LM76003 [TI]
3.5V 至 60V、3.5A 同步降压转换器;型号: | LM76003 |
厂家: | TEXAS INSTRUMENTS |
描述: | 3.5V 至 60V、3.5A 同步降压转换器 转换器 |
文件: | 总56页 (文件大小:3301K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
LM76002/LM76003 3.5V 至 60V、2.5A/3.5A 同步
降压稳压器
1 特性
2 应用
1
•
•
•
集成同步整流
•
•
•
•
电信基础设施
输入电压 3.5V 至 60V(最大值 65V)
资产和机群管理系统
视频监控
输出电流:
可编程逻辑控制器
–
–
LM76002:2.5A
LM76003:3.5A
3 说明
•
•
•
输出电压 1V 至 95% VIN
稳压静态电流 15µA
宽电压转换范围
LM76002/LM76003 稳压器是一款易于使用的同步降压
直流/直流转换器,能驱动高达 2.5A (LM76002) 或
3.5A (LM76003) 的负载电流,输入电压最高可达
60V。LM76002/LM76003 解决方案尺寸极小,但能提
供优异的效率和输出精度。采用峰值电流模式控制。可
调 特性 (例如可调开关频率、同步、FPWM 选项、电
源正常状态标志、精密使能端、可调式软启动和跟踪)
可为各种应用提供灵活且简单易用的 解决方案。轻负
载时的自动频率折返和可选的外部偏置电源可以提高效
率。该器件需要极少的外部组件,其引脚专为简化
PCB 布局而设计,可提供优异的 EMI (CISPR22) 和热
性能。保护 功能 包括输入欠压锁定、热关断、逐周期
电流限制和短路保护。LM76002/LM76003 器件采用
WQFN 30 引脚无引线式封装,且具有可湿性侧面。
–
–
tON-MIN = 65ns(典型值)
tOFF-MIN = 95ns(典型值)
•
系统级 特性
–
–
–
–
–
与外部时钟保持同步
电源正常状态标志
精密使能端
可调软启动(默认为 6.3ms)
电压跟踪功能
•
•
•
•
引脚可选式 FPWM 运行
可调频率范围:300kHz 至 2.2MHz
在轻负载架构下实现高效率 (PFM)
保护 功能
器件信息(1)
–
–
–
逐周期电流限制
器件型号
LM76002
LM76003
封装
封装尺寸(标称值)
具有断续模式的短路保护
过热关断保护
使用 LM76002/LM76003 并借助 WEBENCH® 电源
WQFN (30)
6.00mm × 4.00mm
•
设计器创建定制设计方案
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
空白
简化原理图
效率与输出电流
(VOUT = 5V,fSW = 400kHz,自动模式)
BOOT
SW
PVIN
EN
VIN
100
90
80
70
60
50
40
CBOOT
CIN
VOUT
COUT
L
PGND
LM76003
SS/TRK
RT
BIAS
30
RFBT
VIN = 8 V
VIN = 12 V
20
SYNC/MODE
VIN = 13.5 V
VIN = 24 V
FB
10
0
VCC
RFBB
AGND
0.001
0.01
0.1
Load Current (A)
1
5
CVCC
D034
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNVSAK0
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
目录
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 22
Application and Implementation ........................ 24
8.1 Application Information............................................ 24
8.2 Typical Applications ............................................... 24
Power Supply Recommendations...................... 42
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 Timing Characteristics............................................... 8
6.7 Switching Characteristics.......................................... 8
6.8 System Characteristics ............................................. 9
6.9 Typical Characteristics............................................ 10
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
8
9
10 Layout................................................................... 42
10.1 Layout Guidelines ................................................. 42
10.2 Layout Example .................................................... 45
10.3 Thermal Design..................................................... 46
11 器件和文档支持 ..................................................... 47
11.1 器件支持................................................................ 47
11.2 接收文档更新通知 ................................................. 47
11.3 支持资源................................................................ 47
11.4 商标....................................................................... 47
11.5 静电放电警告......................................................... 47
11.6 Glossary................................................................ 47
12 机械、封装和可订购信息....................................... 47
7
4 修订历史记录
Changes from Original (October 2018) to Revision A
Page
•
•
•
•
•
•
Deleted "Operating" from "Junction temperature row" in Abs Max ...................................................................................... 5
Deleted Operating junction temperature, TJ, from ROC table................................................................................................ 5
Changed 图 17 ..................................................................................................................................................................... 18
Updated Power Good and Overvoltage Protection (PGOOD) section................................................................................. 20
Updated Power Good description......................................................................................................................................... 20
Updated title of component selection table. ......................................................................................................................... 25
2
Copyright © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
5 Pin Configuration and Functions
RNP Package
30-Pin WQFN
Top View
NC
NC
NC
30
NC
29
28
27
26 PGND
SW
SW
SW
1
2
3
4
5
25
24
23
22
PGND
PGND
NC
SW
SW
PVIN
PVIN
BOOT
21
20
19
18
6
7
DAP
NC
VCC
PVIN
NC
8
BIAS
9
EN
17 SYNC/MODE
16 PGOOD
RT
10
11
SS/TRK
13
14
15
12
FB
AGND AGND AGND
Copyright © 2017–2019, Texas Instruments Incorporated
3
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
Pin Functions
PIN
I/O(1)
DESCRIPTION
NO.
NAME
Switching output of the regulator. Internally connected to source of the HS FET and drain of
the LS FET. Connect to power inductor and boot-strap capacitor.
1, 2, 3, 4, 5
SW
P
P
Boot-strap capacitor connection for high-side driver. Connect a high-quality 470-nF
capacitor from this pin to the SW pin.
6
BOOT
NC
7, 19, 23, 27,
28, 29, 30
Not internally connected. Connect to ground copper on PCB to improve heat-sinking of the
device and board level reliability.
—
Output of internal bias supply. Used as supply to internal control circuits. Connect a high-
quality 2.2-µF capacitor from this pin to GND. TI does not recommended loading this pin by
external circuitry.
8
VCC
P
Optional BIAS LDO supply input. TI recommends tying this to VOUT when 3.3 V ≤ VOUT ≤ 18
V, or tying to an external 3.3-V or 5-V rail if available, to improve efficiency. When used,
place a 1-µF capacitor from this terminal to ground. Tie to ground when not in use.
9
BIAS
RT
P
A
Switching frequency setting pin. Place a resistor from this pin to ground to set the switching
frequency. If floating, the default switching frequency is 500 kHz. Do not short to ground.
10
Soft-start-control pin. Leave this pin floating to use the 6.3-ms internal soft-start ramp. An
external capacitor can be connected from this pin to ground to extend the soft-start time. A
2-µA current sourced from this pin can charge the capacitor to provide the ramp. Connect
to external ramp for tracking. Do not short to ground.
11
SS/TRK
A
Feedback input for output voltage regulation. Connect a resistor divider to set the output
voltage. Never short this terminal to ground during operation.
12
16
FB
A
A
Open-drain power-good flag output. Connect to suitable voltage supply through a current
limiting resistor. High = VOUT regulation OK, Low = VOUT regulation fault. PGOOD = Low
when EN = Low.
PGOOD
Synchronization input and mode setting pin. Do not float, tie to ground if not used. Tie to
ground: DCM/PFM operation under light loads, improved efficiency; tie to logic high: forced
PWM under light loads, constant switching frequency over load; tie to external clock source:
synchronize switching action to the clock, forced PWM under light loads. Triggers on the
rising edge of external clock.
17
SYNC/MODE
A
Precision-enable input to regulator. Do not float. High = on, Low = off. Can be tied to VIN
Precision-enable input allows adjustable UVLO by external resistor divider.
.
18
EN
A
Analog ground. Ground reference for internal references and logic. All electrical parameters
are measured with respect to this pin. Connect to system ground on PCB.
13, 14, 15
AGND
G
Supply input to internal bias LDO and HS FET. Connect to input supply and input bypass
capacitors CIN. CIN must be placed right next to this pin and PGND and connected with
short traces.
20, 21, 22
24, 25, 26
EP
PVIN
PGND
DAP
P
G
Power ground, connected to the source of LS FET internally. Connect to system ground,
DAP/EP, AGND, ground side of CIN and COUT. Path to CIN must be as short as possible.
Low impedance connection to AGND. Connect to system ground on PCB. Major heat
dissipation path for the die. Must be used for heat sinking by soldering to ground copper on
PCB. Thermal vias are preferred.
—
(1) A = Analog, O = Output, I = Input, G = Ground, P = Power
4
Copyright © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range of –40°C to +125°C (unless otherwise noted)(1)
PARAMETER
MIN
–0.3
–0.3
–0.3
–0.1
–0.3
–0.3
–0.3
–0.3
–3.5
–0.3
–0.3
–40
MAX
UNIT
PVIN to PGND
EN to AGND
65
VIN + 0.3
FB, RT, SS/TRK to AGND
PGOOD to AGND
SYNC to AGND
5
Input voltages
20
V
5.5
BIAS to AGND
Lower of (VIN + 0.3) or 30
AGND to PGND
0.3
VIN + 0.3
65
SW to PGND
SW to PGND less than 10-ns transients
BOOT to SW
Output voltages
V
5.5
VCC to AGND
5.5
Junction temperature, TJ
Storage temperature, Tstg
150
°C
°C
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended
OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
60
UNIT
PVIN to PGND
3.5
0
EN
VIN
4.5
18
FB
0
PGOOD
0
Input voltages
V
BIAS input not used
0
0.3
Lower of (VIN
+
BIAS input used
AGND to PGND
0
0.3) or 24
–0.1
0.1
95% of VIN
2.5
Output voltage VOUT
IOUT, LM76002
IOUT, LM76003
1
0
0
V
A
Output current
3.5
(1) Recommended operating rating indicate conditions for which the device is intended to be functional, but do not ensure specific
performance limits. For ensured specifications, see Electrical Characteristics .
Copyright © 2017–2019, Texas Instruments Incorporated
5
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
6.4 Thermal Information
LM76002/LM76003
THERMAL METRIC(1)
RNP (WQFN)
UNIT
30 PINS
29.6
17.6
9.1
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ψJB
9.0
RθJC(bot)
1.0
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated.
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following
conditions apply: VIN= 24 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY VOLTAGE (PVIN PINS)
Operating input voltage
range
VIN
3.5
60
10
12
V
VEN = 0 V
TJ = 25℃
Shutdown quiescent current;
ISD
1.2
0.9
µA
µA
measured at PVIN pin(1)
Operating quiescent current VEN = 2 V, VFB = 1.5 V, VBIAS = 3.3 V
from VIN (non-switching)
IQ_NONSW
external
ENABLE (EN PIN)
Enable input high level for
VCC output
VEN_VCC_H
VEN_VCC_L
VEN_VOUT_H
VEN rising
1.2
V
V
V
Enable input low level for
VCC output
VEN falling
0.3
Enable input high level for
VOUT
VEN rising
1.14
1.204
1.25
200
Enable input hysteresis for
VOUT
VEN_VOUT_HYS
VEN falling hysteresis
–150
1.4
mV
nA
ILKG_EN
Enable input leakage current VEN = 2 V
INTERNAL LDO (VCC PIN, BIAS PIN)
PWM operation
PFM operation
VCC rising
3.29
3.1
V
V
VCC
Internal VCC voltage
2.96
3.14
–565
3.11
–63
3.27
3.25
V
Internal VCC undervoltage
lockout
VCC_UVLO
VCC falling hysteresis
VBIAS rising
mV
V
VBIAS_ON
Input changeover
VBIAS falling hysteresis
mV
Operating quiescent current
from external VBIAS (non-
switching)
VEN = 2 V, VFB = 1.5 V, VBIAS = 3.3 V
external
IBIAS_NONSW
21
50
µA
VOLTAGE REFERENCE (FB PIN)
VFB
Feedback voltage
PWM mode
VFB = 1 V
0.987
1.006
0.2
1.017
60
V
Input leakage current at FB
pin
ILKG_FB
nA
(1) Shutdown current includes leakage current ofthe switching transistors.
6
Copyright © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Electrical Characteristics (continued)
Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated.
