LM4893MAX/NOPB [TI]

IC,AUDIO AMPLIFIER,SINGLE,SOP,8PIN,PLASTIC;
LM4893MAX/NOPB
型号: LM4893MAX/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

IC,AUDIO AMPLIFIER,SINGLE,SOP,8PIN,PLASTIC

放大器 光电二极管 商用集成电路
文件: 总22页 (文件大小:701K)
中文:  中文翻译
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August 2004  
LM4893  
1.1 Watt Audio Power Amplifier  
General Description  
Key Specifications  
The LM4893 is an audio power amplifier primarily designed  
for demanding applications in mobile phones and other por-  
table communication device applications. It is capable of  
delivering 1.1 watt of continuous average power to an 8  
BTL load with less than 1% distortion (THD+N) from a 5VDC  
power supply.  
j
j
j
j
Improved PSRR at 5V, 3V, & 217Hz  
62dB (typ)  
1.1W (typ)  
Higher Power Output at 5V & 1% THD  
Higher Power Output at 3V & 1% THD 350mW (typ)  
Shutdown Current 0.1µA (typ)  
Boomer audio power amplifiers were designed specifically to  
provide high quality output power with a minimal amount of  
external components. The LM4893 does not require output  
coupling capacitors or bootstrap capacitors, and therefore is  
ideally suited for lower-power portable applications where  
minimal space and power consumption are primary require-  
ments.  
Features  
n No output coupling capacitors, snubber networks or  
bootstrap capacitors required  
n Unity gain stable  
n Ultra low current shutdown mode  
n Instantaneous turn-on time  
The LM4893 features a low-power consumption global shut-  
down mode, which is achieved by driving the shutdown pin  
with logic low. Additionally, the LM4893 features an internal  
thermal shutdown protection mechanism.  
n BTL output can drive capacitive loads up to 100pF  
n Advanced pop & click circuitry eliminates noises during  
turn-on and turn-off transitions  
n 2.2V - 5.5V operation  
n Available in space-saving µSMD, SO, and MSOP  
packages  
The LM4893 contains advanced pop & click circuitry which  
eliminates noises which would otherwise occur during  
turn-on and turn-off transitions.  
The LM4893 is unity-gain stable and can be configured by  
external gain-setting resistors.  
Applications  
n Mobile Phones  
n PDAs  
n Portable electronic devices  
Typical Application  
20038001  
FIGURE 1. Typical Audio Amplifier Application Circuit  
Boomer® is a registered trademark of National Semiconductor Corporation.  
© 2004 National Semiconductor Corporation  
DS200380  
www.national.com  
Connection Diagrams  
9 Bump micro SMD Marking  
9 Bump micro SMD  
20038087  
Top View  
X - Date Code  
T - Die Traceability  
G - Boomer Family  
93 - LM4893ITL  
20038086  
Top View  
SO Marking  
Order Number LM4893ITL, LM4893ITLX  
See NS Package Number TLA09AAA  
Small Outline (SO) Package  
20038092  
Top View  
XY - Date Code  
TT - Die Traceability  
Bottom 2 lines - Part Number  
20038091  
Top View  
MSOP Marking  
Order Number LM4893MA  
See NS package Number M08A  
Mini Small Outline (MSOP) Package  
20038085  
Top View  
G - Boomer Family  
93 - LM4893MM  
20038084  
Top View  
NC = No Connect  
Order Number LM4893MM  
See NS Package Number MUB10A  
www.national.com  
2
Absolute Maximum Ratings (Note 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
θJA (TLA09AAA)  
θJC (MUB10A)  
θJA (MUB10A)  
θJC (M08A)  
180˚C/W (Note 10)  
56˚C/W  
190˚C/W  
35˚C/W  
Supply Voltage (Note 9)  
Storage Temperature  
Input Voltage  
6.0V  
−65˚C to +150˚C  
−0.3V to VDD +0.3V  
Internally Limited  
2000V  
θJA (M08A)  
150˚C/W  
Operating Ratings  
Temperature Range  
TMIN TA TMAX  
Supply Voltage  
Power Dissipation (Note 3)  
ESD Susceptibility (Note 4)  
ESD Susceptibility (Note 5)  
Junction Temperature  
Thermal Resistance  
−40˚C TA 85˚C  
2.2V VDD 5.5V  
200V  
150˚C  
Electrical Characteristics VDD = 5V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for TA = 25˚C.  
