LM358BAIDR [TI]
Industry-Standard Dual Operational Amplifiers;
| 型号： | LM358BAIDR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Industry-Standard Dual Operational Amplifiers 放大器 光电二极管 |
| 文件： | 总56页 (文件大小：3308K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
Industry-Standard Dual Operational Amplifiers
1 Features
3 Description
The LM358B and LM2904B devices are the next-
1
•
•
Wide supply range of 3 V to 36 V (B version)
generation versions of the industry-standard
operational amplifiers (op amps) LM358 and LM2904,
which include two high-voltage (36-V) op amps.
These devices provide outstanding value for cost-
sensitive applications, with features including low
offset (300 µV, typical), common-mode input range to
ground, and high differential input voltage capability.
Quiescent current: 300 µA per amplifier (B
version, typical)
•
•
Unity-gain bandwidth of 1.2 MHz (B version)
Common-mode input voltage range includes
ground, enabling direct sensing near ground
•
Low input offset voltage of 3 mV at 25°C (A and B
versions, maximum)
The LM358B and LM2904B op amps simplify circuit
design with enhanced features such as unity-gain
stability, lower offset voltage of 3 mV (maximum at
room temperature), and lower quiescent current of
300 µA per amplifier (typical). High ESD (2 kV, HBM)
and integrated EMI and RF filters enable the LM358B
and LM2904B devices to be used in the most rugged,
environmentally challenging applications.
•
•
Internal RF and EMI filter (B version)
On products compliant to MIL-PRF-38535, all
parameters are tested unless otherwise noted. On
all other products, production processing does not
necessarily include testing of all parameters.
2 Applications
The LM358B and LM2904B amplifiers are available in
micro-sized packaging, such as the SOT23-8, as well
as industry standard packages, including SOIC,
TSSOP, and VSSOP.
•
•
•
•
Merchant network and server power supply units
Multi-function printers
Power supplies and mobile chargers
Device Information(1)
Motor control: AC induction, brushed DC,
brushless DC, high-voltage, low-voltage,
permanent magnet, and stepper motor
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LM358B, LM2904B,
LM358, LM358A, LM2904, SOIC (8)
LM2904V, LM258, LM258A
4.90 mm × 3.90 mm
•
•
•
•
Desktop PC and motherboard
Indoor and outdoor air conditioners
Washers, dryers, and refrigerators
LM358B, LM2904B,
LM358, LM358A, LM2904, TSSOP (8) 3.00 mm × 4.40 mm
LM2490V
AC inverters, string inverters, central inverters,
and voltage frequency drives
LM358B(2), LM2904B(2)
,
LM358, LM358A, LM2904, VSSOP (8) 3.00 mm × 3.00 mm
LM2904V, LM258, LM258A
•
•
•
Uninterruptible power supplies
Programmable logic controllers
Electronic point-of-sale systems
LM358B(2), LM2904B(2)
SOT-23 (8) 2.90 mm × 1.60 mm
LM358, LM2904
SO (8)
5.20 mm × 5.30 mm
9.81 mm × 6.35 mm
9.60 mm × 6.67 mm
LM358, LM2904, LM358A,
LM258, LM258A
PDIP (8)
Single-Pole, Low-Pass Filter
LM158, LM158A
LM158, LM158A
CDIP (8)
RG
RF
LCCC (20) 8.89 mm × 8.89 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) Package is for preview only.
R1
VOUT
VIN
C1
1
2pR1C1
f
=
-3 dB
VOUT
VIN
RF
1
1 + sR1C1
=
1 +
(
(
RG
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Table of Contents
9.1 Overview ................................................................. 24
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 4
Pin Configuration and Functions......................... 5
Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 7
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics: LM358B and LM358BA ... 8
9.2 Functional Block Diagram - LM358B, LM358BA,
LM2904B, LM2904BA.............................................. 24
9.3 Feature Description................................................. 25
9.4 Device Functional Modes........................................ 25
10 Application and Implementation........................ 26
10.1 Application Information.......................................... 26
10.2 Typical Application ............................................... 26
11 Power Supply Recommendations ..................... 27
12 Layout................................................................... 27
12.1 Layout Guidelines ................................................. 27
12.2 Layout Examples................................................... 28
13 Device and Documentation Support ................. 29
13.1 Documentation Support ........................................ 29
13.2 Related Links ........................................................ 29
13.3 Receiving Notification of Documentation Updates 29
13.4 Support Resources ............................................... 29
13.5 Trademarks........................................................... 29
13.6 Electrostatic Discharge Caution............................ 29
13.7 Glossary................................................................ 29
7.6 Electrical Characteristics: LM2904B and
LM2904BA ................................................................. 9
7.7 Electrical Characteristics: LM358, LM358A ............ 10
7.8 Electrical Characteristics: LM2904, LM2904V ........ 11
7.9 Electrical Characteristics: LM158, LM158A ............ 12
7.10 Electrical Characteristics: LM258, LM258A .......... 13
7.11 Typical Characteristics.......................................... 14
7.12 Typical Characteristics.......................................... 21
Parameter Measurement Information ................ 23
Detailed Description ............................................ 24
14 Mechanical, Packaging, and Orderable
8
9
Information ........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision W (October 2019) to Revision X
Page
•
•
•
Added application links to Applications section ..................................................................................................................... 1
Deleted preview tag from LM358B and LM2904B TSSOP (8) package in Device Information table .................................... 1
Changed section title from Community Resources to Support Resources .......................................................................... 29
Changes from Revision V (September 2018) to Revision W
Page
•
•
•
•
•
•
Added specification in the Device Comparison Table............................................................................................................ 4
Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings ................................................................................ 6
Changed VS to V+ in Recommended Operating Conditions .................................................................................................. 7
Changed Thermal Information for the LM158FK and LM158JG devices............................................................................... 7
Added Typical Characteristics section for the LM358B and LM2490B op amps ................................................................. 14
Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement Information
section .................................................................................................................................................................................. 23
•
•
Changed the Functional Block Diagram............................................................................................................................... 24
Deleted preview designator from LM358B and LM2904B in the Related Links section ...................................................... 29
Changes from Revision U (January 2017) to Revision V
Page
•
•
•
•
Changed the data sheet title ................................................................................................................................................. 1
Changed first four items in the Features section ................................................................................................................... 1
Changed the first item in the Applications section and added four new items ...................................................................... 1
Changed voltage values in the first paragraph of the Description section ............................................................................. 1
2
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Copyright © 1976–2020, Texas Instruments Incorporated
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
•
•
•
Changed text in the second paragraph of the Description section......................................................................................... 1
Added devices LM358B and LM2904B to data sheet ............................................................................................................ 1
Changed the first three rows of the Device Information table and added a a cross-referenced note for PREVIEW-
status devices......................................................................................................................................................................... 1
•
•
•
•
•
•
•