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following
conditions apply: VIN= 24 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
HIGH SIDE DRIVER (BOOT PIN)
BOOT - SW undervoltage
lockout
VBOOT_UVLO
1.6
2.2
2.7
V
CURRENT LIMITS AND HICCUP
LM76002
LM76003
LM76002
LM76003
LM76002
LM76003
3.2
4.35
2.3
4.2
5.5
5.3
6.8
4.2
5.3
Short-circuit, high-side
current limit
(2)
IHS_LIMIT
A
A
A
3.2
(2)
ILS_LIMIT
Low-side current limit
Negative current limit
3.4
4.2
–2.5
–3.3
0.42
0.05
INEG_LIMIT
VHICCUP
IL_ZC
Hiccup threshold on FB pin
Zero cross-current limit
0.38
1.8
0.46
2.2
V
A
SOFT START (SS/TRK PIN)
ISSC
Soft-start charge current
2
2
µA
Soft-start discharge
resistance
RSSD
UVLO, TSD, OCP; or EN = 0 V
kΩ
POWER GOOD (PGOOD PIN) and OVERVOLTAGE PROTECTION
Power-good overvoltage
threshold
VPGOOD_OV
% of FB voltage
106%
86%
110%
113%
93%
Power-good undervoltage
threshold
VPGOOD_UV
% of FB voltage
% of FB voltage
90%
2.5%
1.3
VPGOOD_HYS
VPGOOD_VALID
Power-good hysteresis
Minimum input voltage for
proper PGOOD function
50-µA pullup to PGOOD pin, VEN = 0 V,
TJ = 25°C
2
V
VEN = 2.5 V
VEN = 0 V
40
30
100
90
RPGOOD
Power-good on-resistance
Ω
MOSFETS
High-side MOSFET on-
resistance
(3)
RDS_ON_HS
IOUT = 1 A, VBIAS = VOUT = 3.3 V
IOUT = 1 A, VBIAS = VOUT = 3.3 V
95
45
150
85
mΩ
mΩ
Low-side MOSFET on-
resistance
(3)
RDS_ON_LS
THERMAL SHUTDOWN
Thermal shutdown threshold Shutdown threshold
Recovery threshold
160
135
(4)
TSD
°C
(2) This current limit was measured as the internal comparator trip point. Due to inherent delays in the current limit comparator and drivers,
the peak current limit measured in closed loop with faster slew rate will be larger, and valley current limit will be lower.
(3) Measured at pins.
(4) Ensured by design.
Copyright © 2017–2019, Texas Instruments Incorporated
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LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
6.6 Timing Characteristics
MIN
NOM
MAX
UNIT
CURRENT LIMITS AND HICCUP
Number of switching cycles
before hiccup is tripped
(1)
NOC
128
46
Cycles
ms
Overcurrent hiccup retry delay
time
tOC
SOFT START (SS/TRK PIN)
CSS = OPEN, from EN rising
edge to PGOOD rising edge
tSS
Internal soft-start time
3.5
6.3
ms
POWER GOOD (PGOOD PIN) and OVERVOLTAGE PROTECTION
PGOOD rising edge deglitch
delay
tPGOOD_RISE
tPGOOD_FALL
80
80
140
140
200
200
µs
µs
PGOOD falling edge deglitch
delay
(1) Ensured by design.
6.7 Switching Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PWM LIMITS (SW PINS)
tON-MIN
tOFF-MIN
tON-MAX
Minimum switch on-time
Minimum switch off-time
Maximum switch on-time
65
95
8
95
130
ns
ns
µs
HS timeout in dropout
3.8
11.4
OSCILLATOR (RT and SYNC PINS)
fOSC Internal oscillator frequency
RT = Open
440
270
500
300
560
330
kHz
kHz
Minimum adjustable frequency by
RT or SYNC
RT =133 kΩ, 0.1%
fADJ
Maximum adjustable frequency by
RT or SYNC
RT = 17.4 kΩ, 0.1%
1980
0.4
2200
2420
2
VSYNC_HIGH
VSYNC_LOW
Sync input high level threshold
Sync input low level threshold
V
V
Mode input high level threshold for
FPWM
VMODE_HIGH
VMODE_LOW
tSYNC_MIN
0.42
0.4
80
V
V
Mode input low level threshold for
AUTO mode
Sync input minimum on- and off-
time
ns
8
Copyright © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
6.8 System Characteristics
The following specifications apply to the circuit found in the typical Simplified Schematic with appropriate modifications (see
表 2). These parameters are not tested in production and represent typical performance only. Unless otherwise stated the
following conditions apply: TA = 25°C, VIN = 24 V, VOUT = 3.3 V, fSW = 500 kHz.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output voltage offset at no load VIN = 3.8 V to 36 V, VSYNC = 0 V, auto mode
VFB_PFM
2%
in auto mode
IOUT = 0 A
Minimum input to output
Vdrop
voltage differential to maintain VOUT = 5 V, IOUT = 1.5 A, fSW = 2.2 MHz
specified accuracy
0.4
V
Operating quiescent current
(switching)
VEN = 3.3 V, IOUT = 0 A, RT = open, VBIAS
VOUT = 3.3 V, RFBT = 1 Meg
=
IQ_SW
15
0.5
0.7
µA
LM76002 :
VSYNC = 0 V, IOUT = 10 mA
IPEAK_MIN
Minimum inductor peak current
A
LM76003 :
VSYNC = 0 V, IOUT = 10 mA
fSW = 500 kHz, IOUT = 1 A
fSW = 2.2 MHz, IOUT = 1 A
While in frequency foldback
7
Operating quiescent current
from external VBIAS (switching)
IBIAS_SW
DMAX
tDEAD
mA
ns
25
Maximum switch duty cycle
97.5%
Dead time between high-side
and low-side MOSFETs
4
版权 © 2017–2019, Texas Instruments Incorporated
9
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
6.9 Typical Characteristics
Unless otherwise specified, VIN = 24 V. Curves represent most likely parametric norm at specified condition.
140
130
120
110
100
90
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
VIN = 24 V
VIN = 3.5 V
VIN = 60 V
80
70
800
700
60
50
600
500
40
400
300
HS Switch
LS Switch
30
20
200
-40
-20
0
20
40
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
Temperature (èC)
D001
D002
图 1. High-Side and Low-Side Switch RDS-ON
图 2. Shutdown Quiescent Current
1.008
1.007
1.006
1.005
1.004
1.003
1.002
1.001
1
6
5.5
5
Temp = -40èC
Temp = 25èC
Temp = 125èC
HS Limit
LS Limit
4.5
4
3.5
3
0
6
12
18
24
30
36
Input Voltage (V)
42
48
54
60
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
D003
D004
图 3. Feedback Voltage
图 4. LM76003 High-Side and Low-Side Current Limits
2500
5
4.5
4
HS Limit
LS Limit
2250
2000
1750
1500
1250
1000
750
FREQ = 300 kHz
FREQ = 1 MHz
FREQ = 2.2 MHz
3.5
3
500
2.5
250
2
0
-40
-20
0
20
40
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
Temperature (èC)
D005
D006
图 5. LM76002 High-Side and Low-Side Current Limits
图 6. Switching Frequency Set by RT Resistor
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Typical Characteristics (接下页)
Unless otherwise specified, VIN = 24 V. Curves represent most likely parametric norm at specified condition.
550
540
530
520
510
500
490
480
470
460
450
1.4
1.2
1
0.8
0.6
0.4
0.2
VEN_VOUT Rising
VEN_VOUT Falling
VEN_VCC Rising
VEN_VCC Falling
VIN = 12 V
VIN = 3.5 V
VIN = 60 V
-40
-20
0
20
40
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
Temperature (èC)
D007
D008
图 7. Switching Frequency With RT Open
图 8. Enable Threshold
115
110
105
100
95
OV Tripping
OV Recovery
UV Recovery
UV Tripping
90
85
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
D009
图 9. PGOOD Threshold
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7 Detailed Description
7.1 Overview
The LM76002/LM76003 regulator is an easy-to-use synchronous step-down DC-DC converter that operates from
3.5-V to 60-V supply voltage. The device is capable of delivering up to 2.5-A or 3.5-A DC load current with
exceptional efficiency and thermal performance in a very small solution size.
The LM76002/LM76003 employs fixed-frequency peak-current-mode control with configurable discontinuous
conduction mode (DCM) and pulse frequency modulation (PFM) mode at light load to achieve high efficiency
across the load range. The device can also be configured as forced-PWM (FPWM) operation to keep constant
switching frequency over the load range. The device is internally compensated, which reduces design time and
requires fewer external components. The switching frequency is programmable from 300 kHz to 2.2 MHz by an
external resistor. The LM76002/LM76003 is also capable of synchronization to an external clock operating within
the 300-kHz to 2.2-MHz frequency range. The wide switching frequency range allows the device to meet a wide
range of design requirements. It can be optimized to very small solution size with higher frequency or to very
high efficiency with lower switching frequency. It has very small minimum HS MOSFET on-time (tON-MIN) and
minimum off-time (tOFF-MIN) to provide wide range of voltage conversion. Automated frequency foldback is
employed under tON-MIN or tOFF-MIN condition to further extend the operation range.
The LM76002/LM76003 also features a power-good (PGOOD) flag, precision enable, internal or adjustable soft-
start rate, start-up with pre-bias voltage, and output voltage tracking. It provides a both flexible and easy-to-use
solution for wide range of applications. Protection features include thermal shutdown, VCC undervoltage lockout,
cycle-by-cycle current limiting, and short-circuit hiccup protection.
The family requires very few external components and has a pinout designed for simple, optimum PCB layout for
EMI and thermal performance. The LM76002/LM76003 device is available in a 30-pin WQFN lead-less package.
7.2 Functional Block Diagram
EN
VCC
BIAS
LDO
PVIN
ISSC
Internal
SS
VBOOT
Precision
Enable
BOOT
VCC
SS/TRK
HS I Sense
ICMD
+
EA
+
VBOOT
REF
œ
RC
CC
œ
+
UVLO
FB
UVLO
FB
OV/UV
Detector
SW
PFM
Detector
CONTROL LOGIC
PGood
PGOOD
TSD
HICCUP
Detector
+
œ
Slope Comp
Oscillator
CLK
LS I Sense
ICMD
AGND
FPWM
SYNC/
MODE
RT
PGND
12
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7.3 Feature Description
7.3.1 Fixed-Frequency, Peak-Current-Mode Control
The following operation description of the LM76002/LM76003 refers to the Functional Block Diagram and to the
waveforms in 图 10. The LM76002/LM76003 supplies a regulated output voltage by turning on the internal high
side (HS) and low side (LS) NMOS switches with varying duty cycle (D). During high-side switch on-time tON, the
SW pin voltage VSW swings up to approximately VIN, and the inductor current iL increase with linear slope. The
HS switch is off by the control logic. During the HS switch off-time, tOFF, the LS switch is turned on. Inductor
current discharges through the LS switch, which forces the VSW to swing below ground by the voltage drop
across the LS switch. The regulator loop adjusts the duty cycle to maintain a constant output voltage. The control
parameter of buck converter is defined as duty cycle D = tON / tSW. In an ideal buck converter, where losses are
ignored, D is proportional to the output voltage and inversely proportional to the input voltage: D = VOUT / VIN.
VSW
D = tON/ TSW
VIN
tON
tOFF
t
0
-VD
TSW
iL
ILPK
IOUT
ûiL
t
0
图 10. SW Node and Inductor Current Waveforms in
Continuous Conduction Mode
The LM76002/LM76003 synchronous buck converter employs peak current-mode control topology. A voltage-
feedback loop is used to get accurate DC-voltage regulation by adjusting the peak current command based on
voltage offset. The peak inductor current is sensed from the HS switch and compared to the peak current to
control the on-time of the HS switch. The voltage feedback loop is internally compensated, which allows
command for fewer external components, makes it easy to design, and provides stable operation with almost any
combination of output capacitors. The regulator operates with fixed switching frequency in continuous conduction
mode (CCM) and discontinuous conduction mode (DCM). At very light load, the LM76002/LM76003 operates in
PFM to maintain high efficiency, and the switching frequency decreases with reduced load current.
7.3.2 Light Load Operation Modes — PFM and FPWM
DCM operation is employed in the LM76002/LM76003 when the inductor current valley reaches zero. The
LM76002/LM76003 is in DCM when load current is less than half of the peak-to-peak inductor current ripple in
CCM. In DCM, the LS switch is turned off when the inductor current reaches zero. Switching loss is reduced by
turning off the LS FET at zero current, and the conduction loss is lowered by not allowing negative current
conduction. Power conversion efficiency is higher in DCM than CCM under the same conditions.
In DCM, the HS switch on-time reduces with lower load current. When either the minimum HS switch on-time
(tON-MIN) or the minimum peak inductor current (IPEAK-MIN) is reached, the switching frequency decreases to
maintain regulation. At this point, the LM76002/LM76003 operates in PFM. In PFM, switching frequency is
decreased by the control loop when load current reduces to maintain output voltage regulation. Switching loss is
further reduced in PFM operation due to less frequent switching actions.
