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LM6154BCM [TI]

四路、75MHz、GBW、轨至轨 I/O 运算放大器 | D | 14 | 0 to 70;
LM6154BCM
型号： LM6154BCM
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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四路、75MHz、GBW、轨至轨 I/O 运算放大器 | D | 14 | 0 to 70

放大器 运算放大器
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LM6152, LM6154  
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
LM6152/LM6154 Dual and Quad 75 MHz GBW Rail-to-Rail I/O Operational Amplifiers  
1 Features  
3 Description  
Using  
patented  
circuit  
topologies,  
the  
1
•
At VS = 5V, typical unless noted.  
LM6152/LM6154 provides new levels of speed vs.  
power performance in applications where low voltage  
supplies or power limitations previously made  
compromise necessary. With only 1.4 mA/amplifier  
supply current, the 75 MHz gain bandwidth of this  
device supports new portable applications where  
higher power devices unacceptably drain battery life.  
The slew rate of the devices increases with  
increasing input differential voltage, thus allowing the  
device to handle capacitive loads while maintaining  
large signal amplitude.  
•
Greater than Rail-to-rail Input CMVR −0.2 5V to  
5.25 V  
•
•
•
Rail-to-rail Output Swing 0.01 V to 4.99 V  
Wide Gain-bandwidth 75 MHz @ 100 kHz  
Slew Rate  
–
–
Small Signal 5 V/µs  
Large Signal 45 V/µs  
•
•
•
Low Supply Current 1.4 mA/amplifier  
Wide Supply Range 2.7 V to 24 V  
The LM6152/LM6154 can be driven by voltages that  
exceed both power supply rails, thus eliminating  
concerns about exceeding the common-mode voltage  
range. The rail-to-rail output swing capability provides  
the maximum possible dynamic range at the output.  
This is particularly important when operating on low  
supply voltages.  
Fast Settling Time of 1.1 µs for 2 V Step (to  
0.01%)  
•
•
PSRR 91 dB  
CMRR 84 dB  
2 Applications  
Operating on supplies from 2.7 V to over 24 V, the  
LM6152/LM6154 is excellent for a very wide range of  
applications, from battery operated systems with  
large bandwidth requirements to high speed  
instrumentation.  
•
•
•
Portable High Speed Instrumentation  
Signal Conditioning Amplifier/ADC Buffers  
Barcode Scanners  
Device Information(1)  
PART NUMBER  
LM6152  
PACKAGE  
SOIC (8)  
SOIC (14)  
BODY SIZE (NOM)  
4.902 mm × 3.912 mm  
8.636 mm × 3.912 mm  
LM6154  
(1) For all available packages, see the orderable addendum at  
the end of the datasheet.  
Offset Voltage vs. Supply voltage  
Supply Current vs. Supply Voltage  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
LM6152, LM6154  
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
www.ti.com  
Table of Contents  
6.7 2.7 V DC Electrical Characteristics.......................... 7  
6.8 2.7 V AC Electrical Characteristics .......................... 7  
6.9 24 V DC Electrical Characteristics........................... 8  
6.10 24 V AC Electrical Characteristics ......................... 8  
6.11 Typical Performance Characteristics ...................... 9  
Application and Implementation ........................ 14  
Device and Documentation Support.................. 16  
8.1 Related Links .......................................................... 16  
8.2 Trademarks............................................................. 16  
8.3 Electrostatic Discharge Caution.............................. 16  
8.4 Glossary.................................................................. 16  
1
2
3
4
5
6
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
6.1 Absolute Maximum Ratings ...................................... 4  
6.2 Handling Ratings....................................................... 4  
6.3 Recommended Operating Conditions(1) ................... 4  
6.4 Thermal Information.................................................. 4  
6.5 5.0 V DC Electrical Characteristics.......................... 5  
6.6 5.0 V AC Electrical Characteristics.......................... 6  
7
8
9
Mechanical, Packaging, and Orderable  
Information ........................................................... 16  
4 Revision History  
Changes from Revision D (March 2013) to Revision E  
Page  
•
•
Changed "Junction Temperature Range" to "Operating Temperature Range" and deleted "TJ" in Recommended  
Operating Conditions ............................................................................................................................................................. 4  
