LM4140CCMX-2.5/NOPB [TI]
High Precision Low Noise Low Dropout Voltage Reference;
| 型号： | LM4140CCMX-2.5/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High Precision Low Noise Low Dropout Voltage Reference 光电二极管 |
| 文件： | 总23页 (文件大小：1286K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM4140
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SNVS053E –JUNE 2000–REVISED APRIL 2013
LM4140 High Precision Low Noise Low Dropout Voltage Reference
Check for Samples: LM4140
1
FEATURES
DESCRIPTION
The LM4140 series of precision references are
designed to combine high accuracy, low drift and
noise with low power dissipation in a small package.
2
•
•
•
High Initial Accuracy: 0.1%
Ultra Low Noise
Low Temperature Coefficient: 3 ppm/°C (A
grade)
The LM4140 is the industry's first reference with
output voltage options lower than the bandgap
voltage.
•
•
•
Low Voltage Operation: 1.8V
Low Dropout Voltage: 20 mV (typ) @ 1mA
Supply Current: 230 μA (typ), ≤ 1 μA Disable
Mode
The key to the advance performance of the LM4140
is the use of EEPROM registers and CMOS DACs for
temperature coefficient curvature correction and
trimming of the output voltage accuracy of the device
during the final production testing.
•
•
Enable Pin
Output Voltage Options: 1.024V, 1.250V,
2.048V, 2.500V, and 4.096V
The major advantage of this method is the much
higher resolution available with DACs than is
available economically with most methods utilized by
other bandgap references.
•
•
Custom Voltages from 0.5V to 4.5V
Temperature Range (0°C to 70°C)
APPLICATIONS SUMMARY
The low input and dropout voltage, low supply current
and output drive capability of the LM4140 makes this
product an ideal choice for battery powered and
portable applications.
•
•
•
•
•
•
•
•
•
Portable, Battery Powered Equipment
Instrumentation and Test Equipment
Automotive
The LM4140 is available in three grades (A, B, C)
with 0.1% initial accuracy and 3, 6 and 10 ppm/°C
temperature coefficients. For even lower Tempco,
contact Texas Instruments.
Industrial Process Control
Data Acquisition Systems
Medical Equipment
Precision Scales
The device performance is specified over the
temperature range (0°C to +70°C) and is available in
compact 8-pin package.
Servo Systems
Battery Charging
For other output voltage options from 0.5V to
4.5V, contact Texas Instruments.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM4140
SNVS053E –JUNE 2000–REVISED APRIL 2013
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Typical Application
COUT, Output bypass capacitor. See text for selection detail.
Figure 1.
Figure 2. Typical Temperature Coefficient
(Sample of 5 Parts)
Connection Diagram
Figure 3. 8-Lead Surface Mount
Package Number D0008A
Top View
PIN DESCRIPTIONS
Vref (Pin 6):
Reference Output. Capable of sourcing up to 8mA.
Input (Pin 2):
Positive Supply.
Ground (Pins 1, 4, 7, 8):
Enable (Pin 3):
NC (Pin 5):
Negative Supply or Ground Connection. These pins must be connected to ground.
Pulled to input for normal operation. Forcing this pin to ground will turn-off the output.
This pin must be left open.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Maximum Voltage on any Input pin
−0.3V to 5.6V
Indefinite
Output Short-Circuit Duration
(3)
Power Dissipation (TA = 25°C)
345mW
(4)
ESD Susceptibility
Human Body Model
Machine Model
2 kV
200V
Lead Temperature:
Soldering, (10 sec.)
+260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by TJMAX
(maximum junction temperature), θJ-A (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power
dissipation at any temperature is: PDissMAX = (TJMAX − TA)/θJ-A up to the value listed in the Absolute Maximum Ratings. The θJ-A for the
SO-8 package is 160°C/W.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
(1)
Operating Range
Storage Temperature Range
Ambient Temperature Range
Junction Temperature Range
−65°C to +150°C
0°C to 70°C
0°C to 80°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions.
LM4140
Electrical Charateristics
Unless otherwise specified, VIN = 3.0V for the LM4140-1.024 and LM4140-1.250, VIN = 5.0V for all other voltage options, VEN
= VIN. COUT = 1μF (1), ILOAD = 1mA, TA = TJ = 25°C. Limits with standard typeface are for TA = 25°C, and limits in boldface
type apply over 0°C to 70°C temperature range.