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Feature Description (接下页)
In PFM operation, a small positive DC offset is required at the output voltage to activate the PFM detector. The
lower the frequency is in PFM, the more DC offset is needed at VOUT. See Typical Characteristics for typical DC
offset at very light load. If the DC offset on VOUT is not acceptable for a given application, TI recommends a static
load at output to reduce or eliminate the offset. Lowering values of the feedback divider RFBT and RFBB can also
serve as a static load. In conditions with low VIN and/or high frequency, the LM76002/LM76003 may not enter
PFM mode if the output voltage cannot be charged up to provide the trigger to activate the PFM detector. Once
the LM76002/LM76003 is operating in PFM mode at higher VIN, it remains in PFM operation when VIN is
reduced.
Alternatively, the device can run in a forced pulse-width-modulation (FPWM) mode where the switching
frequency does not lower with load, and no offset is added to affect the VOUT accuracy unless the minimum on-
time of the converter is reached.
7.3.3 Adjustable Output Voltage
The voltage regulation loop in the LM76002/LM76003 regulates the FB voltage to be the same as the internal
reference voltage. The output voltage of the LM76002/LM76003 is set by a resistor divider to program the ratio
from VOUT to VFB. The resistor divider is connected from the output node to ground with the mid-point connecting
to the FB pin.
V
OUT
R
FBT
FBB
FB
R
图 11. Output Voltage Setting
The voltage reference system produces a precise ±1% voltage reference over temperature. TI recommends
using divider resistors with 1% tolerance or better with temperature coefficient of 100 ppm or lower. Selection of
RFBT equal or lower than 100 kΩ is also recommended. RFBB can be calculated by 公式 1:
VFB
RFBB
=
RFBT
VOUT - VFB
(1)
Larger RFBT and RFBB values reduce the current that goes through the divider, thus helping to increase light load
efficiency. However, larger values also make the feedback path more susceptible to noise. If efficiency at very
light load is not critical in a certain application, TI recommends RFBT = 10 kΩ to 100 kΩ. If the resistor divider is
not connected properly, output voltage cannot be regulated because the feedback loop is broken. If the FB pin is
shorted to ground or disconnected, the output voltage is driven close to VIN because the regulator detects very
low voltage on the FB node. The load connected to VOUT could be damaged in this case. It is important to route
the feedback trace away from the noisy area of the PCB. For more layout recommendations, see Layout.
The minimum output voltage achievable equals VFB, with RFBB open. The maximum VOUT is limited by the
maximum duty cycle at a given frequency:
DMAX = 1 – (tOFF_MIN / TSW
)
where
•
•
tOFF_MIN is the minimum off time of the HS switch
TSW = 1 / fSW is the switching period
(2)
Ideally, without frequency foldback, VOUT_MAX = VIN_MIN × DMAX
Maximum output voltage with frequency foldback can be estimated using 公式 3:
tON_MAX
VOUT _MAX = V
ì
- IOUT
ì
R
(
+ DCR
)
IN_MIN
DS_ON_HS
tON_MAX + tOFF_MIN
(3)
14
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Feature Description (接下页)
7.3.4 Enable (EN Pin) and UVLO
System UVLO by EN and VCC_UVLO voltage on the EN pin (VEN) controls the ON/OFF functionality of the
LM76002/LM76003. Applying a voltage less than 0.3 V to the EN input shuts down the operation of the
LM76002/LM76003. In shutdown mode the quiescent current drops to typically 1.2 µA at VIN = 24 V.
The internal LDO output voltage VCC is turned on when VEN_VOUT_H is higher than 1.15 V. The
LM76002/LM76003 switching action and output regulation are enabled when VEN is greater than 1.204 V
(typical). The LM76002/LM76003 supplies regulated output voltage when enabled and output current up to 2.5
A/3.5 A. The EN pin is an input and cannot be open circuit or floating. The simplest way to enable the operation
of the LM76002/LM76003 is to connect the EN pin to PVIN pins directly. This allows self-start-up of the
LM76002/LM76003 when VIN is within the operation range.
Many applications may benefit from the employment of an enable divider RENT and RENB (see 图 12) to establish
a precision system UVLO level for the stage. System UVLO can be used for supplies operating from utility power
as well as battery power. It can be used for sequencing, ensuring reliable operation, or supply protection, such
as a battery. An external logic signal can also be used to drive EN input for system sequencing and protection.
VIN
RENT
ENABLE
RENB
图 12. VIN UVLO
With a selected RENT, the RENB can be calculated by:
VEN_ VOUT _H ì RENT
RENB
=
VIN_ON_H - VEN_VOUT_H
where
•
•
VIN_ON_H is the desired supply voltage threshold to turn on this device
VEN_VOUT_H could be taken from device data sheet
(4)
Note that the divider adds to supply quiescent current by VIN / (RENT + RENB). Small RENT and RENB values add
more quiescent current loss. However, large divider values make the node more sensitive to noise. RENT in the
hundreds of kΩ range is a good starting point.
7.3.5 Internal LDO, VCC UVLO, and Bias Input
The LM76002/LM76003 has an internal LDO generating VCC voltage for control circuitry and MOSFET drivers.
The nominal voltage for VCC is 3.29 V. The VCC pin must have a 1-µF to 4.7-µF bypass capacitor placed as
close as possible to the pin and properly grounded. Do not load or short the VCC pin to ground during operation.
Shorting the VCC pin to ground during operation may damage the device.
An UVLO prevents the LM76002/LM76003 from operating until the VCC voltage exceeds VCC_UVLO. The VCC_UVLO
threshold is 3.14 V and has approximately 575 mV of hysteresis, so the device operates until VCC drops below
2.575 V (typical). Hysteresis prevents the device from turning off during power up if VIN droops due to input
current demands.
The LDO can generate VCC from two inputs: the supply voltage VIN and the BIAS input. The LDO power loss is
calculated by ILDO × (VINLDO – VOUTLDO). The higher the difference between the input and output voltages of the
LDO, the more losses occur to supply the same LDO output current. The BIAS input is designed to reduce the
difference of the input and output voltages of the LDO to improve efficiency, especially at light load. TI
recommends tying the BIAS pin to VOUT when the output voltage is equal to or greater than 3.3 V. Tie the BIAS
pin to ground for applications less than 3.3 V. BIAS can also tie to external voltage source if available to improve
efficiency. When used, TI recommends a 1-µF to 10-µF high-quality ceramic capacitor be used to bypass the
BIAS pin to ground. If there is high-frequency noise or voltage spikes present on VOUT (during transient events or
fault conditions), TI recommends connecting a resistor (1 to 10 Ω) between VOUT and BIAS.
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Feature Description (接下页)
The VCC voltage is typically 3.27 V. When the LM76002/LM76003 is operating in PFM mode with frequency
foldback, VCC voltage is reduced to 3.1 V (typical) to further decrease the quiescent current and improve
efficiency at very light loads. 图 13 shows an example of VCC voltage change with mode change.
3.5
Auto Mode
FPWM Mode
3.4
3.3
3.2
3.1
3
2.9
2.8
2.7
2.6
2.5
0.001
0.01
0.1
Load Current (A)
1
5
D010
图 13. VCC Voltage Change With Mode Change
VCC voltage has an internal undervoltage lockout threshold, VCC_UVLO. When VCC voltage is higher than VCC_UVLO
rising threshold, the device is active and in normal operation if VEN > VEN_VOUT_H. If VCC voltage droops below
VCC_UVLO falling threshold, the VOUT is shut down.
7.3.6 Soft Start and Voltage Tracking (SS/TRK)
The LM76002/LM76003 has a flexible and easy-to-use start-up rate control pin: SS/TRK. The soft-start feature is
to prevent inrush current impacting the LM76002/LM76003, and its supply when power is first applied. Soft start
is achieved by slowly ramping up the target regulation voltage when the device is first enabled or powered up.
The simplest way to use the device is to leave the SS/TRK pin open circuit or floating. The LM76002/LM76003
employs the internal soft-start control ramp and starts up to the regulated output voltage in 6.3 ms typically. In
applications with a large amount of output capacitors, higher VOUT, or other special requirements, the soft-start
time can be extended by connecting an external capacitor CSS from SS/TRK pin to AGND. Extended soft-start
time further reduces the supply current required to charge up output capacitors and supply any output loading.
An internal current source (ISSC = 2.2 μA) charges CSS and generates a ramp from 0 V to VFB to control the
ramp-up rate of the output voltage. For a desired soft-start time tSS, the capacitance for CSS can be found by 公式
5:
16
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Feature Description (接下页)
CSS = ISSC × tSS
where
•
•
•
CSS = soft-start capacitor value (µF)
ISSC = soft-start charging current (µA)
tSS = desired soft-start time (s)
(5)
The soft-start capacitor CSS is discharged by an internal FET when VOUT is shut down by hiccup protection or
ENABLE = logic low. When a large CSS is applied, and EN is toggled low only for a short period of time, CSS may
not be fully discharged. The next soft-start ramp follows internal soft-start ramp before reaching the leftover
voltage on CSS and then follows the ramp programmed by CSS. If this is not acceptable for a certain application,
an R-C low-pass filter can be added to EN to slow down the shutting down of VCC, allowing more time to
discharge CSS
.
The LM76002/LM76003 is capable of start-up into pre-biased output conditions. When the inductor current
reaches zero, the LS switch is turned off to avoid negative current conduction. This operation mode is also called
diode emulation mode. It is built in by the DCM operation in light loads. With a pre-biased output voltage, the
LM76002/LM76003 waits until the soft-start ramp allows regulation above the pre-biased voltage and then follows
the soft-start ramp to the regulation level. When an external voltage ramp is applied to the SS/TRK pin, the
LM76002/LM76003 FB voltage follows the ramp if the ramp magnitude is lower than the internal soft-start ramp.
A resistor divider pair can be used on the external control ramp to the SS/TRK pin to program the tracking rate of
the output voltage. The final voltage detected by the SS/TRK pin must not fall below 1.2 V to avoid abnormal
operation
VOUT tracked to an external voltage ramp has the option of ramping up slower or faster than the internal voltage
ramp. VFB always follows the lower potential of the internal voltage ramp and the voltage on the SS/TRK pin. 图
14 shows resistive divider connection if external ramp tracking is desired.
EXT RAMP
RTRT
SS/TRK
RTRB
图 14. Soft-Start Tracking External Ramp
图 15 shows the case when VOUT ramps more slowly than the internal ramp, while 图 16 shows when VOUT
ramps faster than the internal ramp. Faster start-up time may result in inductor current tripping current protection
during start-up. Use with special care.
Enable
Internal SS Ramp
Ext Tracking Signal to SS pin
VOUT
图 15. Tracking With Longer Start-up Time Than The Internal Ramp
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Feature Description (接下页)
Enable
Internal SS Ramp
Ext Tracking Signal to SS pin
VOUT
图 16. Tracking With Shorter Start-up Time Than The Internal Ramp
The LM76002/LM76003 is capable of start-up into pre-biased output conditions. During start-up the device sets
the minimum inductor current to zero to avoid discharging a pre-biased load.
7.3.7 Adjustable Switching Frequency (RT) and Frequency Synchronization
The switching frequency of the LM76002/LM76003 can be programmed by the impedance RT from the RT pin to
ground. The frequency is inversely proportional to the RT resistance. The RT pin can be left floating, and the
LM76002/LM76003 operates at 500-kHz default switching frequency. The RT pin is not designed to be shorted to
ground.
For an desired frequency, RT can be found by:
38400
RT(kW) =
Frequency(kHz) - 14.33
(6)
120
110
100
90
80
70
60
50
40
30
20
10
200 400 600 800 1000 1200 1400 1600 1800 2000 2200
Frequency (kHz)
RT_F
图 17. Switching Frequency vs RT
表 1. Switching Frequency vs RT
SWITCHING FREQUENCY (kHz)
RT RESISTANCE (kΩ)
300
400
134.42
99.57
79.07
52.20
38.96
25.85
19.34
17.57
500
750
1000
1500
2000
2200
18
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The LM76002/LM76003 switching action can also be synchronized to an external clock from 300 kHz to 2.2 MHz.
TI recommends connecting an external clock to the SYNC pin with appropriate termination resistor. Ground the
SYNC pin if not used.
SYNC
EXT CLOCK
RTERM
图 18. Frequency Synchronization
The recommendations for the external clock include high level no lower than 2 V, low level no higher than 0.4 V,
duty cycle between 10% and 90%, and both positive and negative pulse width no shorter than 80 ns. When the
external clock fails at logic high or low, the LM76002/LM76003 switches at the frequency programmed by the RT
resistor after a time-out period. TI recommends connecting a resistor RT to the RT pin so that the internal
oscillator frequency is the same as the target clock frequency when the LM76002/LM76003 is synchronized to an
external clock. This allows the regulator to continue operating at approximately the same switching frequency if
the external clock fails.
