1)
5
7
2
3
6
5
1
7
I
I
Negative input
IN1+
IN2–
Positive input
Negative input
Positive input
Output
15
12
2
I
IN2+
OUT1
OUT2
I
O
O
17
Output
Negative (lowest) supply or ground (for single-
supply operation)
V–
10
4
—
1, 3, 4, 6, 8, 9, 11,
13, 14, 16, 18, 19
NC
V+
—
8
—
—
No internal connection
Positive (highest) supply
20
(1) For a listing of which devices are available in what packages, see Section 5.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
LM358B, LM358BA,
LM2904B, LM2904BA
±20 or 40
LM158, LM258, LM358,
LM158A, LM258A, LM358A,
LM2904V
Supply voltage, VS = ([V+] – [V–])
V
±16 or 32
±13 or 26
LM2904
LM358B, LM358BA,
LM2904B, LM2904BA,LM158,
LM258, LM358, LM158A,
LM258A, LM358A, LM2904V
–32
32
(2)
Differential input voltage, VID
V
LM2904
–26
26
40
LM358B, LM358BA,
LM2904B, LM2904BA
–0.3
LM158, LM258, LM358,
LM158A, LM258A, LM358A,
LM2904V
Input voltage, VI
Either input
V
s
–0.3
–0.3
32
LM2904
26
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C,
VS ≤ 15 V(3)
Unlimited
LM158, LM158A
LM258, LM258A
–55
–25
–40
0
125
85
LM358B, LM358BA
85
Operating ambient temperature, TA
°C
LM358, LM358A
70
LM2904B, LM2904BA,
LM2904, LM2904V
–40
125
Operating virtual-junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Differential voltages are at IN+, with respect to IN−.
(3) Short circuits from outputs to VS can cause excessive heating and eventual destruction.
7.2 ESD Ratings
VALUE
UNIT
LM358B, LM358BA, LM2904B, AND LM2904BA
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
±1000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±500
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
MAX UNIT
LM358B, LM358BA, LM2904B,
LM2904BA
3
36
VS
Supply voltage, VS= ([V+] – [V–])
Common-mode voltage
LM158, LM258, LM358, LM158A,
LM258A, LM358A, LM2904V
V
3
30
LM2904
3
V–
26
VCM
V+ – 2
85
V
LM358B, LM358BA
–40
LM2904B, LM2904BA, LM2904,
LM2904V
–40
125
TA
Operating ambient temperature
°C
LM358, LM358A
LM258, LM258A
LM158, LM158A
0
–20
–55
70
85
125
7.4 Thermal Information
LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B,
LM2904BA, LM2904V(2)
LM158, LM158A
THERMAL METRIC(1)
D
DGK
P
PS
PW
DDF
FK
JG
UNIT
(SOIC)
(VSSOP)
(PDIP)
(SO)
(TSSOP)
(SOT-23)
(LCCC)
(CDIP)
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
8PINS
20 PINS
8 PINS
Junction-to-ambient
RθJA
124.7
181.4
80.9
116.9
171.7
164.3
84.0
112.4
°C/W
°C/W
°C/W
thermal resistance
Junction-to-case (top)
RθJC(top)
66.9
67.9
69.4
70.4
57.4
62.5
68.6
68.8
99.2
98.1
82.1
56.9
57.5
63.6
thermal resistance
Junction-to-board thermal
resistance
RθJB
102.9
100.3
Junction-to-top
ψJT
characterization
parameter
19.2
11.8
40
21.9
11.5
11.4
51.7
35.7
°C/W
Junction-to-board
characterization
parameter
ψJB
67.2
—
101.2
—
56.9
—
67.6
—
97.9
—
81.7
—
57.1
10.6
93.3
22.3
°C/W
°C/W
Junction-to-case (bottom)
thermal resistance
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Section 5.
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LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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7.5 Electrical Characteristics: LM358B and LM358BA
VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
±0.3
±3.0
±4
mV
mV
mV
mV
LM358B
TA = –40°C to +85°C
VOS
Input offset voltage
±2.0
±2.5
LM358BA
TA = –40°C to +85°C
TA = -40°C to +85°C(1)
dVOS/dT Input offset voltage drift
±3.5
±2
11 µV/°C
PSRR
Power supply rejection ratio
Channel separation, dc
15
µV/V
µV/V
f = 1 kHz to 20 kHz
±1
INPUT VOLTAGE RANGE
VS = 3 V to 36 V
VS = 5 V to 36 V
(V–)
(V–)
(V+) – 1.5
(V+) – 2
100
V
V
VCM
Common-mode voltage range
TA = –40°C to +85°C
TA = –40°C to +85°C
(V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V
(V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V
20
25
CMRR
Common-mode rejection ratio
µV/V
316
INPUT BIAS CURRENT
±10
0.5
10
±35
±50
4
nA
nA
IB
Input bias current
TA = –40°C to +85°C(1)
nA
IOS
Input offset current
TA = –40°C to +85°C(1)
TA = –40°C to +85°C
5
nA
dIOS/dT
NOISE
En
Input offset current drift
pA/℃
Input voltage noise
f = 0.1 to 10 Hz
f = 1 kHz
3
µVPP
en
Input voltage noise density
40
nV/√/Hz
INPUT IMPEDANCE
ZID
ZIC
Differential
10 || 0.1
4 || 1.5
MΩ|| pF
GΩ|| pF
Common-mode
OPEN-LOOP GAIN
70
35
140
V/mV
V/mV
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V–)
TA = –40°C to +85°C
FREQUENCY RESPONSE
GBW
SR
Θm
tOR
ts
Gain bandwidth product
1.2
0.5
56
MHz
V/µs
°
Slew rate
G = + 1
Phase margin
Overload recovery time
Settling time
G = + 1, RL = 10kΩ, CL = 20 pF
VIN × gain > VS
10
µs
To 0.1%, VS = 5 V, 2-V step , G = +1, CL = 100 pF
4
µs
THD+N Total harmonic distortion + noise
G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36 V, RL = 100k, IOUT ≤ ±50 µA, BW = 80 kHz
0.001
%
OUTPUT
IOUT = 50 µA
1.35
1.4
1.5
100
0.75
5
1.42
1.48
1.61
150
1
V
V
Positive rail (V+)
Negative rail (V–)
IOUT = 1 mA
IOUT = 5 mA(1)
V
VO
Voltage output swing from rail
IOUT = 50 µA
IOUT = 1 mA
mV
V
VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +85°C
20
mV
-20
-10
10
5
-30
VS = 15 V; VO = V–;
VID = 1 V
Source(1)
TA = –40°C to +85°C
mA
IO
Output current
20
VS = 15 V; VO = V+;
VID = –1 V
Sink(1)
TA = –40°C to +85°C
VID = –1 V; VO = (V–) + 200 mV
60
100
±40
100
300
μA
mA
pF
Ω
ISC
Short-circuit current
VS = 20 V, (V+) = 10 V, (V–) = –10 V, VO = 0 V
±60
CLOAD
RO
Capacitive load drive
Open-loop output resistance
f = 1 MHz, IO = 0 A