Added Device Comparison table ........................................................................................................................................... 4
Added a table note to the Pin Functions table ...................................................................................................................... 5
Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition statement ............. 6
Changed all entries in the Absolute Maximum Ratings table except TJ and Tstg .................................................................. 6
Deleted lead temperature and case temperature from Absolute Maximum Ratings.............................................................. 6
Changed device listings and their voltage values in the ESD Ratings table ......................................................................... 6
Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition
statement ............................................................................................................................................................................... 7
•
•
•
•
•
•
•
•
•
•
•
•
Changed table entries for all parameters in the Recommended Operating Conditions table................................................ 7
Added rows to the Thermal Information table, and a table note regarding device-package combinations .......................... 7
Deleted the Operating Conditions table................................................................................................................................ 13
Added a condition statement to the Typical Characteristics section.................................................................................... 21
Changed specific voltages to a Recommended Operating Conditions reference................................................................ 24
Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................................... 25
Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices................................................................ 25
Changed the Input Common Mode Range section in multiple places throughout ............................................................... 25
Changed VCC to VS in the Application Information section .................................................................................................. 26
Subscripted the suffixes fro RI and RF.................................................................................................................................. 26
Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28
Added Preview designation to the LM358B and LM2904B devices in Table 1 ................................................................... 29
Changes from Revision T (April 2015) to Revision U
Page
•
•
Changed data sheet title......................................................................................................................................................... 1
Added Receiving Notification of Documentation Updates section and Community Resources section ............................. 29
Changes from Revision S (January 2014) to Revision T
Page
•
Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
Changes from Revision R (July 2010) to Revision S
Page
•
•
•
•
•
Converted this data sheet from the QS format to DocZone using the PDF on the web ........................................................ 1
Deleted Ordering Information table ........................................................................................................................................ 1
Updated Features to include Military Disclaimer .................................................................................................................... 1
Added Typical Characteristics section.................................................................................................................................. 21
Added ESD warning ............................................................................................................................................................. 29
Copyright © 1976–2020, Texas Instruments Incorporated
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Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
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5 Device Comparison Table
SUPPLY
VOLTAGE
TEMPERATURE
RANGE
VOS (MAXIMUM
AT 25°C)
IQ / CH (TYPICAL AT INTEGRATED EMI
PART NUMBER
PACKAGE
25°C)
FILTER
Yes
Yes
No
LM358B
LM2904B
LM358
3 V–36 V
3 V–36 V
3 V–32 V
3 V–26 V
3 V–32 V
3 V–32 V
3 V–32 V
3 V–32 V
3 V–32 V
3 V–32 V
–40°C to 85°C
–40°C to 125°C
0°C to 70°C
3 mV
3 mV
7 mV
7 mV
3 mV
7 mV
5 mV
3 mV
5 mV
3 mV
300 µA
300 µA
350 µA
350 µA
350 µA
350 µA
350 µA
350 µA
350 µA
350 µA
D, DDF, DGK, PW
D, DDF, DGK, PW
D, PW, DGK, P, PS
D, PW, DGK, P, PS
D, PW, DGK, P
D, PW
LM2904
LM358A
LM2904V
LM158
–40°C to 125°C
0°C to 70°C
No
No
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
–25°C to 85°C
–25°C to 85°C
No
No
JG, FK
LM158A
LM258
No
JG, FK
No
D, DGK, P
LM258A
No
D, DGK, P
4
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Copyright © 1976–2020, Texas Instruments Incorporated
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
6 Pin Configuration and Functions
D, DDF, DGK, P, PS, PW, and JG Packages
8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP, and CDIP
Top View
FK Package
20-Pin LCCC
Top View
OUT1
IN1œ
IN1+
Vœ
1
2
3
4
8
7
6
5
V+
OUT2
IN2œ
IN2+
NC
IN1œ
NC
4
5
6
7
8
18
17
16
15
14
NC
OUT2
NC
Not to scale
IN1+
NC
IN2œ
NC
Not to scale
NC - No internal connection
Pin Functions
PIN
I/O
DESCRIPTION
SOIC, SOT23-8, VSSOP, CDIP,
PDIP, SO, TSSOP, CFP(1)
NAME
IN1–
LCCC(1)
5
7
2
3
6
5
1
7
I
I
Negative input
Positive input
Negative input
Positive input
Output
IN1+
IN2–
IN2+
15
12
2
I
I
OUT1
OUT2
O
O
17
Output
Negative (lowest) supply or ground (for single-
supply operation)
V–
10
4
—
1, 3, 4, 6, 8, 9, 11,
13, 14, 16, 18, 19
NC
V+
—
8
—
—
No internal connection
Positive (highest) supply
20
(1) For a listing of which devices are available in what packages, see Device Comparison Table.
Copyright © 1976–2020, Texas Instruments Incorporated
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5
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
MAX UNIT
LM358B, LM358BA,
LM2904B, LM2904BA
±20 or 40
LM158, LM258, LM358,
Supply voltage, VS = ([V+] – [V–])
V
V
LM158A, LM258A, LM358A,
±16 or 32
±13 or 26
LM2904V
LM2904
LM358B, LM358BA,
LM2904B, LM2904BA,LM158,
LM258, LM358, LM158A,
–32
32
(2)
Differential input voltage, VID
LM258A, LM358A, LM2904V
LM2904
–26
26
40
LM358B, LM358BA,
LM2904B, LM2904BA
–0.3
LM158, LM258, LM358,
LM158A, LM258A, LM358A,
LM2904V
Input voltage, VI
Either input
V
s
–0.3
–0.3
32
LM2904
26
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C,
S ≤ 15 V(3)
Unlimited
V
LM158, LM158A
LM258, LM258A
LM358B, LM358BA
LM358, LM358A
–55
–25
–40
0
125
85
85
Operating ambient temperature, TA
°C
70
LM2904B, LM2904BA,
LM2904, LM2904V
–40
125
Operating virtual-junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Differential voltages are at IN+, with respect to IN−.
(3) Short circuits from outputs to VS can cause excessive heating and eventual destruction.
7.2 ESD Ratings
VALUE
UNIT
LM358B, LM358BA, LM2904B, AND LM2904BA
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±2000
±1000
V(ESD)
Electrostatic discharge
V
LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
V(ESD)
Electrostatic discharge
V
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6
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Copyright © 1976–2020, Texas Instruments Incorporated
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
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SLOS068X –JUNE 1976–REVISED JUNE 2020
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
LM358B, LM358BA, LM2904B,
LM2904BA
3
36
VS
Supply voltage, VS= ([V+] – [V–])
Common-mode voltage
LM158, LM258, LM358, LM158A,
LM258A, LM358A, LM2904V
3
30
LM2904
3
V–
26
V+ – 2
85
VCM
V
LM358B, LM358BA
–40
LM2904B, LM2904BA, LM2904,
LM2904V
–40
125
TA
Operating ambient temperature
°C
LM358, LM358A
LM258, LM258A
LM158, LM158A
0
–20
–55
70
85
125
7.4 Thermal Information
LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904,
LM2904B, LM2904BA, LM2904V(2)
LM158, LM158A
THERMAL METRIC(1)
D
DGK
P
PS
PW
FK
JG
UNIT
(SOIC)
(VSSOP)
(PDIP)
(SO)
(TSSOP)
(LCCC)
(CDIP)
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
20 PINS
8 PINS
Junction-to-ambient thermal
resistance
RθJA
124.7
181.4
80.9
116.9
171.7
84.0
112.4
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top)
RθJC(top)
66.9
67.9
19.2
67.2
—
69.4
102.9
11.8
101.2
—
70.4
57.4
40
62.5
68.6
21.9
67.6
—
68.8
99.2
11.5
97.9
—
56.9
57.5
51.7
57.1
10.6
63.6
100.3
35.7
93.3
22.3
thermal resistance
Junction-to-board thermal
resistance
RθJB
Junction-to-top
ψJT
characterization parameter
Junction-to-board
ψJB
56.9
—
characterization parameter
Junction-to-case (bottom)
RθJC(bot)
thermal resistance
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Device Comparison Table.
