LM36010YKBR [TI]
LM36010 同步升压 LED 闪光灯驱动器 | YKB | 8 | -40 to 85;
| 型号： | LM36010YKBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM36010 同步升压 LED 闪光灯驱动器 | YKB | 8 | -40 to 85 驱动 闪光灯 驱动器 |
| 文件： | 总40页 (文件大小：3102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
LM36010 具有 1.5A 高侧电流源的同步升压、单 LED 闪光灯驱动器
1 特性
3 说明
1
•
精确且可编程 LED 电流
LM36010 是一款超小型 LED 闪光灯驱动器，具有高
度可调节性。总解决方案尺寸为 7mm2，可提供高达
1.5A 的 LED 闪光灯电流或高达 376mA 的手电筒电
流。
–
闪光灯/IR 电流范围：11mA 至 1.5A（128 个级
别）
–
手电筒电流范围：2.4mA 至 376mA（128 个级
别）
该器件采用 2MHz 或 4MHz 固定频率的同步升压转换
器为 1.5A 恒定电流 LED 源供电。自适应调节方法可
在闪光灯模式下将电流控制在 11mA 至 1.5A 的范围
内，或在手电筒模式下将电流控制在 2.4mA 至 376mA
的范围内，因此可确保电流源保持可调节状态，并可最
大限度地提高效率。
•
•
闪光灯超时时间长达 1.6 秒
优化了低电池电量条件下的闪光灯 LED 电流
(IVFM)
•
•
•
•
•
LED 阴极对地短路运行以提高热管理
较小的总体解决方案尺寸：< 7mm2
硬件闪光灯使能 (STROBE)
输入电压范围：2.5V 至 5.5V
400kHz I2C 兼容接口
LM36010 的特性由与 I2C 兼容的接口控制。这些 特性
包括：硬件闪光灯 (STROBE) 以及适用于闪光灯和影
片模式（手电筒）的 128 级可编程电流。该器件的开
关频率为 2MHz 或 4MHz，具备过压保护 (OVP) 和可
调节限流功能，因此可使用微型超薄电感器和陶瓷电容
器。该器件可在 -40°C 至 +85°C 的环境温度范围下工
作。
–
I2C 地址 = 0x64
2 应用
•
•
•
•
•
•
手机
平板电脑
IR LED 驱动器
视频监控：IP 摄像机
条形码扫描仪
便携式数据终端
器件信息(1)
器件型号
LM36010
封装
封装尺寸（标称值）
DSBGA (8)
1.512mm × 0.800mm
(1) 要了解所有可用封装，请参阅数据表末尾的可订购产品附录。
简化电路原理图
L1
IN
SW
VIN
C1
2.5 V œ 5.5 V
OUT
C2
SDA
µP/µC
SCL
LED
D1
STROBE
GND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNVSAN4
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
目录
7.5 Programming........................................................... 18
7.6 Register Descriptions.............................................. 20
Applications and Implementation ...................... 22
8.1 Application Information............................................ 22
8.2 Typical Application ................................................. 22
Power Supply Recommendations...................... 33
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements................................................ 5
6.7 Switching Characteristics.......................................... 5
6.8 Typical Characteristics.............................................. 7
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ...................................... 13
7.3 Feature Description ................................................ 14
7.4 Device Functioning Modes...................................... 16
8
9
10 Layout................................................................... 33
10.1 Layout Guidelines ................................................. 33
10.2 Layout Example ................................................... 34
11 器件和文档支持 ..................................................... 35
11.1 器件支持................................................................ 35
11.2 文档支持................................................................ 35
11.3 接收文档更新通知 ................................................. 35
11.4 社区资源................................................................ 35
11.5 商标....................................................................... 35
11.6 静电放电警告......................................................... 35
11.7 Glossary................................................................ 35
12 机械、封装和可订购信息....................................... 36
7
4 修订历史记录
Changes from Revision A (July 2017) to Revision B
Page
•
更正了封装尺寸 .................................................................................................................................................................... 36
Changes from Original (April 2017) to Revision A
Page
•
已更改 器件状态从“高级信息”更改为“生产数据” ..................................................................................................................... 1
2
Copyright © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
5 Pin Configuration and Functions
YKB Package
8-Pin DSBGA
Top View
A1
B1
A2
B2
Pin A1
C2
D2
C1
D1
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
NO.
A1
GND
G
P
P
I
Ground
Input voltage connection. Connect IN to the input supply and bypass to GND with a 10-µF or
larger ceramic capacitor.
A2
B1
B2
IN
SW
Drain connection for Internal NMOS and synchronous PMOS switches.
Active high hardware flash enable. Drive STROBE high to turn on flash pulse. An internal
pulldown resistor of 300 kΩ is between STROBE and GND.
STROBE
Step-up DC-DC converter output. Connect a 10-µF ceramic capacitor between this terminal
and GND.
C1
OUT
P
C2
D1
D2
SDA
LED
SCL
I/O
P
I2C serial data input/output.
High-side current source output for flash LED.
I2C serial clock input.
I
(1) G = Ground; P = Power; I = Input; O = Output
Copyright © 2017, Texas Instruments Incorporated
3
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
−0.3
−0.3
MAX
UNIT
IN, SW, OUT, LED
6
V
SDA, SCL, STROBE
(VIN+ 0.3) w/ 6 V maximum
Continuous power dissipation(3)
Junction temperature, TJ-MAX
Storage temperature, Tstg
Internally limited
150
150
°C
°C
−65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and
disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.