Min
Typ
Max
Symbol
Parameter
Conditions
Units
(2)
(3)
(2)
Output Voltage Initial Accuracy
(4)
LM4140B-1.024
LM4140B-1.250
LM4140B-2.048
LM4140B-2.500
LM4140B-4.096
±0.1
±0.1
VREF
%
LM4140C-1.024
LM4140C-1.250
LM4140C-2.048
LM4140C-2.500
LM4140C-4.096
(1) For proper operation, a 1μF capacitor is required between the output pin and the GND pin of the device. (See Application Hints for
details)
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical
Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
(3) Typical numbers are at 25°C and represent the most likely parametric norm.
(4) High temperature and mechanical stress associated with PCB assembly can have significant impact on the initial accuracy of the
LM4140 and may create significant shifts in VREF. See Application Hints section regarding accuracy and PCB layout consideration.
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LM4140
Electrical Charateristics (continued)
Unless otherwise specified, VIN = 3.0V for the LM4140-1.024 and LM4140-1.250, VIN = 5.0V for all other voltage options, VEN
= VIN. COUT = 1μF (1), ILOAD = 1mA, TA = TJ = 25°C. Limits with standard typeface are for TA = 25°C, and limits in boldface
type apply over 0°C to 70°C temperature range.
Min
Typ
Max
Symbol
Parameter
Conditions
Units
(2)
(3)
(2)
TCVREF/°C
Temperature Coefficient:
A Grade
B Grade
0°C ≤ TA ≤ + 70°C
ppm/°C
3
6
10
C Grade
Line Regulation
1.024V and 1.250V options
1.8V ≤ VIN ≤ 5.5V
50
20
300
ΔVREF/ΔVIN
ppm/V
350
All other voltage options
Vref + 200mV ≤ VIN ≤ 5.5V
1 mA ≤ ILOAD ≤ 8mA
200
250
Load Regulation
All other voltage options
1
5
20
150
35
ΔVREF/ΔILOAD
ppm/mA
4.096V Option
150
ΔVREF
ΔVREF
Long-Term Stability
1000 Hrs
60
20
ppm
ppm
V
(5)
Thermal Hysteresis
0°C ≤ TA ≤ + 70°C
IL = 1 mA to 8 mA
Operating
Voltage
LM4140-1.024, LM4140-1.250
1.8
5.5
(6)
Dropout Voltage
IL = 1 mA
IL = 8 mA
IL = 1 mA
IL = 8 mA
20
160
20
40
45
LM4140-2.048, LM4140-2.500
235
400
VIN-VREF
mV
LM4140-4.096
40
45
195
2.2
270
490
(7)
VN
Output Noise Voltage
0.1 Hz to 10 Hz
ILOAD = 0 mA
μVPP
IS(ON)
Supply Current
All other voltage options
230
265
.01
2
320
375
350
400
1
μA
4.096V Option
IS(OFF)
VH
IH
Supply Current
VEnable < 0.4V
μA
V
Logic High Input Voltage
Logic High Input Current
Logic Low Input Voltage
Logic Low Input Current
Short Circuit Current
0.8VIN
nA
V
VL
0.4
IL
1
nA
mA
ISC
8.5
20
35
40
(5) Thermal hysteresis is defined as the changes in +25°C output voltage before and after the cycling of the device from 0°C to 70°C.
(6) Dropout voltage is defined as the minimum input to output differential voltage at which the output voltage drops by 0.5% below the value
measured with VIN = 3.0V for the LM4140-1.024 and LM4140-1.250, VIN = 5.0V for all other voltage options.
(7) The output noise is based on 1.024V option. Output noise is linearly proportional to VREF
.
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LM4140 Typical Performance Characteristics
Unless otherwise specified, TA = 25°C, No Load, COUT = 1μF, VIN = 3.0V for LM4140-1.024 and LM4140-1.250, and 5V for all
other voltage options. VIN = VEN
.
Power Up/Down Ground Current
Enable Response
Figure 4.
Figure 5.
* The 1μF output capacitor is actively discharged to ground. See ON/OFF OPERATION section for more details.
Line Transient Response
Load Transient Response
Figure 6.
Figure 7.
Output Impedance
Power Supply Rejection Ratio
Figure 8.
Figure 9.
