LM5017SDE/NOPB [TI]

7.5V-100V 宽输入电压、600mA 恒定导通时间同步降压稳压器 | NGU | 8 | -40 to 125;
LM5017SDE/NOPB
型号: LM5017SDE/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

7.5V-100V 宽输入电压、600mA 恒定导通时间同步降压稳压器 | NGU | 8 | -40 to 125

开关 控制器 开关式稳压器 开关式控制器 光电二极管 电源电路 开关式稳压器或控制器
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LM5017  
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SNVS783D JANUARY 2012REVISED MAY 2013  
LM5017 100V, 600mA Constant On-Time Synchronous Buck Regulator  
Check for Samples: LM5017  
1
FEATURES  
PACKAGES  
2
Wide 9V to 100V Input Range  
Integrated 100V, High and Low Side Switches  
No Schottky Required  
WSON-8  
SO PowerPAD-8  
DESCRIPTION  
Constant On-time Control  
The LM5017 is a 100V, 600mA synchronous step-  
down regulator with integrated high side and low side  
MOSFETs. The constant-on-time (COT) control  
scheme employed in the LM5017 requires no loop  
compensation, provides excellent transient response,  
and enables very low step-down ratios. The on-time  
varies inversely with the input voltage resulting in  
nearly constant frequency over the input voltage  
range. A high voltage startup regulator provides bias  
power for internal operation of the IC and for  
integrated gate drivers.  
No Loop Compensation Required  
Ultra-Fast Transient Response  
Nearly Constant Operating Frequency  
Intelligent Peak Current Limit  
Adjustable Output Voltage from 1.225V  
Precision 2% Feedback Reference  
Frequency Adjustable to 1MHz  
Adjustable Undervoltage Lockout (UVLO)  
Remote Shutdown  
A peak current limit circuit protects against overload  
conditions. The undervoltage lockout (UVLO) circuit  
allows the input undervoltage threshold and  
hysteresis to be independently programmed. Other  
protection features include thermal shutdown and  
bias supply undervoltage lockout (VCC UVLO).  
Thermal Shutdown  
APPLICATIONS  
Smart Power Meters  
Telecommunication Systems  
Automotive Electronics  
Isolated Bias Supply  
The LM5017 is available in WSON-8 and SO  
PowerPAD-8 plastic packages.  
Typical Application  
LM5017  
9V-100V  
VIN  
7
BST  
2
4
+
V
IN  
L1  
VOUT  
C
BST  
8
+
SW  
C
IN  
RON  
R
UV2  
C
VCC  
R
ON  
R
FB2  
VCC  
FB  
3
R
C
6
5
UVLO  
SD  
+
R
UV1  
RTN  
C
OU  
T
R
FB1  
1
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2012–2013, Texas Instruments Incorporated  
LM5017  
SNVS783D JANUARY 2012REVISED MAY 2013  
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Connection Diagram  
SW  
BST  
VCC  
FB  
1
2
3
4
8
RTN  
VIN  
RTN  
VIN  
1
2
3
4
8
7
6
5
SW  
BST  
VCC  
FB  
SO  
PowerPAD-  
8
7
WSON-8  
UVLO  
RON  
Exp Pad  
UVLO  
RON  
6
5
Exp Pad  
Figure 1. Top View (Connect Exposed Pad to RTN) Figure 2. Top View (Connect Exposed Pad to RTN)  
Pin Descriptions  
Pin  
Name  
RTN  
VIN  
Description  
Application Information  
Ground connection of the integrated circuit.  
Operating input range is 9V to 100V.  
1
Ground  
2
Input Voltage  
3
UVLO  
Input Pin of Undervoltage Comparator  
Resistor divider from VIN to UVLO to GND programs the  
undervoltage detection threshold. An internal current  
source is enabled when UVLO is above 1.225V to  
provide hysteresis. When UVLO pin is pulled below  
0.66V externally, the parts goes in shutdown mode.  
4
RON  
On-Time Control  
Feedback  
A resistor between this pin and VIN sets the switch on-  
time as a function of VIN. Minimum recommended on-  
time is 100ns at max input voltage.  
5
6
FB  
This pin is connected to the inverting input of the internal  
regulation comparator. The regulation level is 1.225V.  
VCC  
Output from the Internal High Voltage Series Pass  
Regulator. Regulated at 7.6V  
The internal VCC regulator provides bias supply for the  
gate drivers and other internal circuitry. A 1.0μF  
decoupling capacitor is recommended.  
7
8
BST  
Bootstrap Capacitor  
An external capacitor is required between the BST and  
SW pins (0.01μF ceramic). The BST pin capacitor is  
charged by the VCC regulator through an internal diode  
when the SW pin is low.  