Copyright © 1976–2020, Texas Instruments Incorporated
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7
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LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
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7.5 Electrical Characteristics: LM358B and LM358BA
VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
±0.3
±3.0
±4
mV
mV
LM358B
TA = –40°C to +85°C
VOS
Input offset voltage
±2.0
±2.5
11
mV
LM358BA
TA = –40°C to +85°C
TA = -40°C to +85°C(1)
mV
dVOS/dT
PSRR
Input offset voltage drift
Power Supply Rejection Ratio
Channel separation, dc
±3.5
±2
µV/°C
µV/V
µV/V
15
f = 1 kHz to 20 kHz
±1
INPUT VOLTAGE RANGE
VS = 3 V to 36 V
VS = 5 V to 36 V
(V–)
(V–)
(V+) – 1.5
(V+) – 2
100
V
V
VCM
Common-mode voltage range
TA = –40°C to +85°C
TA = –40°C to +85°C
(V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V
(V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V
20
25
CMRR
Common-mode rejection ratio
µV/V
316
INPUT BIAS CURRENT
±10
0.5
10
±35
±50
4
nA
nA
IB
Input bias current
TA = –40°C to +85°C(1)
nA
IOS
Input offset current
TA = –40°C to +85°C(1)
TA = –40°C to +85°C
5
nA
dIOS/dT
NOISE
En
Input offset current drift
pA/℃
Input voltage noise
f = 0.1 to 10 Hz
f = 1 kHz
3
µVPP
en
Input voltage noise density
40
nV/√/Hz
INPUT IMPEDANCE
ZID
ZIC
Differential
10 || 0.1
4 || 1.5
MΩ|| pF
GΩ|| pF
Common-mode
OPEN-LOOP GAIN
70
35
140
V/mV
V/mV
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-)
TA = –40°C to +85°C
FREQUENCY RESPONSE
GBW
SR
Gain bandwidth product
1.2
0.5
MHz
V/µs
°
Slew rate
G = + 1
Θm
Phase margin
Overload recovery time
Settling time
G = + 1, RL = 10kΩ, CL = 20 pF
VIN × gain > VS
56
tOR
10
µs
ts
To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF
4
µs
THD+N
OUTPUT
Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz
0.001
%
IOUT = 50 µA
1.35
1.4
1.5
100
0.75
5
1.42
1.48
1.61
150
1
V
V
Positive Rail (V+)
Negative Rail (V-)
IOUT = 1 mA
IOUT = 5 mA(1)
V
VO
Voltage output swing from rail
IOUT = 50 µA
IOUT = 1 mA
mV
V
VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +85°C
20
mV
-20
-10
10
5
-30
VS = 15 V; VO = V-;
VID = 1 V
Source(1)
TA = –40°C to +85°C
mA
IO
Output current
20
VS = 15 V; VO = V+;
VID = -1 V
Sink(1)
TA = –40°C to +85°C
VID = -1 V; VO = (V-) + 200 mV
60
100
±40
100
300
μA
mA
pF
Ω
ISC
Short-circuit current
VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V
±60
CLOAD
RO
Capacitive load drive
Open-loop output resistance
f = 1 MHz, IO = 0 A
POWER SUPPLY
IQ
IQ
Quiescent current per amplifier
Quiescent current per amplifier
VS = 5 V; IO = 0 A
VS = 36 V; IO = 0 A
300
460
800
µA
µA
TA = –40°C to +85°C
(1) Specified by characterization only
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SLOS068X –JUNE 1976–REVISED JUNE 2020
7.6 Electrical Characteristics: LM2904B and LM2904BA
VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
±0.3
±3.0
±4
mV
mV
LM2904B
TA = –40°C to +125°C
VOS
Input offset voltage
±2.0
±2.5
12
mV
LM2904BA
TA = –40°C to +125°C
TA = –40°C to +125°C(1)
mV
dVOS/dT
PSRR
Input offset voltage drift
Power Supply Rejection Ratio
Channel separation, dc
±3.5
±2
µV/°C
µV/V
µV/V
15
f = 1 kHz to 20 kHz
±1
INPUT VOLTAGE RANGE
VS = 3 V to 36 V
VS = 5 V to 36 V
(V–)
(V–)
(V+) – 1.5
(V+) – 2
100
V
V
VCM
Common-mode voltage range
TA = –40°C to +125°C
TA = –40°C to +125°C
(V–) ≤ VCM ≤ (V+) – 1.5 V VS = 3 V to 36 V
(V–) ≤ VCM ≤ (V+) – 2.0 V VS = 5 V to 36 V
20
25
CMRR
Common-mode rejection ratio
µV/V
316
INPUT BIAS CURRENT
±10
0.5
10
±35
±50
4
nA
nA
IB
Input bias current
TA = –40°C to +125°C(1)
nA
IOS
Input offset current
TA = –40°C to +125°C(1)
TA = –40°C to +125°C
5
nA
dIOS/dT
NOISE
En
Input offset current drift
pA/℃
Input voltage noise
f = 0.1 to 10 Hz
f = 1 kHz
3
µVPP
en
Input voltage noise density
40
nV/√/Hz
INPUT IMPEDANCE
ZID
ZIC
Differential
10 || 0.1
4 || 1.5
MΩ|| pF
GΩ|| pF
Common-mode
OPEN-LOOP GAIN
70
35
140
V/mV
V/mV
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-)
TA = –40°C to +125°C
FREQUENCY RESPONSE
GBW
SR
Gain bandwidth product
1.2
0.5
MHz
V/µs
°
Slew rate
G = + 1
Θm
Phase margin
Overload recovery time
Settling time
G = + 1, RL = 10kΩ, CL = 20 pF
VIN × gain > VS
56
tOR
10
µs
ts
To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF
4
µs
THD+N
OUTPUT
Total harmonic distortion + noise G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz
0.001
%
IOUT = 50 µA
1.35
1.4
1.5
100
0.75
5
1.42
1.48
1.61
150
1
V
V
Positive Rail (V+)
Negative Rail (V-)
IOUT = 1 mA
IOUT = 5 mA(1)
V
VO
Voltage output swing from rail
IOUT = 50 µA
IOUT = 1 mA
mV
V
VS = 5 V, RL ≤ 10 kΩ connected to (V–) TA = –40°C to +125°C
20
mV
-20
-10
10
5
-30
VS = 15 V; VO = V-; VID
1 V
=
Source(1)
TA = –40°C to +125°C
mA
IO
Output current
20
VS = 15 V; VO = V+; VID
= -1 V
Sink(1)
TA = –40°C to +125°C
VID = -1 V; VO = (V-) + 200 mV
60
100
±40
100
300
μA
mA
pF
Ω
ISC
Short-circuit current
VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V
±60
CLOAD
RO
Capacitive load drive
Open-loop output resistance
f = 1 MHz, IO = 0 A
POWER SUPPLY
IQ
IQ
Quiescent current per amplifier
Quiescent current per amplifier
VS = 5 V; IO = 0 A
VS = 36 V; IO = 0 A
300
460
800
µA
µA
TA = –40°C to +125°C
(1) Specified by characterization only
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7.7 Electrical Characteristics: LM358, LM358A
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
2
7
9
3
5
LM358
TA = 0°C to 70°C
VS = 5 V to 30 V; VCM = 0 V; VO = 1.4
V
VOS
Input offset voltage
mV
LM358A
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
LM358
7
7
dVOS/dT
Input offset voltage drift
µV/°C
LM358A
20
Input offset voltage vs power
supply (ΔVIO/ΔVS)
PSRR
VS = 5 V to 30 V
65
100
120
dB
dB
VO1/ VO2
Channel separation
f = 1 kHz to 20 kHz
INPUT VOLTAGE RANGE
VS = 5 V to 30 V
LM358
(V–)
(V+) – 1.5
(V+) – 2
VS = 30 V
VS = 5 V to 30 V
LM358A
LM358
VCM
Common-mode voltage range
V
TA = 0°C to 70°C
(V–)
65
VS = 30 V
LM358A
CMRR
Common-mode rejection ratio VS = 5 V to 30 V; VCM = 0 V
80
–20
–15
2
dB
INPUT BIAS CURRENT
–250
–500
–100
–200
50
LM358
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
TA = 0°C to 70°C
IB
Input bias current
VO = 1.4 V
nA
nA
LM358A
LM358
150
30
IOS
Input offset current
VO = 1.4 V
2
LM358A
75
10
dIOS/dT
Input offset current drift
pA/°C
nV/√Hz
V/mV
LM358A
300
NOISE
en
Input voltage noise density
f = 1 kHz
40
OPEN-LOOP GAIN
25
15
100
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
TA = 0°C to 70°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
VS = 30 V; RL = 2 kΩ
TA = 0°C to 70°C
TA = 0°C to 70°C
4
3
Positive rail
Negative rail
VS = 30 V; RL ≥ 10 kΩ
VS = 5 V; RL ≥ 2 kΩ
VS = 5 V; RL ≤ 10 kΩ
2
V
VO
Voltage output swing from rail
1.5
20
5
mV
–20
–30
VS = 15 V; VO = 0 V; VID
= 1 V
Source
Sink
LM358A
–60
±60
TA = 0°C to 70°C
TA = 0°C to 70°C
–10
10
5
mA
IO
Output current
20
VS = 15 V; VO = 15 V;
VID = –1 V
VID = –1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
12
30
µA
ISC
Short-circuit current
±40
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
Quiescent current per
amplifier
IQ
TA = 0°C to 70°C
µA
VS = 30 V; VO = 15 V; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM358 and LM358A.