LM4893  
Units  
(Limits)  
Symbol  
IDD  
Parameter  
Conditions  
VIN = 0V, 8BTL  
Typical  
Limit  
(Note 6)  
(Notes 7, 8)  
Quiescent Power Supply Current  
Shutdown Current  
5
0.1  
10  
2.0  
40  
mA (max)  
µA (max)  
mV (max)  
W (min)  
%
ISD  
Vshutdown = GND  
VOS  
Po  
Output Offset Voltage  
Output Power  
5
THD = 1% (max); f = 1kHz  
Po = 0.4Wrms; f = 1kHz  
Vripple = 200mVsine p-p, CB  
1.0µF  
1.1  
0.9  
THD+N  
Total Harmonic Distortion+Noise  
0.1  
=
68 (f = 1kHz)  
62 (f =  
217Hz)  
PSRR  
Power Supply Rejection Ratio  
55  
dB (min)  
Input terminated with 10to  
ground  
VSDIH  
VSDIL  
Shutdown High Input Voltage  
Shutdown Low Input Voltage  
1.4  
0.4  
V (min)  
V (max)  
A-Weighted; Measured across 8Ω  
BTL  
NOUT  
Output Noise  
26  
µVRMS  
Input terminated with 10to  
ground  
Electrical Characteristics VDD = 3.0V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for TA = 25˚C.  
LM4893  
Units  
(Limits)  
Symbol  
IDD  
Parameter  
Conditions  
VIN = 0V, 8BTL  
Typical  
(Note 6)  
4.5  
Limit  
(Notes 7, 8)  
Quiescent Power Supply Current  
Shutdown Current  
9
mA (max)  
µA (max)  
mV (max)  
mW  
ISD  
Vshutdown = GND  
0.1  
2.0  
40  
VOS  
Po  
Output Offset Voltage  
Output Power  
5
THD = 1% (max); f = 1kHz  
Po = 0.15Wrms; f = 1kHz  
Vripple = 200mVsine p-p, CB  
1.0µF  
350  
320  
THD+N  
Total Harmonic Distortion+Noise  
0.1  
%
=
68 (f = 1kHz)  
62 (f =  
217Hz)  
PSRR  
Power Supply Rejection Ratio  
55  
dB (min)  
Input terminated with 10to  
ground  
VSDIH  
VSDIL  
Shutdown High Input Voltage  
Shutdown Low Input Voltage  
1.4  
0.4  
V (min)  
V (max)  
3
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Electrical Characteristics VDD = 3.0V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for TA  
25˚C. (Continued)  
=
LM4893  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Typical  
Limit  
(Note 6)  
(Notes 7, 8)  
A-Weighted; Measured across 8Ω  
BTL  
NOUT  
Output Noise  
26  
µVRMS  
Input terminated with 10to  
ground  
Electrical Characteristics VDD = 2.6V (Notes 1, 2)  
The following specifications apply for the circuit shown in Figure 1 unless otherwise specified. Limits apply for TA = 25˚C.  
LM4893  
Units  
(Limits)  
Symbol  
IDD  
Parameter  
Conditions  
VIN = 0V, 8BTL  
Typical  
(Note 6)  
3.5  
Limit  
(Notes 7, 8)  
Quiescent Power Supply Current  
Shutdown Current  
mA  
µA  
ISD  
Vshutdown = GND  
0.1  
VOS  
Output Offset Voltage  
5
mV  
THD = 1% (max); f = 1kHz  
RL = 8Ω  
Po  
Output Power  
250  
350  
mW  
%
RL = 4Ω  
THD+N  
Total Harmonic Distortion+Noise  
Po = 0.1Wrms; f = 1kHz  
Vripple = 200mVsine p-p, CB  
1.0µF  
0.1  
=
55 (f = 1kHz)  
55 (f =  
217Hz)  
PSRR  
Power Supply Rejection Ratio  
dB  
Input terminated with 10to  
ground  
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.  
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which  
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit  
is given, however, the typical value is a good indication of device performance.  
