LM6125MD8 [TI]

BUFFER AMPLIFIER, UUC, DIE;
LM6125MD8
型号: LM6125MD8
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

BUFFER AMPLIFIER, UUC, DIE

放大器
文件: 总12页 (文件大小:287K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
December 1994  
LM6125/LM6225/LM6325  
High Speed Buffer  
±
n High output current:  
300 mA  
General Description  
The LM6125 family of high speed unity gain buffers slew at  
800 V/µs and have a small signal bandwidth of 50 MHz while  
n Stable with large capacitive loads  
n Current and thermal limiting  
n Electronic shutdown  
n 5V to 15V operation guaranteed  
n Fully specified to drive 50lines  
±
driving a 50load. These buffers drive 300 mA peak and  
±
do not oscillate while driving large capacitive loads. The  
LM6125 contains unique features not found in power buffers;  
these include current limit, thermal shutdown, electronic  
shutdown, and an error flag that warns of fault conditions.  
Applications  
n Line Driving  
n Radar  
These buffers are built with National’s VIP (Vertically Inte-  
grated PNP) process which provides fast PNP transistors  
that are true complements to the already fast NPN devices.  
This advanced junction-isolated process delivers high speed  
performance without the need for complex and expensive di-  
electric isolation.  
n Sonar  
Features  
n High slew rate: 800 V/µs  
Simplified Schematic and Block Diagram  
DS009222-1  
DS009222-2  
Numbers in () are for 14–pin N DIP.  
VIP is a trademark of National Semiconductor Corporation.  
© 1999 National Semiconductor Corporation  
DS009222  
www.national.com  
Pin Configurations  
DS009222-4  
Note: Pin 4 connected to case  
DS009222-3  
Top View  
*Heat sinking pins.  
Internally connected to V−.  
Order Number LM6125H/883 (Note 1)  
or LM6125H  
Order Number LM6225N  
See NS Package Number H08C  
or LM6325N  
See NS Package Number N14A  
Note 1: Available per 5962-9081501  
www.national.com  
2
Absolute Maximum Ratings (Note 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
±
ESD Tolerance (Note 9)  
θJA (Note 4)  
1500V  
H Package  
150˚C/W  
40˚C/W  
N Package  
±
36V ( 18V)  
Supply Voltage  
Maximum Junction  
Temperature (TJ)  
Operating Temperature Range  
LM6125  
±
Input to Output Voltage (Note 2)  
Input Voltage  
7V  
150˚C  
±
Vsupply  
Output Short-Circuit to GND  
(Note 3)  
−55˚C to +125˚C  
−40˚C to +85˚C  
0˚C to +70˚C  
Continuous  
GND Vflag +Vsupply  
−65˚C to +150˚C  
LM6225  
Flag Output Voltage  
Storage Temperature Range  
LM6325  
±
4.75V to 16V  
Operating Supply Voltage Range  
Lead Temperature  
(Soldering, 10 seconds)  
260˚C  
DC Electrical Characteristics  
=
= =  
15V, VCM 0, RL 100 kand RS 50unless otherwise noted.  
±
The following specifications apply for Supply Voltage  
=
=
=
=
Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C.  
