LM36011 [TI]
无电感器 LED 闪存驱动器;
| 型号： | LM36011 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 无电感器 LED 闪存驱动器 驱动 电感器 驱动器 闪存 |
| 文件： | 总34页 (文件大小：2145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM36011
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
LM36011 无感应器、单 LED 闪光灯驱动器
1 特性
3 说明
1
•
精确且可编程 LED 电流
LM36011 是一款超小型 LED 闪光灯驱动器，具有高
度可调节性。总解决方案尺寸为 4mm2，可提供高达
1.5A 的 LED 闪光灯电流或高达 376mA 的手电筒电
流。以上所有的操作均可通过精确的可编程电流源来完
成，无需预调节电压，从而减小解决方案尺寸并节省成
本。
–
闪光灯/IR 电流范围：11mA 至 1.5A（128 个级
别）
–
手电筒电流范围：2.4mA 至 376mA（128 个级
别）
•
•
闪光灯超时时间长达 1.6 秒
优化了低电池电量条件下的闪光灯 LED 电流
(IVFM)
LM36011 的功能由与 I2C 兼容的接口控制。这些 特性
包括：硬件闪光灯 (STROBE)、闪光灯超时、UVLO、
热比例缩减、LED 故障检测以及适用于闪光灯和影片
模式（手电筒）的 128 级可编程电流。该器件可在
-40°C 至 +85°C 的环境温度范围下工作。
•
•
•
•
•
LED 阴极对地短路运行以提高热管理
较小的总体解决方案尺寸：< 4mm2
硬件闪光灯使能 (STROBE)
输入电压范围：2.5V 至 5.5V
400kHz I2C 兼容接口
器件信息(1)
–
I2C 地址 = 0x64
器件型号
LM36011
封装
封装尺寸（标称值）
DSBGA (8)
1.512mm × 0.800mm
2 应用
(1) 要了解所有可用封装，请参阅数据表末尾的可订购产品附录。
•
•
•
•
•
•
手机
平板电脑
IR LED 驱动器
视频监控：IP 摄像机
条形码扫描仪
便携式数据终端
简化电路原理图
IN
VIN
C1
2.5 V œ 5.5 V
LED
D1
SDA
GND
µP/µC
SCL
STROBE
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNVSAN5
LM36011
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
www.ti.com.cn
目录
7.4 Device Functioning Modes...................................... 11
7.5 Programming........................................................... 13
7.6 Register Descriptions.............................................. 15
Applications and Implementation ...................... 17
8.1 Application Information............................................ 17
8.2 Typical Application ................................................. 17
Power Supply Recommendations...................... 23
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements................................................ 5
6.7 Typical Characteristics.............................................. 6
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ........................................ 9
7.3 Feature Description ................................................ 10
8
9
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Example ................................................... 23
11 器件和文档支持 ..................................................... 24
11.1 器件支持................................................................ 24
11.2 文档支持................................................................ 24
11.3 商标....................................................................... 24
11.4 静电放电警告......................................................... 24
11.5 Glossary................................................................ 24
12 机械、封装和可订购信息....................................... 25
7
4 修订历史记录
Changes from Original (July 2017) to Revision A
Page
•
更正了封装尺寸 .................................................................................................................................................................... 25
2
Copyright © 2017, Texas Instruments Incorporated
LM36011
www.ti.com.cn
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
5 Pin Configuration and Functions
YKB Package
8-Pin DSBGA
Top View
A1
B1
A2
B2
Pin A1
C2
D2
C1
D1
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
NO.
A1
GND
G
P
Ground
Input voltage connection. Connect IN to the input supply and bypass to GND with a 10-µF or
larger ceramic capacitor.
A2,C1
B2
IN
Active high hardware flash enable. Drive STROBE high to turn on flash pulse. An internal
pulldown resistor of 300 kΩ is between STROBE and GND.
STROBE
I
C2
D1
D2
B1
SDA
LED
I/O
P
I2C serial data input/output.
High-side current source output for flash LED.
I2C serial clock input.
SCL
I
No Connect
—
No connect
(1) G = Ground; P = Power; I = Input; O = Output
Copyright © 2017, Texas Instruments Incorporated
3
LM36011
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
−0.3
−0.3
MAX
UNIT
IN, OUT, LED
6
V
SDA, SCL, STROBE
(VIN+ 0.3) w/ 6 V maximum
Continuous power dissipation(3)
Junction temperature, TJ-MAX
Storage temperature, Tstg
Internally limited
150
150
°C
°C
−65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and
disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.