6.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
MAX
5.5
UNIT
VIN
2.5
−40
−40
V
Junction temperature, TJ
Ambient temperature, TA
125
85
°C
°C
(3)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LM36010
THERMAL METRIC(1)
YKB (DSBGA)
8 PINS
117.3
1.3
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
34.3
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.5
ΨJB
34.6
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
6.5 Electrical Characteristics
TA = 25°C and VIN = 3.6 V, unless otherwise specified. Minimum and maximum limits apply over the full operating ambient
temperature range (–40°C ≤ TA ≤ 85°C).(1)(2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CURRENT SOURCE SPECIFICATIONS
(3)
VOUT = 4 V , flash code = 0x7F = 1.5 A
–10%
–10%
1.5
376
550
350
5
10%
10%
A
ILED
Current source accuracy
VOUT = 4 V , torch code = 0x7F = 376 mA
mA
ILED = 1.5 A
Flash
Torch
LED current source regulation
voltage
VHR
mV
V
ILED = 376 mA
ON threshold
OFF threshold
4.86
4.71
5.10
4.95
VOVP
Overvoltage Protection
4.85
STEP-UP DC-DC CONVERTER SPECIFICATIONS
RPMOS
RNMOS
PMOS switch on-resistance
NMOS switch on-resistance
175
130
1.9
2.8
2.5
mΩ
Reg 0x01, bit [5] = 0
Reg 0x01, bit [5] = 1
Falling VIN
–15%
–15%
15%
15%
ICL
Switch current limit
A
VUVLO
VIVFM
Undervoltage lockout threshold
V
V
Input voltage flash monitor trip
threshold
Reg 0x02, bits [7:5] = 000
–3%
2.9
0.3
0.8
3%
4
IQ
Quiescent supply current
Device not switching, in pass mode
mA
µA
Device disabled
2.5 V ≤ VIN ≤ 5.5 V
ISB
Standby supply current
STROBE VOLTAGE SPECIFICATIONS
VIL
VIH
Input logic low
Input logic high
0
0.4
VIN
V
V
2.5 V ≤ VIN ≤ 5.5 V
1.2
I2C-COMPATIBLE INTERFACE SPECIFICATIONS (SCL, SDA)
VIL
Input logic low
Input logic high
Output logic low
0
0.4
VIN
2.5 V ≤ VIN ≤ 4.2 V
V
VIH
VOL
1.2
ILOAD = 3 mA
400
mV
(1) Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not verified,
but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
(2) All voltages are with respect to the potential at the GND pin.
(3) The ability to deliver 1.5 A of LED current is highly dependent upon the input voltage, LED voltage, ambient temperature and PCB
layout. Depending upon the system conditions, it is possible that the device could hit the internal thermal shutdown or thermal scale-
back value before the desired flash duration is reached. See Thermal Performance for more details.
6.6 Timing Requirements
MIN
2.4
100
0
NOM
MAX
UNIT
µs
t1
t2
t3
t4
t5
SCL clock period
Data in set-up time to SCL high
Data out stable after SCL low
SDA low set-up time to SCL low (start)
SDA high hold time after SCL high (stop)
ns
ns
100
100
ns
ns
6.7 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
-10%
-10%
2
4
10%
10%
ƒSW
Switching frequency
2.5 V ≤ VIN ≤ 5.5 V
MHz
Copyright © 2017, Texas Instruments Incorporated
5
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
t
1
SCL
SDA_IN
t
t
5
4
t
2
SDA_OUT
t
3
图 1. I2C-Compatible Interface Specifications
6
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
6.8 Typical Characteristics
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
1.5
1.2
0.9
0.6
0.3
0
1.5
1.2
0.9
0.6
0.3
0
85èC
25èC
-40èC
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
Brightness Code (hex)
D001
Brightness Code (hex)
D002
ƒSW = 2 MHz
ICL = 2.8 A
ƒSW = 4 MHz
ICL = 2.8 A
图 2. LED Flash Current vs Brightness Code
图 3. LED Flash Current vs Brightness Code
1.6
1.5
1.4
1.3
1.2
1.1
1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
Code 0x00
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
0.9
0.8
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
2.5
ƒSW = 2 MHz
图 4. LED Flash Current vs Input Voltage
3
3.5
4
4.5
5
5.5
D004
VIN (V)
.
D003
ƒSW = 2 MHz
ICL = 2.8 A
ICL = 2.8 A
图 5. LED Flash Current vs Input Voltage
1.6
1.6
1.52
1.44
1.36
1.28
1.2
1.52
1.44
1.36
1.28
1.2
1.12
1.04
0.96
0.88
0.8
1.12
1.04
0.96
0.88
0.8
85èC
85èC
25èC
25èC
-40èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D005
D006
ƒSW = 2 MHz
ICL = 1.9 A
IFLASH = 1.5 A
Flash Time-out < 120 ms at 85°C
ƒSW = 4 MHz
ICL = 1.9 A
IFLASH = 1.5 A
Flash Time-out < 120 ms at 85°C
图 6. LED Flash Current vs Input Voltage
图 7. LED Flash Current vs Input Voltage
版权 © 2017, Texas Instruments Incorporated
7
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
Typical Characteristics (接下页)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
1.28
1.24
1.2
1.28
1.24
1.2
1.16
1.12
1.08
1.04
1
1.16
1.12
1.08
1.04
1
0.96
0.92
0.88
0.96
0.92
0.88
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D007
D008
ƒSW = 2 MHz
ICL = 1.9 A
IFLASH = 1.2 A
Flash Time-out < 280 ms at 85°C
ƒSW = 4 MHz
ICL = 1.9 A
IFLASH = 1.2 A
Flash Time-out < 280 ms at 85°C
图 8. LED Flash Current vs Input Voltage
图 9. LED Flash Current vs Input Voltage
1.08
1.06
1.04
1.02
1
1.08
1.06
1.04
1.02
1
0.98
0.96
0.94
0.92
0.9
0.98
0.96
0.94
0.92
0.9
85èC
85èC
25èC
25èC
-40èC
-40èC
0.88
0.88
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D009
D010
ƒSW = 2 MHz
IFLASH = 1.03 A
ICL = 1.9 A
ƒSW = 4 MHz
IFLASH = 1.03 A
ICL = 1.9 A
图 10. LED Flash Current vs Input Voltage
图 11. LED Flash Current vs Input Voltage
1.08
1.06
1.04
1.02
1
1.08
1.06
1.04
1.02
1
0.98
0.96
0.94
0.92
0.9
0.98
0.96
0.94
0.92
0.9
85èC
85èC
25èC
25èC
-40èC
-40èC
0.88
0.88
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D011
D012
ƒSW = 2 MHz
IFLASH = 1.03 A
ICL = 2.8 A
ƒSW = 4 MHz
IFLASH = 1.03 A
ICL = 2.8 A
图 12. LED Flash Current vs Input Voltage
图 13. LED Flash Current vs Input Voltage
8
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
Typical Characteristics (接下页)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
0.772
0.764
0.756
0.748
0.74
0.772
0.764
0.756
0.748
0.74
0.732
0.724
0.716
0.708
0.7
0.732
0.724
0.716
0.708
0.7
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D013
D014
ƒSW = 2 MHz
IFLASH = 0.75 A
ICL = 1.9 A
ƒSW = 4 MHz
IFLASH = 0.75 A
ICL = 1.9 A
图 14. LED Flash Current vs Input Voltage
图 15. LED Flash Current vs Input Voltage
0.772
0.764
0.756
