LM3556TMX/NOPB [TI]
LM3556 1.5A 感应式白光 LED 相机闪存器件 | YFQ | 16 | -40 to 85;型号: | LM3556TMX/NOPB |
厂家: | TEXAS INSTRUMENTS |
描述: | LM3556 1.5A 感应式白光 LED 相机闪存器件 | YFQ | 16 | -40 to 85 闪存 |
文件: | 总5页 (文件大小:138K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
May 31, 2012
LM3556 PRODUCT BRIEF
1.5A Synchronous Boost LED Flash Driver w/ High-Side
Current Source
General Description
Features
The LM3556 is a 4 MHz fixed-frequency synchronous boost
converter plus 1.5A constant current driver for a high-current
white LED. The high-side current source allows for grounded
cathode LED operation providing Flash current up to 1.5A. An
adaptive regulation method ensures the current source re-
mains in regulation and maximizes efficiency.
Grounded Cathode LED Operation for Improved Thermal
■
Management
1.5A High-Side Current Source for Single LED
■
■
Accurate and Programmable LED Current from 46.9 mA
to 1.5A
> 85% Efficiency in Torch Mode (@ 100 mA) and Flash
Mode (@1A to 1.5A)
■
The LM3556 is controlled via an I2C-compatible interface.
Features include: a hardware flash enable (STROBE) allow-
ing a logic input to trigger the flash pulse, a hardware Torch
enable (TORCH) for Movie Mode or Flashlight functions, a TX
input which forces the flash pulse into a low-current Torch
mode allowing for synchronization to RF power amplifier
events or other high-current conditions, and an integrated
comparator designed to monitor an NTC thermistor and pro-
vide an interrupt to the LED current. With a fast 1 μs transition
from 0 mA to 46.9 mA, the Torch input pin can be used to
develop custom LED current waveforms.
Small Solution Size: < 20 mm2
■
■
■
■
■
■
■
LED Thermal Sensing and Current Scale-Back
Soft-Start Operation for Battery Protection
Hardware Enable Pin
Hardware Torch Enable
Hardware Strobe Enable
Synchronization Input for RF Power Amplifier Pulse
Events
VIN Flash Monitor Optimization
400 kHz I2C-Compatible Interface
I2C-Programmable NTC Trip Point
■
■
■
■
The 4 MHz switching frequency, over-voltage protection and
adjustable current limit allow for the use of tiny, low-profile
inductors and (10 µF) ceramic capacitors. The device is avail-
able in a small 16-bump (1.615 mm x 1.665 mm x 0.6 mm)
micro SMD package and operates over the −40°C to +85°C
temperature range.
0.4 mm Pitch, 16-Bump micro SMD
Applications
NOTE: This document is not a full datasheet. For more
information regarding this product or to order samples,
please contact your local Texas Instruments sales office
or visit www.ti.com.
Camera Phone LED Flash
■
Typical Application Circuit
30171801
© 2012 Texas Instruments Incorporated
301718 SNVS796A
www.ti.com
Physical Dimensions inches (millimeters) unless otherwise noted
TMD16ACA: 16-Bump micro SMD
X1 = 1.615 mm ±30 µm
X2 = 1.665 mm ±30 µm
X3 = 0.6 mm ±75 µm
www.ti.com
2
Notes
3
www.ti.com
Notes
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
©2020 ICPDF网 联系我们和版权申明