6.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
MAX
5.5
UNIT
VIN
2.5
−40
−40
V
Junction temperature, TJ
Ambient temperature, TA
125
85
°C
°C
(3)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LM36011
THERMAL METRIC(1)
YKB (DSBGA)
8 PINS
117.3
1.3
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
34.3
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.5
ΨJB
34.6
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2017, Texas Instruments Incorporated
LM36011
www.ti.com.cn
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
6.5 Electrical Characteristics
TA = 25°C and VIN = 3.6 V, unless otherwise specified. Minimum and maximum limits apply over the full operating ambient
temperature range (–40°C ≤ TA ≤ 85°C).(1)(2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CURRENT SOURCE SPECIFICATIONS
(3)
VIN = 4 V, flash code = 0x7F = 1.5 A
–10%
–10%
1.5
376
550
350
10%
10%
A
ILED
Current source accuracy
VIN = 4 V, torch code = 0x7F = 376 mA
mA
ILED = 1.5 A
Flash
Torch
LED current source regulation
voltage
VHR
mV
ILED = 376 mA
STEP-UP DC-DC CONVERTER SPECIFICATIONS
VUVLO
VIVFM
Undervoltage lockout threshold
Falling VIN
2.5
2.9
0.3
0.8
V
V
Input voltage flash monitor trip
threshold
Reg 0x02, bits [7:5] = 000
–3%
3%
4
IQ
Quiescent supply current
mA
µA
Device disabled
2.5 V ≤ VIN ≤ 5.5 V
ISB
Standby supply current
STROBE VOLTAGE SPECIFICATIONS
VIL
Input logic low
0
0.4
VIN
V
V
2.5 V ≤ VIN ≤ 5.5 V
VIH
Input logic high
1.2
I2C-COMPATIBLE INTERFACE SPECIFICATIONS (SCL, SDA)
VIL
Input logic low
Input logic high
Output logic low
0
0.4
VIN
2.5 V ≤ VIN ≤ 4.2 V
V
VIH
VOL
1.2
ILOAD = 3 mA
400
mV
(1) Minimum (MIN) and Maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not verified,
but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
(2) All voltages are with respect to the potential at the GND pin.
(3) The ability to deliver 1.5 A of LED current is highly dependent upon the input voltage, LED voltage, ambient temperature and PCB
layout. Depending upon the system conditions, it is possible that the device could hit the internal thermal shutdown or thermal scale-
back value before the desired flash duration is reached. See Thermal Performance for more details.
6.6 Timing Requirements
MIN
2.4
100
0
NOM
MAX
UNIT
µs
t1
t2
t3
t4
t5
SCL clock period
Data in set-up time to SCL high
Data out stable after SCL low
SDA low set-up time to SCL low (start)
SDA high hold time after SCL high (stop)
ns
ns
100
100
ns
ns
t
1
SCL
SDA_IN
t
t
5
4
t
2
SDA_OUT
t
3
图 1. I2C-Compatible Interface Specifications
版权 © 2017, Texas Instruments Incorporated
5
LM36011
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
www.ti.com.cn
6.7 Typical Characteristics
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
1.6
1.4
1.2
1
1.6
1.4
1.2
1
85èC
25èC
-40èC
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
2.5
IFLASH = 1.5 A
图 3. LED Flash Current vs Input Voltage
3
3.5
4
4.5
5
5.5
Brightness Code (hex)
D001
VIN (V)
D002
VIN = 4 V
图 2. LED Flash Current vs Brightness Code
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.2
1
0.8
0.6
0.4
0.2
0
85èC
25èC
85èC
25èC
-40èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
2.5
IFLASH = 1.03 A
图 4. LED Flash Current vs Input Voltage
3
3.5
4
4.5
5
5.5
D004
VIN (V)
.
