LM810M3-4.63 [TI]

具有高电平有效推挽复位功能、用于监控电源的 3 引脚电压监控器(复位 IC) | DBZ | 3 | -40 to 105;
LM810M3-4.63
型号: LM810M3-4.63
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有高电平有效推挽复位功能、用于监控电源的 3 引脚电压监控器(复位 IC) | DBZ | 3 | -40 to 105

监控 光电二极管
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LM809, LM810  
SNVS052E SEPTEMBER 1999REVISED APRIL 2016  
LM809/LM810 3-Pin Microprocessor Reset Circuits  
1 Features  
3 Description  
The LM809 and LM810 microprocessors supervisory  
circuits can be used to monitor the power supplies in  
microprocessor and digital systems. They provide a  
reset to the microprocessor during power-up, power-  
down and brown-out conditions.  
1
Precision Monitoring of Supply Voltages  
Available Threshold Options:  
2.63 V, 2.93 V, 3.08 V, 4.38 V, 4.63 V  
Superior Upgrade to MAX809 and MAX810  
Fully Specified Over Temperature  
The function of the LM809 and LM810 are to monitor  
the VCC supply voltage, and assert a reset signal  
whenever this voltage declines below the factory-  
programmed reset threshold. The reset signal  
remains asserted for 240 ms after VCC rises above  
the threshold. The LM809 has an active-low RESET  
output, while the LM810 has an active-high RESET  
output.  
140-ms Minimum Power-On Reset Pulse Width,  
240-ms Typical  
Active-Low RESET Output (LM809)  
Active-High RESET Output (LM810)  
Ensured RESET Output Valid for VCC 1 V  
Low Supply Current, 15-µA Typical  
Power Supply Transient Immunity  
Seven standard reset voltage options are available,  
suitable for monitoring 5-V, 3.3-V, and 3-V supply  
voltages.  
2 Applications  
With a low supply current of only 15 µA, the LM809  
and LM810 are ideal for use in portable equipment.  
Factory Automation  
Building Automation  
Programmable Logic Control  
Renewable Energy  
Microprocessor Systems  
Computers  
Device Information(1)  
PART NUMBER  
PACKAGE  
BODY SIZE (NOM)  
LM809, LM810  
SOT-23 (3)  
2.92 mm × 1.30 mm  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
Controllers  
Intelligent Instruments  
Portable/Battery-Powered Equipment  
Automotive  
Typical Application for Microprocessor Reset Circuit  
VCC  
VCC  
VCC  
µP  
LM809  
RESET  
INPUT  
RESET  
GND  
GND  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
LM809, LM810  
SNVS052E SEPTEMBER 1999REVISED APRIL 2016  
www.ti.com  
Table of Contents  
7.4 Device Functional Modes.......................................... 9  
Application and Implementation ........................ 10  
8.1 Application Information............................................ 10  
8.2 Typical Application .................................................. 10  
Power Supply Recommendations...................... 11  
1
2
3
4
5
6
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
6.1 Absolute Maximum Ratings ...................................... 4  
6.2 ESD Ratings.............................................................. 4  
6.3 Recommended Operating Conditions....................... 4  
6.4 Thermal Information.................................................. 4  
6.5 Electrical Characteristics........................................... 5  
6.6 Typical Characteristics.............................................. 6  
Detailed Description .............................................. 7  
7.1 Overview ................................................................... 7  
7.2 Functional Block Diagram ......................................... 7  
7.3 Feature Description................................................... 7  
8
9
10 Layout................................................................... 11  
10.1 Layout Guidelines ................................................. 11  
10.2 Layout Example .................................................... 11  
11 Device and Documentation Support ................. 12  
11.1 Related Links ........................................................ 12  
11.2 Community Resources.......................................... 12  
11.3 Trademarks........................................................... 12  
11.4 Electrostatic Discharge Caution............................ 12  
11.5 Glossary................................................................ 12  
7
12 Mechanical, Packaging, and Orderable  
Information ........................................................... 12  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision D (May 2013) to Revision E  
Page  
Removed the SON package................................................................................................................................................... 1  
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation  
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and  
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1  
2
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SNVS052E SEPTEMBER 1999REVISED APRIL 2016  
5 Pin Configuration and Functions  
LM809  
LM810  
DBZ Package  
3-Pin SOT-23  
Top View  
DBZ Package  
3-Pin SOT-23  
Top View  
GND  
1
2
GND  
1
3
V
CC  
3
V
CC  
RESET  
RESET  
2
Pin Functions  
PIN  
NO.  
