LM3525M-L/NOPB [TI]
0.5A 负载、2.7-5.5V、80mΩ USB 电源开关 | D | 8 | -40 to 125;
| 型号： | LM3525M-L/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 0.5A 负载、2.7-5.5V、80mΩ USB 电源开关 | D | 8 | -40 to 125 开关 驱动 电源开关 光电二极管 接口集成电路 |
| 文件： | 总20页 (文件大小：1276K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM3525
www.ti.com
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
LM3525 Single Port USB Power Switch and Over-Current Protection
Check for Samples: LM3525
1
FEATURES
DESCRIPTION
The LM3525 provides Universal Serial Bus standard
power switch and over-current protection for all host
port applications. The single port device is ideal for
Notebook PC and Handheld PC applications that
supply power to one port.
2
•
•
•
Compatible with USB1.1 and USB 2.0
1 ms Fault Flag Delay During Hot-Plug Events
Smooth Turn-On Eliminates Inrush Induced
Voltage Drop
•
•
UL Recognized Component: REF # 205202
A 1 ms delay on fault flag output prevents erroneous
overcurrent reporting caused by inrush currents
during the hot-plug events.
1A Nominal Short Circuit Output Current
Protects Notebook PC Power Supplies
•
Thermal Shutdown Protects Device in Direct
Short Condition
The LM3525 accepts an input voltage between 2.7V
and 5.5V allowing use as a device-based inrush
current limiter for 3.3V USB peripherals, as well as
Root and Self-Powered Hubs at 5.5V. The Enable
input accepts both 3.3V and 5.0V logic thresholds.
•
•
•
•
•
•
•
500mA Minimum Continuous Load Current
Small SOIC-8 Package Minimizes Board Space
2.7V to 5.5V Input Voltage Range
Switch Resistance ≤ 120 mΩ Max. at VIN = 5V
1µA Max Standby Current
The small size, low RON, and 1 ms fault flag delay
make the LM3525 a good choice for root hubs as well
as ganged power control in space-critical self-
powered hubs.
100 µA Max Operating Current
Undervoltage Lockout (UVLO)
APPLICATIONS
•
Universal Serial Bus (USB) Root Hubs
including Desktop and Notebook PC
•
•
•
USB Monitor Hubs
Other Self-Powered USB Hub Devices
High Power USB Devices Requiring Inrush
Limiting
•
General Purpose High Side Switch
Applications
Typical Operating Circuit and Connection Diagram
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM3525
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
www.ti.com
Figure 1. LM3525M-L
Figure 2. LM3525M-H
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage
−0.3V to 6.0V
−0.3V to 6.0V
−0.3V to 5.5V
700 mW
Output Voltage
Voltage at All Other Pins
Power Dissipation (TA = 25°C)(3)
(3)
TJMAX
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its rated operating conditions. Products are not tested under negative Absolute Maximum conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDMAX = (TJMAX − TA)/θJA or the number given in the Absolute Maximum Ratings, which ever is lower. The thermal
resistance θJA of the LM3525 in the SOIC-8 package is 150°C/W.
Operating Ratings
Supply Voltage Range
2.7 to 5.5V
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
260°C
Operating Ambient Range
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 5 seconds)
ESD Rating(1)
2 kV
(1) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
2
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3525
LM3525
www.ti.com
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
DC Electrical Characteristics
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = 5.0V, EN = 0V (LM3525-L) or EN = VIN (LM3525-H).
Symbol
Parameter
Conditions
Min
Typ
Max
Units
IN to Out pins
RON
On-Resistance
VIN = 5V
VIN = 2.7V
80
120
120
160
mΩ
IOUT
ISC
OUT pins continuous output current
Short Circuit Output Current
0.5
A
A
See(1)
0.5
1.0
1.5
10
ILEAK
OUT pins Output Leakage Current EN = VIN (LM3525-L) or
EN = GND (LM3525-H),
0.15
µA
OCTHRESH
RFO
Over-current Threshold
2.25
6
3.2
25
A
IFO = 10 mA, VIN = 5V
FLAG Output Resistance
Ω
IFO = 10 mA, VIN = 2.7V
8
40
IEN
EN/EN Leakage Current
EN/EN Input Voltage
EN/EN Input Voltage
Under-Voltage Lockout
EN/EN = 0V or EN/EN = VIN
−0.5
0.5
µA
V
VIH
See(2)
See(2)
2.4
1.9
1.7
VIL
0.8
V
VUVLO
VIN = Increasing
VIN = Decreasing
1.9
1.8
V
IDDOFF
IDDON
ThSD
Supply Current
Supply Current
Switch OFF
Switch ON
0.05
65
1
µA
µA
100
Overtemperature Shutdown
Threshold(1)
TJ Increasing
TJ Decreasing
135
125
°C
°C
IFH
Error Flag Leakage Current
VFLAG= 5V
0.1
1
µA
(1) Thermal shutdown will protect the device from permanent damage.
