LM384 [TI]
5W 单声道、12V 至 26V 电源电压、模拟输入 AB 类音频放大器;
| 型号： | LM384 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5W 单声道、12V 至 26V 电源电压、模拟输入 AB 类音频放大器 放大器 消费电路 音频放大器 视频放大器 |
| 文件： | 总11页 (文件大小：356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM384
www.ti.com
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
LM384 5W Audio Power Amplifier
Check for Samples: LM384
1
FEATURES
DESCRIPTION
The LM384 is a power audio amplifier for consumer
applications. In order to hold system cost to a
minimum, gain is internally fixed at 34 dB. A unique
input stage allows ground referenced input signals.
The output automatically self-centers to one-half the
supply voltage.
2
•
•
•
•
•
•
•
•
Wide Supply Voltage Range: 12V to 26V
Low Quiescent Power Drain
Voltage Gain Fixed at 50
High Peak Current Capability: 1.3A
Input Referenced to GND
The output is short-circuit proof with internal thermal
limiting. The package outline is standard dual-in-line.
A copper lead frame is used with the center three
pins on either side comprising a heat sink. This
makes the device easy to use in standard p-c layout.
High Input Impedance: 150kΩ
Low Distortion: 0.25% (PO=4W, RL=8Ω)
Quiescent Output Voltage is at One Half of the
Supply Voltage
•
14-Pin PDIP Package
Uses include simple phonograph amplifiers,
intercoms, line drivers, teaching machine outputs,
alarms, ultrasonic drivers, TV sound systems, AM-FM
radio and sound projector systems. See SNAA086 for
circuit details.
Schematic Diagram
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2013, Texas Instruments Incorporated
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
28V
1.3A
Peak Current
Power Dissipation(3)(4)
1.67W
Input Voltage
±0.5V
Storage Temperature
Operating Temperature
Lead Temperature (Soldering, 10 sec.)
Thermal Resistance
−65°C to +150°C
0°C to +70°C
260°C
θJC
θJA
30°C/W
79°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum junction temperature of the LM384 is 150°C.
(4) The package is to be derated at 15°C/W junction to heat sink pins.
Electrical Characteristics(1)
Symbol
Parameter
Conditions
Min
Typ
150
100
50
Max
Units
kΩ
nA
V/V
W
ZIN
IBIAS
AV
POUT
IQ
Input Resistance
Bias Current
Gain
Inputs Floating
40
5
60
25
Output Power
THD = 10%, RL = 8Ω
POUT = 2W, RL = 8Ω
5.5
8.5
11
Quiescent Supply Current
Quiescent Output Voltage
Bandwidth
mA
V
VOUT Q
BW
450
kHz
V
V+
Supply Voltage
12
26
ISC
Short Circuit Current(2)
Power Supply Rejection Ratio(3)
Total Harmonic Distortion
1.3
31
A
PSRRRTO
THD
dB
%
POUT = 4W, RL = 8Ω
0.25
1.0
(1) V+ = 22V and TA = 25°C operating with a Staver V7 heat sink for 30 seconds.
(2) Output is fully protected against a shorted speaker condition at all voltages up to 22V.
(3) Rejection ratio referred to the output with CBYPASS = 5 μF, freq = 120 Hz.
2
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM384
LM384
www.ti.com
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
Heat Sink Dimensions
Staver Company
41 Saxon Ave.
P.O. Drawer H
Bay Shore, N.Y.
Tel: (516) 666-8000
Figure 1. Staver “V7” Heat Sink
Copyright © 1995–2013, Texas Instruments Incorporated
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3
Product Folder Links: LM384
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
Device Dissipation vs Ambient Temperature
Thermal Resistance vs Square Inches
Figure 2.
Figure 3.
Supply Decoupling vs Frequency
Total Harmonic Distortion vs Output Power
Figure 4.
Figure 5.
Output Voltage Gain vs Frequency
Total Harmonic Distortion vs Frequency
Figure 6.
Figure 7.
4
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM384
LM384
www.ti.com
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Power Supply Current vs Supply Voltage
Device Dissipation vs Output Power—16Ω Load
Figure 8.
Figure 9.
Device Dissipation vs Output Power—8Ω Load
Device Dissipation vs Output Power—4Ω Load
Figure 10.
Figure 11.
Copyright © 1995–2013, Texas Instruments Incorporated
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5
Product Folder Links: LM384
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
www.ti.com
Block and Connection Diagrams
Note: Heatsink Pins
Figure 12. 14-Pin PDIP (Top View)
See NFF0014A Package
Typical Applications
Figure 13. Typical 5W Amplifier
6
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM384
LM384
www.ti.com
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
Figure 14. Bridge Amplifier
*For stability with high current loads
Figure 15. Intercom
Figure 16. Phase Shift Oscillator
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM384
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM384
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM384N
ACTIVE
PDIP
PDIP
NFF
14
14
25
TBD
Call TI
SN
Call TI
0 to 70
0 to 70
LM384N
LM384N
LM384N/NOPB
ACTIVE
NFF
25
Pb-Free (RoHS
Exempt)
Level-1-NA-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
NFF0014A
N14A (Rev G)
www.ti.com
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