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LM4140 Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C, No Load, COUT = 1μF, VIN = 3.0V for LM4140-1.024 and LM4140-1.250, and 5V for all
other voltage options. VIN = VEN
.
Dropout Voltage
Output Voltage Change
vs
vs
Load Current
Sink Current (ISINK)
Note: 1.024V and 1.250V options require 1.8V supply.
Figure 10.
Figure 11.
Total Current (IS(OFF)
vs
)
Total Current (IS(ON)
vs
Supply Voltage
)
Supply Voltage
Figure 12.
Figure 13.
Spectral Noise Density (0.1Hz to 10Hz)
Spectral Noise Density (10Hz to 100kHz)
Figure 14.
Figure 15.
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LM4140 Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C, No Load, COUT = 1μF, VIN = 3.0V for LM4140-1.024 and LM4140-1.250, and 5V for all
other voltage options. VIN = VEN
.
Ground Current
vs
Load Current
Long Term Drift
Figure 16.
Figure 17.
Load Regulation
vs
Temperature
Output Voltage
vs
Load Current
Figure 18.
Figure 19.
Line Regulation
vs
Temperature
IQ
vs
Temperature
Figure 20.
Figure 21.
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LM4140 Typical Performance Characteristics (continued)
Unless otherwise specified, TA = 25°C, No Load, COUT = 1μF, VIN = 3.0V for LM4140-1.024 and LM4140-1.250, and 5V for all
other voltage options. VIN = VEN
.
Short Circuit Current
vs
Dropout Voltage
vs
Load Current (VOUT) = 2.0V
Temperature
Figure 22.
Figure 23.
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APPLICATION HINTS
INPUT CAPACITORS
Although not always required, an input capacitor is recommended. A supply bypass capacitor on the input
assures that the reference is working from a source with low impedance, which improves stability. A bypass
capacitor can also improve transient response by providing a reservoir of stored energy that the reference can
utilize in case where the load current demand suddenly increases. The value used for CIN may be used without
limit. Refer to the Typical Application section for examples of input capacitors.
OUTPUT CAPACITORS
The LM4140 requires a 1μF (nominally) output capacitor for loop stability (compensation) as well as transient
response. During the sudden changes in load current demand, the output capacitor must source or sink current
during the time it takes the control loop of the LM4140 to respond.
This capacitor must be selected to meet the requirements of minimum capacitance and equivalent series
resistance (ESR) range.
In general, the capacitor value must be at least 0.2μF (over the actual ambient operating temperature), and the
ESR must be within the range indicated in Figure 24, Figure 25 and Figure 26.
Figure 24. 0.22 μF ESR Range
Figure 25. 1 μF ESR Range
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Figure 26. 10 μF ESR Range
TANTALUM CAPACITORS
Surface-mountable solid tantalum capacitors offer a good combination of small physical size for the capacitance
value, and ESR in the range needed for by the LM4140. The results of testing the LM4140 stability with surface
mount solid tantalum capacitors show good stability with values in the range of 0.1μF. However, optimum
performance is achieved with a 1μF capacitor.
Tantalum capacitors that have been verified as suitable for use with the LM4140 are shown in Table 1.
Table 1. Surface-Mount Tantalum Capacitor Selection Guide
1μF Surface-Mount Tantalums
Manufacturer
Kemet
Part Number
T491A105M010AS
NRU105N10
NEC
Siemens
Nichicon
Sprague
B45196-E3105-K
F931C105MA
293D105X0016A2T
2.2μF Surface-Mount Tantalums
Kemet
NEC
T491A225M010AS
NRU225M06
Siemens
Nichicon
Sprague
B45196/2.2/10/10
F930J225MA
293D225X0010A2T
ALUMINUM ELECTROLYTIC CAPACITORS
Although probably not a good choice for a production design, because of relatively large physical size, an
aluminium electrolytic capacitor can be used in the design prototype for an LM4140 reference. A 1μF capacitor
meeting the ESR conditions can be used. If the operating temperature drops below 0°C, the reference may not
remain stable, as the ESR of the aluminium electrolytic capacitor will increase, and may exceed the limits
indicated in the figures.
MULTILAYER CERAMIC CAPACITORS
Surface-mountable multilayer ceramic capacitors may be an attractive choice because of their relatively small
physical size and excellent RF characteristics.