0.748
0.74
0.772
0.764
0.756
0.748
0.74
0.732
0.724
0.716
0.708
0.7
0.732
0.724
0.716
0.708
0.7
85èC
85èC
25èC
25èC
-40èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D015
D016
ƒSW = 2 MHz
IFLASH = 0.75 A
ICL = 2.8 A
ƒSW = 4 MHz
IFLASH = 0.75 A
ICL = 2.8 A
图 16. LED Flash Current vs Input Voltage
图 17. LED Flash Current vs Input Voltage
0.4
0.36
0.32
0.28
0.24
0.2
0.4
0.36
0.32
0.28
0.24
0.2
85èC
25èC
-40èC
85èC
25èC
-40èC
0.16
0.12
0.08
0.04
0
0.16
0.12
0.08
0.04
0
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
Brightness Code (hex)
Brightness Code (hex)
D017
D018
ƒSW = 2 MHz
ƒSW = 4 MHz
图 18. LED Torch Current vs Brightness Code
图 19. LED Torch Current vs Brightness Code
版权 © 2017, Texas Instruments Incorporated
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LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
Typical Characteristics (接下页)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
0.2
0.18
0.16
0.14
0.12
0.1
0.4
0.38
0.36
0.34
0.32
0.3
Code 0x00
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
0.08
0.06
0.04
0.02
0
0.28
0.26
0.24
0.22
0.2
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D019
D020
ƒSW = 2 MHz
ƒSW = 2 MHz
图 20. LED Torch Current vs Input Voltage
图 21. LED Torch Current vs Input Voltage
0.4
0.39
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.4
0.39
0.38
0.37
0.36
0.35
0.34
0.33
0.32
85èC
85èC
25èC
25èC
-40èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D021
D022
ƒSW = 2 MHz
ITORCH = 376 mA
ƒSW = 4 MHz
ITORCH = 376 mA
图 22. LED Torch Current vs Input Voltage
图 23. LED Torch Current vs Input Voltage
0.28
0.274
0.268
0.262
0.256
0.25
0.212
0.206
0.2
85èC
85èC
25èC
25èC
-40èC
-40èC
0.194
0.188
0.182
0.176
0.17
0.244
0.238
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D023
D024
ƒSW = 2 MHz
ITORCH = 258 mA
ƒSW = 2 MHz
ITORCH = 188 mA
图 24. LED Torch Current vs Input Voltage
图 25. LED Torch Current vs Input Voltage
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Typical Characteristics (接下页)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
380
360
340
320
300
280
260
240
220
200
180
380
360
340
320
300
280
260
240
220
200
180
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D025
D026
Mode (Reg 0x01 bits[1:0]) = 01 (IR Mode)
Mode (Reg 0x01 bits[1:0]) = 10 (Torch Mode)
图 26. LED Off Current vs Input Voltage
图 27. LED On Current vs Input Voltage
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D027
图 28. Standby Current vs Input Voltage
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7 Detailed Description
7.1 Overview
The LM36010 is a high-power white LED flash driver capable of delivering up to 1.5 A to the LED. The device
incorporates a 2-MHz or 4-MHz constant frequency-synchronous current-mode PWM boost converter and a high-
side current source to regulate the LED current over the 2.5-V to 5.5-V input voltage range.
The LM36010 PWM DC-DC boost converter switches and boosts the output to maintain at least VHR across the
current source. This minimum headroom voltage ensures that the current source remains in regulation. If the
input voltage is above the LED voltage + current source headroom voltage the device does not switch, but turns
the PFET on continuously (pass mode). In pass mode, the drop across the current source is the difference
between (VIN - ILED × RPMOS) and VLED
.
The device has one logic input for a hardware flash enable (STROBE). This logic input has an internal 300-kΩ
(typical) pulldown resistor to GND.
Additional features of the device include an input voltage monitor that can reduce the flash current during low VIN
conditions and a temperature based current scale-back feature that forces the flash current to the set torch level
if the on-chip junction temperature reaches 125°C.
Control is done via an I2C-compatible interface. This includes adjustment of the flash and torch current levels,
changing the switch current limit, and changing the flash time-out duration. Additionally, there are flag and status
bits that indicate flash current time-out, LED over-temperature condition, LED failure (open/short), device thermal
shutdown, thermal current scale-back, and VIN undervoltage conditions.
12
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7.2 Functional Block Diagram
SW
Over Voltage
Comparator
2/4 MHz
Oscillator
-
+
IN
VREF
VOVP
160 mΩ
Input Voltage
Flash Monitor
UVLO
OUT
ILED1
PWM
Control
130 mΩ
Thermal Current
Scale Back
+125oC
Thermal Shutdown
+150oC
LED
Error
Amplifier
+
-
OUT-VHR
Current Sense/
Current Limit
Slope
Compensation
Soft-Start
Control
Logic/
Registers
SDA
SCL
I2C
Interface
STROBE
GND
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7.3 Feature Description
7.3.1 Flash Mode
In flash mode, the LED current source provides 128 target current levels from 11 mA to 1.5 A, set by the LED
Flash Brightness Register (0x03 bits [6:0]). Flash mode is activated by the Enable Register (0x01), setting mode
M1, M0 (bits [1:0]) to 11. Once the flash sequence is activated, the LED current source ramps up to the
programmed flash current by stepping through all current steps until the programmed current is reached. The
headroom on the current source is regulated to provide 11 mA to 1.5 A.
When flash mode is enabled using the mode M1, M0 (bits [1:0]) of the Enable Register (0x01), the mode bits in
the Enable Register are cleared after a flash time-out event.
7.3.2 Torch Mode
In torch mode, the LED current source provides 128 target current levels from 2.4 mA to 376 mA, set by the LED
Torch Brightness Register (0x04 bits [6:0]). Torch mode is activated by the Enable Register (0x01), setting mode
M1, M0 (bits [1:0]) to 10. Once the TORCH sequence is activated, the LED current source ramps up to the
programmed torch current by stepping through all current steps until the programmed current is reached. The
rate at which the current ramps is determined by the value chosen in the Torch Ramp bit [0] in Timing Register
(0x02).
