LM3622MX-8.2 [TI]
BATTERY CHARGE CONTROLLER, PDSO8, SOIC-8;
| 型号： | LM3622MX-8.2 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | BATTERY CHARGE CONTROLLER, PDSO8, SOIC-8 光电二极管 |
| 文件： | 总14页 (文件大小：894K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM3622
www.ti.com
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
LM3622 Lithium-Ion Battery Charger Controller
Check for Samples: LM3622
1
FEATURES
DESCRIPTION
The LM3622 is a charge controller for Lithium-Ion
batteries. This monolithic integrated circuit accurately
controls an external pass transistor for precision
Lithium-Ion battery charging. The LM3622 provides a
constant voltage or constant current (CVCC)
configuration that changes, as necessary, to optimally
charge lithium-ion battery cells. Voltage charging
versions (4.1V, 4.2V, 8.2V, and 8.4V) are available
for one or two cell battery packs and for coke or
graphite anode battery chemistry.
2
•
Versions for Charging of 1 Cell (4.1V or 4.2V)
or 2 Cells (8.2V or 8.4V)
•
•
•
•
•
Versions for Coke or Graphite Anode
Precision (±30mV/Cell) End-of-Charge Control
Wide Input Range: 4.5V-24V
Low Battery Drain Leakage: 200nA
15 mA Available to Drive Low Cost PNP
APPLICATIONS
The LM3622 accepts input voltages from 4.5V to
24V. Controller accuracy over temperature is
±30mV/cell for A grade and ±50mV/cell for the
standard grade. No precision external resistors are
required. Furthermore, the LM3622's proprietary
output voltage sensing circuit drains less than 200nA
from the battery when the input source is
disconnected.
•
•
•
Cellular Phone Cradle Charger
PDA/Notebook Cradle Charger
Camcorder Cradle Charger
The LM3622 circuitry includes functions for regulating
the charge voltage with a temperature compensated
bandgap reference and regulating the current with an
external sense resistor. The internal bandgap insures
excellent controller performance over the operating
temperature and input supply range.
The LM3622 can sink 15mA minimum at the EXT pin
to drive the base of an external PNP pass transistor.
It also has low-voltage battery threshold circuitry that
removes this drive when the cell voltage drops below
a preset limit. The LVSEL pin programs this threshold
voltage to either 2.7V/cell or 2.15V/cell. The low-
voltage detection, which is a user enabled feature,
provides an output signal that can be used to enable
a
"wake up charge" source automatically to
precondition a deeply discharged pack.
The LM3622 is available in a standard 8-lead SOIC
surface mount package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM3622
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
TYPICAL APPLICATION
CONNECTION DIAGRAM
Figure 1. 8-Lead SOIC Package
See Package D0008A
2
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3622
LM3622
www.ti.com
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
PIN DESCRIPTION
Pin No.
Name
I/O
Description
1
LVSEL
Input
Low-voltage detection threshold Select. The threshold is 2.15V/cell when this pin is pulled
low to GND and 2.70V/cell when it is pulled up to VCC. The battery voltage is sensed
between CEL and CS pins.
2
3
LVENB
LV
Input
Low-voltage detection Enable. The low-voltage detection is enabled when this pin is pulled
Low to GND. Pulling this pin HIGH to VCC disables the low-voltage detection.
Output
Output of the low-voltage detection. This pin is a NPN open-collector output that goes to low
impedance state when LVENB is pulled LOW and the battery voltage is below the threshold
set by LVSEL. LV stays in HIGH impedance state at any battery voltage when LVENB is
pulled HIGH to VCC. LV can be used for turning on a low current source to recondition a
deeply depleted battery.
4
5
GND
CS
Ground
Input
IC common.
Input for battery charge current and battery negative-terminal voltage sensing. Battery
charging current is sensed through an external resistor, RCS, connected between the
battery's negative terminal and GND. The maximum charge current is regulated to a value
of 100mV/RCS
.
6
7
CEL
EXT
Input
Battery positive-terminal voltage sensing.
Output
Output of the controller for driving a PNP transistor or P-MOSFET. The controller modulates
the current sinking into this pin to control the regulation of either the charge current or the
battery voltage.
8
VCC
Power Supply
IC power supply
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Supply Voltage (VCC
)
-0.3 to 24V
-0.3 to 24V
-0.3 to 24V
-0.3 to 24V
-0.3 to 24V
2500V
LV
(3)
EXT
LVSEL
LVENB
(4)
ESD Susceptibility
Storage Temperature
Lead Temp. Soldering
−40°C to +125°C
215°C
Vapor Phase (60 sec.)