D003
IFLASH = 0.75 A
图 5. LED Flash Current vs Input Voltage
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.6
1.4
1.2
1
Code 0x00
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
0.8
0.6
0.4
0.2
0
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D005
D006
图 6. LED Flash Current vs Input Voltage
图 7. LED Flash Current vs Input Voltage
6
版权 © 2017, Texas Instruments Incorporated
LM36011
www.ti.com.cn
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
Typical Characteristics (接下页)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
0.4
0.36
0.32
0.28
0.24
0.2
0.4
0.36
0.32
0.28
0.24
0.2
85èC
25èC
-40èC
0.16
0.12
0.08
0.04
0
0.16
0.12
0.08
0.04
0
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
2.5
3
3.5
4
4.5
5
5.5
Brightness Code (hex)
VIN (V)
D007
D008
ITORCH = 376 mA
图 8. LED Torch Current vs Brightness Code
图 9. LED Torch Current vs Input Voltage
0.28
0.2
0.18
0.16
0.14
0.12
0.1
0.24
0.2
0.16
0.12
0.08
0.04
0
0.08
0.06
0.04
0.02
0
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D009
D010
ITORCH = 258 mA
ITORCH = 188 mA
图 10. LED Torch Current vs Input Voltage
图 11. LED Torch Current vs Input Voltage
0.2
0.18
0.16
0.14
0.12
0.1
0.4
0.3
0.2
0.1
0
Code 0x00
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
0.08
0.06
0.04
0.02
0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D011
D012
图 12. LED Torch Current vs Input Voltage
图 13. LED Torch Current vs Input Voltage
版权 © 2017, Texas Instruments Incorporated
7
LM36011
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
www.ti.com.cn
Typical Characteristics (接下页)
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
380
360
340
320
300
280
260
240
220
200
180
380
360
340
320
300
280
260
240
220
200
180
85èC
25èC
-40èC
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D013
D014
Mode (Reg 0x01 bits[1:0]) = 01 (IR Mode)
Mode (Reg 0x01 bits[1:0]) = 10 (Torch Mode)
图 14. LED Off Current vs Input Voltage
图 15. LED On Current vs Input Voltage
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
85èC
25èC
-40èC
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D015
图 16. Standby Current vs Input Voltage
8
版权 © 2017, Texas Instruments Incorporated
LM36011
www.ti.com.cn
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
7 Detailed Description
7.1 Overview
The LM36011 is a high-power white LED flash driver capable of delivering up to 1.5 A to the LED over the 2.5-V
to 5.5-V input voltage range.
The device has one logic input for a hardware flash enable (STROBE). This logic input has an internal 300-kΩ
(typical) pulldown resistor to GND.
Additional features of the device include an input voltage monitor that can reduce the flash current during low VIN
conditions and a temperature based current scale-back feature that forces the flash current to the set torch level
if the on-chip junction temperature reaches 125°C.
Control is done via an I2C-compatible interface. This includes adjustment of the flash and torch current levels,
and changing the flash time-out duration. Additionally, there are flag and status bits that indicate flash current
time-out, LED over-temperature condition, LED failure (open/short), device thermal shutdown, thermal current
scale-back, and VIN undervoltage conditions.
7.2 Functional Block Diagram
IN
IN
Thermal Current
Scale Back
Input Voltage
Flash Monitor
UVLO
+125oC
Thermal Shutdown
+150oC
LED
Control
Logic/
Registers
SDA
SCL
I2C
Interface
GND
Copyright © 2017, Texas Instruments Incorporated
STROBE
版权 © 2017, Texas Instruments Incorporated
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LM36011
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
www.ti.com.cn
7.3 Feature Description
7.3.1 Flash Mode
In flash mode, the LED current source provides 128 target current levels from 11 mA to 1.5 A, set by the LED
Flash Brightness Register (0x03 bits [6:0]). Flash mode is activated by the Enable Register (0x01), setting mode
M1, M0 (bits [1:0]) to 11. Once the flash sequence is activated, the LED current source ramps up to the
programmed flash current by stepping through all current steps until the programmed current is reached.
When flash mode is enabled using the mode M1, M0 (bits [1:0]) of the Enable Register (0x01), the mode bits in
the Enable Register are cleared after a flash time-out event.
7.3.2 Torch Mode
In torch mode, the LED current source provides 128 target current levels from 2.4 mA to 376 mA, set by the LED
Torch Brightness Register (0x04 bits [6:0]). Torch mode is activated by the Enable Register (0x01), setting mode
M1, M0 (bits [1:0]) to 10. Once the TORCH sequence is activated, the LED current source ramps up to the
programmed torch current by stepping through all current steps until the programmed current is reached. The
rate at which the current ramps is determined by the value chosen in the Torch Ramp bit [0] in Timing Register
(0x02).