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T  
, θ , and the ambient temperature T . The maximum  
A
JMAX JA  
allowable power dissipation is P  
= (T  
–T )/θ or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4893, see power derating  
DMAX  
JMAX A JA  
curves for additional information.  
Note 4: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 5: Machine Model, 220pF–240pF discharged through all pins.  
Note 6: Typicals are measured at 25˚C and represent the parametric norm.  
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).  
Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase I by a maximum of 2µA.  
SD  
Note 9: If the product is in shutdown mode, and V exceeds 6V (to a max of 8V V ), then most of the excess current will flow through the ESD protection circuits.  
DD  
DD  
If the source impedance limits the current to a max of 10ma, then the part will be protected. If the part is enabled when V  
be curtailed or the part may be permanently damaged.  
is above 6V, circuit performance will  
DD  
Note 10: All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance.  
Note 11: Maximum power dissipation (P  
) in the device occurs at an output power level significantly below full output power. P  
can be calculated using  
DMAX  
DMAX  
Equation 1 shown in the Application section. It may also be obtained from the power dissipation graphs.  
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4
External Components Description  
(Figure 1)  
Components  
Functional Description  
1.  
Ri  
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a  
high pass filter with Ci at fC= 1/(2π RiCi).  
2.  
Ci  
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a  
highpass filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components,  
for an explanation of how to determine the value of Ci.  
3.  
4.  
Rf  
Feedback resistance which sets the closed-loop gain in conjunction with Ri.  
CS  
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing  
section for information concerning proper placement and selection of the supply bypass capacitor.  
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External  
Components, for information concerning proper placement and selection of CB.  
5.  
CB  
Typical Performance Characteristics  
THD+N vs Frequency  
THD+N vs Frequency  
at VDD = 5V, 8RL, and PWR = 250mW  
at VDD = 3.0V, 8RL, and PWR = 150mW  
20038037  
20038038  
THD+N vs Frequency  
THD+N vs Frequency  
at VDD = 2.6V, 8RL, and PWR = 100mW  
at VDD = 2.6V, 4RL, and PWR = 100mW  
20038039  
20038040  
5
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Typical Performance Characteristics (Continued)  
THD+N vs Power Out  
VDD = 5V, 8RL, 1kHz  
THD+N vs Power Out  
VDD = 3.0V, 8RL, 1kHz  
@
@
20038041  
20038042  
THD+N vs Power Out  
VDD = 2.6V, 8RL, 1kHz  
THD+N vs Power Out  
VDD = 2.6V, 4RL, 1kHz  
@
@
20038043  
20038044  
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6
Typical Performance Characteristics (Continued)  
@
@
Power Supply Rejection Ratio (PSRR) VDD = 5V  
Power Supply Rejection Ratio (PSRR) VDD = 3V  
20038045  
20038073  
Input terminated with 10R  
Input terminated with 10R  
@
@
Power Supply Rejection Ratio (PSRR) VDD = 2.6V  
Power Dissipation vs Output Power VDD = 5V  
20038046  
20038047  
Input terminated with 10R  
7
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Typical Performance Characteristics (Continued)  
Power Dissipation vs  
Output Power  
Power Dissipation vs  
Output Power  
@
VDD = 3.0V  
VDD = 2.6V  
20038049  
20038048  
Power Derating - MSOP  
Power Derating - SOP  
PDMAX = 670mW for 5V, 8Ω  
PDMAX = 670mW for 5V, 8Ω  
20038079  
20038093  
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8
Typical Performance Characteristics (Continued)  
Power Derating - 9 Bump µSMD  
Output Power vs  
Supply Voltage  
PDMAX = 670mW for 5V, 8Ω  
20038051  
20038081  
Output Power vs  
Supply Voltage  
Output Power vs  
Load Resistance  
20038050  
20038074  
9
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Typical Performance Characteristics (Continued)  
Clipping (Dropout) Voltage vs  
Supply Voltage  
Supply Current vs  
Shutdown Voltage  
20038075  
20038052  
Shutdown Hysterisis Voltage  
VDD = 5V  
Shutdown Hysterisis Voltage  
VDD = 3V  
20038076  
20038077  
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10  
Typical Performance Characteristics (Continued)  
Shutdown Hysterisis Voltage  
VDD = 2.6V  
Open Loop Frequency Response  
20038078  
20038054  
Frequency Response vs  
Input Capacitor Size  
20038056  
11  
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duced supply voltage, higher load impedance, or reduced  
ambient temperature. Internal power dissipation is a function  
of output power. Refer to the Typical Performance Charac-  
teristics curves for power dissipation information for differ-  
ent output powers and output loading.  
