LM5021MMX-2/NOPB [TI]

LM5021 AC-DC Current Mode PWM Controller;
LM5021MMX-2/NOPB
型号: LM5021MMX-2/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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LM5021 AC-DC Current Mode PWM Controller

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LM5021  
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SNVS359D MAY 2005REVISED MARCH 2013  
LM5021 AC-DC Current Mode PWM Controller  
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1
FEATURES  
DESCRIPTION  
The LM5021 off-line pulse width modulation (PWM)  
controller contains all of the features needed to  
implement highly efficient off-line single-ended  
flyback and forward power converters using current-  
mode control. The LM5021 features include an ultra-  
low (25 µA) start-up current, which minimizes power  
losses in the high voltage start-up network. A skip  
cycle mode reduces power consumption with light  
loads for energy conserving applications (ENERGY  
STAR®, CECP, etc.). Additional features include  
under-voltage lockout, cycle-by-cycle current limit,  
hiccup mode overload protection, slope com-  
pensation, soft-start and oscillator synchronization  
capability. This high performance 8-pin IC has total  
propagation delays less than 100nS and a 1MHz  
capable oscillator that is programmed with a single  
resistor.  
2
Ultra Low Start-up Current (25 µA maximum)  
Current Mode Control  
Skip Cycle Mode for Low Standby Power  
Single Resistor Programmable Oscillator  
Synchronizable Oscillator  
Adjustable Soft-Start  
Integrated 0.7A Peak Gate Driver  
Direct Opto-Coupler Interface  
Maximum Duty Cycle Limiting (80% for  
LM5021-1 or 50% for LM5021-2)  
Slope Compensation for (LM5021-1 Only)  
Under Voltage Lockout (UVLO) with Hysteresis  
Cycle-by-Cycle Over-Current Protection  
Hiccup Mode for Continuous Overload  
Protection  
WHITE SPACE  
Leading Edge Blanking of Current Sense  
Signal  
Packages: VSSOP-8 or PDIP-8  
Simplified Application Diagram  
VOUT  
+
AC  
90 ~ 264 Vac  
VCC  
VIN  
LM5021  
RT  
SS  
OUT  
CS  
+
COMP GND  
FEEDBACK  
WITH  
ISOLATION  
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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LM5021  
SNVS359D MAY 2005REVISED MARCH 2013  
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Connection Diagram  
COMP  
VIN  
1
2
3
4
8
7
6
5
SS  
RT  
VCC  
OUT  
CS  
GND  
Figure 1. Top View  
VSSOP-8  
(See Package Number DGK0008A)  
PDIP-8  
(See Package Number P0008E)  
PIN DESCRIPTIONS  
Pin  
Name  
Description  
Application Information  
1
COMP  
Control input for the Pulse Width Modulator and COMP pull-up is provided by an internal 5K resistor which may  
Hiccup comparators.  
Input voltage.  
be used to bias an opto-coupler transistor.  
2
3
VIN  
Input to start-up regulator. The VIN pin is clamped at 36V by  
an internal zener diode.  
VCC  
Output only of a linear bias supply regulator.  
Nominally 8.5V.  
VCC provides bias to controller and gate drive sections of the  
LM5021. An external capacitor must be connected from this pin  
to ground.  
4
OUT  
MOSFET gate driver output.  
High current output to the external MOSFET gate input with  
source/sink current capability of 0.3A and 0.7A respectively.  
5
6
GND  
CS  
Ground return.  
Current Sense input.  
Current sense input for current mode control and over-current  
protection. Current limiting is accomplished using a dedicated  
current sense comparator. If the CS comparator input exceeds  
0.5 Volts the OUT pin switches low for cycle-by-cycle current  
limit. CS is held low for 90ns after OUT switches high to blank  
the leading edge current spike.  
7
8
RT / SYNC Oscillator timing resistor pin and synchronization An external resistor connected from RT to GND sets the  
input.  
oscillator frequency. This pin will also accept synchronization  
pulses from an external clock.  