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LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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7.5 Electrical Characteristics: LM358B and LM358BA (continued)
VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
IQ
IQ
Quiescent current per amplifier
Quiescent current per amplifier
VS = 5 V; IO = 0 A
VS = 36 V; IO = 0 A
300
460
800
µA
µA
TA = –40°C to +85°C
(1) Specified by characterization only.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.6 Electrical Characteristics: LM2904B and LM2904BA
VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
±0.3
±3.0
±4
mV
mV
mV
mV
LM2904B
TA = –40°C to +125°C
VOS
Input offset voltage
±2.0
±2.5
LM2904BA
TA = –40°C to +125°C
TA = –40°C to +125°C(1)
dVOS/dT Input offset voltage drift
±3.5
±2
12 µV/°C
PSRR
Power supply rejection ratio
Channel separation, dc
15
µV/V
µV/V
f = 1 kHz to 20 kHz
±1
INPUT VOLTAGE RANGE
VS = 3 V to 36 V
VS = 5 V to 36 V
(V–)
(V–)
(V+) – 1.5
(V+) – 2
100
V
V
VCM
Common-mode voltage range
TA = –40°C to +125°C
TA = –40°C to +125°C
(V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V
(V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V
20
25
CMRR
Common-mode rejection ratio
µV/V
316
INPUT BIAS CURRENT
±10
0.5
10
±35
±50
4
nA
nA
IB
Input bias current
TA = –40°C to +125°C(1)
nA
IOS
Input offset current
TA = –40°C to +125°C(1)
TA = –40°C to +125°C
5
nA
dIOS/dT
NOISE
En
Input offset current drift
pA/℃
Input voltage noise
f = 0.1 to 10 Hz
f = 1 kHz
3
µVPP
en
Input voltage noise density
40
nV/√/Hz
INPUT IMPEDANCE
ZID
ZIC
Differential
10 || 0.1
4 || 1.5
MΩ|| pF
GΩ|| pF
Common-mode
OPEN-LOOP GAIN
70
35
140
V/mV
V/mV
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V–)
TA = –40°C to +125°C
FREQUENCY RESPONSE
GBW
SR
Θm
tOR
ts
Gain bandwidth product
1.2
0.5
56
MHz
V/µs
°
Slew rate
G = + 1
Phase margin
Overload recovery time
Settling time
G = + 1, RL = 10kΩ, CL = 20 pF
VIN × gain > VS
10
µs
To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF
4
µs
THD+N Total harmonic distortion + noise
G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36 V, RL = 100k, IOUT ≤ ±50 µA, BW = 80 kHz
0.001
%
OUTPUT
IOUT = 50 µA
1.35
1.4
1.5
100
0.75
5
1.42
1.48
1.61
150
1
V
V
Positive rail (V+)
Negative rail (V–)
IOUT = 1 mA
IOUT = 5 mA(1)
V
VO
Voltage output swing from rail
IOUT = 50 µA
IOUT = 1 mA
mV
V
VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +125°C
20
mV
–20
–10
10
5
–30
VS = 15 V; VO = V–; VID
1 V
=
=
Source(1)
TA = –40°C to +125°C
mA
IO
Output current
20
VS = 15 V; VO = V+; VID
–1 V
Sink(1)
TA = –40°C to +125°C
VID = –1 V; VO = (V–) + 200 mV
60
100
±40
100
300
μA
mA
pF
Ω
ISC
Short-circuit current
VS = 20 V, (V+) = 10 V, (V–) = –10 V, VO = 0 V
±60
CLOAD
RO
Capacitive load drive
Open-loop output resistance
f = 1 MHz, IO = 0 A
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LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
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7.6 Electrical Characteristics: LM2904B and LM2904BA (continued)
VS = (V+) – (V–) = 5 V – 36 V (±2.5 V – ±18 V), TA = 25°C, VCM = VOUT = VS / 2, RL = 10k connected to VS / 2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
IQ
IQ
Quiescent current per amplifier
Quiescent current per amplifier
VS = 5 V; IO = 0 A
VS = 36 V; IO = 0 A
300
460
800
µA
µA
TA = –40°C to +125°C
(1) Specified by characterization only.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.7 Electrical Characteristics: LM358, LM358A
For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
2
7
9
3
5
LM358
TA = 0°C to 70°C
VS = 5 V to 30 V; VC M = 0 V; VO = 1.4
V
VOS
Input offset voltage
mV
LM358A
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
LM358
7
7
dVOS/dT
Input offset voltage drift
µV/°C
LM358A
20
Input offset voltage vs power
supply (ΔVIO/ΔVS)
PSRR
VS = 5 V to 30 V
65
100
120
dB
dB
VO1/ VO2
Channel separation
f = 1 kHz to 20 kHz
INPUT VOLTAGE RANGE
VS = 5 V to 30 V
LM358
(V–)
(V+) – 1.5
(V+) – 2
VS = 30 V
VS = 5 V to 30 V
LM358A
LM358
VCM
Common-mode voltage range
V
TA = 0°C to 70°C
(V–)
65
VS = 30 V
LM358A
CMRR
Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V
80
–20
–15
2
dB
INPUT BIAS CURRENT
–250
–500
–100
–200
50
LM358
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
IB
Input bias current
VO = 1.4 V
nA
nA
LM358A
LM358
150
30
IOS
Input offset current
VO = 1.4 V
2
LM358A
75
10
dIOS/dT
Input offset current drift
pA/°C
nV/√ Hz
V/mV
LM358A
300
NOISE
en
Input voltage noise density
f = 1 kHz
40
OPEN-LOOP GAIN
25
15
100
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
TA = 0°C to 70°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
VS = 30 V; RL = 2 kΩ
VS = 30 V; RL ≥ 10 kΩ
VS = 5 V; RL ≥ 2 kΩ
VS = 5 V; RL ≤ 10 kΩ
TA = 0°C to 70°C
TA = 0°C to 70°C
4
3
Positive rail
Negative rail
2
V
VO
Voltage output swing from rail
1.5
20
5
mV
–20
–30
VS = 15 V; VO = 0 V; VID
= 1 V
Source
Sink
LM358A
–60
±60
TA = 0°C to 70°C
TA = 0°C to 70°C
–10
10
5
mA
IO
Output current
20
VS = 15 V; VO = 15 V;
VID = –1 V
VID = –1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
12
30
µA
ISC
Short-circuit current
±40
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
IQ Quiescent current per amplifier
TA = 0°C to 70°C
µA
VS = 30 V; VO = 15 V; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM358 and LM358A.
(2) All typical values are TA = 25°C.