Application Information  
BRIDGE CONFIGURATION EXPLANATION  
As shown in Figure 1, the LM4893 has two operational  
amplifiers internally, allowing for a few different amplifier  
configurations. The first amplifier’s gain is externally config-  
urable, while the second amplifier is internally fixed in a  
unity-gain, inverting configuration. The closed-loop gain of  
the first amplifier is set by selecting the ratio of Rf to Ri while  
the second amplifier’s gain is fixed by the two internal 20 kΩ  
resistors. Figure 1 shows that the output of amplifier one  
serves as the input to amplifier two which results in both  
amplifiers producing signals identical in magnitude, but out  
of phase by 180˚. Consequently, the differential gain for the  
IC is  
POWER SUPPLY BYPASSING  
As with any amplifier, proper supply bypassing is critical for  
low noise performance and high power supply rejection. The  
capacitor location on both the bypass and power supply pins  
should be as close to the device as possible. Typical appli-  
cations employ a 5V regulator with 10 µF tantalum or elec-  
trolytic capacitor and a ceramic bypass capacitor which aid  
in supply stability. This does not eliminate the need for  
bypassing the supply nodes of the LM4893. The selection of  
a bypass capacitor, especially CB, is dependent upon PSRR  
requirements, click and pop performance (as explained in  
the section, Proper Selection of External Components),  
system cost, and size constraints.  
AVD= 2 *(Rf/Ri)  
By driving the load differentially through outputs Vo1 and  
Vo2, an amplifier configuration commonly referred to as  
“bridged mode” is established. Bridged mode operation is  
different from the classical single-ended amplifier configura-  
tion where one side of the load is connected to ground.  
SHUTDOWN FUNCTION  
In order to reduce power consumption while not in use, the  
LM4893 contains a SHUTDOWN pin to externally turn off the  
amplifier’s bias circuitry. This shutdown feature turns the  
amplifier off when a logic low is placed on the SHUTDOWN  
pin. By switching the SHUTDOWN pin to ground, the  
LM4893 supply current draw will be minimized in idle mode.  
While the device will be disabled with SHUTDOWN pin  
voltages less than 0.4VDC, the idle current may be greater  
than the typical value of 0.1µA. (Idle current is measured  
with the SHUTDOWN pin tied to ground).  
A bridge amplifier design has a few distinct advantages over  
the single-ended configuration, as it provides differential  
drive to the load, thus doubling output swing for a specified  
supply voltage. Four times the output power is possible as  
compared to a single-ended amplifier under the same con-  
ditions. This increase in attainable output power assumes  
that the amplifier is not current limited or clipped. In order to  
choose an amplifier’s closed-loop gain without causing ex-  
cessive clipping, please refer to the Audio Power Amplifier  
Design section.  
In many applications, a microcontroller or microprocessor  
output is used to control the shutdown circuitry to provide a  
quick, smooth transition into shutdown. Another solution is to  
use a single-pole, single-throw switch in conjunction with an  
external pull-up resistor. When the switch is closed, the  
SHUTDOWN pin is connected to ground which disables the  
amplifier. If the switch is open, then the external pull-up  
resistor to VDD will enable the LM4893. This scheme guar-  
antees that the SHUTDOWN pin will not float thus prevent-  
ing unwanted state changes.  
A bridge configuration, such as the one used in LM4893,  
also creates a second advantage over single-ended amplifi-  
ers. Since the differential outputs, Vo1 and Vo2, are biased  
at half-supply, no net DC voltage exists across the load. This  
eliminates the need for an output coupling capacitor which is  
required in a single supply, single-ended amplifier configura-  
tion. Without an output coupling capacitor, the half-supply  
bias across the load would result in both increased internal  
IC power dissipation and also possible loudspeaker damage.  
POWER DISSIPATION  
PROPER SELECTION OF EXTERNAL COMPONENTS  
Power dissipation is a major concern when designing a  
successful amplifier, whether the amplifier is bridged or  
single-ended. A direct consequence of the increased power  
delivered to the load by a bridge amplifier is an increase in  
internal power dissipation. Since the LM4893 has two opera-  
tional amplifiers in one package, the maximum internal  
power dissipation is 4 times that of a single-ended amplifier.  
