LM4880MX/NOPB [TI]
Dual 250 mW Audio Power Amplifier with Shutdown Mode; 具有关断功能双模双250兆瓦的音频功率放大器
| 型号： | LM4880MX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Dual 250 mW Audio Power Amplifier with Shutdown Mode |
| 文件： | 总20页 (文件大小：1096K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
LM4880
Dual 250 mW Audio Power Amplifier with
Shutdown Mode
Check for Samples: LM4880
1
FEATURES
DESCRIPTION
The LM4880 is a dual audio power amplifier capable
of delivering typically 250mW per channel of
continuous average power to an 8Ω load with 0.1%
THD+N using a 5V power supply.
2
•
No Bootstrap Capacitors or Snubber Circuits
are Necessary
•
•
•
Small Outline (SOIC) and PDIP Packaging
Unity-Gain Stable
Boomer audio power amplifiers were designed
specifically to provide high quality output power with a
minimal amount of external components using
surface mount packaging.
External Gain Configuration Capability
APPLICATIONS
•
•
•
Headphone Amplifier
Personal Computers
CD-ROM Players
Since the LM4880 does not require bootstrap
capacitors or snubber networks, it is optimally suited
for low-power portable systems.
The LM4880 features an externally controlled, low-
power consumption shutdown mode, as well as an
internal thermal shutdown protection mechanism.
KEY SPECIFICATIONS
•
•
•
THD+N at 1kHz at 200mW Continuous Average
Output Power into 8Ω: 0.1% (max)
The unity-gain stable LM4880 can be configured by
external gain-setting resistors.
THD+N at 1kHz at 85mW Continuous Average
Output Power into 32Ω: 0.1% (typ)
Output Power at 10% THD+N at 1kHz into 8Ω
325 mW (typ)
•
•
Shutdown Current 0.7 µA (typ)
2.7V to 5.5V Supply Voltage Range
Connection Diagram
Figure 1. Small Outline and PDIP Packages- Top View
See Package Number D0008A for SOIC
or Package Number P0008E for PDIP
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2013, Texas Instruments Incorporated
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
Typical Application
*Refer to Application Information for information concerning proper selection of the input and output coupling
capacitors.
Figure 2. Typical Audio Amplifier Application Circuit
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage
Storage Temperature
Input Voltage
6.0V
−65°C to +150°C
−0.3V to VDD + 0.3V
Internally limited
2000V
(3)
Power Dissipation
(4)
ESD Susceptibility
(5)
ESD Susceptibility
200V
Junction Temperature
Soldering Information
150°C
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
θJC (PDIP)
215°C
220°C
Thermal Resistance
37°C/W
θJA (PDIP)
107°C/W
θJC (SOIC)
35°C/W
θJA (SOIC)
170°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under
particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings.
Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device
performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX − TA)/θJA or the number given in the Absolute Maximum Ratings,
whichever is lower. For the LM4880, TJMAX = 150°C, and the typical junction-to-ambient thermal resistance is 170°C/W for package
D0008A and 107°C/W for package P0008E.
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(5) Machine model, 220 pF–240 pF discharged through all pins.
2
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
Operating Ratings
Temperature Range
Supply Voltage
TMIN≤TA≤TMAX
−40°C≤TA≤+85°C
2.7V≤VDD≤5.5V
(1)(2)
Electrical Characteristics
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA = 25°C.
Symbol
Parameter
Conditions
LM4880
Units
(Limits)
Typical
Limit
(3)
(4)
VDD
Supply Voltage
2.7
5.5
6.0
5
V (min)
V (max)
IDD
ISD
VOS
PO
Quiescent Power Supply Current
Shutdown Current
VIN=0V, IO=0A
VPIN5=VDD
VIN=0V
3.6
0.7
5
mA (max)
μA (max)
mV (max)
Output Offset Voltage
Output Power
50
THD=0.1% (max); f=1 kHz;
RL=8Ω
250
85
200
mW (min)
mW
RL=32Ω
THD+N=10%; f=1 kHz
RL=8Ω
325
110
mW
mW
%
RL=32Ω
THD+N
PSRR
Total Harmonic Distortion+Noise
Power Supply Rejection Ratio
RL=8Ω, PO=200 mW;
RL=32Ω, PO=75 mW;
f=1 kHz
0.03
0.02
%
CB = 1.0 μF,
50
dB
VRIPPLE=200 mVrms, f = 100 Hz
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under
particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings.
Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device
performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Automatic Shutdown Circuit
Figure 3. Automatic Shutdown Circuit
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM4880
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
Automatic Switching Circuit
Figure 4. Automatic Switching Circuit
External Components Description
(Figure 2)
Components
Functional Description
1.
2.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a high
pass filter with Ci at fc = 1/(2πRiCi).
Ci
Input coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a high pass
filter with Ri at fc = 1/(2πRiCi). Refer to PROPER SELECTION OF EXTERNAL COMPONENTS for an explanation
of how to determine the value of Ci.
3.
4.
RF
CS
Feedback resistance which sets closed-loop gain in conjunction with Ri.
Supply bypass capacitor which provides power supply filtering. Refer to Application Information for proper
placement and selection of the supply bypass capacitor.
5.
6.
CB
Co
Bypass pin capacitor which provides half-supply filtering. Refer to PROPER SELECTION OF EXTERNAL
COMPONENTS for information concerning proper placement and selection of CB.
Output coupling capacitor which blocks the DC voltage at the amplifier's output. Forms a high pass filter with RL at
fo = 1/(2πRLCo).
4
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
Typical Performance Characteristics
THD + N
vs
Output Power
THD + N
vs
Output Power
Figure 5.
Figure 6.
THD + N
vs
Output Power
THD + N
vs
Output Power
Figure 7.
Figure 8.
THD + N
vs
Output Power
THD + N
vs
Output Power
Figure 9.
Figure 10.
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM4880
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
THD + N
vs
Frequency
THD + N
vs
Frequency
Figure 11.
Figure 12.
THD + N
vs
Frequency
THD + N
vs
Frequency
Figure 13.
Figure 14.
Output Power vs
Load Resistance
Output Power vs
Load Resistance
Figure 15.
Figure 16.
6
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
Typical Performance Characteristics (continued)
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
Figure 17.
Figure 18.
Output Power vs
Supply Voltage
Clipping Voltage vs
Supply Voltage
Figure 19.
Figure 20.
Clipping Voltage vs
Supply Voltage
Power Dissipation vs
Output Power
Figure 21.
Figure 22.
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM4880
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
Output Attenuation in
Shutdown Mode
Channel Separation
Figure 23.
Figure 24.
Power Supply
Rejection Ratio
Noise Floor
Figure 25.
Figure 26.
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
Figure 27.
Figure 28.
8
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
Typical Performance Characteristics (continued)
Frequency Response vs
Output Capacitor Size
Frequency Response vs
Output Capacitor Size
Figure 29.
Figure 30.
Frequency Response vs
Input Capacitor Size
Typical Application
Frequency Response
Figure 31.
Figure 32.
Typical Application
Frequency Response
Power Derating Curve
Figure 33.
Figure 34.
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM4880
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
APPLICATION INFORMATION
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4880 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. This shutdown feature turns the amplifier off when a logic high is placed on the
shutdown pin. The trigger point between a logic low and logic high level is typically half supply. It is best to switch
between ground and the supply to provide maximum device performance. By switching the shutdown pin to VDD
,
the LM4880 supply current draw will be minimized in idle mode. While the device will be disabled with shutdown
pin voltages less than VDD, the idle current may be greater than the typical value of 0.7 μA. In either case, the
shutdown pin should be tied to a definite voltage because leaving the pin floating may result in an unwanted
shutdown condition.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which
provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in
conjunction with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground
and enables the amplifier. If the switch is open, then the external pull-up resistor will disable the LM4880. This
scheme ensures that the shutdown pin will not float which will prevent unwanted state changes.