(2) All typical values are TA = 25°C.
10
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SLOS068X –JUNE 1976–REVISED JUNE 2020
7.8 Electrical Characteristics: LM2904, LM2904V
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
TEST CONDITIONS(1)
MIN
MAX
UNIT
(2)
PARAMETER
TYP
OFFSET VOLTAGE
3
1
7
7
10
2
Non-A suffix
devices
TA = –40°C to 125°C
VS = 5 V to maximum; VCM = 0 V; VO = 1.4
V
VOS
Input offset voltage
mV
A-suffix
devices
TA = –40°C to 125°C
TA = –40°C to 125°C
4
dVOS/dT
PSRR
Input offset voltage drift
µV/°C
dB
Input offset voltage vs power
supply (ΔVIO/ΔVS)
VS = 5 V to 30 V
65
100
120
VO1/ VO2 Channel separation
f = 1 kHz to 20 kHz
dB
INPUT VOLTAGE RANGE
(V–)
(V–)
65
(V+) – 1.5
(V+) – 2
VCM
Common-mode voltage range
Common-mode rejection ratio
VS = 5 V to maximum
V
TA = –40°C to 125°C
CMRR
VS = 5 V to maximum; VCM = 0 V
80
–20
2
dB
INPUT BIAS CURRENT
–250
–500
50
IB
Input bias current
Input offset current
VO = 1.4 V
VO = 1.4 V
nA
nA
TA = –40°C to 125°C
TA = –40°C to 125°C
Non-V suffix
device
300
50
IOS
2
V-suffix
device
TA = –40°C to 125°C
TA = –40°C to 125°C
150
dIOS/dT
NOISE
en
Input offset current drift
10
40
100
pA/°C
Input voltage noise density
f = 1 kHz
nV/√Hz
OPEN-LOOP GAIN
25
15
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
V/mV
TA = –40°C to 125°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
RL ≥ 10 kΩ
VS – 1.5
VS = maximum; RL
2 kΩ
=
≥
=
≥
4
3
6
Non-V suffix
device
VS = maximum; RL
10 kΩ
2
4
Positive rail
Negative rail
V
VO
Voltage output swing from rail
TA = –40°C to 125°C
VS = maximum; RL
2 kΩ
V-suffix device
VS = maximum; RL
10 kΩ
5
VS = 5 V; RL ≤ 10 kΩ
TA = –40°C to 125°C
TA = –40°C to 125°C
TA = –40°C to 125°C
5
20
mV
mA
–20
–10
10
–30
VS = 15 V; VO = 0 V; VID = 1 V
VS = 15 V; VO = 15 V; VID = –1 V
Source
20
IO
Output current
Sink
5
Non-V suffix device
V-suffix device
30
40
VID = -1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
µA
12
ISC
Short-circuit current
±40
±60
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
IQ Quiescent current per amplifier
TA = –40°C to 125°C
µA
VS = maximum; VO = maximum / 2; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V.
(2) All typical values are TA = 25°C.
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7.9 Electrical Characteristics: LM158, LM158A
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
5
7
2
4
LM158
TA = –55°C to 125°C
VOS
Input offset voltage
VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V
mV
LM158A
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
LM158
7
7
dVOS/dT Input offset voltage drift
µV/°C
LM158A
15(3)
Input offset voltage vs power supply
(ΔVIO/ΔVS)
PSRR
VS = 5 V to 30 V
65
100
120
dB
dB
VO1/ VO2 Channel separation
f = 1 kHz to 20 kHz
INPUT VOLTAGE RANGE
VS = 5 V to 30 V
VS = 30 V
LM158
(V–)
(V+) – 1.5
(V+) – 2
LM158A
LM158
VCM
Common-mode voltage range
V
VS = 5 V to 30 V
VS = 30 V
TA = –55°C to 125°C
(V–)
70
LM158A
CMRR
Common-mode rejection ratio
VS = 5 V to 30 V; VCM = 0 V
80
–20
–15
2
dB
INPUT BIAS CURRENT
–150
–300
–50
–100
30
LM158
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
TA = –55°C to 125°C
IB
Input bias current
Input offset current
VO = 1.4 V
nA
nA
LM158A
LM158
100
10
IOS
VO = 1.4 V
2
LM158A
30
10
dIOS/dT
Input offset current drift
pA/°C
nV/√Hz
V/mV
LM158A
200
NOISE
en
Input voltage noise density
f = 1 kHz
40
OPEN-LOOP GAIN
50
25
100
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
TA = –55°C to 125°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
VS = 30 V; RL = 2 kΩ
VS = 30 V; RL ≥ 10 kΩ
VS = 5 V; RL ≥ 2 kΩ
VS = 5 V; RL ≤ 10 kΩ
TA = –55°C to 125°C
TA = –55°C to 125°C
4
3
Positive rail
Negative rail
2
V
VO
Voltage output swing from rail
1.5
20
5
mV
–20
–30
VS = 15 V; VO = 0 V; VID = 1 V Source
LM158A
–60
±60
TA = –55°C to 125°C
TA = –55°C to 125°C
–10
10
5
mA
IO
Output current
20
VS = 15 V; VO = 15 V; VID = –1
V
Sink
VID = –1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
12
30
µA
ISC
Short-circuit current
±40
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
IQ Quiescent current per amplifier
TA = –55°C to 125°C
µA
VS = 30 V; VO = 15 V; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM158 and LM158A.
(2) All typical values are TA = 25°C.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
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SLOS068X –JUNE 1976–REVISED JUNE 2020
7.10 Electrical Characteristics: LM258, LM258A
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX
UNIT
OFFSET VOLTAGE
3
2
5
7
3
4
LM258
TA = –25°C to 85°C
VOS
Input offset voltage
VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V
mV
LM258A
TA = –25°C to 85°C
TA = –25°C to 85°C
LM258
7
7
dVOS/dT Input offset voltage drift
µV/°C
LM258A
15
Input offset voltage vs power supply
(ΔVIO/ΔVS)
PSRR
VS = 5 V to 30 V
65
100
120
dB
dB
VO1/ VO2 Channel separation
f = 1 kHz to 20 kHz
INPUT VOLTAGE RANGE
VS = 5 V to 30 V
VS = 30 V
LM258
(V–)
(V+) – 1.5
(V+) – 2
LM258A
LM258
VCM
Common-mode voltage range
V
VS = 5 V to 30 V
VS = 30 V
TA = –25°C to 85°C
(V–)
70
LM258A
CMRR
Common-mode rejection ratio
VS = 5 V to 30 V; VCM = 0 V
80
–20
–15
2
dB
INPUT BIAS CURRENT
–150
–300
–80
–100
30
LM258
TA = –25°C to 85°C
TA = –25°C to 85°C
TA = –25°C to 85°C
TA = –25°C to 85°C
TA = –25°C to 85°C
IB
Input bias current
Input offset current
VO = 1.4 V
nA
nA
LM258A
LM258
100
15
IOS
VO = 1.4 V
2
LM258A
30
10
dIOS/dT
Input offset current drift
pA/°C
nV/√Hz
V/mV
LM258A
200
NOISE
en
Input voltage noise density
f = 1 kHz
40
OPEN-LOOP GAIN
50
25
100
AOL
Open-loop voltage gain
VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ
TA = –25°C to 85°C
FREQUENCY RESPONSE
GBW
Gain bandwidth product
0.7
0.3
MHz
V/µs
SR
Slew rate
G = +1
OUTPUT
VS = 30 V; RL = 2 kΩ
VS = 30 V; RL ≥ 10 kΩ
VS = 5 V; RL ≥ 2 kΩ
VS = 5 V; RL ≤ 10 kΩ
TA = –25°C to 85°C
TA = –25°C to 85°C
4
3
Positive rail
Negative rail
2
V
VO
Voltage output swing from rail
1.5
20
5
mV
–20
–30
VS = 15 V; VO = 0 V; VID = 1 V Source
LM258A
–60
±60
TA = –25°C to 85°C
TA = –25°C to 85°C
–10
10
5
mA
IO
Output current
20
VS = 15 V; VO = 15 V; VID = –1
V
Sink
VID = –1 V; VO = 200 mV
VS = 10 V; VO = VS / 2
12
30
µA
ISC
Short-circuit current
±40
mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A
350
500
600
IQ Quiescent current per amplifier
TA = –25°C to 85°C
µA
VS = 30 V; VO = 15 V; IO = 0 A
1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM258 and LM258A.