The maximum power dissipation for a given application can  
be derived from the power dissipation graphs or from Equa-  
tion 1.  
Proper selection of external components in applications us-  
ing integrated power amplifiers is critical to optimize device  
and system performance. While the LM4893 is tolerant of  
external component combinations, consideration to compo-  
nent values must be used to maximize overall system qual-  
ity.  
The LM4893 is unity-gain stable which gives the designer  
maximum system flexibility. The LM4893 should be used in  
low gain configurations to minimize THD+N values, and  
maximize the signal to noise ratio. Low gain configurations  
require large input signals to obtain a given output power.  
Input signals equal to or greater than 1 Vrms are available  
from sources such as audio codecs. Please refer to the  
section, Audio Power Amplifier Design, for a more com-  
plete explanation of proper gain selection.  
PDMAX = 4*(VDD)2/(2π2RL)  
(1)  
It is critical that the maximum junction temperature (TJMAX  
)
of 150˚C is not exceeded. TJMAX can be determined from the  
power derating curves by using PDMAX and the PC board foil  
area. By adding additional copper foil, the thermal resistance  
of the application can be reduced from a free air value of  
150˚C/W, resulting in higher PDMAX. Additional copper foil  
can be added to any of the leads connected to the LM4893.  
It is especially effective when connected to VDD, GND, and  
the output pins. Refer to the application information on the  
LM4893 reference design board for an example of good heat  
sinking. If TJMAX still exceeds 150˚C, then additional  
changes must be made. These changes can include re-  
Besides gain, one of the major considerations is the closed-  
loop bandwidth of the amplifier. To a large extent, the band-  
width is dictated by the choice of external components  
shown in Figure 1. The input coupling capacitor, Ci, forms a  
first order high pass filter which limits low frequency re-  
sponse. This value should be chosen based on needed  
frequency response for a few distinct reasons.  
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12  
Application Information (Continued)  
AUDIO POWER AMPLIFIER DESIGN  
Selection Of Input Capacitor Size  
A 1W/8Audio Amplifier  
Large input capacitors are both expensive and space hungry  
for portable designs. Clearly, a certain sized capacitor is  
needed to couple in low frequencies without severe attenu-  
ation. But in many cases the speakers used in portable  
systems, whether internal or external, have little ability to  
reproduce signals below 100 Hz to 150 Hz. Thus, using a  
large input capacitor may not increase actual system perfor-  
mance.  
Given:  
Power Output  
Load Impedance  
Input Level  
1 Wrms  
8Ω  
1 Vrms  
20 kΩ  
Input Impedance  
Bandwidth  
100 Hz–20 kHz 0.25 dB  
In addition to system cost and size, click and pop perfor-  
mance is effected by the size of the input coupling capacitor,  
Ci. A larger input coupling capacitor requires more charge to  
reach its quiescent DC voltage (nominally 1/2 VDD). This  
charge comes from the output via the feedback and is apt to  
create pops upon device enable. Thus, by minimizing the  
capacitor size based on necessary low frequency response,  
turn-on pops can be minimized.  
A designer must first determine the minimum supply rail to  
obtain the specified output power. By extrapolating from the  
Output Power vs Supply Voltage graphs in the Typical Per-  
formance Characteristics section, the supply rail can be  
easily found. A second way to determine the minimum sup-  
ply rail is to calculate the required Vopeak using Equation 2  
and add the output voltage. Using this method, the minimum  
Besides minimizing the input capacitor size, careful consid-  
eration should be paid to the bypass capacitor value. Bypass  
capacitor, CB, is the most critical component to minimize  
turn-on pops since it determines how fast the LM4893 turns  
on. The slower the LM4893’s outputs ramp to their quiescent  
DC voltage (nominally 1/2 VDD), the smaller the turn-on pop.  