The choice of switching frequency is usually a compromise between conversion efficiency and the size of the
circuit. Lower switching frequency implies reduced switching losses (including gate charge losses, switch
transition losses, etc.) and usually results in higher overall efficiency. However, higher switching frequency allows
use of smaller LC output filters and hence a more compact design. Lower inductance also helps transient
response (higher large signal slew rate of inductor current), and reduces the DCR loss. The optimal switching
frequency is usually a trade-off in a given application and thus needs to be determined on a case-by-case basis.
It is related to the input voltage, output voltage, most frequent load current level(s), external component choices,
and circuit size requirement. The choice of switching frequency may also be limited if an operating condition
triggers tON-MIN or tOFF-MIN
.
7.3.8 Minimum On-Time, Minimum Off-Time, and Frequency Foldback at Dropout Conditions
Minimum on-time, tON-MIN, is the smallest duration of time that the HS switch can be on. tON-MIN is typically 70 ns
in the LM76002/LM76003. Minimum off-time, tOFF-MIN, is the smallest duration that the HS switch can be off. tOFF-
is typically 100 ns in the LM76002/LM76003. In CCM operation, tON-MIN and tOFF-MIN limits the voltage
MIN
conversion range given a selected switching frequency. The minimum duty cycle allowed is:
DMIN = tON-MIN × fSW
(7)
And the maximum duty cycle allowed is:
DMAX = 1 – tOFF-MIN × fSW
(8)
Given fixed tON-MIN and tOFF-MIN, the higher the switching frequency the narrower the range of the allowed duty
cycle. In the LM76002/LM76003, frequency foldback scheme is employed to extend the maximum duty cycle
when tOFF-MIN is reached. The switching frequency decreases once longer duty cycle is needed under low VIN
conditions. The switching frequency can be decreased to approximately 1/10 of the programmed frequency by
RT or the synchronization clock. Such a wide range of frequency foldback allows the LM76002/LM76003 output
voltage to stay in regulation with a much lower supply voltage VIN. This leads to a lower effective dropout voltage.
See Typical Characteristics for more details.
Given an output voltage, the choice of the switching frequency affects the allowed input voltage range, solution
size and efficiency. The maximum operational supply voltage can be found by:
VIN_MAX = VOUT / (fSW × tON-MIN
)
(9)
At lower supply voltage, the switching frequency decreases once tOFF-MIN is tripped. The minimum VIN without
frequency foldback can be approximated by:
VIN_MIN = VOUT / (fSW × tOFF-MIN
)
(10)
Considering power losses in the system with heavy load operation, VIN-MIN is higher than the result calculated in
公式 10. With frequency foldback, VIN-MIN is lowered by decreased fSW. When the device is operating in auto
mode at voltages near maximum rated input voltage and light load conditions, an increased output voltage ripple
during load transient may be observed. For this reason TI recommends that device operating point be calculated
with sufficient operational margin so that minimum on-time condition is not triggered.
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7.3.9 Internal Compensation and CFF
The LM76002/LM76003 is internally compensated with RC = 600 kΩ and CC = 35 pF as shown in the Functional
Block Diagram. The internal compensation is designed such that the loop response is stable over the entire
operating frequency and output voltage range. Depending on the output voltage, the compensation loop phase
margin can be low with all ceramic capacitors. TI recommends placing an external feed-forward cap CFF in
parallel with the top resistor divider RFBT for optimum transient performance.
VOUT
RFBT
CFF
FB
RFBB
图 19. Feed-Forward Capacitor for Loop Compensation
The feed-forward capacitor CFF in parallel with RFBT places an additional zero before the crossover frequency of
the control loop to boost phase margin. The zero frequency can be found by 公式 11:
fZ-CFF = 1 / (2π × RFBT × CFF
)
(11)
An additional pole is also introduced with CFF at the frequency of 公式 12:
fP-CFF = 1 / (2π × CFF × (RFBT // RFBB))
(12)
Select the CFF so that the bandwidth of the control loop without the CFF is centered between fZ-CFF and fP-CFF. The
zero fZ-CFF adds phase boost at the crossover frequency and improves transient response. The pole fP-CFF helps
maintaining proper gain margin at frequency beyond the crossover.
Electrolytic capacitors have much larger ESR and the ESR zero frequency would be low enough to boost the
phase up around the crossover frequency.
fZ-ESR = 1 / (2π × ESR × COUT
)
(13)
Designs using mostly electrolytic capacitors at the output may not need any CFF. The CFF creates a time constant
with RFBT that couples in the attenuated output voltage ripple to the FB node. If the CFF value is too large, it can
couple too much ripple to the FB and affect VOUT regulation. It could also couple too much transient voltage
deviation and falsely trip PGOOD thresholds. Therefore, calculate CFF based on output capacitors used in the
system. At cold temperatures, the value of CFF might change based on the tolerance of the chosen component.
This may reduce its impedance and ease noise coupling on the FB node. To avoid this, more capacitance can be
added to the output or the value of CFF can be reduced. See Feed-Forward Capacitor for the calculation of CFF.
7.3.10 Bootstrap Voltage and VBOOT UVLO (BOOT Pin)
The driver of the power switch (HS switch) requires bias higher than VIN when the HS switch is ON. The
capacitor connected between CBOOT and SW works as a charge pump to boost voltage on the BOOT pin to (VSW
+ VCC). The boot diode is integrated on the LM76002/LM76003 die to minimize physical size. TI recommends a
0.47-µF, 6.3-V or higher capacitor for CBOOT. The VBOOT_UVLO threshold is typically 2.2 V. If the CBOOT capacitor is
not charged above this voltage with respect to SW, the device initiates a charging sequence using the low-side
FET.
7.3.11 Power Good and Overvoltage Protection (PGOOD)
The LM76002/LM76003 has a built-in power-good flag shown on PGOOD pin to indicate whether the output
voltage is within its regulation level. The PGOOD signal can be used for start-up sequencing of multiple rails. The
PGOOD pin is an open-drain output that requires a pullup resistor to an appropriate logic voltage (any voltage
below 12 V). The pin can sink 5 mA of current and maintain its specified logic low level. A typical range of pullup
resistor value is 10 kΩ to 100 kΩ. When the FB voltage is outside the power-good band, +6% above and –7%
below the internal reference VREF typically, the PGOOD switch is turned on, and the PGOOD pin voltage is pulled
to ground. When the FB is 2% (typical) closer to FB than the PGOOD threshold, the PGOOD switch is turned off,
and the pin is pulled up to the voltage connected to the pullup resistor. Both rising and falling edges of the
power-good flag have a built-in 220-µs (typical) deglitch delay. To pull up PGOOD pin to a voltage higher than
15V, a resistor divider can be used to divide the voltage down.
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VPU
RPGT
PGOOD
RPGB
图 20. PGOOD Resistor Divider
For given pullup voltage VPU and desired voltage on PGOOD pin is VPG and with RPGT chosen, value for RPGB
can be calculated using 公式 14:
VPG
RPGB
=
RPGT
VPU - VPG
(14)
7.3.12 Overcurrent and Short-Circuit Protection
The LM76002/LM76003 is protected from overcurrent conditions by cycle-by-cycle current limiting on both peak
and valley of the inductor current. Hiccup mode is activated if a fault condition persists to prevent overheating.
High-side MOSFET overcurrent protection is implemented by the nature of the peak current-mode control. The
HS switch current is sensed when the HS is turned on after a blanking time. The HS switch current is compared
to the either the minimum of a fixed current set point (ISC) or the output of the voltage regulation loop minus slope
compensation every switching cycle. The slope compensation increases with duty cycle and tends to lower the
HS current limit above 60% duty cycle as it lowers below ISC. See Typical Characteristics.
When the LS switch is turned on, the current going through it is also sensed and monitored. Before turning off
the LS switch at the end of every clock cycle, the LS current is compared to the LS current limit. If the LS current
limit is exceeded, the LS MOSFET stays on, and the HS switch is not turned on. The LS switch is kept ON so
that inductor current keeps ramping down, until the inductor current ramps below ILSLIMIT. The LS switch is turned
off once the LS current falls below the limit, and the HS switch is turned on again after a dead time.
If the current of the LS switch is higher than the LS current limit for 128 consecutive cycles, and the feedback
voltage falls 60% below regulation, hiccup current-protection mode is activated. In hiccup mode, the regulator is
shut down and kept off for 40 ms typically before the LM76002/LM76003 tries to start again. If overcurrent or a
short-circuit fault condition still exists, hiccup repeats until the fault condition is removed. Hiccup mode reduces
power dissipation under severe overcurrent conditions, and prevents overheating and potential damage to the
device. Under non-severe overcurrent conditions when the feedback voltage has not fallen 60% below regulation,
the LM76002/LM76003 reduces the switching frequency and keeps the inductor current valley clamped at the LS
current limit level. This operation mode allows slight overcurrent operation during load transients without tripping
hiccup.
If tracking was used for initial sequencing the device attempts to restart using the internal soft-start circuit until
the tracking voltage is reached.
7.3.13 Thermal Shutdown
Thermal shutdown limits total power dissipation by turning off the internal switches when the device junction
temperature exceeds 160°C (typical). After thermal shutdown occurs, hysteresis prevents the device from
switching until the junction temperature drops to approximately 135°C. When the junction temperature falls below
135°C, the LM76002/LM76003 attempts to soft start.
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7.4 Device Functional Modes
7.4.1 Shutdown Mode
The EN pin provides electrical on/off control for the LM76002/LM76003. When the EN pin voltage is below 0.3 V
(typical), both the regulator and the internal LDO have no output voltages, and the device is in shutdown mode.
In shutdown mode the quiescent current drops to typically 1.2 µA. The LM76002/LM76003 also employs UVLO
protection. If VCC voltage is below the UVLO level, the output of the regulator is turned off.
7.4.2 Standby Mode
The internal LDO has a lower EN threshold than the regulator. When the EN pin voltage is above below 1.1 V
(maximum) and below the precision enable threshold for the output voltage, the internal LDO regulates the VCC
voltage at 3.29 V typically. The precision enable circuitry is ON once VCC is above the UVLO. The internal
MOSFETs remain in tri-state unless the voltage on EN pin goes above the precision enable threshold. The
LM76002/LM76003 also employs UVLO protection. If VCC voltage is below the UVLO level, the output of the
regulator is turned off.
7.4.3 Active Mode
The LM76002/LM76003 is in active mode when the EN pin and UVLO high threshold levels are satisfied. The
simplest way to enable the operation of the LM76002/LM76003 is to connect the EN pin to VIN, which allows self
start-up of the LM76002/LM76003 when the input voltage is in the operation range: 3.5 V to 60 V. See Enable
(EN Pin) and UVLO for details on setting these operating levels.
In active mode, depending on the load current, the LM76002/LM76003 will be in one of five sub modes:
1. CCM with fixed switching frequency with load between half of IMINPK to full load.
2. DCM when the load current is lower than half of the inductor current ripple.
3. Light load mode where the device uses pulse frequency modulation (PFM) and lowers the switching
frequency at load under half of IMINPK to improve efficiency.
4. Foldback mode when switching frequency is reduced to maintain output regulation with supply voltages that
cause the minimum tON or tOFF to be exceeded.
5. Forced-pulse-width modulation (FPWM) is similar to CCM with fixed switching frequency, but extends the
fixed frequency range of operation from full to no load.
7.4.4 CCM Mode
CCM operation is employed in the LM76002/LM76003 when the load current is higher than ½ of the peak-to-
peak inductor current. If the load current is decreased, the device enters DCM mode. In CCM operation, the
frequency of operation is constant and fixed unless the minimum tON or tOFF are exceeded which causes the part
to enter fold back mode (refer to Internal LDO, VCC UVLO, and Bias Input for details). In these cases, PWM is
still maintained, but the frequency of operation is folded back (reduced) to maintain proper regulation.
7.4.5 DCM Mode
DCM operation is employed in the LM76002/LM76003 when the load current is lower than ½ of the peak-to-peak
inductor current. In DCM operation (also known as diode emulation mode), the LS FET is turned off when the
inductor current drops below 0 A to keep operation as efficient as possible by reducing switching losses and
preventing negative current conduction. In PWM operation, the frequency of operation is constant and fixed
unless the load current is reduced below IPEAK_MIN, which causes the part to enter light load mode, or if the
minimum tON or tOFF are exceeded, which cause the device to enter foldback mode.