7.3.3 IR Mode
In IR mode, the target LED current is equal to the value stored in the LED Flash Brightness Register (0x03 bits
[7:0]). When IR mode is enabled by the Enable Register (0x01) setting mode M1, M0 (bits [1:0]) to 01, the boost
converter turns on and sets the output equal to the input (pass mode). In IR mode, toggling the STROBE pin
enables and disables the LED current source. The STROBE pin can only be set to be Level sensitive, as all
timing of the IR pulse is externally controlled. In IR mode, the current source does not control the ramp rate of
the LED output. The current transitions immediately from off to on and then on to off.
BOOST
PASS
OFF
VOUT
STROBE
ILED
(1) If needed, the DC/DC boost will turn on when the LED current is delivered (Strobe Pin = High). When the Strobe Pin
goes low, the output voltage will return to VIN (Pass Mode)
图 29. IR Mode with Boost
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Feature Description (接下页)
VOUT
STROBE
ILED
(1) In pass mode, the boost stays disabled and VOUT = VIN when the Strobe Pin is high or low
图 30. IR Mode Pass Only
VOUT
STROBE
ILED
TIME-OUT
Reached
VOUT goes low,
LED turn off
TIME-OUT
Start
(1) When the flash timer elapses, the device goes into stand-by regardless of strobe state
图 31. IR Mode Time-out
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7.4 Device Functioning Modes
7.4.1 Start-Up (Enabling The Device)
At turnon the LED current source steps through each FLASH or TORCH level until the target LED current is
reached. This gives the device a controlled turnon and limits inrush current from the VIN supply. The target LED
flash and the target LED torch currents are set by the LED Flash Brightness Register (0x03 bits [6:0]) and LED
Torch Brightness Register (0x04 bits [6:0]) respectively.
7.4.2 Pass Mode
The LM36010 starts up in pass mode and stays there until boost mode is needed to maintain regulation. If the
voltage difference between VOUT and VLED falls below VHR, the device switches to boost mode. In pass mode, the
boost converter does not switch, the synchronous PFET turns fully on bringing VOUT up to VIN – ILED × RPMOS
,
and the inductor current is not limited by the peak current limit.
7.4.3 Input Voltage Flash Monitor (IVFM)
The LM36010 has the ability to adjust the flash current based upon the voltage level present at the IN pin
utilizing the input voltage flash monitor (IVFM). The adjustable threshold IVFM-D ranges from 2.9 V to 3.6 V in
100-mV steps and is set by Configuration Register (0x02) bits [7:5]. Additionally, the IVFM-D threshold sets the
input voltage boundary that forces the LM36010 to stop ramping the flash current during start-up.
IVFM ENABLE
LEVEL STROBE
VIN PROFILE for Stop and Hold Mode
IVFM-D
Set Target Flash Current
Dotted line shows O/P Current Profile with
O/P Current Profile in
Stop and Hold Mode
IVFM Disabled
SET RAMP FROM
THE RAMP
REGISTER USED
图 32. IVFM Mode
7.4.4 Fault/Protections
Upon a fault condition, the LM36010 sets the appropriate flag(s) in the Flags Register (0x05) and switches into
stand-by mode obtained by clearing the mode M1, M0 (bits [1:0]) of the Enable Register (0x01). The LM36010
remains in standby until an I2C read of the Flags Register. I2C read of the Flags Register clears the flags and the
fault status can be re-checked. If the fault(s) is still present, the LM36010 re-sets the appropriate flag bits and
enters stand-by again.
7.4.4.1 Overvoltage Protection (OVP)
The output voltage is limited to typically 5 V (see VOVP specification in the Electrical Characteristics). In situations
such as an open LED, the LM36010 raises the output voltage in order to keep the LED current at its target value.
When VOUT reaches 5 V (typical), the overvoltage comparator trips and turns off the internal NFET. When OVP
condition is present for three consecutive OVP events, LM36010 enters stand-by mode and OVP flag (bit [0]) of
Flags Register (0x01) is set. Checking for three consecutive events prevents forcing the device to shut down due
to momentary OVP condition. When VOUT falls below the VOVP off threshold, the LM36010 switches again.
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Device Functioning Modes (接下页)
7.4.4.2 Input Voltage Flash Monitor (IVFM)
When the input voltage crosses the IVFM-D value, programmed by Configuration Register (0x02) bits [7:5], the
LM36010 sets the IVFM flag (bit [6]) of Flags Register (0x05).
7.4.4.3 LED and/or VOUT Short Fault
LM36010 enters stand-by mode from flash or torch mode and VLED Short Fault flag (bit [5]) of Flags Register
(0x05) is set, if the LED output and/or VOUT experiences a short condition. An LED short condition occurs if the
voltage at the LED pin goes below 500 mV (typical). There is a deglitch time of 256 µs before the LED short flag
is valid, and a deglitch time of 2.048 ms before the VOUT short flag is valid. The LED and/or VOUT short fault
can be reset to 0 by removing power to the LM36010, or setting the software reset field (Register 0x06 bit [7]) to
a 1, or by reading back the Flags Register.
7.4.4.4 Current Limit (OCP)
The LM36010 features two selectable inductor current limits, 1.9A and 2.8A, programmable through the I2C-
compatible interface by writing to Register 0x01 bit [5] . When the inductor current limit is reached, the LM36010
terminates the charging phase of the switching cycle and sets the OCP flag (bit [4]) of Flags Register (0x05).
However, the mode M1, M0 (bits [1:0]) are not cleared as the device operates at current limit. Switching resumes
at the start of the next switching period.
In pass mode, there is no mechanism to limit the current as the current does not flow through the NMOS, which
senses the current limit.
In the boost mode or the pass mode, if VOUT falls below 2.3 V, the device stops switching, and the PFET
operates as a current source limiting the current to 200 mA. This prevents the LM36010 from drawing excessive
current from the battery during output short-circuit conditions.
7.4.4.5 Thermal Scale-Back (TSB)
When the LM36010 die temperature reaches 125°C, the thermal scale-back (TSB) circuit trips and TSB flag (bit
[2]) of Flags Register (0x05) is set. The LED current then shifts to torch current level, set by the LED Torch
Brightness Register (0x04 bits [6:0]) for the duration of the flash pulse, set by the flash time-out in the
Configuration Register (0x02 bits [4:1]) After I2C read of the Flags Register and upon re-flash, if the die
temperature is still above 125°C, the LM36010 re-enters into torch current level and sets the TSB flag bit again.