Infrared (15 sec.)
220°C
Power Dissipation (TA = 25°C)(5)
Max. Package Dissipation
350mW
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) VEXT is not allowed to exceed (VCC+ 0.3V) or damage to the device may occur.
(4) Rating is for the human body model, a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin.
(5) The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX (maximum junction temperature),
θJA (junction-to-ambient thermal resistance) and TA (ambient temperature). The maximum power dissipation at any temperature is:
PDissMAX = (TJMAX − TA) / θJA up to the value listed in the Absolute Maximum Ratings.
OPERATING RATINGS(1)
Supply Voltage (VCC
)
4.5V to 24V
−20°C to 70°C
−20°C to 85°C
170°C/W
Ambient Temperature Range
Junction Temperature Range
Thermal Resistance, θJA
SOIC-8
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM3622
LM3622
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS LM3622-XX
Unless otherwise specified VCC = 5V/Cell TA =TJ = 25°C. Limits with standard typeface apply for TJ = 25°C, and limits in
boldface type apply over the indicated temperature range.
Symbol
VCC
Parameter
Operating power supply range
Quiescent Current
Conditions
Min
Typ
Max
Units
V
4.5
24.0
ICC
210
µA
Regulation Voltage
LM3622A-4.1
LM3622A-8.2
LM3622A-4.2
LM3622A-8.4
LM3622-4.1
LM3622-8.2
LM3622-4.2
LM3622-8.4
TJ = 0°C to +70°C
VCC = 4.5V/cell
(1)
4.070
8.140
4.170
8.340
4.050
8.100
4.150
8.300
4.100
8.200
4.200
8.400
4.100
8.200
4.200
8.400
4.130
8.260
4.230
8.460
4.150
8.300
4.250
8.500
V
V
V
V
V
V
V
VCEL
(2)
Long Term Stability
See
0.02
100
%
VCS
ICEL
VCEL = 4V for LM3622-4.X
VCEL = 8V for LM3622-8.X
90
110
mV
Current limit threshold at CS pin
Current in CEL pin
VCC Supply connected
VCC Supply Open
25
200
2.15
2.70
25
µA
nA
LVth
Low voltage detect threshold
(between pins CS and GND)
LVENB = 0V and LVSEL = 0V
LVENB = 0V and LVSEL = VCC
2.00
2.55
15
2.30
2.85
V/Cell
V/Cell
mA
IEXT
IIN1
IIN2
EXT pin output sink current
LVSEL input current
VEXT = 4V for LM3622-4.X
VEXT = 8V for LM3622-8.X
LVSEL = 5V, LM3622-4.X
LVSEL = 10V, LM3622-8.X
20
50
µA
µA
LVENB input current
LVENB = 5V, LM3622-4.X
LVENB = 10V, LM3622-8.X
20
50
ILV
LV pin leakage current
LV pin saturation voltage
LV = 5V/Cell
250
nA
V
VLV
ISINK = 1mA
0.25
0.40
TJ = −20°C to 85°C
(1) Limits reflect initial accuracy.
(2) TJ = 85°C, 1000 hours. Activation energy of 0.78eV used.
4
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3622
LM3622
www.ti.com
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified, TA = 25°C.
Current Sense Voltage Regulation
Output Voltage Regulation
Vs
Vs VCC
VCC
Figure 2.
Figure 3.
Current Sense Voltage Regulation
Output Drive Current
Vs
Vs
Temperature
VCC
Figure 4.
Figure 5.
Output Drive Current
Quiescent Current
Vs
Vs
VCC
VCC
Figure 6.
Figure 7.
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM3622
LM3622
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
FUNCTIONAL DESCRIPTION
Figure 8. LM3622 Simplified Block Diagram
The simplified LM3622 block diagram in Figure 8 gives a general idea of the circuit operation. The controller
integrates the reference, feedback and drive functions on-chip to control a linear, lithium-ion battery charger in
constant voltage and constant current (CVCC) charge operation. The regulated output voltage is sensed between
CEL and CS, and the battery charge current is sensed across a current-sense resistor between CS and GND.
The EXT pin is designed for driving a series pass element, which can be a PNP transistor or a P-MOSFET.
Tying the LVENB pin to ground enables the controller's low-voltage detection circuit. When the low-voltage
detection circuit is enabled and a battery voltage below a preset threshold is detected, the LM3622 will drive the
LV pin low and shut off the current flowing into the EXT pin to suspend the CVCC charge process. The low-
voltage threshold is user selectable to be either 2.15V/cell or 2.7V/cell by pulling the LVSEL pin to GND or VCC
respectively. The LV pin is a NPN open collector output that can be used to turn on a low current source to wake
up charge a deeply depleted battery. When the low-voltage detection is disabled (LVENB pulled up to VCC), the
LM3622 always starts the charge cycle in constant current mode at any battery voltage below the controller's
regulation level, and maintains the LV pin at a high-impedance state.