POWER DISSIPATION
Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to
ensure a successful design. Equation 1 states the maximum power dissipation point for a single-ended amplifier
operating at a given supply voltage and driving a specified output load.
PDMAX = (VDD)2/(2π2RL)
(1)
Since the LM4880 has two operational amplifiers in one package, the maximum internal power dissipation point
is twice that of the number which results from Equation 1. Even with the large internal power dissipation, the
LM4880 does not require heat sinking over a large range of ambient temperatures. From Equation 1, assuming a
5V power supply and an 8Ω load, the maximum power dissipation point is 158 mW per amplifier. Thus the
maximum package dissipation point is 317 mW. The maximum power dissipation point obtained must not be
greater than the power dissipation that results from Equation 2:
PDMAX = (TJMAX-TA)/θJA
(2)
For the LM4880 surface mount package, θJA = 170° C/W and TJMAX = 150°C. Depending on the ambient
temperature, TA, of the system surroundings, Equation 2 can be used to find the maximum internal power
dissipation supported by the IC packaging. If the result of Equation 1 is greater than that of Equation 2, then
either the supply voltage must be decreased, the load impedance increased, or the ambient temperature
reduced. For the typical application of a 5V power supply, with an 8Ω load, the maximum ambient temperature
possible without violating the maximum junction temperature is approximately 96°C provided that device
operation is around the maximum power dissipation point. Power dissipation is a function of output power and
thus, if typical operation is not around the maximum power dissipation point, the ambient temperature may be
increased accordingly. Refer to Typical Performance Characteristics for power dissipation information for lower
output powers.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. As displayed in Typical Performance Characteristics, the effect of a larger half supply bypass capacitor
is improved low frequency PSRR due to increased half-supply stability. Typical applications employ a 5V
regulator with 10 μF and a 0.1 μF bypass capacitors which aid in supply stability, but do not eliminate the need
for bypassing the supply nodes of the LM4880. The selection of bypass capacitors, especially CB, is thus
dependant upon desired low frequency PSRR, click and pop performance as explained in PROPER SELECTION
OF EXTERNAL COMPONENTS, system cost, and size constraints.
10
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
AUTOMATIC SHUTDOWN CIRCUIT
As shown in Figure 3, the LM4880 can be set up to automatically shutdown when a load is not connected. This
circuit is based upon a single control pin common in many headphone jacks. This control pin forms a normally
closed switch with one of the output pins. The output of this circuit (the voltage on pin 5 of the LM4880) has two
states based on the state of the switch. When the switch is open, signifying that headphones are inserted, the
LM4880 should be enabled. When the switch is closed, the LM4880 should be off to minimize power
consumption.
The operation of this circuit is rather simple. With the switch closed, Rp and Ro form a resistor divider which
produces a gate voltage of less than 5 mV. This gate voltage keeps the NMOS inverter off and Rsd pulls the
shutdown pin of the LM4880 to the supply voltage. This places the LM4880 in shutdown mode which reduces the
supply current to 0.7 μA typically. When the switch is open, the opposite condition is produced. Resistor Rp pulls
the gate of the NMOS high which turns on the inverter and produces a logic low signal on the shutdown pin of
the LM4880. This state enables the LM4880 and places the amplifier in its normal mode of operation.
This type of circuit is clearly valuable in portable products where battery life is critical, but is also beneficial for
power conscious designs such as “Green PC's”.
AUTOMATIC SWITCHING CIRCUIT
A circuit closely related to Automatic Shutdown Circuit is Automatic Switching Circuit. Automatic Switching Circuit
utilizes both the input and output of the NMOS inverter to toggle the states of two different audio power
amplifiers. The LM4880 is used to drive stereo single ended loads, while the LM4861 drives bridged internal
speakers.