SW  
EP  
Switching Node  
Exposed Pad  
Power switching node. Connect to the output inductor  
and bootstrap capacitor.  
Exposed pad must be connected to RTN pin. Connect to  
system ground plane on application board for reduced  
thermal resistance.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
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(1)(2)  
Absolute Maximum Ratings  
VIN, UVLO to RTN  
SW to RTN  
-0.3V to 100V  
-1.5V to VIN +0.3V  
100V  
BST to VCC  
BST to SW  
13V  
RON to RTN  
-0.3V to 100V  
-0.3V to 13V  
-0.3V to 5V  
2kV  
VCC to RTN  
FB to RTN  
ESD Rating (Human Body Model(3)  
(4)  
Lead Temperature  
200°C  
Storage Temperature Range  
-55°C to +150°C  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.  
The RTN pin is the GND reference electrically connected to the substrate.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin.  
(4) For detailed information on soldering plastic SO PowerPAD package, refer to the SNOA549 available from Texas Instruments. Max  
solder time not to exceed 4 seconds.  
(1)  
Operating Ratings  
VIN Voltage  
9V to 100V  
Operating Junction Temperature  
40°C to +125°C  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.  
The RTN pin is the GND reference electrically connected to the substrate.  
Thermal Characteristics(1)  
WSON-8  
41.3  
3.2  
SO PowerPAD-8  
UNIT  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
θJA  
Junction-to-ambient thermal resistance  
41.1  
2.4  
θJCbot  
ΨJB  
Junction-to-case (bottom) thermal resistance  
Junction-to-board thermal characteristic parameter  
Junction-to-board thermal resistance  
19.2  
19.1  
34.7  
0.3  
24.4  
30.6  
37.3  
6.7  
θJB  
θJCtop  
ΨJT  
Junction-to-case (top) thermal resistance  
Junction-to-top thermal characteristic parameter  
(1) The package thermal impedance is calculated in accordance with JESD 51.  
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SNVS783D JANUARY 2012REVISED MAY 2013  
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Electrical Characteristics  
Specifications with standard typeface are for TJ = 25°C, and those with boldface type apply over full Operating Junction  
(1)  
Temperature range. VIN = 48V, unless otherwise stated. See  
.
Symbol  
VCC Supply  
VCC Reg  
Parameter  
Conditions  
Min  
Typ  
7.6  
4.5  
Max  
8.55  
4.9  
Units  
VCC Regulator Output  
VCC Current Limit  
VIN = 48V, ICC = 20mA  
VIN = 48V(2)  
6.25  
26  
V
mA  
V
VCC Undervoltage Lockout Voltage  
(VCC increasing)  
4.15  
VCC Undervoltage Hysteresis  
VCC Drop Out Voltage  
IIN Operating Current  
300  
2.3  
mV  
V
VIN = 9V, ICC = 20mA  
Non-Switching, FB = 3V  
UVLO = 0V  
1.75  
50  
mA  
µA  
IIN Shutdown Current  
225  
1.8  
Switch Characteristics  
Buck Switch RDS(ON)  
ITEST = 200mA, BST-SW =  
7V  
0.8  
Synchronous RDS(ON)  
Gate Drive UVLO  
ITEST = 200mA  
0.45  
3
1
V
VBST VSW Rising  
2.4  
0.7  
3.6  
Gate Drive UVLO Hysteresis  
260  
mV  
Current Limit  
Current Limit Threshold  
1.02  
150  
12  
1.3  
A
Current Limit Response Time  
OFF-Time Generator (Test 1)  
OFF-Time Generator (Test 2)  
Time to Switch Off  
ns  
µs  
µs  
FB = 0.1V, VIN = 48V  
FB = 1.0V, VIN = 48V  
2.5  
On-Time Generator  
TON Test 1  
VIN = 32V, RON = 100k  
VIN = 48V, RON = 100k  
VIN = 75V, RON = 250k  
VIN = 10V, RON = 250k  
270  
188  
350  
250  
460  
336  
ns  
ns  
ns  
ns  
TON Test 2  
TON Test 3  
TON Test 4  
250  
370  
500  
1880  
3200  
4425  
Minimum Off-Time  
Minimum Off-Timer  
Regulation and Overvoltage Comparators  
FB Regulation Level  
FB = 0V  
144  
ns  
V
Internal Reference Trip Point  
for Switch ON  
1.2  
1.225  
1.25  
FB Overvoltage Threshold  
FB Bias Current  
Trip Point for Switch OFF  
1.62  
60  
V
nA  
Undervoltage Sensing Function  
UV Threshold  
UV Rising  
1.19  
-10  
1.225  
-20  
1.26  
-29  
V
µA  
V
UV Hysteresis Input Current  
Remote Shutdown Threshold  
Remote Shutdown Hysteresis  
Thermal Shutdown  
UV = 2.5V  
Voltage at UVLO Falling  
0.32  
0.66  
110  
mV  
Tsd  
Thermal Shutdown Temperature  
Thermal Shutdown Hysteresis  
165  
20  
°C  
°C  
(1) All limits are specified by design. All electrical characteristics having room temperature limits are tested during production at TA = 25°C.  