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LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.8 Electrical Characteristics: LM2904, LM2904V
For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
1
7
10
2
Non-A suffix
devices
TA = –40°C to 125°C
VS = 5 V to maximum; VC M = 0 V; VO
1.4 V
=
VOS
Input offset voltage
mV
A-suffix
devices
TA = –40°C to 125°C
TA = –40°C to 125°C
4
dVOS/dT Input offset voltage drift
Input offset voltage vs power supply
7
100
120
µV/°C
dB
PSRR
VS = 5 V to 30 V
65
(ΔVIO/ΔVS)
VO1/ VO2 Channel separation
f = 1 kHz to 20 kHz
dB
INPUT VOLTAGE RANGE
(V–)
(V–)
65
(V+) – 1.5
(V+) – 2
VCM
Common-mode voltage range
VS = 5 V to maximum
V
TA = –40°C to 125°C
CMRR
Common-mode rejection ratio
VS = 5 V to maximum; VCM = 0 V
80
–20
2
dB
INPUT BIAS CURRENT
–250
–500
50
IB
Input bias current
VO = 1.4 V
VO = 1.4 V
nA
nA
TA = –40°C to 125°C
TA = –40°C to 125°C
Non-V suffix
device
300
50
IOS
Input offset current
2
V-suffix
device
TA = –40°C to 125°C
TA = –40°C to 125°C
150
dIOS/dT
NOISE
en
Input offset current drift
10
40
100
pA/°C
Input voltage noise density
f = 1 kHz
nV/√ Hz
OPEN-LOOP GAIN
25
15
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
V/mV
TA = –40°C to 125°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
RL ≥ 10 kΩ
VS – 1.5
VS = maximum; RL
2 kΩ
=
≥
=
≥
4
3
6
Non-V suffix
device
VS = maximum; RL
10 kΩ
2
4
Positive rail
Negative rail
V
VO
Voltage output swing from rail
TA = –40°C to 125°C
VS = maximum; RL
2 kΩ
V-suffix device
VS = maximum; RL
10 kΩ
5
VS = 5 V; RL ≤ 10 kΩ TA = –40°C to 125°C
5
20
mV
mA
–20
–10
10
–30
VS = 15 V; VO = 0 V; VID = 1 V
Source
TA = –40°C to 125°C
20
IO
Output current
VS = 15 V; VO = 15 V; VID = –1 V Sink
TA = –40°C to 125°C
5
Non-V suffix device
V-suffix device
30
40
VID = -1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
µA
12
ISC
Short-circuit current
±40
±60
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
IQ Quiescent current per amplifier
TA = –40°C to 125°C
µA
VS = maximum; VO = maximum / 2; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V.
(2) All typical values are TA = 25°C.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.9 Electrical Characteristics: LM158, LM158A
For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
5
7
2
4
LM158
TA = –55°C to 125°C
VOS
Input offset voltage
VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V
mV
LM158A
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
LM158
7
7
dVOS/dT Input offset voltage drift
µV/°C
LM158A
15(3)
Input offset voltage vs power supply
(ΔVIO/ΔVS)
PSRR
VS = 5 V to 30 V
65
100
120
dB
dB
VO1/ VO2 Channel separation
f = 1 kHz to 20 kHz
INPUT VOLTAGE RANGE
VS = 5 V to 30 V
VS = 30 V
LM158
(V–)
(V+) – 1.5
(V+) – 2
LM158A
LM158
VCM
Common-mode voltage range
V
VS = 5 V to 30 V
VS = 30 V
TA = –55°C to 125°C
(V–)
70
LM158A
CMRR
Common-mode rejection ratio
VS = 5 V to 30 V; VCM = 0 V
80
–20
–15
2
dB
INPUT BIAS CURRENT
–150
–300
–50
–100
30
LM158
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
IB
Input bias current
Input offset current
VO = 1.4 V
nA
nA
LM158A
LM158
100
10
IOS
VO = 1.4 V
2
LM158A
30
10
dIOS/dT
Input offset current drift
pA/°C
nV/√ Hz
V/mV
LM158A
200
NOISE
en
Input voltage noise density
f = 1 kHz
40
OPEN-LOOP GAIN
50
25
100
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
TA = –55°C to 125°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
VS = 30 V; RL = 2 kΩ
VS = 30 V; RL ≥ 10 kΩ
VS = 5 V; RL ≥ 2 kΩ
VS = 5 V; RL ≤ 10 kΩ
TA = –55°C to 125°C
TA = –55°C to 125°C
4
3
Positive rail
Negative rail
2
V
VO
Voltage output swing from rail
1.5
20
5
mV
–20
–30
VS = 15 V; VO = 0 V; VID = 1 V Source
LM158A
–60
±60
TA = –55°C to 125°C
TA = –55°C to 125°C
–10
10
5
mA
IO
Output current
20
VS = 15 V; VO = 15 V; VID = –1
V
Sink
VID = –1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
12
30
µA
ISC
Short-circuit current
±40
mA
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.9 Electrical Characteristics: LM158, LM158A (continued)
For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
POWER SUPPLY
VO = 2.5 V; IO = 0 A
VS = 30 V; VO = 15 V; IO = 0 A
350
500
600
IQ
Quiescent current per amplifier
TA = –55°C to 125°C
µA
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM158 and LM158A.
(2) All typical values are TA = 25°C.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.10 Electrical Characteristics: LM258, LM258A
For VS = (V+) – (V–) = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
2
5
7
3
4
LM258
TA = –25°C to 85°C
VOS
Input offset voltage
VS = 5 V to 30 V; VC M = 0 V; VO = 1.4 V
mV
LM258A
TA = –25°C to 85°C
TA = –25°C to 85°C
LM258
7
7
dVOS/dT Input offset voltage drift
µV/°C
LM258A
15
Input offset voltage vs power supply
(ΔVIO/ΔVS)
PSRR
VS = 5 V to 30 V
65
100
120
dB
dB
VO1/ VO2 Channel separation
f = 1 kHz to 20 kHz
INPUT VOLTAGE RANGE
VS = 5 V to 30 V
VS = 30 V
LM258
(V–)
(V+) – 1.5
(V+) – 2
LM258A
LM258
VCM
Common-mode voltage range
V
VS = 5 V to 30 V
VS = 30 V
TA = –25°C to 85°C
(V–)
70
LM258A
CMRR
Common-mode rejection ratio
VS = 5 V to 30 V; VCM = 0 V
80
–20
–15
2
dB
INPUT BIAS CURRENT
–150
–300
–80
–100
30
LM258
TA = –25°C to 85°C
TA = –25°C to 85°C
TA = –25°C to 85°C
TA = –25°C to 85°C
TA = –25°C to 85°C
IB
Input bias current
Input offset current
VO = 1.4 V
nA
nA
LM258A
LM258
100
15
IOS
VO = 1.4 V
2
LM258A
30
10
dIOS/dT
Input offset current drift
pA/°C
nV/√ Hz
V/mV
LM258A
200
NOISE
en
Input voltage noise density
f = 1 kHz
40
OPEN-LOOP GAIN
50
25
100
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
TA = –25°C to 85°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
VS = 30 V; RL = 2 kΩ
VS = 30 V; RL ≥ 10 kΩ
VS = 5 V; RL ≥ 2 kΩ
VS = 5 V; RL ≤ 10 kΩ
TA = –25°C to 85°C
TA = –25°C to 85°C
4
3
Positive rail
Negative rail
2
V
VO
Voltage output swing from rail
1.5
20
5
mV
–20
–30
VS = 15 V; VO = 0 V; VID = 1 V Source
LM258A
–60
±60
TA = –25°C to 85°C
TA = –25°C to 85°C
–10
10
5
mA
IO
Output current
20
VS = 15 V; VO = 15 V; VID = –1
V
Sink
VID = –1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
12
30
µA
ISC
Short-circuit current
±40
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
IQ Quiescent current per amplifier
TA = –25°C to 85°C
µA
VS = 30 V; VO = 15 V; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM258 and LM258A.