7.4.4.6 Thermal Shutdown (TSD)
When the LM36010 die temperature reaches 150°C, the thermal shutdown (TSD) circuit trips, forcing the
LM36010 into standby and writing a 1 to the TSD flag (bit [2]) of the Flags Register (0x05). The LM36010 restarts
only after the Flags Register is read, which clears the fault flag. Upon restart, if the die temperature is still above
150°C, the LM36010 resets the TSD flag and re-enters standby.
7.4.4.7 Undervoltage Lockout (UVLO)
The LM36010 has an internal comparator that monitors the voltage at IN pin. If the input voltage drops to 2.5 V,
the UVLO flag (bit [1]) of Flags Register (0x05) is set and the LM36010 switches to stand-by mode. After the
UVLO flag is set, even if the input voltage rises above 2.5 V, the LM36010 is not available for operation until
there is an I2C read of the Flags Register. Upon an I2C read of the Flags Register, the UVLO fault is cleared and
normal operation can resume.
7.4.4.8 Flash Time-out (FTO)
The LM36010 sources the flash current for the time period set by Flash Time-out (0x02 bits [4:1]). The LED
current source has 16 time-out levels ranging from 40 ms to 1600 ms.
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7.5 Programming
7.5.1 Control Truth Table
M1 (Register 0x01
bit[1])
M0 (Register 0x01 bit[0])
STROBE EN (Register
0x01 bit[2])
STROBE PIN
ACTION
0
0
1
1
0
0
0
0
0
0
1
1
1
1
0
1
X
X
0
1
1
X
Standby
Ext flash
pos edge
X
Int torch
X
Int flash
X
0
IR LED standby
IR LED standby
IR LED enabled
pos edge
7.5.2 I2C-Compatible Interface
7.5.2.1 Data Validity
The data on SDA must be stable during the HIGH period of the clock signal (SCL). In other words, the state of
the data line can only be changed when SCL is LOW.
SCL
SDA
data
change
allowed
data
change
allowed
data
valid
data
change
allowed
data
valid
图 33. Data Validity Data
A pullup resistor between the VIO line of the controller and SDA must be greater than [(VIO – VOL) / 3 mA] to
meet the VOL requirement on SDA. Using a larger pullup resistor results in lower switching current with slower
edges, while using a smaller pullup resistor results in higher switching currents with faster edges.
7.5.2.2 Start and Stop Conditions
START and STOP conditions classify the beginning and the end of the I2C session. A START condition is
defined as the SDA signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined
as the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and
STOP conditions. The I2C bus is considered busy after a START condition and free after a STOP condition.
During data transmission, the I2C master can generate repeated START conditions. First START and repeated
START conditions are equivalent, function-wise.
SDA
SCL
S
P
Start Condition
Stop Condition
图 34. Start and Stop Conditions
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7.5.2.3 Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) transferred first. Each
byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the
master. The master releases the SDA line (HIGH) during the acknowledge clock pulse. The LM36010 pulls down
the SDA line during the 9th clock pulse, signifying an acknowledge. The LM36010 generates an acknowledge
after each byte is received. There is no acknowledge created after data is read from the device.
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LM36010 7-bit address is 0x64. For the eighth bit, a 0 indicates
a WRITE, and a 1 indicates a READ. The second byte selects the register to which the data is written. The third
byte contains data to write to the selected register.
ack from
slave
ack from
slave
ack from
slave
msb Chip
Address lsb
start
w
ack msb Register Add lsb ack msb DATA lsb
ack stop
SCL
SDA
start
Id = 64h
w
ack
addr = 01h
ack
Data = 03h
ack stop
图 35. Write Cycle W = Write (SDA = 0) R = Read (SDA = 1) Ack = Acknowledge
(SDA Pulled Down by Either Master or Slave) ID = Chip Address, 64h for LM36010
7.5.2.4 I2C-Compatible Chip Address
The device address for the LM36010 is 1100100 (0x64). After the START condition, the I2C-compatible master
sends the 7-bit address followed by an eighth read or write bit (R/W). R/W = 0 indicates a WRITE and R/W = 1
indicates a READ. The second byte following the device address selects the register address to which the data is
written. The third byte contains the data for the selected register.
MSB
LSB
1
Bit 7
1
Bit 6
0
Bit 5
0
Bit 4
1
Bit 3
0
Bit 2
0
Bit 1
R/W
Bit 0
I2C Slave Address (chip address)
图 36. I2C-Compatible Chip Address
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7.6 Register Descriptions
POWER ON/RESET VALUE
REGISTER NAME
INTERNAL HEX ADDRESS
LM36010
0x20
Enable Register
0x01
0x02
0x03
0x04
0x05
0x06
Configuration Register
LED Flash Brightness Register
LED Torch Brightness Register
Flags Register
0x15
0x00
0x00
0x00
Device ID Register
0x01
7.6.1 Enable Register (0x01)
Bit 7
Bit 6
Boost
Frequency
Select
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Boost Mode
0 = Normal
(Default)
Boost Current IVFM Enable
Limit Setting 0 = Disabled
0 = 1.9 A
1 = 2.8 A
(Default)
Strobe Type
0 = Level
Triggered
(Default)
1 = Edge
Triggered
Strobe Enable Mode Bits: M1, M0
0 = Disabled
(Default )
00 = Standby (Default)
01 = IR Drive
10 = Torch
(Default)
1 = Enabled
1 = Pass Mode 0 = 2 MHz
1 = Enabled
Only
(Default)
1 = 4 MHz
11 = Flash
注
Edge strobe mode is not valid in IR MODE. Switching between level and edge strobe
types while the device is enabled is not recommended.
In edge or level strobe mode, TI recommends that the trigger pulse width be set greater
than 1 ms to ensure proper turn-on of the device.