All hot and cold limits are specified by correlating the electrical characteristics to process and temperature variations and applying  
statistical process control.  
(2) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.  
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Typical Performance Characteristics  
Efficiency at 200kHz, 10V  
VCC vs VIN  
Figure 3.  
Figure 4.  
VCC vs ICC  
ICC vs External VCC  
Figure 5.  
Figure 6.  
TON vs VIN and RON  
TOFF (ILIM) vs VFB and VIN  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
IIN vs VIN (Operating, Non Switching)  
IIN vs VIN (Shutdown)  
Figure 9.  
Figure 10.  
Switching Frequency vs VIN  
Figure 11.  
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SNVS783D JANUARY 2012REVISED MAY 2013  
Block Diagram  
LM5017  
START-UP  
V
CC  
V
IN  
REGULATOR  
V UVLO  
4.5V  
20 µA  
UVLO  
THERMAL  
SHUTDOWN  
UVLO  
1.225V  
SD  
VDD REG  
BG REF  
BST  
0.66V  
SHUTDOWN  
V
IN  
DISABLE  
ON/OFF  
TIMERS  
R
ON  
SW  
COT CONTROL  
LOGIC  
1.225V  
FEEDBACK  
FB  
ILIM  
COMPARATOR  
OVER-VOLTAGE  
1.62V  
+
-
CURRENT  
LIMIT  
ONE-SHOT  
VILIM  
RTN  
Figure 12. Functional Block Diagram  
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Functional Description  
The LM5017 step-down switching regulator features all the functions needed to implement a low cost, efficient,  
buck converter capable of supplying up to 0.6A to the load. This high voltage regulator contains 100V, N-channel  
buck and synchronous switches, is easy to implement, and is provided in thermally enhanced SO PowerPAD-8  
and WSON-8 packages. The regulator operation is based on a constant on-time control scheme using an on-  
time inversely proportional to VIN. This control scheme does not require loop compensation. The current limit is  
implemented with a forced off-time inversely proportional to VOUT. This scheme ensures short circuit protection  
while providing minimum foldback. The simplified block diagram of the LM5017 is shown in Figure 12, Functional  
Block Diagram.  
The LM5017 can be applied in numerous applications to efficiently regulate down higher voltages. This regulator  
is well suited for 48V telecom and 42V automotive power bus ranges. Protection features include: thermal  
shutdown, Undervoltage Lockout (UVLO), minimum forced off-time, and an intelligent current limit.  
Control Overview  
The LM5017 buck regulator employs a control principle based on a comparator and a one-shot on-timer, with the  
output voltage feedback (FB) compared to an internal reference (1.225V). If the FB voltage is below the  
reference the internal buck switch is turned on for the one-shot timer period, which is a function of the input  
voltage and the programming resistor (RON). Following the on-time the switch remains off until the FB voltage  
falls below the reference, but never before the minimum off-time forced by the minimum off-time one-shot timer.  
When the FB pin voltage falls below the reference and the minimum off-time one-shot period expires, the buck  
switch is turned on for another on-time one-shot period. This will continue until regulation is achieved and the FB  
voltage is approximately equal to 1.225V (typ).  
In a synchronous buck converter, the low side (sync) FET is ‘on’ when the high side (buck) FET is ‘off’. The  
inductor current ramps up when the high side switch is ‘on’ and ramps down when the high side switch is ‘off’.  
There is no diode emulation feature in this IC, and therefore, the inductor current may ramp in the negative  
direction at light load. This causes the converter to operate in continuous conduction mode (CCM) regardless of  
the output loading. The operating frequency remains relatively constant with load and line variations. The  
operating frequency can be calculated as follows:  
VOUT  
10-10 x RON  
Ösw  
=
The output voltage (VOUT) is set by two external resistors (RFB1, RFB2). The regulated output voltage is calculated  
as follows:  
RFB2 + RFB1  
VOUT = 1.225V x  
RFB1  
VOUT - 1.225V  
1.225V  
RFB2  
RFB1  
=
This regulator regulates the output voltage based on ripple voltage at the feedback input, requiring a minimum  
amount of ESR for the output capacitor (COUT). A minimum of 25mV of ripple voltage at the feedback pin (FB) is  
required for the LM5017. In cases where the capacitor ESR is too small, additional series resistance may be  
required (RC in Figure 13 Low Ripple Output Configuration).  