(2) All typical values are TA = 25°C.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
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7.11 Typical Characteristics: LM358B and LM2904B
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
18
16
14
12
10
8
30
27
24
21
18
15
12
9
6
4
6
2
3
0
0
-1800
-1200
-600
0
600
1200
1800
DC11
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25 2.5 2.75
DC12
Offset Voltage (µV)
Offset Voltage Drift (µV/°C)
Figure 7-1. Offset Voltage Production Distribution
Figure 7-2. Offset Voltage Drift Distribution
750
500
300
450
150
100
-150
-450
-750
-100
-300
-500
-40
-20
0
20
40
Temperature (°C)
60
80
100
120
-18
-12
-6
Common-Mode Voltage (V)
0
6
12
17
DC10
DC10
Figure 7-3. Offset Voltage vs Temperature
Figure 7-4. Offset Voltage vs Common-Mode Voltage
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
70
G = 1
G = 10
G = 100
G = 1000
G = –1
60
50
40
30
20
10
0
-10
-20
-30
Gain (dB)
Phase (°)
-10
-20
-10
1k
10k
100k
1M
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
D012
D017
Figure 7-5. Open-Loop Gain and Phase vs Frequency
Figure 7-6. Closed-Loop Gain vs Frequency
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7.11 Typical Characteristics: LM358B and LM2904B (continued)
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-5
-7.5
-10
120
100
80
IB+
IB–
60
40
20
-12.5
-15
0
-20
-40
-20
-15
-10
-5
0
5
10
15
20
-20
-15
-10
-5
0
5
10
15
20
Common-Mode Voltage (V)
Common-Mode Voltage (V)
DC3I
DC3I
Figure 7-7. Input Bias Current vs Common-Mode Voltage
Figure 7-8. Input Offset Current vs Common-Mode Voltage
-6
0.06
-7
-8
0.045
0.03
-9
0.015
0
IB+
IB–
-10
-11
-12
-0.015
-0.03
-40
-10
20
50
80
110 130
-40
-10
20
50
80
110
130
Temperature (°C)
Temperature (°C)
DCIO
DCIB
Figure 7-9. Input Bias Current vs Temperature
Figure 7-10. Input Offset Current vs Temperature
(V–) + 18 V
V+
–40ꢀC
25ꢀC
125ꢀC
(V–) + 15 V
(V–) + 12 V
(V–) + 9 V
(V–) + 6 V
(V–) + 3 V
V–
(V+) – 3 V
(V+) – 6 V
(V+) – 9 V
(V+) – 12 V
–40ꢀC
25ꢀC
125ꢀC
0
5
10
15
20
25
30
35
40
0
10
20
30
40
50
Output Current (mA)
Output Current (mA)
DC1-
DC13
Figure 7-12. Output Voltage Swing vs Output Current (Sinking)
Figure 7-11. Output Voltage Swing vs Output Current (Sourcing)
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7.11 Typical Characteristics: LM358B and LM2904B (continued)
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
100
90
80
70
60
50
40
30
20
10
0
120
115
110
105
100
95
PSRR+
PSRR-
CMRR
90
VS = 36V
VS = 5V
85
-40
1k
10k 100k
Frequency (Hz)
1M
-10
20
50
80
110
130
Temperature (°C)
D001
DC2_
Figure 7-13. CMRR and PSRR vs Frequency
Figure 7-14. Common-Mode Rejection Ratio vs
Temperature (dB)
-118
-119
-120
-121
-122
-123
1.6
1.2
0.8
0.4
0
-0.4
-0.8
-1.2
-1.6
-2
0
1
2
3
4
5
6
7
8
9
10
-40
-20
0
20
40
60
80
100 120 140
Time (s)
Temperature (°C)
D011
DC8_
VS = 5 V to 36 V
Figure 7-16. 0.1-Hz to 10-Hz Noise
Figure 7-15. Power Supply Rejection Ratio vs Temperature (dB)
100
90
80
70
60
50
40
30
20
10
0
-32
-40
10 kꢀ
2 kꢀ
-48
-56
-64
-72
-80
-88
-96
-104
-112
100
1k
10k
10
100
1k
Frequency (Hz)
10k
100k
Frequency (Hz)
D013
D010
G = 1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
Figure 7-18. THD+N Ratio vs Frequency, G = 1
Figure 7-17. Input Voltage Noise Spectral Density vs Frequency
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7.11 Typical Characteristics: LM358B and LM2904B (continued)
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-32
-40
-48
-56
-64
-72
-80
-88
-96
-104
-30
-40
10 kꢀ
2 kꢀ
-50
-60
-70
-80
-90
-100
-110
-120
10 kꢀ
2 kꢀ
100
1k
10k
0.001
0.01
0.1
1
10 20
Frequency (Hz)
Amplitude (VPP)
D014
D015
G = –1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
See Figure 8-3
G = 1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
Figure 7-19. THD+N Ratio vs Frequency, G = –1
Figure 7-20. THD+N vs Output Amplitude, G = 1
-20
460
-35
-50
430
400
370
340
310
280
-65
-80
-95
10 kꢀ
2 kꢀ
-110
0.001
0.01
0.1
1
10 20
3
9
15
21
27
33 36
Amplitude (VPP
)
Supply Voltage (V)
D016
DC_S
G = –1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
See Figure 8-3
Figure 7-21. THD+N vs Output Amplitude, G = –1
Figure 7-22. Quiescent Current vs Supply Voltage
600
500
VS = 36V
VS = 5V
540
400
300
200
100
480
420
360
300
240
-40
-20
0
20
40
60
80
100
120
1k
10k
100k
1M
Temperature (°C)
Frequency (Hz)
DC4_
D006
Figure 7-24. Open-Loop Output Impedance vs Frequency
Figure 7-23. Quiescent Current vs Temperature
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7.11 Typical Characteristics: LM358B and LM2904B (continued)
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
44
40
36
32
28
24
20
16
12
8
18
16
14
12
10
8
Overshoot (+)
Overshoot (-)
Overshoot (+)
Overshoot (–)
6
4
2
0
40
80
120
160
200
240
280
320
360
0
40
80
120 160 200 240 280 320 360
Capacitance load (pF)
Capacitance load (pF)
D020
D019
G = –1, 100-mV output step, RL = open
G = 1, 100-mV output step, RL = open
Figure 7-26. Small-Signal Overshoot vs Capacitive Load
Figure 7-25. Small-Signal Overshoot vs Capacitive Load
60
57
54
51
48
45
42
39
36
33
30
20
Input
Output
10
0
-10
-20
0
200
400
Time (ꢀs)
600
800
1000
0
40
80
120 160 200 240 280 320 360
Capacitance Load (pF)
D021
D018
G = –10
Figure 7-28. Overload Recovery
Figure 7-27. Phase Margin vs Capacitive Load
10
10
7.5
5
7.5
5
2.5
0
2.5
0
-2.5
-5
-2.5
-5
-7.5
-10
-7.5
-10
Input
Output
Input
Output
0
20
40
60
80
100
0
20
40
60
80
100
Time (ꢀs)
Time (ꢀs)
D022
D023
G = 1, RL = open
G = –1, RL = open, RFB = 10K
See Figure 8-3
Figure 7-29. Small-Signal Step Response, G = 1
Figure 7-30. Small-Signal Step Response, G = –1
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7.11 Typical Characteristics: LM358B and LM2904B (continued)
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
16
12
8
40
32
24
16
8
4
0
0
-4
-8
-8
-16
-24
-32
-40
-12
-16
-20
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Time (ꢀs)
Time (ꢀs)
D003
D004
G = 1, RL = open
G = 1, RL = open
Figure 7-32. Large-Signal Step Response (Falling)
Figure 7-31. Large-Signal Step Response (Rising)
2.5
0.675
Output
Input
Positive
Negative
2
1.5
1
0.625
0.575
0.525
0.475
0.425
0.5
0
-0.5
-1
-1.5
-2
-2.5
0
20