(2) For the LM3525-L, OFF is EN ≥ 2.4V and ON is EN ≤ 0.8V. For the LM3525-H, OFF is EN ≤ 0.8V and ON is EN ≥ 2.4V
AC Electrical Characteristics
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = 5.0V.
Symbol
Parameter
OUT Rise Time
Conditions
Min
Typ
200
20
Max
Units
µs
tr
RL = 10Ω
RL = 10Ω
RL = 10Ω
RL = 10Ω
RL = 0
tf
OUT Fall Time
µs
tON
Turn on Delay, EN to OUT
Turn off Delay, EN to OUT
Over Current Flag Delay
200
20
µs
tOFF
tOC
µs
1
ms
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM3525
LM3525
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
www.ti.com
TYPICAL APPLICATION CIRCUIT
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
1
EN (LM3525-L) Enable (Input): Logic-compatible enable input.
EN (LM3525-H)
2
3
FLG
GND
NC
Fault Flag (Output): Active-low, open-drain output. Indicates overcurrent, UVLO and thermal shutdown.
Ground
4, 5
7
Not internally connected.
IN
Supply Input: This pin is the input to the power switch and the supply voltage for the IC.
Switch Output: This pin is the output of the high side switch. Pins 6 & 8 must be tied together.
6, 8
OUT
Figure 3. Typical Application Circuit
4
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3525
LM3525
www.ti.com
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
Typical Performance Characteristics
VIN = 5.0V, IL = 500 mA, TA = 25°C unless otherwise specified.
RDSON
vs
VIN
RDSON
vs
Temperature
Figure 4.
Figure 5.
Current Limit
vs
Temperature
Over Current Threshold
vs
Temperature
Figure 6.
Figure 7.
Delay
vs
Temperature
UVLO Threshold
Figure 8.
Figure 9.
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM3525
LM3525
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
VIN = 5.0V, IL = 500 mA, TA = 25°C unless otherwise specified.
Short Circuit Response
Under Voltage Lock Out (UVLO)
Figure 10.
Figure 11.
Turn-ON/OFF Delay and Rise Time/Fall Time
Short Circuit Current
Figure 12.
Figure 13.
6
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3525
LM3525
www.ti.com
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
FUNCTIONAL DESCRIPTION
The LM3525-H and LM3525-L are high side P-Channel switches with active-high and active-low enable inputs,
respectively. Fault conditions turn off and inhibit turn-on of the output transistor and activate the open-drain error
flag transistor sinking current to the ground.
INPUT AND OUTPUT
IN (Input) is the power supply connection to the control circuitry and the source of the output MOSFET.
OUT (Output) is the drain of the output MOSFET. In a typical application circuit, current flows through the switch
from IN to OUT towards the load.
If VOUT is greater than VIN when the switch is enabled, current will flow from OUT to IN since the MOSFET is
bidirectional.
THERMAL SHUTDOWN
LM3525 is internally protected against excessive power dissipation. In the event of a shorted output or heavy
loads that could elevate the die temperature to above approximately 135°C, the thermal shutdown circuit of the
LM3525 will be activated and the power switch turned off.
The switch is turned on after die temperature drops by 10°C. This built-in temperature hysteresis prevents
undesirable oscillation of the thermal protection circuit and allows the device to reset itself after it is cooled down.
UNDERVOLTAGE LOCKOUT
UVLO prevents the MOSFET switch from turning on until input voltage exceeds 1.9V.
UVLO shuts off the MOSFET switch and signals the fault flag if input voltage drops below 1.8V. UVLO functions
only when device is enabled.
CURRENT LIMIT
The current limit circuit is designed to protect the system supply, the MOSFET switches and the load from
damage caused by excessive currents. The current limit threshold is set internally to allow a minimum of 500 mA
through the MOSFET but limit the maximum current to 1.0A typical.
FAULT FLAG
The fault flag is an open-drain output capable of sinking 10 mA load current to typically 60 mV above ground.
The fault flag is active (pulled low) when any of the following conditions are present: undervoltage, current limit,
or thermal shutdown.
A 1ms delay in reporting fault condition prevents erroneous fault flags and eliminates the need for external RC
delay network.