(2) All typical values are TA = 25°C.
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7.11 Typical Characteristics
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
18
16
14
12
10
8
30
27
24
21
18
15
12
9
6
4
6
2
3
0
0
-1800
-1200
-600
0
600
1200
1800
DC11
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25 2.5 2.75
DC12
Offset Voltage (µV)
Offset Voltage Drift (µV/°C)
Figure 1. Offset Voltage Production Distribution
Figure 2. Offset Voltage Drift Distribution
750
450
500
300
150
100
-150
-450
-750
-100
-300
-500
-40
-20
0
20
40
Temperature (°C)
60
80
100
120
-18
-12
-6
Common-Mode Voltage (V)
0
6
12
17
DC10
DC10
Figure 3. Offset Voltage vs Temperature
Figure 4. Offset Voltage vs Common-Mode Voltage
90
100
90
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
G = 1
80
70
60
50
40
30
20
10
0
G = 10
G = 100
G = 1000
G = –1
-10
-20
-30
Gain (dB)
Phase (°)
-10
-20
-10
1k
10k
100k
1M
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
D012
D017
Figure 5. Open-Loop Gain and Phase vs Frequency
Figure 6. Closed-Loop Gain vs Frequency
14
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SLOS068X –JUNE 1976–REVISED JUNE 2020
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-5
-7.5
-10
120
100
80
IB+
IB–
60
40
20
-12.5
-15
0
-20
-40
-20
-15
-10
-5
0
5
10
15
20
-20
-15
-10
-5
0
5
10
15
20
Common-Mode Voltage (V)
Common-Mode Voltage (V)
DC3I
DC3I
Figure 7. Input Bias Current vs Common-Mode Voltage
Figure 8. Input Offset Current vs Common-Mode Voltage
0.06
-6
-7
0.045
0.03
-8
-9
0.015
0
IB+
IB–
-10
-11
-12
-0.015
-0.03
-40
-10
20
50
80
110 130
-40
-10
20
50
80
110
130
Temperature (°C)
Temperature (°C)
DCIO
DCIB
Figure 9. Input Bias Current vs Temperature
Figure 10. Input Offset Current vs Temperature
V+
(V–) + 18 V
(V–) + 15 V
(V–) + 12 V
(V–) + 9 V
(V–) + 6 V
(V–) + 3 V
V–
–40ꢀC
25ꢀC
125ꢀC
(V+) – 3 V
(V+) – 6 V
(V+) – 9 V
(V+) – 12 V
–40ꢀC
25ꢀC
125ꢀC
0
5
10
15
20
25
30
35
40
0
10
20
30
40
50
Output Current (mA)
Output Current (mA)
DC1-
DC13
Figure 12. Output Voltage Swing vs
Output Current (Sinking)
Figure 11. Output Voltage Swing vs
Output Current (Sourcing)
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Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
120
115
110
105
100
95
100
90
80
70
60
50
40
30
20
10
0
PSRR+
PSRR-
CMRR
90
VS = 36V
VS = 5V
85
-40
-10
20
50
80
110
130
1k
10k 100k
Frequency (Hz)
1M
Temperature (°C)
DC2_
D001
Figure 13. CMRR and PSRR vs Frequency
Figure 14. Common-Mode Rejection Ratio vs
Temperature (dB)
-118
-119
-120
-121
-122
-123
1.6
1.2
0.8
0.4
0
-0.4
-0.8
-1.2
-1.6
-2
-40
-20
0
20
40
60
80
100 120 140
0
1
2
3
4
5
6
7
8
9
10
Temperature (°C)
Time (s)
DC8_
D011
VS = 5 V to 36 V
Figure 16. 0.1-Hz to 10-Hz Noise
Figure 15. Power Supply Rejection Ratio vs
Temperature (dB)
-32
-40
100
90
80
70
60
50
40
30
20
10
0
10 kꢀ
2 kꢀ
-48
-56
-64
-72
-80
-88
-96
-104
-112
100
1k
10k
10
100
1k
Frequency (Hz)
10k
100k
Frequency (Hz)
D013
D010
G = 1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
Figure 18. THD+N Ratio vs Frequency, G = 1
Figure 17. Input Voltage Noise Spectral Density vs
Frequency
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Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-32
-40
-48
-56
-64
-72
-80
-88
-96
-104
-30
10 kꢀ
2 kꢀ
-40
-50
-60
-70
-80
-90
-100
-110
-120
10 kꢀ
2 kꢀ
100
1k
10k
0.001
0.01
0.1
1
10 20
Frequency (Hz)
Amplitude (VPP)
D014
D015
G = –1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
G = 1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
Figure 19. THD+N Ratio vs Frequency, G = –1
Figure 20. THD+N vs Output Amplitude, G = 1
-20
-35
460
430
400
370
340
310
280
-50
-65
-80
-95
10 kꢀ
2 kꢀ
-110
3
9
15
21
27
33 36
0.001
0.01
0.1
1
10 20
Supply Voltage (V)
Amplitude (VPP
)
DC_S
D016
G = –1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
Figure 21. THD+N vs Output Amplitude, G = –1
Figure 22. Quiescent Current vs Supply Voltage
600
540
480
420
360
300
240
500
400
300
200
100
VS = 36V
VS = 5V
-40
-20
0
20
40
60
80
100
120
1k
10k
100k
1M
Temperature (°C)
Frequency (Hz)
DC4_
D006
Figure 24. Open-Loop Output Impedance vs Frequency
Figure 23. Quiescent Current vs Temperature
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Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
44
40
36
32
28
24
20
16
12
8
18
16
14
12
10
8
Overshoot (+)
Overshoot (-)
Overshoot (+)
Overshoot (–)
6
4
2
0
0
40
80
120 160 200 240 280 320 360
Capacitance load (pF)
40
80
120
160
200
240
280
320
360
Capacitance load (pF)
D019
D020
G = 1, 100-mV output step, RL = open
Figure 25. Small-Signal Overshoot vs Capacitive Load
G = –1, 100-mV output step, RL = open
Figure 26. Small-Signal Overshoot vs Capacitive Load
20
10
0
60
Input
Output
57
54
51
48
45
42
39
36
33
30
-10
-20
0
200
400
600
800
1000
0
40
80
120 160 200 240 280 320 360
Capacitance Load (pF)
Time (ꢀs)
D021
D018
G = –10
Figure 28. Overload Recovery
Figure 27. Phase Margin vs Capacitive Load
10
7.5
5
10
7.5
5
2.5
0
2.5
0
-2.5
-5
-2.5
-5
-7.5
-10
-7.5
-10
Input
Output
Input
Output
0
20
40
60
80
100
0
20
40
60
80
100
Time (ꢀs)
Time (ꢀs)
D022
D023
G = 1, RL = open
G = –1, RL = open, RFB = 10K
Figure 29. Small-Signal Step Response, G = 1
Figure 30. Small-Signal Step Response, G = –1
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Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
16
12
8
40
32
24
16
8
4
0
0
-4
-8
-8
-16
-24
-32
-40
-12
-16
-20
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Time (ꢀs)
Time (ꢀs)
D003
D004
G = 1, RL = open
G = 1, RL = open
Figure 31. Large-Signal Step Response (Rising)
Figure 32. Large-Signal Step Response (Falling)
2.5
2
0.675
0.625
0.575
0.525
0.475
0.425
Output
Input
Positive
Negative
1.5
1
0.5
0
-0.5
-1
-1.5
-2
-2.5
0
20
40
60
80
100
-40 -25 -10
5
20 35 50 65 80 95 110 125
Time (µs)
Temp(ꢀC)
AC_S
D009
G = 1, RL = open
Figure 33. Large-Signal Step Response
Figure 34. Slew Rate vs Temperature
60
40
20
0
15
14
13
12
11
10
9
Sinking
Sourcing
8
7
6
-20
-40
-60
5
4
3
2
1
0
1k
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
10k
100k
1M
Frequency (Hz)
DC7_
D005
VS = 15 V
Figure 35. Short-Circuit Current vs Temperature
Figure 36. Maximum Output Voltage vs Frequency
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Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-75
90
84
78
72
66
60
54
48
42
36
30
24
-85
-95
-105
-115
-125
-135
1k
10k
100k
Frequency (Hz)
1M
1M
10M
100M
Frequency (Hz)
1G
D008
D007
Figure 37. Channel Separation vs Frequency
Figure 38. EMIRR (Electromagnetic Interference Rejection
Ratio) vs Frequency
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7.12 Typical Characteristics
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
0.36
0.34
0.32
0.3
20
18
16
14
12
10
8
–55C
0C
125C
0.28
0.26
0.24
0.22
0.2