6
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3622
LM3622
www.ti.com
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
APPLICATION INFORMATION
CEL PIN CURRENT DRAIN
The LM3622 has an internal power down switch in series with the on-chip resistor divider that is used for sensing
the battery voltage. In the event that the VCC supply is removed, the power down switch will disconnect the
resistor divider from the CS pin, preventing the battery from discharging through the CEL pin.
EXT PIN
The EXT pin is internally pulled up to VCC via a 20µA current source making it possible to eliminate the external
base-emitter resistor when driving a PNP transistor, or the gate-source resistor when driving a P-MOSFET.
However, the voltage applied to EXT is not allowed to be higher than (VCC + 0.3V), otherwise the reverse current
from EXT pin to VCC pin may cause damage to the device.
LV PIN CURRENT RATING
The LV pin is a low power, NPN open collector output that is rated to sink 10mA maximum. Therefore, the value
of the pull up resistor should be chosen high enough to limit the current to be less than 10mA.
CS PIN
In normal operation, the current limit threshold voltage for the CS pin is 100mV typical. In case of a fault
condition, the voltage to this pin should be limited to below 5V.
TYPICAL APPLICATION
Figure 9. Low Dropout, Constant Current/Constant Voltage Li-ion Battery Charger
The low dropout linear charger shown in Figure 9 provides constant current and constant voltage charging of 1-
cell lithium-ion battery packs. J1 and J2 are used for selecting the operation of the low-voltage detection. The
LM3622 initializes the charge cycle based on the battery voltage and the enable status of the low-voltage
detection.
When the low-voltage detection is disabled, the LM3622 starts the charge cycle constant current mode if the
battery voltage is below the controller's regulation level. In constant current mode, the LM3622 modulates the
base drive of Q2 to regulate a constant 100mV across the current sense resistor R1, thus generating charge
current of
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM3622
LM3622
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
I-charge = 0.1V/R1
which is equal to 0.5A in this case.
Once the battery voltage reaches the target regulation level set by the LM3622, Q2 is controlled to regulate the
voltage across the battery, and the constant voltage mode of the charging cycle starts. Once the charger is in the
constant voltage mode, the charger maintains a regulated voltage across the battery and the charging current is
dependent on the state of the charge of the battery. As the cell approaches a fully charged condition, the charge
current falls to a very low value.
When the low-voltage detection is enabled and the initial battery voltage is below the low-voltage threshold, the
LM3622 turns Q2 off and forces the LV pin low to drive Q1 on to start a wake up charge phase. Q1 in
conjunction with R2 provides a low current source to recondition the battery. During the wake up charge mode,
Q1 is driven into saturation and the wake up charge current is programmed by R2,
I-charge (wake) = (VIN – VCE1 – VD1 – LVth)/R2
where VIN is the input supply voltage, VCE1 is the collector-emitter on state voltage of Q1, VD1 is the diode
forward voltage of D1, and LVth is the low-voltage threshold level set by switch J2.
Once the battery voltage reaches the low-voltage threshold, the LV pin transitions to a high-impedance state to
end the wake up charge phase, and the EXT pin resumes the base drive of Q2 to start the constant current
mode. The charging cycle is completed in constant voltage mode when the battery is fully charged. Figure 10
shows the timing diagram of the charge cycle with the low-voltage detection enabled.
D1 is a general-purpose silicon diode used for isolating the battery from the charger circuitry that could discharge
the battery when the input source is removed. Changing D1 to a Schottky diode will reduce the overall dropout
voltage of the circuit, but the penalty is higher leakage current associated with Schottky diodes.
TIMING DIAGRAM
Figure 10. Typical Charge Cycle with Low-Voltage Detection Enabled.
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM3622
LM3622
www.ti.com
SNVS043B –FEBRUARY 2000–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision A (April 2013) to Revision B
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
Copyright © 2000–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM3622
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2013
PACKAGING INFORMATION
Orderable Device
LM3622MX-8.2
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-20 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SOIC
SOIC
D
8
8
TBD
Call TI
CU SN
Call TI
3622
M-8.2
LM3622MX-8.2/NOPB
ACTIVE
D
2500
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-20 to 85
3622
M-8.2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM3622MX-8.2/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
LM3622MX-8.2/NOPB
D
8
2500
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明