7.4.6 Light Load Mode
At light output current loads, PFM is activated for the highest efficiency possible. When the inductor current does
not reach IPEAK_MIN during a switching cycle, the on-time is increased, and the switching frequency reduces as
needed to maintain proper regulation. The on-time has a maximum value of 8 µs to avoid large output voltage
ripple in dropout conditions. Efficiency is greatly improved by reducing switching and gate-drive losses. During
light-load mode of operation the LM76002/LM76003 operates with a minimum quiescent current of 10 to 15 µA
(typical).
22
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Device Functional Modes (接下页)
7.4.7 Foldback Mode
Foldback protection modes are entered when the duty cycle exceeds the minimum on- and off-times of the
device. At very high duty cycles, where the minimum off-time is not satisfied, the frequency folds back to allow
more time for the peak current command to be reached. The maximum on-time is 8 µs, which limits the
maximum duty cycle in dropout to 98%. At very low duty cycles when the minimum on-time is reached, the
device maintains regulation by dropping the frequency to allow more time for the inductor current to discharge
the output capacitor. Foldback mode is exited once the minimum on-time and off-times are satisfied.
7.4.8 Forced Pulse-Width-Modulation Mode
FPWM is employed when the FPWM pin is pulled high, or the device is synchronized to an external clock. In this
mode, diode emulation is turned off, and the device emains in CCM over the full load range. In FPWM operation,
the frequency of operation is constant and fixed unless the minimum tON or tOFF are exceeded, which cause the
device to enter foldback mode. In these cases, PWM operation is still maintained, but the frequency of operation
is folded back (reduced) to maintain proper regulation. DC accuracy is at a minimum in FPWM mode.
7.4.9 Self-Bias Mode
For highest efficiency of operation, TI recommends that the BIAS pin be connected directly to VOUT when 3.3 V ≤
VOUT ≤ 24 V. In this self-bias mode of operation, the difference between the input and output voltages of the
internal LDO are reduced, and therefore the total efficiency of the LM76002/LM76003 is improved. These
efficiency gains are more evident during light load operation. During this mode of operation, the
LM76002/LM76003 operates with a minimum quiescent current of 15 µA (typical). See Internal LDO, VCC UVLO,
and Bias Input for more details.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM76002/LM76003 is a step-down DC-DC converter. It is typically used to convert a higher DC voltage to a
lower DC voltage with a maximum output current of 3.5 A. The following design procedure can be used to select
component values for the LM76002/LM76003. Alternately, the WEBENCH® software may be used to generate a
complete design. The WEBENCH software uses an iterative design procedure and accesses a comprehensive
database of components when generating a design (see Custom Design With WEBENCH® Tools).
8.2 Typical Applications
The LM76002/LM76003 only requires a few external components to convert from a wide range of supply voltage
to output voltage, as shown in 图 21:
L
VIN
PVIN
SW
VOUT
COUT
CIN
CBOOT
PGND
CFF
RFBT
BOOT
FB
EN
VCC
RFBB
CVCC
SS/TRK
BIAS
RT
CBIAS
LM76003
PGOOD
SYNC
AGND
Tie BIAS to PGND
when VOUT < 3.3 V
图 21. LM76002/LM76003 Basic Schematic
The LM76002/LM76003 also integrates a full list of features to aid system design requirements, such as VCC
UVLO, programmable soft start, start-up tracking, programmable switching frequency, clock synchronization, and
a power-good indication. Each system can select the features needed in a specific application. A comprehensive
schematic with all features utilized is shown in 图 22:
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Typical Applications (接下页)
L
VOUT
VIN
SW
PVIN
RENT
CIN
COUT
PGND
EN
CBOOT
RFBT
CFF
VIN
PVIN
BOOT
FB
CIN
RENB
RENT
PGND
EN
B
VCC
RFBB
CVCC
SS/TRK
RT
RENB
CSS
SS/TRK
BIAS
LM76003
CSS
RT
CBIAS
RT
LM76003
RT
PGOOD
PGND
SYNC
AGND
RPG
PG
P
RSYNC
SYNC
AGND
Tie BIAS to PGND when
VOUT < 3.3 V
RSYNC
Copyright © 2017, Texas Instruments Incorporated
图 22. LM76002/LM76003 Comprehensive Schematic
The external components must fulfill the requirements of the application, but also the stability criteria of the
device control loop. The LM76002/LM76003 is optimized to work within a range of external components.
Inductance and capacitance of the LC output filter each create poles that have to be considered in the control of
the converter. 表 2 can be used to simplify the output filter component selection.
表 2. Typical Component Selection
fSW (kHz)
300
VOUT (V)
1
L (µH)
2.5
1.5
0.68
0.47
6.8
4.7
2.5
1.2
10
COUT (µF)
680
470
200
120
200
150
88
RFBT (kΩ)
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
RFBB (kΩ)
OPEN
OPEN
OPEN
OPEN
43.5
43.5
43.5
43.5
25
500
1
1000
2200
300
1
1
3.3
3.3
3.3
3.3
5
500
1000
2200
300
44
150
100
66
500
5
6.8
3.3
1.5
22
25
1000
2200
300
5
25
5
44
25
12
12
12
12
24
24
24
24
66
9.09
9.09
9.09
9.09
4.37
4.37
4.37
4.37
500
15
44
1000
2200
300
6.8
3.3
47
22
22
40
500
27
33
1000
2200
15
22
6.8
22
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8.2.1 Design Requirements
Detailed Design Procedure is based on a design example. For this design example, use the parameters listed in
表 3 as the input parameters.
表 3. Design Example Parameters
DESIGN PARAMETER
Input voltage range
Output voltage
VALUE
3.5 V to 60 V
3.3 V
Input ripple voltage
Output ripple voltage
Output current rating
Operating frequency
400 mV
30 mV
3.5 A
500 kHz
8.2.2 Detailed Design Procedure
8.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LM76002/03 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
8.2.2.2 Output Voltage Setpoint
The output voltage of the LM76002/LM76003 device is externally adjustable using a resistor divider network. In
the application circuit of 图 22, this divider network is comprised of top feedback resistor RFBT and bottom
feedback resistor RFBB. 公式 15 is used to determine the output voltage of the converter:
VFB
RFBB
=
RFBT
VOUT - VFB
(15)
Choose the value of the RFBT to be around 1 MΩ to minimize quiescent current during light load operation or
100kΩ to improve noise immunity. With the desired output voltage set to be 3.3 V and with a VFB = 1 V, the RFBB
value can then be calculated using 公式 15. The formula yields a value of 434.78 kΩ. Choose the closest
available value of 432 kΩ for the RFBB, or a combination of two resistors (432 kΩ + 2.74 kΩ) to increase initial
accuracy.
8.2.2.3 Switching Frequency
The default switching frequency of the LM76002/LM76003 device is set at 500 kHz. If the RT is left open, the
LM76002/LM76003 switches at 500 kHz in CCM mode. Use 公式 16 to calculate the required value for RT in
order to operate the LM76002/LM76003 at different frequencies.
38400
RT(kW) =
Frequency(kHz) - 14.33
(16)
The unit for the result is kΩ.
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8.2.2.4 Input Capacitors
The LM76002/LM76003 device requires an input decoupling and, depending on the application, a bulk input
capacitor. The typical recommended value for the high frequency decoupling capacitor is 10 μF to 22 μF. TI
recommends a high-quality ceramic type X5R or X7R with sufficiency voltage rating. The voltage rating must be
greater than the maximum input voltage. To compensate the derating of ceramic capacitors, a voltage rating of
twice the maximum input voltage is recommended. Additionally, some bulk capacitance can be required,
especially if the LM76002/LM76003 circuit is not located within approximately 5 cm from the input voltage source.
This capacitor is used to provide damping to the voltage spiking due to the lead inductance of the cable. The
optimum value for this capacitor is four times the ceramic input capacitance with ESR close to the characteristic
impedance of the LC filter formed by the application input inductance and ceramic input capacitors.
For this design, two 4.7-μF, X7R dielectric capacitors rated for 100 V are used for the input decoupling
capacitance. A single capacitor has equivalent series resistance (ESR) of approximately 3 mΩ, and an RMS
current rating of 3 A. Include a capacitor with a value of 47 nF for high-frequency filtering and place it as close as
possible to the device pins.
注
DC-Bias Effect: High capacitance ceramic capacitors have a DC-bias derating effect,
which has a strong influence on the final effective capacitance. Therefore, choose the right
capacitor value carefully. Package size and voltage rating in combination with dielectric
material are responsible for differences between the rated capacitor value and the
effective capacitance.
8.2.2.5 Inductor Selection
The first criterion for selecting an output inductor is the inductance itself. In most buck converters, this value is
based on the desired peak-to-peak ripple current, ΔiL that flows in the inductor along with the load current. As
with switching frequency, the selection of the inductor is a tradeoff between size and cost. Higher inductance
means lower ripple current and hence lower output voltage ripple. Lower inductance results in smaller, less
expensive devices. An inductance that gives a ripple current of 20% to 40% of the maximum output current is a
good starting point. (ΔiL = (1/5 to 2/5) × IOUT). The peak-to-peak inductor current ripple can be found by 公式 17
and the range of inductance can be found by 公式 18 with the typical input voltage used as VIN.
(VIN - VOUT )ìD
DiL =
L ì fSW
(17)
(VIN - VOUT )ìD
0.4ìfSW ìIL-MAX
(VIN - VOUT)ìD
0.2ìfSW ìIL-MAX
Ç L Ç
(18)
D is the duty cycle of the converter which in a buck converter it can be approximated as D = VOUT / VIN,
assuming no loss power conversion. By calculating in terms of amperes, volts, and megahertz, the inductance
value comes out in micro henries. The inductor ripple current ratio is defined by:
DiL
IOUT
r =
(19)
The second criterion is the inductor saturation-current rating. The inductor must be rated to handle the maximum
load current plus the ripple current:
IL-PEAK = ILOAD-MAX + Δ iL / 2
(20)
The LM76002/LM76003 has both valley current limit and peak current limit. During an instantaneous short, the
peak inductor current can be high due to a momentary increase in duty cycle. The inductor current rating should
be higher than the HS current limit. TI recommends selection of an inductor with a larger core saturation margin
and preferably a softer roll off of the inductance value over load current.
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In general, it is preferable to choose lower inductance in switching power supplies, because it usually
corresponds to faster transient response, smaller DCR, and reduced size for more compact designs. However,
too low of an inductance can generate too large of an inductor current ripple such that overcurrent protection at
the full load could be falsely triggered. It also generates more conduction loss because the RMS current is
slightly higher relative that with lower current ripple at the same DC current. Larger inductor current ripple also
implies larger output voltage ripple with the same output capacitors. With peak-current-mode control, it is not
recommended to have an inductor current ripple that is too small. Enough inductor current ripple improves signal-
to-noise ratio on the current comparator and makes the control loop more immune to noise.
Once the inductance is determined, the type of inductor must be selected. Ferrite designs have very low core
losses and are preferred at high switching frequencies, so design goals can concentrate on copper loss and
preventing saturation. Ferrite core material saturates hard, which means that inductance collapses abruptly when
the peak design current is exceeded. The hard saturation results in an abrupt increase in inductor ripple current
and consequent output voltage ripple. Do not allow the core to saturate.
For the design example, a standard 10-μH inductor from Wurth, Coiltronics, or Vishay can be used for the 3.3-V
output with plenty of current rating margin.
8.2.2.6 Output Capacitor Selection
The device is designed to be used with a wide variety of LC filters. TI generally recommends using as little output
capacitance as possible to keep cost and size down. Choose the output capacitor(s), COUT, with care as it
directly affects the steady-state output-voltage ripple, loop stability, and the voltage over/undershoot during load
current transients.
The output voltage ripple is essentially composed of two parts. One is caused by the inductor current ripple going
through the equivalent series resistance (ESR) of the output capacitors:
ΔVOUT-ESR = ΔiL × ESR
(21)
The other is caused by the inductor current ripple charging and discharging the output capacitors:
ΔVOUT-C = ΔiL / (8 × fSW × COUT
)
(22)
The two components in the voltage ripple are not in phase, so the actual peak-to-peak ripple is smaller than the
sum of the two peaks.
Output capacitance is usually limited by transient performance specifications if the system requires tight voltage
regulation in the presence of large current steps and fast slew rates. When a fast large load transient happens,
output capacitors provide the required charge before the inductor current can slew to the appropriate level. The
initial output voltage step is equal to the load current step multiplied by the ESR. VOUT continues to droop until
the control loop response increases or decreases the inductor current to supply the load. To maintain a small
overshoot or undershoot during a transient, small ESR, and large capacitance are desired. But these also come
with higher cost and size. Thus, the motivation is to seek a fast control loop response to reduce the output
voltage deviation.