7.3.3 IR Mode
In IR mode, the target LED current is equal to the value stored in the LED Flash Brightness Register (0x03 bits
[7:0]). IR mode is enabled by the Enable Register (0x01) setting mode M1, M0 (bits [1:0]) to 01. In IR mode,
toggling the STROBE pin enables and disables the LED current source. The STROBE pin can only be set to be
Level sensitive, as all timing of the IR pulse is externally controlled. In IR mode, the current source does not
control the ramp rate of the LED output. The current transitions immediately from off to on and then on to off.
STROBE
ILED
图 17. IR Mode
STROBE
ILED
TIME-OUT
Reached
TIME-OUT
VOUT goes low,
Start
LED turn off
(1) When the flash timer elapses, the device goes into stand-by regardless of strobe state
图 18. IR Mode Time-out
10
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LM36011
www.ti.com.cn
ZHCSGJ7A –JULY 2017–REVISED OCTOBER 2017
7.4 Device Functioning Modes
7.4.1 Start-Up (Enabling The Device)
At turnon the LED current source steps through each FLASH or TORCH level until the target LED current is
reached. This gives the device a controlled turnon and limits inrush current from the VIN supply. The target LED
flash and the target LED torch currents are set by the LED Flash Brightness Register (0x03 bits [6:0]) and LED
Torch Brightness Register (0x04 bits [6:0]) respectively.
7.4.2 Input Voltage Flash Monitor (IVFM)
The LM36011 has the ability to adjust the flash current based upon the voltage level present at the IN pin
utilizing the input voltage flash monitor (IVFM). The adjustable threshold IVFM-D ranges from 2.9 V to 3.6 V in
100-mV steps and is set by Configuration Register (0x02) bits [7:5]. Additionally, the IVFM-D threshold sets the
input voltage boundary that forces the LM36011 to stop ramping the flash current during start-up.
IVFM ENABLE
LEVEL STROBE
VIN PROFILE for Stop and Hold Mode
IVFM-D
Set Target Flash Current
Dotted line shows O/P Current Profile with
O/P Current Profile in
Stop and Hold Mode
IVFM Disabled
SET RAMP FROM
THE RAMP
REGISTER USED
图 19. IVFM Mode
7.4.3 Fault/Protections
Upon a fault condition, the LM36011 sets the appropriate flag(s) in the Flags Register (0x05) and switches into
stand-by mode obtained by clearing the mode M1, M0 (bits [1:0]) of the Enable Register (0x01). The LM36011
remains in standby until an I2C read of the Flags Register. I2C read of the Flags Register clears the flags and the
fault status can be re-checked. If the fault(s) is still present, the LM36011 re-sets the appropriate flag bits and
enters stand-by again.
7.4.3.1 Input Voltage Flash Monitor (IVFM)
When the input voltage crosses the IVFM-D value, programmed by Configuration Register (0x02) bits [7:5], the
LM36011 sets the IVFM flag (bit [6]) of Flags Register (0x05).
7.4.3.2 LED Short Fault
LM36011 enters stand-by mode from flash or torch mode and VLED Short Fault flag (bit [5]) of Flags Register
(0x05) is set, if the LED output experiences a short condition. An LED short condition occurs if the voltage at the
LED pin goes below 500 mV (typical). There is a deglitch time of 256 µs before the LED short flag is valid The
LED short fault can be reset to 0 by removing power to the LM36011, or setting the software reset field (Register
0x06 bit [7]) to a 1, or by reading back the Flags Register.
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Device Functioning Modes (接下页)
7.4.3.3 Thermal Scale-Back (TSB)
When the LM36011 die temperature reaches 125°C, the thermal scale-back (TSB) circuit trips and TSB flag (bit
[2]) of Flags Register (0x05) is set. The LED current then shifts to torch current level, set by the LED Torch
Brightness Register (0x04 bits [6:0]) for the duration of the flash pulse, set by the flash time-out in the
Configuration Register (0x02 bits [4:1]) After I2C read of the Flags Register and upon re-flash, if the die
temperature is still above 125°C, the LM36011 re-enters into torch current level and sets the TSB flag bit again.
7.4.3.4 Thermal Shutdown (TSD)
When the LM36011 die temperature reaches 150°C, the thermal shutdown (TSD) circuit trips, forcing the
LM36011 into standby and writing a 1 to the TSD flag (bit [2]) of the Flags Register (0x05). The LM36011 restarts
only after the Flags Register is read, which clears the fault flag. Upon restart, if the die temperature is still above
150°C, the LM36011 resets the TSD flag and re-enters standby.