SS  
Soft-start / Hiccup time  
An external capacitor and an internal 22 µA current source set  
the soft-start ramp. The soft -start capacitor controls both the  
soft-start rate and the hiccup mode period.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
2
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(1)(2)  
Absolute Maximum Ratings  
VIN to GND  
-0.3V to 30V  
5mA  
VIN Clamp Continuous Current  
CS to GND  
-0.3V to 1.25V  
-0.3V to 5.5V  
-0.3V to 7.0V  
RT to GND  
All other pins to GND  
(3)  
ESD Rating  
Human Body Model  
2kV  
-65°C to +150°C  
+150°C  
Storage Temperature  
Operating Junction Temperature  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) The human body model is a 100 pF capacitor discharged through a 1.5kresistor into each pin.  
(1)  
Operating Ratings  
VIN Voltage  
(2)  
8V to 30V  
Junction Temperature  
-40°C to +125°C  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.  
(2) After initial turn-on at VIN = 20V.  
Electrical Characteristics(1)  
Specifications in standard type face are for TJ= +25°C and those in boldface type apply over the full Operating Junction  
Temperature Range. Unless otherwise specified: VIN = 15V, RT = 44.2K.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
STARTUP CIRCUIT  
Start Up Current  
Before VCC Enable  
18  
20  
25  
23  
µA  
V
VCC Regulator enable threshold  
VCC Regulator disable threshold  
VIN ESD Clamp voltage  
17  
30  
7.25  
36  
V
I = 5mA  
40  
V
IVIN  
Operating supply current  
COMP = 0VDC  
2.5  
3.75  
mA  
VCC SUPPLY  
Controller enable threshold  
Controller disable threshold  
VCC regulated output  
6.5  
5.3  
8
7
7.5  
6.3  
9
V
V
5.8  
8.5  
1.7  
22  
No External Load  
I = 5 mA  
V
VCC dropout voltage (VIN - VCC)  
VCC regulator current limit  
V
(2)  
VCC = 7.5V  
15  
75  
mA  
SKIP CYCLE MODE COMPARATOR  
Skip Cycle mode enable threshold [COMP - 1.25V]  
125  
5
175  
mV  
mV  
Skip Cycle mode hysteresis  
CURRENT LIMIT  
CS limit to OUT delay  
CS stepped from 0 to  
0.6V, time to OUT  
35  
ns  
transition low, Cload  
0.  
=
CS limit threshold  
0.45  
0.5  
90  
35  
0.55  
55  
V
ns  
Leading Edge Blanking time  
CS blanking sinking impedance  
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation  
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).  
(2) Device thermal limitations may limit usable range.  
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Electrical Characteristics(1) (continued)  
Specifications in standard type face are for TJ= +25°C and those in boldface type apply over the full Operating Junction  
Temperature Range. Unless otherwise specified: VIN = 15V, RT = 44.2K.  
Symbol  
SOFT-START  
VSS-OCV  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
SS pin open-circuit voltage  
Soft-start Current Source  
Soft-start to COMP Offset  
COMP sinking impedance  
4.3  
15  
5.2  
22  
6.1  
30  
V
µA  
V
0.35  
0.55  
60  
0.75  
During SS ramp  
OSCILLATOR  
Frequency1 (RT = 44.2K)  
Frequency2 (RT = 13.3K)  
Sync threshold  
135  
440  
2.4  
150  
500  
3.2  
165  
560  
3.8  
kHz  
kHz  
V
PWM COMPARATOR  
COMP to OUT delay  
COMP set to 2V  
20  
ns  
CS stepped 0 to 0.4V,  
time to OUT transition  
low, Cload = 0.  
Min Duty Cycle  
COMP = 0V  
0
%
%
%
Max Duty Cycle (-1 Device)  
Max Duty Cycle (-2 Device)  
COMP to PWM comparator gain  
COMP Open Circuit Voltage  
COMP at Max Duty Cycle  
COMP Short Circuit Current  
75  
80  
50  
85  
0.33  
5.1  
4.2  
0.6  
70  
6
V
V
2.75  
1.1  
COMP = 0V  
1.5  
110  
mA  
SLOPE COMPENSATION  
Slope Comp Amplitude (LM5021-1 CS pin to PWM  
90  
mV  
only)  
Comparator offset at  
maximum duty cycle  
OUTPUT SECTION  
OUT High Saturation  
IOUT = 50mA, VCC -  
OUT  
0.6  
1.1  
1
V
OUT Low Saturation  
Peak Source Current  
Peak Sink Current  
Rise time  
IOUT = 100mA  
OUT = VCC/2.  