For applications where lower output voltage ripple is required the output can be taken directly from a low ESR  
output capacitor, as shown in Figure 13 Low Ripple Output Configuration. However, RC slightly degrades the  
load regulation.  
VCC Regulator  
The LM5017 contains an internal high voltage linear regulator with a nominal output of 7.6V. The input pin (VIN)  
can be connected directly to the line voltages up to 100V. The VCC regulator is internally current limited to 30mA.  
The regulator sources current into the external capacitor at VCC. This regulator supplies current to internal circuit  
blocks including the synchronous MOSFET driver and the logic circuits. When the voltage on the VCC pin  
reaches the undervoltage lockout (VCC UVLO) threshold of 4.5V, the IC is enabled.  
The VCC regulator contains an internal diode connection to the BST pin to replenish the charge in the gate drive  
boot capacitor when SW pin is low.  
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At high input voltages, the power dissipated in the high voltage regulator is significant and can limit the overall  
achievable output power. As an example, with the input at 48V and switching at high frequency, the VCC  
regulator may supply up to 7mA of current resulting in 48V x 7mA = 336mW of power dissipation. If the VCC  
voltage is driven externally by an alternate voltage source, between 8V and 13V, the internal regulator is  
disabled. This reduces the power dissipation in the IC.  
L1  
VOUT  
SW  
LM5017  
R
R
FB2  
C
VOUT  
(low ripple)  
FB  
+
COUT  
R
FB1  
Figure 13. Low Ripple Output Configuration  
Regulation Comparator  
The feedback voltage at FB is compared to an internal 1.225V reference. In normal operation, when the output  
voltage is in regulation, an on-time period is initiated when the voltage at FB falls below 1.225V. The high side  
switch will stay on for the on-time, causing the FB voltage to rise above 1.225V. After the on-time period, the  
high side switch will stay off until the FB voltage again falls below 1.225V. During start-up, the FB voltage will be  
below 1.225V at the end of each on-time, causing the high side switch to turn on immediately after the minimum  
forced off-time of 144ns. The high side switch can be turned off before the on-time is over, if the peak current in  
the inductor reaches the current limit threshold.  
Overvoltage Comparator  
The feedback voltage at FB is compared to an internal 1.62V reference. If the voltage at FB rises above 1.62V  
the on-time pulse is immediately terminated. This condition can occur if the input voltage and/or the output load  
changes suddenly. The high side switch will not turn on again until the voltage at FB falls below 1.225V.  
On-Time Generator  
The on-time for the LM5017 is determined by the RON resistor, and is inversely proportional to the input voltage  
(VIN), resulting in a nearly constant frequency as VIN is varied over its range. The on-time equation for the  
LM5017 is:  
10-10 x RON  
TON  
=
VIN  
See figure “TON vs VIN and RON” in the section “ Performance Curves”. RON should be selected for a minimum on-  
time (at maximum VIN) greater than 100ns, for proper operation. This requirement limits the maximum switching  
frequency for high VIN.  
Current Limit  
The LM5017 contains an intelligent current limit off-timer. If the current in the buck switch exceeds 1.02A the  
present cycle is immediately terminated, and a non-resetable off-timer is initiated. The length of off-time is  
controlled by the FB voltage and the input voltage VIN. As an example, when FB = 0V and VIN = 48V, the  
maximum off-time is set to 16μs. This condition occurs when the output is shorted, and during the initial part of  
start-up. This amount of time ensures safe short circuit operation up to the maximum input voltage of 100V.  
In cases of overload where the FB voltage is above zero volts (not a short circuit) the current limit off-time is  
reduced. Reducing the off-time during less severe overloads reduces the amount of foldback, recovery time, and  
start-up time. The off-time is calculated from the following equation:  
0.07 x VIN  
ms  
TOFF(ILIM)  
=
VFB + 0.2V  
The current limit protection feature is peak limited. The maximum average output will be less than the peak.  
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N-Channel Buck Switch and Driver  
The LM5017 integrates an N-Channel Buck switch and associated floating high voltage gate driver. The gate  
driver circuit works in conjunction with an external bootstrap capacitor and an internal high voltage diode. A  
0.01uF ceramic capacitor connected between the BST pin and the SW pin provides the voltage to the driver  
during the on-time. During each off-time, the SW pin is at approximately 0V, and the bootstrap capacitor charges  
from VCC through the internal diode. The minimum off-timer, set to 144ns , ensures a minimum time each cycle to  
recharge the bootstrap capacitor.  