Symbol  
Parameter  
Conditions  
Typ  
LM6125  
Limit  
(Notes 5, 10)  
0.980  
0.970  
0.860  
0.800  
0.780  
0.750  
30  
LM6225  
Limit  
(Note 5)  
0.980  
0.950  
0.860  
0.820  
0.780  
0.700  
30  
LM6325  
Limit  
(Note 5)  
0.970  
0.950  
0.850  
0.820  
0.750  
0.700  
50  
Units  
=
=
=
±
±
AV1  
AV2  
AV3  
VOS  
IB  
Voltage Gain 1  
Voltage Gain 2  
RL 1k, VIN  
10V  
10V  
0.990  
0.900  
0.840  
15  
=
RL 50, VIN  
V/V  
Min  
= =  
RL 50, V+ 5V  
Voltage Gain 3  
(Note 6)  
=
VIN 2 VPP (1.5 VPP  
)
=
Offset Voltage  
RL 1 kΩ  
mV  
Max  
µA  
50  
60  
100  
=
=
Input Bias Current  
RL 1 k, RS 10 kΩ  
1
4
4
5
7
7
7
Max  
MΩ  
pF  
=
RIN  
CIN  
RO  
Input Resistance  
Input Capacitance  
Output Resistance  
RL 50Ω  
5
3.5  
3
=
±
IOUT  
10 mA  
5
10  
5
10  
5
6
Max  
=  
= ∞  
= ∞  
IS1  
Supply Current 1  
Supply Current 2  
RL  
RL  
RL  
15  
14  
18  
18  
20  
22  
18  
20  
1.5  
2.0  
13.2  
13  
11  
10  
10  
9
20  
20  
=
IS2  
, V+ 5V  
16  
16  
mA  
18  
18  
Max  
=
±
±
15V  
IS/D  
VO1  
VO2  
VO3  
VO4  
PSRR  
VOL  
Supply Current  
in Shutdown  
, V  
1.1  
13.5  
12.7  
12  
1.5  
2.0  
13.3  
13  
1.5  
2.0  
13.3  
13  
=
Output Swing 1  
RL 1 kΩ  
=
±
V
Output Swing 2  
Output Swing 3  
Output Swing 4  
RL 100Ω  
11.5  
10  
11.5  
10  
Min  
=
RL 50Ω  
11  
11  
9
9
=
RL 50Ω  
1.8  
70  
1.6  
1.3  
60  
1.6  
1.4  
60  
1.6  
1.5  
60  
50  
340  
400  
VPP  
Min  
dB  
=
V+ 5V (Note 6)  
Power Supply  
Rejection Ratio  
Flag Pin Output  
Low Voltage  
55  
50  
Min  
mV  
Max  
=
±
±
±
V
5V to 15V  
300  
400  
300  
400  
=
VS/D 0V  
3
www.national.com  
DC Electrical Characteristics (Continued)  
=
= =  
15V, VCM 0, RL 100 kand RS 50unless otherwise noted.  
±
The following specifications apply for Supply Voltage  
=
=
=
=
Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C.  
Symbol  
Parameter  
Conditions  
Typ  
LM6125  
Limit  
LM6225  
Limit  
(Note 5)  
10  
LM6325  
Limit  
(Note 5)  
10  
Units  
(Notes 5, 10)  
10  
=
IOH  
Flag Pin Output  
High Current  
VOH Flag Pin 15V  
0.01  
1.4  
µA  
Max  
V
(Note 6)  
20  
20  
20  
VTH  
VIH  
Shutdown Threshold  
Shutdown Pin  
2.0  
2.0  
2.0  
2.0  
0.8  
0.8  
−10  
−20  
−10  
−20  
50  
2.0  
2.0  
V
Trip Point High  
Shutdown Pin  
Min  
V
VIL  
0.8  
0.8  
Trip Point Low  
Shutdown Pin  
0.8  
0.8  
Max  
µA  
=
IIL  
VS/D 0V  
−0.07  
−0.05  
1
−10  
−20  
−10  
−20  
50  
−10  
−20  
−10  
−20  
100  
200  
Input Low Current  
Shutdown Pin  
Max  
µA  
=
VS/D 5V  
IIH  
Input High Current  
Max  
µA  
=
Shutdown Pin 0V  
IO  
Bi-State Output  
Current  
=
VOUT +5V or −5V  
2000  
100  
AC Electrical Characteristics  
=
=
=
±
The following specifications apply for Supply Voltage  
15V, VCM 0, RL 100 kand RS 50unless otherwise noted.  
=
=
=
=
Boldface limits apply for TA TJ TMIN to TMAX; all other limits TA TJ 25˚C.  