Choosing CB equal to 1.0 µF along with a small value of Ci  
(in the range of 0.1 µF to 0.39 µF), should produce a virtually  
clickless and popless shutdown function. While the device  
will function properly, (no oscillations or motorboating), with  
CB equal to 0.1 µF, the device will be much more susceptible  
to turn-on clicks and pops. Thus, a value of CB equal to  
1.0 µF is recommended in all but the most cost sensitive  
designs.  
supply voltage would be (Vopeak + (VOD  
+ VODBOT)), where  
VOD  
and VOD  
are extrapolated frToOmP the Dropout Volt-  
TOP  
age BvOsT Supply Voltage curve in the Typical Performance  
Characteristics section.  
(2)  
5V is a standard voltage, in most applications, chosen for the  
supply rail. Extra supply voltage creates headroom that al-  
lows the LM4893 to reproduce peaks in excess of 1W with-  
out producing audible distortion. At this time, the designer  
must make sure that the power supply choice along with the  
output impedance does not violate the conditions explained  
in the Power Dissipation section.  
Figure 2 shows the LM4893’s turn-on characteristics when  
coming out of shutdown mode. Trace B is the differential  
output signal across a BTL 8load. The LM4893’s active-  
low SHUTDOWN pin is driven by the logic signal shown in  
Trace A. Trace C is the Vo1- output signal and Trace D is the  
Vo2+ output signal. A shown in Figure 2, the differential  
output signal Trace B appears just as Trace A transitions  
from logic low to logic high (turn-on condition).  
Once the power dissipation equations have been addressed,  
the required differential gain can be determined from Equa-  
tion 3.  
(3)  
AVD = (Rf/Ri) 2  
From Equation 3, the minimum AVD is 2.83; use AVD = 3.  
Since the desired input impedance was 20 k, and with a  
AVD of 3, a ratio of 1.5:1 of Rf to Ri results in an allocation of  
Ri = 20 kand Rf = 30 k. The final design step is to  
address the bandwidth requirements which must be stated  
as a pair of −3 dB frequency points. Five times away from a  
−3 dB point is 0.17 dB down from passband response which  
is better than the required 0.25 dB specified.  
fL = 100 Hz/5 = 20 Hz  
fH = 20 kHz * 5 = 100 kHz  
As stated in the External Components section, Ri in con-  
junction with Ci create a highpass filter.  
Ci 1/(2π*20 k*20 Hz) = 0.397 µF; use 0.39 µF  
The high frequency pole is determined by the product of the  
20038097  
desired frequency pole, fH, and the differential gain, AVD  
.
With a AVD = 3 and fH = 100 kHz, the resulting GBWP =  
300 kHz which is much smaller than the LM4893 GBWP of  
10 MHz. This figure displays that if a designer has a need to  
design an amplifier with a higher differential gain, the  
LM4893 can still be used without running into bandwidth  
limitations.  
FIGURE 2. LM4893 Turn-on Characteristics  
Differential output signal (Trace B) is devoid of  
transients. The SHUTDOWN pin is driven by a  
shutdown signal (Trace A). The inverting output (Trace  
C) and the non-inverting output (Trace D) are applied  
across an 8BTL load.  
13  
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Application Information (Continued)  
20038088  
FIGURE 3. HIGHER GAIN AUDIO AMPLIFIER  
nates possible high frequency oscillations. Care should be  
taken when calculating the -3dB frequency in that an incor-  
rect combination of R3 and C4 will cause rolloff before  
20kHz. A typical combination of feedback resistor and ca-  
pacitor that will not produce audio band high frequency rolloff  
is R3 = 20kand C4 = 25pf. These components result in a  
-3dB point of approximately 320 kHz.  
The LM4893 is unity-gain stable and requires no external  
components besides gain-setting resistors, an input coupling  
capacitor, and proper supply bypassing in the typical appli-  
cation. However, if a closed-loop differential gain of greater  
than 10 is required, a feedback capacitor (C4) may be  
needed as shown in Figure 2 to bandwidth limit the amplifier.  