Synchronous Rectifier  
The LM5017 provides an internal synchronous N-Channel MOSFET rectifier. This MOSFET provides a path for  
the inductor current to flow when the high-side MOSFET is turned off.  
The synchronous rectifier has no diode emulation mode, and is designed to keep the regulator in continuous  
conduction mode even during light loads which would otherwise result in discontinuous operation.  
Undervoltage Detector  
The LM5017 contains a dual level undervoltage lockout (UVLO) circuit. When the UVLO pin voltage is below  
0.66V, the controller is in a low current shutdown mode. When the UVLO pin voltage is greater than 0.66V but  
less than 1.225V, the controller is in standby mode. In standby mode the VCC bias regulator is active while the  
regulator output is disabled. When the VCC pin exceeds the VCC undervoltage threshold and the UVLO pin  
voltage is greater than 1.225V, normal operation begins. An external set-point voltage divider from VIN to GND  
can be used to set the minimum operating voltage of the regulator.  
UVLO hysteresis is accomplished with an internal 20μA current source that is switched on or off into the  
impedance of the set-point divider. When the UVLO threshold is exceeded, the current source is activated to  
quickly raise the voltage at the UVLO pin. The hysteresis is equal to the value of this current times the resistance  
RUV2  
.
UVLO  
VCC  
Mode  
Description  
<0.66V  
Shutdown  
VCC regulator disabled.  
Switcher disabled.  
0.66V – 1.225V  
>1.225V  
Standby  
Standby  
Operating  
VCC regulator enabled  
Switcher disabled.  
VCC <4.5V  
VCC >4.5V  
VCC regulator enabled.  
Switcher disabled.  
VCC enabled.  
Switcher enabled.  
If the UVLO pin is wired directly to the VIN pin, the regulator will begin operation once the VCC undervoltage is  
satisfied.  
VIN  
2
V
IN  
+
C
IN  
R
R
UV2  
UV1  
LM5017  
3
UVLO  
Figure 14. UVLO Resistor Setting  
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Thermal Protection  
The LM5017 should be operated so the junction temperature does not exceed 150°C during normal operation.  
An internal Thermal Shutdown circuit is provided to protect the LM5017 in the event of a higher than normal  
junction temperature. When activated, typically at 165°C, the controller is forced into a low power reset state,  
disabling the buck switch and the VCC regulator. This feature prevents catastrophic failures from accidental  
device overheating. When the junction temperature reduces below 145°C (typical hysteresis = 20°C), the VCC  
regulator is enabled, and normal operation is resumed.  
APPLICATION INFORMATION  
SELECTION OF EXTERNAL COMPONENTS  
Selection of external components is illustrated through a design example. The design example specifications are  
as follows:  
Buck Converter Design Specifications  
Input voltage range  
Output voltage  
12.5V to 95V  
10V  
Maximum Load current  
Switching Frequency  
500mA  
200kHz  
RFB1, RFB2:  
VOUT = VFB x (RFB2/RFB1 + 1), and since VFB = 1.225V, the ratio of RFB2 to RFB1 calculates as 7:1. Standard  
values of 6.98kand 1.00kare chosen. Other values could be used as long as the 7:1 ratio is maintained.  
Frequency Selection:  
At the minimum input voltage, the maximum switching frequency of LM5017 is restricted by the forced minimum  
off-time (TOFF(MIN)) as given by:  
1 - DMAX  
TOFF(MIN)  
1 - 10/12.5  
200 ns  
=
= 1 MHz  
ÖSW(MAX)  
=
Similarly, at maximum input voltage, the maximum switching frequency of LM5017 is restricted by the minimum  
TON as given by:  
DMIN  
10/95  
100 ns  
ÖSW(MAX)  
=
=
= 1.05 MHz  
TON(MIN)  
Resistor RON sets the nominal switching frequency based on the following equations:  
VOUT  
K x RON  
ÖSW  
=
(1)  
where K = 1 x 10–10. Operation at high switching frequency results in lower efficiency while providing the smallest  
solution. For this example a conservative 200kHz was selected, resulting in RON = 504k. Selecting a standard  
value for RON = 499kresults in a nominal frequency of 202kHz.  