OUT = VCC/2.  
Cload = 1nF  
0.3  
0.3  
0.7  
25  
V
A
A
ns  
ns  
Fall time  
Cload = 1nF  
10  
HICCUP MODE  
VOVLD  
VHIC  
Over load detection threshold  
Hiccup mode threshold  
COMP pin  
SS pin  
VSS-OCV – 0.8  
VSS-OCV – 0.6  
VSS-OCV– 0.4  
V
V
VSS-OCV – 0.8  
VSS-OCV – 0.6  
VSS-OCV– 0.4  
VRST  
IDTCS  
IOVCS  
Hiccup mode Restart threshold  
Dead-time current source  
SS pin  
0.1  
0.1  
6
0.3  
0.25  
10  
0.5  
0.4  
14  
V
µA  
µA  
Overload detection timer current  
source  
THERMAL RESISTANCE  
θJA  
θJA  
VSSOP-8 Junction to Ambient  
PDIP-8 Junction to Ambient  
0 LFM  
0 LFM  
200  
107  
°C/W  
°C/W  
4
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Simplified Block Diagram  
8.5VLINEAR  
REGULATOR  
VIN  
VCC  
3
2
VIN UVLO  
20V RISING  
7.25VFALLING  
VCC UVLO  
36V  
CLAMP  
7V RISING  
5.8VFALLING  
EN  
VCC_UVLO  
DIS  
CLK  
VCC_UVLO  
RT/ SYNC  
7
OSC  
VCC_UVLO  
SLOPECOMPENSATIONRAMPGENERATOR  
(LM5021 - 1 ONLY)  
MAX DUTY LIMIT  
OUT  
4
50 mA  
LM5021 - 1 (80%)  
LM5021 - 2 (50%)  
DRIVER  
S
R
Q
0 mA  
PWM  
COMPARATOR  
5.2V  
5k  
+
1.25V  
COMP  
2R  
PWM  
LOGIC  
-
1
R
SKIP CYCLE  
550 mV  
5.2V  
COMPARATOR  
-
22 mA  
+
-
+
SS  
SOFTSTART  
SS  
8
AND  
HICCUP  
MODE  
LOGIC  
125 mV  
COMP  
CURRENT LIMIT  
COMPARATOR  
0.25 mA  
1.8k  
CS  
6
+
10 mA  
-
500 mV  
CLK  
Leading Edge Blanking  
VCC_UVLO  
GND  
5
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Typical Performance Characteristics  
Unless otherwise specified: TJ = 25°C.  
VIN Start-Up Current  
VIN UVLO  
16  
14  
12  
10  
8
3
2
1
0
V
Falling  
IN  
6
4
V
Rising  
IN  
2
0
0
10  
20  
30  
15  
16  
17  
19  
20  
21  
18  
V
IN  
(V)  
V
VOLTAGE (V)  
IN  
Figure 2.  
Figure 3.  
VIN Current vs OUT Load  
VIN Voltage Falling vs VCC Voltage  
25  
6
F
= 160 kHz  
S
20  
15  
10  
5
5
4
3
2
F
S
= 80 kHz  
F
= 40 kHz  
1500  
S
0
0
5
10  
15  
(V)  
20  
25  
0
500  
1000  
2000  
OUT DRIVER LOAD (pF)  
V
IN  
Figure 4.  
Figure 5.  
OUT Driver Current vs Temperature  
Hiccup Mode Deadtime vs Softstart Capacitance  
100  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
Sinking  
10  
1
0.1  
0.01  
Sourcing  
-40  
0
40  
80  
120  
1
10  
100  
1000  
TEMPERATURE (oC)  
SOFTSTART CAPACITANCE (nF)  
Figure 6.  