5Vdc
6
15Vdc
30Vdc
4
2
0
–55 –35 –15
5
25
45
65
85 105 125
0
5
10
15
20
25
30
Temperature (°C)
Supply Voltage (Vdc)
Figure 39. Input Current vs Temperature
Figure 40. Supply Current vs Supply Voltage
160
140
120
100
80
100
CMRR
90
80
70
60
50
40
30
20
10
0
RL=20K
RL=2K
60
40
20
0
0.1
1
10
100
1000
0
5
10
15
20
25
30
35
40
V+ Supply Voltage (Vdc)
Frequency (kHz)
C001
Figure 41. Voltage Gain vs Supply Voltage
Figure 42. Common-Mode Rejection Ratio vs Frequency
0.50
3.5
VOUT
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.45
0.40
0.35
0.30
0.25
0.20
VOUT
0
2
4
6
8
10
0
4
8
12
16
20
24
28
32
36
40
Time (ꢀs)
Time (ꢀs)
C001
C001
Figure 44. Voltage Follower Small Signal Response (50 pF)
Figure 43. Voltage Follower Large Signal Response (50 pF)
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Typical Characteristics (continued)
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
8
7
6
5
4
3
2
1
20
17.5
15
12.5
10
7.5
5
2.5
0
1
10
100
Frequency (kHz)
1k
0.001
0.01
0.1
1
10
100
Output Sink Current (mAdc)
Figure 45. Maximum Output Swing vs Frequency
(VCC = 15 V)
Figure 46. Output Sourcing Characteristics
90
80
70
60
50
40
30
20
10
0
10
5Vdc
15Vdc
30Vdc
1
0.1
0.01
–55
–35
–15
5
25
45
65
85
105
125
0.001
0.01
0.1
1
10
100
Output Sink Current (mAdc)
Temperature (°C)
Figure 47. Output Sinking Characteristics
Figure 48. Source Current Limiting
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8 Parameter Measurement Information
900 Ω
V
CC+
V
CC+
−
100 Ω
V
O
−
+
V = 0 V
I
+
V
I
V
O
RS
C
L
V
CC−
R
L
V
CC−
Figure 49. Unity-Gain Amplifier
Figure 50. Noise-Test Circuit
10 k
+18V
–
VIN
+
-18V
GND
GND
Figure 51. Test Circuit, G = –1, for THD+N and Small-Signal Step Response
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9 Detailed Description
9.1 Overview
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is within the supply voltage range specified in the Recommended Operating
Conditions section, and VS is at least 1.5 V more positive than the input common-mode voltage. The low supply-
current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices
can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required
interface electronics without additional ±5-V supplies.
9.2 Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA
VCC+
~6 µA
Current
Regulator
~6 µA
Current
Regulator
~100 µA
Current
Regulator
IN-
OUT
IN+
~120 µA
Current
Regulator
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9.3 Feature Description
9.3.1 Unity-Gain Bandwidth
The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without
greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).
9.3.2 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. These devices have a 0.5-V/µs slew rate (B Version).
9.3.3 Input Common Mode Range
The valid common mode range is from device ground to VS – 1.5 V (VS – 2 V across temperature). Inputs may
exceed VS up to the maximum VS without device damage. At least one input must be in the valid input common-
mode range for the output to be the correct phase. If both inputs exceed the valid range, then the output phase is
undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA and the output
phase is undefined.
9.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single-supply
operational amplifier or dual-supply amplifier, depending on the application.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications.
Inputs can be powered before VS for flexibility in multiple supply circuits.
10.2 Typical Application
A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage on
the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative
voltages positive.
RF
Vsup+
RI
VOUT
+
VIN
Vsup-
Figure 52. Application Schematic
10.2.1 Design Requirements
The supply voltage must be chosen such that it is larger than the input voltage range and output range. For
instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to
accommodate this application.
10.2.2 Detailed Design Procedure
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:
VOUT
A V
=
VIN
1.8
(1)
(2)
A V
=
= - 3.6
-0.5
Once the desired gain is determined, choose a value for RI or RF. [Subscripts should be fixed in the
accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the
amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current.
This example uses 10 kΩ for RI which means 36 kΩ is used for RF. This was determined by Equation 3.
RF
A V = -
RI
(3)
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Typical Application (continued)
10.2.3 Application Curve
2
1.5
1
VIN
VOUT
0.5
0
-0.5
-1
-1.5
-2
0
0.5
1
Time (ms)
1.5
2
Figure 53. Input and Output Voltages of the Inverting Amplifier
11 Power Supply Recommendations
CAUTION
Supply voltages larger than specified in the recommended operating region can
permanently damage the device (see the Absolute Maximum Ratings).
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies. For more detailed information on bypass capacitor placement, see the Layout
section.
12 Layout
12.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
•
Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
–
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
•
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace. [Things in parallel never cross, by definition]
•
•
•
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Examples.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
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LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
12.2 Layout Examples
Place components close to
device and to each other to
reduce parasitic errors
Run the input traces as far
away from the supply lines
VS+
as possible
RF
OUT1
V+
RG
GND
VIN
OUT2
IN1Þ
GND
IN1+
IN2Þ
RIN
IN2+
VÞ
Use low-ESR, ceramic
bypass capacitor
Only needed for
dual-supply
operation
VSÞ
(or GND for single supply)
GND
Ground (GND) plane on another layer
Figure 54. Operational Amplifier Board Layout for Noninverting Configuration
RIN
VIN
+
VOUT
RG
RF
Figure 55. Operational Amplifier Schematic for Noninverting Configuration
28
Submit Documentation Feedback
Copyright © 1976–2020, Texas Instruments Incorporated
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
•
Texas Instruments, Circuit Board Layout Techniques.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
ORDER NOW
LM158
LM158A
LM258
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
LM258A
LM358
LM358A
LM358B
LM2904
LM2904B
LM2904V
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
13.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
Copyright © 1976–2020, Texas Instruments Incorporated
Submit Documentation Feedback
29
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most-
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.