Inductor Selection:  
The minimum inductance is selected to limit the output ripple to 20 to 40 percent of the maximum load current. In  
addition, the peak inductor current at maximum load should be smaller than the minimum current limit as given in  
Electrical Characteristics table. The inductor current ripple is given by:  
VIN - VOUT VOUT  
x
ûIL =  
L1 x ÖSW  
VIN  
The maximum ripple is observed at maximum input voltage. Substituting VIN = 95V and ΔIL = 40 percent x IOUT  
results in L1 = 198.4μH. The next higher standard value of 220μH is chosen. The peak-to-peak minimum  
(max)  
and maximum inductor current ripples of 35mA and 204mA are given at minimum and maximum input voltages  
respectively. The peak inductor and switch current is given by  
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ûIL(MAX)  
ILI(peak) = IOUT  
+
= 602 mA  
2
which is smaller than the minimum current limit. The inductor should be able to withstand the maximum current  
limit of 1.3A, which can be reached during startup and overload conditions.  
LM5017  
9V-100V  
7
VIN  
BST  
2
4
+
V
IN  
L1  
VOUT  
C
T
BS  
8
+
+
SW  
C
C
IN  
BYP  
RON  
C
VCC  
R
ON  
R
UV2  
R
R
C
VCC  
FB  
FB2  
C
3
6
5
UVLO  
Shutdown  
+
R
UV1  
RTN  
R
OUT  
FB1  
1
Figure 15. Reference Schematic for Selection of External Components  
Output Capacitor:  
The output capacitor is selected to minimize the capacitive ripple across it. The maximum ripple is observed at  
maximum input voltage and is given by:  
ûIL  
COUT  
=
8 x Ösw x ûVripple  
where ΔVripple is the voltage ripple across the capacitor. Substituting ΔVripple = 10mV gives COUT = 12.64μF. A  
22μF standard value is selected. An X5R or X7R type capacitor with a voltage rating 16V or higher should be  
selected.  
Series Ripple Resistor RC:  
The series resistor should be selected to produce sufficient ripple at the feedback node. The ripple produced by  
RC is proportional to the inductor current ripple, and therefore RC should be chosen for minimum inductor current  
ripple which occurs at minimum input voltage. The RC is calculated by the equation:  
VOUT  
VREF  
25 mV  
ûIL(MIN)  
>
x
RC  
This gives an RC of greater than or equal to 5.15. Selecting RC = 5.23results in ~1V of maximum output  
voltage ripple. For applications requiring lower output voltage ripple, Type II or Type III ripple injection circuits  
should be used as described in the section “ Ripple Configuration”.  
VCC and Bootstrap Capacitor:  
The VCC capacitor provides charge to bootstrap capacitor as well as internal circuitry and low side gate driver.  
The Bootstrap capacitor provides charge to high side gate driver. A good value for CVCC is 1μF. A good value for  
CBST is 0.01μF.  
Input Capacitor:  
Input capacitor should be large enough to limit the input voltage ripple:  
IOUT(MAX)  
8 x ÖSW x ûVIN  
>
CIN  
choosing a ΔVIN = 0.5V gives a minimum CIN = 1.24μF. A standard value of 2.2μF is selected. The input  
capacitor should be rated for the maximum input voltage under all conditions. A 100V, X7R dielectric should be  
selected for this design.  
Input capacitor should be placed directly across VIN and RTN (pin 2 and 1) of the IC. If it is not possible to place  
all of the input capacitor close to the IC, a 0.47μF capacitor should be placed near the IC to provide a bypass  
path for the high frequency component of the switching current. This helps limit the switching noise.  
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UVLO Resistors:  
The UVLO resistors RFB1 and RFB2 set the UVLO threshold and hysteresis according to the following relationship:  
V (HYS) HYS x RUV2  
I
=
IN  
and  
RUV2  
RUV1  
VIN (UVLO,rising) = 1.225V x  
+ 1  
(
)
where IHYS = 20μA. Setting UVLO hysteresis of 2.5V and UVLO rising threshold of 12V results in RUV1 = 14.53kΩ  
and RUV2 = 125k. Selecting standard value of RUV1 = 14kand RUV2 = 125kresults in UVLO thresholds and  
hysteresis of 12.4V and 2.5V respectively.  
APPLICATION CIRCUIT: 12V TO 95V INPUT AND 10V, 500mA OUTPUT BUCK CONVERTER  
The application schematic of a buck supply is shown in Figure 16 below. For output voltage (VOUT) above the  
maximum regulation threshold of VCC (8.55V, see Electrical Characteristics), the VCC pin can be connected to  
VOUT through a diode (D2), as shown below, for higher efficiency and lower power dissipation in the IC.  