This feedback capacitor creates a low pass filter that elimi-  
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14  
Application Information (Continued)  
20038089  
FIGURE 4. DIFFERENTIAL AMPLIFIER CONFIGURATION FOR LM4893  
20038090  
FIGURE 5. REFERENCE DESIGN BOARD and LAYOUT - micro SMD  
15  
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Application Information (Continued)  
LM4893 SO BOARD ARTWORK  
Silk Screen  
20038098  
20038095  
20038096  
Top Layer  
Bottom Layer  
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16  
Application Information (Continued)  
20038068  
FIGURE 6. REFERENCE DESIGN BOARD and PCB LAYOUT GUIDELINES - MSOP & SO Boards  
17  
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Application Information (Continued)  
LM4893 MSOP DEMO BOARD ARTWORK  
Silk Screen  
20038065  
Top Layer  
20038066  
Bottom Layer  
20038067  
www.national.com  
18  
Application Information (Continued)  
Mono LM4893 Reference Design Boards  
Bill of Material for all 3 Demo Boards  
Item  
1
Part Number  
Part Description  
Qty  
1
Ref Designator  
551011208-001 LM4893 Mono Reference Design Board  
482911183-001 LM4893 Audio AMP  
10  
20  
21  
25  
30  
35  
1
U1  
151911207-001 Tant Cap 1uF 16V 10  
1
C1  
151911207-002 Cer Cap 0.39uF 50V Z5U 20% 1210  
152911207-001 Tant Cap 1.0uF 16V 10  
1
C2  
1
C3  
472911207-001 Res 20K Ohm 1/10W 5  
3
R1, R2, R3  
J1, J2  
210007039-002 Jumper Header Vertical Mount 2X1 0.100  
2
PCB LAYOUT GUIDELINES  
analog and digital sections. It is further recommended to put  
digital and analog power traces over the corresponding digi-  
tal and analog ground traces to minimize noise coupling.  
This section provides practical guidelines for mixed signal  
PCB layout that involves various digital/analog power and  
ground traces. Designers should note that these are only  
"rule-of-thumb" recommendations and the actual results will  
depend heavily on the final layout.  
PLACEMENT OF DIGITAL AND ANALOG  
COMPONENTS  
All digital components and high-speed digital signals traces  
should be located as far away as possible from analog  
components and circuit traces.  
General Mixed Signal Layout Recommendations  
POWER AND GROUND CIRCUITS  
AVOIDING TYPICAL DESIGN / LAYOUT PROBLEMS  
For 2 layer mixed signal design, it is important to isolate the  
digital power and ground trace paths from the analog power  
and ground trace paths. Star trace routing techniques (bring-  
ing individual traces back to a central point rather than daisy  
chaining traces together in a serial manner) can have a  
major impact on low level signal performance. Star trace  
routing refers to using individual traces to feed power and  
ground to each circuit or even device. This technique will  
take require a greater amount of design time but will not  
increase the final price of the board. The only extra parts  
required may be some jumpers.  
Avoid ground loops or running digital and analog traces  
parallel to each other (side-by-side) on the same PCB layer.  
When traces must cross over each other do it at 90 degrees.  
Running digital and analog traces at 90 degrees to each  
other from the top to the bottom side as much as possible will  
minimize capacitive noise coupling and cross talk.  
SINGLE-POINT POWER / GROUND CONNECTIONS  
The analog power traces should be connected to the digital  
traces through a single point (link). A "Pi-filter" can be helpful  
in minimizing high frequency noise coupling between the  
19  
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Physical Dimensions inches (millimeters) unless otherwise noted  
9-Bump micro SMD  
Order Number LM4893ITL, LM4893ITLX  
NS Package Number TLA09AAA  
X1 = 1.514 0.03 X2 = 1.514 0.03 X3 = 0.60 0.075  
www.national.com  
20  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
SO  
Order Number LM4893MA  
NS Package Number M08A  
21  
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
MSOP  
Order Number LM4893MM  
NS Package Number MUB10A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification  
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
National Semiconductor  
Americas Customer  
Support Center  
National Semiconductor  
Europe Customer Support Center  
Fax: +49 (0) 180-530 85 86  
National Semiconductor  
Asia Pacific Customer  
Support Center  
National Semiconductor  
Japan Customer Support Center  
Fax: 81-3-5639-7507  
Email: new.feedback@nsc.com  
Tel: 1-800-272-9959  
Email: europe.support@nsc.com  
Deutsch Tel: +49 (0) 69 9508 6208  
English Tel: +44 (0) 870 24 0 2171  
Français Tel: +33 (0) 1 41 91 8790  
Email: ap.support@nsc.com  
Email: jpn.feedback@nsc.com  
Tel: 81-3-5639-7560  
www.national.com  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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