7.4.3.5 Undervoltage Lockout (UVLO)
The LM36011 has an internal comparator that monitors the voltage at IN pin. If the input voltage drops to 2.5 V,
the UVLO flag (bit [1]) of Flags Register (0x05) is set and the LM36011 switches to stand-by mode. After the
UVLO flag is set, even if the input voltage rises above 2.5 V, the LM36011 is not available for operation until
there is an I2C read of the Flags Register. Upon an I2C read of the Flags Register, the UVLO fault is cleared and
normal operation can resume.
7.4.3.6 Flash Time-out (FTO)
The LM36011 sources the flash current for the time period set by Flash Time-out (0x02 bits [4:1]). The LED
current source has 16 time-out levels ranging from 40 ms to 1600 ms.
12
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7.5 Programming
7.5.1 Control Truth Table
M1 (Register 0x01
bit[1])
M0 (Register 0x01 bit[0])
STROBE EN (Register
0x01 bit[2])
STROBE PIN
ACTION
0
0
1
1
0
0
0
0
0
0
1
1
1
1
0
1
X
X
0
1
1
X
Standby
Ext flash
pos edge
X
Int torch
X
Int flash
X
0
IR LED standby
IR LED standby
IR LED enabled
pos edge
7.5.2 I2C-Compatible Interface
7.5.2.1 Data Validity
The data on SDA must be stable during the HIGH period of the clock signal (SCL). In other words, the state of
the data line can only be changed when SCL is LOW.
SCL
SDA
data
change
allowed
data
change
allowed
data
valid
data
change
allowed
data
valid
图 20. Data Validity Data
A pullup resistor between the VIO line of the controller and SDA must be greater than [(VIO – VOL) / 3 mA] to
meet the VOL requirement on SDA. Using a larger pullup resistor results in lower switching current with slower
edges, while using a smaller pullup resistor results in higher switching currents with faster edges.
7.5.2.2 Start and Stop Conditions
START and STOP conditions classify the beginning and the end of the I2C session. A START condition is
defined as the SDA signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined
as the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and
STOP conditions. The I2C bus is considered busy after a START condition and free after a STOP condition.
During data transmission, the I2C master can generate repeated START conditions. First START and repeated
START conditions are equivalent, function-wise.
SDA
SCL
S
P
Start Condition
Stop Condition
图 21. Start and Stop Conditions
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7.5.2.3 Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) transferred first. Each
byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the
master. The master releases the SDA line (HIGH) during the acknowledge clock pulse. The LM36011 pulls down
the SDA line during the 9th clock pulse, signifying an acknowledge. The LM36011 generates an acknowledge
after each byte is received. There is no acknowledge created after data is read from the device.
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LM36011 7-bit address is 0x64. For the eighth bit, a 0 indicates
a WRITE, and a 1 indicates a READ. The second byte selects the register to which the data is written. The third
byte contains data to write to the selected register.
ack from
slave
ack from
slave
ack from
slave
msb Chip
Address lsb
start
w
ack msb Register Add lsb ack msb DATA lsb
ack stop
SCL
SDA
start
Id = 64h
w
ack
addr = 01h
ack
Data = 03h
ack stop
图 22. Write Cycle W = Write (SDA = 0) R = Read (SDA = 1) Ack = Acknowledge
(SDA Pulled Down by Either Master or Slave) ID = Chip Address, 64h for LM36011
7.5.2.4 I2C-Compatible Chip Address
The device address for the LM36011 is 1100100 (0x64). After the START condition, the I2C-compatible master
sends the 7-bit address followed by an eighth read or write bit (R/W). R/W = 0 indicates a WRITE and R/W = 1
indicates a READ. The second byte following the device address selects the register address to which the data is
written. The third byte contains the data for the selected register.