SW  
(TP6)  
12V-95V  
LM5017  
VIN  
(TP1)30177733  
0.01 F  
7
220 H  
L1  
0Ω  
R8  
BST  
2
4
+
V
IN  
VOUT  
(TP3)  
C1  
8
+
+
SW  
C5  
C4  
R5  
RON  
127 kΩ  
2.2 F 0.47 F  
R3  
499 kΩ  
C6  
R2  
0Ω  
R4  
3
3300 pF  
GND  
(TP2)  
UVLO  
46.4 kΩ  
C8  
0.1 F  
(TP4)  
VCC  
FB  
R1  
R7  
14 kΩ  
+
6
5
UVLO/SD  
6.98 kΩ  
C9  
22 F  
D2  
R6  
1 kΩ  
EXP RTN  
+
C7  
GND  
(TP5)  
1
U1  
1 F  
Figure 16. Final Schematic for 12V to 95V Input, and 10V, 500mA Output Buck Converter  
ISOLATED DC-DC CONVERTER USING LM5017  
An isolated supply using LM5017 is shown in Figure 17 below. Inductor (L) in a typical buck circuit is replaced  
with a coupled inductor (X1). A diode (D1) is used to rectify the voltage on a secondary output. The nominal  
voltage at the secondary output (VOUT2) is given by:  
NS  
NP  
VOUT2 = VOUT1  
x
- VF  
where VF is the forward voltage drop of D1, and NP, NS are the number of turns on the primary and secondary  
of coupled inductor X1. For output voltage (VOUT1) above the maximum VCC (8.55V), the VCC pin can be diode  
connected to VOUT1 for higher effiicency and low dissipation in the IC. See AN-2204 (SNVA611) for a complete  
isolated bias design with LM5017.  
VOUT2  
D1  
+
C
OUT2  
N
S
LM5017  
VIN  
20V-100V  
BST  
+
X1  
VOUT1  
C
BST  
SW  
V
IN  
N
P
R
r
+
+
C
OUT1  
C
IN  
RON  
R
UV2  
UV1  
R
C
C
r
ON  
ac  
R
FB2  
VCC  
FB  
UVLO  
D2  
R
RTN  
+
R
C
FB1  
VCC  
Figure 17. Typical Isolated Application Schematic  
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RIPPLE CONFIGURATION  
LM5017 uses Constant-On-Time (COT) control scheme, in which the on-time is terminated by an on-timer, and  
the off-time is terminated by the feedback voltage (VFB) falling below the reference voltage (VREF). Therefore, for  
stable operation, the feedback voltage must decrease monotonically, in phase with the inductor current during  
the off-time. Furthermore, this change in feedback voltage (VFB) during off-time must be large enough to  
suppress any noise component present at the feedback node.  
Table 1 shows three different methods for generating appropriate voltage ripple at the feedback node. Type 1  
and Type 2 ripple circuits couple the ripple at the output of the converter to the feedback node (FB). The output  
voltage ripple has two components:  
1. Capacitive ripple caused by the inductor current ripple charging/discharging the output capacitor.  
2. Resistive ripple caused by the inductor current ripple flowing through the ESR of the output capacitor.  
The capacitive ripple is not in phase with the inductor current. As a result, the capacitive ripple does not  
decrease monotonically during the off-time. The resistive ripple is in phase with the inductor current and  
decreases monotonically during the off-time. The resistive ripple must exceed the capacitive ripple at the output  
node (VOUT) for stable operation. If this condition is not satisfied unstable switching behavior is observed in COT  
converters, with multiple on-time bursts in close succession followed by a long off-time.  
Type 3 ripple method uses Rr and Cr and the switch node (SW) voltage to generate a triangular ramp. This  
triangular ramp is ac coupled using Cac to the feedback node (FB). Since this circuit does not use the output  
voltage ripple, it is ideally suited for applications where low output voltage ripple is required. See application note  
AN-1481 (SNVA166) for more details for each ripple generation method.  
Table 1.  
Type 1  
Type 2  
Type 3  
Lowest Cost Configuration  
Reduced Ripple Configuration  
Minimum Ripple Configuration  
VOUT  
VOUT  
VOUT  
L1  
L1  
L1  
C
ac  
R
C
OUT  
r
C
R
R
FB2  
r
FB2  
R
C
R
C
R
FB2  
C
ac  
To FB  
To FB  
GND  
C
C
OUT  
To FB  
OUT  
R
R
FB1  
FB1  
R
FB1  
GND  
GND  
5
VOUT  
VREF  
Cr = 3300 pF  
Cac = 100 nF  
25 mV  
ûIL(MIN)  
C >  
>
x
RC  
Ö
sw (RFB2||RFB1  
)
(VIN(MIN) - VOUT) x TON  
25 mV  
25 mV  
ûIL(MIN)  
<
>
RrCr  
RC  
SOFT START  
A soft-start feature can be implemented to the LM5017 using an external circuit. As shown in Figure 18, the soft-  
start circuit consists of one capacitor, C1, two resistors, R1 and R2, and a diode, D. During the initial start-up, the  
VCC voltage is established prior to the VOUT voltage. D is thereby forward biased and the FB voltage is pulled up  
above the reference voltage (1.225V). The switcher is disabled. With the charging of the capacitor C1, the voltage  
at node B gradually decreases. Due to the action of the control circuit, VOUT will gradually rise to maintain the FB  
voltage at the reference voltage. Once the voltage at node B is lower than the FB voltage, plus the voltage drop  
of D, the soft-start is finished and D is reverse biased.  