Deleted TJ = 25°C for Electrical Characteristics Tables......................................................................................................... 5  
Changes from Revision C (March 2013) to Revision D  
Page  
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 15  
2
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Product Folder Links: LM6152 LM6154  
 
LM6152, LM6154  
www.ti.com  
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
5 Pin Configuration and Functions  
Package D08A  
8-Pin  
Top View  
Package D14A  
14-Pin  
Top View  
Pin Functions  
PIN  
LM6152  
LM6154  
I/O  
DESCRIPTION  
NAME  
D08A  
D14A  
2
-IN A  
+IN A  
-IN B  
+IN B  
-IN C  
+IN C  
-IN D  
+IN D  
OUT A  
OUT B  
OUT C  
OUT D  
V-  
2
3
6
5
I
I
ChA Inverting Input  
ChA Non-inverting Input  
ChB Inverting Input  
ChB Non-inverting Input  
ChC Inverting Input  
ChC Non-inverting Input  
ChD Inverting Input  
ChD Non-inverting Input  
ChA Output  
3
6
I
5
I
9
I
10  
13  
12  
1
I
I
I
1
7
O
O
O
O
I
7
ChB Output  
8
ChC Output  
14  
11  
4
ChD Output  
4
8
Negative Supply  
V+  
I
Positive Supply  
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LM6152, LM6154  
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
www.ti.com  
6 Specifications  
6.1 Absolute Maximum Ratings(1)(2)  
MIN  
MAX  
UNIT  
Differential Input Voltage  
Voltage at Input/Output Pin  
±15  
V
(V+) + 0.3  
V
(V−) −0.3  
Supply Voltage (V+ − V−)  
35  
±10  
±25  
50  
V
Current at Input Pin  
mA  
mA  
mA  
°C  
(3)  
Current at Output Pin  
Current at Power Supply Pin  
Lead Temperature (soldering, 10 sec)  
260  
150  
(4)  
Junction Temperature  
°C  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test  
conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in  
exceeding the maximum allowed junction temperature of 150°C.  
(4) The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient  
temperature is PD = (TJ(MAX)–T A)/RθJA. All numbers apply for packages soldered directly into a PC board.  
6.2 Handling Ratings  
MIN  
MAX  
+150  
2500  
UNIT  
Tstg  
Storage temperature range  
Electrostatic discharge  
-65  
°C  
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all  
pins(1)  
V(ESD)  
V
(1) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process. Human body model  
is 1.5 kΩ in series with 100 pF  
6.3 Recommended Operating Conditions(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
2.7 ≤ V+ ≤ 24  
+70  
UNIT  
V
Supply Voltage  
Operating Temperature Range, LM6152,LM6154  
0
°C  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test  
conditions, see the Electrical Characteristics.  
6.4 Thermal Information  
D08A  
8 PINS  
193°C/W  
D14A  
THERMAL METRIC(1)  
UNIT  
14 PINS  
126°C/W  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
4
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Product Folder Links: LM6152 LM6154  
LM6152, LM6154  
www.ti.com  
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
6.5 5.0 V DC Electrical Characteristics  
Unless otherwise specified, all limits are ensured for V+ = 5.0V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface  
limits apply at the temperature extremes.  
LM6154BC  
LM6152AC  
PARAMETER  
TEST CONDITIONS  
TYP(1)  
LM6152BC  
LIMIT(2)  
UNIT  
LIMIT(2)  
VOS  
Input Offset Voltage  
2
4
5
7
mV  
max  
0.54  
TCVOS  
IB  
Input Offset Voltage Average Drift  
Input Bias Current  
10  
µV/°C  
0V ≤ VCM ≤ 5V  
500  
750  
980  
1500  
980  
1500  
nA max  
IOS  
Input Offset Current  
32  
40  
100  
160  
100  
160  
nA max  
RIN  
Input Resistance, CM  
0V ≤ VCM ≤ 4V  
0V ≤ VCM ≤ 4V  
0V ≤ VCM ≤ 5V  
5V ≤ V+ ≤ 24V  
30  
94  
84  
MΩ  
CMRR  
Common Mode Rejection Ratio  
70  
60  
70  
60  
dB  
min  
PSRR  
VCM  
Power Supply Rejection Ratio  
dB  
min  
91  
80  
80  
Input Common-Mode Voltage Range  
Low  
−0.25  
0
0
V
V
High  
5.25  
5.0  
5.0  
AV  
VO  
Large Signal Voltage Gain  
Output Swing  
RL = 10 kΩ  
V/mV  
min  
214  
0.006  
4.992  
0.04  
50  
50  
RL = 100 kΩ  
RL = 2 kΩ  
Sourcing  
0.02  
0.03  
0.02  
0.03  
V
max  
4.97  
4.96  
4.97  
4.96  
V
min  
0.10  
0.12  
0.10  
0.12  
V
max  
4.80  
4.70  
4.80  
4.70  
V
min  
4.89  
ISC  
Output Short Circuit Current  
3
2.5  
3
2.5  
mA  
min  
6.2  
27  
27  
mA  
17  
17  
max  
Sinking  
7
5
7
5
mA  
min  
16.9  
1.4  
mA  
max  
40  
40  
IS  
Supply Current  
Per Amplifier  
2
2.25  
2
2.25  
mA  
max  
(1) Typical Values represent the most likely parametric norm.  