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However, they sometimes have an ESR values lower than the minimum required by the LM4140, and relatively
large capacitance change with temperature. The manufacturer's datasheet for the capacitor should be consulted
before selecting a value. Test results of LM4140 stability using multilayer ceramic capacitors show that a
minimum of 0.2μF is usually needed.
Multilayer ceramic capacitors that have been verified as suitable for use with the LM4140 are shown in Table 2.
Table 2. Surface-Mount Ceramic Capacitors Selection Guide
2.2μF Surface-Mount Ceramic
Manufacturer
Tokin
Part Number
1E225ZY5U-C203
GRM42-6Y5V225Z16
Murata
4.7μF Surface-Mount Ceramic
Tokin
1E475ZY5U-C304
REVERSE CURRENT PATH
The P-channel Pass transistor used in the LM4140 has an inherent diode connected between the VIN and VREF
pins (see diagram below).
Forcing the output to voltages higher than the input, or pulling VIN below voltage stored on the output capacitor
by more than a Vbe, will forward bias this diode and current will flow from the VREF terminal to VIN. No damage to
the LM4140 will occur under these conditions as long as the current flowing into the output pin does not exceed
50mA.
ON/OFF OPERATION
The LM4140 is designed to quickly reduce both VREF and IQ to zero when turned-off. VREF is restored in less than
200μs when turned-on. During the turn-off, the charge across the output capacitor is discharged to ground
through internal circuitry.
The LM4140 is turned-off by pulling the enable input low, and turned-on by driving the input high. If this feature is
not to be used, the enable pin should be tied to the VIN to keep the reference on at all times (the enable pin must
not be left floating).
To ensure proper operation, the signal source used to drive the enable pin must be able to swing above and
below the specified high and low voltage thresholds which ensure an ON or OFF state (see LM4140
Electrical Charateristics).
The ON/OFF signal may come from either a totem-pole output, or an open-collector output with pull-up resistor to
the LM4140 input voltage. This high-level voltage may exceed the LM4140 input voltage, but must remain within
the Absolute Maximum Rating for the enable pin.
OUTPUT ACCURACY
Like all references, either series or shunt, the after assembly accuracy is made up of primarily three components:
initial accuracy itself, thermal hysteresis and effects of the PCB assembly stress.
LM4140 provides an excellent output initial accuracy of 0.1% and temperature coefficient of 6ppm/°C (B Grade).
For best accuracy and precision, the LM4140 junction temperature should not exceed 70°C.
The thermal hysteresis curve on this datasheet are performance characteristics of three typical parts selected at
random from a sample of 40 parts.
Parts are mounted in a socket to minimize the effect of PCB's mechnical expansion and contraction. Readings
are taken at 25°C following multiple temperature cycles to 0°C and 70°C. The labels on the X axis of the graph
indicates the device temperature cycle prior to measurement at 25°C.
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Figure 27. Typical Thermal Hysteresis
The mechanical stress due to the PCB's mechanical and thermal stress can cause an output voltage shift more
than the true thermal coefficient of the device. References in surface mount packages are more susceptible to
these stresses because of the small amount of plastic molding which support the leads.
Following the recommendations on PCB LAYOUT CONSIDERATION section can minimize the mechanical
stress on the device.
PCB LAYOUT CONSIDERATION
The simplest ways to reduce the stress related shifts are:
1. Mounting the device near the edges or the corners of the board where mechanical stress is at its minimum.
The center of the board generally has the highest mechanical and thermal expansion stress.
2. Mechanical isolation of the device by creating an island by cutting a U shape slot on the PCB for mounting
the device. This approach would also provide some thermal isolation from the rest of the circuit.
Figure 28 is a recommended printed board layout with a slot cut on three sides of the circuit layout to serve as a
strain relief.
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Figure 28. Suggested PCB Layout with Slot
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Typical Application Circuits
Figure 29. Boosted Output Current
Figure 30. Boosted Ouput Current with Current
Limiter
* Low Noise Op Amp such as OP-27
Figure 31. Complimentary Outputs
Figure 32. Voltage Reference with Force and Sense
Output
Figure 33. Precision Programmable Current Source
Figure 34. Precision DAC Reference
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Figure 35. Strain Gauge Conditioner for 350Ω Bridge
Figure 36.
Figure 37.