MSB
LSB
1
Bit 7
1
Bit 6
0
Bit 5
0
Bit 4
1
Bit 3
0
Bit 2
0
Bit 1
R/W
Bit 0
I2C Slave Address (chip address)
图 23. I2C-Compatible Chip Address
14
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7.6 Register Descriptions
POWER ON/RESET VALUE
REGISTER NAME
INTERNAL HEX ADDRESS
LM36011
0x20
Enable Register
0x01
0x02
0x03
0x04
0x05
0x06
Configuration Register
LED Flash Brightness Register
LED Torch Brightness Register
Flags Register
0x15
0x00
0x00
0x00
Device ID Register
0x01
7.6.1 Enable Register (0x01)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
RFU
RFU
IVFM Enable
0 = Disabled
(Default)
Strobe Type
0 = Level
Triggered
(Default)
Strobe Enable Mode Bits: M1, M0
0 = Disabled
(Default )
00 = Standby (Default)
01 = IR Drive
10 = Torch
1 = Enabled
1 = Enabled
1 = Edge
Triggered
11 = Flash
注
Edge strobe mode is not valid in IR MODE. Switching between level and edge strobe
types while the device is enabled is not recommended.
In edge or level strobe mode, TI recommends that the trigger pulse width be set greater
than 1 ms to ensure proper turn-on of the device.
7.6.2 Configuration Register (0x02)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
IVFM Levels (IVFM-D)
000 = 2.9 V (Default)
001 = 3 V
Flash Time-out Duration
0000 = 40 ms
0001 = 80 ms
Torch Ramp
0 = No Ramp
1 = 1 ms
010 = 3.1 V
011 = 3.2 V
100 = 3.3 V
101 = 3.4 V
110 = 3.5 V
111 = 3.6 V
0010 = 120 ms
0011 = 160 ms
0100 = 200 ms
0101 = 240 ms
0110 = 280 ms
0111 = 320 ms
1000 = 360 ms
1001 = 400 ms
1010 = 600 ms (Default)
1011 = 800 ms
1100 = 1000 ms
1101 = 1200 ms
1110 = 1400 ms
1111 = 1600 ms
(default)
注
On the LM36011, special care must be taken with regards to thermal management when
using time-out values greater than 500 ms. Depending on the PCB layout, input voltage,
and output current, it is possible to have the internal thermal shutdown circuit trip prior to
reaching the desired flash time-out value.
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7.6.3 LED Flash Brightness Register (0x03)
Bit 7
Thermal
Current
Scale-Back
0 = Disabled
1 = Enabled
(default)
If enabled, the .......................
LED current
shifts to torch
current level if 01100110 (0x66) = 1.2 A
Bit 6
Bit 5
Bit 4
Bit 3
Bit 3
Bit 3
Bit 2
Bit 2
Bit 2
Bit 1
Bit 0
LED Flash Brightness Level
0000000 = 11 mA (Default)
.......................
00010101 (0x15) = 0.257 A
.......................
0111111 (0x3F) = 0.75 A
0101111 (0x5F) = 1.03 A
.......................
TJ reaches
125 °C
.......................
1111111 (0x7F) = 1.5 A
7.6.4 LED Torch Brightness Register (0x04)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 1
Bit 0
LED Torch Brightness Levels
0000000 = 2.4 mA (Default)
.......................
00010101 (0x15) = 64 mA
.......................
0111111 (0x3F) = 188 mA
.......................
0101111 (0x5F) = 258 mA
.......................
RFU
01100110 (0x66) = 302 mA
.......................
1111111 (0x7F) = 376 mA
7.6.5 Flags Register (0x05)
Bit 7
RFU
Bit 6
Bit 5
Bit 4
RFU
Bit 1
Bit 0
Thermal Current
Scale-back
Thermal
Shutdown
(TSD) Fault
IVFM Trip
Flag
VLED Short
Fault
Flash Time-Out
Flag
UVLO Fault
(TSB) Flag
7.6.6 Device ID and RESET Register (0x06)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Software
RESET
Device ID
000
Silicon Revision Bits
001
0 = Normal
(default)
RFU
1 = Force
device RESET
16
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8 Applications and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM36011 can drive a flash LED at currents up to 1.5 A. .
8.2 Typical Application
IN
VIN
C1
2.5 V œ 5.5 V
LED
D1
SDA
GND
µP/µC
SCL
STROBE
Copyright © 2016, Texas Instruments Incorporated
图 24. LM36011 Typical Application
8.2.1 Design Requirements
Example requirements based on default register values:
表 1. Design Parameters
DESIGN PARAMETER
Input voltage range
Brightness control
LED configuration
Flash brightness
EXAMPLE VALUE
2.5 V to 5.5 V
I2C Register
1 flash LED
1.5-A maximum current
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8.2.2 Detailed Design Procedure
8.2.2.1 Thermal Performance
Output power is limited by two things: the ambient temperature, and the maximum power dissipation in the
package. If the die temperature of the device is below the absolute maximum rating of 125°C, the maximum
output power can be over 6 W. However, any appreciable output current causes the internal power dissipation to
increase and therefore increase the die temperature. Any circuit configuration must ensure that the die
temperature remains below 125°C taking into account the ambient temperature derating. The thermal scale-back
protection (TSB) helps ensure that temperature requirement is held valid. If the TSB feature is disabled, thermal
shutdown (TSD) is the next level of protection for the device, which is set to 150°C. This mechanism cannot be
disabled, and operation of the device above 125°C is not ensured by the electrical specification.