In this application, the LM4880 and LM4861 are never on at the same time. When the switch inside the
headphone jack is open, the LM4880 is enabled and the LM4861 is disabled since the NMOS inverter is on. If a
headphone jack is not present, it is assumed that the internal speakers should be on and thus the voltage on the
LM4861 shutdown pin is low and the voltage at the LM4880 pin is high. This results in the LM4880 being
shutdown and the LM4861 being enabled.
Only one channel of this circuit is shown in Figure 4 to keep the drawing simple but the typical application would
a LM4880 driving a stereo external headphone jack and two LM4861's driving the internal stereo speakers. If
only one internal speaker is required, a single LM4861 can be used as a summer to mix the left and right inputs
into a single mono channel.
PROPER SELECTION OF EXTERNAL COMPONENTS
Selection of external components when using integrated power amplifiers is critical to optimize device and
system performance. While the LM4880 is tolerant of external component combinations, care must be exercised
when choosing component values.
The LM4880 is unity-gain stable which gives a designer maximum system flexibility. The LM4880 should be used
in low gain configurations to minimize THD + N values, and maximize the signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to AUDIO POWER AMPLIFIER DESIGN for
a more complete explanation of proper gain selection.
Besides gain, one of the major design considerations is the closed-loop bandwidth of the amplifier. To a large
extent, the bandwidth is dictated by the choice of external components shown in Figure 2. Both the input
coupling capacitor, Ci, and the output coupling capacitor, Co, form first order high pass filters which limit low
frequency response. These values should be chosen based on needed frequency response for a few distinct
reasons.
Selection of Input and Output Capacitor Size
Large input and output capacitors are both expensive and space hungry for portable designs. Clearly a certain
sized capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the
transducers used in portable systems, whether internal or external, have little ability to reproduce signals below
100 Hz–150 Hz. Thus using large input and output capacitors may not increase system performance.
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM4880
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (normally
1/2 VDD.) This charge comes from the output via the feedback and is apt to create pops upon device enable.
Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be
minimized.
Besides minimizing the input and output capacitor sizes, careful consideration should be paid to the bypass
capacitor size. The bypass capacitor, CB, is the most critical component to minimize turn-on pops since it
determines how fast the LM4880 turns on. The slower the LM4880's outputs ramp to their quiescent DC voltage
(nominally 1/2 VDD), the smaller the turn-on pop. Choosing CB equal to 1.0 μF along with a small value of Ci (in
the range of 0.1 μF to 0.39 μF), should produce a virtually clickless and popless shutdown function. While the
device will function properly, (no oscillations or motorboating), with CB equal to 0.1 μF, the device will be much
more susceptible to turn-on clicks and pops. Thus, a value of CB equal to 1.0 μF or larger is recommended in all
but the most cost sensitive designs.
AUDIO POWER AMPLIFIER DESIGN
Design a Dual 200 mW/8Ω Audio Amplifier
Given:
Power Output: 200 mWrms
Load Impedance: 8Ω
Input Level: 1 Vrms (max)
Input Impedance: 20 kΩ
Bandwidth: 100 Hz–20 kHz ± 0.50 dB
A designer must first determine the needed supply rail to obtain the specified output power. Calculating the
required supply rail involves knowing two parameters, Vopeak and also the dropout voltage. As shown in Typical
Performance Characteristics, the dropout voltage is typically 0.5V. Vopeak can be determined from Equation 3.
(3)
For 200 mW of output power into an 8Ω load, the required Vopeak is 1.79V. Since this is a single supply
application, the minimum supply voltage is twice the sum of Vopeak and Vod. Since 5V is a standard supply
voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates headroom that allows
the LM4880 to reproduce peaks in excess of 200 mW without clipping the signal. At this time, the designer must
make sure that the power supply choice along with the output impedance does not violate the conditions
explained in POWER DISSIPATION. Remember that the maximum power dissipation value from Equation 1
must be multiplied by two since there are two independent amplifiers inside the package.