(2) All limits are specified by testing or statistical analysis.  
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6.6 5.0 V AC Electrical Characteristics  
Unless otherwise specified, all limits ensured for V+ = 5.0V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits  
apply at the temperature extremes.  
LM6154BC  
LM6152AC  
PARAMETER  
Slew Rate  
TEST CONDITIONS  
TYP(1)  
LM6152BC  
LIMIT(2)  
UNIT  
LIMIT(2)  
SR  
±4V Step @ VS = ±6V,  
RS < 1 kΩ  
24  
24  
V/µs  
min  
30  
15  
15  
GBW  
Gain-Bandwidth Product  
Amp-to-Amp Isolation  
f = 100 kHz  
RL = 10 kΩ  
f = 1 kHz  
75  
125  
9
MHz  
dB  
en  
Input-Referred Voltage Noise  
Input-Referred Current Noise  
Total Harmonic Distortion  
nV/√Hz  
pA/√Hz  
dBc  
in  
f = 1 kHz  
0.34  
T.H.D  
f = 100 kHz, RL = 10 kΩ  
AV = −1, VO = 2.5 VPP  
−65  
ts  
Settling Time  
2V Step to 0.01%  
1.1  
µs  
(1) Typical Values represent the most likely parametric norm.  
(2) All limits are specified by testing or statistical analysis.  
6
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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
6.7 2.7 V DC Electrical Characteristics  
Unless otherwise specified, all limits are ensured for V+ = 2.7V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface  
limits apply at the temperature extremes.  
LM6154BC  
LM6152AC  
PARAMETER  
TEST CONDITIONS  
TYP(1)  
LM6152BC  
LIMIT(2)  
UNIT  
LIMIT(2)  
VOS  
Input Offset Voltage  
2
5
5
8
mV  
max  
0.8  
TCVOS  
IB  
Input Offset Voltage Average Drift  
Input Bias Current  
10  
500  
50  
µV/°C  
nA  
IOS  
Input Offset Current  
nA  
RIN  
Input Resistance, CM  
0V ≤ VCM ≤ 1.8V  
30  
MΩ  
CMRR  
Common Mode Rejection Ratio  
0V ≤ VCM ≤ 1.8V  
0V ≤ VCM ≤ 2.7V  
3V ≤ V+ ≤ 5V  
Low  
88  
dB  
78  
PSRR  
VCM  
Power Supply Rejection Ratio  
69  
dB  
V
Input Common-Mode Voltage Range  
−0.25  
2.95  
5.5  
0
0
High  
2.7  
2.7  
V
AV  
VO  
Large Signal Voltage Gain  
Output Swing  
RL = 10 kΩ  
RL = 10 kΩ  
V/mV  
0.07  
0.11  
0.07  
0.11  
V
max  
0.032  
2.64  
2.62  
2.64  
2.62  
V
min  
2.68  
1.35  
IS  
Supply Current  
Per Amplifier  
mA  
(1) Typical Values represent the most likely parametric norm.  
(2) All limits are specified by testing or statistical analysis.  
6.8 2.7 V AC Electrical Characteristics  
Unless otherwise specified, all limits are ensured for V+ = 2.7V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface  
limits apply at the temperature extremes.  
LM6154BC  
LM6152AC  
PARAMETER  
TEST CONDITIONS  
f = 100 kHz  
TYP(1)  
LM6152BC  
LIMIT(2)  
UNIT  
LIMIT(2)  
GBW  
Gain-Bandwidth Product  
80  
MHz  
(1) Typical Values represent the most likely parametric norm.  
(2) All limits are specified by testing or statistical analysis.  
Copyright © 1999–2014, Texas Instruments Incorporated  
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6.9 24 V DC Electrical Characteristics  
Unless otherwise specified, all limits are ensured for V+ = 24V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface  
limits apply at the temperature extremes.  