The device power dissipation equals:
P
= V - VLED ìI
DISS
IN
LED
(1)
Use 公式 2 to calculate the junction temperature (TJ) of the device:
TJ = RqJA ìP
DISS
(2)
Note that these equations only provide approximation of the junction temperature and do not take into account
thermal time constants, which play a large role in determining maximum deliverable output power and flash
durations.
8.2.2.2 Input Capacitor Selection
Choosing the correct size and type of input capacitor helps minimize noise on the input pin of the boost converter
that can feed through and disrupt internal analog signals. In the typical application circuit a 10-µF ceramic input
capacitor works well. It is important to place the input capacitor as close as possible to the LM36011 input (IN)
pin. This reduces the series resistance and inductance that can inject noise into the device. 表 2 lists various
input capacitors recommended for use with the LM36011.
表 2. Recommended InputCapacitors (X5R/X7R Dielectric)
MANUFACTURER
TDK Corporation
TDK Corporation
Murata
PART NUMBER
C1608JB0J106M
VALUE
10 µF
10 µF
10 µF
10 µF
CASE SIZE
VOLTAGE RATING
0603 (1.6 mm × 0.8 mm × 0.8 mm)
0805 (2 mm × 1.25 mm × 1.25 mm)
0603 (1.6 mm × 0.8 mm × 0.8 mm)
0805 (2 mm × 1.25 mm × 1.25 mm)
6.3 V
10 V
6.3 V
10 V
C2012JB1A106M
GRM188R60J106M
GRM21BR61A106KE19
Murata
18
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8.2.3 Application Curves
TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
2.5
3
3.5
4
4.5
5
5.5
Brightness Code (hex)
VIN (V)
D016
D017
VIN = 4.0 V
IFLASH = 1.5 A
图 25. LED Flash Efficiency vs Brightness Code
图 26. LED Flash Efficiency vs Input Voltage
100
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
95
90
85
80
75
70
65
60
55
50
45
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D018
D019
IFLASH = 1.03 A
IFLASH = 0.75 A
图 27. LED Flash Efficiency vs Input Voltage
图 28. LED Flash Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
50
45
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D020
D021
图 29. LED Flash Efficiency vs Input Voltage
图 30. LED Flash Efficiency vs Input Voltage
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TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
0x00 0x0F 0x1F 0x2F 0x3F 0x4F 0x5F 0x6F 0x7F
2.5
3
3.5
4
4.5
5
5.5
Brightness Code (hex)
D022
VIN (V)
D023
ITORCH = 376 mA
图 31. LED Torch Efficiency vs Brightness Code
图 32. LED Torch Efficiency vs Input Voltage
100
100
95
90
85
80
75
70
65
60
55
50
45
85èC
25èC
-40èC
85èC
25èC
-40èC
95
90
85
80
75
70
65
60
55
50
45
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D024
D025
ITORCH = 258 mA
图 33. LED Torch Efficiency vs Input Voltage
ITORCH = 188 mA
图 34. LED Torch Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
45
100
Code 0x47
Code 0x4F
Code 0x57
Code 0x5F
Code 0x67
Code 0x6F
Code 0x77
Code 0x7F
Code 0x07
Code 0x0F
Code 0x17
Code 0x1F
Code 0x27
Code 0x2F
Code 0x37
Code 0x3F
95
90
85
80
75
70
65
60
55
50
45
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D027
VIN (V)
D026
图 36. LED Torch Efficiency vs Input Voltage
图 35. LED Torch Efficiency vs Input Voltage
20
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TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
Time (200 µs/DIV)
Time (100 ms/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 11 (Flash mode)
Flash Time-out (Reg 0x02 bits[4:1]) = 0111 (320 ms)
图 37. Flash Start-up with I2C
图 38. Flash Time-out
Time (2 ms/DIV)
Time (200 µs/DIV)
Mode bits (Reg 0x01 bit[1:0]) = 10 (Torch mode)
图 39. Flash Turn-off with I2C
图 40. Torch Start-up with I2C
Time (400 µs/DIV)
Time (1 ms/DIV)
STROBE Enabled (Reg 0x01 bit[2] = 1)
Mode bits (Reg 0x01 bit[1:0]) = 00 (Standby mode)
图 41. Torch Turn-off with I2C
图 42. Flash Start-up with STROBE
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TA = 25°C, VIN = 3.6 V, CIN = 10 µF, VLED = 3.4 V, Flash Time-out = 320 ms and Thermal Scale-Back (TSB) disabled, unless
otherwise noted.