I/O  
DESCRIPTION  
NAME  
LM809  
LM810  
Active-low output. RESET remains low while VCC is below the reset threshold, and for 240 ms  
after VCC rises above the reset threshold.  
RESET  
RESET  
2
O
O
Active-high output. RESET remains high while VCC is below the reset threshold, and for 240 ms  
after VCC rises above the reset threshold.  
2
VCC  
3
1
3
1
I
Supply voltage  
GND  
Ground reference  
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6 Specifications  
6.1 Absolute Maximum Ratings  
(1)(2)  
see  
MIN  
–0.3  
–0.3  
MAX  
6
UNIT  
V
Input supply voltage  
VCC  
Output voltage  
RESET, RESET  
VCC  
VCC + 0.3  
20  
V
Input current  
mA  
mA  
V/µs  
mW  
°C  
Output current  
RESET, RESET  
VCC  
20  
Rate of rise  
100  
Continuous power dissipation  
Lead temperature (soldering, 10 s)  
Ambient temperature range, TA  
Maximum junction temperature, TJ(MAX)  
Storage temperature, Tstg  
320  
300  
–40  
–65  
105  
°C  
125  
°C  
160  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
6.2 ESD Ratings  
VALUE  
±2000  
±200  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)  
V(ESD)  
Electrostatic discharge  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with  
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with  
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.  
6.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
1.0  
NOM  
MAX  
5.5  
5.5  
60  
UNIT  
TA = 0°C to 70°C  
VCC  
Input voltage range  
Supply Current  
V
TA = –40°C to 105°C  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
1.2  
18  
15  
VCC < 5.5 V,  
LM8xx: 4.63, 4.38, 4.00  
100  
50  
ICC  
µA  
VCC < 3.6 V,  
LM8xx: 3.08, 2.93, 2.63, 2.45  
100  
6.4 Thermal Information  
LM809, LM810  
DBZ (SOT-23)  
3 PINS  
252.0  
THERMAL METRIC(1)  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top) Junction-to-case (top) thermal resistance  
113.3  
RθJB  
ψJT  
Junction-to-board thermal resistance  
53.5  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
9.9  
ψJB  
52.6  
RθJC(bot) Junction-to-case (bottom) thermal resistance  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953.  
4
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6.5 Electrical Characteristics  
VCC = full range, TA = –40°C to 105°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 5 V for 4.63, 4.38, and  
4.00 versions, VCC = 3.3 V for 3.08 and 2.93 versions, and VCC = 3 V for 2.63 and 2.45 version(1)  
.
PARAMETER  
TEST CONDITIONS  
TA = 25°C  
MIN  
4.56  
4.50  
4.40  
4.31  
4.25  
4.16  
3.93  
3.89  
3.80  
3.04  
3.00  
2.92  
2.89  
2.85  
2.78  
2.59  
2.55  
2.50  
2.41  
2.38  
2.33  
TYP  
MAX  
4.70  
4.75  
4.86  
4.45  
4.50  
4.56  
4.06  
4.10  
4.20  
3.11  
3.15  
3.23  
2.96  
3.00  
3.08  
2.66  
2.70  
2.76  
2.49  
2.52  
2.57  
UNIT  
4.63  
LM8xx: 4.63 V  
LM8xx: 4.38 V  
LM8xx: 4.00 V  
LM8xx: 3.08 V  
LM8xx: 2.93 V  
LM8xx: 2.63 V  
LM8xx: 2.45 V  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = 25°C  
4.38  
4.00  
3.08  
2.93  
2.63  
2.45  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = 25°C  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = 25°C  
VTH  
Reset Threshold(2)  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = 25°C  
V
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = 25°C  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
TA = 25°C  
TA = –40°C to 85°C  
TA = 85°C to 105°C  
Reset Threshold  
Temperature Coefficient  
VCC to Reset Delay(2)  
30  
ppm/°C  
µs  
VCC = VTH to (VTH – 100 mV)  
TA = –40°C to 85°C  
20  
140  
100  
240  
560  
840  
0.3  
0.4  
0.3  
0.3  
0.4  
Reset Active Timeout  
Period  
ms  
TA = 85°C to 105°C  
VCC = VTH(min), ISINK = 1.2 mA, LM809: 2.45, 2.63, 2.93, 3.08  
VCC = VTH(min), ISINK = 3.2 mA, LM809: 4.63, 4.38, 4.00  
VCC > 1 V, ISINK = 50 µA  
RESET Output Voltage  
Low (LM809)  
VOL  
V
VCC = VTH(max), ISINK = 1.2 mA, LM810: 2.63, 2.93, 3.08  
VCC = VTH(max), ISINK = 3.2 mA, LM810: 4.63, 4.38, 4.00  
RESET Output Voltage  
Low (LM810)  
VCC > VTH(max), ISOURCE = 500 µA, LM809: 2.45, 2.63, 2.93, 3.08 0.8 × VCC  
RESET Output Voltage  
High (LM809)  
VCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00  
VCC – 1.5  
VOH  
V
RESET Output Voltage  
High (LM810)  
1.8 V < VCC < VTH(min), ISOURCE = 150 μA  
0.8 × VCC  
(1) Production testing done at TA = 25°C, over temperature limits specified by design only.  