7.6.2 Configuration Register (0x02)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
IVFM Levels (IVFM-D)
000 = 2.9 V (Default)
001 = 3 V
Flash Time-out Duration
0000 = 40 ms
0001 = 80 ms
Torch Ramp
0 = No Ramp
1 = 1 ms
010 = 3.1 V
011 = 3.2 V
100 = 3.3 V
101 = 3.4 V
110 = 3.5 V
111 = 3.6 V
0010 = 120 ms
0011 = 160 ms
0100 = 200 ms
0101 = 240 ms
0110 = 280 ms
0111 = 320 ms
1000 = 360 ms
1001 = 400 ms
1010 = 600 ms (Default)
1011 = 800 ms
1100 = 1000 ms
1101 = 1200 ms
1110 = 1400 ms
1111 = 1600 ms
(default)
注
On the LM36010, special care must be taken with regards to thermal management when
using time-out values greater than 500 ms. Depending on the PCB layout, input voltage,
and output current, it is possible to have the internal thermal shutdown circuit trip prior to
reaching the desired flash time-out value.
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7.6.3 LED Flash Brightness Register (0x03)
Bit 7
Thermal
Current
Scale-Back
0 = Disabled
1 = Enabled
(default)
If enabled, the .......................
LED current
shifts to torch
current level if 01100110 (0x66) = 1.2 A
Bit 6
Bit 5
Bit 4
Bit 3
Bit 3
Bit 3
Bit 2
Bit 2
Bit 2
Bit 1
Bit 0
Bit 0
Bit 0
LED Flash Brightness Level
0000000 = 11 mA (Default)
.......................
00010101 (0x15) = 0.257 A
.......................
0111111 (0x3F) = 0.75 A
0101111 (0x5F) = 1.03 A
.......................
TJ reaches
125 °C
.......................
1111111 (0x7F) = 1.5 A
7.6.4 LED Torch Brightness Register (0x04)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 1
LED Torch Brightness Levels
0000000 = 2.4 mA (Default)
.......................
00010101 (0x15) = 64 mA
.......................
0111111 (0x3F) = 188 mA
.......................
0101111 (0x5F) = 258 mA
.......................
RFU
01100110 (0x66) = 302 mA
.......................
1111111 (0x7F) = 376 mA
7.6.5 Flags Register (0x05)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 1
Thermal Current
Scale-back
Thermal
Shutdown
(TSD) Fault
IVFM Trip
Flag
VOUT / VLED
Short Fault
Current Limit
Flag
Flash Time-Out
Flag
OVP Fault
UVLO Fault
(TSB) Flag
7.6.6 Device ID and RESET Register (0x06)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Software
RESET
Device ID
000
Silicon Revision Bits
001
0 = Normal
(default)
RFU
1 = Force
device RESET
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8 Applications and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM36010 can drive a flash LED at currents up to 1.5 A. The 2-MHz or 4-MHz DC-DC boost regulator allows
for the use of small value discrete external components.
8.2 Typical Application
L1
IN
SW
VIN
C1
2.5 V œ 5.5 V
OUT
C2
SDA
µP/µC
SCL
LED
D1
STROBE
GND
Copyright © 2016, Texas Instruments Incorporated
图 37. LM36010 Typical Application
8.2.1 Design Requirements
Example requirements based on default register values:
表 1. Design Parameters
DESIGN PARAMETER
Input voltage range
Brightness control
EXAMPLE VALUE
2.5 V to 5.5 V
I2C Register
LED configuration
1 flash LED
Boost switching frequency
Flash brightness
2 MHz (4 MHz selectable)
1.5-A maximum current
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8.2.2 Detailed Design Procedure
8.2.2.1 Thermal Performance
Output power is limited by three things: the peak current limit, the ambient temperature, and the maximum power
dissipation in the package. If the die temperature of the device is below the absolute maximum rating of 125°C,
the maximum output power can be over 6 W. However, any appreciable output current causes the internal power
dissipation to increase and therefore increase the die temperature. Any circuit configuration must ensure that the
die temperature remains below 125°C taking into account the ambient temperature derating. The thermal scale-
back protection (TSB) helps ensure that temperature requirement is held valid. If the TSB feature is disabled,
thermal shutdown (TSD) is the next level of protection for the device, which is set to 150°C. This mechanism
cannot be disabled, and operation of the device above 125°C is not ensured by the electrical specification.
In boost mode, where VIN < VLED + VHR, the power dissipation can be approximated by 公式 1:
»
ö …
…
ÿ
Ÿ
»
…
…
ÿ
≈
’
V
- V ì V
»
…
ÿ
PFET Ÿ
⁄
(
)
≈
∆
«
’
÷
◊
VOUT
OUT
IN
OUT
P
ìI 2 ìR
+
ìILED2 ìR
+ VHR ìILED
(
NFET Ÿ
)
∆
∆
÷
÷
DISS
LED
2
V
V
Ÿ
⁄
Ÿ
⁄
IN
«
IN
◊
(1)
When the device is in pass mode, where VIN > VLED + VHR, the power dissipation equals:
»
ÿ
⁄
P
= » V - VLED ìI ÿ - I 2 ìRINDUCTOR
(
)
DISS
IN
LED
LED
⁄
(2)
(3)
Use 公式 3 to calculate the junction temperature (TJ) of the device:
TJ = RqJA ìP
DISS
Note that these equations only provide approximation of the junction temperature and do not take into account
thermal time constants, which play a large role in determining maximum deliverable output power and flash
durations.
8.2.2.2 Output Capacitor Selection
The LM36010 is designed to operate with a 10-µF ceramic output capacitor. When the boost converter is
running, the output capacitor supplies the load current during the boost converter on-time. When the NMOS
switch turns off, the inductor energy is discharged through the internal PMOS switch, supplying power to the load
and restoring charge to the output capacitor. This causes a sag in the output voltage during the on-time and a
rise in the output voltage during the off-time. Therefore, choose the output capacitor to limit the output ripple to
an acceptable level depending on load current and input or output voltage differentials and also to ensure the
converter remains stable.
Larger capacitors such as a 22-µF or capacitors in parallel can be used if lower output voltage ripple is desired.
To estimate the output voltage ripple considering the ripple due to capacitor discharge (ΔVQ) and the ripple due
to the capacitors ESR (ΔVESR), use 公式 4 and 公式 5:
For continuous conduction mode, the output voltage ripple due to the capacitor discharge is:
ILED ì V
- V
IN
(
)
OUT
DVQ =
fSW ì VOUT ìCOUT
(4)
The output voltage ripple due to the output capacitors ESR is found by:
≈
’
≈
∆
«
’
÷
◊
ILED ì VOUT
V ì V
- V
IN
(
)
IN
OUT
DVESR = RESR
ì
+ D
IL
∆
∆
÷
÷
DIL =
V
2ì fSW ìL ì VOUT
IN
«
◊
(5)
In ceramic capacitors, the ESR is very low so the assumption is that 80% of the output voltage ripple is due to
capacitor discharge and 20% from ESR. 表 2 lists different manufacturers for various output capacitors and their
case sizes suitable for use with the LM36010.