Once the power dissipation equations have been addressed, the required gain can be determined from
Equation 4.
(4)
AV = −RF/Ri
(5)
From Equation 4, the minimum gain is: AV = −1.26
Since the desired input impedance was 20 kΩ, and with a gain of −1.26, a value of 27 kΩ is designated for Rf,
assuming 5% tolerance resistors. This combination results in a nominal gain of −1.35. The final design step is to
address the bandwidth requirements which must be stated as a pair of −3 dB frequency points. Five times away
from a −3 dB point is 0.17 dB down from passband response assuming a single pole roll-off. As stated in
External Components Description, both Ri in conjunction with Ci, and Co with RL, create first order high pass
filters. Thus to obtain the desired frequency low response of 100 Hz within ± 0.5 dB, both poles must be taken
into consideration. The combination of two single order filters at the same frequency forms a second order
response. This results in a signal which is down 0.34 dB at five times away from the single order filter −3 dB
point. Thus, a frequency of 20 Hz is used in the following equations to ensure that the response if better than 0.5
dB down at 100 Hz.
Ci ≥ 1/(2π*20kΩ*20Hz) = 0.397 μF; use 0.39 μF
12
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
Co ≥ 1/(2π*8Ω*20Hz) = 995 μF; use 1000 μF
The high frequency pole is determined by the product of the desired high frequency pole, fH, and the closed-loop
gain, AV. With a closed-loop gain magnitude of 1.35 and fH = 100 kHz, the resulting GBWP = 135 kHz which is
much smaller than the LM4880 GBWP of 12.5 MHz. This figure displays that if a designer has a need top design
an amplifier with a higher gain, the LM4880 can still be used without running into bandwidth limitations.
LM4880 MDA MWA
DUAL 250 MW AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE
Figure 35. Die Layout (B - Step)
Table 1. Die/Wafer Characteristics
Fabrication Attributes
General Die Information
Physical Die Identification
Die Step
LM4880B
B
Bond Pad Opening Size (min)
86µm x 86µm
ALUMINUM
NITRIDE
Bond Pad Metalization
Passivation
Physical Attributes
Wafer Diameter
150mm
Back Side Metal
Bare Back
GND
Dise Size (Drawn)
952µm x 1283µm
37mils x 51mils
Back Side Connection
Thickness
Min Pitch
254µm Nominal
117µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (B - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
X/Y COORDINATES
PAD SIZE
SIGNAL NAME
PAD# NUMBER
X
Y
X
Y
86
BYPASS
GND
1
2
3
4
5
6
7
-322
-359
-359
-359
-323
-109
8
523
259
5
86
86
86
86
86
86
86
x
x
x
x
x
x
x
188
86
NC
GND
-259
-523
-523
-523
188
86
SHUTDOWN
INPUT B
OUTPUT B
86
86
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LM4880
LM4880
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
www.ti.com
VDD
8
358
358
359
323
8
-78
141
406
523
523
523
86
86
86
86
86
86
x
x
x
x
x
x
188
188
86
GND
9
OUTPUT A
INPUT A
NC
10
11
12
13
86
86
NC
-109
86
14
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM4880
LM4880
www.ti.com
SNAS103C –NOVEMBER 1995–REVISED MAY 2013
REVISION HISTORY
Changes from Revision B (May 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 14
Copyright © 1995–2013, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: LM4880
PACKAGE OPTION ADDENDUM
www.ti.com
2-May-2013
PACKAGING INFORMATION
Orderable Device
LM4880M
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
SOIC
D
8
8
8
95
TBD
Call TI
CU SN
CU SN
Call TI
LM
4880M
LM4880M/NOPB
LM4880MX/NOPB
ACTIVE
ACTIVE
D
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
LM
4880M
2500
Green (RoHS
& no Sb/Br)
-40 to 85
LM
4880M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM4880MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
LM4880MX/NOPB
D
8
2500
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明