30
Submit Documentation Feedback
Copyright © 1976–2020, Texas Instruments Incorporated
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
5962-87710012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
87710012A
LM158FKB
5962-8771001PA
5962-87710022A
ACTIVE
ACTIVE
CDIP
JG
FK
8
1
1
TBD
TBD
SNPB
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8771001PA
LM158
LCCC
20
POST-PLATE
5962-
87710022A
LM158AFKB
5962-8771002PA
LM158 MW8
ACTIVE
CDIP
JG
YS
FK
8
0
1
1
1
TBD
SNPB
Call TI
N / A for Pkg Type
Level-1-NA-UNLIM
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
8771002PA
LM158A
ACTIVE WAFERSALE
Green (RoHS
& no Sb/Br)
LM158AFKB
ACTIVE
LCCC
20
TBD
POST-PLATE
5962-
87710022A
LM158AFKB
LM158AJG
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
8
8
1
1
TBD
TBD
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
LM158AJG
LM158AJGB
8771002PA
LM158A
LM158FKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
87710012A
LM158FKB
LM158JG
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
8
8
1
1
TBD
TBD
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
LM158JG
LM158JGB
8771001PA
LM158
LM258AD
LM258ADGKR
LM258ADR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
VSSOP
SOIC
D
DGK
D
8
8
8
8
75
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
-25 to 85
-25 to 85
-25 to 85
-25 to 85
LM258A
2500
2500
2500
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(M3L, M3P, M3S, M3
U)
Green (RoHS
& no Sb/Br)
NIPDAU | SN
Level-1-260C-UNLIM
LM258A
LM258ADRE4
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
LM258A
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
50
(1)
(2)
(3)
(4/5)
(6)
LM258ADRG4
LM258AP
ACTIVE
SOIC
PDIP
D
P
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM258A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
Green (RoHS
& no Sb/Br)
NIPDAU | SN
NIPDAU
LM258AP
LM258AP
LM258
LM258APE4
PDIP
P
50
Pb-Free
(RoHS)
LM258D
SOIC
D
75
Green (RoHS
& no Sb/Br)
NIPDAU
LM258DG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
NIPDAU
LM258
LM258DGKR
LM258DGKRG4
LM258DR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
50
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(M2L, M2P, M2S, M2
U)
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Call TI
(M2L, M2P, M2S, M2
U)
Green (RoHS
& no Sb/Br)
LM258
LM258DRG3
LM258DRG4
LM258P
SOIC
D
Green (RoHS
& no Sb/Br)
LM258
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Call TI
LM258
PDIP
P
Green (RoHS
& no Sb/Br)
LM258P
LM258P
L2904AV
L2904AV
L2904AV
L2904AV
2904BA
LM258PE4
PDIP
P
50
Pb-Free
(RoHS)
LM2904AVQDR
LM2904AVQDRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904BAIDR
LM2904BIDGKR
SOIC
D
2500
2500
2000
2000
2500
2500
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
SOIC
PW
PW
D
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
VSSOP
DGK
TBD
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
2000
75
(1)
(2)
(3)
(4/5)
(6)
LM2904BIDR
LM2904BIPWR
LM2904D
ACTIVE
SOIC
TSSOP
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
NIPDAU
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
L2904B
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
D
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
L2904B
LM2904
LM2904
LM2904
Green (RoHS
& no Sb/Br)
LM2904DE4
LM2904DG4
LM2904DGKR
LM2904DGKRG4
LM2904DR
SOIC
D
75
Green (RoHS
& no Sb/Br)
SOIC
D
75
Green (RoHS
& no Sb/Br)
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(MBL, MBP, MBS, MB
U)
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
(MBL, MBP, MBS, MB
U)
Green (RoHS
& no Sb/Br)
LM2904
LM2904
LM2904
LM2904
LM2904P
LM2904P
L2904
LM2904DRE4
LM2904DRG3
LM2904DRG4
LM2904P
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
NIPDAU
NIPDAU
NIPDAU | SN
SN
PDIP
P
Green (RoHS
& no Sb/Br)
LM2904PE4
LM2904PSR
LM2904PW
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
SO
PS
PW
PW
PW
2000
150
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
L2904
LM2904PWR
LM2904PWRG3
2000
2000
Green (RoHS
& no Sb/Br)
L2904
Green (RoHS
& no Sb/Br)
L2904
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2000
2000
2500
2500
2500
2500
2000
2000
75
(1)
(2)
(3)
(4/5)
(6)
LM2904PWRG4
LM2904PWRG4-JF
LM2904QDR
ACTIVE
TSSOP
TSSOP
SOIC
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
0 to 70
L2904
L2904
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Green (RoHS
& no Sb/Br)
2904Q1
2904Q1
L2904V
L2904V
L2904V
L2904V
LM358A
LM358A
LM358A
LM2904QDRG4
LM2904VQDR
LM2904VQDRG4
LM2904VQPWR
LM2904VQPWRG4
LM358AD
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
SOIC
PW
PW
D
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM358ADE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM358ADG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM358ADGKR
LM358ADGKRG4
LM358ADR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
50
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
0 to 70
(M6L, M6P, M6S, M6
U)
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
(M6L, M6P, M6S, M6
U)
Green (RoHS
& no Sb/Br)
0 to 70
LM358A
LM358A
LM358A
LM358AP
LM358ADRE4
LM358ADRG4
LM358AP
SOIC
D
Green (RoHS
& no Sb/Br)
0 to 70
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
0 to 70
PDIP
P
Green (RoHS
& no Sb/Br)
NIPDAU | SN
0 to 70
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM358APE4
LM358APW
ACTIVE
PDIP
TSSOP
TSSOP
TSSOP
SOIC
P
8
8
8
8
8
50
Pb-Free
(RoHS)
NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
0 to 70
0 to 70
0 to 70
0 to 70
-40 to 85
LM358AP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
D
150
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
L358A
L358A
L358A
L358BA
LM358APWR
LM358APWRG4
LM358BAIDR
2000
2000
2500
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
NIPDAU
LM358BIDGKR
LM358BIDR
PREVIEW
ACTIVE
VSSOP
SOIC
DGK
D
8
8
2500
2500
TBD
Call TI
Call TI
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
NIPDAU
Level-2-260C-1 YEAR
LM358B
LM358B
LM358
LM358BIPWR
LM358D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
8
8
8
8
8
8
8
8
8
2000
75
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Green (RoHS
& no Sb/Br)
LM358DG4
LM358DGKR
LM358DGKRG4
LM358DR
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM358
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
(M5L, M5P, M5S, M5
U)
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
NIPDAU
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
(M5L, M5P, M5S, M5
U)
Green (RoHS
& no Sb/Br)
LM358
LM358
LM358
LM358
LM358P
LM358P
LM358DRE4
LM358DRG3
LM358DRG4
LM358P
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU | SN
SN
PDIP
P
Green (RoHS
& no Sb/Br)
LM358PE3
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM358PE4
LM358PSR
ACTIVE
PDIP
SO
P
8
8
8
8
8
8
8
50
Green (RoHS
& no Sb/Br)
NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM358P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PS
2000
150
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU | SN
SN
L358
L358
L358
L358
L358
L358
LM358PW
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
LM358PWR
2000
2000
2000
2000
Green (RoHS