LM6154BC  
LM6152AC  
PARAMETER  
TEST CONDITIONS  
TYP(1)  
LM6152BC  
LIMIT(2)  
UNIT  
LIMIT(2)  
VOS  
Input Offset Voltage  
2
4
7
9
mV  
max  
0.3  
TCVOS  
IB  
Input Offset Voltage Average Drift  
Input Bias Current  
10  
500  
32  
µV/°C  
nA  
IOS  
Input Offset Current  
nA  
RIN  
Input Resistance, CM  
0V ≤ VCM ≤ 23V  
60  
Meg Ω  
CMRR  
Common Mode Rejection Ratio  
0V ≤ VCM ≤ 23V  
0V ≤ VCM ≤ 24V  
0V ≤ VCM ≤ 24V  
Low  
94  
dB  
84  
PSRR  
VCM  
Power Supply Rejection Ratio  
95  
dB  
V
Input Common-Mode Voltage Range  
−0.25  
24.25  
55  
0
0
High  
24  
24  
V
AV  
VO  
Large Signal Voltage Gain  
Output Swing  
RL = 10 kΩ  
RL = 10 kΩ  
V/mV  
0.075  
0.090  
0.075  
0.090  
V
max  
0.044  
23.91  
1.6  
23.8  
23.7  
23.8  
23.7  
V
min  
IS  
Supply Current  
Per Amplifier  
2.25  
2.50  
2.25  
2.50  
mA  
max  
(1) Typical Values represent the most likely parametric norm.  
(2) All limits are specified by testing or statistical analysis.  
6.10 24 V AC Electrical Characteristics  
Unless otherwise specified, all limits are ensured for V+ = 24V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface  
limits apply at the temperature extremes.  
LM6154BC  
LM6152AC  
PARAMETER  
TEST CONDITIONS  
TYP(1)  
LM6152BC  
LIMIT(2)  
UNIT  
LIMIT(2)  
GBW  
Gain-Bandwidth Product  
f = 100 kHz  
80  
MHz  
(1) Typical Values represent the most likely parametric norm.  
(2) All limits are specified by testing or statistical analysis.  
8
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6.11 Typical Performance Characteristics  
Figure 1. Supply Current vs. Supply Voltage  
Figure 2. Offset Voltage vs. Supply voltage  
Figure 3. Bias Current vs. Supply voltage  
Figure 4. Bias Current vs. VCM  
Figure 5. Bias Current vs. VCM  
Figure 6. Bias Current vs. VCM  
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Typical Performance Characteristics (continued)  
Figure 7. Output Voltage vs. Source Current  
Figure 8. Output Voltage vs. Source Current  
Figure 9. Output Voltage vs. Source Current  
Figure 10. Output Voltage vs. Sink Current  
Figure 11. Output Voltage vs. Sink Current  
Figure 12. Output Voltage vs. Sink Current  
10  
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Typical Performance Characteristics (continued)  
Figure 13. Crosstalk (dB) vs. Frequency  
Figure 14. GBWP (@ 100 kHz) vs. Supply Voltage  
Figure 15. Unity Gain Frequency vs. Supply Voltage  
for Various Loads  
Figure 16. CMRR  
Figure 17. Voltage Swing vs. Frequency  
(CL = 100 pF)  
Figure 18. PSRR vs. Frequency  
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Typical Performance Characteristics (continued)  
Figure 19. Open Loop Gain/Phase  
(VS = 5V)  
Figure 20. Open Loop Gain/Phase  
(VS = 10V)  
Figure 21. Open Loop Gain/Phase  
(VS = 24V)  
Figure 22. Noise Voltage vs. Frequency  
Figure 23. Noise Current vs. Frequency  
Figure 24. Voltage Error vs. Settle Time  
12  
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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
Typical Performance Characteristics (continued)  
0
V
A
V
= ±5V  
= -1  
S
-10  
-20  
V
= 5 V  
IN  
PP  
THD  
HD2  
R
L
= 10 k:  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
HD3  
-100  
100k  
1M  
FREQUENCY (Hz)  
Figure 25. Distortion vs. Frequency  
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7 Application and Implementation  
The LM6152/LM6154 is ideally suited for operation with about 10 kΩ (Feedback Resistor, RF) between the output  
and the negative input terminal.  
With RF set to this value, for most applications requiring a close loop gain of 10 or less, an additional small  
compensation capacitor (CF) (see Figure 26) is recommended across RF in order to achieve a reasonable  
overshoot (10%) at the output by compensating for stray capacitance across the inputs.  