During the initial part of the start-up, the FB voltage can be approximated as follows. Please note that the effect  
of R1 has been ignored to simplify the calculation:  
RFB1 x RFB2  
R2 x (RFB1 + RFB2) + RFB1 x RFB2  
VFB = (VCC - VD) x  
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To achieve the desired soft-start, the following design guidance is recommended:  
(1) R2 is selected so that VFB is higher than 1.225V for a VCC of 4.5V, but is lower than 5V when VCC is 8.55V. If  
an external VCC is used, VFB should not exceed 5V at maximum VCC  
.
(2) C1 is selected to achieve the desired start-up time that can be determined as follows:  
RFB1 x RFB2  
RFB1 + RFB2  
)
tS = C1 x (R2 +  
(3) R1 is used to maintain the node B voltage at zero after the soft-start is finished. A value larger than the  
feedback resistor divider is preferred.  
Based on the schematic shown in Figure 16, selecting C1=1uF, R2=1k, R1=30kresults in a soft-start time of  
about 2ms.  
VCC  
VOUT  
C
1
R
FB2  
R
2
To FB  
D
B
R
R
FB1  
1
Figure 18. Soft-Start Circuit  
LAYOUT RECOMMENDATION  
A proper layout is essential for optimum performance of the circuit. In particular, the following guidelines should  
be observed:  
1. CIN: The loop consisting of input capacitor (CIN), VIN pin, and RTN pin carries switching currents. Therefore,  
the input capacitor should be placed close to the IC, directly across VIN and RTN pins and the connections to  
these two pins should be direct to minimize the loop area. In general it is not possible to accommodate all of  
input capacitance near the IC. A good practice is to use a 0.1μF or 0.47μF capacitor directly across the VIN  
and RTN pins close to the IC, and the remaining bulk capacitor as close as possible (Refer to Figure 19  
Placement of Bypass Capacitors).  
2. CVCC and CBST: The VCC and bootstrap (BST) bypass capacitors supply switching currents to the high and  
low side gate drivers. These two capacitors should also be placed as close to the IC as possible, and the  
connecting trace length and loop area should be minimized (See Figure 19 Placement of Bypass  
Capacitors).  
3. The Feedback trace carries the output voltage information and a small ripple component that is necessary for  
proper operation of LM5017. Therefore, care should be taken while routing the feedback trace to avoid  
coupling any noise to this pin. In particular, feedback trace should not run close to magnetic components, or  
parallel to any other switching trace.  
4. SW trace: The SW node switches rapidly between VIN and GND every cycle and is therefore a possible  
source of noise. The SW node area should be minimized. In particular, the SW node should not be  
inadvertently connected to a copper plane or pour.  
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SW  
BST  
VCC  
FB  
1
2
3
4
8
RTN  
VIN  
C
IN  
7
SO  
PowerPAD-  
8
UVLO  
RON  
6
5
C
VCC  
Figure 19. Placement of Bypass Capacitors  
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PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
250  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM5017MRE/NOPB  
LM5017MRX/NOPB  
SO  
Power  
PAD  
DDA  
DDA  
8
8
178.0  
330.0  
12.4  
12.4  
6.5  
6.5  
5.4  
5.4  
2.0  
2.0  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
SO  
Power  
PAD  
2500  
LM5017SD/NOPB  
LM5017SDX/NOPB  
WSON  
WSON  
NGU  
NGU  
8
8
1000  
4500  
178.0  
330.0  
12.4  
12.4  
4.3  
4.3  
4.3  
4.3  
1.3  
1.3  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM5017MRE/NOPB  
LM5017MRX/NOPB  
LM5017SD/NOPB  
LM5017SDX/NOPB  
SO PowerPAD  
SO PowerPAD  
WSON  
DDA  
DDA  
NGU  
NGU  
8
8
8
8
250  
213.0  
367.0  
203.0  
367.0  
191.0  
367.0  
190.0  
367.0  
55.0  
35.0  
41.0  
35.0  
2500  
1000  
4500  
WSON  
Pack Materials-Page 2  
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