Figure 7.  
6
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Typical Performance Characteristics (continued)  
Unless otherwise specified: TJ = 25°C.  
Output Switching Frequency vs RT  
1000  
LM5021-1  
LM5021-2  
100  
10  
1
10  
100  
1000  
RT (kQ)  
Figure 8.  
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DETAILED OPERATING DESCRIPTION  
START UP CIRCUIT  
Referring to Figure 9, the input capacitor CVIN is trickle charged through the start-up resistor Rstart, when the  
rectified ac input voltage HV is applied. The VIN current consumed by the LM5021 is only 18 µA (nominal) while  
the capacitor CVIN is initially charged to the start-up threshold. When the input voltage, VIN reaches the upper  
VIN UVLO threshold of 20V, the internal VCC linear regulator is enabled. The VCC regulator will remain on until  
VIN falls to the lower UVLO threshold of 7.25V (12.5V hysteresis). When the VCC regulator is turned on, the  
external capacitor at the VCC pin begins to charge. The PWM controller, soft-start circuit and gate driver are  
enabled when the VCC voltage reaches the VCC UVLO upper threshold of 7V. The VCC UVLO has 1.2V  
hysteresis between the upper and lower thresholds to avoid chattering during transients on the VCC pin. When  
the VCC UVLO enables the switching power supply, energy is transferred from the primary to the secondary  
transformer winding(s). A bias winding, shown in Figure 9, delivers power to the VIN pin to sustain the VCC  
regulator. The voltage supplied should be from 11V (VCC regulated voltage maximum plus VCC regulator  
dropout voltage) to 30V (maximum operating VIN voltage). The bias winding should always be connected to the  
VIN pin as shown in Figure 9. Do not connect the bias winding to the VCC pin. The start-up sequence is  
completed and normal operation begins when the voltage from the bias winding is sufficient to maintain VCC  
level greater than the VCC UVLO threshold (5.8V typical).  
The LM5021 is designed for ultra-low start-up current into the VIN pin. To accomplish this very low start-up  
current, the VCC regulator of the LM5021 is unique as compared to the VCC regulator used in other controllers  
of the LM5xxx family. The LM5021 is designed specifically for applications with the bias winding connected to the  
VIN pin as shown in Figure 9. It is not recommended that the bias winding be connected to the VCC pin of  
the LM5021.  
The size of the start-up resistor Rstart not only affects power supply start-up time, but also power supply  
efficiency since the resistor dissipates power in normal operation. The ultra low start-up current of the LM5021  
allows a large value Rstart resistor (up to 3 M) for improved efficiency with reasonable start-up time.  
HV  
Rstart  
VIN  
TRANSFORMER  
BIAS  
WINDING  
V
CC  
REGULATOR  
VCC  
+
C
VCC  
V
IN  
C
VIN  
UVLO  
INTERNAL  
BIAS  
GENERATOR  
V
UPPER  
LOWER  
S
R
Q
CC  
UVLO  
Enable Driver  
Figure 9. Start-Up Circuit Block Diagram  
RELATIONSHIP BETWEEN INPUT CAPACITOR CIN & VCC CAPACITOR CVCC  
The internal VCC linear regulator is enabled when VIN reaches 20V. The drop in VIN due to charge transfer from  
CVIN to CVCC after the regulator is enabled can be calculated from the following equations where VIN' is the  
voltage on CVIN immediately after the VCC regulator charges CVCC  
.
ΔVIN x CVIN = ΔVCC x CVCC  
(1)  
(2)  
(20V – VIN') CVIN = 8.5V CVCC  
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CVCC  
CVIN  
8.5V x  
VIN = 20V -  
(3)  
Assuming CVIN value as 10 µF, and CVCC of 1µF, then the drop in VIN will be 0.85V, or the VIN value drops to  
19.15V. The value of the VCC capacitor can be small (less than 1uF) as it supplies only transient gate drive  
current of a short duration. The CVIN capacitor must be sized to supply the gate drive current and the quiescent  
current of LM5021until the transformer bias winding delivers sufficient voltage to VIN to sustain the VCC voltage.  