40
60
80
100
-40 -25 -10
5
20 35 50 65 80 95 110 125
Time (µs)
Temp(ꢀC)
AC_S
D009
G = 1, RL = open
Figure 7-33. Large-Signal Step Response
Figure 7-34. Slew Rate vs Temperature
15
14
13
12
11
10
9
60
40
20
0
Sinking
Sourcing
8
7
6
-20
-40
-60
5
4
3
2
1
0
1k
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
10k
100k
Frequency (Hz)
1M
DC7_
D005
VS = 15 V
Figure 7-36. Maximum Output Voltage vs Frequency
Figure 7-35. Short-Circuit Current vs Temperature
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7.11 Typical Characteristics: LM358B and LM2904B (continued)
This typical characteristics section is applicable for LM358B and LM2904B. Typical characteristics data in this section was
taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-75
-85
90
84
78
72
66
60
54
48
42
36
30
24
-95
-105
-115
-125
-135
1k
10k
100k
Frequency (Hz)
1M
1M
10M
100M
Frequency (Hz)
1G
D008
D007
Figure 7-37. Channel Separation vs Frequency
Figure 7-38. EMIRR (Electromagnetic Interference Rejection
Ratio) vs Frequency
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7.12 Typical Characteristics: LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and
LM2904V
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
20
18
16
14
12
10
8
0.36
0.34
0.32
0.3
–55C
0C
125C
0.28
0.26
0.24
0.22
0.2
5Vdc
6
15Vdc
30Vdc
4
2
0
–55 –35 –15
5
25
45
65
85 105 125
0
5
10
Supply Voltage (Vdc)
Figure 7-40. Supply Current vs Supply Voltage
15
20
25
30
Temperature (°C)
Figure 7-39. Input Current vs Temperature
160
140
120
100
80
100
CMRR
90
80
70
60
50
40
30
20
10
0
RL=20K
RL=2K
60
40
20
0
0.1
1
10
100
1000
0
5
10
V+ Supply Voltage (Vdc)
Figure 7-41. Voltage Gain vs Supply Voltage
15
20
25
30
35
40
Frequency (kHz)
C001
Figure 7-42. Common-Mode Rejection Ratio vs Frequency
3.5
0.50
VOUT
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.45
0.40
0.35
0.30
0.25
VOUT
0.20
0
4
8
12
16
20
24
28
32
36
40
0
2
4
6
8
10
Time (ꢀs)
Time (ꢀs)
C001
C001
Figure 7-43. Voltage Follower Large Signal Response (50 pF)
Figure 7-44. Voltage Follower Small Signal Response (50 pF)
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7.12 Typical Characteristics: LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and
LM2904V (continued)
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
20
17.5
15
8
7
6
5
4
3
2
1
12.5
10
7.5
5
2.5
0
1
10
100
Frequency (kHz)
1k
0.001
0.01
0.1
1
10
100
Output Sink Current (mAdc)
Figure 7-45. Maximum Output Swing vs Frequency (VCC = 15 V)
Figure 7-46. Output Sourcing Characteristics
10
90
80
70
60
50
40
30
20
10
0
5Vdc
15Vdc
30Vdc
1
0.1
0.01
0.001
0.01
Output Sink Current (mAdc)
Figure 7-47. Output Sinking Characteristics
0.1
1
10
100
–55
5
–35
–15
25
45
65
85
105
125
Temperature (°C)
Figure 7-48. Source Current Limiting
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8 Parameter Measurement Information
900 Ω
V
CC+
V
CC+
−
100 Ω
V
O
−
+
V = 0 V
I
+
V
I
V
O
RS
C
L
V
CC−
R
L
V
CC−
Figure 8-2. Noise-Test Circuit
Figure 8-1. Unity-Gain Amplifier
10 k
+18V
–
VIN
+
-18V
GND
GND
Figure 8-3. Test Circuit, G = –1, for THD+N and Small-Signal Step Response
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LM358, LM358A, LM358B, LM358BA
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9 Detailed Description
9.1 Overview
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is within the supply voltage range specified in Section 7.3 and VS is at least
1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the
magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices
can be operated directly from the standard 5-V supply used in digital systems and easily can provide the
required interface electronics without additional ±5-V supplies.
9.2 Functional Block Diagram: LM358B, LM358BA, LM2904B, LM2904BA
VCC+
~6 µA
Current
Regulator
~6 µA
Current
Regulator
~100 µA
Current
Regulator
IN-
OUT
IN+
~120 µA
Current
Regulator
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LM358, LM358A, LM358B, LM358BA
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9.3 Feature Description
9.3.1 Unity-Gain Bandwidth
The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without
greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).
9.3.2 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. These devices have a 0.5-V/µs slew rate (B Version).
9.3.3 Input Common Mode Range
The valid common mode range is from device ground to VS – 1.5 V (VS – 2 V across temperature). Inputs
may exceed VS up to the maximum VS without device damage. At least one input must be in the valid input
common-mode range for the output to be the correct phase. If both inputs exceed the valid range, then the
output phase is undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA
and the output phase is undefined.
9.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single-supply
operational amplifier or dual-supply amplifier, depending on the application.
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LM358, LM358A, LM358B, LM358BA
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10 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and
TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
10.1 Application Information
The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications.
Inputs can be powered before VSfor flexibility in multiple supply circuits.
10.2 Typical Application
A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage
on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes
negative voltages positive.
RF
Vsup+
RI
VOUT
+
VIN
Vsup-
Figure 10-1. Application Schematic
10.2.1 Design Requirements
The supply voltage must be chosen such that it is larger than the input voltage range and output range. For
instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to
accommodate this application.
10.2.2 Detailed Design Procedure
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:
VOUT
A V
=
VIN
(1)
(2)
1.8
A V
=
= - 3.6
-0.5
Once the desired gain is determined, choose a value for RI or RF. [Subscripts should be fixed in the
accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the
amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current.