The optimum value for CF can best be established experimentally with a trimmer cap in place since its value is  
dependant on the supply voltage, output driving load, and the operating gain. Below, some typical values used in  
an inverting configuration and driving a 10 kΩ load have been tabulated for reference:  
Table 1. Typical BW (−3 dB) at Various  
Supply Voltage and Gains  
VS  
Volts  
CF  
pF  
BW (−3 dB)  
GAIN  
MHz  
−1  
−10  
−100  
−1  
5.6  
6.8  
4
3
1.97  
0.797  
6.6  
None  
2.2  
24  
−10  
−100  
4.7  
2.2  
None  
0.962  
In the non-inverting configuration, the LM6152/LM6154 can be used for closed loop gains of +2 and above. In  
this case, also, the compensation capacitor (CF) is recommended across RF (= 10 kΩ) for gains of 10 or less.  
Figure 26. Typical Inverting Gain Circuit AV = −1  
Because of the unique structure of this amplifier, when used at low closed loop gains, the realizable BW will be  
much less than the GBW product would suggest.  
The LM6152/LM6154 brings a new level of ease of use to op amp system design.  
The greater than rail-to-rail input voltage range eliminates concern over exceeding the common-mode voltage  
range. The rail-to-rail output swing provides the maximum possible dynamic range at the output. This is  
particularly important when operating on low supply voltages.  
The high gain-bandwidth with low supply current opens new battery powered applications where higher power  
consumption previously reduced battery life to unacceptable levels.  
The ability to drive large capacitive loads without oscillating functional removes this common problem.  
To take advantage of these features, some ideas should be kept in mind.  
The LM6152/LM6154, capacitive loads do not lead to oscillations, in all but the most extreme conditions, but they  
will result in reduced bandwidth. They also cause increased settling time.  
14  
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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
Unlike most bipolar op amps, the unique phase reversal prevention/speed-up circuit in the input stage, causes  
the slew rate to be very much a function of the input pulse amplitude. This results in a 10 to 1 increase in slew  
rate when the differential input signal increases. Large fast pulses will raise the slew-rate to more than 30 V/µs.  
Figure 27. Slew Rate vs. VDIFF  
The speed-up action adds stability to the system when driving large capacitive loads.  
A conventional op amp exhibits a fixed maximum slew-rate even though the differential input voltage rises due to  
the lagging output voltage. In the LM6152/LM6154, increasing lag causes the differential input voltage to  
increase but as it does, the increased slew-rate keeps the output following the input much better. This effectively  
reduces phase lag. As a result, the LM6152/LM6154 can drive capacitive loads as large as 470 pF at gain of 2  
and above, and not oscillate.  
Capacitive loads decrease the phase margin of all op amps. This can lead to overshoot, ringing and oscillation.  
This is caused by the output resistance of the amplifier and the load capacitance forming an R-C phase shift  
network. The LM6152/6154 senses this phase shift and partly compensates for this effect.  
Copyright © 1999–2014, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Links: LM6152 LM6154  
LM6152, LM6154  
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014  
www.ti.com  
8 Device and Documentation Support  
8.1 Related Links  
The table below lists quick access links. Categories include technical documents, support and community  
resources, tools and software, and quick access to sample or buy.  
Table 2. Related Links  
TECHNICAL  
DOCUMENTS  
TOOLS &  
SOFTWARE  
SUPPORT &  
COMMUNITY  
PARTS  
PRODUCT FOLDER  
SAMPLE & BUY  
LM6152  
LM6154  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
8.2 Trademarks  
All trademarks are the property of their respective owners.  