Application Information
FILTERING
The USB specification indicates that “no less than 120 µF tantalum capacitors” must be used on the output of
each downstream port. This bulk capacitance provides the short-term transient current needed during a hot plug-
in. Current surges caused by the input capacitance of the down stream device could generate undesirable EMI
signals. Ferrite beads in series with all power and ground lines are recommended to eliminate or significantly
reduce EMI.
In selecting a ferrite bead, the DC resistance of the wire used must be kept to minimum to reduce the voltage
drop.
A 0.01 µF ceramic capacitor is recommended on each port directly between the Vbus and ground pins to prevent
EMI damage to other components during the hot - detachment.
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM3525
LM3525
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
www.ti.com
Adequate capacitance must be connected to the input of the device to limit the input voltage drop during a hot-
plug event to less than 330 mV. For a few tens of µs, the host must supply the inrush current to the peripheral,
charging its bulk capacitance to Vbus. This current is initially supplied by the input capacitor. A 33 µF 16V
tantalum capacitor is recommended.
In choosing the capacitors, special attention must be paid to the Effective Series Resistance, ESR, of the
capacitors to minimize the IR drop across the capacitor's ESR.
SOFT START
To eliminate the upstream voltage droop caused by the high in-rush current drawn by the output capacitors, the
inrush current is internally limited to 1.0A.
TRANSIENT OVER-CURRENT DELAY
In USB applications, it is required that output bulk capacitance is utilized to support hot-plug events. During hot-
plug events, inrush currents may also cause the flag to go active. Since these conditions are not valid over-
current faults, the USB controller must ignore the flag during these events.
High transient current is also generated when switch is enabled and large values of capacitance at the output
have to be rapidly charged. The inrush currents created could exceed the short circuit current limit threshold of
the device forcing it into the current limit mode. The capacitor is charged with the maximum available short circuit
current set by the LM3525. The duration of the inrush current depends on the size of the output capacitance and
load current. Since this is not a valid fault condition, the LM3525 delays the generation of the fault flag for 1 ms.
If condition persists due to other causes such as a short, a fault flag is generated after a 1 ms delay has elapsed.
The LM3525's 1 ms delay in issuing the fault flag is adequate for most applications. If longer delays are required,
an RC filter as shown in Figure 14 may be used.
Figure 14. Transient Fitter
PCB LAYOUT CONSIDERATIONS
In order to meet the USB requirements for voltage drop, droop and EMI, each component used in this circuit
must be evaluated for its contribution to the circuit performance as shown in Figure 15. The PCB layout rules and
guidelines must be followed.
•
Place the switch as close to the USB connector as possible. Keep all Vbus traces as short as possible and use
at least 50-mil, 1 ounce copper for all Vbus traces. Solder plating the traces will reduce the trace resistance.
•
Avoid vias as much as possible. If vias are used, use multiple vias in parallel and/or make them as large as
possible.
•
•
Place the output capacitor and ferrite beads as close to the USB connector as possible.
If ferrite beads are used, use wires with minimum resistance and large solder pads to minimize connection
resistance.
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3525
LM3525
www.ti.com
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
Figure 15. Self-Powered Hub Per-Port Voltage Drop
Typical Applications
Figure 16. SIngle-Port USB Self-Powered Hub
Figure 17. Soft-Start Application
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM3525
LM3525
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
www.ti.com
Figure 18. Inrush Current-limit Application
10
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3525
LM3525
www.ti.com
SNVS051D –FEBRUARY 2000–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM3525
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
95
95
95
95
(1)
(2)
(3)
(4/5)
(6)
LM3525M-H
LM3525M-H/NOPB
LM3525M-L
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
8
8
8
8
8
8
Non-RoHS
& Green
Call TI
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
3525
M-H
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
RoHS & Green
SN
Call TI
SN
3525
M-H
Non-RoHS
& Green
3525
M-L
LM3525M-L/NOPB
LM3525MX-H/NOPB
LM3525MX-L/NOPB
RoHS & Green
3525
M-L
2500 RoHS & Green
2500 RoHS & Green
SN
3525
M-H
SN
3525
M-L
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Sep-2021
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM3525MX-H/NOPB
LM3525MX-L/NOPB
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.5
6.5
5.4
5.4
2.0
2.0
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM3525MX-H/NOPB
LM3525MX-L/NOPB
SOIC
SOIC
D
D
8
8
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM3525M-H
LM3525M-H
D
D
D
D
D
D
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
8
8
8
8
8
8
95
95
95
95
95
95
495
495
495
495
495
495
8
8
8
8
8
8
4064
4064
4064
4064
4064
4064
3.05
3.05
3.05
3.05
3.05
3.05
LM3525M-H/NOPB
LM3525M-L
LM3525M-L
LM3525M-L/NOPB
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明