This example uses 10 kΩ for RI which means 36 kΩ is used for RF. This was determined by Equation 3.
RF
A V = -
RI
(3)
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
www.ti.com
10.2.3 Application Curve
2
VIN
1.5
1
VOUT
0.5
0
-0.5
-1
-1.5
-2
0
0.5
1
Time (ms)
1.5
2
Figure 10-2. Input and Output Voltages of the Inverting Amplifier
11 Power Supply Recommendations
CAUTION
Supply voltages larger than specified in the recommended operating region can permanently
damage the device (see Section 7.1).
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or
high-impedance power supplies. For more detailed information on bypass capacitor placement, see Section 12.
12 Layout
12.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
•
Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
•
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it
is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed
to in parallel with the noisy trace.
•
•
•
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Section 12.2.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
www.ti.com
12.2 Layout Examples
Place components close to
device and to each other to
reduce parasitic errors
Run the input traces as far
away from the supply lines
as possible
VS+
RF
OUT1
V+
RG
GND
OUT2
IN1Þ
GND
VIN
IN1+
IN2Þ
RIN
IN2+
VÞ
Use low-ESR, ceramic
bypass capacitor
Only needed for
dual-supply
operation
VSÞ
(or GND for single supply)
GND
Ground (GND) plane on another layer
Figure 12-1. Operational Amplifier Board Layout for Noninverting Configuration
RIN
VIN
+
VOUT
RG
RF
Figure 12-2. Operational Amplifier Schematic for Noninverting Configuration
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
www.ti.com
13 Device and Documentation Support
13.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
13.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
13.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
13.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
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Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
LM158, LM158A, LM258, LM258A
LM2904, LM2904B, LM2904BA, LM2904V
LM358, LM358A, LM358B, LM358BA
SLOS068Z – JUNE 1976 – REVISED JULY 2021
www.ti.com
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most-
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.
Copyright © 2021 Texas Instruments Incorporated
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33
Product Folder Links: LM158 LM158A LM258 LM258A LM2904 LM2904B LM2904BA LM2904V LM358
LM358A LM358B LM358BA
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
5962-87710012A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-
87710012A
LM158FKB
5962-8771001PA
5962-87710022A
ACTIVE
ACTIVE
CDIP
JG
FK
8
1
1
Non-RoHS
& Green
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8771001PA
LM158
LCCC
20
Non-RoHS
& Green
5962-
87710022A
LM158AFKB
5962-8771002PA
ACTIVE
CDIP
JG
8
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
8771002PA
LM158A
LM158 MW8
LM158AFKB
ACTIVE WAFERSALE
YS
FK
0
1
1
RoHS & Green
Call TI
SNPB
Level-1-NA-UNLIM
N / A for Pkg Type
-55 to 125
-55 to 125
ACTIVE
LCCC
20
Non-RoHS
& Green
5962-
87710022A
LM158AFKB
LM158AJG
LM158AJGB
LM158FKB
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
LCCC
JG
JG
FK
8
8
1
1
1
Non-RoHS
& Green
SNPB
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
LM158AJG
Non-RoHS
& Green
8771002PA
LM158A
20
Non-RoHS
& Green
5962-
87710012A
LM158FKB
LM158JG
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
8
8
1
1
Non-RoHS
& Green
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
LM158JG
LM158JGB
Non-RoHS
& Green
8771001PA
LM158
LM258AD
LIFEBUY
ACTIVE
SOIC
D
8
8
75
RoHS & Green
NIPDAU
-25 to 85
-25 to 85
LM258A
LM258ADGKR
VSSOP
DGK
2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
(M3L, M3P, M3S, M3
U)
LM258ADR
LM258ADRE4
LM258ADRG4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
D
D
D
8
8
8
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
NIPDAU | SN
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-25 to 85
-25 to 85
-25 to 85
LM258A
LM258A
LM258A
NIPDAU
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2021
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM258AP
ACTIVE
ACTIVE
PDIP
PDIP
P
P
8
8
50
50
RoHS & Green
RoHS & Green
NIPDAU | SN
N / A for Pkg Type
N / A for Pkg Type
-25 to 85
-25 to 85
LM258AP
LM258APE4
NIPDAU
LM258AP
LM258D
LM258DG4
LM258DGKR
LIFEBUY
LIFEBUY
ACTIVE
SOIC
SOIC
D
D
8
8
8
75
75
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-25 to 85
-25 to 85
-25 to 85
LM258
LM258
VSSOP
DGK
2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
(M2L, M2P, M2S, M2
U)
LM258DGKRG4
LIFEBUY
VSSOP
DGK
8
2500 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
(M2L, M2P, M2S, M2
U)
LM258DR
LM258DRG3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
PDIP
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
NIPDAU | SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM258
LM258
LM258DRG4
D
NIPDAU
NIPDAU | SN
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
LM258
LM258P
P
50
50
RoHS & Green
RoHS & Green
LM258P
LM258P
L2904AV
L2904AV
L2904AV
L2904AV
2904BA
L2904
LM258PE4
PDIP
P
N / A for Pkg Type
LM2904AVQDR
LM2904AVQDRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904BAIDR
LM2904BIDDFR
LM2904BIDGKR
LM2904BIDR
SOIC
SOIC
TSSOP
TSSOP
SOIC
D
2500 RoHS & Green
2500 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
2500 RoHS & Green
3000 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2000 RoHS & Green
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
D
PW
PW
D
ACTIVE SOT-23-THIN
DDF
DGK
D
ACTIVE
ACTIVE
ACTIVE
VSSOP
SOIC
28BB
L2904B
L2904B
LM2904BIPWR
TSSOP
PW
LM2904D
LIFEBUY
LIFEBUY
SOIC
SOIC
D
D
8
8
75
75
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
LM2904
LM2904
LM2904DE4
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2021
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM2904DG4
LIFEBUY
ACTIVE
SOIC
D
8
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
-40 to 125
LM2904
LM2904DGKR