The CVIN capacitor value can be calculated from the operating VCC load current after it's output voltage reaches  
the VCC UVLO threshold. For example, if the LM5021 is driving an external MOSFET with total gate charge (Qg)  
of 25nC, the average gate drive current is Qg x Fsw, where Fsw is the switching frequency. Assuming a  
switching frequency of 150KHz, the average gate drive current is 3.75mA. Since the IC consumes approximately  
2.5mA operating current in addition to the gate current, the total current drawn from CVIN capacitor is the  
operating current plus the gate charge current, or 6.25mA. The CVIN capacitor must supply this current for a brief  
time until the transformer bias winding takes over. The CVIN voltage must not fall below 8.5V during the start-up  
sequence or the cycle will be restarted. The maximum allowable start-up time can be calculated using the value  
of CVIN, the change in voltage allow at VIN (19.15V – 8.5V) and the VCC regulator current (6.25mA). Tmax, the  
maximum time allowed to energize the bias winding is:  
CVIN x (19.15V - 8.5V)  
= 17 ms  
Tmax =  
6.25 mA  
(4)  
If the calculated value of Tmax is too small, the value of Cin should be increased further to allow more time  
before the transformer bias winding takes over and delivers the operating current to the VCC regulator.  
Increasing CVIN will increase the time from the application of the rectified ac (HV in the Figure 9) to the time when  
VIN reaches the 20V start threshold. The initial charging time of CVIN is:  
-1  
20V  
1 -  
TVIN_THRESHOLD = RSTART x CVIN x ln  
HV  
(5)  
PWM COMPARATOR/SLOPE COMPENSATION  
The PWM comparator compares the current sense signal with the loop error voltage from the COMP pin. The  
COMP pin voltage is reduced by 1.25V then attenuated by a 3:1 resistor divider. The PWM comparator input  
offset voltage is designed such that less than 1.25V at the COMP pin will result in a zero duty cycle at the  
controller output.  
For duty cycles greater than 50 percent, current mode control circuits are subject to sub-harmonic oscillation. By  
adding an additional fixed slope voltage ramp signal (slope compensation) to the current sense signal, this  
oscillation can be avoided. The LM5021-1 integrates this slope compensation by summing a ramp signal  
generated by the oscillator with the current sense signal. The slope compensation is generated by a current ramp  
driven through an internal 1.8 kresistor connected to the CS pin. Additional slope compensation may be added  
by increasing the resistance between the current sense filter capacitor and the CS pin, thereby increasing the  
voltage ramp created by the oscillator current ramp. Since the LM5021-2 is not capable of duty cycles greater  
than 50%, there is no slope compensation feature in this device.  
CURRENT LIMIT/CURRENT SENSE  
The LM5021 provides a cycle-by-cycle over current protection feature. Current limit is triggered by an internal  
current sense comparator threshold which is set at 500mV. If the CS pin voltage plus the slope compensation  
voltage exceeds 500mV, the OUT pin output pulse will be immediately terminated.  
An RC filter, located near the LM5021, is recommended for the CS pin to attenuate the noise coupled from the  
power FET's gate to source. The CS pin capacitance is discharged at the end of each PWM clock cycle by an  
internal switch. The discharge switch remains on for an additional 90ns leading edge blanking interval to  
attenuate the current sense transient that occurs when the external power FET is turned on. In addition to  
providing leading edge blanking, this circuit also improves dynamic performance by discharging the current  
sense filter capacitor at the conclusion of every cycle.  
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The LM5021 CS comparator is very fast, and may respond to short duration noise pulses. Layout considerations  
are critical for the current sense filter and sense resistor. The capacitor associated with the CS filter must be  
placed very close to the device and connected directly to the pins of the IC (CS and GND). If a current sense  
transformer is used, both leads of the transformer secondary should be routed to the sense resistor, which  
should also be located close to the IC. If a current sense resistor located in the power FET's source is used for  
current sense, a low inductance resistor is required. In this case, all of the noise sensitive low current grounds  
should be connected in common near the IC and then a single connection should be made to the power ground  
(sense resistor ground point).  