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23
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
8.2.2.3 Input Capacitor Selection
Choosing the correct size and type of input capacitor helps minimize the voltage ripple caused by the switching
of the boost converter and reduces noise on the input pin of the boost converter that can feed through and
disrupt internal analog signals. In the typical application circuit a 10-µF ceramic input capacitor works well. It is
important to place the input capacitor as close as possible to the LM36010 input (IN) pin. This reduces the series
resistance and inductance that can inject noise into the device due to the input switching currents. 表 2 lists
various input capacitors recommended for use with the LM36010.
表 2. Recommended Input/Output Capacitors (X5R/X7R Dielectric)
MANUFACTURER
TDK Corporation
TDK Corporation
Murata
PART NUMBER
C1608JB0J106M
VALUE
10 µF
10 µF
10 µF
10 µF
CASE SIZE
VOLTAGE RATING
0603 (1.6 mm × 0.8 mm × 0.8 mm)
0805 (2 mm × 1.25 mm × 1.25 mm)
0603 (1.6 mm × 0.8 mm × 0.8 mm)
0805 (2 mm × 1.25 mm × 1.25 mm)
6.3 V
10 V
6.3 V
10 V
C2012JB1A106M
GRM188R60J106M
GRM21BR61A106KE19
Murata
8.2.2.4 Inductor Selection
The LM36010 is designed to use a 0.47-µH or 1-µH inductor. 表 3 lists various inductors and their manufacturers
that work well with the LM36010. When the device is boosting (VOUT > VIN) the inductor is typically the largest
area of efficiency loss in the circuit. Therefore, choosing an inductor with the lowest possible series resistance is
important. Additionally, the saturation rating of the inductor must be greater than the maximum operating peak
current of the LM36010. This prevents excess efficiency loss that can occur with inductors that operate in
saturation. For proper inductor operation and circuit performance, ensure that the inductor saturation and the
peak current limit setting of the LM36010 are greater than IPEAK in 公式 6:
V ì V
- V
IN
(
)
ILED VOUT
IN
OUT
DI =
+ DIL
IPEAK
=
ì
L
2ì fSW ìL ì VOUT
h
V
IN
where
•
ƒSW = 2 or 4 MHz
(6)
Efficiency details can be found in the Application Curves.
表 3. Recommended Inductors
MANUFACTURER
TOKO
L
PART NUMBER
DFE201610P-R470M
DFE201610P-1R0M
DIMENSIONS (L×W×H)
2 mm × 1.6 mm × 1 mm
2 mm × 1.6 mm × 1 mm
ISAT
4.1 A
3.7 A
RDC
0.47 µH
1 µH
32 mΩ
58 mΩ
TOKO
24
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
8.2.3 Application Curves
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
85èC
25èC
-40èC
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
Brightness Code (hex)
Brightness Code (hex)
D028
D029
ƒSW = 2 MHz
ICL = 2.8 A
ƒSW = 4 MHz
ICL = 2.8 A
图 38. LED Flash Efficiency vs Brightness Code
图 39. LED Flash Efficiency vs Brightness Code
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D030
D031
ƒSW = 2 MHz
ICL = 2.8 A
ƒSW = 2 MHz
ICL = 2.8 A
图 40. LED Flash Efficiency vs Input Voltage
图 41. LED Flash Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D032
D033
ƒSW = 2 MHz
ICL = 1.9 A
IFLASH = 1.5 A
Flash Time-out < 120 ms at 85°C
ƒSW = 4 MHz
ICL = 1.9 A
IFLASH = 1.5 A
Flash Time-out < 120 ms at 85°C
图 42. LED Flash Efficiency vs Input Voltage
图 43. LED Flash Efficiency vs Input Voltage
版权 © 2017, Texas Instruments Incorporated
25
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D034
D035
ƒSW = 2 MHz
ICL = 1.9 A
IFLASH = 1.2 A
Flash Time-out < 280 ms at 85°C
ƒSW = 4 MHz
ICL = 1.9 A
IFLASH = 1.2 A
Flash Time-out < 280 ms at 85°C
图 44. LED Flash Efficiency vs Input Voltage
图 45. LED Flash Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D036
D037
ƒSW = 2 MHz
IFLASH = 1.03 A
ICL = 1.9 A
ƒSW = 4 MHz
IFLASH = 1.03 A
ICL = 1.9 A
图 46. LED Flash Efficiency vs Input Voltage
图 47. LED Flash Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
85èC
25èC
25èC
-40èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
ƒSW = 2 MHz
图 48. LED Flash Efficiency vs Input Voltage
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D039
D038
ƒSW = 4 MHz
IFLASH = 1.03 A
ICL = 2.8 A
IFLASH = 1.03 A
ICL = 2.8 A
图 49. LED Flash Efficiency vs Input Voltage
26
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D040
D041
ƒSW = 2 MHz
IFLASH = 0.75 A
ICL = 1.9 A
ƒSW = 4 MHz
IFLASH = 0.75 A
ICL = 1.9 A
图 50. LED Flash Efficiency vs Input Voltage
图 51. LED Flash Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D042
D043
ƒSW = 2 MHz
IFLASH = 0.75 A
ICL = 2.8 A
ƒSW = 4 MHz
IFLASH = 0.75 A
ICL = 2.8 A
图 52. LED Flash Efficiency vs Input Voltage
图 53. LED Flash Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
85èC
25èC
-40èC
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
Brightness Code (hex)
Brightness Code (hex)
D044
D045
ƒSW = 2 MHz
ƒSW = 4 MHz
图 54. LED Torch Efficiency vs Brightness Code
图 55. LED Torch Efficiency vs Brightness Code
版权 © 2017, Texas Instruments Incorporated
27
LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D046
D047
ƒSW = 2 MHz
ƒSW = 2 MHz
图 56. LED Torch Efficiency vs Input Voltage
图 57. LED Torch Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D048
D049
ƒSW = 2 MHz
ITORCH = 376 mA
ƒSW = 4 MHz
ITORCH = 376 mA
图 58. LED Torch Efficiency vs Input Voltage
图 59. LED Torch Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D050
D051
ƒSW = 2 MHz
ITORCH = 258 mA
ƒSW = 2 MHz
ITORCH = 188 mA
图 60. LED Torch Efficiency vs Input Voltage
图 61. LED Torch Efficiency vs Input Voltage
28
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
Time (100 ms/DIV)
Time (400 µs/DIV)
Flash Time-out (Reg 0x02 bits[4:1]) = 0111 (320 ms)
Mode bits (Reg 0x01 bit[1:0]) = 11 (Flash Mode)
图 62. Flash Start-up with I2C
图 63. Flash Time-Out
Time (2 ms/DIV)
Time (400 µs/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 10 (Torch Mode)
图 64. Flash Turnoff with I2C
图 65. Torch Start-up with I2C