Symbol  
Parameter  
Conditions  
Typ  
LM6125  
Limit  
LM6225  
Limit  
LM6325  
Limit  
Units  
(Note 5)  
(Note 5)  
(Note 5)  
=
=
=
±
±
SR1  
SR2  
Slew Rate 1  
VIN  
VIN  
11V, RL 1 kΩ  
1200  
800  
V/µs  
Min  
=
Slew Rate 2  
11V, RL 50Ω  
550  
30  
550  
30  
550  
30  
(Note 8)  
=
=
SR3  
BW  
tr, tf  
tPD  
Slew Rate 3  
VIN 2 VPP, RL 50Ω  
50  
50  
=
V+ 5V (Note 6)  
=
−3 dB Bandwidth  
VIN 100 mVPP  
MHz  
Min  
ns  
=
RL 50, CL 10 pF  
=
Rise Time  
Fall Time  
RL 50, CL 10 pF  
8.0  
4.0  
10  
=
VO 100 mVPP  
=
Propagation  
Delay Time  
Overshoot  
RL 50, CL 10 pF  
ns  
%
=
VO 100 mVPP  
=
RL 50, CL 10 pF  
OS  
=
VO 100 mVPP  
=
Shutdown Pin 0V  
VFT  
VIN, VOUT Feedthrough  
in Shutdown  
=
VIN 4 VPP, 1 MHz  
−50  
30  
dB  
pF  
ns  
=
RL 50Ω  
Shutdown Pin 0V  
=
COUT  
Output Capacitance  
in Shutdown  
tSD  
Shutdown  
700  
Response Time  
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating  
the device beyond its rated operating conditions.  
Note 3: During current limit, thermal limit, or electronic shutdown the input current will increase if the input to output differential voltage exceeds 8V. See Overvoltage  
Protection in Application Hints.  
Note 4: The LM6125 series buffers contain current limit and thermal shutdown to protect against fault conditions.  
www.national.com  
4
AC Electrical Characteristics (Continued)  
=
Note 5: For operation at elevated temperature, these devices must be derated based on a thermal resistance of θ and T max, T  
T
A
+ θ  
P . θ for the  
D JC  
JA  
J
J
JA  
LM6125H and LM6225H is 17˚C/W. The thermal impedance θ of the device in the N package is 40˚C/W when soldered directly to a printed circuit board, and the  
JA  
heat-sinking pins (pins 3, 4, 5, 10, 11, and 12) are connected to 2 square inches of 2 oz. copper. When installed in a socket, the thermal impedance θ of the N pack-  
JA  
age is 60˚C/W.  
Note 6: Limits are guaranteed by testing or correlation.  
Note 7: The input is biased to +2.5V, and V swings V about this value. The input swing is 2 V at all temperatures except for the A 3 test at −55˚C where it  
IN PP PP  
V
is reduced to 1.5 V  
.
PP  
Note 8: The Error Flag is set (low) during current limit or thermal fault detection in addition to being set by the Shutdown pin. It is an open-collector output which re-  
quires an external pullup resistor.  
±
Note 9: Slew rate is measured with a 11V input pulse and 50source impedance at 25˚C. Since voltage gain is typically 0.9 driving a 50load, the output swing  
±
±
will be approximately 10V. Slew rate is calculated for transitions between 5V levels on both rising and falling edges. A high speed measurement is done to minimize  
±
device heating. For slew rate versus junction temperature see typical performance curves. The input pulse amplitude should be reduced to 10V for measurements  
at temperature extremes. For accurate measurements, the input slew rate should be at least 1700 V/µs.  
Note 10: The test circuit consists of the human body model of 120 pF in series with 1500.  
Note 11: A military RETS specification is available on request. At the time of printing, the LM6125H/883 RETS spec complied with the Boldface limits in this column.  
The LM6125H/883 may also be procured as Standard Military Drawing specification #5962-9081501MXX.  