OSCILLATOR, SHUTDOWN and SYNC CAPABILITY  
A single external resistor connected between RT and GND pins sets the LM5021 oscillator frequency. The  
LM5021-2 device, with 50% maximum duty cycle, includes an internal flip-flop that divides the oscillator  
frequency by two. This method produces a precise 50% maximum duty cycle limit. Because of this frequency  
divider, the oscillator frequency of the LM5021-2 is actually twice the frequency of the gate drive output (OUT).  
For the LM5021-1 device, the oscillator frequency and the operational output frequency are the same. To set a  
desired output switching frequency (Fsw), the RT resistor can be calculated from:  
LM5021-1:  
6.63 x 109  
RT =  
FSW  
(6)  
LM5021-2:  
6.63 x 109  
RT =  
2 x FSW  
(7)  
The LM5021 can also be synchronized to an external clock. The external clock must have a higher frequency  
than the free running oscillator frequency set by the RT resistor. The clock signal should be capacitively coupled  
into the RT pin with a 100pF capacitor. A peak voltage level greater than 3.8 Volts at the RT pin is required for  
detection of the sync pulse. The dc voltage across the RT resistor is internally regulated at 2 volts. Therefore, the  
ac pulse superimposed on the RT resistor must have 1.8V or greater amplitude to successfully synchronize the  
oscillator. The sync pulse width should be set between 15ns to 150ns by the external components. The RT  
resistor is always required, whether the oscillator is free running or externally synchronized. The RT resistor  
should be located very close to the device and connected directly to the pins of the LM5021 (RT and GND).  
GATE DRIVER and MAX DUTY CYCLE LIMIT  
The LM5021 provides a gate driver (OUT), which can source peak current of 0.3A and sink 0.7A. The LM5021 is  
available in two duty-cycle limit options. The maximum output duty-cycle is typically 80% for the LM5021-1  
option, and precisely equal to 50% for the LM5021-2 option. The maximum duty cycle function for the LM5021-2  
is accomplished with an internal toggle flip-flop to ensure an accurate duty cycle limit. The internal oscillator  
frequency of the LM5021-2 is therefore twice the switching frequency of the PWM controller (OUT pin).  
The 80% maximum duty-cycle function for the LM5021-1 is determined by the internal oscillator. For the  
LM5021-1 the internal oscillator frequency and the switching frequency of the PWM controller are the same.  
SOFT-START  
The soft-start feature allows the power converter to gradually reach the initial steady state operating point, thus  
reducing start-up stresses and current surges. An internal 22 µA current source charges an external capacitor  
connected to the SS pin. The capacitor voltage will ramp up slowly, limiting the COMP pin voltage and the duty  
cycle of the output pulses. The soft-start capacitor is also used to generate the hiccup mode delay time when the  
output of the switching power supply is continuously overloaded.  
HICCUP MODE OVERLOAD CURRENT LIMITING  
Hiccup mode is a method of protecting the power supply from over-heating and damage during an extended  
overload condition. When the output fault is removed the power supply will automatically restart.  
10  
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LM5021  
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SNVS359D MAY 2005REVISED MARCH 2013  
Figure 10, Figure 11, and Figure 12 illustrate the equivalent circuit of the hiccup mode for LM5021 and the  
relevant waveforms. During start-up and in normal operation, the external soft-start capacitor Css is pulled up by  
a current source that delivers 22 µA to the SS pin capacitor. In normal operation, the soft-start capacitor  
continues to charge and eventually reaches the saturation voltage of the current source (VSS_OCV, nominally  
5.2V). During start-up the COMP pin voltage follows the SS capacitor voltage and gradually increases the peak  
current delivered by the power supply. When the output of the switching power supply reaches the desired  
voltage, the voltage feedback amplifier takes control of the COMP signal (via the opto-coupler). In normal  
operation the COMP level is held at an intermediate voltage between 1.25V and 2.75V controlled by the voltage  
regulation loop. When the COMP pin voltage is below 1.25V, the duty-cycle is zero. When the COMP level is  
above 2.75V, the duty cycle will be limited by the 0.5V threshold of cycle-by-cycle current limit comparator.  