VSSOP
DGK
2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
(MBL, MBP, MBS, MB
U)
LM2904DGKRG4
LIFEBUY
VSSOP
DGK
8
2500 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
(MBL, MBP, MBS, MB
U)
LM2904DR
LM2904DRE4
LM2904DRG3
LM2904DRG4
LM2904P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
NIPDAU | SN
NIPDAU
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM2904
LM2904
LM2904
LM2904
LM2904P
LM2904P
L2904
SOIC
D
SOIC
D
NIPDAU
NIPDAU | SN
NIPDAU
NIPDAU
NIPDAU
NIPDAU | SN
SN
PDIP
P
50
50
RoHS & Green
RoHS & Green
LM2904PE4
PDIP
P
N / A for Pkg Type
LM2904PSR
SO
PS
PW
PW
PW
PW
PW
D
2000 RoHS & Green
150 RoHS & Green
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LM2904PW
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
L2904
LM2904PWR
2000 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
L2904
LM2904PWRG3
LM2904PWRG4
LM2904PWRG4-JF
LM2904QDR
L2904
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
L2904
L2904
2904Q1
2904Q1
L2904V
L2904V
L2904V
L2904V
LM2904QDRG4
LM2904VQDR
LM2904VQDRG4
LM2904VQPWR
LM2904VQPWRG4
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
PW
PW
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2021
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM358AD
LM358ADE4
LM358ADG4
LM358ADGKR
LIFEBUY
LIFEBUY
LIFEBUY
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
75
75
75
RoHS & Green
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
LM358A
LM358A
LM358A
SOIC
D
VSSOP
DGK
2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
(M6L, M6P, M6S, M6
U)
LM358ADGKRG4
LIFEBUY
VSSOP
DGK
8
2500 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
(M6L, M6P, M6S, M6
U)
LM358ADR
LM358ADRE4
LM358ADRG4
LM358AP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
NIPDAU | SN
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
LM358A
LM358A
LM358A
LM358AP
LM358AP
L358A
SOIC
D
NIPDAU
0 to 70
PDIP
P
50
50
RoHS & Green
RoHS & Green
RoHS & Green
NIPDAU | SN
NIPDAU
0 to 70
LM358APE4
LM358APW
PDIP
P
N / A for Pkg Type
0 to 70
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
D
150
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
0 to 70
LM358APWR
LM358APWRG4
LM358BAIDR
LM358BIDDFR
LM358BIDGKR
LM358BIDR
2000 RoHS & Green
2000 RoHS & Green
2500 RoHS & Green
3000 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2000 RoHS & Green
NIPDAU | SN
NIPDAU
0 to 70
L358A
0 to 70
L358A
NIPDAU
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
L358BA
LM358
ACTIVE SOT-23-THIN
DDF
DGK
D
NIPDAU
ACTIVE
ACTIVE
ACTIVE
VSSOP
SOIC
NIPDAU
358B
NIPDAU
LM358B
LM358B
LM358BIPWR
TSSOP
PW
NIPDAU
LM358D
LM358D-JF
LM358DG4
LM358DGKR
LIFEBUY
LIFEBUY
LIFEBUY
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
75
75
75
RoHS & Green
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
LM358
LM358
LM358
SOIC
D
VSSOP
DGK
2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
(M5L, M5P, M5S, M5
U)
LM358DGKRG4
LIFEBUY
VSSOP
DGK
8
2500 RoHS & Green NIPDAU Level-1-260C-UNLIM
0 to 70
(M5L, M5P, M5S, M5
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2021
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
U)
LM358DR
LM358DRE4
LM358DRG3
LM358DRG4
LM358P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
P
P
8
8
8
8
8
8
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
NIPDAU | SN
NIPDAU
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM358
LM358
LM358
LM358
LM358P
LM358P
NIPDAU
NIPDAU | SN
SN
50
50
RoHS & Green
LM358PE3
RoHS &
N / A for Pkg Type
Non-Green
LM358PE4
LM358PSR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
8
8
8
8
8
8
8
50
RoHS & Green
NIPDAU
NIPDAU
NIPDAU
NIPDAU | SN
SN
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM358P
L358
L358
L358
L358
L358
L358
PS
2000 RoHS & Green
150 RoHS & Green
LM358PW
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
LM358PWR
2000 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
2000 RoHS & Green
LM358PWRG3
LM358PWRG4
LM358PWRG4-JF
NIPDAU
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2021
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B :
Automotive : LM2904-Q1, LM2904B-Q1
•
Enhanced Product : LM258A-EP, LM2904-EP
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM258ADGKR
LM258ADR
VSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
TSSOP
TSSOP
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.8
15.4
12.8
12.4
12.4
12.5
12.5
12.4
12.4
5.3
6.4
6.4
6.4
6.4
6.4
5.3
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
7.0
7.0
3.4
5.2
5.2
5.2
5.2
5.2
3.4
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
3.6
3.6
1.4
2.1
2.1
2.1
2.1
2.1
1.4
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
1.6
1.6
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LM258ADR
D
LM258ADR
D
LM258ADRG4
LM258ADRG4
LM258DGKR
LM258DR
D
D
DGK
D
LM258DR
D
LM258DR
D
LM258DRG3
LM258DRG3
LM258DRG4
LM258DRG4
LM2904AVQDR
LM2904AVQDRG4
LM2904AVQPWR
LM2904AVQPWRG4
D
D
D
D
D
D
PW
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2021
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2904BAIDR
LM2904BIDDFR
SOIC
D
8
8
2500
3000
330.0
180.0
12.4
8.4
6.4
3.2
5.2
3.2
2.1
1.4
8.0
4.0
12.0
8.0
Q1
Q3
SOT-
DDF
23-THIN
LM2904BIDGKR
LM2904BIDR
LM2904BIPWR
LM2904DGKR
LM2904DGKR
LM2904DR
VSSOP
SOIC
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2000
2000
2000
2500
3000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
180.0
12.4
12.4
12.4
12.4
12.4
12.4
12.8
12.4
12.8
15.4
12.4
12.4
16.4
12.4
12.4
12.4
12.4
12.4
12.4
12.5
12.4
12.4
12.4
12.4
12.8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
8.4
5.3
6.4
7.0
5.3
5.3
6.4
6.4
6.4
6.4
6.4
6.4
6.4
8.35
7.0
7.0
7.0
7.0
7.0
6.4
6.4
7.0
7.0
5.3
6.4
6.4
6.4
6.4
6.4
7.0
7.0
7.0
6.4
3.2
3.4
5.2
3.6
3.4
3.4
5.2
5.2
5.2
5.2
5.2
5.2
5.2
6.6
3.6
3.6
3.6
3.6
3.6
5.2
5.2
3.6
3.6
3.4
5.2
5.2
5.2
5.2
5.2
3.6
3.6
3.6
5.2
3.2
1.4
2.1
1.6
1.4
1.4
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.4
1.6
1.6
1.6
1.6
1.6
2.1
2.1
1.6
1.6
1.4
2.1
2.1
2.1
2.1
2.1
1.6
1.6
1.6
2.1
1.4
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q3
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DR