8.3 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
8.4 Glossary  
SLYZ022 — TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
9 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
16  
Submit Documentation Feedback  
Copyright © 1999–2014, Texas Instruments Incorporated  
Product Folder Links: LM6152 LM6154  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Oct-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM6152ACM  
LM6152ACM/NOPB  
LM6152ACMX/NOPB  
LM6152BCM/NOPB  
LM6152BCMX/NOPB  
LM6154BCM  
NRND  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
8
8
95  
Non-RoHS  
& Green  
Call TI  
Level-1-235C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-235C-UNLIM  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
LM61  
52ACM  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
95  
RoHS & Green  
SN  
SN  
LM61  
52ACM  
Samples  
Samples  
Samples  
Samples  
8
2500 RoHS & Green  
95 RoHS & Green  
2500 RoHS & Green  
LM61  
52ACM  
8
SN  
LM61  
52BCM  
8
SN  
LM61  
52BCM  
14  
55  
55  
Non-RoHS  
& Green  
Call TI  
LM6154BCM  
LM6154BCM/NOPB  
LM6154BCMX/NOPB  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
LM6154BCM  
LM6154BCM  
Samples  
Samples  
2500 RoHS & Green  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Oct-2022  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM6152ACMX/NOPB  
LM6152BCMX/NOPB  
LM6154BCMX/NOPB  
SOIC  
SOIC  
SOIC  
D
D
D
8
8
2500  
2500  
2500  
330.0  
330.0  
330.0  
12.4  
12.4  
16.4  
6.5  
6.5  
6.5  
5.4  
5.4  
2.0  
2.0  
2.3  
8.0  
8.0  
8.0  
12.0  
12.0  
16.0  
Q1  
Q1  
Q1  
14  
9.35  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM6152ACMX/NOPB  
LM6152BCMX/NOPB  
LM6154BCMX/NOPB  
SOIC  
SOIC  
SOIC  
D
D
D
8
8
2500  
2500  
2500  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
14  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jan-2022  
TUBE  
*All dimensions are nominal  
Device  
Package Name Package Type  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
LM6152ACM  
LM6152ACM  
D
D
D
D
D
D
D
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
8
8
95  
95  
95  
95  
55  
55  
55  
495  
495  
495  
495  
495  
495  
495  
8
8
8
8
8
8
8
4064  
4064  
4064  
4064  
4064  
4064  
4064  
3.05  
3.05  
3.05  
3.05  
3.05  
3.05  
3.05  
LM6152ACM/NOPB  
LM6152BCM/NOPB  
LM6154BCM  
8
8
14  
14  
14  
LM6154BCM  
LM6154BCM/NOPB  
Pack Materials-Page 3  
PACKAGE OUTLINE  
D0008A  
SOIC - 1.75 mm max height  
SCALE 2.800  
SMALL OUTLINE INTEGRATED CIRCUIT  
C
SEATING PLANE  
.228-.244 TYP  
[5.80-6.19]  
.004 [0.1] C  
A
PIN 1 ID AREA  
6X .050  
[1.27]  
8
1
2X  
.189-.197  
[4.81-5.00]  
NOTE 3  
.150  
[3.81]  
4X (0 -15 )  
4
5
8X .012-.020  
[0.31-0.51]  
B
.150-.157  
[3.81-3.98]  
NOTE 4  
.069 MAX  
[1.75]  
.010 [0.25]  
C A B  
.005-.010 TYP  
[0.13-0.25]  
4X (0 -15 )  
SEE DETAIL A  
.010  
[0.25]  
.004-.010  
[0.11-0.25]  
0 - 8  
.016-.050  
[0.41-1.27]  
DETAIL A  
TYPICAL  
(.041)  
[1.04]  
4214825/C 02/2019  
NOTES:  
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.  
Dimensioning and tolerancing per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed .006 [0.15] per side.  
4. This dimension does not include interlead flash.  
5. Reference JEDEC registration MS-012, variation AA.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
D0008A  
SOIC - 1.75 mm max height  
SMALL OUTLINE INTEGRATED CIRCUIT  
8X (.061 )  
[1.55]  
SYMM  
SEE  
DETAILS  
1
8
8X (.024)  
[0.6]  
SYMM  
(R.002 ) TYP  
[0.05]  
5
4
6X (.050 )  
[1.27]  
(.213)  
[5.4]  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:8X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED  
METAL  
EXPOSED  
METAL  
.0028 MAX  
[0.07]  
.0028 MIN  
[0.07]  
ALL AROUND  
ALL AROUND  
SOLDER MASK  
DEFINED  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4214825/C 02/2019  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
D0008A  
SOIC - 1.75 mm max height  
SMALL OUTLINE INTEGRATED CIRCUIT  
8X (.061 )  
[1.55]  
SYMM  
1
8
8X (.024)  
[0.6]  
SYMM  
(R.002 ) TYP  
[0.05]  
5
4
6X (.050 )  
[1.27]  
(.213)  
[5.4]  
SOLDER PASTE EXAMPLE  
BASED ON .005 INCH [0.125 MM] THICK STENCIL  
SCALE:8X  
4214825/C 02/2019  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
TI products.  
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022, Texas Instruments Incorporated  

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