If the output of the power supply is overloaded, the voltage regulation loop demands more current by increasing  
the COMP pin control voltage. When the COMP pin exceeds the over voltage detection threshold (VOVLD  
,
nominally 4.6V), the SS capacitor Css will be discharged by a 10 µA overload detection timer current source,  
IOVCS. If COMP remains above VOVLD long enough for the SS capacitor to discharge to the Hiccup mode  
threshold (VHIC, nominally 4.6V), the controller enters the hiccup mode. The OUT pin is then latched low and the  
SS capacitor discharge current source is reduced from 10 µA to 0.25 µA, the dead-time current source, IDTCS  
.
The SS pin voltage is slowly reduced until it reaches the Restart threshold (VRST, nominally 0.3V). Then a new  
start-up sequence commences with 22 µA current source charging the capacitor CSS. The slow discharge of the  
SS capacitor from the Hiccup threshold to the Restart threshold provides an extended off time that reduces the  
overheating of components including diodes and MOSFETs due to the continuous overload. The off time during  
the hiccup mode can be calculated from the following equation:  
CSS x (4.6V - 0.3V)  
CSS x (VHC - VRST  
)
=
Toff =  
IDTCS  
0.25 mA  
(8)  
Example:  
Toff = 808 ms, assuming the CSS capacitor value is 0.047 µF  
Short duration intermittent overloads will not trigger the hiccup mode. The overload duration required to trigger  
the hiccup response is set by the capacitor CSS, the 10 µA discharge current source and voltage difference  
between the saturation level of the SS pin and the Hiccup mode threshold. Figure 12 shows the waveform of SS  
pin with a short duration overload condition. The overload time required to enter the hiccup mode can be  
calculated from the following equation:  
CSS x (VSS_OCV - VHC  
)
CSS x 0.6V  
=
Toverload =  
IOVCS  
10 mA  
(9)  
Example:  
Toverload = 2.82 ms, assuming the CSS capacitor value is 0.047 µF  
Copyright © 2005–2013, Texas Instruments Incorporated  
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Product Folder Links: LM5021  
LM5021  
SNVS359D MAY 2005REVISED MARCH 2013  
www.ti.com  
5.2V  
COMP  
OVERLOAD  
DETECTION  
550 mV  
5.2V  
+
4.6V  
-
22 mA  
EN  
+
-
SS  
10 mA  
EN  
0.25 mA  
EN  
S
R
Q
+
4.6V  
-
HICCUP MODE  
COMPARATOR  
OUT  
DRIVER  
PWM  
0.3V  
+
-
RESTART  
COMPARATOR  
Figure 10. Hiccup Mode Control  
WHITE SPACE  
WHITE SPACE  
Normal  
operation  
Overload  
Detection  
Soft-Start  
SMPS latched  
OFF  
Soft-Start  
COMP  
-10 mA  
5.2V  
4.6V  
SS  
+22 mA  
-0.25 mA  
+22 mA  
0.3V  
Figure 11. Waveform at SS and COMP Pin due to Continuous Overload  
12  
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Product Folder Links: LM5021  
LM5021  
www.ti.com  
SNVS359D MAY 2005REVISED MARCH 2013  
COMP  
5.2V  
4.6V  
+22 mA  
-10 mA  
during over  
load  
+22 mA  
SS  
after releasing the over load  
Figure 12. Waveform at SS and COMP Pin due to Brief Overload  
SKIP CYCLE OPERATION  
During light load conditions, the efficiency of the switching power supply typically drops as the losses associated  
with switching and operating bias currents of the converter become a significant percentage of the power  
delivered to the load. The largest component of the power loss is the switching loss associated with the gate  
driver and external MOSFET gate charge. Each PWM cycle consumes a finite amout of energy as the MOSFET  
is turned on and then turned off. These switching losses are proportional to the frequency of operation. The Skip  
Cycle function integrated within the LM5021 controller reduces the average switching frequency to reduce  
switching losses and improve efficiency during light load conditions.  