& no Sb/Br)
LM358PWRG3
LM358PWRG4
LM358PWRG4-JF
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
Green (RoHS
& no Sb/Br)
PLM2904BIDGKR
PLM358BIDGKR
ACTIVE
ACTIVE
VSSOP
VSSOP
DGK
DGK
8
8
2500
2500
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 85
TBD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2020
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B :
Automotive: LM2904-Q1, LM2904B-Q1
•
Enhanced Product: LM258A-EP, LM2904-EP
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM258ADGKR
LM258ADR
VSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
15.4
12.8
12.4
12.4
12.4
12.4
15.4
12.8
12.4
15.4
12.8
12.4
12.4
12.5
12.5
5.3
6.4
6.4
6.4
6.4
6.4
6.4
5.3
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
3.4
5.2
5.2
5.2
5.2
5.2
5.2
3.4
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
1.4
2.1
2.1
2.1
2.1
2.1
2.1
1.4
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LM258ADR
D
LM258ADR
D
LM258ADR
D
LM258ADRG4
LM258ADRG4
LM258DGKR
LM258DR
D
D
DGK
D
LM258DR
D
LM258DR
D
LM258DR
D
LM258DRG3
LM258DRG3
LM258DRG4
LM258DRG4
LM2904AVQDR
LM2904AVQDRG4
D
D
D
D
D
D
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2020
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2904AVQPWR
LM2904AVQPWRG4
LM2904BAIDR
LM2904BIDR
LM2904BIPWR
LM2904DGKR
LM2904DGKR
LM2904DR
TSSOP
TSSOP
SOIC
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2000
2000
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2500
2500
2000
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
15.4
12.8
12.4
12.4
15.4
12.8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.5
12.4
12.4
12.4
15.4
12.4
12.4
12.8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
15.4
12.8
12.4
7.0
7.0
6.4
6.4
7.0
5.3
5.3
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
7.0
7.0
7.0
7.0
7.0
6.4
6.4
7.0
7.0
5.3
6.4
6.4
6.4
6.4
6.4
6.4
7.0
7.0
7.0
6.4
6.4
7.0
5.3
5.3
6.4
6.4
6.4
6.4
3.6
3.6
5.2
5.2
3.6
3.4
3.4
5.2
5.2
5.2
5.2
5.2
5.2
5.2
5.2
3.6
3.6
3.6
3.6
3.6
5.2
5.2
3.6
3.6
3.4
5.2
5.2
5.2
5.2
5.2
5.2
3.6
3.6
3.6
5.2
5.2
3.6
3.4
3.4
5.2
5.2
5.2
5.2
1.6
1.6
2.1
2.1
1.6
1.4
1.4
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
1.6
1.6
1.6
1.6
1.6
2.1
2.1
1.6
1.6
1.4
2.1
2.1
2.1
2.1
2.1
2.1
1.6
1.6
1.6
2.1
2.1
1.6
1.4
1.4
2.1
2.1
2.1
2.1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
D
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DR
SOIC
D
LM2904DR
SOIC
D
LM2904DRG3
LM2904DRG3
LM2904DRG4
LM2904DRG4
LM2904PWR
LM2904PWR
LM2904PWRG3
LM2904PWRG4
LM2904PWRG4-JF
LM2904QDR
LM2904VQDR
LM2904VQPWR
LM2904VQPWRG4
LM358ADGKR
LM358ADR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
PW
D
SOIC
D
TSSOP
TSSOP
VSSOP
SOIC
PW
PW
DGK
D
LM358ADR
SOIC
D
LM358ADR
SOIC
D
LM358ADR
SOIC
D
LM358ADRG4
LM358ADRG4
LM358APWR
LM358APWR
LM358APWRG4
LM358BAIDR
LM358BIDR
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
D
SOIC
D
LM358BIPWR
LM358DGKR
LM358DGKR
LM358DR
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM358DR
SOIC
D
LM358DR
SOIC
D
LM358DR
SOIC
D
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2020
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM358DRG3
LM358DRG3
LM358DRG4
LM358DRG4
LM358PWR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.8
15.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
6.4
6.4
6.4
6.4
7.0
7.0
7.0
7.0
7.0
5.2
5.2
5.2
5.2
3.6
3.6
3.6
3.6
3.6
2.1
2.1
2.1
2.1
1.6
1.6
1.6
1.6
1.6
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
LM358PWR
LM358PWRG3
LM358PWRG4
LM358PWRG4-JF
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM258ADGKR
LM258ADR
VSSOP
SOIC
DGK
D
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
364.0
340.5
853.0
333.2
364.0
340.5
853.0
364.0
364.0
338.1
449.0
345.9
364.0
338.1
449.0
364.0
27.0
20.6
35.0
28.6
27.0
20.6
35.0
27.0
LM258ADR
SOIC
D
LM258ADR
SOIC
D
LM258ADR
SOIC
D
LM258ADRG4
LM258ADRG4
LM258DGKR
SOIC
D
SOIC
D
VSSOP
DGK
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2020
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM258DR
LM258DR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
340.5
333.2
364.0
853.0
333.2
364.0
340.5
853.0
340.5
340.5
853.0
853.0
340.5
340.5
853.0
358.0
364.0
333.2
364.0
853.0
340.5
333.2
364.0
853.0
340.5
853.0
364.0
364.0
853.0
853.0
350.0
340.5
853.0
853.0
364.0
333.2
367.0
340.5
364.0
367.0
340.5
364.0
853.0
853.0
338.1
345.9
364.0
449.0
345.9
364.0
338.1
449.0
338.1
338.1
449.0
449.0
338.1
338.1
449.0
335.0
364.0
345.9
364.0
449.0
338.1
345.9
364.0
449.0
338.1
449.0
364.0
364.0
449.0
449.0
350.0
338.1
449.0
449.0
364.0
345.9
367.0
338.1
364.0
367.0
338.1
364.0
449.0
449.0
20.6
28.6
27.0
35.0
28.6
27.0
20.6
35.0
20.6
20.6
35.0
35.0
20.6
20.6
35.0
35.0
27.0
28.6
27.0
35.0
20.6
28.6
27.0
35.0
20.6
35.0
27.0
27.0
35.0
35.0
43.0
20.6
35.0
35.0
27.0
28.6
35.0
20.6
27.0
35.0
20.6
27.0
35.0
35.0
LM258DR
SOIC
D
LM258DR
SOIC
D
LM258DRG3
LM258DRG3
LM258DRG4
LM258DRG4
LM2904AVQDR
LM2904AVQDRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904BAIDR
LM2904BIDR
LM2904BIPWR
LM2904DGKR
LM2904DGKR
LM2904DR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
SOIC
PW
PW
D
SOIC
D
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DR
SOIC
D
LM2904DR
SOIC
D
LM2904DRG3
LM2904DRG3
LM2904DRG4
LM2904DRG4
LM2904PWR
LM2904PWR
LM2904PWRG3
LM2904PWRG4
LM2904PWRG4-JF
LM2904QDR
LM2904VQDR
LM2904VQPWR
LM2904VQPWRG4
LM358ADGKR
LM358ADR
SOIC
D
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
PW
D
SOIC
D
TSSOP
TSSOP
VSSOP
SOIC
PW
PW
DGK
D
LM358ADR
SOIC
D
LM358ADR
SOIC
D
LM358ADR
SOIC
D
LM358ADRG4
LM358ADRG4
LM358APWR
LM358APWR
LM358APWRG4
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
PW
PW
PW
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2020
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM358BAIDR
LM358BIDR
LM358BIPWR
LM358DGKR
LM358DGKR
LM358DR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
340.5
340.5
853.0
364.0
358.0
340.5
333.2
364.0
853.0
364.0
333.2
340.5
853.0
364.0
853.0
364.0
853.0
853.0
338.1
338.1
449.0
364.0
335.0
338.1
345.9
364.0
449.0
364.0
345.9
338.1
449.0
364.0
449.0
364.0
449.0
449.0
20.6
20.6
35.0
27.0
35.0
20.6
28.6
27.0
35.0
27.0
28.6
20.6
35.0
27.0
35.0
27.0
35.0
35.0
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM358DR
SOIC
D
LM358DR
SOIC
D
LM358DR
SOIC
D
LM358DRG3
LM358DRG3
LM358DRG4
LM358DRG4
LM358PWR
LM358PWR
LM358PWRG3
LM358PWRG4
LM358PWRG4-JF
SOIC
D
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
Pack Materials-Page 5
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
8
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
SEATING PLANE
TYP
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
5
1
3.1
2.9
NOTE 3
2X
1.95
4
0.30
0.19
8X
4.5
4.3
1.2 MAX
B
0.1
C A
B
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 - 8
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
8X (0.45)
(R0.05)
1
4
TYP
8
SYMM
6X (0.65)
5
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
(R0.05) TYP
8X (0.45)
1
4
8
SYMM
6X (0.65)
5
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
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