For a given input and output requirement, 公式 23 gives an approximation for an absolute minimum output cap
required:
2
»
…
…
ÿ
Ÿ
≈
’
÷
◊
1
r
Å
Å
COUT
>
ì
ì(1+ D ) + D ì(1+ r)
(
)
∆
∆
÷
(fSW ìr ì DVOUT / IOUT
)
12
Ÿ
⁄
«
(23)
Along with this for the same requirement, calculate the maximum ESR as per 公式 24
D'
1
≈
’
ESR <
ì
+ 0.5
∆
«
÷
◊
fSW ì COUT
r
where
•
•
•
•
•
r = Ripple ratio of the inductor ripple current (ΔiL / IOUT
ΔVO = target output voltage undershoot
D’ = 1 – duty cycle
)
fSW = switching frequency
IOUT = load current
(24)
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A general guideline for COUT range is that COUT should be larger than the minimum required output capacitance
calculated by 公式 23, and smaller than 10 times the minimum required output capacitance or 1 mF. In
applications with VOUT less than 3.3 V, it is critical that low ESR output capacitors are selected. This limits
potential output voltage overshoots as the input voltage falls below the device normal operating range. To
optimize the transient behavior a feed-forward capacitor could be added in parallel with the upper feedback
resistor. For this design example, three 47-µF, 10-V, X7R ceramic capacitors are used in parallel.
8.2.2.7 Feed-Forward Capacitor
The LM76002/LM76003 is internally compensated and the internal R-C values are 400 kΩ and 50 pF,
respectively. Depending on the VOUT and frequency FS, if the output capacitor COUT is dominated by low ESR
(ceramic types) capacitors, it could result in low phase margin. To improve the phase boost an external feed-
forward capacitor CFF can be added in parallel with RFBT. CFF is chosen such that phase margin is boosted at the
crossover frequency without CFF. A simple estimation for the crossover frequency without CFF (fx) is shown in 公
式 25, assuming COUT has very small ESR.
15.46
fX
=
VOUT ì COUT
(25)
The 公式 26 for CFF was tested:
1
1
CFF
=
ì
2pfx
RFBT ì(RFBT / /RFBB
)
(26)
If capacitors with high ESR are used CFF is not required. The CFF capacitor creates a time constant with RFBT that
couples the attenuated output voltage ripple to the FB node. Using a value that is too large for CFF may couple
too much ripple to FB node and affect output voltage regulation. For capacitors with medium ESR (20 – 200 mΩ)
公式 26 can be used as quick starting point. For the application in this design example, a 47-pF C0G capacitor is
used.
8.2.2.8 Bootstrap Capacitors
Every LM76002/LM76003 design requires a bootstrap capacitor, CBOOT. The recommended bootstrap capacitor
is 0.47 μF and rated at 6.3 V or greater. The bootstrap capacitor is located between the SW pin and the BOOT
pin. The bootstrap capacitor must be a high-quality ceramic type with X7R or X5R grade dielectric for
temperature stability.
8.2.2.9 VCC Capacitors
The VCC pin is the output of an internal LDO for LM76002/LM76003. The input for this LDO comes from either
VIN or BIAS (please refer to functional block diagram for LM76002/LM76003). To insure stability of the part,
place a 1-µF to 2.2-µF, 10-V capacitor for this pin. Never short VCC pin to ground during operation.
8.2.2.10 BIAS Capacitors
For an output voltage 3.3 V and greater, connect the BIAS pin to the output in order to increase light load
efficiency. The BIAS pin is one of the two inputs for the VCC LDO. When BIAS voltage is below VBIAS-ON
threshold, the input for the VCC LDO is internally connected to VIN. Because this is an LDO, the voltage
differences between the input and output affects the efficiency of the LDO. If necessary, a capacitor with a value
of 1 μF can be added close to the BIAS pin as an input capacitor for the LDO.
8.2.2.11 Soft-Start Capacitors
The SS pin can be left floating, and the LM76002/LM76003 implements a soft-start time of 6.3 ms. In order to
use an external soft-start capacitor, the capacitor must be sized so that the soft-start time is greater than 6.3 ms.
Use 公式 27 to calculate the soft-start capacitor value:
CSS = ISSC × tSS
(27)
With a desired soft-start time of 11 ms, a soft-start charging current of 2 µA, and an internal VREF of 1 V, 公式 27
yields a soft start capacitor value of 22 nF.
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8.2.2.12 Undervoltage Lockout Setpoint
The undervoltage lockout (UVLO) is adjusted using the external voltage divider network of RENT and RENB. RENT
is connected between the PVIN pin and the EN pin of the LM76002/LM76003. RENB is connected between the
EN pin and the GND pin. The UVLO has two thresholds, one for power up when the input voltage is rising and
one for power down or brownouts when the input voltage is falling. 公式 28 can be used to determine the VIN
UVLO level.
VIN-UVLO-RISING = VENH × (RENB + RENT) / RENB
(28)
The EN rising threshold (VENH) for LM76002/LM76003 is set to be 1.218 V (typical). Choose the value of RENB to
be 100 kΩ to minimize input current from the supply. If the desired VIN UVLO level is at 5 V, then the value of
RENT can be calculated using 公式 29:
RENT = (VIN-UVLO-RISING / VENH – 1) × RENB
(29)
公式 29 yields a value of 315 kΩ. The resulting falling UVLO threshold, can be calculated by 公式 30, where EN
falling threshold (VENL) is 0.99 V (typical).
VIN-UVLO-FALLING = VENL × (RENB + RENT) / RENB
(30)
8.2.2.13 PGOOD
A typical pullup resistor value is 10 kΩ to 100 kΩ from the PGOOD pin to a voltage no higher than 18 V. If it is
desired to pull up the PGOOD pin to a voltage higher than 18 V, a resistor can be added from the PGOOD pin to
ground to divide the voltage detected by the PGOOD pin to a value no higher than 18 V.
8.2.2.14 Synchronization
The LM76002/LM76003 switching action can synchronize to an external clock from 300 kHz to 2.2 MHz. TI
recommends connecting an external clock to the SYNC pin with a 50-Ω to 100-Ω termination resistor. Ground the
SYNC pin if not used.
30
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LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
8.2.3 Application Curves
Unless otherwise specified the following conditions apply:
100
90
80
70
60
50
40
100
95
90
85
80
75
70
65
60
55
50
30
VIN = 8 V
VIN = 12 V
VIN = 18 V
VIN = 24 V
VIN = 8 V
20
VIN = 12 V
VIN = 18 V
VIN = 24 V
10
0
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D011
D011
VOUT = 3.3 V
fSW = 500 kHz
Auto Mode
VOUT = 3.3 V
fSW = 500 kHz
FPWM Mode
图 23. LM76003 Efficiency
图 24. LM76003 Efficiency
100
100
90
80
70
60
50
40
30
20
10
0
95
90
85
80
75
70
65
60
55
50
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D014
D014
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
图 25. LM76003 Efficiency
图 26. LM76003 Efficiency
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D016
D016
VOUT = 5 V
fSW = 1000 kHz
Auto Mode
VOUT = 5 V
fSW = 1000 kHz
FPWM Mode
图 27. LM76003 Efficiency
图 28. LM76003 Efficiency
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LM76002, LM76003
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www.ti.com.cn
Unless otherwise specified the following conditions apply:
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
10
0
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D018
D018
VOUT = 5 V
fSW = 2200 kHz
Auto Mode
VOUT = 5 V
fSW = 2200 kHz
FPWM Mode
图 29. LM76003 Efficiency
图 30. LM76003 Efficiency
120
120
100
80
60
40
20
0
100
80
60
40
20
0
VIN = 24 V
VIN = 48 V
VIN = 60 V
VIN = 24 V
VIN = 48 V
VIN = 60 V
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D020
D020
VOUT = 12 V
fSW = 500 kHz
Auto Mode
VOUT = 12 V
fSW = 500 kHz
FPWM Mode
图 31. LM76003 Efficiency
图 32. LM76003 Efficiency
120
100
80
60
40
20
0
120
100
80
60
40
20
0
VIN = 32 V
VIN = 48 V
VIN = 60 V
VIN = 32 V
VIN = 48 V
VIN = 60 V
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D022
D022
VOUT = 24 V
fSW = 300 kHz
Auto Mode
VOUT = 24 V
fSW = 300 kHz
FPWM Mode
图 33. LM76003 Efficiency
图 34. LM76003 Efficiency
32
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LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Unless otherwise specified the following conditions apply:
100
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
10
0
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
Load Current (A)
2
2.5
3
D024
D024
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
图 35. LM76002 Efficiency
图 36. LM76002 Efficiency
3.4
3.4
3.38
3.36
3.34
3.32
3.3
VIN = 8 V
VIN = 8 V
3.38
3.36
3.34
3.32
3.3
VIN = 12 V
VIN = 18 V
VIN = 24 V
VIN = 12 V
VIN = 18 V
VIN = 24 V
3.28
3.26
3.24
3.22
3.2
3.28
3.26
3.24
3.22
3.2
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D012
D012
VOUT = 3.3 V
fSW = 500 kHz
Auto Mode
VOUT = 3.3 V
fSW = 500 kHz
FPWM Mode
图 37. LM76003 Load and Line Regulation
图 38. LM76003 Load and Line Regulation
5.2
5.16
5.12
5.08
5.04
5
5.1
5.08
5.06
5.04
5.02
5
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
4.96
4.92
4.88
4.84
4.8
4.98
4.96
4.94
4.92
4.9
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D015
D015
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
图 39. LM76003 Load and Line Regulation
图 40. LM76003 Load and Line Regulation
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LM76002, LM76003
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Unless otherwise specified the following conditions apply:
5.2
5.1
5.08
5.06
5.04
5.02
5
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
5.16
5.12
5.08
5.04
5
4.96
4.92
4.88
4.84
4.8
4.98
4.96
4.94
4.92
4.9
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D017
D017
VOUT = 5 V
fSW = 1000 kHz
Auto Mode
VOUT = 5 V
fSW = 1000 kHz
FPWM Mode
图 41. LM76003 Load and Line Regulation
图 42. LM76003 Load and Line Regulation
5.2
5.1
5.08
5.06
5.04
5.02
5
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
5.16
5.12
5.08
5.04
5
4.96
4.92
4.88
4.84
4.8
4.98
4.96
4.94
4.92
4.9
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D019
D019
VOUT = 5 V
fSW = 2200 kHz
Auto Mode
VOUT = 5 V
fSW = 2200 kHz
FPWM Mode
图 43. LM76003 Load and Line Regulation
图 44. LM76003 Load and Line Regulation
12.4
12.35
12.3
12.4
12.35
12.3
VIN = 24 V
VIN = 48 V
VIN = 60 V
VIN = 24 V
VIN = 48 V
VIN = 60 V
12.25
12.2
12.25
12.2
12.15
12.1
12.15
12.1
12.05
12
12.05
12
11.95
11.9
11.95
11.9
11.85
11.8
11.85
11.8
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D021
D021
VOUT = 12 V
fSW = 500 kHz
Auto Mode
VOUT = 12 V
fSW = 500 kHz
FPWM Mode
图 45. LM76003 Load and Line Regulation
图 46. LM76003 Load and Line Regulation
34
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LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Unless otherwise specified the following conditions apply:
24.5
24.5
24.4
24.3
24.2
24.1
24
VIN = 32 V
VIN = 48 V
VIN = 60 V
VIN = 32 V
VIN = 48 V
VIN = 60 V
24.4
24.3
24.2
24.1
24
23.9
23.8
23.7
23.6
23.9
23.8
23.7
23.6
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
2
Load Current (A)
2.5
3
3.5
4
D023
D023
VOUT = 24 V
fSW = 300 kHz
Auto Mode
VOUT = 24 V
fSW = 300 kHz
FPWM Mode
图 47. LM76003 Load and Line Regulation
图 48. LM76003 Load and Line Regulation
5.2
5.16
5.12
5.08
5.04
5
5.1
5.08
5.06
5.04
5.02
5
VIN = 12 V
VIN = 24 V
VIN = 48 V
VIN = 12 V
VIN = 24 V
VIN = 48 V
4.96
4.92
4.88
4.84
4.8
4.98
4.96
4.94
4.92
4.9
0.001
0.01
0.1
Load Current (A)
1
5
0
0.5
1
1.5
Load Current (A)
2
2.5
3
D025
D025
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
图 49. LM76002 Load and Line Regulation
图 50. LM76002 Load and Line Regulation
3.5
3.4
3.3
3.2
3.1
3
5.6
5.4
5.2
5
4.8
4.6
4.4
4.2
4
2.9
2.8
2.7
2.6
2.5
ILOAD = 10 mA
ILOAD = 1 A
ILOAD = 2.5 A
ILOAD = 3.5 A
ILOAD = 10 mA
ILOAD = 1 A
ILOAD = 2.5 A
ILOAD = 3.5 A
3.8
3
3.5
4
4.5
Input Voltage (V)
5
5.5
6
6.5
4.5
4.75
5
5.25
5.5
Input Voltage (V)
5.75
6
6.25
6.5
D026
D027
VOUT = 3.3 V
fSW = 500 kHz
Auto Mode
VOUT = 5 V
fSW = 500 kHz
Auto Mode
图 51. LM76003 Dropout Curve
图 52. LM76003 Dropout Curve
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35
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
Unless otherwise specified the following conditions apply:
5.6
5.6
5.4
5.2
5
5.4
5.2
5
4.8
4.6
4.4
4.8
4.6
4.4
4.2
4
ILOAD = 10 mA
ILOAD = 1 A
ILOAD = 2.5 A
ILOAD = 3.5 A
ILOAD = 10 mA
ILOAD = 1 A
ILOAD = 2.5 A
ILOAD = 3.5 A
4.2
4
3.8
3.8
4.5
4.75
5
5.25
5.5
Input Voltage (V)
5.75
6
6.25
6.5
4.5
4.75
5
5.25
5.5
Input Voltage (V)
5.75
6
6.25
6.5
D028
D029
VOUT = 5 V
fSW = 1000 kHz
Auto Mode
VOUT = 5 V
fSW = 2200 kHz
Auto Mode
图 53. LM76003 Dropout Curve
图 54. LM76003 Dropout Curve
12.4
12.2
12
5.6
5.4
5.2
5
11.8
11.6
11.4
11.2
11
4.8
4.6
4.4
4.2
4
ILOAD = 100 mA
ILOAD = 1 A
ILOAD = 2.5 A
ILOAD = 3.5 A
ILOAD = 100 mA
ILOAD = 1 A
ILOAD = 2.5 A
10.8
10.6
3.8
4.5
4.75
5
5.25
5.5
Input Voltage (V)
5.75
6
6.25
6.5
11.5
12
12.5
13 13.5
Input Voltage (V)
14
14.5
15
D030
D031
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VOUT = 12 V
fSW = 500 kHz
Auto Mode
图 55. LM76002 Dropout Curve
图 56. LM76003 Dropout Curve
25
24.5
24
VSW
(5 V/DIV)
IINDUCTOR
23.5
23
(500 mA/
DIV)
VOUT
ILOAD = 100 mA
ILOAD = 1 A
(20 mV/DIV)
22.5
ILOAD = 2.5 A
ILOAD = 3.5 A
Time (1 ms/DIV)
22
23.5
24
24.5
25 25.5
Input Voltage (V)
26
26.5
27
D032
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VOUT = 24 V
fSW = 300 kHz
Auto Mode
图 57. LM76003 Dropout Curve
图 58. LM76003 Switching Waveform and Output Ripple
36
版权 © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Unless otherwise specified the following conditions apply:
VSW
VSW
(5 V/DIV)
(5 V/DIV)
IINDUCTOR
IINDUCTOR
(500 mA/
DIV)
(500 mA/
DIV)
VOUT
VOUT
(20 mV/DIV)
(20 mV/DIV)
Time (2 µs/DIV)
Time (2 µs/DIV)
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
VIN = 12 V
100-mA Load
VOUT = 5 V
fSW = 500 kHz
Auto Mode
图 59. LM76003 Switching Waveform and Output Ripple
图 60. LM76003 Switching Waveform and Output Ripple
Enable
(2 V/DIV)
VSW
(5 V/DIV)
VOUT
(2 V/DIV)
IINDUCTOR
(500 mA/
DIV)
PGOOD
(2 V/DIV)
VOUT
IINDUCTOR
(20 mV/DIV)
(2 A/DIV)
Time (2 µs/DIV)
Time (5 ms/DIV)
VIN = 12 V
100-mA Load
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
VIN = 12 V
No Load
VOUT = 3.3 V
fSW = 500 kHz
Auto Mode
图 61. LM76003 Switching Waveform and Output Ripple
图 62. LM76003 Start-up Waveform
Enable
(2 V/DIV)
Enable
(2 V/DIV)
VOUT
(2 V/DIV)
VOUT
(2 V/DIV)
PGOOD
(2 V/DIV)
PGOOD
(2 V/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
Time (5 ms/DIV)
Time (5 ms/DIV)
VIN = 12 V
No Load
VOUT = 3.3 V
fSW = 500 kHz
FPWM Mode
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
Auto Mode
图 63. LM76003 Start-up Waveform
图 64. LM76003 Start-up Waveform
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LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
Unless otherwise specified the following conditions apply:
Enable
(2 V/DIV)
Enable
(2 V/DIV)
VOUT
(2 V/DIV)
VOUT
(2 V/DIV)
PGOOD
(2 V/DIV)
PGOOD
(2 V/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
Time (5 ms/DIV)
Time (5 ms/DIV)
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
VIN = 12 V
3.5-A Load
VOUT = 3.3 V
fSW = 500 kHz
图 65. LM76003 Start-up Waveform
图 66. LM76003 Start-up Waveform
Enable
(2 V/DIV)
Enable
(2 V/DIV)
VOUT
(2 V/DIV)
VOUT
(2 V/DIV)
PGOOD
(2 V/DIV)
PGOOD
(2 V/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
Time (5 ms/DIV)
Time (5 ms/DIV)
VIN = 12 V
VOUT = 5 V
fSW = 500 kHz
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
Auto Mode
3.5-A Load
图 67. Start-up Waveform
图 68. LM76002 Start-up Waveform
Enable
(2 V/DIV)
Enable
(2 V/DIV)
VOUT
(2 V/DIV)
VOUT
(2 V/DIV)
PGOOD
(2 V/DIV)
PGOOD
(2 V/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
Time (5 ms/DIV)
Time (5 ms/DIV)
VIN = 12 V
2.5-A Load
VOUT = 5 V
fSW = 500 kHz
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
Auto Mode
图 69. LM76002 Start-up Waveform
图 70. LM76003 Start-up With Pre-Biased Output
38
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LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Unless otherwise specified the following conditions apply:
VOUT
Enable
(2 V/DIV)
(1 V/DIV)
VOUT
(2 V/DIV)
IINDUCTOR
(2 A/DIV)
PGOOD
(2 V/DIV)
VSW
(5 V/DIV)
IINDUCTOR
(2 A/DIV)
Time (5 ms/DIV)
Time (50 ms/DIV)
VIN = 12 V
No Load
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
VIN = 12 V
VOUT = 5 V
fSW = 500 kHz
Auto Mode
图 71. LM76002 Start-up With Pre-Biased Output
图 72. LM76003 Short-Circuit Behavior With Hiccup
ILOAD
ILOAD
(2 A/DIV)
(2 A/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
VOUT
VOUT
(200 mV/
DIV)
(200 mV/
DIV)
Time (100 µs/DIV)
Time (100 µs/DIV)
VIN = 12 V
VOUT = 3.3 V
fSW = 500 kHz
Auto Mode
VIN = 12 V
VOUT = 3.3 V
fSW = 500 kHz
FPWM Mode
10 mA to 3.5 A to 10 mA
10 mA to 3.5 A to 10 mA
图 73. LM76003 Load Transient
图 74. LM76003 Load Transient
ILOAD
ILOAD
(2 A/DIV)
(2 A/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
VOUT
VOUT
(200 mV/
DIV)
(200 mV/
DIV)
Time (100 µs/DIV)
Time (100 µs/DIV)
VIN = 12 V
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VIN = 12 V
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
10 mA to 3.5 A to 10 mA
10 mA to 3.5 A to 10 mA
图 75. LM76003 Load Transient
图 76. LM76003 Load Transient
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39
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
Unless otherwise specified the following conditions apply:
ILOAD
ILOAD
(2 A/DIV)
(2 A/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
VOUT
VOUT
(200 mV/
DIV)
(200 mV/
DIV)
Time (100 µs/DIV)
Time (100 µs/DIV)
VIN = 12 V
VOUT = 5 V
fSW = 1000 kHz
Auto Mode
VIN = 12 V
VOUT = 5 V
fSW = 1000 kHz
FPWM Mode
10 mA to 3.5 A to 10 mA
10 mA to 3.5 A to 10 mA
图 77. LM76003 Load Transient
图 78. LM76003 Load Transient
ILOAD
ILOAD
(2 A/DIV)
(2 A/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
VOUT
VOUT
(200 mV/
DIV)
(200 mV/
DIV)
Time (100 µs/DIV)
Time (100 µs/DIV)
VIN = 12 V
VOUT = 5 V
fSW = 2200 kHz
Auto Mode
VIN = 12 V
VOUT = 5 V
fSW = 2200 kHz
FPWM Mode
10 mA to 3.5 A to 10 mA
10 mA to 3.5 A to 10 mA
图 79. LM76003 Load Transient
图 80. LM76003 Load Transient
ILOAD
ILOAD
(2 A/DIV)
(2 A/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
VOUT
VOUT
(500 mV/
DIV)
(500 mV/
DIV)
Time (100 µs/DIV)
Time (100 µs/DIV)
VIN = 24 V
VOUT = 12 V
fSW = 500 kHz
Auto Mode
VIN = 24 V
VOUT = 12 V
fSW = 500 kHz
FPWM Mode
10 mA to 3.5 A to 10 mA
10 mA to 3.5 A to 10 mA
图 81. LM76003 Load Transient
图 82. LM76003 Load Transient
40
版权 © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Unless otherwise specified the following conditions apply:
ILOAD
ILOAD
(1 A/DIV)
(1 A/DIV)
IINDUCTOR
IINDUCTOR
(2 A/DIV)
(2 A/DIV)
VOUT
VOUT
(200 mV/
DIV)
(200 mV/
DIV)
Time (100 µs/DIV)
Time (100 µs/DIV)
VIN = 12 V
VOUT = 5 V
fSW = 500 kHz
Auto Mode
VIN = 12 V
VOUT = 5 V
fSW = 500 kHz
FPWM Mode
10 mA to 2.5 A to 10 mA
10 mA to 2.5 A to 10 mA
图 83. LM76002 Load Transient
图 84. LM76002 Load Transient
版权 © 2017–2019, Texas Instruments Incorporated
41
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
9 Power Supply Recommendations
The LM76002/LM76003 is designed to operate from an input voltage supply range between 3.5 V and 60 V. This
input supply must be able to withstand the maximum input current and maintain a voltage above 3.5 V. The
resistance of the input supply rail must be low enough that an input current transient does not cause a high
enough drop at the LM76002 supply voltage that can cause a false UVLO fault triggering and system reset.
If the input supply is located more than a few inches from the LM76002/LM76003 additional bulk capacitance
may be required in addition to the ceramic bypass capacitors. The amount of bulk capacitance is not critical, but
a 47-µF or 100-µF electrolytic capacitor is a typical choice.
10 Layout
10.1 Layout Guidelines
The performance of any switching converter depends as much upon the layout of the PCB as the component
selection. The following guidelines will help the user design a circuit with maximum rejection of outside EMI and
minimum generation of unwanted EMI.
1. Place ceramic high frequency bypass CIN as close as possible to the LM76002/LM76003 PVIN and PGND
pins. Grounding for both the input and output capacitors should consist of localized top side planes that
connect to the PGND pins and PAD.
2. Place bypass capacitors for VCC and BIAS close to the pins and ground the bypass capacitors to device
ground.
3. Minimize trace length to the FB pin. Both feedback resistors, RFBT and RFBB must be located close to the FB
pin. Place CFF directly in parallel with RFBT. If VOUT accuracy at the load is important, make sure VOUT sense
is made at the load. Route VOUT sense path away from noisy nodes and preferably through a layer on the
other side of a shielding layer.
4. Use ground plane in one of the middle layers as noise shielding and heat dissipation path. Have a single
point ground connection to the plane. Route the ground connections for the feedback, soft start, and enable
components to the ground plane. This prevents any switched or load currents from flowing in the analog
ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output
voltage ripple behavior.
5. Make VIN, VOUT and ground bus connections as wide as possible. This reduces any voltage drops on the
input or output paths of the converter and maximizes efficiency.
6. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the exposed pad to the
ground plane on the bottom PCB layer. If the PCB has multiple copper layers, these thermal vias can also be
connected to inner layer heat-spreading ground planes. Ensure enough copper area is used for heat-sinking
to keep the junction temperature below 125°C.
10.1.1 Layout Highlights
1. Minimize area of switched current loops. From an EMI reduction standpoint, it is imperative to minimize the
high di/dt paths during PC board layout as shown in the figure above. The high current loops that do not
overlap have high di/dt content that causes observable high frequency noise on the output pin if the input
capacitor CIN is placed at a distance away from the LM76002/LM76003. Therefore, place CIN as close as
possible to the LM76002/LM76003 PVIN and PGND pins. This minimizes the high di/dt area and reduce
radiated EMI. Additionally, grounding for both the input and output capacitor must consist of a localized top-
side plane that connects to the PGND pin.
2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components
should be routed to the AGND pin of the device. This prevents any switched or load currents from flowing in
the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or
erratic output voltage ripple behavior.
3. Minimize trace length to the FB pin net. Place both feedback resistors, RFBT and RFBB, close to the FB pin.
Because the FB node is high impedance, maintain the copper area as small as possible. Route the traces
from RFBT, RFBB away from the body of the LM76002/LM76003 to minimize possible noise pickup. Place Cff
directly in parallel with RFBT
.
4. Make input and output bus connections as wide as possible. This reduces any voltage drops on the input or
output of the converter and maximizes efficiency. To optimize voltage accuracy at the load, ensure that a
42
版权 © 2017–2019, Texas Instruments Incorporated
LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
Layout Guidelines (接下页)
separate feedback voltage sense trace is made to the load. Doing so corrects for voltage drops and provide
optimum output accuracy.
5. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the exposed pad to the
ground plane on the bottom PCB layer. If the PCB has multiple copper layers, these thermal vias can also be
connected to inner layer heat-spreading ground planes. For best results use a 10 × 10 via array (or greater)
with a minimum via diameter of 12 mil thermal vias spaced 46.8 mil apart. Ensure enough copper area is
used for heat-sinking to keep the junction temperature below 125°C.
10.1.2 Compact Layout for EMI Reduction
Radiated EMI is generated by the high di/dt components in pulsing currents in switching converters. The larger
area covered by the path of a pulsing current, the more electromagnetic emission is generated. The key to
minimize radiated EMI is to identify the pulsing current path and minimize the area of the path. In Buck
converters, the pulsing current path is from the VIN side of the input capacitors to HS switch, to the LS switch,
and then return to the ground of the input capacitors, as shown in 图 85.
BUCK
CONVERTER
L
PVIN
VIN
CIN
SW
VOUT
COUT
PGND
PGND
High di/dt current
图 85. Buck Converter High di / dt Path
High frequency ceramic bypass capacitors at the input side provide primary path for the high di/dt components of
the pulsing current. Placing ceramic bypass capacitor(s) as close as possible to the PVIN and PGND pins is the
key to EMI reduction. The SW pin connecting to the inductor should be as short as possible, and just wide
enough to carry the load current without excessive heating. Short, thick traces or copper pours (shapes) should
be used for high current condution path to minimize parasitic resistance. The output capacitors should be place
close to the VOUT end of the inductor and closely grounded to PGND pin and exposed PAD. Place the bypass
capacitors on VCC and BIAS pins as close as possible to the pins respectively and closely grounded to PGND
and the exposed PAD.
10.1.3 Ground Plane and Thermal Considerations
TI recommends using one of the middle layers as a solid ground plane. Ground plane provides shielding for
sensitive circuits and traces. It also provides a quiet reference potential for the control circuitry. Connect the
AGND and PGND pins to the ground plane using vias right next to the bypass capacitors. PGND pins are
connected to the source of the internal LS switch; connect the PGND pins directly to the grounds of the input and
output capacitors. The PGND net contains noise at the switching frequency and may bounce due to load
variations. The PGND trace, as well as PVIN and SW traces, should be constrained to one side of the ground
plane. The other side of the ground plane contains much less noise — use for sensitive routes.
Provide adequate device heat sinking by utilizing the PAD of the device as the primary thermal path. Use a
minimum 4 by 4 array of 10 mil thermal vias to connect the PAD to the system ground plane for heat sinking.
Distribute the vias evenly under the PAD. Use as much copper as possible for system ground plane on the top
and bottom layers for the best heat dissipation. TI recommends using a four-layer board with the copper
thickness, for the four layers, starting from the top one, 2 oz / 1 oz / 1 oz / 2 oz. Four layer boards with enough
copper thickness and proper layout provides low current conduction impedance, proper shielding and lower
thermal resistance.
The thermal characteristics of the LM76002/LM76003 are specified using the parameter RθJA, which characterize
the junction temperature of the silicon to the ambient temperature in a specific system. Although the value of RθJA
is dependant on many variables, it still can be used to approximate the operating junction temperature of the
device.
To obtain an estimate of the device junction temperature, one may use the following relationship:
版权 © 2017–2019, Texas Instruments Incorporated
43
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
Layout Guidelines (接下页)
TJ = PD × RθJA + TA
where
•
•
•
•
•
TJ = junction temperature in °C
PD = VIN × IIN × (1 − efficiency) − 1.1 × IOUT × DCR
DCR = inductor DC parasitic resistance in Ω
RθJA = junction-to-ambient thermal resistance of the device in °C/W
TA = ambient temperature in °C.
(31)
The maximum operating junction temperature of the LM76002/LM76003 is 125°C. RθJA is highly related to PCB
size and layout, as well as environmental factors such as heat sinking and air flow. 图 86 shows measured
results of RθJA with different copper area on a 2-layer board and a 4-layer board.
30
1W @0 fpm - 2layer
28
1W @0 fpm - 4layer
26
2W @0 fpm - 2layer
2W @0 fpm - 4layer
24
22
20
18
16
14
12
10
30mm × 30mm
40mm × 40mm
50mm × 50mm
70mm ×70mm
Copper Area
图 86. Measured RθJA vs PCB Copper Area on a 2-Layer Board and a 4-Layer Board
10.1.4 Feedback Resistors
To reduce noise sensitivity of the output voltage feedback path, it is important to place the resistor divider and
CFF close to the FB pin, rather than close to the load. The FB pin is the input to the error amplifier, so it is a high
impedance node and very sensitive to noise. Placing the resistor divider and CFF closer to the FB pin reduces the
trace length of FB signal and reduces noise coupling. The output node is a low impedance node, so the trace
from VOUT to the resistor divider can be long if short path is not available.
If voltage accuracy at the load is important, make sure voltage sense is made at the load. Doing so corrects for
voltage drops along the traces and provide the best output accuracy. The voltage sense trace from the load to
the feedback resistor divider should be routed away from the SW node path, the inductor and VIN path to avoid
contaminating the feedback signal with switch noise, while also minimizing the trace length. This is most
important when high value resistors are used to set the output voltage. TI recommends routing the voltage sense
trace on a different layer than the inductor, SW node and VIN path, such that there is a ground plane in between
the feedback trace and inductor / SW node / VIN polygon. This provides further shielding for the voltage
feedback path from switching noises.
44
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LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
10.2 Layout Example
图 87. LM76002/LM76003 Layout
版权 © 2017–2019, Texas Instruments Incorporated
45
LM76002, LM76003
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
www.ti.com.cn
10.3 Thermal Design
When calculating module dissipation use the maximum input voltage and the average output current for the
application. Many common operating conditions are provided in the characteristic curves such that less common
applications can be derived through interpolation. In all designs, the junction temperature must be kept below the
rated maximum of 125°C. For the design case of VIN = 12 V, VOUT = 5 V, IOUT = 3.5 A, fSW = 2100 kHz, and TA-
MAX = 85°C, the device must detect a thermal resistance from exposed pad (case) to ambient (RθCA):
TJ-MAX - TA-MAX
RqCA
<
- RqCA
P
IC_LOSS
(32)
The typical thermal impedance from junction to case is 1.7°C/W. Use the 125°C power dissipation curves in
Typical Characteristics section to estimate the PIC-LOSS for the application being designed. In this application it is
3 W. The inductor losses must be subtracted from this number and can be estimated as:
125èC- 85èC
2.75 W
RqCA
<
- 1.7èC/W < 12.84èC/W
(33)
To reach RθCA = 12.84°C/W, the PCB is required to dissipate heat effectively. With no airflow and no external
heat-sink, a good estimate of the required board area covered by 2 oz. copper on both the top and bottom metal
layers is:
500
èC ì cm2
Board Area_cm2 Ç
ì
RqCA
W
(34)
As a result, approximately 38.95 square cm of 2 oz. copper on top and bottom layers is the minimum required
area for the example PCB design. This is a 6.25 cm (2.45 inch) square. The PCB copper heat sink must be
connected to the pins of the device and to the exposed pad with multiple thermal vias to the bottom copper. For
an example of a high thermal performance PCB layout refer to AN-2020 Thermal Design By Insight, Not
Hindsight and the evaluation board documentation.
46
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LM76002, LM76003
www.ti.com.cn
ZHCSH05A –OCTOBER 2017–REVISED OCTOBER 2019
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
11.1.1.1 使用 WEBENCH® 工具创建定制设计
单击此处,以使用 LM76002 或 LM76003 器件并借助 WEBENCH® 电源设计器创建定制设计方案。
1. 首先输入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
2. 使用优化器拨盘优化该设计的关键参数,如效率、尺寸和成本。
3. 将生成的设计与德州仪器 (TI) 的其他可行的解决方案进行比较。
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。
在多数情况下,可执行以下操作:
•
•
•
•
运行电气仿真,观察重要波形以及电路性能
运行热性能仿真,了解电路板热性能
将定制原理图和布局方案以常用 CAD 格式导出
打印设计方案的 PDF 报告并与同事共享
有关 WEBENCH 工具的详细信息,请访问 www.ti.com.cn/WEBENCH。
11.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产品
信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 支持资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 商标
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2017–2019, Texas Instruments Incorporated
47
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM76002RNPR
LM76002RNPT
LM76003RNPR
LM76003RNPT
ACTIVE
WQFN
WQFN
WQFN
WQFN
RNP
30
30
30
30
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM76002R
NP
ACTIVE
ACTIVE
ACTIVE
RNP
SN
SN
SN
LM76002R
NP
RNP
LM76003R
NP
RNP
LM76003R
NP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM76002RNPR
LM76002RNPT
LM76003RNPR
LM76003RNPT
WQFN
WQFN
WQFN
WQFN
RNP
RNP
RNP
RNP
30
30
30
30
3000
250
330.0
180.0
330.0
180.0
16.4
16.4
16.4
16.4
4.25
4.25
4.25
4.25
6.25
6.25
6.25
6.25
0.95
0.95
0.95
0.95
8.0
8.0
8.0
8.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM76002RNPR
LM76002RNPT
LM76003RNPR
LM76003RNPT
WQFN
WQFN
WQFN
WQFN
RNP
RNP
RNP
RNP
30
30
30
30
3000
250
367.0
213.0
367.0
213.0
367.0
191.0
367.0
191.0
38.0
35.0
38.0
35.0
3000
250
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RNP 30
4 x 6, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225831/A
www.ti.com
PACKAGE OUTLINE
RNP0030B
WQFN - 0.8 mm max height
S
C
A
L
E
2
.
7
0
0
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
B
A
PIN 1 INDEX AREA
6.1
5.9
0.1 MIN
(0.05)
E
SCAL
C
T
SECTION A-A
TYPICAL
0.8 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
1.8 0.1
2X 1.5
(0.2) TYP
EXPOSED
THERMAL PAD
12
15
26X 0.5
11
16
SYMM
31
A
A
2X
5
4.5 0.1
1
26
0.3
30
27
30X
PIN 1 ID
(OPTIONAL)
0.2
0.1
0.05
SYMM
0.5
0.3
8X
C A B
C
0.65
0.45
22X
4222784/B 09/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RNP0030B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.8)
SYMM
8X (0.6)
30
27
22X (0.75)
1
26
30X (0.25)
(0.5) TYP
SYMM
(1.14)
TYP
31
(5.8)
(4.5)
(0.57)
(R0.05) TYP
(
0.2) TYP
VIA
16
11
12
(0.65) TYP
15
(3.65)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222784/B 09/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RNP0030B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
8X (0.8)
27
8X (0.6)
30
22X (0.75)
1
26
31
30X (0.25)
8X
(0.94)
26X (0.5)
SYMM
(5.8)
(0.57)
TYP
(1.14)
TYP
METAL
TYP
16
11
(R0.05) TYP
12
15
SYMM
(0.5) TYP
(3.65)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 31:
74.3% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4222784/B 09/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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