±
Typical Performance Characteristics TA = 25˚C, VS= 15V unless otherwise specified  
Frequency Response  
Frequency Response  
Slew Rate vs Temperature  
DS009222-9  
DS009222-10  
DS009222-11  
Overshoot vs Capacitive Load  
Large Signal Response  
Large Signal Response  
=
(RL 1 k)  
=
(RL 50)  
DS009222-13  
DS009222-14  
DS009222-12  
Supply Current  
−3 dB Bandwidth  
Slew Rate  
DS009222-15  
DS009222-16  
DS009222-17  
5
www.national.com  
±
Typical Performance Characteristics TA = 25˚C, VS= 15V unless otherwise specified (Continued)  
Slew Rate  
Power Bandwidth  
Input Return Gain  
(S11)  
DS009222-19  
DS009222-18  
DS009222-20  
Forward Transmission  
Gain (S21)  
Current Limit  
DS009222-22  
DS009222-21  
Typical Connection Diagram  
DS009222-6  
www.national.com  
6
Application Hints  
POWER SUPPLY DECOUPLING  
down is activated, or the shutdown (S/D) pin is driven low by  
external logic. Flag voltage returns to its HIGH state when  
normal operation resumes.  
If the S/D pin is not to be used, it should be connected to V+.  
The method of supply bypassing is not critical for stability of  
the LM6125 series buffers. However, their high current out-  
put combined with high slew rate can result in significant  
voltage transients on the power supply lines if much induc-  
tance is present. For example, a slew rate of 900 V/µs into a  
50load produces a di/dt of 18 A/µs. Multiplying this by a  
wiring inductance of 50 nH results in a 0.9V transient. To  
minimize this problem use high quality decoupling very close  
to the device. Suggested values are a 0.1 µF ceramic in par-  
allel with one or two 2.2 µF tantalums. A ground plane is rec-  
ommended.  
OVERVOLTAGE PROTECTION  
The LM6125 may be severely damaged or destroyed if the  
Absolute Maximum Rating of 7V between input and output  
pins is exceeded.  
If the buffer’s input-to-output differential voltage is allowed to  
exceed 7V,  
a
base-emitter junction will be in  
reverse-breakdown, and will be in series with  
a
forward-biased base-emitter junction. Referring to the  
LM6125 simplified schematic, the transistors involved are  
Q1 and Q3 for positive inputs, and Q2 and Q4 for negative  
inputs. If any current is allowed to flow through these junc-  
tions, localized heating of the reverse-biased junction will oc-  
cur, potentially causing damage. The effect of the damage is  
typically increased offset voltage, increased bias current,  
and/or degraded AC performance. The damage is cumula-  
tive, and may eventually result in complete device failure.  
LOAD IMPEDANCE  
The LM6125 is stable into any load when driven by a 50Ω  
source. As shown in the Overshoot vs Capacitive Load  
graph, worst case is  
1000 pF. Shunting the load capacitance with a resistor will  
reduce overshoot.  
a purely capacitive load of about  
SOURCE INDUCTANCE  
Like any high-frequency buffer, the LM6125 can oscillate at  
high values of source inductance. The worst case condition  
occurs at a purely capacitive load of 50 pF where up to  
100 nH of source inductance can be tolerated. With a 50Ω  
load, this goes up to 200 nH. This sensitivity may be reduced  
at the expense of a slight reduction in bandwidth by adding a  
resistor in series with the buffer input. A 100resistor will en-  
sure stability with source inductances up to 400 nH with any  
load.  
The device is best protected by the insertion of the parallel  
combination of a 100 kresistor (R1) and a small capacitor  
(C1) in series with the buffer input, and a 100 kresistor  
(R2) from input to output of the buffer (see Figure 1). This  
network normally has no effect on the buffer output. How-  
ever, if the buffer’s current limit or shutdown is activated, and  
the output has a ground-referred load of significantly less  
than 100 k, a large input-to-output voltage may be present.  
R1 and R2 then form  
a voltage divider, keeping the  
input-output differential below the 7V Maximum Rating for in-  
put voltages up to 14V. This protection network should be  
sufficient to protect the LM6125 from the output of nearly any  
ERROR FLAG LOGIC  
The Error Flag pin is an open-collector output which requires  
an external pull-up resistor. Flag voltage is HIGH during op-  
eration, and is LOW during a fault condition. A fault condition  
occurs if either the internal current limit or the thermal shut-  
±
op amp which is operated on supply voltages of 15V or  
lower.  