When a light load condition occurs, the COMP pin voltage is reduced by the voltage feedback loop to reduce the  
peak current delivered by the controller. Referring to Figure 13, the PWM comparator input tracks the COMP pin  
voltage through a 1.25V level shift circuit and a 3:1 resistor divider. As the COMP pin voltage falls, the input to  
the PWM comparator falls proportionately. When the PWM comparator input falls to 125mV, the Skip Cycle  
comparator detects the light load condition and disables output pulses from the controller. The controller  
continues to skip switching cycles until the power supply output falls and the COMP pin voltage increases to  
demand more output current. The number of cycles skipped will depend on the load and the response time of the  
frequency compensation network. Eventually the COMP voltage will increase when the voltage loop requires  
more current to sustain the regulated output voltage. When the PWM comparator input exceeds 130mV (5mV  
hysteresis), normal fixed frequency switching resumes. Typical power supply designs will produce a short burst  
of output pulses followed by a long skip cycle interval. The average switching frequency in the Skip Cycle mode  
can be a small fraction of the normal operating frequency of the power supply.  
The skip cycle mode of operation can be disabled by adding an offset voltage to the CS pin (refer to Figure 14).  
A resistive divider connected to a regulated source, injecting a 125mV offset (minimum) on the CS pin, will force  
the voltage at the PWM Comparator to be greater than 125 mV, disabling the Skip Cycle Comparator.  
Copyright © 2005–2013, Texas Instruments Incorporated  
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Product Folder Links: LM5021  
LM5021  
SNVS359D MAY 2005REVISED MARCH 2013  
www.ti.com  
5.2V  
5k  
PWM  
COMPARATOR  
+
-
1.25V  
COMP  
2R  
PWM  
LOGIC  
R
-
+
SKIP CYCLE  
COMPARATOR  
125 mV  
CS  
1.8k  
+
-
CLK  
CURRENT LIMIT  
COMPARATOR  
LEADING EDGE  
BLANKING  
500 mV  
Figure 13. Skip Cycle Control  
VIN  
OUT  
LM5021  
Voffset > 125 mV  
VCC  
CS  
RSense  
Figure 14. Disabling the Skip Cycle Mode  
14  
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Product Folder Links: LM5021  
LM5021  
www.ti.com  
SNVS359D MAY 2005REVISED MARCH 2013  
Typical Application Circuit  
Copyright © 2005–2013, Texas Instruments Incorporated  
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15  
Product Folder Links: LM5021  
 
LM5021  
SNVS359D MAY 2005REVISED MARCH 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision C (March 2013) to Revision D  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 15  
16  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LM5021MM-1/NOPB  
ACTIVE  
VSSOP  
DGK  
8
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
21-1  
LM5021MM-2  
NRND  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
21-2  
21-2  
LM5021MM-2/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM5021MMX-1/NOPB  
ACTIVE  
VSSOP  
DGK  
8
3500  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
21-1  
LM5021MMX-2  
NRND  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
3500  
3500  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
21-2  
21-2  
LM5021MMX-2/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM5021NA-1/NOPB  
ACTIVE  
PDIP  
P
8
40  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-NA-UNLIM  
-40 to 125  
LM5021NA  
-1  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM5021MM-1/NOPB  
LM5021MM-2  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
8
8
1000  
1000  
1000  
3500  
3500  
3500  
178.0  
178.0  
178.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
LM5021MM-2/NOPB  
LM5021MMX-1/NOPB  
LM5021MMX-2  
LM5021MMX-2/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM5021MM-1/NOPB  
LM5021MM-2  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
8
8
1000  
1000  
1000  
3500  
3500  
3500  
210.0  
210.0  
210.0  
367.0  
367.0  
367.0  
185.0  
185.0  
185.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LM5021MM-2/NOPB  
LM5021MMX-1/NOPB  
LM5021MMX-2  
LM5021MMX-2/NOPB  
Pack Materials-Page 2  
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