(2) RESET Output for LM809, RESET output for LM810.  
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6.6 Typical Characteristics  
20  
20  
15  
10  
5
15  
10  
5
0
0
–40  
–20  
0
20  
40  
60  
80  
–40  
–20  
0
20  
40  
60  
80  
Temperature (°C)  
Temperature (°C)  
Figure 1. Supply Current vs Temperature  
(No Load, LM8xx: 2.63, 2.93, 3.08)  
Figure 2. Supply Current vs Temperature  
(No Load, LM8xx: 4.63, 4.38)  
180  
160  
140  
120  
100  
80  
100  
80  
60  
40  
20  
0
60  
40  
20  
0
–40  
–20  
0
20  
40  
60  
80  
–40  
–20  
0
20  
40  
60  
80  
Temperature (°C)  
Temperature (°C)  
Figure 3. Power-Down Reset Delay vs Temp  
(LM8xx: 2.63, 2.93, 3.08)  
Figure 4. Power-Down Reset Delay vs Temperature  
(LM8xx: 4.63, 4.38)  
250  
1.003  
1.002  
1.001  
1.000  
0.999  
0.998  
0.997  
245  
240  
235  
230  
225  
220  
215  
210  
205  
200  
–40  
–20  
0
20  
40  
60  
80  
–40  
–20  
0
20  
40  
60  
80  
Temperature (°C)  
Temperature (°C)  
Figure 5. Power-Up Reset Timeout vs Temperature  
Figure 6. Normalized Reset Threshold vs Temperature  
6
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7 Detailed Description  
7.1 Overview  
The LM809 and LM810 microprocessor supervisory circuits provide a simple solution to monitor the power  
supplies in microprocessor and digital systems and provide a reset during power-up, power-down, and brown-out  
conditions. The reset signal is controlled by the factory-programmed reset threshold on the VCC supply voltage  
pin. When the voltage declines below the reset threshold, the reset signal is asserted and remains asserted for  
240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has  
an active-high RESET output. The available threshold options are 2.63 V, 2.93 V, 3.08 V, 4.38 V, and 4.63 V to  
provide precision monitoring of supply voltages.  
7.2 Functional Block Diagram  
INPUT  
RD  
-
+
RESET  
VREF  
GND  
7.3 Feature Description  
7.3.1 Benefits of Precision Reset Thresholds  
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage.  
A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63-V and 3.08-V  
options of the LM809 and LM810 use highly accurate circuitry to ensure that the reset threshold occurs only  
within this range (for 5-V and 3.3-V supplies). The other voltage options have the same tight tolerance to ensure  
a reset signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds  
apply to 3-V, 3.3-V, and 5-V nominal supply voltages.  
Table 1. Reset Thresholds Related to Common Supply Voltages  
Reset Threshold  
4.63 ± 3%  
4.38 ± 3%  
4.00 ± 3%  
3.08 ± 3%  
2.93 ± 3%  
2.63 ± 3%  
2.45 ± 3%  
3 V  
3.3 V  
5 V  
90 – 95%  
85 – 90%  
78 – 82%  
90 – 95%  
86 – 90%  
77 – 81%  
72 – 76%  
85 – 90%  
79 – 84%  
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7.3.1.1 Ensuring a Valid Reset Output Down to VCC = 0 V  
When VCC falls below 1 V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic  
input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100-kΩ  
resistor should be connected from the RESET output to ground, as shown in Figure 7.  
A 100-kΩ pullup resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC  
< 1 V.  