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 15
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
LM4140ACM-1.0/NOPB
LM4140ACM-1.2
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
95
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
4140A
CM1.0
LIFEBUY
ACTIVE
LIFEBUY
ACTIVE
LIFEBUY
ACTIVE
LIFEBUY
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
95
95
TBD
Call TI
4140A
CM1.2
LM4140ACM-1.2/NOPB
LM4140ACM-2.0
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
4140A
CM1.2
95
TBD
4140A
CM2.0
LM4140ACM-2.0/NOPB
LM4140ACM-2.5
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
4140A
CM2.0
95
TBD
4140A
CM2.5
LM4140ACM-2.5/NOPB
LM4140ACM-4.1
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
4140A
CM2.5
95
TBD
4140A
CM4.1
LM4140ACM-4.1/NOPB
LM4140ACMX-2.5/NOPB
LM4140ACMX-4.1/NOPB
LM4140BCM-1.0/NOPB
LM4140BCM-1.2/NOPB
LM4140BCM-2.0/NOPB
LM4140BCM-2.5/NOPB
LM4140BCM-4.1/NOPB
LM4140BCMX-1.0/NOPB
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
4140A
CM4.1
2500
2500
95
Green (RoHS
& no Sb/Br)
4140A
CM2.5
Green (RoHS
& no Sb/Br)
4140A
CM4.1
Green (RoHS
& no Sb/Br)
4140B
CM1.0
95
Green (RoHS
& no Sb/Br)
4140B
CM1.2
95
Green (RoHS
& no Sb/Br)
4140B
CM2.0
95
Green (RoHS
& no Sb/Br)
4140B
CM2.5
95
Green (RoHS
& no Sb/Br)
4140B
CM4.1
2500
Green (RoHS
& no Sb/Br)
4140B
CM1.0
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM4140BCMX-2.5/NOPB
LM4140BCMX-4.1/NOPB
LM4140CCM-1.0/NOPB
LM4140CCM-1.2/NOPB
LM4140CCM-2.0/NOPB
LM4140CCM-2.5
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
4140B
CM2.5
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LIFEBUY
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
D
D
D
D
D
D
2500
95
Green (RoHS
& no Sb/Br)
4140B
CM4.1
Green (RoHS
& no Sb/Br)
4140C
CM1.0
95
Green (RoHS
& no Sb/Br)
4140C
CM1.2
95
Green (RoHS
& no Sb/Br)
4140C
CM2.0
95
TBD
4140C
CM2.5
LM4140CCM-2.5/NOPB
LM4140CCM-4.1/NOPB
LM4140CCMX-1.0/NOPB
LM4140CCMX-1.2/NOPB
LM4140CCMX-2.5/NOPB
LM4140CCMX-4.1/NOPB
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
4140C
CM2.5
95
Green (RoHS
& no Sb/Br)
4140C
CM4.1
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
4140C
CM1.0
Green (RoHS
& no Sb/Br)
4140C
CM1.2
Green (RoHS
& no Sb/Br)
4140C
CM2.5
Green (RoHS
& no Sb/Br)
4140C
CM4.1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4140ACMX-2.5/NOPB SOIC
LM4140ACMX-4.1/NOPB SOIC
LM4140BCMX-1.0/NOPB SOIC
LM4140BCMX-2.5/NOPB SOIC
LM4140BCMX-4.1/NOPB SOIC
LM4140CCMX-1.0/NOPB SOIC
LM4140CCMX-1.2/NOPB SOIC
LM4140CCMX-2.5/NOPB SOIC
LM4140CCMX-4.1/NOPB SOIC
D
D
D
D
D
D
D
D
D
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
5.4
5.4
5.4
5.4
5.4
5.4
5.4
5.4
5.4
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM4140ACMX-2.5/NOPB
LM4140ACMX-4.1/NOPB
LM4140BCMX-1.0/NOPB
LM4140BCMX-2.5/NOPB
LM4140BCMX-4.1/NOPB
LM4140CCMX-1.0/NOPB
LM4140CCMX-1.2/NOPB
LM4140CCMX-2.5/NOPB
LM4140CCMX-4.1/NOPB
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
D
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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相关型号：
LM4140CCMX-4.1/NOPB
IC 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 4.096 V, PDSO8, SOIC-8, Voltage Reference
NSC
LM422-100.00M
LVDS Output Clock Oscillator, 100MHz Nom, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-6
CONNOR-WINFIE
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