SOIC
D
LM2904DRG3
LM2904DRG3
LM2904DRG4
LM2904DRG4
LM2904PSR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SO
PS
PW
PW
PW
PW
PW
D
LM2904PWR
LM2904PWR
LM2904PWRG3
LM2904PWRG4
LM2904PWRG4-JF
LM2904QDR
LM2904VQDR
LM2904VQPWR
LM2904VQPWRG4
LM358ADGKR
LM358ADR
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
SOIC
D
TSSOP
TSSOP
VSSOP
SOIC
PW
PW
DGK
D
LM358ADR
SOIC
D
LM358ADR
SOIC
D
LM358ADRG4
LM358ADRG4
LM358APWR
LM358APWR
LM358APWRG4
LM358BAIDR
LM358BIDDFR
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
D
SOT-
DDF
23-THIN
LM358BIDGKR
LM358BIDR
LM358BIPWR
LM358DGKR
LM358DGKR
LM358DR
VSSOP
SOIC
DGK
D
8
8
8
8
8
8
2500
2500
2000
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
5.3
6.4
7.0
5.3
5.3
6.4
3.4
5.2
3.6
3.4
3.4
5.2
1.4
2.1
1.6
1.4
1.4
2.1
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2021
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM358DR
LM358DR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.8
12.4
12.8
15.4
12.4
12.4
16.4
12.4
12.4
12.4
12.4
12.4
6.4
6.4
6.4
6.4
6.4
6.4
8.35
7.0
7.0
7.0
7.0
7.0
5.2
5.2
5.2
5.2
5.2
5.2
6.6
3.6
3.6
3.6
3.6
3.6
2.1
2.1
2.1
2.1
2.1
2.1
2.4
1.6
1.6
1.6
1.6
1.6
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LM358DRG3
LM358DRG3
LM358DRG4
LM358DRG4
LM358PSR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SO
PS
PW
PW
PW
PW
PW
LM358PWR
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LM358PWR
LM358PWRG3
LM358PWRG4
LM358PWRG4-JF
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM258ADGKR
LM258ADR
VSSOP
SOIC
SOIC
SOIC
SOIC
DGK
D
8
8
8
8
8
2500
2500
2500
2500
2500
364.0
364.0
853.0
340.5
340.5
364.0
364.0
449.0
336.1
336.1
27.0
27.0
35.0
25.0
25.0
LM258ADR
D
LM258ADR
D
LM258ADRG4
D
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2021
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM258ADRG4
LM258DGKR
LM258DR
SOIC
VSSOP
SOIC
D
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
3000
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2000
853.0
364.0
340.5
853.0
364.0
333.2
364.0
853.0
340.5
340.5
340.5
853.0
853.0
340.5
210.0
366.0
340.5
853.0
364.0
358.0
853.0
364.0
340.5
364.0
333.2
853.0
340.5
853.0
853.0
364.0
364.0
853.0
853.0
350.0
340.5
853.0
853.0
364.0
853.0
364.0
340.5
340.5
853.0
853.0
449.0
364.0
336.1
449.0
364.0
345.9
364.0
449.0
336.1
336.1
336.1
449.0
449.0
336.1
185.0
364.0
336.1
449.0
364.0
335.0
449.0
364.0
336.1
364.0
345.9
449.0
336.1
449.0
449.0
364.0
364.0
449.0
449.0
350.0
336.1
449.0
449.0
364.0
449.0
364.0
336.1
336.1
449.0
449.0
35.0
27.0
25.0
35.0
27.0
28.6
27.0
35.0
25.0
25.0
25.0
35.0
35.0
25.0
35.0
50.0
25.0
35.0
27.0
35.0
35.0
27.0
25.0
27.0
28.6
35.0
25.0
35.0
35.0
27.0
27.0
35.0
35.0
43.0
25.0
35.0
35.0
27.0
35.0
27.0
25.0
25.0
35.0
35.0
LM258DR
SOIC
D
LM258DR
SOIC
D
LM258DRG3
SOIC
D
LM258DRG3
SOIC
D
LM258DRG4
SOIC
D
LM258DRG4
SOIC
D
LM2904AVQDR
LM2904AVQDRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904BAIDR
LM2904BIDDFR
LM2904BIDGKR
LM2904BIDR
LM2904BIPWR
LM2904DGKR
LM2904DGKR
LM2904DR
SOIC
D
SOIC
D
TSSOP
TSSOP
SOIC
PW
PW
D
SOT-23-THIN
VSSOP
SOIC
DDF
DGK
D
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DR
SOIC
D
LM2904DRG3
LM2904DRG3
LM2904DRG4
LM2904DRG4
LM2904PSR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SO
PS
PW
PW
PW
PW
PW
D
LM2904PWR
LM2904PWR
LM2904PWRG3
LM2904PWRG4
LM2904PWRG4-JF
LM2904QDR
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
LM2904VQDR
LM2904VQPWR
LM2904VQPWRG4
LM358ADGKR
LM358ADR
SOIC
D
TSSOP
TSSOP
VSSOP
SOIC
PW
PW
DGK
D
LM358ADR
SOIC
D
LM358ADR
SOIC
D
LM358ADRG4
LM358ADRG4
LM358APWR
SOIC
D
SOIC
D
TSSOP
PW
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2021
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM358APWR
LM358APWRG4
LM358BAIDR
LM358BIDDFR
LM358BIDGKR
LM358BIDR
TSSOP
TSSOP
SOIC
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2000
2000
2500
3000
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
364.0
853.0
340.5
210.0
366.0
340.5
853.0
358.0
364.0
853.0
364.0
340.5
364.0
333.2
340.5
853.0
853.0
364.0
853.0
364.0
853.0
853.0
364.0
449.0
336.1
185.0
364.0
336.1
449.0
335.0
364.0
449.0
364.0
336.1
364.0
345.9
336.1
449.0
449.0
364.0
449.0
364.0
449.0
449.0
27.0
35.0
25.0
35.0
50.0
25.0
35.0
35.0
27.0
35.0
27.0
25.0
27.0
28.6
25.0
35.0
35.0
27.0
35.0
27.0
35.0
35.0
SOT-23-THIN
VSSOP
SOIC
DDF
DGK
D
LM358BIPWR
LM358DGKR
LM358DGKR
LM358DR
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM358DR
SOIC
D
LM358DR
SOIC
D
LM358DRG3
LM358DRG3
LM358DRG4
LM358DRG4
LM358PSR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SO
PS
PW
PW
PW
PW
PW
LM358PWR
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LM358PWR
LM358PWRG3
LM358PWRG4
LM358PWRG4-JF
Pack Materials-Page 5
PACKAGE OUTLINE
DDF0008A
SOT-23 - 1.1 mm max height
S
C
A
L
E
4
.
0
0
0
PLASTIC SMALL OUTLINE
C
2.95
2.65
SEATING PLANE
TYP
PIN 1 ID
AREA
0.1 C
A
6X 0.65
8
1
2.95
2.85
NOTE 3
2X
1.95
4
5
0.4
0.2
8X
0.1
C A
B
1.65
1.55
B
1.1 MAX
0.20
0.08
TYP
SEE DETAIL A
0.25
GAGE PLANE
0.1
0.0
0 - 8
0.6
0.3
DETAIL A
TYPICAL
4222047/B 11/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
1
8
8X (0.45)
SYMM
6X (0.65)
5
4
(R0.05)
TYP
(2.6)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222047/B 11/2015
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DDF0008A
SOT-23 - 1.1 mm max height
PLASTIC SMALL OUTLINE
8X (1.05)
SYMM
(R0.05) TYP
8
1
8X (0.45)
SYMM
6X (0.65)
5
4
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4222047/B 11/2015
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
8
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
SEATING PLANE
TYP
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
5
1
3.1
2.9
NOTE 3
2X
1.95
4
0.30
0.19
8X
4.5
4.3
1.2 MAX
B
0.1
C A
B
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 - 8
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
8X (0.45)
(R0.05)
1
4
TYP
8
SYMM
6X (0.65)
5
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
(R0.05) TYP
8X (0.45)
1
4
8
SYMM
6X (0.65)
5
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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