VCC  
LM809  
RESET  
R1  
100 kΩ  
GND  
Figure 7. RESET Valid to VCC = Ground Circuit  
7.3.1.2 Negative-Going VCC Transients  
The LM809 and LM810 are relatively immune to short negative-going transients or glitches on VCC. Figure 8  
shows the maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In  
general, as the magnitude of the transient increases, going further below the threshold, the maximum allowable  
pulse width decreases. Typically, for the 4.63-V and 4.38-V version of the LM809 or LM810, a VCC transient that  
goes 100 mV below the reset threshold and lasts 20 µs or less will not cause a reset pulse. A 0.1-µF bypass  
capacitor mounted as close as possible to the VCC pin will provide additional transient rejection.  
560  
480  
400  
320  
240  
160  
80  
0
1
10  
100  
1000  
Reset Comparator Overdrive (ms)  
Figure 8. Maximum Transient Duration without Causing a Reset Pulse vs Reset Comparator Overdrive  
8
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7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins  
Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the  
LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in  
the opposite state, connect a 4.7-kΩ resistor between the LM809 RESET output and the µP reset pin, as shown  
in Figure 9. Buffer the LM809 RESET output to other system components.  
Buffered RESET  
to other system  
components  
BUFFER  
VCC  
VCC  
µP  
LM809  
4.7 kΩ  
RESET  
RESET  
GND  
GND  
Figure 9. Interfacing to Microprocessors with Bidirectional Reset I/O  
7.4 Device Functional Modes  
7.4.1 VCC Supply Voltage Low  
When VCC supply voltage declines below the reset threshold, the RESET output is asserted. For LM809, the  
active-low RESET output is low. For LM810, the active-high RESET output is high.  
7.4.2 VCC Supply Voltage High  
When the VCC supply voltage rises above the reset threshold, the RESET output resets after 240 ms. For LM809,  
the active-low RESET output rises high. For LM810, the active-high RESET output drops low.  
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8 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
The LM809 and LM810 are a supervisor circuit for microprocessor and digital systems. With a low supply current  
of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment.  
8.2 Typical Application  
VCC  
VCC  
VCC  
µP  
LM809  
RESET  
INPUT  
RESET  
GND  
GND  
Figure 10. Microprocessor RESET Circuit  
8.2.1 Design Requirements  
For this design example, use the parameters listed in Table 2 as the input parameters.  
Table 2. Design Parameters  
DESIGN PARAMETER  
Input supply voltage range  
Reset output voltage (high)  
Reset output voltage (low)  
EXAMPLE VALUE  
1 V to 5.5 V  
Input supply  
0 V  
8.2.2 Detailed Design Procedure  
For the typical application circuit, all that is required is the LM809 or LM810 IC, but TI recommends an input  
capacitor to help with input voltage transients. A typical input capacitor value is 0.1 uF and must be rated for the  
highest expected input voltage.  
10  
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8.2.3 Application Curve  
VCC  
VCC threshold (5 V, 3.3 V, or 3 V)  
240 ms  
RESET (LM809)  
RESET (LM810)  
Figure 11. Reset Active Timeout  
9 Power Supply Recommendations  
The input of the LM809 is designed to handle up to the supply voltage absolute maximum rating of 6.5 V. If the  
input supply is susceptible to any large transients above the maximum rating, then extra precautions should be  
taken. An input capacitor is recommended to avoid false reset output triggers due to noise.  
10 Layout  
10.1 Layout Guidelines  
Place the input capacitor as close as possible to the IC.  
10.2 Layout Example  
U1  
C1  
VCC Input  
Reset  
GND  
Figure 12. Layout Example  
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11 Device and Documentation Support  
11.1 Related Links  
The table below lists quick access links. Categories include technical documents, support and community  
resources, tools and software, and quick access to sample or buy.  