DS009222-8  
FIGURE 1. LM6125 with Overvoltage Protection  
7
www.national.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
Metal Can Package (H)  
Order Number LM6125H/883 or LM6125H  
NS Package Number H08C  
Molded Dual-In-Line Package (N)  
Order Number LM6225N or LM6325N  
NS Package Number N14A  
www.national.com  
8
Notes  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  
National P/N LM6125 - High Speed Buffer  
file:////roarer/root/data13/imaging/BIT...0804/08032000/NATL/08012000/LM6125.html  
Design  
Purchasing Quality Company Jobs  
Products > Analog - Buffers> LM6125  
Product Folder  
LM6125  
High Speed Buffer  
Generic P/N 6125  
Contents  
Parametric Table  
Number of Channels  
1
General Description  
Features  
Applications  
(Channels)  
Type  
Fixed  
50  
BW at AV+1, typ (MHz)  
Datasheet  
Package Availability, Models, Samples  
& Pricing  
Design Tools  
Slew Rate, typ (Volts/usec) 800  
Gain, typ  
.999  
300  
Output Current, typ (mA)  
Min Supply Voltage (Volt) 10  
Max Supply Voltage (Volt) 36  
Supply Current per Channel,  
14  
typ (mA)  
Vos, typ (mV)  
30  
Input Bias Current, Max  
(nA)  
7000  
Special Features  
Shutdown,Error Flag  
General Description  
The LM6125 family of high speed unity gain buffers slew at 800 V/µs and have a small  
signal bandwidth of 50 MHz while driving a 50 Ohm load. These buffers drive ±300 mA  
peak and do not oscillate while driving large capacitive loads. The LM6125 contains unique  
features not found in power buffers; these include current limit, thermal shutdown,  
electronic shutdown, and an error flag that warns of fault conditions.  
These buffers are built with National's VIP™ (Vertically Integrated PNP) process which  
provides fast PNP transistors that are true complements to the already fast NPN devices.  
This advanced junction-isolated process delivers high speed performance without the need  
for complex and expensive dielectric isolation.  
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National P/N LM6125 - High Speed Buffer  
file:////roarer/root/data13/imaging/BIT...0804/08032000/NATL/08012000/LM6125.html  
Features  
High slew rate: 800 V/µs  
High output current: ±300 mA  
Stable with large capacitive loads  
Current and thermal limiting  
Electronic shutdown  
5V to ±15V operation guaranteed  
Fully specified to drive 50 Ohm lines  
Applications  
Line Driving  
Radar  
Sonar  
Datasheet  
Size  
(in Kbytes)  
Title  
Date  
Receive via  
Email  
View  
Online  
Download  
Download  
Download  
LM6125/LM6225/LM6325 High Speed  
Buffer  
View  
Online  
Receive via  
Email  
261 Kbytes 25-Mar-99  
27 Kbytes  
LM6125 Mil-Aero Datasheet  
MNLM6125-X  
View  
Online  
Receive via  
Email  
Please use Adobe Acrobat to view PDF file(s).  
If you have trouble printing, see Printing Problems.  
Package Availability, Models, Samples & Pricing  
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Samples  
&
Electronic  
Orders  
Package  
Models  
Budgetary Pricing  
Std  
Pack  
Size  
Pack  
Mar  
Part Number  
Status  
#
$US  
Quantity  
Type  
SPICE IBIS  
pins  
each  
[logo] ¢Z  
LM6125H  
5962-9081  
$E  
tray  
20  
Full  
production  
LM6125H/883 TO-5  
8
N/A N/A  
N/A N/A  
.
.
50+  
$15.0000 of  
Full  
production  
LM6125 MD8  
die  
N/A  
-
Design Tools  
Size  
(in Kbytes)  
Title  
Date  
Receive via  
Email  
Download  
View Online  
Amplifiers Selection Guide  
software for Windows  
8 Kbytes  
21-Jul-2000  
View  
Please use Adobe Acrobat to view PDF file(s).  
If you have trouble printing, see Printing Problems.  
[Information as of 1-Aug-2000]  
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