Time (100 ms/DIV)
Time (100 ms/DIV)
STROBE Enabled (Reg 0x01 bit[2] = 1)
Level Triggered (Reg 0x01 bit[3] = 0)
Strobe pulse = 100 ms
STROBE Enabled (Reg 0x01 bit[2] = 1)
Edge Triggered (Reg 0x01 bit[3] = 1)
Flash Time-out = 320 ms
图 43. Flash Turn-off with Level Triggered STROBE
图 44. Flash Turn-off with Edge Triggered STROBE
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9 Power Supply Recommendations
The LM36011 is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input
supply must be well regulated and capable to supply the required input current. If the input supply is located far
from the LM36011 additional bulk capacitance may be required in addition to the ceramic bypass capacitors.
10 Layout
10.1 Layout Guidelines
The following steps are to be used as a reference to ensure the device is stable and maintains proper LED
current regulation across its intended operating voltage and current range.
1. Place CIN on the top layer (same layer as the LM36011) and as close as possible to the device. Connecting
the input capacitor through short, wide traces to both the IN and GND pins reduces the inductive voltage
spikes that occur during switching which can corrupt the VIN line.
2. Terminate the flash LED cathode directly to the GND pin of the LM36011. If possible, route the LED return
with a dedicated path so as to keep the high amplitude LED current out of the GND plane. For a flash LED
that is routed relatively far away from the LM36011, a good approach is to sandwich the forward and return
current paths over the top of each other on two layers. This helps reduce the inductance of the LED current
path.
10.2 Layout Example
IN
10 mF
VIAs to GND
tlane
GND
NC
IN
STROBE
STROBE
SDA
SCL
IN
SDA
SCL
LED
LED
图 45. LM36011 Layout Example
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11 器件和文档支持
11.1 器件支持
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 文档支持
11.2.1 相关文档
相关文档如下：
AN-1112 DSBGA 晶圆级芯片级封装
11.3 商标
All trademarks are the property of their respective owners.
11.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
24
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12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据如有变更，恕不另行通知
和修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。
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27
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM36011YKBR
ACTIVE
DSBGA
YKB
8
3000 RoHS & Green
SAC396
Level-1-260C-UNLIM
-40 to 85
6011
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Feb-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM36011YKBR
DSBGA
YKB
8
3000
180.0
8.4
0.9
1.61
0.57
2.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Feb-2018
*All dimensions are nominal
Device
Package Type Package Drawing Pins
DSBGA YKB
SPQ
Length (mm) Width (mm) Height (mm)
182.0 182.0 20.0
LM36011YKBR
8
3000
Pack Materials-Page 2
PACKAGE OUTLINE
YKB0008
DSBGA - 0.5 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.5 MAX
C
SEATING PLANE
0.18
0.13
0.05 C
BALL TYP
0.35 TYP
D
C
B
SYMM
1.05
TYP
D: Max = 1.502 mm, Min =1.442 mm
E: Max = 0.79 mm, Min = 0.73 mm
0.35
TYP
A
1
2
0.24
0.19
C A B
8X
SYMM
0.015
4223222/A 08/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YKB0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.35) TYP
8X ( 0.2)
(0.35) TYP
2
1
A
B
C
SYMM
D
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
0.0325 MIN
0.0325 MAX
(
0.2)
SOLDER MASK
OPENING
(
0.2)
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223222/A 08/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YKB0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.35) TYP
8X ( 0.21)
(R0.05) TYP
1
2
A
B
(0.35)
TYP
SYMM
C
D
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 - 0.1 mm THICK STENCIL
SCALE:40X
4223222/A 08/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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