Table 3. Related Links  
TECHNICAL  
DOCUMENTS  
TOOLS &  
SOFTWARE  
SUPPORT &  
COMMUNITY  
PARTS  
PRODUCT FOLDER SAMPLE & BUY  
LM809  
LM810  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
11.2 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
11.3 Trademarks  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
11.4 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
11.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
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Copyright © 1999–2016, Texas Instruments Incorporated  
Product Folder Links: LM809 LM810  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Jul-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LM809M3-2.63/NOPB  
LM809M3-2.93  
ACTIVE  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 105  
-40 to 105  
S3B  
S4B  
Samples  
1000  
Non-RoHS  
& Green  
Call TI  
LM809M3-2.93/NOPB  
LM809M3-3.08  
ACTIVE  
NRND  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 105  
-40 to 105  
S4B  
S5B  
Samples  
1000  
Non-RoHS  
& Green  
Call TI  
LM809M3-3.08/NOPB  
LM809M3-4.38/NOPB  
LM809M3-4.63/NOPB  
LM809M3X-2.63/NOPB  
LM809M3X-2.93/NOPB  
LM809M3X-3.08/NOPB  
LM809M3X-4.38/NOPB  
LM809M3X-4.63/NOPB  
LM810M3-4.63  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
3
3
3
3
3
3
3
3
3
1000 RoHS & Green  
1000 RoHS & Green  
1000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
3000 RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 105  
-40 to 105  
-40 to 105  
-40 to 105  
-40 to 105  
-40 to 105  
S5B  
S7B  
S8B  
S3B  
S4B  
S5B  
S7B  
S8B  
SEB  
Samples  
Samples  
Samples  
Samples  
Samples  
Samples  
Samples  
Samples  
SN  
SN  
SN  
SN  
SN  
SN  
-40 to 105  
-40 to 105  
1000  
Non-RoHS  
& Green  
Call TI  
LM810M3-4.63/NOPB  
LM810M3X-4.63/NOPB  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBZ  
DBZ  
3
3
1000 RoHS & Green  
SN  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 105  
-40 to 105  
SEB  
SEB  
Samples  
Samples  
3000 RoHS & Green  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Jul-2022  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM809M3-2.63/NOPB  
LM809M3-2.93  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
1000  
1000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
2.9  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
1.22  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LM809M3-2.93/NOPB  
LM809M3-3.08  
LM809M3-3.08/NOPB  
LM809M3-4.38/NOPB  
LM809M3-4.63/NOPB  
LM809M3X-2.63/NOPB SOT-23  
LM809M3X-2.93/NOPB SOT-23  
LM809M3X-3.08/NOPB SOT-23  
LM809M3X-4.38/NOPB SOT-23  
LM809M3X-4.63/NOPB SOT-23  
LM810M3-4.63  
SOT-23  
SOT-23  
LM810M3-4.63/NOPB  
LM810M3X-4.63/NOPB SOT-23  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jun-2023  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM809M3-2.63/NOPB  
LM809M3-2.93  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
DBZ  
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
1000  
1000  
3000  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
208.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
191.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LM809M3-2.93/NOPB  
LM809M3-3.08  
LM809M3-3.08/NOPB  
LM809M3-4.38/NOPB  
LM809M3-4.63/NOPB  
LM809M3X-2.63/NOPB  
LM809M3X-2.93/NOPB  
LM809M3X-3.08/NOPB  
LM809M3X-4.38/NOPB  
LM809M3X-4.63/NOPB  
LM810M3-4.63  
LM810M3-4.63/NOPB  
LM810M3X-4.63/NOPB  
Pack Materials-Page 2  
PACKAGE OUTLINE  
DBZ0003A  
SOT-23 - 1.12 mm max height  
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR  
C
2.64  
2.10  
1.12 MAX  
1.4  
1.2  
B
A
0.1 C  
PIN 1  
INDEX AREA  
1
0.95  
(0.125)  
3.04  
2.80  
1.9  
3
(0.15)  
NOTE 4  
2
0.5  
0.3  
3X  
0.10  
0.01  
(0.95)  
TYP  
0.2  
C A B  
0.25  
GAGE PLANE  
0.20  
0.08  
TYP  
0.6  
0.2  
TYP  
SEATING PLANE  
0 -8 TYP  
4214838/D 03/2023  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Reference JEDEC registration TO-236, except minimum foot length.  
4. Support pin may differ or may not be present.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DBZ0003A  
SOT-23 - 1.12 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
3X (1.3)  
1
3X (0.6)  
SYMM  
3
2X (0.95)  
2
(R0.05) TYP  
(2.1)  
LAND PATTERN EXAMPLE  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
0.07 MIN  
ALL AROUND  
0.07 MAX  
ALL AROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214838/D 03/2023  
NOTES: (continued)  
4. Publication IPC-7351 may have alternate designs.  
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DBZ0003A  
SOT-23 - 1.12 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
3X (1.3)  
1
3X (0.6)  
SYMM  
3
2X(0.95)  
2
(R0.05) TYP  
(2.1)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 THICK STENCIL  
SCALE:15X  
4214838/D 03/2023  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
7. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
TI products.  
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2023, Texas Instruments Incorporated  

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