Time (4 ms/DIV)
Time (400 µs/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 00 (Standby Mode)
STROBE Enabled (Reg 0x01 bit[2] = 1)
图 66. Torch Turnoff with I2C
图 67. Flash Start-up with STROBE
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LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
Time (100 ms/DIV)
Time (100 ms/DIV)
STROBE Enabled (Reg 0x01 bit[2] = 1)
Level Triggered (Reg 0x01 bit[3] = 0)
Strobe pulse = 100 ms
STROBE Enabled (Reg 0x01 bit[2] = 1)
Edge Triggered (Reg 0x01 bit[3] = 1)
Flash Time-out = 320 ms
图 68. Flash Turnoff with Level Triggered STROBE
图 69. Flash Turnoff with Edge Triggered STROBE
Time (400 µs/DIV)
Reg 0x01 = 0x26
Time (400 µs/DIV)
Reg 0x01 = 0x27
图 70. Boost I2C Torch
图 71. Boost I2C Flash
Time (400 µs/DIV)
Reg 0x01 = 0x2C
Time (400 µs/DIV)
Reg 0x01 = 0x24
图 72. Boost Edge Triggered Flash
图 73. Boost Level Triggered Flash
30
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
Time (400 µs/DIV)
Reg 0x01 = 0xA6
Time (400 µs/DIV)
Reg 0x01 = 0xA7
图 74. Pass Mode I2C Torch
图 75. Pass Mode I2C Flash
Time (400 µs/DIV)
Reg 0x01 = 0xAC
Time (400 µs/DIV)
Reg 0x01 = 0xA4
图 76. Pass mode Edge Triggered Flash
图 77. Pass mode Level Triggered Flash
Time (200 ns/DIV)
Time (200 ns/DIV)
ƒSW = 2 MHz
ƒSW = 4 MHz
图 78. Inductor Current and Switch node (SW) Waveform
图 79. Inductor Current and Switch node (SW) Waveform
版权 © 2017, Texas Instruments Incorporated
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LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, COUT = 10 µF, L = 1 µH, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back
(TSB) disabled, unless otherwise noted.
Time (400 µs/DIV)
Reg 0x01 = 0x13
IVFM Trip Level (Reg 0x02 bits[7:5]) = 001 (3 V)
图 80. IVFM - Ramp and Hold
32
版权 © 2017, Texas Instruments Incorporated
LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
9 Power Supply Recommendations
The LM36010 is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input
supply must be well regulated and capable to supply the required input current. If the input supply is located far
from the LM36010 additional bulk capacitance may be required in addition to the ceramic bypass capacitors.
10 Layout
10.1 Layout Guidelines
The high switching frequency and large switching currents of the LM36010 make the choice of layout important.
The following steps are to be used as a reference to ensure the device is stable and maintains proper LED
current regulation across its intended operating voltage and current range.
1. Place CIN on the top layer (same layer as the LM36010) and as close as possible to the device. The input
capacitor conducts the driver currents during the low-side MOSFET turnon and turnoff and can detect current
spikes over 1 A in amplitude. Connecting the input capacitor through short, wide traces to both the IN and
GND pins reduces the inductive voltage spikes that occur during switching which can corrupt the VIN line.
2. Place COUT on the top layer (same layer as the LM36010) and as close as possible to the OUT and GND
pins. The returns for both CIN and COUT must come together at one point, as close as possible to the GND
pin. Connecting COUT through short, wide traces reduce the series inductance on the OUT and GND pins that
can corrupt the VOUT and GND lines and cause excessive noise in the device and surrounding circuitry.
3. Connect the inductor on the top layer close to the SW pin. There must be a low-impedance connection from
the inductor to SW due to the large DC inductor current, and at the same time the area occupied by the SW
node must be small so as to reduce the capacitive coupling of the high dV/dT present at SW that can couple
into nearby traces.
4. Avoid routing logic traces near the SW node so as to avoid any capacitively coupled voltages from SW onto
any high-impedance logic lines such as STROBE, SDA, and SCL. A good approach is to insert an inner layer
GND plane underneath the SW node and between any nearby routed traces. This creates a shield from the
electric field generated at SW.
5. Terminate the flash LED cathode directly to the GND pin of the LM36010. If possible, route the LED return
with a dedicated path so as to keep the high amplitude LED current out of the GND plane. For a flash LED
that is routed relatively far away from the LM36010, a good approach is to sandwich the forward and return
current paths over the top of each other on two layers. This helps reduce the inductance of the LED current
path.
版权 © 2017, Texas Instruments Incorporated
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LM36010
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
www.ti.com.cn
10.2 Layout Example
IN
10 mF
VIAs to GND
tlane
CIN
GND
SW
IN
L
1 mH
COUT
STROBE
10 mF
STROBE
SW
SDA
SCL
OUT
LED
SDA
SCL
OUT
LED
图 81. LM36010 Layout Example
34
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LM36010
www.ti.com.cn
ZHCSGJ8B –APRIL 2017–REVISED OCTOBER 2017
11 器件和文档支持
11.1 器件支持
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 文档支持
11.2.1 相关文档
相关文档如下：
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11.3 接收文档更新通知
要接收文档更新通知，请转至 TI.com 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产品信
息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据如有变更，恕不另行通知
和修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。
36
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版权 © 2017, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM36010YKBR
ACTIVE
DSBGA
YKB
8
3000 RoHS & Green SAC396 | SNAGCU
Level-1-260C-UNLIM
-40 to 85
6010
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
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TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
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